Solid state drive device

Abstract

A solid state drive device includes: a housing including a top cover and a bottom cover defining an interior space of the housing; and a plurality of package substrate modules accommodated in the internal space of the housing. The package substrate modules include a top package substrate module having a top package base substrate and a bottom package substrate module having a bottom package base substrate. The top package substrate module and the bottom package substrate module are separated from each other in a vertical direction. The top package base substrate includes a plurality of top protrusions and a plurality of top notches, and the bottom package base substrate includes a plurality of bottom protrusions and a plurality of bottom notches.

Description

Background Art

[0001] The present disclosure relates to a solid-state drive device, and more particularly, to a solid-state drive device having a housing in which at least two package substrate modules are housed. Background Art

[0003] Solid-state drive devices have been envisioned as next-generation storage devices for replacing existing hard disk drives. Solid-state drive devices are storage devices based on nonvolatile memories, and have low power consumption and high storage density. In addition, with solid-state drive devices used as storage devices, a large amount of data can be input to and output from the solid-state drive devices at high speed, and therefore, demand for solid-state drive devices is increasing.

[0004] A system including a solid state drive device is required to have high performance and small size, and therefore, there is also a need to reduce the size of the solid state drive device. Summary of the invention

[0005] The present disclosure provides a solid state drive device having a reduced size.

[0006] An example embodiment of the inventive concept provides a solid-state drive device, which includes: a housing including a top cover and a bottom cover, the top cover and the bottom cover defining an internal space of the housing; and a plurality of package substrate modules accommodated in the internal space, the plurality of package substrate modules including a top package substrate module having a top package base substrate and a bottom package substrate module having a bottom package base substrate, the top package substrate module and the bottom package substrate module being separated from each other in a vertical direction. The top package base substrate includes a plurality of top protrusions and a plurality of top recesses. The bottom package base substrate includes a plurality of bottom protrusions and a plurality of bottom recesses. The top cover includes a plurality of protruding rod pressing portions corresponding to the plurality of bottom protrusions and a plurality of protruding rounded pressing portions corresponding to the plurality of bottom recesses. The bottom cover includes a plurality of protruding rod placement portions corresponding to the plurality of top protrusions and a plurality of protruding rounded placement portions corresponding to the plurality of top recesses.

[0007] An example embodiment of the inventive concept further provides a solid-state drive device, which includes: a housing including a top cover and a bottom cover, the top cover and the bottom cover defining an internal space of the housing; a top package substrate module accommodated in the internal space of the housing, and the top package substrate module includes a top package base substrate; a bottom package substrate module separated from the top package substrate module in a vertical direction, the bottom package substrate module accommodated in the internal space of the housing, and the bottom package substrate module includes a bottom package base substrate; and a connecting member electrically connecting the top package substrate module to the bottom package substrate module. The housing has a plurality of screw holes at the corners of the housing, the plurality of screw holes including a plurality of top screw holes in the top cover and a plurality of bottom screw holes in the bottom cover. The top cover includes a plurality of protruding rod pressing portions and a plurality of protruding rounded pressing portions at the corners of the top cover. The bottom cover includes a plurality of protruding rod placement portions and a plurality of protruding rounded placement portions at the corners of the bottom cover. The top package base substrate includes a plurality of top protrusions and a plurality of top recesses, the plurality of top protrusions contact the plurality of protruding rod seating portions of the bottom cover, and the plurality of protruding rounded pressing portions of the top cover contact the top package base substrate at the plurality of top recesses. The bottom package base substrate includes a plurality of bottom protrusions and a plurality of bottom recesses, the plurality of bottom protrusions contact the plurality of protruding rod pressing portions of the top cover, and the plurality of protruding rounded seating portions of the bottom cover contact the bottom package base substrate at the plurality of bottom recesses.

[0008] An example embodiment of the inventive concept further provides a solid-state drive device, which includes: a housing including a top cover and a bottom cover, the top cover and the bottom cover defining an internal space of the housing; a top package substrate module, which is accommodated in the internal space of the housing, and the top package substrate module includes a top package base substrate and an upper semiconductor chip mounted on the top package base substrate; a bottom package substrate module, which is separated from the top package substrate module in a vertical direction, the bottom package substrate module is accommodated in the internal space of the housing, and the bottom package substrate module includes a bottom package base substrate and a lower semiconductor chip mounted on the bottom package base substrate; and a connecting member, including a flexible printed circuit (FPC) connector that electrically connects the top package substrate module to the bottom package substrate module. The housing has a plurality of screw holes at the corners of the housing, the plurality of screw holes including a plurality of top screw holes in the top cover and a plurality of bottom screw holes in the bottom cover. The top cover includes two top lower side walls facing each other, two top higher side walls facing each other, a plurality of protruding rod pressing portions protruding from the two top higher side walls toward the internal space of the housing, and a plurality of protruding rounded pressing portions protruding from portions at the plurality of top screw holes toward the internal space of the housing. The bottom cover includes two bottom lower side walls facing each other, two bottom higher side walls facing each other, a plurality of protruding rod placement parts protruding from the two bottom higher side walls toward the inner space of the housing, and a plurality of protruding rounded placement parts protruding from the portions at the plurality of bottom screw holes toward the inner space of the housing. The top package base substrate includes a plurality of top protrusions and a plurality of top recesses, the plurality of top protrusions contact the top surfaces of the plurality of protruding rod placement parts of the bottom cover, and the bottom surfaces of the plurality of protruding rounded pressing parts of the top cover contact the top package base substrate at the plurality of top recesses. The bottom package base substrate includes a plurality of bottom protrusions and a plurality of bottom recesses, the plurality of bottom protrusions contact the bottom surfaces of the plurality of protruding rod pressing parts of the top cover, and the top surfaces of the plurality of protruding rounded placement parts of the bottom cover contact the bottom package base substrate at the plurality of bottom recesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Some example embodiments of the inventive concept will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0010] Figure 1A and Figure 1B are respectively a perspective view and a transmissive perspective view showing a solid state drive device according to some example embodiments of the inventive concept;

[0011] Figure 2A , Figure 2B , Figure 2C , Figure 2D and Figure 2E are a perspective view and a top view showing a package substrate module of a solid state drive device according to some example embodiments of the inventive concept;

[0012] Figure 3A , Figure 3B , Figure 3C and Figure 3D are a perspective view, an enlarged perspective view, and a top view showing a top cover of a housing of a solid state drive device according to some example embodiments of the inventive concept;

[0013] Figure 4A , Figure 4B , Figure 4C and Figure 4D are a perspective view, an enlarged perspective view, and a top view showing a bottom cover of a housing of a solid-state drive device according to some example embodiments of the inventive concept;

[0014] Figure 5A and Figure 5B is an exploded perspective view showing a solid state drive device according to some example embodiments of the inventive concept;

[0015] Fig. 6A and Figure 6B is a cross-sectional view for describing a method of installing a package substrate module included in a solid state drive device in a housing according to some example embodiments of the inventive concept;

[0016] Fig. 7A and Figure 7B is a top view showing a top package substrate module and a bottom cover included in a solid state drive device according to some example embodiments of the inventive concept;

[0017] Fig. 8A and Figure 8B is a top view showing a bottom package substrate module and a top cover included in a solid state drive device according to some example embodiments of the inventive concept;

[0018] Fig.9A and 9B is a top view showing a top package substrate module and a bottom cover included in a solid state drive device according to some example embodiments of the inventive concept;

[0019] Fig. 10A and Fig. 10B is a top view showing a bottom package substrate module and a top cover included in a solid state drive device according to some example embodiments of the inventive concept;

[0020] Fig.11 is an enlarged perspective view showing a top cover of a housing of a solid state drive device according to some example embodiments of the inventive concept;

[0021] Fig.12 is an enlarged perspective view showing a bottom cover of a housing of a solid state drive device according to some example embodiments of the inventive concept; and

[0022] Fig.13A , Fig. 13B and Fig. 13C is a perspective view illustrating a package substrate module and a bottom cover of a solid state drive device according to some example embodiments of the inventive concept. DETAILED DESCRIPTION

[0023] When the terms "at least one of A, B, and C" and similar language (e.g., "at least one selected from the group consisting of A, B, and C") are used in the specification or claims, these terms may be interpreted as A only, B only, C only, or any combination of two or more of A, B, and C, such as, for example, ABC, AB, BC, and AC.

[0024] Figure 1A and Figure 1B 1 and 2 are a perspective view and a transparent perspective view respectively showing a solid state drive device 1 according to some example embodiments.

[0025] Reference Figure 1A and Figure 1B The solid state drive device 1 may include a housing 100 and a plurality of package substrate modules 200 installed in the housing 100 .

[0026] The solid-state drive device 1 may have a first corner CN1, a second corner CN2, a third corner CN3, a fourth corner CN4, a first edge EG1, a second edge EG2, a third edge EG3, and a fourth edge EG4. In a top view of the solid-state drive device 1, the first corner CN1, the second corner CN2, the third corner CN3, and the fourth corner CN4 may be in a clockwise order, and the first edge EG1, the second edge EG2, the third edge EG3, and the fourth edge EG4 may be connected in a clockwise order. In particular, the first edge EG1 may be between the first corner CN1 and the second corner CN2 and connected to the second edge EG2 and the fourth edge EG4, the second edge EG2 may be between the second corner CN2 and the third corner CN3 and connected to the first edge EG1 and the third edge EG3, the third edge EG3 may be between the third corner CN3 and the fourth corner CN4 and connected to the second edge EG2 and the fourth edge EG4, and the fourth edge EG4 may be between the fourth corner CN4 and the first corner CN1 and connected to the first edge EG1 and the third edge EG3. In the first horizontal direction (X direction), the second edge EG2 may be on one side and the fourth edge EG4 may be on the other side. In addition, in the second horizontal direction (Y direction), the first edge EG1 may be on one side and the third edge EG3 may be on the other side. The first horizontal direction (X direction) may be perpendicular to the second horizontal direction (Y direction).

