Grinding fluid for silicon carbide substrate wafer

Abstract

The invention belongs to the technical field of grinding fluid, and particularly relates to grinding fluid for a silicon carbide substrate wafer, which comprises the following component raw materials in parts by weight: 5-12 parts of diamond micro powder; 35 to 80 parts of pure water; 15 to 25 parts of a suspending agent; 10-18 parts of a dispersant; 5-10 parts of an emulsifier; 15 to 20 parts of a lubricant; the dispersing agent and the suspending agent are used for dispersing diamond micro-powder, the dispersing agent and the suspending agent are used for dispersing diamond micro-powder, the dispersing agent and the suspending agent are used for dispersing diamond micro-powder, the dispersing agent and the suspending agent are used for dispersing diamond micro-powder, the diamond micro-powder is one or a mixture of several of single-crystal diamond micro-powder, polycrystalline-like diamond micro-powder or polycrystalline diamond micro-powder, the diameter of the diamond micro-powder is smaller than 30 micrometers, and the pure water is prepared through a reverse osmosis method. When a worker prepares the grinding fluid for the silicon carbide substrate wafer, under the cooperation of the dispersing agent and the suspending agent, sedimentation and condensation of particles can be prevented, an amphiphilic reagent required by a stable suspension is formed, and therefore it can be guaranteed that the grinding fluid does not settle after being placed for a long time.

Description

Technical Field

[0001] The invention belongs to the technical field of grinding liquids, and in particular relates to a grinding liquid for a silicon carbide substrate wafer and a preparation method thereof. Background Art

[0002] Silicon carbide wafers are third-generation semiconductor materials and play an important role in the fields of new energy, communications, and military and national defense. In the processing of silicon carbide wafers, grinding fluid is an important auxiliary material. Diamond grinding fluid is prepared by dispersing abrasive particles in a medium. It is a grinding product with excellent chemical and mechanical properties. It can be used for grinding and polishing silicon wafers, engineering ceramics, compound crystals, precision optical devices, liquid crystal panels, gemstones, metal workpieces, etc. However, the existing grinding fluid is prone to sedimentation after being placed for a long time, and it is not convenient to discharge the waste chips produced by grinding. Summary of the invention

[0003] To solve the problems raised in the above background technology, the present invention provides a grinding liquid for silicon carbide substrate wafers and a preparation method thereof, which has the characteristics of ensuring that the grinding liquid does not settle after being placed for a long time and facilitating the discharge of waste chips generated by grinding.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a grinding liquid for silicon carbide substrate wafer, comprising the following component raw materials in parts by weight: 5-12 parts of diamond micropowder; 35-80 parts of pure water; 15-25 parts of suspending agent; 10-18 parts of dispersing agent; 5-10 parts of emulsifier; 15-20 parts of lubricant; and 0.5-2 parts of defoaming agent.

[0005] As a further solution of the present invention: the diamond powder is one or a mixture of single crystal diamond powder, polycrystalline diamond powder or polycrystalline diamond powder, and has a diameter of less than 30 microns.

[0006] As a further solution of the present invention: the pure water is prepared by reverse osmosis, and the lubricant is a mixture of one or more of diethylene glycol, isopropanol, and allyl glycol.

[0007] As a further solution of the present invention: the dispersant is polyacrylate, polyacrylate salt, polycarboxylate, or block phosphate polymer.

[0008] As a further embodiment of the present invention: the emulsifier is a mixture of one or more of alkylphenol polyoxyethylene ether, high-carbon fatty alcohol polyoxyethylene ether, and fatty acid polyoxyethylene ester.

[0009] As a further embodiment of the present invention: the suspending agent is a mixture of one or more of polyoxyethylene alkylamine, polyoxyethylene alkylolamide, polyacetylene alcohol or fatty alcohol polyether.

[0010] A grinding liquid for a silicon carbide substrate wafer and a preparation method thereof, comprising the following steps:

[0011] Step 1: injecting diamond powder and pure water into the ultrasonic disperser and stirring to form a mixed solution 1;

[0012] Step 2: placing the mixed solution 1 prepared in step 1 on a 600-mesh sieve for filtration to obtain a mixed solution 2;

[0013] Step 3: injecting the dispersant and the suspending agent into the ultrasonic disperser and stirring to form a mixed solution 3;

[0014] Step 4: injecting the lubricant and the emulsifier into the ultrasonic disperser and stirring to form a mixed solution 4;

[0015] Step 5: Add the mixed solution 2, the mixed solution 3, the mixed solution 4 and the defoaming agent into the ultrasonic disperser in turn and stir to form a grinding liquid.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The present invention adopts a dispersant and a suspending agent. When workers prepare a grinding liquid for a silicon carbide substrate wafer, the dispersant and the suspending agent can prevent the sedimentation and aggregation of particles, and form an amphiphilic agent required for a stable suspension, thereby ensuring that the grinding liquid does not sediment when placed for a long time.

[0018] 2. The present invention, by adopting lubricants and emulsifiers, can improve the lubricity of the grinding liquid when workers prepare the grinding liquid for silicon carbide substrate wafers, and can also easily clean and discharge the waste chips generated by grinding, thereby ensuring a high surface finish of the processed workpiece. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] Example

[0021] The present invention provides the following technical solution: a grinding liquid for silicon carbide substrate wafers, comprising the following component raw materials in parts by weight: 5-12 parts of diamond micropowder; 35-80 parts of pure water; 15-25 parts of suspending agent; 10-18 parts of dispersing agent; 5-10 parts of emulsifier; 15-20 parts of lubricant; and 0.5-2 parts of defoaming agent.

