Plating selection control method and system based on positioning and tracking

Abstract

The invention relates to a plating selection control method and system based on positioning and tracking, and relates to the technical field of electroplating. The method comprises the following steps: when a to-be-plated workpiece is detected, scanning a positioner on the to-be-plated workpiece to obtain first positioning information representing the position of the to-be-plated workpiece and target information used for determining an area needing to be electroplated, and then carrying out image acquisition on an image of the to-be-plated workpiece to obtain the image of the to-be-plated workpiece; and based on the image of the workpiece to be plated and the target information, second positioning information representing the position of the target area is determined. Furthermore, the target area is electroplated based on the first positioning information and the second positioning information, and selective electroplating of the specific area is realized. The to-be-plated workpiece is positioned firstly, then the specific area of the to-be-plated workpiece is positioned, and positioning of the specific area is achieved without manual intervention. Through the image of the workpiece to be plated and the target information, the specific area can be accurately positioned. According to the technical scheme, the precision and efficiency of plating selection control can be improved, and then the quality of electroplated products is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of electroplating technology, and in particular, to a selective plating control method and system based on positioning tracking. Background Art

[0002] Electroplating technology uses the principle of electrolysis to plate a thin layer of other metals or alloys on certain metal surfaces. It is a process that uses electrolysis to adhere a layer of metal film to the surface of metal or other material parts. It can prevent metal oxidation (such as rust), improve wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhance aesthetics.

[0003] Selective plating technology, which can be called selective electroplating, is a localized electroplating technology used to enhance, repair or refurbish specific local areas of manufactured parts.

[0004] In selective plating technology, it is necessary to locate and track specific local areas to ensure the accuracy of selective plating control and thus ensure the quality of electroplated products. Summary of the invention

[0005] The purpose of the present disclosure is to provide a selective plating control method and system based on positioning tracking, which can improve the accuracy and efficiency of selective plating control, thereby improving the quality of electroplating products.

[0006] In order to achieve the above-mentioned objectives, in a first aspect, the present disclosure provides a selective plating control method based on positioning tracking, comprising: in response to detecting a workpiece to be plated, scanning a locator on the workpiece to be plated to obtain first positioning information and target information for determining a target area, wherein the first positioning information is used to characterize the position of the workpiece to be plated, and the target area is an area on the workpiece to be plated that needs to be electroplated; performing image acquisition on the workpiece to be plated to obtain an image of the workpiece to be plated; determining second positioning information based on the image of the workpiece to be plated and the target information, wherein the second positioning information is used to characterize the position of the target area; and controlling an electroplating device to electroplate the target area based on the first positioning information and the second positioning information.

[0007] Optionally, the locator is used to transmit a positioning signal, and an electronic tag is affixed to the locator. The locator on the workpiece to be plated is scanned to obtain first positioning information and target information for determining a target area, including: scanning the positioning signal emitted by the locator, and determining the first positioning information based on the scanned positioning signal; scanning the electronic tag, and determining the target information for determining the target area based on the scanned electronic tag information.

[0008] Optionally, determining the second positioning information based on the image of the workpiece to be plated and the target information includes: determining image feature conditions corresponding to the target area based on the target information; performing feature extraction on the image of the workpiece to be plated to obtain image features corresponding to the image of the workpiece to be plated; determining position information of the target area in the image of the workpiece to be plated based on the image feature conditions corresponding to the target area and the image features corresponding to the image of the workpiece to be plated; determining the second positioning information based on the position information of the target area in the image of the workpiece to be plated.

[0009] Optionally, the target information includes: information of the workpiece to be plated, and determining the image feature conditions corresponding to the target area based on the target information includes: obtaining pre-configured selective plating reference information, the pre-configured selective plating reference information including: a plurality of preset electroplating workpiece information and electroplating area information respectively corresponding to the plurality of preset electroplating workpiece information; comparing the plurality of preset electroplating workpiece information with the workpiece information to be plated to determine the target preset electroplating workpiece information; and determining the image feature conditions corresponding to the target area based on the electroplating area information corresponding to the target preset electroplating workpiece information.

[0010] Optionally, the workpiece to be plated is a circuit board, which includes multiple electronic devices. The plating area information corresponding to the target plating workpiece information includes: plating area size, plating area material and electronic device information of the plating area. The image feature conditions corresponding to the target area are determined based on the plating area information corresponding to the target preset plating workpiece information, including: determining the size feature condition corresponding to the target area based on the plating area size; determining the first pixel feature condition corresponding to the target area based on the plating area material; determining the second pixel feature condition corresponding to the target area based on the electronic device information, the first pixel feature and the second pixel feature belonging to different types of pixel features; determining the image feature condition corresponding to the target area based on the size feature condition, the first pixel feature condition and the second pixel feature condition.

[0011] Optionally, determining the second positioning information based on the image of the workpiece to be plated and the target information includes: determining model reference information based on the target information, the model reference information being used to assist a pre-trained image processing model in performing image processing, the training data corresponding to the pre-trained image processing model including: a plurality of sample electroplated workpiece images, the plurality of sample electroplated workpiece images respectively identifying areas to be electroplated; using the pre-trained image processing model, marking the image of the workpiece to be plated based on the model reference information to obtain a processed image of the workpiece to be plated including a target area identification; and determining the second positioning information based on the position of the target area identification in the processed workpiece image.

