Voltage control method and device, electronic equipment, storage medium and program product

Abstract

According to the voltage control method and device, the electronic equipment, the storage medium and the program product provided by the invention, by accurately testing the working states of the chip under multiple voltages, the relatively appropriate target voltage for working of the chip can be determined, and energy consumption waste caused by improper voltage setting is avoided. Afterwards, the appropriate voltage value is stored and is directly applied after the chip is assembled to the display module, so that the accuracy and timeliness of voltage regulation are ensured. The efficiency of voltage regulation is improved, potential damage to the chip and the display module due to voltage fluctuation or over-high setting is reduced, and the service life of equipment is prolonged. And further optimization of the power consumption of the display equipment is realized by accurately matching the voltage requirement of the chip.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a voltage control method, device, electronic device, storage medium and program product. Background Art

[0002] High refresh rate and high resolution display devices usually lead to high power consumption. Low-frequency display technology can reduce power consumption by reducing the refresh rate. For example, low-temperature polycrystalline oxide (LTPO) display panels can achieve low-frequency display, as low as 1Hz, effectively reducing display power consumption.

[0003] However, as user demands develop, the specifications of display devices are gradually improved, and there is still a need to further reduce the power consumption of display devices. Summary of the invention

[0004] In view of this, the purpose of the present application is to propose a voltage control method, device, electronic device, storage medium and program product to solve the above technical problems.

[0005] Based on the above purpose, the first aspect of the present application provides a voltage control method, comprising:

[0006] Determining a test signal of an integrated circuit chip, wherein the test signal includes a plurality of test voltages and an operating voltage parameter corresponding to the integrated circuit chip;

[0007] Determining the operating state of the integrated circuit chip under the multiple test voltages based on the multiple test voltages and the operating voltage parameters corresponding to the integrated circuit chip;

[0008] Determining a target voltage corresponding to the integrated circuit chip from the multiple test voltages according to the working state of the integrated circuit chip under the multiple test voltages, and storing the target voltage corresponding to the integrated circuit chip;

[0009] In response to the integrated circuit chip being assembled into the display module, the voltage of the integrated circuit chip assembled into the display module is adjusted according to the target voltage corresponding to the integrated circuit chip.

[0010] Optionally, the operating voltage parameters include an operating voltage error range and a target operating voltage;

[0011] The determining the working state of the integrated circuit chip under the multiple test voltages based on the multiple test voltages and the working voltage parameters corresponding to the integrated circuit chip includes:

[0012] For each test voltage, perform the following:

[0013] Determining a difference between the test voltage and the target operating voltage;

[0014] In response to the difference value being within the operating voltage error range, determining whether the operating states of the functional modules of the integrated circuit chip are all normal under the test voltage;

[0015] In response to yes, it is determined that the working state of the integrated circuit chip under the test voltage is a normal state; or,

[0016] In response to no, it is determined that the working state of the integrated circuit chip under the test voltage is an abnormal state.

[0017] Optionally, the operating voltage parameter includes an operating voltage range;

[0018] The method of determining the working state of the integrated circuit chip under the multiple test voltages based on the multiple test voltages and the working voltage parameters corresponding to the integrated circuit chip includes:

[0019] For each test voltage, perform the following:

[0020] In response to the test voltage being within the operating voltage range, determining whether the operating states of the functional modules of the integrated circuit chip under the test voltage are all in a normal state;

[0021] In response to yes, it is determined that the working state of the integrated circuit chip under the test voltage is a normal state; or,

[0022] In response to no, it is determined that the working state of the integrated circuit chip under the test voltage is an abnormal state.

[0023] Optionally, determining a target voltage corresponding to the integrated circuit chip from the multiple test voltages according to the working state of the integrated circuit chip under the multiple test voltages includes:

[0024] In response to the integrated circuit chip operating in a normal state under multiple test voltages, a minimum test voltage is selected from the multiple test voltages, and the minimum test voltage is used as a target voltage corresponding to the integrated circuit chip; or

[0025] In response to the existence of an abnormal state in the working state of the integrated circuit chip under multiple test voltages, the test voltage corresponding to the abnormal state is eliminated from the multiple test voltages, and the minimum test voltage is screened from the multiple test voltages after elimination, and the minimum test voltage is used as the target voltage corresponding to the integrated circuit chip.

[0026] Optionally, the display module is provided with a power management integrated circuit;

[0027] The voltage regulation of the integrated circuit chip assembled into the display module according to the target voltage corresponding to the integrated circuit chip includes:

[0028] Using a preset initial voltage to power the integrated circuit chip assembled in the display module, so as to control the integrated circuit chip assembled in the display module to be in a normal state;

[0029] The stored target voltage corresponding to the integrated circuit chip is read back, and the power management integrated circuit is controlled to adjust the integrated circuit chip assembled into the display module from a preset initial voltage to the target voltage corresponding to the integrated circuit chip.

[0030] Optionally, the display module is provided with a digital integrated circuit and a power management integrated circuit;

[0031] In response to the integrated circuit chip being assembled into the display module, after voltage adjustment is performed on the integrated circuit chip assembled into the display module according to the target voltage corresponding to the integrated circuit chip, the method further includes:

[0032] Performing gamma debugging on the display module, and storing the target voltage corresponding to the integrated circuit chip assembled into the display module in the digital integrated circuit during the gamma debugging process;

[0033] In response to the power management integrated circuit receiving the power supply request of the display module, the power management integrated circuit is controlled to supply power to the integrated circuit chip assembled in the display module according to the target voltage corresponding to the integrated circuit chip.

[0034] Optionally, after determining that the working state of the integrated circuit chip under the test voltage is an abnormal state, the method further includes:

[0035] Recording that the integrated circuit chip is in a failed state under the test voltage.