[0027] Throughout the following disclosure, even when description is made with reference to drawings that do not show the first corner CN1, the second corner CN2, the third corner CN3, the fourth corner CN4, the first edge EG1, the second edge EG2, the third edge EG3, and the fourth edge EG4, Figure 1A The first corner CN1, the second corner CN2, the third corner CN3, the fourth corner CN4, the first edge EG1, the second edge EG2, the third edge EG3, and the fourth edge EG4 are explained. In addition, even for the solid-state drive device 1, the housing 100 included in the solid-state drive device 1, and each of the plurality of package substrate modules 200 installed in the housing 100, the first corner CN1, the second corner CN2, the third corner CN3, the fourth corner CN4, the first edge EG1, the second edge EG2, the third edge EG3, and the fourth edge EG4 may be used. For example, the first corner CN1 and the first edge EG1 of the housing 100 are the first corner CN1 and the first edge EG1 of the solid-state drive device 1, respectively, and the first corner CN1 and the first edge EG1 of each of the plurality of package substrate modules 200 are the corners and edges facing the first corner CN1 and the first edge EG1 of the housing 100, respectively.

[0028] By considering the heat transfer characteristics of the housing (100), the housing 100 can be made of a single material or a combination of different materials. The housing 100 may include a metal, a carbon-based material, a polymer material or a combination thereof, but is not limited thereto. The housing 100 may include, for example, copper (Cu), aluminum (Al), zinc (Zn), tin (Sn), stainless steel or a clad metal including them. Alternatively, the housing 100 may include, for example, graphite, graphene, carbon fiber, carbon nanotube (CNT) composite material or the like. Alternatively, the housing 100 may include, for example, a polymer material such as epoxy resin, polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene (PE) or polypropylene (PP).

[0029] The housing 100 may include a top cover 100T and a bottom cover 100B coupled to the top cover 100T. The housing 100 may have an inner space surrounded and / or defined by the top cover 100T and the bottom cover 100B and accommodating a plurality of package substrate modules 200 therein. The top surface 102T of the top cover 100T may face the outside of the housing 100, and the bottom surface 104T (see Figure 3B ) may face the inner space of the housing 100. The top surface 102B (see Figure 4A ) can face the inner space of the housing 100, and the bottom surface 104B of the bottom cover 100B (see Figure 4C) may face the outside of the housing 100. The top surface 102T and the bottom surface 104T of the top cover 100T may be referred to as the first top surface 102T and the first bottom surface 104T, respectively, and the top surface 102B and the bottom surface 104B of the bottom cover 100B may be referred to as the second top surface 102B and the second bottom surface 104B, respectively. A plurality of screw holes 190 for coupling the top cover 100T to the bottom cover 100B may be formed at the corners of the housing 100. The plurality of screw holes 190 may include a first screw hole 192, a second screw hole 194, a third screw hole 196, and a fourth screw hole 198. The first screw hole 192, the second screw hole 194, the third screw hole 196, and the fourth screw hole 198 may be located at the first corner CN1, the second corner CN2, the third corner CN3, and the fourth corner CN4 of the housing 100, respectively. In the top cover 100T and the bottom cover 100B coupled to each other, each of the first screw hole 192, the second screw hole 194, the third screw hole 196, and the fourth screw hole 198 may extend from the top cover 100T to the bottom cover 100B. The plurality of screw holes 190 may be formed not only at the corners of the housing 100 but also at the edges of the housing 100. For example, the plurality of screw holes 190 may be formed not only at the first corner CN1, the second corner CN2, the third corner CN3, and the fourth corner CN4 of the housing 100 but also at least one of the first edge EG1, the second edge EG2, the third edge EG3, and the fourth edge EG4 of the housing 100. Referring to FIG. 3A to FIG. 3D The housing 100 including the top cover 100T and the bottom cover 100B is described in detail.

[0030] In some example embodiments, the housing 100 may include an external fastening screw hole 150. For example, the external fastening screw hole 150 may be used to couple the housing 100 to an external device.

[0031] The plurality of package substrate modules 200 may include an external connector 290. The external connector 290 may connect the solid state drive device 1 to an external host to exchange signals between the solid state drive device 1 and the external host and / or receive power from the external host. The external connector 290 may be connected to an external device in a manner according to, for example, a parallel advanced technology attachment (PATA) standard, a serial advanced technology attachment (SATA) standard, a small computer system interface (SCSI) standard, or a parallel component interconnect high speed (PCIe) standard. Here, the SATA standard relates to all SATA-based standards, including not only SATA-1 but also SATA-2, SATA-3, external SATA (e-SATA), and the like. The PCIe standard relates to all PCIe-based standards, including not only PCIe1.0, but also PCIe 2.0, PCIe 2.1, PCIe3.0, PCIe 4.0, and the like. The SCSI standard relates to all SCSI-based standards, including parallel SCSI, serial attached SCSI (SA-SCSI), Internet SCSI (iSCSI), and the like. In some example embodiments, the external connector 290 may be configured to support an M2 interface, a mini SATA (mSATA) interface, or a 2.5" interface.

[0032] A plurality of package substrate modules 200 may be accommodated in the internal space of the housing 100. The plurality of package substrate modules 200 may include a top package substrate module 200T and a bottom package substrate module 200B. An external connector 290 may be provided to the bottom package substrate module 200B, but is not limited thereto. For example, the external connector 290 may be provided to the top package substrate module 200T or the bottom package substrate module 200B. In some example embodiments, the external connector 290 may be provided to the fourth edge EG4 of the solid state drive device 1 and protrude to the outside of the housing 100. Referring to FIG. 2A to FIG. 2E A plurality of package substrate modules 200 including a top package substrate module 200T and a bottom package substrate module 200B are described in detail.

[0033] FIG. 2A to FIG. 2E 2 is a perspective view and a top view showing a plurality of package substrate modules 200 of a solid state drive device according to some example embodiments. Specifically, Figure 2A 2 is a perspective view showing a plurality of package substrate modules 200 including a top package substrate module 200T and a bottom package substrate module 200B. Figure 2B 2 is a perspective view showing a top package substrate module 200T. Figure 2C 2 is a top view of a top package base substrate 210T of a top package substrate module 200T. Figure 2D is a perspective view showing a bottom package substrate module 200B, Figure 2E2 is a top view of the bottom package base substrate 210B of the bottom package substrate module 200B.

[0034] Reference FIG. 2A to FIG. 2E , the plurality of package substrate modules 200 may include a top package substrate module 200T and a bottom package substrate module 200B. The top package substrate module 200T and the bottom package substrate module 200B may be separated from each other in the vertical direction (Z direction) in the internal space of the housing 100. In some example embodiments, the top package substrate module 200T may include a top package base substrate 210T and a plurality of first semiconductor chips 220 mounted on the top package base substrate 210T, and the bottom package substrate module 200B may include a bottom package base substrate 210B and a plurality of first semiconductor chips 220, at least one second semiconductor chip 230, and a plurality of third semiconductor chips 240 mounted on the bottom package base substrate 210B, but the top package substrate module 200T and the bottom package substrate module 200B are not limited thereto. For example, some and others of the plurality of first semiconductor chips 220, the at least one second semiconductor chip 230, and the plurality of third semiconductor chips 240 may be mounted on the top package base substrate 210T and the bottom package base substrate 210B, respectively. The plurality of first semiconductor chips 220, the at least one second semiconductor chip 230, and the plurality of third semiconductor chips 240 may be referred to as a plurality of semiconductor chips. The semiconductor chip mounted on the top package base substrate 210T among the plurality of first semiconductor chips 220, the at least one second semiconductor chip 230, and the plurality of third semiconductor chips 240 may be referred to as an upper semiconductor chip. The semiconductor chip mounted on the bottom package base substrate 210B among the plurality of first semiconductor chips 220, the at least one second semiconductor chip 230, and the plurality of third semiconductor chips 240 may be referred to as a lower semiconductor chip.

[0035] Each of the top package substrate module 200T and the bottom package substrate module 200B may be a dual in-line memory module (DIMM) having some and others of the plurality of first semiconductor chips 220, the at least one second semiconductor chip 230, and the plurality of third semiconductor chips 240 mounted on the top surface and the bottom surface of each of the top package base substrate 210T and the bottom package base substrate 210B, respectively, but is not limited thereto. For example, each of the top package substrate module 200T and the bottom package substrate module 200B may be a single in-line memory module (SIMM) having some and others of the plurality of first semiconductor chips 220, the at least one second semiconductor chip 230, and the plurality of third semiconductor chips 240 mounted on the top surface of each of the top package base substrate 210T and the bottom package base substrate 210B. Alternatively, for example, one of the top package substrate module 200T and the bottom package substrate module 200B may be a DIMM, and the other thereof may be a SIMM.

[0036] The scheme in which each of the multiple first semiconductor chips 220, the at least one second semiconductor chip 230 and the multiple third semiconductor chips 240 is mounted on any one of the top package base substrate 210T and the bottom package base substrate 210B can be a ball grid array (BGA) scheme, a pin grid array (PGA) scheme, a tape carrier package (TCP) scheme, a chip on board (COB) scheme, a quad flat no-lead (QFN) scheme, a quad flat package (QFP) scheme or the like, but is not limited thereto.

[0037] Each of the plurality of first semiconductor chips 220, the at least one second semiconductor chip 230 and the plurality of third semiconductor chips 240 may include a semiconductor substrate. The semiconductor substrate may include silicon (Si). Alternatively, the semiconductor substrate may include a semiconductor element, such as germanium (Ge), or a compound semiconductor, such as silicon carbide (SiC), gallium arsenide (GaAs), indium arsenide (InAs) or indium phosphide (InP). The semiconductor substrate may have an active surface and an inactive surface opposite to the active surface. Each of the plurality of first semiconductor chips 220, the at least one second semiconductor chip 230 and the plurality of third semiconductor chips 240 may have a semiconductor device including various individual devices formed on the active surface.

