Processing method of touch force sensor and mechanical arm

Abstract

The invention relates to the technical field of mechanical arms, and discloses a processing method of a touch force sensor and a mechanical arm. The processing method of the touch force sensor comprises the following steps: fixing an MEMS pressure chip on a base; a metal coil is fixed on the base; a cavity gas precursor is placed on the base; a deformable flexible cover is fixed to a base, the base and the flexible cover form a flexible shell with a sealed cavity, and the cavity gas precursor solid, the metal coil and the MEMS pressure chip are all located in the sealed cavity; the metal coil heats the cavity gas precursor solid to gasify the cavity gas precursor solid into filling gas, the flexible cover, the base and the filling gas form a miniature air bag, and the miniature air bag, the MEMS pressure chip and the metal coil form the touch force sensor. The tactile force sensor processed by the processing method of the tactile force sensor disclosed by the invention has relatively high sensitivity and accuracy at normal temperature and low temperature.

Description

Technical Field

[0001] The present invention relates to the technical field of mechanical arms, and in particular to a processing method of a tactile force sensor and a mechanical arm. Background Art

[0002] Under the current technological environment, pressure sensors are widely used in industrial control, medical equipment, environmental monitoring and other fields. However, the common pressure sensors on the market are often designed for normal temperature environments, and their performance under low temperature conditions is not ideal. When the ambient temperature decreases, the physical properties of many sensor materials and electronic components will change, resulting in a significant decrease in the sensitivity and accuracy of the sensor. For example, the resistivity of semiconductor materials may fluctuate with temperature, thus affecting the stability of the signal. In addition, some mechanical parts may become more fragile or rigid at low temperatures, further reducing the response speed and accuracy of the sensor. Summary of the invention

[0003] Based on the above, an object of the present invention is to provide a method for processing a tactile force sensor and a robotic arm, wherein the processed tactile force sensor has high sensitivity and accuracy at both normal temperature and low temperature.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] A method for processing a tactile force sensor, comprising:

[0006] Fix the MEMS pressure chip on the base;

[0007] fixing a metal coil on the base;

[0008] placing a cavity gas precursor solid on the base;

[0009] Fixing a deformable flexible cover on the base, the base and the flexible cover form a flexible shell with a sealed chamber, the cavity gas precursor solid, the metal coil and the MEMS pressure chip are all located in the sealed chamber;

[0010] The metal coil heats the cavity gas precursor solid to gasify it into a filling gas. The flexible cover, the base and the filling gas form a micro airbag. The micro airbag, the MEMS pressure chip and the metal coil form a tactile force sensor.

[0011] As a preferred solution of a processing method for a tactile force sensor, the flexible cover is a polydimethylsiloxane cover, the base is a polydimethylsiloxane seat, and the MEMS pressure chip is hot pressed or bonded to the polydimethylsiloxane seat.

[0012] As a preferred solution of a method for processing a tactile force sensor, the method for processing a cavity gas precursor solid includes:

[0013] Esterification of camphene to isoborneol acetate;

[0014] Add sodium hydroxide solution and xylene to isoborneol acetate and saponify under pressure;

[0015] After adding xylene solvent, the mixture was allowed to stand for stratification, sodium acetate was separated and then washed with water until neutral, thereby obtaining an isoborneol xylene solution;

[0016] Dehydrogenating isoborneol and distilling off xylene at a first preset temperature using basic carbonate as a catalyst;

[0017] The cavity gas precursor solid is obtained by sublimation at a second preset temperature.

[0018] As a preferred scheme for a processing method of a tactile force sensor, the MEMS pressure chip includes a substrate, a piezoresistor, a temperature electrode and a cap, the piezoresistor and the temperature electrode are both formed on the substrate, the cap is covered on the substrate and the two form a pressure cavity, a force groove facing the pressure cavity is provided on the side of the substrate away from the cap, and the cap is fixed on the base.

[0019] As a preferred scheme for a processing method of a tactile force sensor, the number of the piezoresistors is four, and the four piezoresistors are electrically connected to form a Wheatstone bridge connection. The MEMS pressure chip also includes four first metal PADs, two of which are electrically connected to two input ends of the Wheatstone bridge, and the other two are electrically connected to two output ends of the Wheatstone bridge.

