Bonding performance testing equipment and testing method for embedded partition plate

Abstract

The invention discloses a device and method for testing the bonding performance of an embedded partition plate, and the method comprises the steps: driving a loading unit to move through an electronic universal testing machine, so as to drive a press-in unit which is detachably and fixedly connected with the loading unit to move, and enabling the press-in unit to be pressed into a honeycomb core material in the axial direction of the honeycomb core material; the method comprises the following steps: pressing a honeycomb core material into a press-in unit, driving the press-in unit to continuously apply a load to an embedded partition plate adhered to the interior of the honeycomb core material until the embedded partition plate is completely separated from the honeycomb core material, recording the maximum damage load borne by the embedded partition plate in the process, and calculating the adhesion performance parameters of the embedded partition plate and the honeycomb core material through the obtained maximum damage load, so that the adhesion performance parameters of the embedded partition plate and the honeycomb core material can be calculated. And the bonding effect of the embedded partition plate and the honeycomb core material can be effectively obtained through the bonding performance parameters, so that data support is provided for the design and preparation of a subsequent silencing structure.

Description

Technical Field

[0001] The present application relates to the technical field of mechanical property testing of non-metallic and composite materials, and more specifically, to a bonding property testing device and a testing method for an embedded partition. Background Art

[0002] At present, engine silencers usually use a honeycomb perforated plate silencer structure based on a resonant sound absorption structure. The structure consists of a honeycomb core material of a certain thickness and two layers of panels, where the upper panel is a perforated plate (embedded partition) with a certain number of holes of a certain size. When sound waves enter the honeycomb core material, the air in the honeycomb core material is disturbed, causing the sound waves to be converted into heat energy and dissipated, thus achieving noise reduction.

[0003] During the preparation of the above-mentioned sound-absorbing structure, it is necessary to implant the embedded partition into the honeycomb core material at a certain height, and bond the embedded partition to the honeycomb wall of the honeycomb core material. The bonding effect between the embedded partition and the honeycomb core material has a great influence on the sound-absorbing effect of the sound-absorbing structure. At present, it is impossible to effectively obtain the bonding effect between the embedded partition and the honeycomb core material, resulting in the inability to provide data support for the design and preparation of subsequent sound-absorbing structures.

[0004] In summary, how to effectively obtain the bonding effect between the embedded partition and the honeycomb core material to provide data support for the design and preparation of the subsequent sound-absorbing structure is an urgent problem to be solved by technical personnel in this field. Summary of the invention

[0005] In view of this, the purpose of this application is to provide a bonding performance testing device and a testing method for an embedded partition, so as to effectively obtain the bonding effect between the embedded partition and the honeycomb core material, so as to provide data support for the design and preparation of subsequent sound-absorbing structures.

[0006] In order to achieve the above objectives, this application provides the following technical solutions:

[0007] A bonding performance testing device for an embedded partition, used for testing the bonding performance between the embedded partition and a honeycomb core material, the bonding performance testing device comprising: a loading unit and a pressing unit; wherein the loading unit is used for connecting to an electronic universal testing machine, and the pressing unit is detachably fixedly connected to the loading unit; the honeycomb core material is relatively fixed to the electronic universal testing machine, and an embedded partition is bonded to the inside of the honeycomb core material, and the embedded partition is distributed along the radial direction of the honeycomb core material; the pressing unit is used for pressing into the inside of the honeycomb core material along the axial direction of the honeycomb core material, and the pressing unit is used for applying a load to the embedded partition.

[0008] In some embodiments, the loading unit includes an upper pressure plate and a lower pressure plate, and the upper pressure plate and the lower pressure plate are both used to connect to the electronic universal testing machine; the pressing unit is detachably fixedly connected to the upper pressure plate, and the upper pressure plate can drive the pressing unit to move axially along the honeycomb core material, and the lower pressure plate is used to place the honeycomb core material.

[0009] In some embodiments, the pressing unit includes a pressing rod; the upper pressure plate is provided with a connecting hole; the first end of the pressing rod is threadedly engaged with the connecting hole, and the end face of the second end of the pressing rod is provided with a protective pad, and the protective pad is used to abut against the embedded partition.

[0010] In some embodiments, the holes of the honeycomb core material are regular hexagons, the press-in rods are regular hexagonal prisms, and the side length of the press-in rods is smaller than the side length of the holes of the honeycomb core material; the protection pad is a regular hexagon, the side length of the protection pad is equal to the side length of the press-in rod, and the protection pad covers the end face of the press-in rod.

[0011] In some embodiments, the loading unit also includes a first connecting member, a second connecting member, a first locking member and a second locking member; the first connecting member is detachably fixedly connected to the top end of the upper pressure plate, the first connecting member is used to connect the electronic universal testing machine, the first locking member is sleeved on the first connecting member, and the first locking member is used to lock the first connecting member and the electronic universal testing machine; the second connecting member is detachably fixedly connected to the bottom end of the lower pressure plate, the second connecting member is used to connect the electronic universal testing machine, the second locking member is sleeved on the second connecting member, and the second locking member is used to lock the second connecting member and the electronic universal testing machine.

[0012] In some embodiments, a guide unit is further included; the guide unit is fixedly connected to the lower pressure plate, and the upper pressure plate is slidably matched with the guide unit.