[0012] Optionally, the workpiece to be plated is a circuit board, which includes multiple electronic devices, and the target information includes: plating area size, plating area material and electronic device information of the plating area, and determining the model reference information based on the target information includes: determining first model reference information based on the plating area size, the first model reference information is used to characterize the proportion of the area to be identified in the image of the workpiece to be plated; determining second model reference information based on the plating area material, the second model reference information is used to characterize the proportion of the first target pixel in the area to be identified in the image of the workpiece to be plated; determining third model reference information based on the electronic device information, the third model reference information is used to characterize the proportion of the second target pixel in the area to be identified in the image of the workpiece to be plated; the second target pixel and the first target pixel belong to different pixel types; and determining the final model reference information based on the first model reference information, the second model reference information and the third model reference information.

[0013] Optionally, controlling the electroplating device to electroplate the target area according to the first positioning information and the second positioning information includes: controlling the electroplating device to move to a plating position that matches the position of the workpiece to be plated according to the first positioning information; and controlling the electroplating device to electroplate the target area according to a preset plating selection strategy and the second positioning information, the preset plating selection strategy being any one of brush plating, package flow plating or dripless plating.

[0014] Optionally, the selective plating control method also includes: in response to detecting that the electroplating device has completed the electroplating of the target area, capturing an image of the electroplated workpiece to obtain an image of the electroplated workpiece; determining electroplating evaluation information for characterizing positioning accuracy based on the image of the workpiece to be plated and the image of the electroplated workpiece; and optimizing the electroplating accuracy of the electroplating device based on the electroplating evaluation information.

[0015] In a second aspect, the present disclosure provides a selective plating control system based on positioning and tracking, comprising: a scanning device, configured to scan a locator on a workpiece to be plated in response to detecting the workpiece to be plated, and obtain first positioning information and target information for determining a target area, wherein the first positioning information is used to characterize the position of the workpiece to be plated, and the target area is an area on the workpiece to be plated that needs to be electroplated; an image acquisition device, configured to acquire an image of the workpiece to be plated, and obtain an image of the workpiece to be plated; a positioning and tracking device, connected to the scanning device and the image acquisition device respectively, and configured to determine second positioning information based on the image of the workpiece to be plated and the target information, wherein the second positioning information is used to characterize the position of the target area; a control device, connected to the positioning and tracking device, and configured to control the electroplating device to electroplate the target area based on the first positioning information and the second positioning information.

[0016] Through the above technical solution, when the workpiece to be plated is detected, the locator on the workpiece to be plated is scanned to obtain the first positioning information characterizing the position of the workpiece to be plated and the target information for determining the area to be electroplated, and then the image of the workpiece to be plated is captured to obtain the image of the workpiece to be plated. Based on the image of the workpiece to be plated and the target information, the second positioning information characterizing the position of the target area is determined. Then, based on the first positioning information and the second positioning information, the target area is electroplated to achieve selective electroplating of a specific area. By first positioning the workpiece to be plated and then positioning the specific area of ​​the workpiece to be plated, the positioning of the specific area is achieved without manual intervention. And, through the image of the workpiece to be plated and the target information, the specific area can be accurately positioned. Therefore, this technical solution can improve the accuracy and efficiency of selective plating control, thereby improving the quality of electroplated products.

[0017] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings: Figure 1 It is a block diagram of a selective plating control system based on positioning tracking according to an exemplary embodiment.

[0019] Figure 2 It is a schematic diagram showing a selective plating scenario according to an exemplary embodiment.

[0020] Figure 3 It is a flow chart of a selective plating control method based on positioning tracking according to an exemplary embodiment.

[0021] Figure 4 is a schematic diagram of a workpiece to be plated according to an exemplary embodiment.

[0022] Figure 5 The figure is a schematic diagram of a model application according to an exemplary embodiment.

[0023] Figure 6 It is a block diagram of an electronic device according to an exemplary embodiment. DETAILED DESCRIPTION

[0024] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0025] Electroplating technology uses the principle of electrolysis to plate a thin layer of other metals or alloys on certain metal surfaces. It is a process that uses electrolysis to adhere a layer of metal film to the surface of metal or other material parts. It can prevent metal oxidation (such as rust), improve wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhance aesthetics.

[0026] Selective plating technology, which can be called selective electroplating, is a localized electroplating technology used to enhance, repair or refurbish specific local areas of manufactured parts.

[0027] In selective plating technology, it is necessary to locate and track specific local areas to ensure the accuracy of selective plating control and thus ensure the quality of electroplated products.

[0028] In related technologies, positioning technologies such as laser radar are used to locate products that need to be electroplated, so as to control the electroplating equipment to achieve electroplating. This technical solution can be applied to conventional electroplating scenarios, but electroplating control for specific areas still requires manual intervention, resulting in low electroplating efficiency.

[0029] Based on this, the embodiments of the present disclosure provide a technical solution, which combines image processing technology with positioning technology to achieve accurate positioning and tracking of specific areas of products that require electroplating without human intervention, thereby achieving precise and efficient selective plating control and improving the quality of electroplated products.