[0020] A robotic arm comprises a robotic hand and a tactile force sensor processed by the processing method of the tactile force sensor described in any of the above schemes, the robotic hand comprises robotic fingers and a robotic palm, the tactile force sensor is arranged on the inner side of the robotic fingers and / or the robotic palm, the robotic hand comprises a wrist joint, the robotic fingers comprise finger joints, the robotic arm also comprises an elastic joint force detection unit, the joint force detection unit is arranged at the finger joint and / or the wrist joint and is configured to detect the pressure distribution at the joint.

[0021] As a preferred solution of a robotic arm, the robotic arm also includes a flexible seat, on which a plurality of mounting grooves are defined, each of which is provided with a tactile force sensor, and each of the tactile force sensors can independently detect pressure and temperature.

[0022] As a preferred solution for a robotic arm, the mounting grooves are arranged in a staggered manner on the flexible seat, and the cross-sectional shape of the mounting grooves is a honeycomb shape.

[0023] As a preferred solution for a robotic arm, the robotic finger includes a finger distal end fixing seat, the finger distal end fixing seat is provided with the tactile force sensor, the tactile force sensor on the finger distal end fixing seat includes at least two MEMS pressure chips, and different MEMS pressure chips of the same tactile force sensor can detect pressure in different directions.

[0024] As a preferred solution for a robotic arm, the joint force detection unit includes a first flexible substrate, a pressure sensitive layer and a second flexible substrate stacked in sequence, a plurality of top flexible electrodes are provided on the first flexible substrate, a plurality of bottom flexible electrodes are provided on the second flexible substrate, a plurality of the bottom flexible electrodes are arranged in one-to-one correspondence with a plurality of the top flexible electrodes, and the pressure sensitive layer is sandwiched between the top flexible electrode and the bottom flexible electrode.

[0025] The beneficial effects of the present invention are:

[0026] The tactile force sensor processed by the processing method of the tactile force sensor disclosed in the present invention has a deformable flexible cover that enables the tactile force sensor to deform when subjected to force and reset when the external force is removed. When detecting pressure, the pressure acts on the MEMS pressure chip through the filling gas in the sealed chamber, thereby realizing the detection of pressure. The tactile force sensor with this structure has strong impact resistance when encountering external impact or overload, low sensitivity to environmental factors, and is less affected by the environment. Even if it is used for a long time, the sensitivity will not decrease; when detecting pressure in a low temperature environment, the metal coil heats the tactile force sensor to increase the temperature of the tactile force sensor itself, so that the pressure can be detected more accurately and the detection accuracy and sensitivity can be guaranteed; when detecting pressure at room temperature, if the metal coil does not work, the MEMS pressure chip directly detects the pressure, or if the metal coil heats the tactile force sensor, the tactile force sensor is always in a warm state, thereby improving the tactile feeling of the user who contacts it.

[0027] The robotic arm disclosed in the present invention includes a tactile force sensor processed by the above-mentioned tactile force sensor processing method, and has high sensitivity and accuracy when detecting pressure at normal temperature and low temperature. The joint force detection unit can detect the pressure distribution at the wrist joint and finger joint positions, which is beneficial to the refined operation of the robotic arm. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0029] Figure 1 is a flow chart of a method for processing a tactile force sensor provided by a specific embodiment of the present invention;

[0030] Figure 2 is a cross-sectional view of a tactile force sensor manufactured by the processing method of the tactile force sensor provided by an embodiment of the present invention;

[0031] Figure 3 is a cross-sectional view of a MEMS pressure chip provided by a specific embodiment of the present invention;

[0032] Figure 4 is a top view of a MEMS pressure chip provided by a specific embodiment of the present invention with a cap removed;

[0033] Figure 5 is a front schematic diagram of a mechanical arm provided by a specific embodiment of the present invention;

[0034] Figure 6 is a schematic diagram of the back side of a mechanical arm provided by a specific embodiment of the present invention;

[0035] Figure 7 is a top view of a flexible seat of a mechanical arm provided by a specific embodiment of the present invention;

[0036] Figure 8 is a top view of a flexible seat of a mechanical arm provided in another embodiment of the present invention;

[0037] Fig. 9 It is a schematic diagram of the layered structure of a joint force detection unit of a robotic arm provided in a specific embodiment of the present invention.