[0038] The at least one second semiconductor chip 230 may control the plurality of first semiconductor chips 220 and the plurality of third semiconductor chips 240. The controller may be embedded in the at least one second semiconductor chip 230. The controller may control access to data stored in the plurality of first semiconductor chips 220 and the plurality of third semiconductor chips 240. The controller may control write / read operations to the plurality of first semiconductor chips 220 (e.g., flash memory) in response to a control command of an external host. The controller may include a separate control semiconductor chip, such as an application specific integrated circuit (ASIC). The controller may be designed to be automatically executed by an operating system of an external host, for example, when the solid state drive device 1 is connected to an external host. The controller may provide a standard protocol, such as a PATA protocol, a SATA protocol, a SCSI protocol, or a PCIe protocol. In addition, the controller may perform wear leveling, garbage collection, bad block management, and error correction code (ECC) on the plurality of first semiconductor chips 220. In some example embodiments, the controller may include a script for automatic execution and an application executable by an external host.

[0039] Each of the plurality of first semiconductor chips 220 may be a non-volatile memory device. The non-volatile memory device may include, for example, a flash memory, a phase change random access memory (PRAM), a resistive random access memory (RRAM), a ferroelectric random access memory (FeRAM), a magnetic random access memory (MRAM), or the like, but is not limited thereto. The flash memory may be, for example, a NAND flash memory. The flash memory may be, for example, a vertical NAND (V-NAND) flash memory. The non-volatile memory device may include a single semiconductor die or a plurality of stacked semiconductor dies.

[0040] Each of the plurality of third semiconductor chips 240 may be a volatile memory device. The volatile memory device may include, for example, a dynamic random access memory (DRAM), a static random access memory (SRAM), a synchronous dynamic random access memory (SDRAM), a double data rate random access memory (DDR RAM), Dynamic random access memory (RDRAM) or the like, but not limited thereto. The volatile memory device can provide a cache function of storing data frequently used when an external host accesses the solid state drive device 1, thereby adjusting access time and data transmission performance to meet the processing performance of the external host connected to the solid state drive device 1.

[0041] In some example embodiments, the plurality of package substrate modules 200 may further include at least one passive device 250. For example, the at least one passive device 250 may include a capacitor. In some example embodiments, the at least one passive device 250 may be attached to the top package substrate substrate 210T, but is not limited thereto. For example, the at least one passive device 250 may be attached to the bottom package substrate substrate 210B or to each of the top package substrate substrate 210T and the bottom package substrate substrate 210B.

[0042] In some example embodiments, each of the top package base substrate 210T and the bottom package base substrate 210B may be a printed circuit board (PCB). For example, each of the top package base substrate 210T and the bottom package base substrate 210B may be a double-sided PCB or a multi-layer PCB. Each of the top package base substrate 210T and the bottom package base substrate 210B may include a substrate base. The substrate base may be made of at least one material selected from phenolic resin, epoxy resin, and polyimide. The substrate base may include at least one selected from, for example, flame retardant 4 (FR4), tetrafunctional epoxy resin, polyphenylene ether, epoxy resin / polyphenylene ether, bismaleimide triazine (BT), (non-woven aramid fiber reinforced substrates for printed wiring boards), cyanate esters, polyimides, and liquid crystal polymers.

[0043] Each of the top package base substrate 210T and the bottom package base substrate 210B may have a wiring pattern formed on the top surface and the bottom surface of the base substrate. In some example embodiments, when the base substrate includes a plurality of layers, the wiring pattern may also be formed between each two of the plurality of layers included in the base substrate. Each of the top package base substrate 210T and the bottom package base substrate 210B may have a conductive path formed to connect the wiring patterns to each other in the base substrate. The conductive path may electrically connect the wiring patterns to each other by penetrating all or a portion of the base substrate. The wiring pattern and / or the conductive path may include Cu, nickel, stainless steel, or beryllium Cu.

[0044] A solder resist layer covering at least a portion of each wiring pattern on the top and bottom surfaces of the substrate substrate may be formed on the top and bottom surfaces of each of the top package substrate substrate 210T and the bottom package substrate substrate 210B. The portion of each wiring pattern on the top and bottom surfaces of the substrate substrate that is not covered by the solder resist layer may be used as a pad electrically connected to the active device or passive device on the top and / or bottom surface of each of the plurality of first semiconductor chips 220, the at least one second semiconductor chip 230, the plurality of third semiconductor chips 240, the top package substrate substrate 210T, and the bottom package substrate substrate 210B.

[0045] The plurality of package substrate modules 200 may include an external connector 290. In some example embodiments, the bottom package substrate module 200B may include the external connector 290, but is not limited thereto. For example, the top package substrate module 200T may include the external connector 290 instead of the bottom package substrate module 200B.

[0046] The at least one passive device 250 and the external connector 290 may be located at one side and the other side of the plurality of package substrate modules 200, respectively. In some example embodiments, the at least one passive device 250 may be at the second edge EG2 of the top package substrate module 200T, and the external connector 290 may be at the fourth edge EG4 of the bottom package substrate module 200B, but the at least one passive device 250 and the external connector 290 are not limited thereto. For example, the at least one passive device 250 may be at the second edge EG2 of the top package substrate module 200T and the external connector 290 may be at the fourth edge EG4 of the top package substrate module 200T, the at least one passive device 250 may be at the second edge EG2 of the bottom package substrate module 200B and the external connector 290 may be at the fourth edge EG4 of the bottom package substrate module 200B, or the at least one passive device 250 may be at the second edge EG2 of the bottom package substrate module 200B and the external connector 290 may be at the fourth edge EG4 of the top package substrate module 200T.

[0047] The top package substrate module 200T may be electrically connected to the bottom package substrate module 200B through a connecting member 295. One end and the other end of the connecting member 295 may be connected to the top package base substrate 210T and the bottom package base substrate 210B, respectively. For example, when the bottom package substrate module 200B includes an external connector 290, some of the plurality of first semiconductor chips 220, the at least one second semiconductor chip 230, and the plurality of third semiconductor chips 240 mounted on the top package base substrate 210T may be electrically connected to the external connector 290 through the connecting member 295 and the bottom package base substrate 210B. In some example embodiments, the plurality of package substrate modules 200 may include a rigid-flexible PCB (RF-PCB), and the connecting member 295 may include a flexible printed circuit (FPC) connector, but the plurality of package substrate modules 200 and the connecting member 295 are not limited thereto. For example, the connecting member 295 may include a board-to-board (B-to-B) connector or a flat flexible cable (FFC) connector between the top package substrate module 200T and the bottom package substrate module 200B.

[0048] The top package base substrate 210T may include a plurality of top protrusions 270T and a plurality of top recesses 280T, and the bottom package base substrate 210B may include a plurality of bottom protrusions 270B and a plurality of bottom recesses 280B. In some example embodiments, each of the number of top protrusions 270T and bottom protrusions 270B may be 4, but is not limited thereto. For example, each of the number of top protrusions 270T and bottom protrusions 270B may be 2 or greater. In some example embodiments, each of the number of top recesses 280T and bottom recesses 280B may be 4, but is not limited thereto. For example, each of the number of top recesses 280T and bottom recesses 280B may be 4 or greater.

[0049] The plurality of top protrusions 270T may include a first top protrusion 272T, a second top protrusion 274T, a third top protrusion 276T, and a fourth top protrusion 278T. The first top protrusion 272T and the second top protrusion 274T may be separated from each other at the first edge EG1 of the top package base substrate 210T, and the third top protrusion 276T and the fourth top protrusion 278T may be separated from each other at the third edge EG3 of the top package base substrate 210T. The plurality of top recesses 280T may include a first top recess 282T, a second top recess 284T, a third top recess 286T, and a fourth top recess 288T at the first corner CN1, the second corner CN2, the third corner CN3, and the fourth corner CN4 of the top package base substrate 210T, respectively. The plurality of bottom protrusions 270B may include a first bottom protrusion 272B, a second bottom protrusion 274B, a third bottom protrusion 276B, and a fourth bottom protrusion 278B. The first bottom protrusion 272B and the fourth bottom protrusion 278B may be separated from each other at the fourth edge EG4 of the bottom package base substrate 210B, and the second bottom protrusion 274B and the third bottom protrusion 276B may be separated from each other at the second edge EG2 of the bottom package base substrate 210B. The first bottom protrusion 272B, the second bottom protrusion 274B, the third bottom protrusion 276B and the fourth bottom protrusion 278B may be adjacent to the first corner CN1, the second corner CN2, the third corner CN3 and the fourth corner CN4 of the bottom package base substrate 210B, respectively. The plurality of bottom recesses 280B may include the first bottom recess 282B, the second bottom recess 284B, the third bottom recess 286B and the fourth bottom recess 288B at the first corner CN1, the second corner CN2, the third corner CN3 and the fourth corner CN4 of the bottom package base substrate 210B, respectively.

[0050] In some example embodiments, the first top protrusion 272T, the second top protrusion 274T, the third top protrusion 276T, and the fourth top protrusion 278T may not overlap with the first bottom protrusion 272B, the second bottom protrusion 274B, the third bottom protrusion 276B, and the fourth bottom protrusion 278B, respectively, in the vertical direction (Z direction). That is, in a top view, the first top protrusion 272T, the second top protrusion 274T, the third top protrusion 276T, and the fourth top protrusion 278T may be separated from the first bottom protrusion 272B, the second bottom protrusion 274B, the third bottom protrusion 276B, and the fourth bottom protrusion 278B, respectively. The first top recess 282T, the second top recess 284T, the third top recess 286T, and the fourth top recess 288T may overlap the first bottom recess 282B, the second bottom recess 284B, the third bottom recess 286B, and the fourth bottom recess 288B in the vertical direction (Z direction), respectively.