[0030] Figure 1 is a block diagram of a selective plating control system based on positioning tracking according to an exemplary embodiment, such as Figure 1 As shown, the system includes: a scanning device, an image acquisition device, a positioning and tracking device, and a control device.

[0031] Among them, the positioning and tracking device is connected to the scanning device and the image acquisition device respectively, and the control device can be integrated on the electroplating device, or connected to the electroplating device, for issuing control instructions to the electroplating device.

[0032] In some embodiments, the scanning device can be a signal transceiver, which can obtain relevant information by receiving or transmitting signals. The scanning device can be integrated on the electroplating device, that is, the position of the scanning device and the position of the electroplating device can be regarded as the same position.

[0033] In some embodiments, the image acquisition device may be an industrial camera, which may be applied in industrial scenes to acquire industrial-type images.

[0034] In some embodiments, the positioning tracking device may be a data processing device that can obtain relevant data from the scanning device and the image acquisition device and perform processing.

[0035] In some embodiments, the control device may be a host computer, which may obtain positioning information determined by the positioning tracking device and control the electroplating device.

[0036] In some embodiments, the control device and the positioning tracking device can be integrated into the same device, which is not limited here.

[0037] Figure 2 is a schematic diagram of a selective plating scenario according to an exemplary embodiment, such as Figure 2 As shown, in the selective plating scenario, multiple workpieces to be plated are moved to the bottom of the electroplating device by a conveyor belt. A scanning device and an image acquisition device are configured at the location of the electroplating device. After the current workpiece to be plated moves to the bottom of the electroplating device, the conveyor belt first pauses transmission, and the scanning device and the image acquisition device obtain relevant data, and then transmit it to the positioning tracking device. The positioning tracking device obtains positioning information based on the relevant data, and then transmits it to the control device. The control device then issues a control instruction to the electroplating device based on the positioning information, so that the electroplating device electroplates a specific area to achieve selective plating control. After the selective plating is completed, the conveyor belt is controlled to continue moving to perform selective plating control on the next workpiece to be plated.

[0038] Figure 3 is a flow chart of a selective plating control method based on positioning tracking according to an exemplary embodiment. Figure 3 As shown, the selective plating control method includes: Step S31, in response to detecting the workpiece to be plated, scanning the locator on the workpiece to be plated to obtain first positioning information and target information for determining a target area, wherein the first positioning information is used to characterize the position of the workpiece to be plated, and the target area is the area on the workpiece to be plated that needs to be electroplated.

[0039] Step S32, collecting images of the workpiece to be plated to obtain images of the workpiece to be plated.

[0040] Step S33, determining second positioning information according to the image of the workpiece to be plated and the target information, where the second positioning information is used to characterize the position of the target area.

[0041] Step S34, controlling the electroplating device to electroplate the target area according to the first positioning information and the second positioning information.

[0042] In some embodiments, step S31 can be implemented by a scanning device, that is, the locator on the workpiece to be plated is scanned by the scanning device to obtain first positioning information and target information for determining the target area.

[0043] In some embodiments, the locator on the workpiece to be plated can emit a signal, and when the signal strength received by the scanning device is higher than a preset strength, the workpiece to be plated is deemed to be detected. The preset signal strength can be determined based on the distance between the scanning device and the conveyor belt, and the preset signal strength can indicate that the position of the workpiece to be plated (i.e., the electroplating position) is located below the scanning device. Therefore, the preset signal strength can be determined based on the relationship between the scanning device and the electroplating position in different scenarios.

[0044] Figure 4 is a schematic diagram of a workpiece to be plated according to an exemplary embodiment. Figure 4 As shown, the workpiece to be plated includes a target area, which is an area that needs selective electroplating. For example, it can be an area that needs to be repaired, an area that needs to be enhanced, etc.

[0045] A locator is provided on the workpiece to be plated, and the locator can emit a positioning signal. The positioning signal can be: a Bluetooth positioning signal, a radio frequency positioning signal, a laser positioning signal, etc. For details, reference can be made to the mature positioning methods based on signal transmission and reception in the art.

[0046] An electronic tag is attached to the locator, and the electronic tag may be an electronic tag based on radio frequency technology. By scanning the electronic tag, corresponding information may be obtained. For example, the electronic tag may be a QR code, a bar code, or the like.

[0047] The position of the locator may be a position that does not affect the electroplating of the workpiece to be plated, such as an edge position.

[0048] Therefore, step S31 may include: scanning the positioning signal emitted by the locator, and determining the first positioning information according to the scanned positioning signal; scanning the electronic tag, and determining the target information used to determine the target area according to the scanned electronic tag information.

[0049] In this embodiment, the position information of the workpiece to be plated can be obtained by scanning the positioning signal emitted by the positioning device, and the target information for determining the target area can be obtained by scanning the electronic tag.

[0050] It can be understood that the first positioning information is only used to characterize the position of the workpiece to be plated, which is equivalent to rough positioning information. If the target area needs to be electroplated, the positioning information of the corresponding target area also needs to be obtained.

[0051] Therefore, target information that can be used to determine the target area can be preconfigured to achieve positioning tracking based on the target area.