[0038] In the figure:

[0039] 1. Tactile force sensor; 10. Sealed chamber; 11. Flexible shell; 111. Base; 112. Flexible cover; 12. MEMS pressure chip; 121. Substrate; 1210. Force groove; 122. Piezoresistors; 123. Temperature electrodes; 124. Caps; 1240. Pressure chamber; 125. First metal PAD; 126. Second metal PAD; 13. Metal coil;

[0040] 21. Mechanical fingers; 211. Finger joints; 22. Mechanical palms; 23. Wrist joints;

[0041] 3. Flexible seat; 30. Mounting slot;

[0042] 4. Joint force detection unit; 41. First flexible substrate; 42. Top flexible electrode; 43. Pressure sensitive layer; 44. Bottom flexible electrode; 45. Second flexible substrate. DETAILED DESCRIPTION

[0043] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0044] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0045] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] This embodiment provides a method for processing a tactile force sensor. Figures 1 to 4 As shown, including:

[0047] S1 . Fix the MEMS pressure chip 12 on the base 111 .

[0048] like Figure 3 and Figure 4As shown, the MEMS pressure chip 12 of this embodiment includes a substrate 121, a piezoresistor 122, a temperature electrode 123 and a cap 124. The piezoresistor 122 and the temperature electrode 123 are both formed on the substrate 121. The cap 124 is covered on the substrate 121 and the two form a pressure chamber 1240. A force groove 1210 facing the pressure chamber 1240 is provided on the side of the substrate 121 away from the cap 124, and the cap 124 is fixed on the base 111.

[0049] like Figure 5 As shown, the number of the piezoresistors 122 of this embodiment is four, and the four piezoresistors 122 are electrically connected to form a Wheatstone bridge connection. The MEMS pressure chip 12 also includes four first metal PADs 125, of which two first metal PADs 125 are electrically connected to the two input ends of the Wheatstone bridge, respectively, and the other two first metal PADs 125 are electrically connected to the two output ends of the Wheatstone bridge. The cap 124 of this embodiment is provided with four first connection holes (not shown in the figure), and each first connection hole corresponds to a first metal PAD 125. Specifically, the cap 124 of this embodiment is a rectangular cap, and the four first connection holes are respectively located at the four corners of the rectangular cap, and each first connection hole is directly opposite to a first metal PAD 125, so that the connection wire connected to the first metal PAD 125 in the later stage can be led out from the first connection hole. It should be noted that, in this embodiment, the base 111 is further provided with a first avoidance hole (not shown in the figure) corresponding to the first connection hole, so as to ensure that the connection line led out from the first connection hole can pass through the first avoidance hole.

[0050] like Figure 5 As shown, the number of the temperature electrode 123 in this embodiment is one, and the MEMS pressure chip 12 also includes two second metal PADs 126, which are electrically connected to the two ends of the temperature electrode 123 respectively. The cap 124 is provided with two second connection holes (not shown in the figure), and the two second connection holes correspond to the two second metal PADs 126 one by one, so that the connection wires connected to the second metal PADs 126 in the later stage can be led out from the second connection holes. It should be noted that the base 111 of this embodiment is also provided with a second avoidance hole (not shown in the figure) corresponding to the second connection hole, so as to ensure that the connection wires led out from the second connection hole can pass through the second avoidance hole.

[0051] S2. Fix the metal coil 13 on the base 111.

[0052] The metal coil 13 of this embodiment is a spiral coil, which has a compact structure and can achieve efficient heating and rapid heating function on a limited area base 111. In other embodiments, the shape of the metal coil 13 can also be a serpentine, arc or other shape, which is not limited in this embodiment and is selected according to actual needs.

[0053] S3. Place some solid cavity gas precursor solid on the base 111.

[0054] The cavity gas precursor solid in this step is processed by the following method:

[0055] S31, esterifying camphene into isoborneol acetate;

[0056] S32, adding sodium hydroxide solution and xylene to isoborneol acetate and then pressurizing and saponifying;

[0057] S33, adding xylene solvent and standing to separate the sodium acetate, washing with water until neutral, and obtaining an isoborneol xylene solution;

[0058] S34, dehydrogenating isoborneol with basic carbonate as a catalyst at a first preset temperature and distilling off xylene;

[0059] S35, sublimating at a second preset temperature to obtain a cavity gas precursor solid.

[0060] Specifically, the first preset temperature of this embodiment is 180°C, and the second preset temperature is 212°C. It should be noted that the weight of the cavity gas precursor solid is set according to actual needs, which is specifically related to the volume of the micro airbag described below, as long as the pressure of the filling gas formed after the cavity gas precursor solid is vaporized in the micro airbag is within the preset pressure range. Specifically, the preset pressure of this embodiment is greater than one atmosphere and less than two atmospheres. It should be noted that in other embodiments of the present invention, the first preset temperature can also be other values ​​between 175°C and 185°C, and the second preset temperature can also be other values ​​between 207°C and 217°C, which are selected and set according to actual needs.