[0022] Specifically, the diamond powder is one or a mixture of single crystal diamond powder, polycrystalline diamond powder or polycrystalline diamond powder, and has a diameter of less than 30 microns.

[0023] Specifically, pure water is prepared by reverse osmosis, and the lubricant is a mixture of one or more of diethylene glycol, isopropyl alcohol, and allyl glycol.

[0024] Specifically, the dispersant is polyacrylate, polyacrylate salt, polycarboxylate, block phosphate polymer. By using dispersants and suspending agents, in combination with dispersants and suspending agents, the sedimentation and agglomeration of particles can be prevented, and the amphiphilic agent required for a stable suspension can be formed, thereby ensuring that the grinding liquid does not sediment when left for a long time.

[0025] Specifically, the emulsifier is a mixture of one or more of alkylphenol polyoxyethylene ether, high-carbon fatty alcohol polyoxyethylene ether, and fatty acid polyoxyethylene ester. By using lubricants and emulsifiers, with the cooperation of lubricants and emulsifiers, the lubricity of the grinding fluid can be improved, and it is easy to clean and discharge the waste chips generated by grinding, thereby ensuring a high surface finish of the processed workpiece.

[0026] Specifically, the suspending agent is a mixture of one or more of polyoxyethylene alkylamine, polyoxyethylene alkylolamide, polyacetylene alcohol or fatty alcohol polyether.

[0027] A grinding liquid for a silicon carbide substrate wafer and a preparation method thereof, comprising the following steps:

[0028] Step 1: injecting diamond powder and pure water into the ultrasonic disperser and stirring to form a mixed solution 1;

[0029] Step 2: placing the mixed solution 1 prepared in step 1 on a 600-mesh sieve for filtration to obtain a mixed solution 2;

[0030] Step 3: injecting the dispersant and the suspending agent into the ultrasonic disperser and stirring to form a mixed solution 3;

[0031] Step 4: injecting the lubricant and the emulsifier into the ultrasonic disperser and stirring to form a mixed solution 4;

[0032] Step 5: Add the mixed solution 2, the mixed solution 3, the mixed solution 4 and the defoaming agent into the ultrasonic disperser in turn and stir to form a grinding liquid.

[0033] The working principle and use process of the present invention are as follows: during the preparation, firstly, diamond micropowder and pure water are injected into the interior of an ultrasonic disperser for stirring to form a mixed solution 1, then the mixed solution 1 prepared in step 1 is placed on a sieve with an aperture of 600 meshes for filtration to obtain a mixed solution 2, and a dispersant and a suspending agent are injected into the interior of an ultrasonic disperser for stirring to form a mixed solution 3, and at the same time, a lubricant and an emulsifier are injected into the interior of an ultrasonic disperser for stirring to form a mixed solution 4, and finally, the mixed solution 2, the mixed solution 3, the mixed solution 4 and a defoaming agent are sequentially injected into the interior of an ultrasonic disperser for stirring to form a grinding liquid, thereby completing the grinding liquid preparation process.

[0034] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A polishing liquid for a silicon carbide substrate wafer, characterized in that: The raw materials include the following components in parts by weight: 5-12 parts of diamond micropowder; 35-80 parts of pure water; 15-25 parts of suspending agent; 10-18 parts of dispersing agent; 5-10 parts of emulsifier; 15-20 parts of lubricant; and 0.5-2 parts of defoaming agent.

2. The polishing liquid for silicon carbide substrate wafer according to claim 1, characterized in that: The diamond powder is one or a mixture of single crystal diamond powder, polycrystalline diamond powder or polycrystalline diamond powder, and has a diameter of less than 30 microns.

3. The polishing liquid for silicon carbide substrate wafer according to claim 1, characterized in that: The pure water is prepared by reverse osmosis, and the lubricant is a mixture of one or more of diethylene glycol, isopropanol, and allyl glycol.

4. The polishing liquid for silicon carbide substrate wafer according to claim 1, characterized in that: The dispersant is polyacrylate, polyacrylate salt, polycarboxylate, or block phosphate polymer.

5. The polishing liquid for silicon carbide substrate wafer according to claim 1, characterized in that: The emulsifier is a mixture of one or more of alkylphenol polyoxyethylene ether, high-carbon fatty alcohol polyoxyethylene ether, and fatty acid polyoxyethylene ester.

6. The polishing liquid for silicon carbide substrate wafer according to claim 1, characterized in that: The suspending agent is a mixture of one or more of polyoxyethylene alkylamine, polyoxyethylene alkylolamide, polyacetylene alcohol or fatty alcohol polyether.

7. A method for preparing a polishing liquid for a silicon carbide substrate wafer according to any one of claims 1 to 7, characterized in that: The steps include: Step 1: injecting diamond powder and pure water into the ultrasonic disperser and stirring to form a mixed solution 1; Step 2: placing the mixed solution 1 prepared in step 1 on a 600-mesh sieve for filtration to obtain a mixed solution 2; Step 3: injecting the dispersant and the suspending agent into the ultrasonic disperser and stirring to form a mixed solution 3; Step 4: injecting the lubricant and the emulsifier into the ultrasonic disperser and stirring to form a mixed solution 4; Step 5: Add the mixed solution 2, the mixed solution 3, the mixed solution 4 and the defoaming agent into the ultrasonic disperser in turn and stir to form a grinding liquid.