[0052] There may be a variety of different implementations of target information, which will be described in detail in the subsequent embodiments.

[0053] In some embodiments, step S32 may be performed by an image acquisition device.

[0054] In some embodiments, the scanning device may send information to the image acquisition device to inform the image acquisition device that it can perform image acquisition. Alternatively, the image acquisition device may continue to acquire images, and when positioning and tracking are performed subsequently, positioning and tracking may be performed based on the images acquired by the image acquisition device at the time when the target information is obtained.

[0055] In some embodiments, the image of the workpiece to be plated needs to include the entire workpiece to be plated in order to achieve accurate positioning of the target area.

[0056] Furthermore, in step S33, the positioning tracking device may determine the second positioning information according to the image of the workpiece to be plated and the target information.

[0057] As an optional implementation, step S33 includes: determining image feature conditions corresponding to the target area based on the target information; performing feature extraction on the image of the workpiece to be plated to obtain image features corresponding to the image of the workpiece to be plated; determining position information of the target area in the image of the workpiece to be plated based on the image feature conditions corresponding to the target area and the image features corresponding to the image of the workpiece to be plated; determining second positioning information based on the position information of the target area in the image of the workpiece to be plated.

[0058] In this embodiment, since the image of the workpiece to be plated also includes the target area, the image feature conditions that the target area needs to meet can be determined through the target information, and the image feature conditions are used to determine the position information of the target area in the image of the workpiece to be plated, and then, the position information is converted into position information in the real scene, that is, the second positioning information.

[0059] In some embodiments, the conversion relationship between the coordinates of the image of the workpiece to be plated and the real coordinates can be pre-configured, and based on the conversion relationship, the image coordinates can be directly converted into the real coordinates. For details, reference can be made to the mature coordinate conversion technology in the art, which will not be described in detail here.

[0060] In some embodiments, the target information includes: information about the workpiece to be plated, and the information about the workpiece to be plated can be used to uniquely identify the workpiece to be plated and reflect the characteristics of the workpiece to be plated.

[0061] For example, the information of the workpiece to be plated may include relatively simple information such as the identification of the workpiece to be plated and the type of the workpiece to be plated. Regarding the identification of the workpiece to be plated, it can be understood that each product to be electroplated has a corresponding product identification, such as a serial number. Regarding the type of the workpiece to be plated, it can be described that the workpiece to be plated belongs to various workpieces, and the form may also be a type identification.

[0062] Furthermore, according to the target information, the image feature conditions corresponding to the target area are determined, including: obtaining pre-configured selective plating reference information, the pre-configured selective plating reference information including: a plurality of preset electroplating workpiece information and electroplating area information respectively corresponding to the plurality of preset electroplating workpiece information; comparing the plurality of preset electroplating workpiece information with the workpiece information to be plated to determine the target preset electroplating workpiece information; and determining the image feature conditions corresponding to the target area according to the electroplating area information corresponding to the target preset electroplating workpiece information.

[0063] In this embodiment, selective plating reference information is pre-configured, and the selective plating reference information includes a plurality of preset electroplating workpiece information and electroplating area information corresponding to the plurality of preset electroplating workpiece information.

[0064] It can be understood that the plating selection reference information is usually configured before the product is electroplated, so it can be obtained directly.

[0065] In some embodiments, a plurality of preset electroplating workpiece information is compared with the workpiece information to be plated to determine the target preset electroplating workpiece information. For example, assuming that both the preset electroplating workpiece information and the workpiece information to be plated include a product identifier and a type identifier, the product identifiers are compared first, and if the same product identifier is found, the same preset electroplating workpiece information is determined as the target preset electroplating workpiece information. If the same product identifier is not found, the type identifier is compared, and the preset electroplating workpiece information with the same type identifier is determined as the target preset electroplating workpiece information.

[0066] Furthermore, based on the electroplating area information corresponding to the target preset electroplating workpiece information, the image feature conditions corresponding to the target area can be determined.

[0067] In some embodiments, the workpiece to be plated may be a circuit board, which includes a plurality of electronic devices. Then, the plating area information may include: plating area size, plating area material, and electronic device information of the plating area. Accordingly, the plating area information corresponding to the target plating workpiece information may also include: plating area size, plating area material, and electronic device information of the plating area.

[0068] In some embodiments, the electronic device information may include: the number of electronic devices, the number of types of electronic devices, and the distribution density of electronic devices, etc.

[0069] Thus, according to the plating area information corresponding to the target preset plating workpiece information, the image feature conditions corresponding to the target area are determined, which may include: determining the size feature conditions corresponding to the target area according to the size of the plating area; determining the first pixel feature conditions corresponding to the target area according to the material of the plating area; determining the second pixel feature conditions corresponding to the target area according to the electronic device information, the first pixel feature and the second pixel feature belonging to different types of pixel features; determining the image feature conditions corresponding to the target area according to the size feature conditions, the first pixel feature conditions and the second pixel feature conditions.

[0070] In some embodiments, the size of the electroplating area can be converted into the size of the target area in the image. For example, assuming that the size ratio of the image of the workpiece to be plated to the actual workpiece to be plated is 1:10, then if the size of the electroplating area is 10, the size of the target area in the image can be around 1, so the size feature condition can be in the range of 0.9 to 1.1.