[0061] S4. Fix the deformable flexible cover 112 on the base 111. The base 111 and the flexible cover 112 form a flexible shell 11 with a sealed chamber 10. The cavity gas precursor solid, the metal coil 13 and the MEMS pressure chip 12 are all located in the sealed chamber 10.

[0062] The flexible cover 112 of the present embodiment is a polydimethylsiloxane cover, which is not only easy to process, but also has the advantages of excellent heat resistance and good flexibility. The base 111 is a polydimethylsiloxane seat, and the above-mentioned MEMS pressure chip 12 is hot pressed on the polydimethylsiloxane seat. In other embodiments, the MEMS pressure chip 12 can also be bonded to the polydimethylsiloxane seat. It should be noted that in other embodiments of the present invention, the materials of the flexible cover 112 and the base 111 are not limited to the polydimethylsiloxane specified in the present embodiment, and can also be other deformable and resettable flexible materials, which are selected according to actual needs.

[0063] S5, the metal coil 13 heats the cavity gas precursor solid to gasify it into filling gas, the flexible cover 112, the base 111 and the filling gas form a micro airbag, and the micro airbag, the MEMS pressure chip 12 and the metal coil 13 form a micro airbag. Figure 2 The tactile force sensor 1 is shown.

[0064] Specifically, when the pressure acts on the MEMS pressure chip 12 through the filling gas in the flexible cavity, the piezoresistors 122 produce resistance changes due to the piezoresistive effect, and the Wheatstone bridge formed by the piezoresistors 122 generates an electrical signal output, which is conditioned and converted by the conditioning chip and output to the next stage for use. In addition, the MEMS pressure chip 12 of this structure can be set to a large pressure range, which is suitable for a large range of pressure environments.

[0065] The tactile force sensor 1 processed by the processing method of the tactile force sensor provided in this embodiment has a deformable flexible cover 112 that enables the tactile force sensor 1 to deform when subjected to force and reset when the external force is removed. When detecting pressure, the pressure acts on the MEMS pressure chip 12 through the filling gas in the sealed chamber 10, thereby realizing the detection of pressure. The tactile force sensor 1 of this structure has strong impact resistance when encountering external impact or overload, is less sensitive to environmental factors, is less affected by the environment, and the sensitivity will not decrease even after long-term use. When detecting pressure in a low temperature environment, the metal coil 13 heats the tactile force sensor 1 to increase the temperature of the tactile force sensor 1 itself, so that the pressure can be detected more accurately and the detection accuracy and sensitivity can be ensured. When detecting pressure at room temperature, if the metal coil 13 does not work, the MEMS pressure chip 12 directly detects the pressure, or when the metal coil 13 heats the tactile force sensor 1, the tactile force sensor 1 can also be kept in a warm state, thereby improving the touch of the user who contacts it.

[0066] Specifically, when the tactile force sensor 1 processed by the processing method of the tactile force sensor provided in this embodiment detects pressure, the detection is performed in the following manner: first, the metal coil 13 of the tactile force sensor 1 works to heat the tactile force sensor 1 to a third preset temperature, and the ambient temperature at this time is lower than the third preset temperature. Then, the MEMS pressure chip 12 of the tactile force sensor 1 detects pressure at the third preset temperature. At this time, the detection temperature is not affected by the external ambient temperature and the tactile force sensor 1 is in a warm state. The air pressure of the filling gas in the sealed chamber 10 is also a specific value, and the detection accuracy is higher; if the ambient temperature is higher than the third preset temperature, the metal coil 13 does not work, and the MEMS pressure chip 12 of the tactile force sensor 1 directly detects the pressure value. It should be noted that. The third preset temperature of this embodiment is set to 25°C. In other embodiments, the third preset temperature can also be 20°C, 30°C or other temperature values, which can be set according to actual needs.

