Radiating unit and spliced radiator

Abstract

The invention provides a heat dissipation unit and a spliced radiator, and relates to the technical field of radiators. The heat dissipation unit comprises the first heat dissipation body and the first splicing part located on the surface of the first heat dissipation body, the longitudinal section of the first heat dissipation body is arranged to be in the S shape, the first splicing part is used for being spliced with the adjacent heat dissipation unit, and therefore heat dissipation devices of different shapes can be formed through splicing according to the actual situation; therefore, the technical problem that application scenes are limited due to the fact that the shape of an existing radiator is determined after the radiator leaves a factory is solved.

Description

Technical Field

[0001] The present application relates to the technical field of radiators, and in particular to a heat dissipation unit and a spliced ​​radiator. Background Art

[0002] The shape of existing heat sinks is determined after leaving the factory. For example, when a heat sink is used on a PCB (printed circuit board), the installation position of the heat sink on the PCB is also fixed. In actual use, if the temperature rise test of the device fails, the area and shape of the heat sink are fixed, resulting in a small operating space from the perspective of the heat sink, and the applicable scenarios are limited. Summary of the invention

[0003] The present application provides a heat dissipation unit, aiming to solve the technical problem that the shape of the existing radiator is determined after leaving the factory, resulting in limited application scenarios.

[0004] On the one hand, the present application provides a heat dissipation unit, including a first heat dissipation body and a first splicing portion located on the surface of the first heat dissipation body, the longitudinal section of the first heat dissipation body is in the shape of the letter "S", and the first splicing portion is used for splicing with an adjacent heat dissipation unit.

[0005] In a possible implementation of the present application, the first heat dissipation body includes a first surface and a second surface that are oppositely arranged along the width direction thereof, and the first surface and the second surface are both in the shape of the letter "S"; the first splicing portion includes a first sub-portion located on the first surface and a second sub-portion located on the second surface; the first sub-portion includes a first convex block, and the second sub-portion includes a first groove that is adapted to the first convex block;

[0006] And / or, the first heat dissipation body includes a third surface and a fourth surface arranged opposite to each other along its length direction, and the third surface and the fourth surface are both square; the first splicing portion includes a third sub-portion located on the third surface and a fourth sub-portion located on the fourth surface; the third sub-portion includes a second protrusion, and the fourth sub-portion includes a second groove adapted to the second protrusion

[0007] And / or, a positioning hole is provided on the first heat dissipation body.

[0008] In a possible implementation of the present application, the first protrusion includes an arc-shaped rib, or a broken-line rib, or an "S"-shaped rib, or a straight-line rib, or a plurality of bosses arranged at intervals.

[0009] In a possible implementation of the present application, the cross section of the second protrusion is trapezoidal, and the narrow end of the second protrusion is fixedly connected to the first surface;

[0010] Alternatively, the transverse cross section of the second protrusion is square.

[0011] On the other hand, the present application provides a spliced ​​radiator, which includes at least one first heat dissipation unit, and the first heat dissipation unit is the heat dissipation unit described above.

[0012] In a possible implementation of the present application, the spliced ​​radiator includes a plurality of the first heat dissipation units, and a longitudinal section of the whole formed by splicing two adjacent first heat dissipation units is in the shape of the letter "W" or the shape of a "J".

[0013] In a possible implementation of the present application, the spliced ​​radiator also includes a second heat dissipation unit, the second heat dissipation unit includes a second heat dissipation body and a second splicing portion located on the second heat dissipation body, and the second splicing portion is configured to be connected to the first splicing portion to splice the first heat dissipation body and the second heat dissipation body.

[0014] In a possible implementation of the present application, the second heat dissipation body is a flat plate structure, and along the length direction of the first heat dissipation unit, the first heat dissipation body includes a tail end, the tail end is planar, and the second heat dissipation body and the tail end are located on the same plane.

[0015] In a possible implementation of the present application, the spliced ​​radiator is provided with air flow channels and / or heat dissipation holes.

[0016] In a possible implementation of the present application, a plurality of heat dissipation fins are provided on the first heat dissipation body;

[0017] And / or, the second heat dissipation body is provided with a plurality of heat dissipation fins.