[0013] In some embodiments, the guide unit includes a first guide rod and a second guide rod; the upper pressure plate includes an upper pressure plate body, and a first fixing member and a second fixing member detachably fixedly connected to both sides of the upper pressure plate body; the lower pressure plate includes a lower pressure plate body, and a third fixing member and a fourth fixing member detachably fixedly connected to both sides of the lower pressure plate body; the first guide rod is slidably matched with the first fixing member, and the first guide rod is fixedly connected to the top end of the third fixing member; the second guide rod is slidably matched with the second fixing member, and the second guide rod is fixedly connected to the top end of the fourth fixing member.

[0014] In some embodiments, a first linear bearing is disposed between the first fixing member and the first guide rod; and a second linear bearing is disposed between the second fixing member and the second guide rod.

[0015] A method for testing the bonding performance of an embedded partition, using the above-mentioned device for testing the bonding performance of an embedded partition, the method comprising the steps of:

[0016] S1. placing the honeycomb core material to be tested in an atmospheric environment for pretreatment to obtain a pretreated honeycomb core material;

[0017] S2, measuring the value of the cell side length w of the pretreated honeycomb core material and the value of the thickness h of the embedded partition;

[0018] S3, assembling the bonding performance testing equipment, installing the press rod and the upper pressing plate, assembling the upper pressing plate with the first guide rod and the second guide rod, and connecting the upper pressing plate and the lower pressing plate to the electronic universal testing machine respectively;

[0019] S4, placing the pretreated honeycomb core material in the bonding performance testing device for testing, the testing operation comprising:

[0020] S41: placing the pretreated honeycomb core material on the lower pressing plate, adjusting the pretreated honeycomb core material so that the shape and orientation of the holes of the honeycomb core material are consistent with the orientation of the pressing rod, and controlling the upper pressing plate to move downward by the electronic universal testing machine so that the pressing rod moves to the same horizontal position as the upper wall surface of the pretreated honeycomb core material;

[0021] S42: selecting the center hole of the pretreated honeycomb core material as the first test point, then selecting the second test point at least one hole apart, and selecting multiple test points by analogy; measuring the value of the distance l between the upper wall surface of the pretreated honeycomb core material and the embedded partition; lowering the upper pressure by a distance l so that the protective pad contacts the embedded partition;

[0022] S43: The upper pressure plate is controlled to descend at a rate v by the electronic universal testing machine, so that the pressing rod continuously applies load to the embedded partition until the embedded partition and the honeycomb core material at the test point are completely separated, and the maximum destructive load P of the pressing rod on the embedded partition is obtained. max .

[0023] In some embodiments, S4 further includes: placing the bonding performance testing equipment in a high and low temperature environment box, and adjusting the high and low temperature environment box according to different test temperature conditions so that the test environment of the pretreated honeycomb core material reaches the corresponding bonding performance test temperature conditions.

[0024] In some embodiments, the S4 further includes a calculation unit, which can obtain the maximum breaking load P under the bonding performance test temperature condition through the bonding performance test device of the embedded partition. max , the bonding performance parameters of the embedded partition and the honeycomb core material are calculated; the bonding performance parameters include at least one of the shear strength of the embedded partition, the cumulative failure probability of the embedded partition, the average shear strength of the embedded partition, and the shear strength variance of the embedded partition.

[0025] In some embodiments, the calculation unit includes: under the bonding performance test temperature condition, the maximum destructive load P of the press rod on the embedded partition is obtained. max ;use , calculate the shear strength σ of the embedded partition.

[0026] In some embodiments, the calculation unit further includes: under the bonding performance test temperature condition, a distribution function of the cumulative failure probability can be obtained according to the Weibull distribution: , where m is the dimensionless shape parameter of the Weibull distribution, is the size parameter of the Weibull distribution;

[0027] Arrange the calculated shear strengths σ in ascending order to obtain the i-th shear strength σ i , i=1,2,3...N, N is the total number of points to be tested, using , we get the shear strength σ i Under this condition, the probability of damage of the embedded partition is F i ;

[0028] Upward Taking the natural logarithm of both sides, we get , using σ i and F i ,get and The scatter plot between , the scatter plot is linearly fitted, the slope of the straight line obtained after the linear fitting is the dimensionless shape parameter m of the Weibull distribution, and the intercept of the straight line obtained after the linear fitting can be used to obtain the size parameter of the Weibull distribution ; The dimensionless shape parameter m and size parameter Bring-in The cumulative failure probability F(σ) of the embedded partition under the shear strength σ can be calculated.

[0029] In some embodiments, the calculation unit further comprises: using , calculate the average shear strength of the embedded partition , where Г is the gamma function.

[0030] In some embodiments, the calculation unit further comprises: using , calculate the variance D of the shear strength of the embedded partition, where Г is the gamma function.