[0036] Based on the same inventive concept, the second aspect of the present application provides a voltage control device, comprising:

[0037] A test signal determination module is configured to determine a test signal of the integrated circuit chip, wherein the test signal includes a plurality of test voltages and an operating voltage parameter corresponding to the integrated circuit chip;

[0038] a working state determining module, configured to determine the working state of the integrated circuit chip under the multiple test voltages based on the multiple test voltages and the working voltage parameters corresponding to the integrated circuit chip;

[0039] a target voltage storage module, configured to determine a target voltage corresponding to the integrated circuit chip from the multiple test voltages according to the working state of the integrated circuit chip under the multiple test voltages, and store the target voltage corresponding to the integrated circuit chip;

[0040] The voltage regulating module is configured to regulate the voltage of the integrated circuit chip assembled into the display module according to the target voltage corresponding to the integrated circuit chip in response to the integrated circuit chip being assembled into the display module.

[0041] Based on the same inventive concept, the third aspect of the present application provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, wherein the processor implements the method described in the first aspect above when executing the computer program.

[0042] Based on the same inventive concept, the fourth aspect of the present application provides a non-transitory computer-readable storage medium, which stores computer instructions, and the computer instructions are used to enable a computer to execute the method described in the first aspect above.

[0043] Based on the same inventive concept, the fifth aspect of the present application provides a computer program product, including computer program instructions, which, when executed on a computer, enable the computer to execute the method described in the first aspect.

[0044] As can be seen from the above, the voltage control method, device, electronic device, storage medium and program product provided by the present application can determine a more suitable target voltage for the chip to work by accurately testing the working state of the chip under multiple voltages, thereby avoiding energy waste caused by improper voltage setting. Subsequently, this suitable voltage value is stored and directly applied after the chip is assembled to the display module, ensuring the accuracy and timeliness of voltage regulation. Not only does it improve the efficiency of voltage regulation, it also reduces the potential damage to the chip and display module caused by voltage fluctuations or excessive settings, and extends the service life of the equipment. Furthermore, by accurately matching the voltage requirements of the chip, further optimization of the power consumption of the display device is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0046] Figure 1 A flow chart of a voltage control method according to an embodiment of the present application;

[0047] Figure 2 A schematic diagram of a process for detecting and recording a qualified digital voltage (i.e., a target voltage) of an integrated circuit chip according to an embodiment of the present application;

[0048] Figure 3 A schematic diagram of a process of applying an optimal digital voltage (ie, target voltage) when assembling an integrated circuit chip of an embodiment of the present application onto a module;

[0049] Figure 4 A schematic diagram of a process of automatically completing a digital voltage update of a driver integrated circuit chip (IC) according to an embodiment of the present application;

[0050] Figure 5 A schematic diagram of lighting a display module according to an embodiment of the present application;

[0051] Figure 6 is a structural block diagram of a voltage control device according to an embodiment of the present application;

[0052] Figure 7 A schematic diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0053] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0054] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0055] It is understandable that before using the technical solutions of each embodiment of the present application, the type, scope of use, usage scenarios, etc. of the personal information involved will be informed to the user in an appropriate manner, and the user's authorization will be obtained.

[0056] For example, in response to receiving an active request from a user, a prompt message is sent to the user to clearly remind the user that the operation requested to be performed will require obtaining and using the user's personal information. Thus, the user can independently choose whether to provide personal information to the electronic device, application, server, storage medium or other software or hardware that performs the operation of the technical solution of the present application according to the prompt message.

[0057] As an optional but non-limiting implementation, in response to receiving the user's active request, the prompt information may be sent to the user in the form of a pop-up window, in which the prompt information may be presented in text form. In addition, the pop-up window may also carry a selection control for the user to choose "agree" or "disagree" to provide personal information to the electronic device.

[0058] It is understandable that the above notification and the process of obtaining user authorization are merely illustrative and do not constitute a limitation on the implementation method of this application. Other methods that meet relevant laws and regulations may also be applied to the implementation method of this application.

[0059] High refresh rate and high resolution display devices usually lead to high power consumption. Low-frequency display technology can reduce power consumption by reducing the refresh rate. For example, low-temperature polycrystalline oxide (LTPO) display panels can achieve low-frequency display, as low as 1Hz, effectively reducing display power consumption.

[0060] LTPO panel technology is relatively mature, but with the development of user needs, the specifications of display devices are gradually improved, and screen manufacturers still need to further reduce power consumption. Display power consumption includes organic electroluminescent (EL) and digital integrated circuit (DIC) power consumption. When the panel design is determined, the EL voltage and power consumption have been determined, and reducing DIC power consumption becomes the main power consumption optimization solution.

[0061] When designing each DIC, it is set according to the predetermined voltage. However, the process capabilities of each integrated circuit manufacturing (Fab) factory are different. Even in the same Fab factory, there will be differences in the products made at different stages. Therefore, each integrated circuit chip (IC) will be subject to wafer testing (chipprobing, CP) control before leaving the factory, and the preset operating voltage, current consumption, signal timing and correct execution of specific functions will be checked. However, in order to improve the yield, IC manufacturers will determine these contents and separate those that meet different parameters. However, there are still differences when ICs are shipped to module factories. In actual use, the voltage settings are the same. In order to fully reflect the characteristics of these ICs, the present application proposes a solution that can achieve intelligent identification of power consumption reduction.

[0062] At present, during the use of mobile phone display driver integrated circuits (DDIC), three independent power supplies are often used to power DDIC (3Power) or four independent power supplies are used to power DDIC (4power). The corresponding power consumption is mainly designed for analog power consumption and digital power consumption. Among them, analog power consumption is mainly related to panel design. Digital power consumption is mainly related to IC design and whether the circuit module (Intellectual Property, IP) with independent functions in the chip is used or not. Usually for mobile phone color pictures, digital power consumption may reach hundreds of milliamperes. When designing IC, standardized design is carried out according to the process data provided by the Fab factory. However, for each position of each wafer and different batches, there may be differences in the single IC produced. This difference will be tested in the final wafer test (Chip Probing, CPtest). Selecting unqualified products, this yield loss will inevitably cause the unit price of chips to rise. CP test is between wafer manufacturing and packaging in the entire chip production process. The test object is each die in the whole wafer. The purpose is to ensure that each die in the whole wafer can basically meet the device characteristics or design specifications, usually including voltage, current, timing and function verification.