[0051] FIG. 3A to FIG. 3D 1 is a perspective view, an enlarged perspective view, and a top view showing a top cover 100T of a housing 100 of a solid state drive device according to some example embodiments, FIG. 4A to FIG. 4D 1 is a perspective view, an enlarged perspective view, and a top view showing a bottom cover 100B of a housing 100 of a solid state drive device according to some example embodiments. In particular, Figure 3A and Figure 3B These are three-dimensional views of the top cover 100T from the top and bottom, respectively. Figure 3C It is shown Figure 3B An enlarged perspective view of a portion of the top cover 100T, Figure 3D is a top view of the top cover 100T from the bottom. Figure 4A and Figure 4C are three-dimensional views of the bottom cover 100B from the top and bottom, respectively. Figure 4B It is shown Figure 4A An enlarged perspective view of a portion of the bottom cover 100B in FIG. Figure 4D 100B is a top view of the bottom cover 100B.

[0052] Reference FIG. 3A to FIG. 4D, the housing 100 may include a top cover 100T and a bottom cover 100B. The top cover 100T may have a first top surface 102T and a first bottom surface 104T opposite to each other, and the bottom cover 100B may have a second top surface 102B and a second bottom surface 104B opposite to each other. In the top cover 100T and the bottom cover 100B connected to each other, the first top surface 102T of the top cover 100T and the second top surface 102B of the bottom cover 100B may be oriented in the same direction (e.g., a vertical direction (Z direction)), and the first bottom surface 104T of the top cover 100T and the second bottom surface 104B of the bottom cover 100B may be oriented in the same direction (e.g., an opposite direction of the vertical direction (Z direction)). The first top surface 102T and the second bottom surface 104B may face the outside of the housing 100, and the first bottom surface 104T and the second top surface 102B may face the internal space of the housing 100.

[0053] The top cover 100T may include a first top lower sidewall 112 and a second top lower sidewall 114 facing each other and a first top upper sidewall 122 and a second top upper sidewall 124 facing each other. The bottom cover 100B may include a first bottom upper sidewall 126 and a second bottom upper sidewall 128 facing each other and a first bottom lower sidewall 116 and a second bottom lower sidewall 118 facing each other. From the bottom surface 104T of the top cover 100T, in the opposite direction of the vertical direction (Z direction), the height of each of the first top lower sidewall 112 and the second top lower sidewall 114 may be smaller than the height of each of the first top upper sidewall 122 and the second top upper sidewall 124. From the top surface 102B of the bottom cover 100B, in the vertical direction (Z direction), the height of each of the first bottom lower sidewall 116 and the second bottom lower sidewall 118 may be smaller than the height of each of the first bottom upper sidewall 126 and the second bottom upper sidewall 128.

[0054] In the top cover 100T and the bottom cover 100B coupled to each other, the first top lower sidewall 112, the second top lower sidewall 114, the first top upper sidewall 122, and the second top upper sidewall 124 of the top cover 100T may respectively correspond to the first bottom upper sidewall 126, the second bottom upper sidewall 128, the first bottom lower sidewall 116, and the second bottom lower sidewall 118 of the bottom cover 100B. For example, one side of each of the first top lower sidewall 112, the second top lower sidewall 114, the first top upper sidewall 122, and the second top upper sidewall 124 of the top cover 100T connected to the first bottom surface 104T and the other side opposite to the one side may contact one side of each of the first bottom upper sidewall 126, the second bottom upper sidewall 128, the first bottom lower sidewall 116, and the second bottom lower sidewall 118 of the bottom cover 100B connected to the second top surface 102B and the other side opposite to the one side.

[0055] The first top lower sidewall 112 and the first bottom upper sidewall 126 may be at the first edge EG1 of the housing 100, the second top upper sidewall 124 and the second bottom lower sidewall 118 may be at the second edge EG2 of the housing 100, the second top lower sidewall 114 and the second bottom upper sidewall 128 may be at the third edge EG3 of the housing 100, and the first top upper sidewall 122 and the first bottom lower sidewall 116 may be at the fourth edge EG4 of the housing 100. In the top view of the housing 100, the first top lower sidewall 112, the second top upper sidewall 124, the second top lower sidewall 114, and the first top upper sidewall 122 of the top cover 100T may be in a clockwise order, and the first bottom upper sidewall 126, the second bottom lower sidewall 118, the second bottom upper sidewall 128, and the first bottom lower sidewall 116 of the bottom cover 100B may be in a clockwise order. In some example embodiments, the first bottom lower sidewall 116 may have a shape corresponding to the external connector 290 (see Figure 1A and Figure 1B ) of the connector groove 116G. From the top surface 102B of the bottom cover 100B, in the vertical direction (Z direction), the height of the connector groove 116G may be smaller than the height of another portion of the first bottom lower sidewall 116.

[0056] The housing 100 may have a plurality of screw holes 190. The plurality of screw holes 190 may include a first screw hole 192, a second screw hole 194, a third screw hole 196, and a fourth screw hole 198. The top cover 100T may have a plurality of top screw holes 190T, and the bottom cover 100B may have a plurality of bottom screw holes 190B. The plurality of top screw holes 190T and the plurality of bottom screw holes 190B corresponding to each other may constitute the plurality of screw holes 190.

[0057] The plurality of top screw holes 190T may include a first top screw hole 192T, a second top screw hole 194T, a third top screw hole 196T, and a fourth top screw hole 198T. The plurality of bottom screw holes 190B may include a first bottom screw hole 192B, a second bottom screw hole 194B, a third bottom screw hole 196B, and a fourth bottom screw hole 198B. ​​The first top screw hole 192T, the second top screw hole 194T, the third top screw hole 196T, and the fourth top screw hole 198T may be located at the first corner CN1, the second corner CN2, the third corner CN3, and the fourth corner CN4 of the top cover 100T, respectively, and the first bottom screw hole 192B, the second bottom screw hole 194B, the third bottom screw hole 196B, and the fourth bottom screw hole 198B may be located at the first corner CN1, the second corner CN2, the third corner CN3, and the fourth corner CN4 of the bottom cover 100B, respectively. In the top cover 100T and the bottom cover 100B connected to each other, the first top screw hole 192T, the second top screw hole 194T, the third top screw hole 196T and the fourth top screw hole 198T can be connected with the first bottom screw hole 192B, the second bottom screw hole 194B, the third bottom screw hole 196B and the fourth bottom screw hole 198B to form the first screw hole 192, the second screw hole 194, the third screw hole 196 and the fourth screw hole 198 respectively.

[0058] The housing 100 may include a plurality of protruding rod portions 170 and a plurality of protruding rounded portions 180. The plurality of protruding rod portions 170 may include a plurality of protruding rod pressing portions 170T included in the top cover 100T and a plurality of protruding rod seating portions 170B included in the bottom cover 100B. The plurality of protruding rounded portions 180 may include a plurality of protruding rounded pressing portions 180T included in the top cover 100T and a plurality of protruding rounded seating portions 180B included in the bottom cover 100B. In a top view, each of the plurality of protruding rounded portions 180 may have an arc shape extending along the periphery of each of the plurality of screw holes 190.

[0059] The number of the protruding lever pressing portions 170T may be Figure 2D and Figure 2E The number of the protruding rod placement portions 170B may be the same as that of the bottom protrusions 270B shown in FIG. Figure 2B and Figure 2C The number of the top protrusions 270T shown in FIG. 1 is the same as that of the top protrusions 270T shown in FIG. Figure 2B and Figure 2C The number of the top notches 280T shown in FIG. 1 is the same as that of the top notches 280T shown in FIG. Figure 2D and Figure 2EThe number of bottom recesses 280B shown in is the same. In some example embodiments, each of the number of protruding rod pressing portions 170T and protruding rod seating portions 170B may be 4, but is not limited thereto. For example, each of the number of protruding rod pressing portions 170T and protruding rod seating portions 170B may be 2 or greater. In some example embodiments, each of the number of protruding rounded pressing portions 180T and protruding rounded seating portions 180B may be 4, but is not limited thereto. For example, each of the number of protruding rounded pressing portions 180T and protruding rounded seating portions 180B may be 4 or greater.

[0060] The plurality of protruding rod pressing portions 170T may include a first protruding rod pressing portion 172T, a second protruding rod pressing portion 174T, a third protruding rod pressing portion 176T, and a fourth protruding rod pressing portion 178T. The plurality of protruding rounded pressing portions 180T may include a first protruding rounded pressing portion 182T, a second protruding rounded pressing portion 184T, a third protruding rounded pressing portion 186T, and a fourth protruding rounded pressing portion 188T. The plurality of protruding rod seating portions 170B may include a first protruding rod seating portion 172B, a second protruding rod seating portion 174B, a third protruding rod seating portion 176B, and a fourth protruding rod seating portion 178B. The plurality of protruding rounded seating portions 180B may include a first protruding rounded seating portion 182B, a second protruding rounded seating portion 184B, a third protruding rounded seating portion 186B, and a fourth protruding rounded seating portion 188B.

[0061] The first protruding rod pressing portion 172T, the second protruding rod pressing portion 174T, the third protruding rod pressing portion 176T, and the fourth protruding rod pressing portion 178T may be located at portions adjacent to the first corner CN1, the second corner CN2, the third corner CN3, and the fourth corner CN4 of the top cover 100T, respectively. For example, the first protruding rod pressing portion 172T may protrude from the first top higher side wall 122 of the top cover 100T adjacent to the first corner CN1 toward the internal space of the shell 100, the second protruding rod pressing portion 174T may protrude from the second top higher side wall 124 of the top cover 100T adjacent to the second corner CN2 toward the internal space of the shell 100, the third protruding rod pressing portion 176T may protrude from the second top higher side wall 124 of the top cover 100T adjacent to the third corner CN3 toward the internal space of the shell 100, and the fourth protruding rod pressing portion 178T may protrude from the first top higher side wall 122 of the top cover 100T adjacent to the fourth corner CN4 toward the internal space of the shell 100.

[0062] The first protruding rounded pressing portion 182T, the second protruding rounded pressing portion 184T, the third protruding rounded pressing portion 186T and the fourth protruding rounded pressing portion 188T can respectively protrude toward the internal space of the shell 100 from the portion of the top cover 100T where the first top screw hole 192T, the second top screw hole 194T, the third top screw hole 196T and the fourth top screw hole 198T are located.