[0031] In the bonding performance testing equipment for the embedded partition provided in the present application, the loading unit is driven to move by an electronic universal testing machine to drive the pressing unit which is detachably fixedly connected to the loading unit to move, so that the pressing unit is pressed into the interior of the honeycomb core material along the axial direction of the honeycomb core material, and the pressing unit is driven to continuously apply load to the embedded partition bonded to the interior of the honeycomb core material until the embedded partition is completely separated from the honeycomb core material, and the maximum destructive load received by the embedded partition during the above process is recorded. The bonding performance parameters of the embedded partition and the honeycomb core material can be calculated through the obtained maximum destructive load. In this way, the bonding effect of the embedded partition and the honeycomb core material can be effectively obtained through the bonding performance parameters, thereby providing data support for the design and preparation of subsequent sound-absorbing structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0033] Figure 1 A schematic diagram of the structure of the bonding performance testing equipment for the embedded partition provided in the embodiment of the present application;

[0034] Figure 2 for Figure 1 A front view of the bonding performance testing device shown;

[0035] Figure 3 for Figure 1 A schematic diagram of an upper pressing plate in an adhesive performance testing device shown;

[0036] Figure 4 for Figure 1 A schematic diagram of the structure of a pressing rod in an adhesive performance testing device shown;

[0037] Figure 5 A schematic diagram of the use process of the bonding performance testing device for the embedded partition provided in an embodiment of the present application;

[0038] Figure 6 A schematic diagram of the selection of holes of the honeycomb core material in the bonding performance testing method of the embedded partition provided in the embodiment of the present application;

[0039] Figure 7 It is a load-displacement curve diagram in the bonding performance test method of the embedded partition;

[0040] Figure 8 The following are data scatter plots and curve fitting diagrams.

[0041] Description of reference numerals:

[0042] 11-upper pressure plate, 110-upper pressure plate body, 111-first fixing member, 112-second fixing member, 113-connecting hole, 12-lower pressure plate, 120-lower pressure plate body, 121-third fixing member, 122-fourth fixing member, 13-first connecting member, 14-second connecting member, 15-first locking member, 16-second locking member;

[0043] 21-first guide rod, 22-second guide rod, 23-first linear bearing, 24-second linear bearing;

[0044] 31-pressing rod, 32-protection pad;

[0045] 40-honeycomb core material;

[0046] 50-Built-in partitions. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0048] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0049] The multiple involved in the embodiments of the present application means greater than or equal to two. It should be noted that in the description of the embodiments of the present application, the words "first", "second", etc. are only used for the purpose of distinguishing the description, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying order. The terms "including", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0050] In the process of obtaining the bonding effect between the embedded partition and the honeycomb core material, the bonding effect between the embedded partition and the honeycomb core material is usually pre-judged based on the breaking load required to completely separate the embedded partition and the honeycomb core material. Therefore, the breaking load during the separation process of the embedded partition and the honeycomb core material must first be obtained to obtain the evaluation parameters of the bonding effect between the embedded partition and the honeycomb core material. However, it is not possible to effectively obtain the breaking load required to separate the embedded partition and the honeycomb core material, so that it is not possible to effectively obtain the evaluation parameters of the bonding effect between the embedded partition and the honeycomb core material.

[0051] Therefore, the embodiment of the present application provides a testing device and a testing method for the bonding performance of the embedded partition, so as to effectively obtain the destructive load between the embedded partition and the honeycomb core material, so as to effectively obtain the bonding effect between the embedded partition and the honeycomb core material, so as to provide data support for the design and preparation of subsequent sound-absorbing structures.

[0052] For ease of description, the bonding performance testing equipment for the embedded partition provided in the embodiment of the present application is referred to as the testing equipment for short.

[0053] like Figure 1 , Figure 2 and Figure 5 As shown, the test equipment provided in the embodiment of the present application is used to test the bonding performance of the embedded partition 50 and the honeycomb core material 40, and the test equipment includes a loading unit and a pressing unit. Among them, the loading unit is connected to the electronic universal testing machine, and the pressing unit is detachably fixedly connected to the loading unit, so that the electronic universal testing machine can drive the pressing unit to move by driving the loading unit; the honeycomb core material 40 to be tested is relatively fixedly placed with the electronic universal testing machine, and the embedded partition 50 is bonded inside the honeycomb core material 40 to be tested, and the embedded partition 50 is distributed along the radial direction of the honeycomb core material 40, and the embedded partition 50 has a set distance from the upper and lower walls of the honeycomb core material 40; the pressing unit can be pressed into the interior of the honeycomb core material 40 along the axial direction of the honeycomb core material 40 under the driving action of the electronic universal testing machine, and the pressing unit can continuously apply load to the embedded partition 50 until the embedded partition 50 is completely separated from the honeycomb core material 40. The maximum destructive load received by the embedded partition 50 during the above process is recorded. The bonding performance parameters of the embedded partition 50 and the honeycomb core material 40 can be calculated based on the obtained maximum destructive load. In this way, the bonding effect of the embedded partition 50 and the honeycomb core material 40 can be effectively obtained through the bonding performance parameters, thereby providing data support for the design and preparation of subsequent sound-absorbing structures.

[0054] It should be noted that the electronic universal testing machine is a testing equipment that can perform various mechanical property tests on samples such as tension, compression, bending, shearing, etc., which will not be described in detail here.

[0055] It should be noted that the sizes of the honeycomb core material 40 to be tested and the embedded partition plate 50 bonded to the honeycomb core material can be adjusted according to the test requirements, and the embodiment of the present application does not limit this.