[0067] This embodiment also provides a mechanical arm, such as Figure 5 and Figure 6 As shown, it includes a manipulator and a tactile force sensor 1 processed by the processing method of the tactile force sensor provided in the above embodiment, the manipulator includes a manipulator finger 21 and a manipulator palm 22, the tactile force sensor 1 is arranged on the inner side of the manipulator finger 21 and the manipulator palm 22, the manipulator includes a wrist joint 23, the manipulator finger 21 includes a finger joint 211, and the manipulator arm also includes an elastic joint force detection unit 4, the joint force detection unit 4 is arranged at the finger joint 211 and the wrist joint 23 and is configured to detect the pressure distribution at the joint. In other embodiments, the tactile force sensor 1 can also be arranged only on the inner side of the manipulator finger 21 or the manipulator palm 22, and the joint force detection unit 4 can also be arranged only at the finger joint 211 or the wrist joint 23, according to actual needs.

[0068] The robotic arm provided in this embodiment includes a tactile force sensor 1 manufactured by the above-mentioned tactile force sensor processing method, and has high sensitivity and accuracy when detecting pressure at normal temperature and low temperature. The joint force detection unit 4 can detect the pressure distribution at the wrist joint 23 and the finger joint 211, which is beneficial to the refined operation of the robotic arm.

[0069] like Figure 7 As shown, the mechanical arm of this embodiment also includes a flexible seat 3, on which twenty mounting slots 30 are defined, and a tactile force sensor 1 is provided in each mounting slot 30, and each tactile force sensor 1 can independently detect pressure and temperature, that is, the pressure value and temperature value detected by adjacent temperature detection units do not affect each other. It should be noted that in other embodiments of the present invention, the number of mounting slots 30 on the tactile force sensor 1 and the flexible seat 3 is not limited to the twenty described in this embodiment, and can also be other numbers, and the specific number can be set according to actual needs. The flexible seat 3 of this embodiment enables different tactile force sensors 1 to independently detect temperature and pressure. Since each tactile force sensor 1 is independently provided, the tactile force sensor 1 with a problem can be replaced individually, which is easy to maintain.

[0070] Specifically, if Figure 7 As shown, the mounting grooves 30 of this embodiment are arranged in five rows and four columns on the flexible seat 3, and the cross-sectional shape of the mounting grooves 30 is a rectangle. In other embodiments, the cross-sectional shape of the mounting grooves 30 arranged in rows and columns on the flexible seat 3 can also be a square or other shapes; or, the mounting grooves 30 are arranged in staggered rows on the flexible seat 3, and the cross-sectional shape of the mounting grooves 30 is as follows: Figure 8 The honeycomb, circular, elliptical or other polygonal shapes shown are set according to actual needs and are not specifically limited in this embodiment.

[0071] The mechanical finger 21 of this embodiment includes a finger end fixing seat (not shown in the figure), and a tactile force sensor 1 is provided on the finger end fixing seat. The tactile force sensor 1 on the finger end fixing seat includes at least two MEMS pressure chips 12. Different MEMS pressure chips 12 of the same tactile force sensor 1 can detect pressure in different directions. The tactile force sensor 1 on the finger end fixing seat of this embodiment includes five MEMS pressure chips 12. The finger end fixing seat and the tactile force sensor 1 thereon constitute the finger end, of which two MEMS pressure chips 12 are arranged on the inner side of the finger end, one MEMS pressure chip 12 is located at the end of the finger end, and the other two MEMS pressure chips 12 are arranged on the left and right sides of the finger end. The five MEMS pressure chips 12 included in each tactile force sensor 1 respectively detect pressure in five directions, so that the force condition of the mechanical hand with refined movements can be detected. It should be noted that in other embodiments of the present invention, the number of MEMS pressure chips 12 of the tactile force sensor 1 on the finger distal end fixing seat is not limited to five in this embodiment, but can also be one, two, three, four or more than five, depending on actual needs.

[0072] like Fig. 9 As shown, the joint force detection unit 4 of this embodiment includes a first flexible substrate 41, a pressure sensitive layer 43 and a second flexible substrate 45 which are stacked in sequence. The first flexible substrate 41 is provided with a plurality of top flexible electrodes 42 connected in parallel and the plurality of top flexible electrodes 42 are distributed in an array. The second flexible substrate 45 is provided with a plurality of bottom flexible electrodes 44 and the plurality of bottom flexible electrodes 44 are distributed in an array. The plurality of bottom flexible electrodes 44 are arranged in a one-to-one correspondence with the plurality of top flexible electrodes 42. The pressure sensitive layer 43 is sandwiched between the top flexible electrode 42 and the bottom flexible electrode 44, so that the pressure at each position of the joint can be detected. When the joint moves, the continuous distribution of the pressure at the joint can be detected. By analyzing the pressure distribution and change detected by the joint force detection unit 4, the bending state of the joint can be analyzed, and then the motion posture of the manipulator can be obtained, thereby realizing the refined operation of the manipulator.