[0018] The present application provides a heat dissipation unit. By setting the longitudinal section of the first heat dissipation body to be in the shape of the letter "S", and the first splicing portion is used to splice with adjacent heat dissipation units, radiators of different shapes can be spliced ​​according to actual conditions, thereby solving the technical problem that the shape of the existing radiator is determined after leaving the factory, resulting in limited applicable scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 is a structural schematic diagram of an embodiment of a first heat dissipation unit provided in an embodiment of the present application;

[0021] Figure 2 yes Figure 1 A schematic structural diagram of the first heat dissipation unit in another viewing angle;

[0022] Figure 3 is a structural schematic diagram of an embodiment of a second heat dissipation unit provided in an embodiment of the present application;

[0023] Figure 4 It is a structural schematic diagram of a first embodiment of a spliced ​​radiator provided in an embodiment of the present application;

[0024] Figure 5 yes Figure 4 A schematic diagram of the structure of the spliced ​​radiator in another perspective;

[0025] Figure 6 is a structural schematic diagram of a second embodiment of a spliced ​​radiator provided in an embodiment of the present application;

[0026] Figure 7 yes Figure 6 A schematic diagram of the structure of the spliced ​​radiator in another perspective;

[0027] Figure 8 is a structural schematic diagram of a third embodiment of a spliced ​​radiator provided in an embodiment of the present application;

[0028] Fig. 9 yes Figure 8 A schematic diagram of the structure of the spliced ​​radiator in another perspective;

[0029] Fig.10 It is a structural schematic diagram of a fourth embodiment of a spliced ​​radiator provided in an embodiment of the present application.

[0030] Description of the drawings: 1000, spliced ​​radiator; 100, first heat dissipation unit; 110, first heat dissipation body; 11, first surface; 12, second surface; 13, third surface; 14, fourth surface; 15, positioning hole; 120, first splicing part; 121, first sub-part; 122, second sub-part; 123, third sub-part; 124, fourth sub-part; 200, second heat dissipation unit; 210, second heat dissipation body; 220, second splicing part; 230, heat dissipation fins; 300, air flow channel; 400, heat dissipation hole. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0034] In this application, the word "exemplary" is used to mean "serving as an example, illustration, or illustration." Any embodiment described in this application as "exemplary" is not necessarily to be construed as being preferred or advantageous over other embodiments. The following description is given to enable any person skilled in the art to implement and use the invention. In the following description, details are listed for the purpose of explanation. It should be understood that a person of ordinary skill in the art can recognize that the invention can be implemented without using these specific details. In other instances, well-known structures and processes are not elaborated in detail to avoid obscuring the description of the invention with unnecessary details. Therefore, the present invention is not intended to be limited to the embodiments shown, but is consistent with the widest scope consistent with the principles and features disclosed in this application.

[0035] It is understandable that the shape of the existing heat sink is determined after leaving the factory. For example, when the heat sink is used in a PCB (printed circuit board), once the shape of the heat sink is determined, the installation position of the heat sink on the PCB is also fixed. In actual use, if the temperature rise test of the device fails, the area and shape of the heat sink are fixed, resulting in a small space for operation from the perspective of the heat sink, and the applicable scenarios are limited.

[0036] In view of the above technical problems in the prior art, please refer to Figure 1 and Figure 2 , an embodiment of the present application provides a heat dissipation unit, which can be spliced ​​to form heat sinks of different shapes according to actual conditions, which are described in detail below.

[0037] The heat dissipation unit in the present application includes a first heat dissipation body 110 and a first splicing portion 120 located on the surface of the first heat dissipation body 110. The longitudinal section of the first heat dissipation body 110 is in the shape of the letter "S", and the first splicing portion 120 is used for splicing with adjacent heat dissipation units. It should be noted that in the present application, the longitudinal section of a certain component refers to the cut surface on the component that is perpendicular to the width direction, and the cross-section of a certain component refers to the cut surface on the component that is perpendicular to the length direction. Specifically in the present application, the longitudinal section of the first heat dissipation body 110 refers to the cut surface in the width direction of the first heat dissipation body 110. The first splicing portion 120 is used for splicing with adjacent heat dissipation units, that is, the heat dissipation unit is snap-connected with other heat dissipation units through the first splicing portion 120 thereon. Among them, the structures of two adjacent heat dissipation units may be the same or different, which is not limited here. In the present application, the longitudinal section of the first heat dissipation body 110 is set to be in the shape of the letter "S", and the first splicing part 120 is used to splice with the adjacent heat dissipation unit, so that radiators of different shapes can be spliced ​​according to actual conditions, thereby solving the technical problem that the shape of the existing radiator is determined after leaving the factory, resulting in limited applicable scenarios. In addition, since the longitudinal section of the first heat dissipation body 110 is in the shape of the letter "S", it has a larger heat dissipation area than the heat dissipation unit with a planar structure, so that the radiator with the heat dissipation unit has a larger heat dissipation area, which is beneficial to increase the heat dissipation effect of the radiator. At the same time, since the longitudinal section of the first heat dissipation body 110 is in the shape of the letter "S", it can avoid being hit by the raised structure on the heat dissipation component (such as a PCB board), and can be applied to more scenarios.