[0056] like Figure 5 As shown, the loading unit includes an upper pressure plate 11 and a lower pressure plate 12, and the top surface of the upper pressure plate 11 and the bottom surface of the lower pressure plate 12 are both connected to the electronic universal testing machine, so that the loading unit can be stably connected to the electronic universal testing machine; the pressing unit is detachably fixedly connected to the bottom surface of the upper pressure plate 11, and the honeycomb core material 40 to be tested is placed on the top surface of the lower pressure plate 12, so that the upper pressure plate 11 is driven to move by the electronic universal testing machine, and the pressing unit can be driven to enter the interior of the honeycomb core material 40 along the axial direction of the honeycomb core material 40 to be tested, so as to ensure the stability of the testing process.

[0057] In order to be able to connect stably with the electronic universal testing machine, such as Figure 1-Figure 3 As shown, the loading unit further includes a first connecting member 13 , a second connecting member 14 , a first locking member 15 and a second locking member 16 .

[0058] A through hole is provided on the upper pressure plate 11, and a mounting hole corresponding to the through hole of the upper pressure plate 11 is also provided on the first connecting member 13, so that the first connecting member 13 can be detachably fixedly connected to the upper pressure plate 11 by threaded fasteners, and the upper part of the first connecting member 13 is also provided with horizontal and vertical intersecting through holes. In this way, after the first connecting member 13 is sleeved with the sleeve of the electronic universal testing machine, the first connecting member 13 can be fixed to the electronic universal testing machine by inserting pins into the horizontal and vertical intersecting through holes, and the first locking member 15 can be rotated so that the first locking member 15 locks the first connecting member 13 and the electronic universal testing machine to ensure the stability of the connection, thereby ensuring the stability of the test process.

[0059] Similarly, the second connecting member 14 is detachably fixedly connected to the bottom end of the lower pressure plate 12 by threaded fasteners, and is connected to the electronic universal testing machine through the second connecting member 14. The second connecting member 14 and the electronic universal testing machine are fixed by pins, and the second locking member 16 is rotated so that the second locking member 16 locks the second connecting member 14 and the electronic universal testing machine to ensure the stability of the connection and ensure the stability of the honeycomb core material 40 to be tested during the test.

[0060] like Figure 3-Figure 4As shown, the pressing unit includes a pressing rod 31, the upper pressure plate 11 is provided with a connecting hole 113, and the first end of the pressing rod 31 has a threaded portion that threadably cooperates with the connecting hole 113, so that the pressing rod 31 can be detachably fixedly connected to the upper pressure plate 11; the second end of the pressing rod 31 is provided with a protective pad 32, and the protective pad 32 is in contact with the embedded partition 50 to reduce local damage to the embedded partition 50 during the process of the pressing rod 31 applying a load to the embedded partition 50.

[0061] In some embodiments, the protection pad 32 may be a rubber pad, an airbag pad, etc., which is not limited in the embodiments of the present application.

[0062] In some embodiments, the pressing rod 31 can be replaced with different sizes according to actual needs to test honeycomb core materials 40 of different shapes and sizes. The embodiment of the present application does not limit the specific size of the pressing rod 31.

[0063] In general, the holes of the honeycomb core material 40 are regular hexagons. In order to enable the pressing rod 31 to enter the interior of the honeycomb core material 40 to be tested and apply a load to the embedded partition plate 50, such as Figure 4 As shown, the pressing rod 31 is a regular hexagonal prism, and the side length of the pressing rod 31 is slightly smaller than the side length of the hole of the honeycomb core material 40, so that the pressing rod 31 can enter the interior of the honeycomb core material 40 along the axial direction of the honeycomb core material 40 without contacting the inner wall of the honeycomb core material 40, so as to ensure the accuracy during the test.

[0064] The protective pad 32 is also a regular hexagon, and the side length of the protective pad 32 is equal to the side length of the pressing rod 31, and the orientation of the protective pad 32 and the pressing rod 31 are consistent, so that the protective pad 32 can cover the end surface of the pressing rod 31 to ensure the accuracy during the test. Figure 5 As shown, during the test, the position of the pressing rod 31 is adjusted to be consistent with the position of the holes of the honeycomb core material 40 so that the pressing rod 31 can be accurately pressed into the holes of the honeycomb core material 40 to accurately apply load to the embedded partition 50.

[0065] In some other embodiments, the holes of the honeycomb core material 40 may also be other regular polygons or circles, and the pressing rod 31 and the protection pad 32 are both adapted shapes consistent with the holes of the honeycomb core material 40, which is not limited in the embodiments of the present application.

[0066] In order to further ensure that the pressing unit can stably apply load to the embedded partition 50 under the drive of the electronic universal testing machine, the testing equipment provided in the embodiment of the present application also includes a guide unit, which is fixedly connected to the lower pressure plate 12, and the upper pressure plate 11 can slide with the guide unit.