[0063] For existing ICs, the digital voltage (DVDD) often uses a voltage of 1.2V, but for 28nm ICs, this voltage has dropped to 1V or even 0.9V. However, because the client is temporarily unwilling to change the power supply method, it is still using 1.2V to provide to the DIC, and the DIC is then internally reduced to the actual required voltage of the IC through a low-dropout regulator (LDO). If the IC uses a power management integrated circuit (PMIC) for external supply, the DVDD voltage can be directly reduced to the most suitable voltage for the IC. Through testing, it was found that for the same screen, DVDD is supplied by the PMIC externally and uses a low voltage, which will have a lower current, because the IC is now operating at the optimal efficiency voltage and can have lower power consumption.

[0064] However, because the optimal DVDD adaptation voltage of each IC is different when it leaves the factory, only one voltage range will be given to control these ICs when they are shipped. Those that do not meet the requirements are unqualified. Through research on the IC control standard, the voltage Vs±0~0.1V is set. For some ICs, the range may be greater than 0.2V. When this range is too large, such as 0.2V, corresponding to a digital current of 100mA, the power consumption can be saved by at least 20mW. Therefore, it is necessary to test and record the digital voltage of each IC before the driver IC leaves the factory. At present, when these ICs are shipped to panel manufacturers, they will be set with the highest voltage controlled so that all ICs are satisfied.

[0065] To this end, the present application proposes a solution that can apply a more appropriate DVDD voltage to each module, so that it can work at a more appropriate voltage (that is, the lowest voltage that can ensure the normal operation of the IC). For some low-cost considerations, the IC shipment yield is improved.

[0066] The embodiments of the present application provide a voltage control method, device, electronic device, storage medium and program product. By accurately testing the working state of the chip under multiple voltages, a more suitable target voltage for the chip to work can be determined, avoiding energy waste caused by improper voltage setting. Subsequently, this suitable voltage value is stored and directly applied after the chip is assembled to the display module, ensuring the accuracy and timeliness of voltage regulation. Not only does it improve the efficiency of voltage regulation, it also reduces the potential damage to the chip and display module caused by voltage fluctuations or excessive settings, and extends the service life of the device. Furthermore, by accurately matching the voltage requirements of the chip, further optimization of the power consumption of the display device is achieved.

[0067] like Figure 1 As shown, the method of this embodiment includes:

[0068] Step 101 : determining a test signal of an integrated circuit chip, wherein the test signal includes a plurality of test voltages and an operating voltage parameter corresponding to the integrated circuit chip.

[0069] In this step, the integrated circuit chip is the object to be tested. It is a complex electronic device that integrates a large number of electronic components (such as transistors, resistors, capacitors, etc.) on a tiny silicon chip.

[0070] Multiple test voltages refer to different voltage values ​​applied to the integrated circuit chip during the test process. These voltage values ​​are used to simulate various working conditions that the chip may encounter in order to observe its performance under different voltages.

[0071] The operating voltage parameter is the voltage range or specific voltage value required for the normal operation of an integrated circuit chip. Each chip has its design specifications, including the voltage range in which it can operate safely and effectively.

[0072] By determining the test signals of the integrated circuit chip, including multiple test voltages and corresponding operating voltage parameters, the performance and stability of the chip under different conditions can be fully evaluated. This helps to ensure that the chip can meet the design requirements in actual applications and improve the reliability and quality of the product.

[0073] Step 102: Determine the operating state of the integrated circuit chip under the multiple test voltages based on the multiple test voltages and the operating voltage parameters corresponding to the integrated circuit chip.

[0074] In this step, a series of different test voltages are used to simulate the working conditions that the integrated circuit chip may encounter, and the working voltage parameters of the chip are referred to to evaluate and analyze the working status of the chip under these different voltages (such as whether it can work normally, how is the performance, whether errors or failures occur, etc.), so as to understand its performance and stability under various conditions. This is crucial to ensure that the chip can work reliably in actual applications.

[0075] Step 103 , determining a target voltage corresponding to the integrated circuit chip from the multiple test voltages according to the working state of the integrated circuit chip under the multiple test voltages, and storing the target voltage corresponding to the integrated circuit chip.

[0076] In this step, based on the working conditions observed under multiple test voltages, a suitable voltage value is selected as the target voltage of the integrated circuit chip. This target voltage is a voltage value that enables the chip to exhibit better performance or meet specific requirements (such as power consumption, stability, etc.), for example, the minimum voltage that can ensure the normal operation of the chip.

[0077] Once the target voltage is determined, it is recorded or stored in an appropriate location, such as a database, configuration file, or non-volatile memory on the chip itself. In this way, in future use or production processes, this determined target voltage can be quickly accessed and used to ensure that the chip can operate under optimal conditions.

[0078] By accurately determining the target voltage for each chip, we can ensure that they achieve optimal performance and stability in actual applications.

[0079] Step 104 , in response to the integrated circuit chip being assembled into the display module, voltage regulation is performed on the integrated circuit chip assembled into the display module according to the target voltage corresponding to the integrated circuit chip.

[0080] In this step, an integrated circuit chip (which may be a driver chip, control chip, or other type of chip) is physically installed or embedded into a display module. A display module is the part of an electronic device (such as a smartphone, tablet, TV, etc.) that is responsible for displaying images or videos.

[0081] Each integrated circuit chip has its design specifications and performance requirements, including the voltage range in which it can work normally. This target voltage refers to the lowest voltage value that the chip needs to be adjusted to in order to work normally, efficiently and safely.