[0071] The size characteristic condition can be used to easily determine the location of the target area in the image of the workpiece to be plated.

[0072] It can be understood that different electroplating area materials have different corresponding pixel grayscale means. Therefore, the first pixel feature can be the pixel grayscale mean. Thus, the pixel grayscale mean condition can be determined based on the electroplating area material. The pixel grayscale mean can be the average value between the pixel grayscales in the area.

[0073] For example, the average grayscale value of pixels corresponding to the copper material is higher than the average grayscale value of pixels corresponding to the iron material.

[0074] It can be understood that different electronic device information has different corresponding pixel grayscale similarities. Therefore, the second pixel feature can be the pixel grayscale similarity. The pixel grayscale similarity can be represented by the difference between the pixel grayscales. The larger the difference, the lower the similarity.

[0075] For example, the greater the number of electronic devices, the greater the number of types of electronic devices, the higher the distribution density of electronic devices, and the higher the pixel grayscale similarity, it means that the pixel distribution is denser.

[0076] Therefore, according to the electronic device information, a reasonable second pixel characteristic condition can be configured.

[0077] In some embodiments, size characteristic conditions corresponding to different electroplating area sizes, first pixel characteristic conditions corresponding to different electroplating area materials, and second pixel characteristic conditions corresponding to different electronic device information can be preconfigured. Furthermore, according to the current relevant information and the preconfigured conditional relationship, the corresponding conditions matched by the current relevant information can be determined.

[0078] Furthermore, the image feature conditions corresponding to the target area include: a size feature condition, a first pixel feature condition and a second pixel feature condition.

[0079] In some embodiments, feature extraction is performed on the image of the workpiece to be plated to obtain image features corresponding to the image of the workpiece to be plated, which may include: dividing the image of the workpiece to be plated into multiple sub-areas according to the image size corresponding to the target area, and then extracting the first pixel feature and the second pixel feature from each sub-area.

[0080] In some embodiments, image feature extraction can be achieved through mature feature extraction technology in the art, which will not be described in detail here.

[0081] Furthermore, the image feature condition corresponding to the target area is compared with the first pixel feature and the second pixel feature actually extracted, and the sub-area that can meet the image feature condition is determined as the target area.

[0082] Furthermore, the second positioning information can be obtained by converting the position information of the target area in the image of the workpiece to be plated into real coordinates.

[0083] In some embodiments, when performing sub-region division, a variety of different sub-region division methods can be used to perform image feature condition matching respectively to ensure that the target area in the image of the workpiece to be plated can be located.

[0084] As an optional implementation, step S33 includes: determining model reference information based on target information, the model reference information is used to assist a pre-trained image processing model in performing image processing, the training data corresponding to the pre-trained image processing model includes: multiple sample electroplating workpiece images, each of which identifies areas that need to be electroplated; using the pre-trained image processing model, identifying the image of the workpiece to be plated according to the model reference information, to obtain a processed image of the workpiece to be plated including the target area identification; determining the second positioning information based on the position of the target area identification in the processed workpiece image.

[0085] In this embodiment, the target area is marked by the model. Therefore, for the pre-trained image processing model, its training data may include: a plurality of sample electroplating workpiece images, in which the areas that need to be electroplated are marked.

[0086] In some embodiments, multiple sample electroplated workpiece images may cover products that require selective electroplating in an electroplating scene, and they are all images captured from real electroplated products.

[0087] In some embodiments, the pre-trained image processing model can be a large model. For a large model, after the training is completed, it has preliminary prediction capabilities. However, if the reference information of the model can be increased, the prediction accuracy of the model can be improved.

[0088] Therefore, in the embodiments of the present disclosure, model reference information is determined based on the target information to assist the pre-trained image processing model to better complete the identification of the target area.

[0089] In some embodiments, the model reference information and the image of the workpiece to be plated are output together to a pre-trained large image processing model to obtain a processed image of the workpiece to be plated including a target area identifier.

[0090] In some embodiments, under the implementation mode in which the target information includes: the size of the electroplating area, the material of the electroplating area and the electronic device information of the electroplating area, determining the model reference information according to the target information may include: determining the first model reference information according to the size of the electroplating area, the first model reference information being used to characterize the proportion of the area to be identified in the image of the workpiece to be plated; determining the second model reference information according to the material of the electroplating area, the second model reference information being used to characterize the proportion of the first target pixel in the area to be identified in the image of the workpiece to be plated; determining the third model reference information according to the electronic device information, the third model reference information being used to characterize the proportion of the second target pixel in the area to be identified in the image of the workpiece to be plated; the second target pixel and the first target pixel belong to different pixel types; determining the final model reference information according to the first model reference information, the second model reference information and the third model reference information.

[0091] In this embodiment, the proportion of the target area in the workpiece to be plated can be determined according to the size of the electroplating area, and this proportion is also the proportion of the area to be marked in the image of the workpiece to be plated.