[0038] It should be noted that the material for preparing the heat dissipation unit in the present application is not limited, and existing metal heat dissipation materials or other heat dissipation materials can be used. Exemplarily, the material for preparing the heat dissipation unit is aluminum, copper, or aluminum-magnesium alloy.

[0039] It should be noted that the first splicing portion 120 only needs to be arranged on the surface of the first heat dissipation body 110. It is understandable that the first heat dissipation body 110 is a three-dimensional structure, which must include multiple surfaces. The first splicing portion 120 can be arranged on one surface of the first heat dissipation body 110, or it can be arranged on multiple surfaces of the first heat dissipation body 110 at the same time. When the first splicing portion 120 is arranged on multiple surfaces at the same time, the multiple surfaces of the first heat dissipation body 110 on which the first splicing portion 120 is arranged can be adjacent to each other or can be non-adjacent to each other, which is not limited here. The following is an example in which the first splicing portion 120 is arranged on multiple surfaces. For example, please refer to Figure 1 , Figure 2 and Figure 7, the first heat dissipation body 110 includes a first surface 11 and a second surface 12 which are arranged opposite to each other along its width direction (the first surface 11 and the second surface 12 also include two end surfaces along its width direction of the first heat dissipation body 110), and the first surface 11 and the second surface 12 are both in the shape of the letter "S"; the first splicing portion 120 includes a first sub-portion 21 located on the first surface 11 and a second sub-portion 22 located on the second surface 12; the first sub-portion 21 includes a first protrusion, and the second sub-portion 22 includes a first groove which is matched with the first protrusion. This structural setting enables multiple heat dissipation units (i.e., first heat dissipation units) to be freely spliced ​​along their width direction, and the structure of the spliced ​​heat dissipation unit can be changed by changing the number of first heat dissipation units in the spliced ​​heat dissipation unit or the splicing method between two adjacent first heat dissipation units.

[0040] Specifically, the first surface 11, the second surface 12 and the longitudinal section of the first heat dissipation body 110 are parallel to each other, and the orthographic projection of the first surface 11 on the plane where the second surface 12 is located coincides with the second surface 12. This structural arrangement enables the shapes of the connecting surfaces (i.e., the surfaces that are spliced ​​together) between two adjacent first heat dissipation bodies 110 to be completely identical when multiple first heat dissipation bodies 110 are spliced ​​along their width direction, thereby making the structure of the spliced ​​part more beautiful and the spliced ​​heat sink more regular.

[0041] Specifically, the first sub-portion 21 is located on the first surface 11 and is arranged near the center of the first surface 11. The second sub-portion 22 is located on the second surface 12 and is arranged near the center of the second surface 12. Exemplarily, the first sub-portion 21 can be a first protrusion, and correspondingly, the second sub-portion 22 is a first groove adapted to the first protrusion. When two first heat dissipation bodies 110 are spliced ​​along their width direction, the first protrusion on one of the first heat dissipation bodies 110 is inserted into the first groove on the other first heat dissipation body 110, so that the two first heat dissipation bodies 110 can be spliced ​​together along their width direction. Of course, in other embodiments of the present application, the first sub-portion 21 can be a first groove, and correspondingly, the second sub-portion 22 is a first protrusion adapted to the first groove. It should be noted that the structure of the first protrusion in the present application is not specifically limited, and it is only necessary to enable the two heat dissipation units to be spliced ​​together through the first protrusion and the first groove. Exemplarily, the first protrusion may be an arc-shaped rib, or a zigzag rib, or an “S”-shaped rib, or a straight-line rib, or a plurality of spaced-apart bosses, or the like.