[0082] Once the integrated circuit chip is assembled into the display module, it needs to be voltage regulated to ensure that it can operate at the correct voltage. This usually involves using a voltage regulator, such as a low-dropout regulator (LDO), a DC-to-DC converter (DC-DC), etc. to adjust the power supply voltage provided to the chip to match the target voltage.

[0083] By precisely adjusting the voltage, the performance of the chip can be optimized and its service life can be extended. After the chip is assembled into the display module, it can be directly applied to ensure the accuracy and timeliness of voltage regulation. It not only improves the efficiency of voltage regulation, but also reduces the potential damage to the chip and display module caused by voltage fluctuations or excessive settings, and extends the service life of the device. Furthermore, by precisely matching the voltage requirements of the chip, the power consumption of the display device is further optimized.

[0084] Through the above scheme, by accurately testing the working status of the chip under multiple voltages, a more appropriate target voltage for the chip to work can be determined, avoiding energy waste caused by improper voltage setting. Subsequently, this appropriate voltage value is stored and directly applied after the chip is assembled into the display module, ensuring the accuracy and timeliness of voltage regulation. Not only does it improve the efficiency of voltage regulation, it also reduces the potential damage to the chip and display module caused by voltage fluctuations or excessive settings, and extends the service life of the device. Furthermore, by accurately matching the voltage requirements of the chip, the power consumption of the display device is further optimized.

[0085] In some embodiments, the operating voltage parameters include an operating voltage error range and a target operating voltage.

[0086] Step 102 includes:

[0087] For each test voltage, perform the following:

[0088] Step A1, determining a difference between the test voltage and the target operating voltage;

[0089] Step A2, in response to the difference value being within the operating voltage error range, determining whether the operating states of the functional modules of the integrated circuit chip under the test voltage are all normal;

[0090] Step A3, in response to yes, it is determined that the working state of the integrated circuit chip under the test voltage is normal. Or,

[0091] Step A3: in response to "no", determining that the working state of the integrated circuit chip under the test voltage is an abnormal state.

[0092] In the above scheme, the target operating voltage is an ideal operating voltage specified in the integrated circuit chip design or specification.

[0093] The operating voltage error range indicates the theoretical voltage fluctuation range within which the integrated circuit chip can work normally.

[0094] If the difference value is within the operating voltage error range, it means that although the test voltage is different from the target operating voltage, the difference is within an acceptable range, and the integrated circuit chip may work normally under this test voltage. Then the test proceeds to the next step, that is, to check whether all functional modules of the integrated circuit chip, that is, the circuit modules (Intellectual Property, IP) with independent functions in the chip, are in normal state under the current test voltage. This may involve testing the functions of each module to ensure that they can perform operations as expected.

[0095] If all functional modules work normally under the test voltage, it can be determined that the working state of the integrated circuit chip under the test voltage is normal.

[0096] If any functional module fails to operate normally under the test voltage, the operating state of the integrated circuit chip under the test voltage is determined to be an abnormal state.

[0097] In some embodiments, the operating voltage parameter includes an operating voltage range.

[0098] Step 102 includes:

[0099] For each test voltage, perform the following:

[0100] Step B1, in response to the test voltage being within the operating voltage range, determining whether the operating states of the various functional modules of the integrated circuit chip under the test voltage are all normal;

[0101] Step B2, in response to yes, determining that the working state of the integrated circuit chip under the test voltage is a normal state; or,

[0102] Step B3: in response to "no", determining that the working state of the integrated circuit chip under the test voltage is an abnormal state.

[0103] In the above scheme, each test voltage is compared with a predefined operating voltage range, which refers to the theoretical value of the voltage range within which the integrated circuit chip can work normally.

[0104] Apply a test voltage to the integrated circuit chip. This test voltage is selected within the preset operating voltage range in order to test how the chip performs under this specific voltage condition.

[0105] Next, the working status of each functional module of the integrated circuit chip will be checked under this test voltage, that is, whether the circuit modules (Intellectual Property, IP) with independent functions in the chip are in normal state. For example, whether the output of the functional module meets expectations, whether there are error signals, and whether the communication between modules is normal.

[0106] If all functional modules are confirmed to be operating normally under the test voltage, it can be determined that the working state of the integrated circuit chip under this test voltage is normal.

[0107] If any functional module is confirmed to be operating abnormally under the test voltage (for example, outputting an error signal, failing to respond to a command, etc.), then it can be determined that the operating state of the integrated circuit chip under this test voltage is abnormal.

[0108] In some embodiments, in step 103, determining a target voltage corresponding to the integrated circuit chip from the multiple test voltages according to the working state of the integrated circuit chip under the multiple test voltages includes:

[0109] Step C1, in response to the integrated circuit chip operating in a normal state under multiple test voltages, a minimum test voltage is selected from the multiple test voltages, and the minimum test voltage is used as a target voltage corresponding to the integrated circuit chip. Or,

[0110] Step C2, in response to the existence of an abnormal state in the working state of the integrated circuit chip under multiple test voltages, the test voltage corresponding to the abnormal state is eliminated from the multiple test voltages, and the minimum test voltage is screened from the multiple test voltages after elimination, and the minimum test voltage is used as the target voltage corresponding to the integrated circuit chip.

[0111] In the above scheme, the integrated circuit chip is placed under a plurality of different test voltages for inspection. These test voltages are designed to find the minimum voltage value that can make the chip work normally and have stable performance.

[0112] At each test voltage, observe and record the working status of the integrated circuit chip. The working status can be normal or abnormal. Normal status means that the chip can work as expected at this voltage, while abnormal status may include performance degradation, unstable operation, or complete inability to work.

[0113] If the IC chip shows normal working state under all the tested voltages, then the minimum voltage value is selected as the target voltage. This is because, under the premise of meeting normal working conditions, using a lower voltage can save energy, reduce heat generation, and may extend the service life of the chip.