[0092] In some embodiments, the first target pixel may be a pixel whose pixel grayscale satisfies a preset pixel grayscale mean condition, and the preset pixel grayscale mean condition may be related to the material of the electroplating area, and the specific implementation method may refer to the aforementioned first pixel characteristic condition. Accordingly, the proportion of the electroplating area material in all materials is determined based on the electroplating area material and the materials of other areas in the workpiece to be plated. Furthermore, the proportion may characterize the proportion of the first target pixel in the image of the workpiece to be plated.

[0093] In some embodiments, the second target pixel may be the proportion of the second pixel feature whose pixel grayscale satisfies a preset pixel grayscale similarity condition. The preset pixel grayscale similarity condition may be related to the electronic device information, and specific reference may be made to the implementation of the aforementioned second pixel feature condition. Accordingly, based on the electronic device information and the electronic device information of other areas in the workpiece to be plated, the proportion of the electronic device information in all the electronic device information is determined, that is, the proportion of the second target pixel in the area to be identified in the image of the workpiece to be plated.

[0094] Furthermore, the first model reference information, the second model reference information and the third model reference information may be integrated into final model reference information.

[0095] Figure 5 is a schematic diagram of a model application according to an exemplary embodiment. Figure 5 As shown, based on the image of the workpiece to be plated, target information is determined; based on the target information and relevant information of the workpiece to be plated, three types of model reference information can be determined. Then, the three types of model reference information and the image of the workpiece to be plated without the target area marked are input into the image processing model, and the image processing model marks the part of the workpiece to be plated corresponding to the target area based on the model reference information, and outputs an image including the target area mark.

[0096] Furthermore, based on the position of the target area marker in the image, it can be converted into second positioning information.

[0097] In other embodiments, the model reference information may also be reference information that affects the accuracy of the model, such as external bias constants, etc., which may be specifically configured according to different scenarios and are not limited here.

[0098] For example, according to the target information, the identification difficulty of the target area can be determined, and according to the identification difficulty, a reasonable external bias constant can be configured. For example, the smaller the size of the electroplating area, the more common the material of the electroplating area, and the less the electronic device information of the electroplating area, the higher the identification difficulty.

[0099] Further, in step S34, based on the first positioning information and the second positioning information, the electroplating device can be controlled to electroplate the target area.

[0100] As an optional implementation, this step includes: according to the first positioning information, controlling the electroplating device to move to the electroplating position that matches the position of the workpiece to be plated; according to the preset selective plating strategy and the second positioning information, controlling the electroplating device to electroplate the target area, and the preset selective plating strategy is: any one of brush plating, package flow plating or dripless plating.

[0101] In this embodiment, one of brush plating, package flow plating or dripless plating can be used.

[0102] In some embodiments, the electroplating device can first control the electroplating device to move to an electroplating position that matches the position of the workpiece to be plated according to the first positioning information, and then further move to an electroplating position that matches the position of the target area according to the second positioning information, and perform electroplating according to the selective plating strategy.

[0103] In some embodiments, control instructions for the electroplating device can be generated based on the first positioning information, the second positioning information, and the plating selection strategy. The generation method of the control instructions can refer to mature implementation methods in the art, which will not be described in detail here. That is, in the embodiments of the present disclosure, the key is how to determine the positioning information, and the specific control method after positioning can adopt mature technologies in the art.

[0104] In some embodiments, after the electroplating is completed, the electroplating effect may be evaluated.

[0105] As an optional embodiment, the selective plating control method also includes: in response to detecting that the electroplating device has completed the electroplating of the target area, capturing an image of the electroplated workpiece to obtain an image of the electroplated workpiece; determining electroplating evaluation information for characterizing positioning accuracy based on the image of the workpiece to be plated and the image of the electroplated workpiece; and optimizing the electroplating accuracy of the electroplating device based on the electroplating evaluation information.

[0106] In this embodiment, after the electroplating device completes the electroplating according to the control instruction, the electroplating will be temporarily stopped. Therefore, after it is detected that the electroplating device temporarily stops the electroplating, it is considered that the electroplating of the target area is completed.

[0107] At this time, the image acquisition device can be used to acquire the image of the electroplated workpiece to obtain the image of the electroplated workpiece.

[0108] Next, the image of the workpiece to be plated and the image of the workpiece that has been plated may be combined to determine electroplating evaluation information for characterizing positioning accuracy.

[0109] In some embodiments, since the portion corresponding to the target region in the plated workpiece image may change, the similarity between the image of the workpiece to be plated and the image of the plated workpiece may be determined, and if the similarity matches the image difference that may be caused by the target region, it indicates that the positioning accuracy is high.

[0110] In some embodiments, the image difference that may be caused by the target area can be determined based on the size, electronic device information and material of the target area. The higher the image difference, the lower the similarity between the image of the workpiece to be plated and the image of the electroplated workpiece.

[0111] Alternatively, other implementations may be used to determine the positioning accuracy, which is not limited here.

[0112] Furthermore, if the positioning accuracy is low, the electroplating accuracy of the electroplating device can be optimized first to compensate for the influence of the positioning accuracy on the electroplating effect, for example, by reducing the electroplating speed of the electroplating device, increasing the intermediate stop point of the electroplating device, and so on.