[0063] The first protruding rod seating portion 172B, the second protruding rod seating portion 174B, the third protruding rod seating portion 176B, and the fourth protruding rod seating portion 178B may be at portions of the bottom cover 100B adjacent to the first corner CN1, the second corner CN2, the third corner CN3, and the fourth corner CN4, respectively. For example, the first protruding rod placement portion 172B may protrude from the first bottom higher side wall 126 of the bottom cover 100B adjacent to the first corner CN1 toward the interior space of the shell 100, the second protruding rod placement portion 174B may protrude from the first bottom higher side wall 126 of the bottom cover 100B adjacent to the second corner CN2 toward the interior space of the shell 100, the third protruding rod placement portion 176B may protrude from the second bottom higher side wall 128 of the bottom cover 100B adjacent to the third corner CN3 toward the interior space of the shell 100, and the fourth protruding rod placement portion 178B may protrude from the second bottom higher side wall 128 of the bottom cover 100B adjacent to the fourth corner CN4 toward the interior space of the shell 100.

[0064] The first protruding rounded placement portion 182B, the second protruding rounded placement portion 184B, the third protruding rounded placement portion 186B and the fourth protruding rounded placement portion 188B can respectively protrude from the portion of the bottom cover 100B where the first bottom screw hole 192B, the second bottom screw hole 194B, the third bottom screw hole 196B and the fourth bottom screw hole 198B are located toward the internal space of the shell 100.

[0065] The heights of the plurality of protruding rod pressing portions 170T including the first protruding rod pressing portion 172T, the second protruding rod pressing portion 174T, the third protruding rod pressing portion 176T, and the fourth protruding rod pressing portion 178T may be the same as each other. In some example embodiments, from the bottom surface 104T of the top cover 100T, in the opposite direction of the vertical direction (Z direction), the height of each of the plurality of protruding rod pressing portions 170T including the first protruding rod pressing portion 172T, the second protruding rod pressing portion 174T, the third protruding rod pressing portion 176T, and the fourth protruding rod pressing portion 178T may be the same as the height of each of the first top higher side wall 122 and the second top higher side wall 124.

[0066] The heights of the plurality of protruding rounded pressing portions 180T including the first protruding rounded pressing portion 182T, the second protruding rounded pressing portion 184T, the third protruding rounded pressing portion 186T, and the fourth protruding rounded pressing portion 188T may be the same as each other. In some example embodiments, from the bottom surface 104T of the top cover 100T, in the opposite direction of the vertical direction (Z direction), the height of each of the plurality of protruding rounded pressing portions 180T including the first protruding rounded pressing portion 182T, the second protruding rounded pressing portion 184T, the third protruding rounded pressing portion 186T, and the fourth protruding rounded pressing portion 188T may be less than the height of each of the first top lower sidewall 112 and the second top lower sidewall 114.

[0067] The heights of the plurality of protruding rod seating portions 170B including the first protruding rod seating portion 172B, the second protruding rod seating portion 174B, the third protruding rod seating portion 176B, and the fourth protruding rod seating portion 178B may be the same as each other. In some example embodiments, from the top surface 102B of the bottom cover 100B, in the vertical direction (Z direction), the height of each of the plurality of protruding rod seating portions 170B including the first protruding rod seating portion 172B, the second protruding rod seating portion 174B, the third protruding rod seating portion 176B, and the fourth protruding rod seating portion 178B may be less than the height of each of the first bottom upper sidewall 126 and the second bottom upper sidewall 128.

[0068] The heights of the plurality of protruding rounded seating portions 180B including the first protruding rounded seating portion 182B, the second protruding rounded seating portion 184B, the third protruding rounded seating portion 186B, and the fourth protruding rounded seating portion 188B may be the same as each other. In some example embodiments, in the vertical direction (Z direction) from the top surface 102B of the bottom cover 100B, the height of each of the plurality of protruding rounded seating portions 180B including the first protruding rounded seating portion 182B, the second protruding rounded seating portion 184B, the third protruding rounded seating portion 186B, and the fourth protruding rounded seating portion 188B may be less than the height of each of the first bottom lower sidewall 116 and the second bottom lower sidewall 118.

[0069] The first protruding rod pressing portion 172T, the second protruding rod pressing portion 174T, the third protruding rod pressing portion 176T and the fourth protruding rod pressing portion 178T may not overlap with the first protruding rod seating portion 172B, the second protruding rod seating portion 174B, the third protruding rod seating portion 176B and the fourth protruding rod seating portion 178B in the vertical direction (Z direction), respectively.

[0070] The first protruding rounded pressing portion 182T, the second protruding rounded pressing portion 184T, the third protruding rounded pressing portion 186T and the fourth protruding rounded pressing portion 188T may overlap with the first protruding rounded seating portion 182B, the second protruding rounded seating portion 184B, the third protruding rounded seating portion 186B and the fourth protruding rounded seating portion 188B in the vertical direction (Z direction), respectively. In the top cover 100T and the bottom cover 100B connected to each other, the first protruding rounded pressing portion 182T, the second protruding rounded pressing portion 184T, the third protruding rounded pressing portion 186T and the fourth protruding rounded pressing portion 188T may not contact the first protruding rounded seating portion 182B, the second protruding rounded seating portion 184B, the third protruding rounded seating portion 186B and the fourth protruding rounded seating portion 188B, respectively, for example, may be separated from the first protruding rounded seating portion 182B, the second protruding rounded seating portion 184B, the third protruding rounded seating portion 186B and the fourth protruding rounded seating portion 188B.

[0071] Figure 5A and Figure 5B is an exploded perspective view showing a solid state drive device 1 according to some example embodiments. In particular, Figure 5A 1 is an exploded perspective view showing the top cover 100T and the bottom cover 100B of the housing and the top package substrate module 200T. Figure 5B 1 is an exploded perspective view showing the top cover 100T and the bottom cover 100B of the case and the bottom package substrate module 200B.

[0072] Reference Figure 5A and Figure 5B , the solid state drive device 1 may include a top package substrate module 200T and a bottom package substrate module 200B fixed by a top cover 100T and a bottom cover 100B.

[0073] In the top cover 100T and the bottom cover 100B coupled to each other, the top package substrate module 200T may be fixed by the plurality of protruding rod seating portions 170B and the plurality of protruding rounded pressing portions 180T. For example, on the bottom surface of the top package base substrate 210T of the top package substrate module 200T, the plurality of top protrusions 270T may be in contact with the plurality of protruding rod seating portions 170B of the bottom cover 100B, respectively, and on the top surface of the top package base substrate 210T, the plurality of top recesses 280T may be in contact with the plurality of protruding rounded pressing portions 180T, respectively. For example, the first protruding rod seating portion 172B, the second protruding rod seating portion 174B, the third protruding rod seating portion 176B, and the fourth protruding rod seating portion 178B may be in contact with the first top protrusion 272T, the second top protrusion 274T, the third top protrusion 276T, and the fourth top protrusion 278T, respectively. For example, the first protruding rounded pressing portion 182T, the second protruding rounded pressing portion 184T, the third protruding rounded pressing portion 186T, and the fourth protruding rounded pressing portion 188T may contact the top package base substrate 210T at the first top notch 282T, the second top notch 284T, the third top notch 286T, and the fourth top notch 288T, respectively. In a top view, the plurality of top notches 280T may have concave shapes corresponding to the plurality of protruding rounded pressing portions 180T, respectively.

[0074] The plurality of protruding rod seating portions 170B and the plurality of protruding rounded pressing portions 180T may fix the top package base substrate 210T in the vertical direction (Z direction) to limit and / or prevent the top package substrate module 200T from moving in the vertical direction (Z direction). The plurality of protruding rounded pressing portions 180T may fix the top package base substrate 210T in the horizontal direction (X direction, Y direction, and the diagonal direction of the X direction and the Y direction) to limit and / or prevent the top package substrate module 200T from rotating horizontally.

[0075] In the top cover 100T and the bottom cover 100B coupled to each other, the bottom package substrate module 200B may be fixed by the plurality of protruding rod pressing portions 170T and the plurality of protruding rounded placement portions 180B. For example, on the top surface of the bottom package base substrate 210B of the bottom package substrate module 200B, the plurality of bottom protrusions 270B may be respectively in contact with the plurality of protruding rod pressing portions 170T of the top cover 100T, and on the bottom surface of the bottom package base substrate 210B, the plurality of bottom recesses 280B may be respectively in contact with the plurality of protruding rounded placement portions 180B. For example, the first protruding rod pressing portion 172T, the second protruding rod pressing portion 174T, the third protruding rod pressing portion 176T, and the fourth protruding rod pressing portion 178T may be respectively in contact with the first bottom protrusion 272B, the second bottom protrusion 274B, the third bottom protrusion 276B, and the fourth bottom protrusion 278B. For example, the first protruding rounded seating portion 182B, the second protruding rounded seating portion 184B, the third protruding rounded seating portion 186B, and the fourth protruding rounded seating portion 188B may contact the bottom package substrate 210B at the first bottom recess 282B, the second bottom recess 284B, the third bottom recess 286B, and the fourth bottom recess 288B, respectively. In a top view, the plurality of bottom recesses 280B may have concave shapes corresponding to the plurality of protruding rounded seating portions 180B, respectively.

[0076] The plurality of protruding rod pressing portions 170T and the plurality of protruding rounded placement portions 180B may fix the bottom package base substrate 210B in the vertical direction (Z direction) to limit and / or prevent the bottom package substrate module 200B from moving in the vertical direction (Z direction). The plurality of protruding rounded placement portions 180B may fix the bottom package base substrate 210B in the horizontal direction (X direction, Y direction, and the diagonal direction of the X direction and the Y direction) to limit and / or prevent the bottom package substrate module 200B from rotating horizontally.

[0077] Fig. 6A and Figure 6B is a cross-sectional view for describing a method of installing a package substrate module included in a solid-state drive device in a housing according to some example embodiments. In particular, Fig. 6A is a cross-sectional view for describing a method of installing the top package substrate module 200T between the top cover 100T and the bottom cover 100B, Figure 6B 100B is a cross-sectional view for describing a method of mounting the bottom package substrate module 200B between the top cover 100T and the bottom cover 100B.