[0073] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A method for processing a tactile force sensor, characterized in that: include: Fix the MEMS pressure chip on the base; fixing a metal coil on the base; placing a cavity gas precursor solid on the base; Fixing a deformable flexible cover on the base, the base and the flexible cover form a flexible shell with a sealed chamber, the cavity gas precursor solid, the metal coil and the MEMS pressure chip are all located in the sealed chamber; The metal coil heats the cavity gas precursor solid to gasify it into a filling gas. The flexible cover, the base and the filling gas form a micro airbag. The micro airbag, the MEMS pressure chip and the metal coil form a tactile force sensor.

2. The method for processing a tactile force sensor according to claim 1, characterized in that: The flexible cover is a polydimethylsiloxane cover, the base is a polydimethylsiloxane seat, and the MEMS pressure chip is hot-pressed or bonded to the polydimethylsiloxane seat.

3. The method for processing a tactile force sensor according to claim 1, characterized in that: The processing method of the cavity gas precursor solid comprises: Esterification of camphene to isoborneol acetate; Add sodium hydroxide solution and xylene to isoborneol acetate and saponify under pressure; After adding xylene solvent, the mixture was allowed to stand for stratification, sodium acetate was separated and then washed with water until neutral, thereby obtaining an isoborneol xylene solution; Dehydrogenating isoborneol and distilling off xylene at a first preset temperature using basic carbonate as a catalyst; The cavity gas precursor solid is obtained by sublimation at a second preset temperature.

4. The method for processing a tactile force sensor according to claim 1, characterized in that: The MEMS pressure chip includes a substrate, a piezoresistor, a temperature electrode and a cap. The piezoresistor and the temperature electrode are both formed on the substrate. The cap is covered on the substrate and the two form a pressure cavity. A force-bearing groove facing the pressure cavity is provided on the side of the substrate away from the cap. The cap is fixed on the base.

5. The method for processing a tactile force sensor according to claim 4, characterized in that: The number of the varistors is four, and the four varistors are electrically connected to form a Wheatstone bridge connection. The MEMS pressure chip also includes four first metal PADs, two of which are electrically connected to the two input ends of the Wheatstone bridge, and the other two are electrically connected to the two output ends of the Wheatstone bridge.

6. A robotic arm, characterized in that: It comprises a manipulator and a tactile force sensor processed by the processing method of the tactile force sensor as described in any one of claims 1 to 5, the manipulator comprises manipulator fingers and a manipulator palm, the tactile force sensor is arranged on the inner side of the manipulator fingers and / or the manipulator palm, the manipulator comprises a wrist joint, the manipulator fingers comprise finger joints, the manipulator arm further comprises a joint force detection unit with elasticity, the joint force detection unit is arranged at the finger joint and / or the wrist joint and is configured to detect the pressure distribution at the joint.

7. The robot arm according to claim 6, characterized in that: The mechanical arm also includes a flexible seat, on which a plurality of mounting slots are defined, each of which is provided with a tactile force sensor, and each of the tactile force sensors can independently detect pressure and temperature.

8. The robot arm according to claim 7, characterized in that: The mounting grooves are arranged in a staggered manner on the flexible seat, and the cross-sectional shape of the mounting grooves is a honeycomb shape.

9. The mechanical arm according to claim 6, characterized in that: The mechanical finger includes a finger distal end fixing seat, the finger distal end fixing seat is provided with the tactile force sensor, the tactile force sensor on the finger distal end fixing seat includes at least two MEMS pressure chips, and different MEMS pressure chips of the same tactile force sensor can detect pressure in different directions.

10. The robot arm according to claim 6, characterized in that: The joint force detection unit includes a first flexible substrate, a pressure sensitive layer and a second flexible substrate stacked in sequence, the first flexible substrate is provided with a plurality of top flexible electrodes, the second flexible substrate is provided with a plurality of bottom flexible electrodes, the plurality of bottom flexible electrodes are arranged in one-to-one correspondence with the plurality of top flexible electrodes, and the pressure sensitive layer is sandwiched between the top flexible electrode and the bottom flexible electrode.

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