[0113] At the same time, the low current positioning accuracy can also be fed back to the relevant maintenance personnel so that the relevant maintenance personnel can optimize the positioning strategy, for example, increase the accuracy of the target information carried by the electronic tag for determining the target area, so as to more accurately locate the target area. Or, replace the image acquisition device to improve the image acquisition accuracy, etc.

[0114] In an embodiment of the present disclosure, when a workpiece to be plated is detected, the locator on the workpiece to be plated is scanned to obtain first positioning information characterizing the position of the workpiece to be plated and target information for determining the area to be electroplated, and then, the image of the workpiece to be plated is captured to obtain an image of the workpiece to be plated. Based on the image of the workpiece to be plated and the target information, second positioning information characterizing the position of the target area is determined. Further, based on the first positioning information and the second positioning information, the target area is electroplated to achieve selective electroplating of a specific area. By first positioning the workpiece to be plated and then positioning the specific area of ​​the workpiece to be plated, positioning of the specific area is achieved without manual intervention. Furthermore, the specific area can be accurately positioned through the image of the workpiece to be plated and the target information. Therefore, the technical solution can improve the accuracy and efficiency of selective plating control, thereby improving the quality of electroplated products.

[0115] Figure 6 FIG. 6 is a block diagram of an electronic device 600 according to an exemplary embodiment. Figure 6 As shown, the electronic device 600 may include: a processor 601 , a memory 602 . The electronic device 600 may also include one or more of a multimedia component 603 , an input / output (I / O) interface 604 , and a communication component 605 .

[0116] The processor 601 is used to control the overall operation of the electronic device 600 to complete all or part of the steps in the above-mentioned selective plating control method based on positioning tracking. The memory 602 is used to store various types of data to support the operation of the electronic device 600, and these data may include, for example, instructions for any application or method used to operate on the electronic device 600, and application-related data, such as contact data, sent and received messages, pictures, audio, video, etc. The memory 602 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (Static Random Access Memory, referred to as SRAM), electrically erasable programmable read-only memory (Electrically Erasable Programmable Read-Only Memory, referred to as EEPROM), erasable programmable read-only memory (Erasable Programmable Read-Only Memory, referred to as EPROM), programmable read-only memory (Programmable Read-Only Memory, referred to as PROM), read-only memory (Read-Only Memory, referred to as ROM), magnetic memory, flash memory, disk or optical disk. The multimedia component 603 may include a screen and an audio component. The screen may be, for example, a touch screen, and the audio component is used to output and / or input audio signals. For example, the audio component may include a microphone, which is used to receive external audio signals. The received audio signal may be further stored in the memory 602 or sent through the communication component 605. The audio component also includes at least one speaker for outputting audio signals. The I / O interface 604 provides an interface between the processor 601 and other interface modules, and the above-mentioned other interface modules may be keyboards, mice, buttons, etc. These buttons may be virtual buttons or physical buttons. The communication component 605 is used for wired or wireless communication between the electronic device 600 and other devices. Wireless communication, such as Wi-Fi, Bluetooth, Near Field Communication (NFC), 2G, 3G or 4G, or a combination of one or more of them, so the corresponding communication component 605 may include: Wi-Fi module, Bluetooth module, NFC module.

[0117] In an exemplary embodiment, the electronic device 600 may be implemented by one or more application specific integrated circuits (ASIC), digital signal processors (DSP), digital signal processing devices (DSPD), programmable logic devices (PLD), field programmable gate arrays (FPGA), controllers, microcontrollers, microprocessors or other electronic components to execute the above-mentioned XXXX method.

[0118] In another exemplary embodiment, a computer-readable storage medium including program instructions is also provided, and when the program instructions are executed by a processor, the steps of the selective plating control method based on positioning tracking are implemented. For example, the computer-readable storage medium can be the memory 602 including the program instructions, and the program instructions can be executed by the processor 601 of the electronic device 600 to complete the selective plating control method based on positioning tracking.

[0119] In another exemplary embodiment, a computer program product is also provided, which includes a computer program that can be executed by a processor, and when the computer program is executed by the processor, the steps of the above-mentioned selective plating control method based on positioning tracking are implemented.

[0120] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0121] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0122] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A selective plating control method based on positioning tracking, characterized in that: include: In response to detecting the workpiece to be plated, scanning the positioner on the workpiece to be plated to obtain first positioning information and target information for determining a target area, wherein the first positioning information is used to characterize the position of the workpiece to be plated, and the target area is an area on the workpiece to be plated that needs to be electroplated; Capturing an image of the workpiece to be plated to obtain an image of the workpiece to be plated; Determine second positioning information according to the image of the workpiece to be plated and the target information, wherein the second positioning information is used to characterize the position of the target area; According to the first positioning information and the second positioning information, the electroplating device is controlled to electroplate the target area.

2. The selective plating control method according to claim 1, characterized in that: The locator is used to transmit a positioning signal, an electronic tag is attached to the locator, and the locator on the workpiece to be plated is scanned to obtain first positioning information and target information for determining a target area, including: Scanning the positioning signal transmitted by the locator, and determining the first positioning information according to the scanned positioning signal; The electronic tag is scanned, and target information for determining a target area is determined based on the scanned electronic tag information.