[0114] If an integrated circuit chip exhibits abnormal behavior under certain test voltages, the voltage value that causes the abnormality is first removed from these voltages. Then, among the remaining normal working test voltages, the smallest voltage value is selected as the target voltage. This is done to ensure that the selected voltage will not cause the chip to work abnormally, but is as low as possible, thereby optimizing performance and energy consumption.

[0115] Once the target voltage is determined, this voltage value can be used to guide the power supply of the integrated circuit chip in actual application. Ensuring that the chip operates at the recommended target voltage can improve its performance stability, reduce failure rate, and may reduce the energy consumption of the overall system.

[0116] In summary, this process aims to find a balance through systematic testing and adjustment, that is, to ensure that the integrated circuit chip can run at the lowest possible voltage while ensuring normal operation, thereby optimizing performance, stability and energy consumption.

[0117] In some embodiments, the display module is provided with a power management integrated circuit.

[0118] In step 104, the voltage of the integrated circuit chip assembled into the display module is adjusted according to the target voltage corresponding to the integrated circuit chip, including:

[0119] Step D1 , using a preset initial voltage to power the integrated circuit chip assembled in the display module, so as to control the integrated circuit chip assembled in the display module to be in a normal state.

[0120] Step D2, reading back the stored target voltage corresponding to the integrated circuit chip, and controlling the power management integrated circuit to adjust the integrated circuit chip assembled into the display module from a preset initial voltage to the target voltage corresponding to the integrated circuit chip.

[0121] In the above solution, a preset initial voltage is used to power the integrated circuit chip assembled in the display module.

[0122] This initial voltage is pre-set to ensure that the integrated circuit chip can obtain sufficient power when it starts up, so as to enter a working state, that is, a normal state.

[0123] By providing this initial voltage, it ensures that the integrated circuit chip can start up normally and run its built-in basic functions.

[0124] This step is the basis for subsequent operations, because only when the integrated circuit chip is in a normal state can it be further voltage adjusted and performance optimized.

[0125] Next, the target voltage value corresponding to the integrated circuit chip stored in a certain location (which may be the integrated circuit chip itself, a memory connected to the integrated circuit chip, or other data source) is read back (or read).

[0126] The power management integrated circuit (PMIC) is controlled to adjust the voltage currently supplied to the integrated circuit chip from a preset initial voltage to a target voltage previously read back.

[0127] PMIC is an integrated circuit responsible for power distribution, conversion and management. It can adjust the voltage and current as needed to ensure that the integrated circuit chips in the display module can work under optimal conditions.

[0128] Through this series of steps, the integrated circuit chip will eventually be adjusted to operate at its target voltage.

[0129] At this voltage level, the performance, power consumption and stability of the integrated circuit chip are usually optimized, ensuring that the display module can work normally and efficiently.

[0130] In summary, this process involves multiple steps such as initial power supply, status confirmation, target voltage readback, and voltage regulation of the integrated circuit chip in the display module, aiming to ensure that the integrated circuit chip can operate with the lowest power consumption under normal working conditions, thereby improving the overall performance and stability of the display module.

[0131] In some embodiments, the display module is provided with a digital integrated circuit and a power management integrated circuit.

[0132] After step 104, the method further includes:

[0133] Step E1, performing gamma debugging on the display module, and storing the target voltage corresponding to the integrated circuit chip assembled into the display module in the digital integrated circuit during the gamma debugging process.

[0134] Step E2, in response to the power management integrated circuit receiving the power supply request of the display module, controlling the power management integrated circuit to supply power to the integrated circuit chip assembled in the display module according to the target voltage corresponding to the integrated circuit chip.

[0135] In the above scheme, gamma debugging is an important part of display technology, which is used to adjust the brightness, contrast and color balance of the display module to ensure the image display quality.

[0136] During this process, the display module will undergo a series of tests and adjustments to achieve the best display effect.

[0137] During the gamma debugging process, the integrated circuit chip (IC chip) assembled into the display module requires a specific voltage to work properly.

[0138] These specific voltage values ​​(i.e., target voltages) are stored in a digital integrated circuit, which may be a dedicated memory chip used to store key parameters obtained during the debugging process.

[0139] The display module needs to obtain power supply before normal operation. This request is sent by the display module and received by the Power Management Integrated Circuit (PMIC).

[0140] A PMIC is an integrated circuit responsible for managing and distributing power to various components in a system.

[0141] Once the PMIC receives a power supply request from the display module, it will power the IC chip assembled in the display module according to the target voltage information previously stored in the digital integrated circuit.

[0142] This means that the PMIC will precisely adjust the output voltage to ensure that each IC chip obtains the specific voltage value it requires, thereby ensuring that the display module operates normally with the lowest power consumption and achieves the expected display effect.

[0143] In some embodiments, in step A3 or step B3, after determining that the working state of the integrated circuit chip under the test voltage is abnormal, the method further includes:

[0144] Recording that the integrated circuit chip is in a failed state under the test voltage.

[0145] In the above scheme, during the test process, if the working performance of the integrated circuit chip under the applied test voltage is found to be not in accordance with the expected standard or specification, it is considered that its working state is abnormal. This may be manifested as performance degradation, functional failure, overheating, abnormal current, etc.

[0146] Once it is determined that the IC chip is operating abnormally at the test voltage, the next step is to record the result. This means marking the IC chip as unqualified at that test voltage, indicating that it failed to meet the test standard. This is critical for quality control and ensuring the reliability of the final product.

[0147] In some embodiments, the integrated circuit chip detects and records the qualified digital voltage (ie, the target voltage) as follows: Figure 2 As shown, before the current driver integrated circuit chip (IC leaves the factory, a CP test is performed. This test will screen out ICs that meet a certain voltage range.

[0148] In order to enable each IC to record its own qualified digital voltage. Only a functional module needs to be added inside the IC to meet the input test signal, including various test voltages (i.e. multiple test voltages) and qualified voltage ranges (i.e. the operating voltage parameters corresponding to the integrated circuit chip). The functional module outputs the qualified digital voltage of each IC (i.e. the target voltage corresponding to the integrated circuit chip) (accuracy 10mV), records the voltage information (i.e. the target voltage), and records the qualified digital voltage of the IC through the enable signal. After the generation IC completes all CP test content packaging, it is sent to the panel factory for assembly.