[0067] like Figure 1-Figure 2As shown, the guide unit includes a first guide rod 21 and a second guide rod 22; the upper pressure plate 11 includes an upper pressure plate body 110, and a first fixing member 111 and a second fixing member 112 which are detachably fixedly connected on both sides of the upper pressure plate body 110. Specifically, the upper pressure plate body 110 is provided with connecting threaded holes in the circumferential direction, and the first fixing member 111 and the second fixing member 112 are both provided with through holes corresponding to the connecting threaded holes provided on the upper pressure plate body 110, so that the threaded fasteners can detachably fix and connect the upper pressure plate body 110 and the first fixing member 111 and the second fixing member 112; similarly, the lower pressure plate 12 includes a lower pressure plate body 120, and a third fixing member 121 and a fourth fixing member 122 which can be detachably fixedly connected on both sides of the lower pressure plate body 120 by threaded fasteners.

[0068] In some other embodiments, the upper pressure plate body 110, the first fixing member 111, and the second fixing member 112 can be an integrated structure, and the lower pressure plate body 120, the third fixing member 121, and the fourth fixing member 122 can also be an integrated structure to improve the strength of the upper pressure plate 11 and the lower pressure plate 12.

[0069] like Figure 1-Figure 2 As shown, the first guide rod 21 is slidably matched with the first fixing member 111, and the first guide rod 21 is fixedly connected to the top of the third fixing member 121; the second guide rod 22 is slidably matched with the second fixing member 112, and the second guide rod 112 is fixedly connected to the top of the fourth fixing member 122. In this way, the upper pressing plate 11 can move along the first guide rod 21 and the second guide rod 22 toward the honeycomb core material 40 to be tested, ensuring the stability of the pressing process of the pressing rod 31 and improving the accuracy of the testing process.

[0070] In order to further ensure the stability of the movement of the upper platen 11, Figure 1 As shown, a first linear bearing 23 is arranged between the first fixing member 111 and the first guide rod 21; a second linear bearing 24 is arranged between the second fixing member 112 and the second guide rod 22, so that the upper pressure plate 11 moves more smoothly and stably along the first guide rod 21 and the second guide rod 22, further ensuring the stability and accuracy of the test process.

[0071] It should be noted that in the bonding performance testing equipment for the embedded partition provided in the embodiment of the present application, the parts of each unit are cut and processed by plates or blocks; the parts of each unit are made of elastic alloy materials, or other metals, polymers or ceramics that meet the strength, rigidity, and applicable temperature requirements. The parts of each unit have small dimensional deformation during use and will not generate internal stress. The surface of the parts of each unit is smooth and chamfered, and will not cause scratches on the tested specimens and operators.

[0072] When testing the bonding performance testing equipment of the embedded partition provided in the embodiment of the present application, firstly, the second connecting member 14 is connected to the electronic universal testing machine so that the lower pressure plate 12 is connected to the electronic universal testing machine; then, the pressing rod 31 is installed on the upper pressure plate 11, and the upper pressure plate 11 passes through the first guide rod 21 and the second guide rod 22, and then the first connecting member 13 is connected to the electronic universal testing machine so that the upper pressure plate 11 is connected to the electronic universal testing machine, and then the honeycomb core material 40 to be tested is placed on the lower pressure plate 12, and the position of the pressing rod 31 is adjusted so that the orientation of the pressing rod 31 is consistent with the holes of the honeycomb core material 40, and then the electronic universal testing machine is started to drive the pressing rod 31 to press into the holes of the honeycomb core material 40, and continuously apply load to the embedded partition 50 for testing.

[0073] The embodiment of the present application also provides a method for testing the bonding performance of an embedded partition. Using the above-mentioned testing equipment, the method for testing the bonding performance of an embedded partition includes the following steps:

[0074] In S1, the honeycomb core material 40 to be tested is placed in an atmospheric environment for pretreatment to obtain a pretreated honeycomb core material 40, the atmospheric environment temperature is (23±2)°C and the atmospheric environment relative humidity is (50±10)%, and the honeycomb core material 40 is placed for 24 hours for pretreatment;

[0075] In S2, the value of the cell side length w of the pre-treated honeycomb core material 40 and the value of the thickness h of the embedded partition plate 50 are measured;

[0076] In S3, the test equipment is assembled, the press rod 31 is installed with the upper platen 11, the upper platen 11 is assembled with the first guide rod 21 and the second guide rod 22, and the upper platen 11 and the lower platen 12 in the test equipment are respectively connected to the electronic universal testing machine;

[0077] In S4, the pretreated honeycomb core material 40 is placed in a testing device for testing. The testing steps include:

[0078] S41: placing the pretreated honeycomb core material 40 on the lower pressing plate 12, and adjusting the pretreated honeycomb core material 40 so that the shape range of the holes of the pretreated honeycomb core material 40 is consistent with the orientation of the pressing rod 31, so as to ensure that the pressing rod 31 can be pressed into the interior of the honeycomb core material 40 without contacting the inner wall of the honeycomb core material 40, and controlling the upper pressing plate 11 to move downward by the electronic universal testing machine so that the bottom surface of the protection pad 32 and the upper wall surface of the honeycomb core material 40 are at the same horizontal position, and the displacement data and load data of the electronic universal testing machine are cleared at this time, so as to facilitate data recording in the subsequent test process;

[0079] S42: Figure 6As shown, under the bonding performance test temperature condition, the central hole of the pretreated honeycomb core material 40 is selected as the first test point, and then the second test point is selected at least one hole apart, and so on to select multiple test points.