[0078] Reference Fig. 6A and Figure 6BThe top cover 100T may include the plurality of protruding rod pressing portions 170T and the plurality of protruding rounded pressing portions 180T respectively protruding from the portions where the plurality of top screw holes 190T are located, and the bottom cover 100B may include the plurality of protruding rod seating portions 170B and the plurality of protruding rounded seating portions 180B respectively protruding from the portions where the plurality of bottom screw holes 190B are located.

[0079] In the top cover 100T and the bottom cover 100B coupled to each other, the top package substrate module 200T may be fixed by the plurality of protruding rod seating portions 170B and the plurality of protruding rounded pressing portions 180T. For example, on the bottom surface 204T of the top package base substrate 210T of the top package substrate module 200T, the plurality of top protrusions 270T may respectively contact the plurality of protruding rod seating portions 170B of the bottom cover 100B, and on the top surface 202T of the top package base substrate 210T, the plurality of top recesses 280T may respectively contact the plurality of protruding rounded pressing portions 180T.

[0080] In the top cover 100T and the bottom cover 100B coupled to each other, the bottom package substrate module 200B may be fixed by the plurality of protruding rod pressing portions 170T and the plurality of protruding rounded placement portions 180B. For example, on the top surface 202B of the bottom package base substrate 210B of the bottom package substrate module 200B, the plurality of bottom protrusions 270B may be in contact with the plurality of protruding rod pressing portions 170T of the top cover 100T, respectively, and on the bottom surface 204B of the bottom package base substrate 210B, the plurality of bottom recesses 280B may be in contact with the plurality of protruding rounded placement portions 180B, respectively.

[0081] Fig. 7A and Figure 7B is a top plan view illustrating a top package substrate module 200Ta and a bottom cover 100Ba included in a solid state drive device according to some example embodiments.

[0082] Reference Fig. 7A and Figure 7B , Figure 1A and Figure 1B The solid state drive device 1 shown in FIG. 1 may include a top package substrate module 200Ta and a bottom cover 100Ba instead of the top package substrate module 200T and the bottom cover 100B.

[0083] The top package substrate module 200Ta may include a top package base substrate 210Ta. The top package base substrate 210Ta may include a plurality of top protrusions 270Ta and a plurality of top recesses 280T. The plurality of top protrusions 270Ta may include a first top protrusion 272Ta, a second top protrusion 274Ta, a third top protrusion 276Ta, and a fourth top protrusion 278Ta. The first top protrusion 272Ta and the fourth top protrusion 278Ta may be located at a fourth edge EG4 of the top package base substrate 210Ta to be separated from each other, and the second top protrusion 274Ta and the third top protrusion 276Ta may be located at a second edge EG2 of the top package base substrate 210Ta to be separated from each other.

[0084] The bottom cover 100Ba may include a plurality of protruding rod seating portions 170Ba and a plurality of protruding rounded seating portions 180B. The plurality of protruding rod seating portions 170Ba may include a first protruding rod seating portion 172Ba, a second protruding rod seating portion 174Ba, a third protruding rod seating portion 176Ba, and a fourth protruding rod seating portion 178Ba. The first protruding rod seating portion 172Ba, the second protruding rod seating portion 174Ba, the third protruding rod seating portion 176Ba, and the fourth protruding rod seating portion 178Ba may be located at portions adjacent to the first corner CN1, the second corner CN2, the third corner CN3, and the fourth corner CN4 of the bottom cover 100Ba, respectively. For example, the first protruding rod placement portion 172Ba can be located on the first bottom lower side wall 116 of the bottom cover 100Ba adjacent to the first corner CN1, the second protruding rod placement portion 174Ba can be located on the second bottom lower side wall 118 of the bottom cover 100Ba adjacent to the second corner CN2, the third protruding rod placement portion 176Ba can be located on the second bottom lower side wall 118 of the bottom cover 100Ba adjacent to the third corner CN3, and the fourth protruding rod placement portion 178Ba can be located on the first bottom lower side wall 116 of the bottom cover 100Ba adjacent to the fourth corner CN4.

[0085] For example, on the bottom surface of the top package base substrate 210Ta of the top package substrate module 200Ta, the plurality of top protrusions 270Ta may be in contact with the plurality of protruding rod seating portions 170Ba of the bottom cover 100Ba, respectively. For example, the first protruding rod seating portion 172Ba, the second protruding rod seating portion 174Ba, the third protruding rod seating portion 176Ba, and the fourth protruding rod seating portion 178Ba may be in contact with the first top protrusion 272Ta, the second top protrusion 274Ta, the third top protrusion 276Ta, and the fourth top protrusion 278Ta, respectively.

[0086] Fig. 8A and Figure 8Bis a top plan view illustrating a bottom package substrate module 200Ba and a top cover 100Ta included in a solid state drive device according to some example embodiments.

[0087] Reference Fig. 8A and Figure 8B , Figure 1A and Figure 1B The solid state drive device 1 shown in FIG. 1 may include a bottom package substrate module 200Ba and a top cover 100Ta instead of the bottom package substrate module 200B and the top cover 100T.

[0088] The bottom package substrate module 200Ba may include a bottom package substrate 210Ba. The bottom package substrate 210Ba may include a plurality of bottom protrusions 270Ba and a plurality of bottom recesses 280B. The plurality of bottom protrusions 270Ba may include a first bottom protrusion 272Ba, a second bottom protrusion 274Ba, a third bottom protrusion 276Ba, and a fourth bottom protrusion 278Ba. The first bottom protrusion 272Ba and the second bottom protrusion 274Ba may be located at a first edge EG1 of the bottom package substrate 210Ba to be separated from each other, and the third bottom protrusion 276Ba and the fourth bottom protrusion 278Ba may be located at a third edge EG3 of the bottom package substrate 210Ba to be separated from each other. The first bottom protrusion 272Ba, the second bottom protrusion 274Ba, the third bottom protrusion 276Ba, and the fourth bottom protrusion 278Ba may be adjacent to a first corner CN1, a second corner CN2, a third corner CN3, and a fourth corner CN4 of the bottom package substrate 210Ba, respectively.

[0089] The top cover 100Ta may include a plurality of protruding rod pressing portions 170Ta and a plurality of protruding rounded pressing portions 180T. The plurality of protruding rod pressing portions 170Ta may include a first protruding rod pressing portion 172Ta, a second protruding rod pressing portion 174Ta, a third protruding rod pressing portion 176Ta, and a fourth protruding rod pressing portion 178Ta. The first protruding rod pressing portion 172Ta, the second protruding rod pressing portion 174Ta, the third protruding rod pressing portion 176Ta, and the fourth protruding rod pressing portion 178Ta may be located at portions adjacent to the first corner CN1, the second corner CN2, the third corner CN3, and the fourth corner CN4 of the top cover 100Ta, respectively. For example, the first protruding rod pressing portion 172Ta may be located on the first top lower side wall 112 of the top cover 100Ta adjacent to the first corner CN1, the second protruding rod pressing portion 174Ta may be located on the first top lower side wall 112 of the top cover 100Ta adjacent to the second corner CN2, the third protruding rod pressing portion 176Ta may be located on the second top lower side wall 114 of the top cover 100Ta adjacent to the third corner CN3, and the fourth protruding rod pressing portion 178Ta may be located on the second top lower side wall 114 of the top cover 100Ta adjacent to the fourth corner CN4.

[0090] For example, on the top surface of the bottom package base substrate 210Ba of the bottom package substrate module 200Ba, the plurality of bottom protrusions 270Ba may be in contact with the plurality of protruding rod pressing portions 170Ta of the top cover 100Ta, respectively. For example, the first protruding rod pressing portion 172Ta, the second protruding rod pressing portion 174Ta, the third protruding rod pressing portion 176Ta, and the fourth protruding rod pressing portion 178Ta may be in contact with the first bottom protrusion 272Ba, the second bottom protrusion 274Ba, the third bottom protrusion 276Ba, and the fourth bottom protrusion 278Ba, respectively.

[0091] Fig.9A and Fig. 9B is a top plan view illustrating a top package substrate module 200Tb and a bottom cover 100Bb included in a solid state drive device according to some example embodiments.

[0092] Reference Fig.9A and Fig. 9B , Figure 1A and Figure 1B The solid state drive device 1 shown in FIG. 1 may include a top package substrate module 200Tb and a bottom cover 100Bb instead of the top package substrate module 200T and the bottom cover 100B.

[0093] The top package substrate module 200Tb may include a top package base substrate 210Tb. The top package base substrate 210Tb may include a plurality of top protrusions 270Tb and a plurality of top recesses 280T. The plurality of top protrusions 270Tb may include a first top protrusion 272Tb and a second top protrusion 274Tb. The first top protrusion 272Tb may be at a first edge EG1 of the top package base substrate 210Tb, and the second top protrusion 274Tb may be at a third edge EG3 of the top package base substrate 210Tb. In some example embodiments, in a top view, the first top protrusion 272Tb may be at a substantially middle portion of the first edge EG1 between the first corner CN1 and the second corner CN2 of the top package base substrate 210Tb, and the second top protrusion 274Tb may be at a substantially middle portion of the third edge EG3 between the third corner CN3 and the fourth corner CN4 of the top package base substrate 210Tb.

[0094] The bottom cover 100Bb may include a plurality of protruding rod placement portions 170Bb and a plurality of protruding rounded placement portions 180B. The plurality of protruding rod placement portions 170Bb may include a first protruding rod placement portion 172Bb and a second protruding rod placement portion 174Bb. The first protruding rod placement portion 172Bb may be at the first edge EG1, and the second protruding rod placement portion 174Bb may be at the third edge EG3. In some example embodiments, in a top view, the first protruding rod placement portion 172Bb may be on the first bottom higher sidewall 126 at a substantially middle portion of the first edge EG1 between the first corner CN1 and the second corner CN2, and the second protruding rod placement portion 174Bb may be on the second bottom higher sidewall 128 at a substantially middle portion of the third edge EG3 between the third corner CN3 and the fourth corner CN4.