[0149] When the IC arrives at the panel factory and is assembled into a module for lighting, a larger digital voltage (i.e., the preset initial voltage) is preset to ensure that the module can light up normally. Then, the optimal digital voltage (i.e., the target voltage) recorded by the driver IC is read back, and the voltage signal is sent to the PMIC through the single-wire transmission protocol (Swire) or the serial communication bus (Inter-Integrated Circuit, I2C) to update to the optimal digital voltage. After the relevant image quality is debugged, it is shipped. The integrated circuit chip is assembled on the module and the optimal digital voltage (i.e., the target voltage) is used. The process is as follows: Figure 3 As shown:

[0150] Step 301: IC design specifications;

[0151] Step 302: Fab factory production, CP test, the chip itself records the digital qualified voltage parameters (i.e., target voltage) of each chip; if it is unqualified (no good, NG), execute step 303; if it is qualified (OK), execute step 304;

[0152] Step 303: record as scrapped;

[0153] Step 304: Ship to the screen factory and assemble into modules;

[0154] Step 305: Module lights, read back the qualified digital voltage of IC, and IC sends a control signal to PMIC to generate DVDD;

[0155] Step 306: The module with the best power consumption is shipped.

[0156] In addition, when debugging the module, a digital voltage that satisfies all ICs (i.e., the preset initial voltage) will be set to ensure that all modules can be lit (i.e., the integrated circuit chip assembled into the display module is controlled to be in a normal state). All processes will complete this series of operations through an automated program, and the specific process is as follows. After gamma debugging (gamma), the digital voltage (i.e., the target voltage) will be burned into the digital integrated circuit (Digital Integrated Circuit, DIC), and each subsequent power-on will send a signal to the power management integrated circuit (Power Management Integrated Circuit, PMIC) according to the optimal voltage (i.e., the target voltage), and its driver IC automatically completes the digital voltage update process as follows Figure 4 As shown:

[0157] Step 401: IC reads back the voltage (i.e., reads back the target voltage corresponding to the stored integrated circuit chip);

[0158] Step 402: convert the value into a signal recognizable by the PMIC and send it to the PMIC;

[0159] Step 403: The PMIC recognizes the signal and automatically updates the digital voltage;

[0160] Step 404: Start gamma debugging.

[0161] Among them, the schematic diagram of module lighting is as follows Figure 5 As shown, the display panel is the part of the module used to display images or information. It may be a liquid crystal display (LCD), a light emitting diode display (LED) or other types of display screens.

[0162] The digital integrated circuit (DIC) is responsible for processing signals and data in the module and controlling the display content of the display panel. It may include components such as processors, memory, and controllers.

[0163] Flexible Printed Circuit (FPC) is a thin and flexible electronic circuit board used to connect various components within a module. It allows electrical connections between components while maintaining the compactness and flexibility of the module structure.

[0164] Display modules can use a single-wire transmission protocol or a serial communication bus to transmit data. This means that data transmission between digital integrated circuits and other components such as display panels and connectors is carried out through one or more serial channels rather than parallel channels. This helps reduce the number of connection lines and simplify the module structure.

[0165] The connector is the part of the display module that makes electrical connections to external devices or power sources. It may contain multiple pins or sockets for receiving and sending signals.

[0166] Debugging equipment is a tool used to test, verify and debug module functions. It may be connected to the connector to perform functional verification and troubleshooting during display module manufacturing.

[0167] When the display module receives power from an external device or power source, the power enters the flexible circuit board through the connector.

[0168] The flexible printed circuit transmits electrical energy to the digital integrated circuit, which processes the received signal and generates a signal for controlling the display of the display panel.

[0169] The display panel receives signals from the digital integrated circuit and displays images or information according to the signal content.

[0170] In this process, a single-wire transmission protocol or serial communication bus may be used to transmit data between the digital integrated circuit, display panel, and connector.

[0171] The debugging equipment can be used to monitor and adjust the lighting process during the module manufacturing process to ensure that the function and performance of the module meet the design requirements.

[0172] In summary, this application can improve the IC shipment yield, and the benefits are more obvious for low-cost solution modules. In addition, it can also meet the optimal digital voltage (i.e., target voltage) of each IC, ensure that it works in the most efficient state, and achieve low power consumption.

[0173] It should be noted that the method of the embodiment of the present application can be performed by a single device, such as a computer or server. The method of this embodiment can also be applied to a distributed scenario and completed by multiple devices cooperating with each other. In the case of such a distributed scenario, one of the multiple devices can only perform one or more steps in the method of the embodiment of the present application, and the multiple devices will interact with each other to complete the described method.

[0174] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0175] Based on the same inventive concept, corresponding to any of the above-mentioned embodiment methods, the present application also provides a voltage control device.

[0176] refer to Figure 6 , the voltage control device comprises:

[0177] A test signal determination module 601 is configured to determine a test signal of the integrated circuit chip, wherein the test signal includes a plurality of test voltages and an operating voltage parameter corresponding to the integrated circuit chip;

[0178] The working state determination module 602 is configured to determine the working state of the integrated circuit chip under the multiple test voltages based on the multiple test voltages and the working voltage parameters corresponding to the integrated circuit chip;

[0179] a target voltage storage module 603, configured to determine a target voltage corresponding to the integrated circuit chip from the multiple test voltages according to the working state of the integrated circuit chip under the multiple test voltages, and store the target voltage corresponding to the integrated circuit chip;

[0180] The voltage regulating module 604 is configured to regulate the voltage of the integrated circuit chip assembled into the display module according to the target voltage corresponding to the integrated circuit chip in response to the integrated circuit chip being assembled into the display module.