3. The selective plating control method according to claim 1, characterized in that: Determining the second positioning information according to the image of the workpiece to be plated and the target information includes: Determining image feature conditions corresponding to the target area according to the target information; Extracting features of the image of the workpiece to be plated to obtain image features corresponding to the image of the workpiece to be plated; Determining the position information of the target area in the image of the workpiece to be plated according to the image feature conditions corresponding to the target area and the image features corresponding to the image of the workpiece to be plated; The second positioning information is determined according to the position information of the target area in the image of the workpiece to be plated.

4. The selective plating control method according to claim 3, characterized in that: The target information includes: information of the workpiece to be plated, and the image feature conditions corresponding to the target area are determined according to the target information, including: Acquire pre-configured selective plating reference information, wherein the pre-configured selective plating reference information includes: a plurality of preset electroplating workpiece information and electroplating area information respectively corresponding to the plurality of preset electroplating workpiece information; Compare the plurality of preset electroplating workpiece information with the workpiece information to be plated to determine target preset electroplating workpiece information; According to the electroplating area information corresponding to the target preset electroplating workpiece information, the image feature conditions corresponding to the target area are determined.

5. The selective plating control method according to claim 4, characterized in that: The workpiece to be plated is a circuit board, and the circuit board includes a plurality of electronic devices. The plating area information corresponding to the target plating workpiece information includes: plating area size, plating area material and electronic device information of the plating area. The image feature conditions corresponding to the target area are determined according to the plating area information corresponding to the target preset plating workpiece information, including: Determining the size characteristic condition corresponding to the target area according to the size of the electroplating area; Determining a first pixel characteristic condition corresponding to the target area according to the material of the electroplating area; Determining, according to the electronic device information, a second pixel feature condition corresponding to the target area, wherein the first pixel feature and the second pixel feature belong to different types of pixel features; An image feature condition corresponding to the target area is determined according to the size feature condition, the first pixel feature condition, and the second pixel feature condition.

6. The selective plating control method according to claim 1, characterized in that: Determining the second positioning information according to the image of the workpiece to be plated and the target information includes: Determine model reference information according to the target information, wherein the model reference information is used to assist a pre-trained image processing model in performing image processing, wherein training data corresponding to the pre-trained image processing model includes: a plurality of sample electroplated workpiece images, wherein the plurality of sample electroplated workpiece images respectively identify areas that need to be electroplated; By using the pre-trained image processing model, the image of the workpiece to be plated is subjected to identification processing according to the model reference information to obtain a processed image of the workpiece to be plated including the target area identification; The second positioning information is determined according to the position of the target area identifier in the processed workpiece image.

7. The selective plating control method according to claim 6, characterized in that: The workpiece to be plated is a circuit board, and the circuit board includes a plurality of electronic devices. The target information includes: the size of the electroplating area, the material of the electroplating area, and the electronic device information of the electroplating area. The model reference information is determined according to the target information, including: Determine first model reference information according to the size of the electroplating area, wherein the first model reference information is used to characterize the proportion of the area to be marked in the image of the workpiece to be plated; Determine second model reference information according to the material of the electroplating area, where the second model reference information is used to characterize the proportion of the first target pixel in the area to be marked in the image of the workpiece to be plated; Determine third model reference information according to the electronic device information, wherein the third model reference information is used to characterize the proportion of a second target pixel in the area to be marked in the image of the workpiece to be plated; the second target pixel and the first target pixel belong to different pixel types; Final model reference information is determined according to the first model reference information, the second model reference information and the third model reference information.

8. The selective plating control method according to claim 1, characterized in that: The controlling the electroplating device to electroplate the target area according to the first positioning information and the second positioning information comprises: According to the first positioning information, controlling the electroplating device to move to an electroplating position matching the position of the workpiece to be plated; According to a preset selective plating strategy and the second positioning information, the electroplating device is controlled to electroplate the target area, and the preset selective plating strategy is any one of brush plating, package flow plating or dripless plating.

9. The selective plating control method according to claim 1, characterized in that: The selective plating control method also includes: In response to detecting that the electroplating device has completed electroplating the target area, capturing an image of the electroplated workpiece to obtain an image of the electroplated workpiece; Determining electroplating evaluation information for characterizing positioning accuracy according to the image of the workpiece to be plated and the image of the electroplated workpiece; The electroplating accuracy of the electroplating device is optimized according to the electroplating evaluation information.

10. A selective plating control system based on positioning tracking, characterized in that: include: A scanning device is configured to scan a locator on the workpiece to be plated in response to detecting the workpiece to be plated, and obtain first positioning information and target information for determining a target area, wherein the first positioning information is used to characterize the position of the workpiece to be plated, and the target area is an area on the workpiece to be plated that needs to be electroplated; An image acquisition device is configured to acquire an image of the workpiece to be plated to obtain an image of the workpiece to be plated; A positioning tracking device, connected to the scanning device and the image acquisition device respectively, and configured to determine second positioning information according to the image of the workpiece to be plated and the target information, wherein the second positioning information is used to characterize the position of the target area; The control device is connected to the positioning tracking device and is configured to control the electroplating device to electroplate the target area according to the first positioning information and the second positioning information.

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