[0095] For example, on the bottom surface of the top package base substrate 210Tb of the top package substrate module 200Tb, the plurality of top protrusions 270Tb may be in contact with the plurality of protruding rod seating portions 170Bb of the bottom cover 100Bb, respectively. For example, the first protruding rod seating portion 172Bb and the second protruding rod seating portion 174Bb may be in contact with the first top protrusion 272Tb and the second top protrusion 274Tb, respectively.

[0096] Fig. 10A and Fig. 10B is a top plan view illustrating a bottom package substrate module 200Bb and a top cover 100Tb included in a solid state drive device according to some example embodiments.

[0097] Reference Fig. 10A and Fig. 10B , Figure 1A and Figure 1BThe solid state drive device 1 shown in FIG. 1 may include a bottom package substrate module 200Bb and a top cover 100Tb instead of the bottom package substrate module 200B and the top cover 100T.

[0098] The bottom package substrate module 200Bb may include a bottom package substrate 210Bb. The bottom package substrate 210Bb may include a plurality of bottom protrusions 270Bb and a plurality of bottom recesses 280B. The plurality of bottom protrusions 270Bb may include a first bottom protrusion 272Bb, a second bottom protrusion 274Bb, and a third bottom protrusion 276Bb. The first bottom protrusion 272Bb may be at a first edge EG1 of the bottom package substrate 210Bb, and the second bottom protrusion 274Bb and the third bottom protrusion 276Bb may be at a third edge EG3 of the bottom package substrate 210Bb to be separated from each other. In some example embodiments, in a top view, the first bottom protrusion 272Bb may be at a substantially middle portion of the first edge EG1 between the first corner CN1 and the second corner CN2 of the bottom package base substrate 210Bb, and the second bottom protrusion 274Bb and the third bottom protrusion 276Bb may be adjacent to the third corner CN3 and the fourth corner CN4 of the bottom package base substrate 210Bb, respectively.

[0099] The top cover 100Tb may include a plurality of protruding rod pressing portions 170Tb and a plurality of protruding rounded pressing portions 180T. The plurality of protruding rod pressing portions 170Tb may include a first protruding rod pressing portion 172Tb, a second protruding rod pressing portion 174Tb, and a third protruding rod pressing portion 176Tb. The first protruding rod pressing portion 172Tb may be at a first edge EG1 of the top cover 100Tb, and the second protruding rod pressing portion 174Tb and the third protruding rod pressing portion 176Tb may be at a third edge EG3 of the top cover 100Tb to be separated from each other. In some example embodiments, the first protruding rod pressing portion 172Tb may be located on the first top lower side wall 112 at approximately the middle portion of the first edge EG1 between the first corner CN1 and the second corner CN2 of the top cover 100Tb, and the second protruding rod pressing portion 174Tb and the third protruding rod pressing portion 176Tb may be located on the second top lower side wall 114 adjacent to the third corner CN3 and the fourth corner CN4 of the top cover 100Tb, respectively.

[0100] For example, on the top surface of the bottom package base substrate 210Bb of the bottom package substrate module 200Bb, the plurality of bottom protrusions 270Bb may be in contact with the plurality of protruding rod pressing portions 170Tb of the top cover 100Tb, respectively. For example, the first protruding rod pressing portion 172Tb, the second protruding rod pressing portion 174Tb, and the third protruding rod pressing portion 176Tb may be in contact with the first bottom protrusion 272Bb, the second bottom protrusion 274Bb, and the third bottom protrusion 276Bb, respectively.

[0101] Fig.11 is an enlarged perspective view of a top cover 100Tc of a housing of a solid state drive device according to some example embodiments.

[0102] Reference Fig.11 , Figure 1A and Figure 1B The solid-state drive device 1 shown in FIG. 1 may include a top cover 100Tc instead of the top cover 100T. The top cover 100Tc may include a plurality of protruding rod pressing portions 170Tc and a plurality of protruding rounded pressing portions 180T. In a top view, the plurality of protruding rod pressing portions 170Tc may be respectively FIG. 3A to FIG. 3D The plurality of protruding rod pressing portions 170T shown in the top cover 100Tc are approximately at the same position. The heights of the plurality of protruding rod pressing portions 170Tc may be the same as each other. In some example embodiments, the height of each of the plurality of protruding rod pressing portions 170Tc may be less than the height of the second top higher side wall 124 in the opposite direction of the vertical direction (Z direction) from the bottom surface 104T of the top cover 100Tc.

[0103] Fig.12 is an enlarged perspective view of a bottom cover 100Bc of a housing of a solid state drive device according to some example embodiments.

[0104] Reference Fig.12 , Figure 1A and Figure 1B The solid state drive device 1 shown in FIG. 1 may include a bottom cover 100Bc instead of the bottom cover 100B. The bottom cover 100Bc may include a plurality of protruding rod seating portions 170Bc and a plurality of protruding rounded seating portions 180B. In a top view, the plurality of protruding rod seating portions 170Bc may be respectively FIG. 4A to FIG. 4D The plurality of protruding rod seating portions 170B shown in the figure are in substantially the same position. The heights of the plurality of protruding rod seating portions 170Bc may be the same as each other. In some example embodiments, in the vertical direction (Z direction), from the top surface 102B of the bottom cover 100Bc, the height of each of the plurality of protruding rod seating portions 170Bc may be greater than the height of the second bottom lower side wall 118 and the same as the height of at least a portion of the first bottom higher side wall 126.

[0105] FIG. 13A to FIG. 13C is a perspective view showing a plurality of package substrate modules 200d and a bottom cover 100Bd of a solid state drive device according to some example embodiments. In particular, Fig.13A is a perspective view showing a plurality of package substrate modules 200d, Fig. 13B is a perspective view showing the bottom cover 100Bd, Fig. 13C 2 is a perspective view showing the bottom cover 100Bd and the plurality of package substrate modules 200d mounted on the bottom cover 100Bd.

[0106] Reference FIG. 13A to FIG. 13C , Figure 1A and Figure 1B The solid-state drive device 1 shown in FIG. 1 may include the plurality of package substrate modules 200d and a housing 100d instead of the plurality of package substrate modules 200 and the housing 100. The plurality of package substrate modules 200d may include a top package substrate module 200Td and a bottom package substrate module 200B. The housing 100d may include a top cover 100T (see FIG. 10). Figure 1A ) and bottom cover 100Bd.

[0107] The top package substrate module 200Td may include a top package base substrate 210Td. The top package base substrate 210Td may further include a fixing protrusion 260. The fixing protrusion 260 may be located at an opposite side of the top package base substrate 210Td to a side where the connecting member 295 is connected. For example, when the connecting member 295 is connected to the third edge EG3 of the top package base substrate 210Td, the fixing protrusion 260 may be located at the first edge EG1 of the top package base substrate 210Td.

[0108] The bottom cover 100Bd may have a fixing groove 160 in any one of the first bottom upper sidewall 126 and the second bottom upper sidewall 128. For example, when the first bottom upper sidewall 126 and the second bottom upper sidewall 128 are respectively located at the first edge EG1 and the third edge EG3 of the bottom cover 100Bd and the fixing protrusion 260 is located at the first edge EG1 of the top package base substrate 210Td, the first bottom upper sidewall 126 may have the fixing groove 160.

[0109] When the plurality of package substrate modules 200d are coupled to the bottom cover 100Bd, the fixing protrusions 260 may be coupled to the fixing grooves 160 of the bottom cover 100Bd. Even when the connection member 295 is a flexible connection member, the fixing protrusions 260 may be coupled to the fixing grooves 160 so that the top package substrate module 200Td is fixed to the bottom cover 100Bd. Therefore, in the process of coupling the top cover 100T to the bottom cover 100Bd, the movement of the top package substrate module 200Td may be restricted and / or prevented to stably couple the top cover 100T to the bottom cover 100Bd.

[0110] Reference Figures 1A to 13C , the solid-state drive device 1 according to the inventive concept can ensure the gap between the top package substrate module 200T, 200Ta, 200Tb or 200Td and the bottom package substrate module 200B, 200Ba or 200Bb only by using the top cover 100T, 100Ta, 100Tb or 100Tc and the bottom cover 100B, 100Ba, 100Bb, 100Bc or 100Bd, and the top package substrate module 200T, 200Ta, 200Tb or 200Td and the bottom package substrate module 200B, 200Ba or 200Bb can be fixed to the top cover 100T, 100Ta, 100Tb or 100Tc and the bottom cover 100B. The solid-state drive device 1 according to the inventive concept may include no separate frame member to ensure a gap between the top package substrate module 200T, 200Ta, 200Tb or 200Td and the bottom package substrate module 200B, 200Ba or 200Bb, and fix the top package substrate module 200T, 200Ta, 200Tb or 200Td and the bottom package substrate module 200B, 200Ba or 200Bb. Therefore, the solid-state drive device 1 according to the inventive concept may not include a separate frame member, thereby reducing its volume.

[0111] One or more of the elements disclosed above may include or be implemented in a processing circuit, such as hardware including logic circuits; a hardware / software combination, such as a processor that executes software; or a combination thereof. For example, the processing circuit may more specifically include, but is not limited to, a central processing unit (CPU), an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a system on a chip (SoC), a programmable logic unit, a microprocessor, an application specific integrated circuit (ASIC), etc.

[0112] While the inventive concept has been particularly shown and described with reference to certain example embodiments thereof, it will be understood that various changes in form and details may be made therein without departing from the spirit and scope of the appended claims.

[0113] CROSS-REFERENCE TO RELATED APPLICATIONS

[0114] This application is based on and claims the benefit of priority of Korean Patent Application No. 10-2023-0116268 filed in the Korean Intellectual Property Office on September 1, 2023, the disclosure of which is incorporated herein by reference in its entirety.