[0181] In some embodiments, the operating voltage parameters include an operating voltage error range and a target operating voltage;

[0182] The working status determination module 602 is specifically configured to:

[0183] For each test voltage, perform the following:

[0184] Determining a difference between the test voltage and the target operating voltage;

[0185] In response to the difference value being within the operating voltage error range, determining whether the operating states of the functional modules of the integrated circuit chip are all normal under the test voltage;

[0186] In response to yes, it is determined that the working state of the integrated circuit chip under the test voltage is a normal state; or,

[0187] In response to no, it is determined that the working state of the integrated circuit chip under the test voltage is an abnormal state.

[0188] In some embodiments, the operating voltage parameter includes an operating voltage range;

[0189] The working status determination module 602 is specifically configured to:

[0190] For each test voltage, perform the following:

[0191] In response to the test voltage being within the operating voltage range, determining whether the operating states of the functional modules of the integrated circuit chip under the test voltage are all in a normal state;

[0192] In response to yes, it is determined that the working state of the integrated circuit chip under the test voltage is a normal state; or,

[0193] In response to no, it is determined that the working state of the integrated circuit chip under the test voltage is an abnormal state.

[0194] In some embodiments, the target voltage storage module 603 is specifically configured as follows:

[0195] In response to the integrated circuit chip operating in a normal state under multiple test voltages, a minimum test voltage is selected from the multiple test voltages, and the minimum test voltage is used as a target voltage corresponding to the integrated circuit chip; or

[0196] In response to the existence of an abnormal state in the working state of the integrated circuit chip under multiple test voltages, the test voltage corresponding to the abnormal state is eliminated from the multiple test voltages, and the minimum test voltage is screened from the multiple test voltages after elimination, and the minimum test voltage is used as the target voltage corresponding to the integrated circuit chip.

[0197] In some embodiments, the display module is provided with a power management integrated circuit;

[0198] The voltage regulation module 604 is specifically configured as follows:

[0199] Using a preset initial voltage to power the integrated circuit chip assembled in the display module, so as to control the integrated circuit chip assembled in the display module to be in a normal state;

[0200] The stored target voltage corresponding to the integrated circuit chip is read back, and the power management integrated circuit is controlled to adjust the integrated circuit chip assembled into the display module from a preset initial voltage to the target voltage corresponding to the integrated circuit chip.

[0201] In some embodiments, the display module is provided with a digital integrated circuit and a power management integrated circuit;

[0202] The voltage control device further includes a power supply module. In response to the integrated circuit chip being assembled into the display module, after the voltage of the integrated circuit chip assembled into the display module is adjusted according to the target voltage corresponding to the integrated circuit chip, the power supply module is specifically configured as follows:

[0203] Performing gamma debugging on the display module, and storing the target voltage corresponding to the integrated circuit chip assembled into the display module in the digital integrated circuit during the gamma debugging process;

[0204] In response to the power management integrated circuit receiving the power supply request of the display module, the power management integrated circuit is controlled to supply power to the integrated circuit chip assembled in the display module according to the target voltage corresponding to the integrated circuit chip.

[0205] In some embodiments, the voltage control device further includes a recording module. After determining that the working state of the integrated circuit chip under the test voltage is an abnormal state, the recording module is specifically configured to:

[0206] Recording that the integrated circuit chip is in a failed state under the test voltage.

[0207] For the convenience of description, the above device is described in terms of functions divided into various modules. Of course, when implementing the present application, the functions of each module can be implemented in the same or multiple software and / or hardware.

[0208] The device of the above embodiment is used to implement the corresponding voltage control method in any of the above embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be described in detail here.

[0209] Based on the same inventive concept, corresponding to any of the above-mentioned embodiments and methods, the present application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the voltage control method described in any of the above embodiments is implemented.

[0210] Figure 7 A more specific schematic diagram of the hardware structure of an electronic device provided in this embodiment is shown, and the device may include: a processor 701, a memory 702, an input / output interface 703, a communication interface 704, and a bus 705. The processor 701, the memory 702, the input / output interface 703, and the communication interface 704 are connected to each other in communication within the device through the bus 705.

[0211] The processor 701 can be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0212] The memory 702 may be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 702 may store an operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program codes are stored in the memory 702 and are called and executed by the processor 701.

[0213] The input / output interface 703 is used to connect the input / output module to realize information input and output. The input / output module can be configured in the device as a component (not shown in the figure), or it can be externally connected to the device to provide corresponding functions. The input device may include a keyboard, a mouse, a touch screen, a microphone, various sensors, etc., and the output device may include a display, a speaker, a vibrator, an indicator light, etc.

[0214] The communication interface 704 is used to connect a communication module (not shown) to realize communication interaction between the device and other devices. The communication module can realize communication through a wired mode (such as USB, network cable, etc.) or a wireless mode (such as mobile network, WIFI, Bluetooth, etc.).

[0215] The bus 705 includes a path for transmitting information between various components of the device (eg, the processor 701 , the memory 702 , the input / output interface 703 , and the communication interface 704 ).

[0216] It should be noted that, although the above device only shows the processor 701, the memory 702, the input / output interface 703, the communication interface 704 and the bus 705, in the specific implementation process, the device may also include other components necessary for normal operation. In addition, it can be understood by those skilled in the art that the above device may also only include the components necessary for implementing the embodiments of the present specification, and does not necessarily include all the components shown in the figure.

[0217] The electronic device of the above embodiment is used to implement the corresponding voltage control method in any of the above embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be described in detail here.

[0218] Based on the same inventive concept, corresponding to any of the above-mentioned embodiment methods, the present application also provides a non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium stores computer instructions, and the computer instructions are used to enable the computer to execute the voltage control method described in any of the above embodiments.

[0219] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device.