[0042] In some embodiments of the present application, the first heat dissipation body 110 includes a third surface 13 and a fourth surface 14 arranged opposite to each other along its length direction, and the third surface 13 and the fourth surface 14 are both square; the first splicing portion 120 includes a third sub-portion 23 located on the third surface 13 and a fourth sub-portion 24 located on the fourth surface 14; the third sub-portion 23 includes a second protrusion, and the fourth sub-portion 24 includes a second groove adapted to the second protrusion.

[0043] Specifically, the third surface 13 and the fourth surface 14 are parallel to each other, and the outer contours of the third surface 13 and the fourth surface 14 can completely overlap. This structural setting enables the shapes of the connection surfaces between two adjacent first heat dissipation bodies 110 to be completely identical when multiple first heat dissipation bodies 110 are spliced ​​along their length direction, thereby making the structure of the spliced ​​part more beautiful and the spliced ​​heat sink more regular.

[0044] Specifically, the third sub-portion 23 is located on the third surface 13, and the third sub-portion 23 is arranged near the center of the third surface 13. The fourth sub-portion 24 is located on the fourth surface 14, and the fourth sub-portion 24 is arranged near the center of the fourth surface 14. Exemplarily, the third sub-portion 23 can be a second protrusion, and correspondingly, the fourth sub-portion 24 is a second groove adapted to the second protrusion. When two first heat dissipation bodies 110 are spliced ​​along their length, the second protrusion on one of the first heat dissipation bodies 110 is inserted into the second groove on the other first heat dissipation body 110, so that the two first heat dissipation bodies 110 can be spliced ​​together along their length direction. Of course, in other embodiments of the present application, the third sub-portion 23 can be a second groove, and correspondingly, the fourth sub-portion 24 is a second protrusion adapted to the second groove. It should be noted that the structure of the second protrusion is not specifically limited, and it is only necessary to enable the two heat dissipation units to be spliced ​​through the second protrusion and the second groove. Exemplarily, the cross section of the second boss is trapezoidal (e.g., an isosceles trapezoid), and the narrow end of the second protrusion (i.e., the end corresponding to the top side of the isosceles trapezoid) is fixedly connected to the first surface 11. This structural arrangement can prevent the second protrusion located in the second groove from being separated from the second groove when the first heat dissipation unit after splicing is subjected to a force along its length direction, which is beneficial to improving the stability of the spliced ​​heat sink. Of course, in other embodiments of the present application, the structure of the second protrusion can also be other shapes, for example, the transverse cross section of the second protrusion is rectangular or arc-shaped, etc.

[0045] In some embodiments of the present application, a positioning hole 15 is provided on the first heat dissipation body 110. Through the positioning hole 15, the first heat dissipation body 110 can be fixed to the structure that needs heat dissipation. Exemplarily, the positioning hole 15 is a threaded hole, and a threaded member passes through the positioning hole 15 on the first heat dissipation body 110 and the mounting hole on the heat dissipating member, thereby fixing the first heat dissipation body 110 to the heat dissipating member. For another example, positioning posts are provided on the PCB board, and the positioning holes 15 on the first heat dissipation body 110 cooperate with the positioning posts on the PCB board, thereby limiting the first heat dissipation body 110 on the PCB board. It should be noted that the positioning posts on the PCB board can pass through the positioning holes on different heat dissipation units, so that multiple heat dissipation units are stacked along the height direction of the positioning posts, forming a multi-layer heat dissipation structure, further improving the heat dissipation effect.

[0046] Please refer to Figures 4 to 10 , an embodiment of the present application further provides a spliced radiator 1000. The spliced radiator 1000 includes at least one first heat dissipation unit 100, and the first heat dissipation unit 100 is the above-mentioned heat dissipation unit.