Claims

1. A solid state drive device, comprising: A housing, comprising a top cover and a bottom cover, wherein the top cover and the bottom cover define an interior space of the housing; as well as a plurality of package substrate modules accommodated in the inner space, the plurality of package substrate modules including a top package substrate module having a top package base substrate and a bottom package substrate module having a bottom package base substrate, the top package substrate module and the bottom package substrate module being separated from each other in a vertical direction, wherein the top package base substrate comprises a plurality of top protrusions and a plurality of top recesses, The bottom package base substrate comprises a plurality of bottom protrusions and a plurality of bottom recesses, The top cover includes a plurality of protruding rod pressing portions corresponding to the plurality of bottom protrusions and a plurality of protruding rounded pressing portions corresponding to the plurality of bottom recesses, and The bottom cover includes a plurality of protruding rod seating portions corresponding to the plurality of top protrusions and a plurality of protruding rounded seating portions corresponding to the plurality of top recesses.

2. The solid-state drive device according to claim 1, wherein: The number of each of the top protrusions separated from each other, the bottom protrusions separated from each other, the protruding rod pressing portions separated from each other, and the protruding rod seating portions separated from each other is 2 or more, and The number of each of the top notches separated from each other, the bottom notches separated from each other, the protruding rounded pressing portions separated from each other, and the protruding rounded seating portions separated from each other is 4 or more.

3. The solid-state drive device according to claim 1, wherein: The bottom surfaces of the plurality of protruding lever pressing portions of the top cover are in contact with the top surfaces of the plurality of bottom protrusions of the bottom package base substrate, and The plurality of protruding rounded pressing portions of the top cover are in contact with the top package base substrate at the plurality of top notches.

4. The solid-state drive device according to claim 1, wherein: The top surfaces of the plurality of protruding rod seating parts of the bottom cover are in contact with the bottom surfaces of the plurality of top protrusions of the top package base substrate, and The plurality of protruding rounded seating portions of the bottom cover are in contact with the bottom package base substrate at the plurality of bottom recesses.

5. The solid-state drive device according to claim 1, wherein: The top cover and the bottom cover respectively have a plurality of top screw holes and a plurality of bottom screw holes that together define a plurality of screw holes, The plurality of protruding rounded pressing portions respectively protrude from portions of the top cover at the plurality of top screw holes toward the inner space of the housing, and The plurality of protruding rounded seating portions respectively protrude from portions of the bottom cover at the plurality of bottom screw holes toward the inner space of the housing.

6. The solid-state drive device according to claim 5, wherein: The plurality of screw holes are respectively located at corners of the housing, and each of the plurality of protruding lever pressing portions and each of the plurality of protruding lever seating portions are adjacent to a corresponding one of the corners of the housing.

7. The solid-state drive device according to claim 1, wherein: The top cover includes a first top lower side wall and a second top lower side wall facing each other, the top cover includes a first top higher side wall and a second top higher side wall facing each other, the first top lower side wall and the second top lower side wall and the first top higher side wall and the second top higher side wall are respectively at the edges of the shell, The bottom cover includes a first bottom lower side wall and a second bottom lower side wall facing each other, the bottom cover includes a first bottom upper side wall and a second bottom upper side wall facing each other, the first bottom lower side wall and the second bottom lower side wall and the first bottom upper side wall and the second bottom upper side wall are respectively located at the edge of the housing, and The first top lower sidewall, the second top lower sidewall, the first top upper sidewall and the second top upper sidewall of the top cover are in contact with the first bottom upper sidewall, the second bottom upper sidewall, the first bottom lower sidewall and the second bottom lower sidewall of the bottom cover, respectively.

8. The solid-state drive device according to claim 7, wherein: Each of the plurality of protruding rod pressing portions is located on the first top higher side wall or the second top higher side wall, and Each of the plurality of protruding rod seating portions is located on the first bottom upper side wall or the second bottom upper side wall.

9. The solid state drive device according to claim 1, wherein the plurality of package substrate modules include rigid-flexible printed circuit boards, and The plurality of package substrate modules further include a connection member having one end and the other end connected to the top package base substrate and the bottom package base substrate, respectively.

10. The solid-state drive device according to claim 9, wherein: The top package base substrate further includes a fixing protrusion at a side of the top package base substrate opposite to a side at which the connection member is connected, and the bottom cover has a fixing groove corresponding to the fixing protrusion.

11. A solid state drive device comprising: A housing, comprising a top cover and a bottom cover, wherein the top cover and the bottom cover define an interior space of the housing; a top package substrate module accommodated in the inner space of the housing, and comprising a top package base substrate; a bottom package substrate module, separated from the top package substrate module in a vertical direction, the bottom package substrate module being accommodated in the inner space of the housing, and the bottom package substrate module comprising a bottom package base substrate; as well as a connecting member, electrically connecting the top package substrate module to the bottom package substrate module, wherein the housing has a plurality of screw holes at the corners of the housing, the plurality of screw holes comprising a plurality of top screw holes in the top cover and a plurality of bottom screw holes in the bottom cover, The top cover includes a plurality of protruding rod pressing portions and a plurality of protruding rounded pressing portions at the corners of the top cover, The bottom cover includes a plurality of protruding rod seating portions and a plurality of protruding rounded seating portions at the corners of the bottom cover, the top package base substrate comprises a plurality of top protrusions and a plurality of top recesses, the plurality of top protrusions contacting the plurality of protruding rod seating portions of the bottom cover, and the plurality of protruding rounded pressing portions of the top cover contacting the top package base substrate at the plurality of top recesses, and The bottom package base substrate includes a plurality of bottom protrusions and a plurality of bottom recesses, the plurality of bottom protrusions contacting the plurality of protruding rod pressing portions of the top cover, and the plurality of protruding rounded seating portions of the bottom cover contacting the bottom package base substrate at the plurality of bottom recesses.

12. The solid-state drive device according to claim 11, wherein: The top cover includes a first top lower side wall and a second top lower side wall facing each other, and the top cover includes a first top higher side wall and a second top higher side wall facing each other, the first top lower side wall and the second top lower side wall and the first top higher side wall and the second top higher side wall are respectively located at the edges of the shell, The bottom cover includes a first bottom lower side wall and a second bottom lower side wall facing each other, and the bottom cover includes a first bottom upper side wall and a second bottom upper side wall facing each other, the first bottom lower side wall and the second bottom lower side wall and the first bottom upper side wall and the second bottom upper side wall are respectively located at the edge of the shell, some of the plurality of protruding rod pressing portions are located on the first top higher side wall, and other ones of the plurality of protruding rod pressing portions are located on the second top higher side wall, and Some of the plurality of protruding rod seating portions are located on the first bottom upper side wall, and other ones of the plurality of protruding rod seating portions are located on the second bottom upper side wall.

13. The solid-state drive device according to claim 12, wherein: The height of each of the plurality of protruding rounded pressing portions is smaller than the height of each of the first top lower sidewall and the second top lower sidewall, and the height of each of the plurality of protruding rounded seating portions is smaller than the height of each of the first bottom lower sidewall and the second bottom lower sidewall.

14. The solid-state drive device according to claim 12, wherein: The height of each of the multiple protruding rod pressing portions is the same as the height of each of the first top higher side wall and the second top higher side wall, and the height of each of the multiple protruding rod seating portions is less than or equal to the height of each of the first bottom higher side wall and the second bottom higher side wall.

15. The solid-state drive device according to claim 11, wherein: The plurality of protruding rod pressing portions are adjacent to the corners of the top cover, respectively, and the plurality of protruding rod seating portions are adjacent to the corners of the bottom cover, respectively.

16. The solid state drive device according to claim 11, wherein: The plurality of top protrusions do not overlap with the plurality of bottom protrusions in the vertical direction.

17. The solid-state drive device according to claim 11, wherein: The plurality of top notches overlap the plurality of bottom notches in the vertical direction.

18. The solid state drive device according to claim 11, wherein: The connecting member includes a flexible printed circuit connector.

19. A solid state drive device comprising: A housing, comprising a top cover and a bottom cover, wherein the top cover and the bottom cover define an interior space of the housing; a top package substrate module accommodated in the inner space of the housing, and comprising a top package base substrate and an upper semiconductor chip mounted on the top package base substrate; a bottom package substrate module, separated from the top package substrate module in a vertical direction, the bottom package substrate module being accommodated in the inner space of the housing, and the bottom package substrate module comprising a bottom package base substrate and a lower semiconductor chip mounted on the bottom package base substrate; as well as a connecting member including a flexible printed circuit connector electrically connecting the top package substrate module to the bottom package substrate module, wherein the housing has a plurality of screw holes at the corners of the housing, the plurality of screw holes comprising a plurality of top screw holes in the top cover and a plurality of bottom screw holes in the bottom cover, The top cover includes two top lower side walls facing each other, two top higher side walls facing each other, a plurality of protruding rod pressing portions protruding from the two top higher side walls toward the inner space of the shell, and a plurality of protruding rounded pressing portions protruding from portions at the plurality of top screw holes toward the inner space of the shell, The bottom cover includes two bottom lower side walls facing each other, two bottom higher side walls facing each other, a plurality of protruding rod placement portions protruding from the two bottom higher side walls toward the inner space of the housing, and a plurality of protruding rounded placement portions protruding from portions at the plurality of bottom screw holes toward the inner space of the housing, the top package base substrate includes a plurality of top protrusions and a plurality of top recesses, the plurality of top protrusions contacting top surfaces of the plurality of protruding rod seating portions of the bottom cover, and bottom surfaces of the plurality of protruding rounded pressing portions of the top cover contacting the top package base substrate at the plurality of top recesses, and The bottom packaging base substrate includes a plurality of bottom protrusions and a plurality of bottom recesses, the plurality of bottom protrusions contacting the bottom surfaces of the plurality of protruding rod pressing portions of the top cover, and the top surfaces of the plurality of protruding rounded seating portions of the bottom cover contacting the bottom packaging base substrate at the plurality of bottom recesses.

20. The solid state drive device according to claim 19, wherein: The plurality of protruding rounded pressing portions have arc shapes extending along circumferences of the plurality of top screw holes in a plan view, respectively, and the plurality of protruding rounded seating portions have arc shapes extending along circumferences of the plurality of bottom screw holes in a plan view, respectively.

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