[0220] The computer instructions stored in the storage medium of the above embodiments are used to enable the computer to execute the voltage control method described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0221] Based on the same inventive concept, corresponding to any of the above-mentioned embodiment methods, the present application also provides a computer program product, including computer program instructions. When the computer program instructions are run on a computer, the computer executes the method described in any of the above embodiments, which has the beneficial effects of the corresponding method embodiments and will not be repeated here.

[0222] A person skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0223] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present application difficult to understand, the known power supply / ground connection with the integrated circuit (IC) chip and other components may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform to be implemented in the embodiments of the present application (that is, these details should be fully within the scope of understanding of those skilled in the art). In the case of elaborating specific details (e.g., circuits) to describe exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0224] Although the present application has been described in conjunction with specific embodiments of the present application, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.

[0225] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the present application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the protection scope of the present application.

Claims

1. A voltage control method for an integrated circuit chip, characterized in that: include: Determining a test signal of an integrated circuit chip, wherein the test signal includes a plurality of test voltages and an operating voltage parameter corresponding to the integrated circuit chip; Determining the operating state of the integrated circuit chip under the multiple test voltages based on the multiple test voltages and the operating voltage parameters corresponding to the integrated circuit chip; Determining a target voltage corresponding to the integrated circuit chip from the multiple test voltages according to the working state of the integrated circuit chip under the multiple test voltages, and storing the target voltage corresponding to the integrated circuit chip; In response to the integrated circuit chip being assembled into the display module, the voltage of the integrated circuit chip assembled into the display module is adjusted according to the target voltage corresponding to the integrated circuit chip.

2. The method according to claim 1, characterized in that The operating voltage parameters include an operating voltage error range and a target operating voltage; The determining the working state of the integrated circuit chip under the multiple test voltages based on the multiple test voltages and the working voltage parameters corresponding to the integrated circuit chip includes: For each test voltage, perform the following: Determining a difference between the test voltage and the target operating voltage; In response to the difference value being within the operating voltage error range, determining whether the operating states of the functional modules of the integrated circuit chip are all normal under the test voltage; In response to yes, it is determined that the working state of the integrated circuit chip under the test voltage is a normal state; or, In response to no, it is determined that the working state of the integrated circuit chip under the test voltage is an abnormal state.

3. The method according to claim 1, characterized in that The operating voltage parameters include an operating voltage range; The method of determining the working state of the integrated circuit chip under the multiple test voltages based on the multiple test voltages and the working voltage parameters corresponding to the integrated circuit chip includes: For each test voltage, perform the following: In response to the test voltage being within the operating voltage range, determining whether the operating states of the functional modules of the integrated circuit chip under the test voltage are all normal; In response to yes, it is determined that the working state of the integrated circuit chip under the test voltage is a normal state; or, In response to no, it is determined that the working state of the integrated circuit chip under the test voltage is an abnormal state.

4. The method according to claim 1, characterized in that: The step of determining a target voltage corresponding to the integrated circuit chip from the multiple test voltages according to the working state of the integrated circuit chip under the multiple test voltages comprises: In response to the integrated circuit chip operating in a normal state under multiple test voltages, a minimum test voltage is selected from the multiple test voltages, and the minimum test voltage is used as a target voltage corresponding to the integrated circuit chip; or In response to the existence of an abnormal state in the working state of the integrated circuit chip under multiple test voltages, the test voltage corresponding to the abnormal state is eliminated from the multiple test voltages, and the minimum test voltage is screened from the multiple test voltages after elimination, and the minimum test voltage is used as the target voltage corresponding to the integrated circuit chip.

5. The method according to claim 1, characterized in that The display module is provided with a power management integrated circuit; The voltage regulation of the integrated circuit chip assembled into the display module according to the target voltage corresponding to the integrated circuit chip includes: Using a preset initial voltage to power the integrated circuit chip assembled in the display module, so as to control the integrated circuit chip assembled in the display module to be in a normal state; The stored target voltage corresponding to the integrated circuit chip is read back, and the power management integrated circuit is controlled to adjust the integrated circuit chip assembled into the display module from a preset initial voltage to the target voltage corresponding to the integrated circuit chip.

6. The method according to claim 1, characterized in that The display module is provided with a digital integrated circuit and a power management integrated circuit; In response to the integrated circuit chip being assembled into the display module, after voltage adjustment is performed on the integrated circuit chip assembled into the display module according to the target voltage corresponding to the integrated circuit chip, the method further includes: Performing gamma debugging on the display module, and storing the target voltage corresponding to the integrated circuit chip assembled into the display module in the digital integrated circuit during the gamma debugging process; In response to the power management integrated circuit receiving the power supply request of the display module, the power management integrated circuit is controlled to supply power to the integrated circuit chip assembled in the display module according to the target voltage corresponding to the integrated circuit chip.

7. The method according to claim 2 or 3, characterized in that: After determining that the working state of the integrated circuit chip under the test voltage is an abnormal state, the method further includes: Recording that the integrated circuit chip is in a failed state under the test voltage.

8. A voltage control device, characterized in that: include: A test signal determination module is configured to determine a test signal of the integrated circuit chip, wherein the test signal includes a plurality of test voltages and an operating voltage parameter corresponding to the integrated circuit chip; a working state determining module, configured to determine the working state of the integrated circuit chip under the multiple test voltages based on the multiple test voltages and the working voltage parameters corresponding to the integrated circuit chip; a target voltage storage module, configured to determine a target voltage corresponding to the integrated circuit chip from the multiple test voltages according to the working state of the integrated circuit chip under the multiple test voltages, and store the target voltage corresponding to the integrated circuit chip; The voltage regulating module is configured to regulate the voltage of the integrated circuit chip assembled into the display module according to the target voltage corresponding to the integrated circuit chip in response to the integrated circuit chip being assembled into the display module.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that: When the processor executes the program, the method according to any one of claims 1 to 7 is implemented.

10. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to enable a computer to execute the method according to any one of claims 1 to 7.

11. A computer program product, comprising computer program instructions, which, when executed on a computer, enable the computer to execute the method according to any one of claims 1 to 7.

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