[0047] In some embodiments of the present application, please refer to Figure 4 and Figure 5 , Figure 4 and Figure 5 Only a partial structure formed by splicing the first heat dissipation units along their length directions is shown. The spliced radiator 1000 includes a plurality of the first heat dissipation units 100, and the overall longitudinal section formed by splicing two adjacent first heat dissipation units 100 is in the shape of the letter "W" or the shape of "Ji". Specifically, the spliced radiator 1000 includes four first heat dissipation units 100, and the four first heat dissipation units 100 are sequentially connected along their length directions. Among them, the overall longitudinal section formed by splicing one first heat dissipation unit 100 at the end and an adjacent first heat dissipation unit 100 is in the shape of the letter "W". The overall longitudinal section formed by splicing the two first heat dissipation units 100 in the middle is in the shape of "Ji". The spliced radiator 1000 is formed by splicing a plurality of first heat dissipation units 100 along their length directions. By changing the number and / or splicing positions of the first heat dissipation units 100 in the spliced radiator 1000, the structure of the spliced radiator can be changed according to actual needs. At the same time, an air flow channel 300 is provided in the spliced radiator 1000, which is beneficial to further improving the heat dissipation effect.

[0048] It should be noted that in some other embodiments of the present application, the spliced radiator 1000 includes a plurality of the first heat dissipation units 100, and some of the first heat dissipation units 100 are spliced along their length directions, such as Figure 4 and Figure 5As shown, another part of the first heat dissipation units 100 are spliced ​​in the extended width direction, so that the dimensions of the spliced ​​radiator 1000 in both the length direction and the width direction can be flexibly adjusted.

[0049] In the present application, the spliced ​​heat sink 1000 includes a plurality of first heat dissipation units 100. In a certain practical application scenario, when it is found that the heat dissipation effect of the spliced ​​heat sink 1000 is not ideal, the heat dissipation area can be increased by increasing the number of spliced ​​first heat dissipation units 100, or the splicing positions of two adjacent first heat dissipation units 100 can be changed to change the shape of the spliced ​​heat sink 1000, thereby changing the heat dissipation effect of the spliced ​​heat sink 1000. In addition, the first heat dissipation units 100 can be spliced ​​to obtain a heat sink with a special structure, so that the structure of the spliced ​​heat sink 1000 fully covers the heat dissipation area of ​​the heat dissipation device (such as a motherboard), improves the heat dissipation efficiency, and ensures that the spliced ​​heat sink 1000 is tightly fitted with the heat dissipation device to conduct heat to the greatest extent.

[0050] In another practical application scenario, when a device (such as a functional component on a PCB) within the coverage of the spliced ​​heat sink in the present application is too close to the heat sink so that the temperature rise cannot pass through, or when a device is too high to be placed under the spliced ​​heat sink, one or more heat dissipation units can be removed to form a heat dissipation hole 400 (such as Fig.10 As shown), the device can be avoided through the heat dissipation hole 400, or the corresponding part of the spliced ​​heat sink can be lifted up to form an avoidance space, thereby increasing applicability.

[0051] In another practical application scenario, when the temperature rise of a heat dissipation device (such as a PCB board) at the far end is too high during power operation, but there is no reserved position for a heat sink on the PCB board, the spliced ​​heat sink can be extended to cover the device for heat dissipation, thereby increasing applicability.

[0052] In some embodiments of this application, please refer to Figure 3 , Figures 6 to 9 The spliced ​​heat sink 1000 further includes a second heat dissipation unit 200, the second heat dissipation unit 200 includes a second heat dissipation body 210 and a second splicing portion 220 located on the second heat dissipation body 210, the second splicing portion 220 is configured to be connected to the first splicing portion 120 so as to splice the first heat dissipation body 110 and the second heat dissipation body 210. Exemplarily, the structure of the second heat dissipation body 210 is different from that of the first heat dissipation body 110, and the structure of the second splicing portion 220 is the same as or similar to that of the first splicing portion 120. For details, refer to the relevant description of the first splicing portion 120, which will not be repeated here.

[0053] Specifically, see Figure 6 and Figure 7 , the spliced ​​radiator 1000 includes two first heat dissipation units 100 and two second heat dissipation units 200. Along the length direction of the spliced ​​radiator 1000 (that is, the length direction of the first heat dissipation unit 100), the two first heat dissipation units 100 are located in the middle of the spliced ​​radiator 1000, and an air flow channel 300 is formed between the two first heat dissipation units 100, which is conducive to further improving the heat dissipation effect. The two second heat dissipation units 200 are located at both ends of the spliced ​​radiator 1000. The second heat dissipation body 210 is a flat plate structure. Further, along the length direction of the first heat dissipation body 110, the first heat dissipation body 110 includes a tail end, the tail end is planar, and the second heat dissipation body 210 is located on the same plane as the tail end. The spliced ​​radiator 1000 in this embodiment is in the shape of a "J" as a whole, and an air flow channel 300 is formed in the spliced ​​radiator 1000, which is conducive to improving the heat dissipation effect of the spliced ​​radiator 1000.