[0080] It should be noted that at least three pretreated honeycomb core materials 40 are required to be prepared as test samples, and at least five holes at different positions are selected on each pretreated honeycomb core material 40 for testing, unless effective results can be obtained using fewer honeycomb core materials 40 to ensure the validity of the test results.

[0081] Measure the value of the distance l between the upper wall surface of the pretreated honeycomb core material 40 and the embedded partition 50, and then drive the upper pressure plate 11 to drop a distance l, so that the protection pad 32 can contact the embedded partition 50 at this time, and the load value displayed by the electronic universal testing machine at this time is not greater than 2N, or other smaller load values, to ensure that the protection pad 32 is in contact with the embedded partition 50 at this time, and the pressing rod 31 does not apply excessive load to the embedded partition 50 at this time, which will not affect the subsequent testing process.

[0082] S43: Under the bonding performance test temperature condition, the upper pressure plate 11 is controlled to descend at a rate v by the electronic universal testing machine, and the electronic universal testing machine is observed in real time. The load value is reduced to 10% of the maximum load value as the basis for stopping the electronic universal testing machine, so that the pressing rod 31 continues to apply load to the embedded partition 50 until the embedded partition 50 and the honeycomb core material 40 at the test point are completely separated. The above steps are repeated until the test of all the test points is completed, and the load-displacement curve in the above process is obtained, such as Figure 7 As shown, the maximum breaking load P is obtained in the process in which the pressing rod 31 continuously applies load to the embedded partition 50 and separates the embedded partition 50 from the honeycomb core material 40. max .

[0083] In some embodiments, the rate v may be 1 mm / min, or other rates that can satisfy the test process, which is not limited in the embodiments of the present application.

[0084] It should be noted that after the test is completed, it is necessary to observe and record the state of each hole after destruction in order to select valid test data. The test is considered to be valid if the holes of the embedded partition 50 and the honeycomb core material 40 are completely separated and there are no obvious defects at the separation point, and is selected as valid test data.

[0085] Among them, S4 also includes: placing the test equipment in a high and low temperature environment box, adjusting the high and low temperature environment box according to different test temperature conditions, so that the test environment of the pretreated honeycomb core material 40 reaches the corresponding bonding performance test temperature conditions, and keeping it warm for 30 minutes to ensure the stability of the test environment.

[0086] S4 also includes a calculation unit, which can obtain the bonding performance parameters of the embedded partition 50 in the pretreated honeycomb core material 40 and the honeycomb core material 40 through the testing equipment under the bonding performance test temperature conditions; the bonding performance parameters include at least one of the shear strength of the embedded partition 50, the cumulative failure probability of the embedded partition 50, the average shear strength of the embedded partition 50, and the variance of the shear strength of the embedded partition 50.

[0087] The calculation unit includes: obtaining the maximum destructive load P max After that, use , calculate the shear strength of the embedded partition 50 , the unit is MPa; where P max is the maximum destructive load, in N, obtained by testing with an electronic universal testing machine; w is the side length of the hole, in mm; h is the thickness of the embedded partition 50, in mm.

[0088] In actual situations, due to the internal shape defects of the embedded partition 50 and the stability of the bonding process between the embedded partition 50 and the honeycomb core material 40, the bonding effect will be affected, which will make the calculated shear strength of the embedded partition 50 The data has a large dispersion, so the bonding performance test method of the embedded partition provided in the embodiment of the present application describes the shear strength of the embedded partition 50 by Weibull distribution. The statistical distribution of .

[0089] The calculation unit also includes: using The cumulative distribution function of the failure probability of the embedded partition 50 is obtained, where is the shear strength of the embedded partition 50 Under the condition of , the cumulative failure probability of the embedded partition 50; m is the dimensionless shape parameter of the Weibull distribution, and m is used to describe the dispersion of the shear strength of the embedded partition 50. Generally, the larger the m, the more concentrated the shear strength of the embedded partition 50; is the size parameter of the Weibull distribution, in GPa.

[0090] Because the above formula In the size parameters and dimensionless shape parameter m are unknown and can be obtained by the following calculation:

[0091] Select valid data and pass Calculated shear strength of the embedded partition 50 The shear strength is calculated in order from small to large. Sort by, and record the i-th shear strength as σ i, where i=1,2,3…N (N is the total number of valid data of the tested honeycomb core material 40), using , it can be calculated that the shear strength σ i Under this condition, the probability Fi of the embedded partition 50 being damaged;

[0092] Upward Taking the natural logarithm of both sides, we get , using σ i and F i , and obtain ㏑σ and A scatter plot between Figure 8 As shown, a linear fit is performed on the scatter plot. The slope of the straight line obtained after the linear fitting is the dimensionless shape parameter m of the Weibull distribution. The intercept of the straight line obtained after the linear fitting can be used to obtain the size parameter of the Weibull distribution. ; The dimensionless shape parameter m and size parameter Bring-in In the equation, the cumulative failure probability F(σ) of the embedded partition 50 under the shear strength σ can be calculated.

[0093] like Figure 8 As shown, we can know the determination coefficient R 2 =0.96804, because in the fitting degree judgment standard, R 2 The closer it is to 1, the better the fitting effect is. Therefore, using σ i and F i The fitting effect of the curve fitted by the scatter plot obtained is good, so the dimensionless shape parameter m and size parameter obtained by fitting the curve The data is also relatively accurate, so that the cumulative failure probability F (σ) can more accurately represent the failure probability between the embedded partition 50 and the honeycomb core material 40, so as to more accurately reflect the bonding performance between the embedded partition 50 and the honeycomb core material 40.

[0094] The calculation unit also includes: under the bonding performance test temperature condition, according to the expected value formula of Weibull distribution, using , where Г is the gamma function, and the average shear strength of the embedded partition 50 is calculated. .

[0095] The calculation unit also includes: under the bonding performance test temperature condition, using , where Г is a gamma function, and the variance D of the shear strength of the embedded partition 50 is calculated, so that the discrete degree of the shear strength of the embedded partition 50 can be obtained to determine the stability of the bonding effect between the embedded partition 50 and the honeycomb core material 40.

[0096] The testing method for the bonding performance of the embedded partition provided in the embodiment of the present application obtains multiple parameters such as shear strength, cumulative failure probability, average shear strength, and variance of shear strength by separating the honeycomb core material 40 to be tested from the embedded partition 50, thereby providing effective data support for the bonding performance of the embedded partition 50 and the honeycomb core material 40, and providing data support for the design and preparation of the subsequent sound-absorbing structure of the honeycomb core material 40.

[0097] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An adhesive performance testing device for an embedded partition, characterized in that: Used to test the bonding performance between the embedded partition plate (50) and the honeycomb core material (40), the bonding performance testing equipment comprising: a loading unit and a pressing unit; Wherein, the loading unit is used to connect to an electronic universal testing machine, and the pressing unit is detachably fixedly connected to the loading unit; The honeycomb core material (40) is relatively fixed to the electronic universal testing machine, an embedded partition plate (50) is bonded inside the honeycomb core material (40), and the embedded partition plate (50) is distributed along the radial direction of the honeycomb core material (40); The pressing unit is used to press into the interior of the honeycomb core material (40) along the axial direction of the honeycomb core material (40), and the pressing unit is used to apply a load to the embedded partition plate (50).

2. The bonding performance testing device for the embedded partition according to claim 1, characterized in that: The loading unit comprises an upper pressing plate (11) and a lower pressing plate (12), and the upper pressing plate (11) and the lower pressing plate (12) are both used for connecting to the electronic universal testing machine; The pressing unit is detachably fixedly connected to the upper pressing plate (11); the upper pressing plate (11) can drive the pressing unit to move along the axial direction of the honeycomb core material (40); and the lower pressing plate (12) is used to place the honeycomb core material (40).

3. The bonding performance testing device for the embedded partition according to claim 2, characterized in that: The pressing unit comprises a pressing rod (31); the upper pressing plate (11) is provided with a connecting hole (113); The first end of the press-in rod (31) is threadedly engaged with the connecting hole (113), and the end surface of the second end of the press-in rod (31) is provided with a protective pad (32), and the protective pad (32) is used to abut against the embedded partition plate (50).

4. The bonding performance testing device for the embedded partition according to claim 3, characterized in that: The holes of the honeycomb core material (40) are regular hexagons, the press-in rods (31) are regular hexagonal prisms, and the side length of the press-in rods (31) is smaller than the side length of the holes of the honeycomb core material (40); The protection pad (32) is a regular hexagon, the side length of the protection pad (32) is equal to the side length of the pressing rod (31), and the protection pad (32) covers the end surface of the pressing rod (31).

5. The bonding performance testing device for the embedded partition according to claim 2, characterized in that: The loading unit further comprises a first connecting member (13), a second connecting member (14), a first locking member (15) and a second locking member (16); The first connecting member (13) is detachably fixedly connected to the top end of the upper pressure plate (11), the first connecting member (13) is used to connect to the electronic universal testing machine, the first locking member (15) is externally mounted on the first connecting member (13), and the first locking member (15) is used to lock the first connecting member (13) and the electronic universal testing machine; The second connecting member (14) is detachably fixedly connected to the bottom end of the lower pressure plate (12), the second connecting member (14) is used to connect to the electronic universal testing machine, the second locking member (16) is externally mounted on the second connecting member (14), and the second locking member (16) is used to lock the second connecting member (14) and the electronic universal testing machine.

6. The bonding performance testing device for the embedded partition according to claim 2, characterized in that: Also includes a guide unit; The guide unit is fixedly connected to the lower pressure plate (12), and the upper pressure plate (11) is slidably matched with the guide unit.

7. The bonding performance testing device for the embedded partition according to claim 6, characterized in that: The guide unit comprises a first guide rod (21) and a second guide rod (22); The upper pressure plate (11) comprises an upper pressure plate body (110), and a first fixing member (111) and a second fixing member (112) detachably fixedly connected to two sides of the upper pressure plate body (110); The lower pressure plate (12) comprises a lower pressure plate body (120), and a third fixing member (121) and a fourth fixing member (122) detachably fixedly connected to two sides of the lower pressure plate body (120); The first guide rod (21) is slidably matched with the first fixing member (111), and the first guide rod (21) is fixedly connected to the top end of the third fixing member (121); The second guide rod (22) is slidably matched with the second fixing member (112), and the second guide rod (22) is fixedly connected to the top end of the fourth fixing member (122).

8. The bonding performance testing device for the embedded partition according to claim 7, characterized in that: A first linear bearing (23) is provided between the first fixing member (111) and the first guide rod (21); A second linear bearing (24) is provided between the second fixing member (112) and the second guide rod (22).

9. A method for testing the bonding performance of an embedded partition, characterized in that: Using the bonding performance testing device for the embedded partition as described in any one of claims 1 to 8, the bonding performance testing method comprises the steps of: S1, placing the honeycomb core material (40) to be tested in an atmospheric environment for pretreatment to obtain a pretreated honeycomb core material (40); S2, measuring the value of the cell side length w of the pre-treated honeycomb core material (40) and the value of the thickness h of the embedded partition (50); S3, assembling the bonding performance testing equipment, installing the pressing rod (31) and the upper pressing plate (11), assembling the upper pressing plate (11) and the first guide rod (21) and the second guide rod (22), and connecting the upper pressing plate (11) and the lower pressing plate (12) to an electronic universal testing machine respectively; S4, placing the pretreated honeycomb core material (40) in the bonding performance testing device for testing, the testing operation comprising: S41: placing the pretreated honeycomb core material (40) on the lower pressing plate (12), adjusting the pretreated honeycomb core material (40) so that the shape and orientation of the holes of the pretreated honeycomb core material (40) are consistent with the orientation of the pressing rod (31), and controlling the upper pressing plate (11) to move downward by an electronic universal testing machine so that the pressing rod (31) moves to the same horizontal position as the upper wall surface of the pretreated honeycomb core material (40); S42: selecting the central hole of the pretreated honeycomb core material (40) as the first test point, then selecting the second test point at least one hole apart, and selecting multiple test points by analogy; measuring the value of the distance l between the upper wall surface of the pretreated honeycomb core material (40) and the embedded partition (50); lowering the upper pressure plate (11) by a distance l so that the protection pad (32) contacts the embedded partition (50); S43: The upper pressing plate (11) is controlled to descend at a rate v by the electronic universal testing machine, so that the pressing rod (31) continuously applies a load to the embedded partition (50) until the embedded partition (50) at the test point is completely separated from the honeycomb core material (40), and the maximum destructive load P of the pressing rod (31) on the embedded partition (50) is obtained. max .

10. The method for testing the bonding performance of an embedded partition according to claim 9, characterized in that: The S4 further comprises: The bonding performance testing device is placed in a high and low temperature environment box, and the high and low temperature environment box is adjusted according to different test temperature conditions so that the test environment of the pretreated honeycomb core material (40) reaches the corresponding bonding performance test temperature conditions.

11. The method for testing the bonding performance of an embedded partition according to claim 10, characterized in that: The S4 further includes a calculation unit, which can obtain the maximum breaking load P under the bonding performance test temperature condition through the bonding performance test device of the embedded partition. max , and calculate the bonding performance parameters between the embedded partition (50) and the honeycomb core material (40); the bonding performance parameters include at least one of the shear strength of the embedded partition (50), the cumulative failure probability of the embedded partition (50), the average shear strength of the embedded partition (50), and the shear strength variance of the embedded partition (50).

12. The method for testing the bonding performance of an embedded partition according to claim 11, characterized in that: The computing unit comprises: Under the bonding performance test temperature conditions, the maximum breaking load P of the press rod (31) on the embedded partition (50) is obtained. max ,use , calculate the shear strength σ of the embedded partition (50).

13. The method for testing the bonding performance of an embedded partition according to claim 12, characterized in that: The computing unit further comprises: Under the bonding performance test temperature conditions, the distribution function of the cumulative failure probability can be obtained according to the Weibull distribution: , where m is the dimensionless shape parameter of the Weibull distribution, is the size parameter of the Weibull distribution; Arrange the calculated shear strengths σ in ascending order to obtain the i-th shear strength σ i , i=1,2,3...N, N is the total number of points to be tested, using , the shear strength σ i The probability of damage of the embedded partition (50) is F i ; Upward Taking the natural logarithm of both sides, we get , using σ i and F i , and obtain ㏑σ and The scatter plot between , the scatter plot is linearly fitted, the slope of the straight line obtained after the linear fitting is the dimensionless shape parameter m of the Weibull distribution, and the intercept of the straight line obtained after the linear fitting can be used to obtain the size parameter of the Weibull distribution ; The dimensionless shape parameter m and size parameter Bring-in In the above, the cumulative failure probability F(σ) of the embedded partition (50) under the shear strength σ can be calculated.

14. The method for testing the bonding performance of an embedded partition according to claim 13, characterized in that: The computing unit further comprises: Under the bonding performance test temperature conditions, using , calculate the average shear strength of the embedded partition (50) , where Г is the gamma function.

15. The method for testing the bonding performance of an embedded partition according to claim 13, characterized in that: The computing unit further comprises: Under the bonding performance test temperature conditions, using , the variance D of the shear strength of the embedded partition (50) is calculated, where Г is the gamma function.

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