[0054] In some embodiments of this application, please refer to Figure 3 and Figure 8 , a plurality of heat dissipation fins 230 are provided on the second heat dissipation body 210. This embodiment increases the heat dissipation area of ​​the second heat dissipation body 210 by providing a plurality of heat dissipation fins 230 on the second heat dissipation body 210, so that the spliced ​​radiator 1000 having the second heat dissipation body 210 has a better heat dissipation effect. Exemplarily, a plurality of heat dissipation fins 230 are provided on the second heat dissipation body 210, any one of the heat dissipation fins 230 is arranged perpendicular to the second heat dissipation body 210, and a plurality of heat dissipation fins 230 are arranged at equal intervals along the length direction of the second heat dissipation body 210. It should be noted that the specific structure of the heat dissipation fins 230 does not belong to the main improvement point of the present application and is not limited here.

[0055] In some embodiments of this application, please refer to Fig.10 , it should be noted that Fig.10 Only a partial structure of the spliced ​​radiator 1000 is shown in the figure, and the spliced ​​radiator 1000 includes at least one first heat dissipation unit 100 (not shown in the figure) and a plurality of second heat dissipation units 200. Specifically, the plurality of second heat dissipation units 200 are in an array structure as a whole. Exemplarily, the spliced ​​radiator 1000 includes 8 second heat dissipation units 200, which are generally arranged in a 3*3 array structure, and a heat dissipation hole 400 (such as Fig.10 As shown), the heat dissipation hole 400 can be used to avoid devices on the heat dissipation component, and can also be used to increase the flow of air flow to increase the heat dissipation effect of the spliced ​​heat sink 1000.

[0056] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the detailed description of other embodiments above, and will not be repeated here.

[0057] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements and amendments to the present application. Such modifications, improvements and amendments are suggested in the present application, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of the present application.

[0058] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0059] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus help understand one or more embodiments of the invention, in the above description of the embodiments of this application, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

[0060] In some embodiments, numbers describing the number of components and attributes are used. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise specified, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values ​​is as accurate as possible within the feasible range.

[0061] The above is a detailed introduction to a heat dissipation unit and a spliced ​​radiator provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A heat dissipation unit, characterized in that: It includes a first heat dissipation body and a first splicing portion located on the surface of the first heat dissipation body, the longitudinal section of the first heat dissipation body is in the shape of the letter "S", and the first splicing portion is used for splicing with adjacent heat dissipation units.

2. The heat dissipation unit according to claim 1, characterized in that: The first heat dissipation body comprises a first surface and a second surface which are arranged opposite to each other along the width direction thereof, and the first surface and the second surface are both in the shape of the letter "S"; the first joint portion comprises a first sub-portion located on the first surface and a second sub-portion located on the second surface; the first sub-portion comprises a first protrusion, and the second sub-portion comprises a first groove which is adapted to the first protrusion; And / or, the first heat dissipation body includes a third surface and a fourth surface arranged opposite to each other along its length direction, and the third surface and the fourth surface are both square; the first splicing portion includes a third sub-portion located on the third surface and a fourth sub-portion located on the fourth surface; the third sub-portion includes a second protrusion, and the fourth sub-portion includes a second groove adapted to the second protrusion And / or, a positioning hole is provided on the first heat dissipation body.

3. The heat dissipation unit according to claim 2, characterized in that: The first protrusion includes an arc-shaped rib, a broken-line rib, an "S"-shaped rib, a straight-line rib, or a plurality of spaced-apart bosses.

4. The heat dissipation unit according to claim 2, characterized in that: The cross section of the second protrusion is trapezoidal, and the narrow end of the second protrusion is fixedly connected to the first surface; Alternatively, the transverse cross section of the second protrusion is square.

5. A spliced ​​radiator, characterized in that: The spliced ​​radiator comprises at least one first radiating unit, and the first radiating unit is the radiating unit according to any one of claims 1 to 4.

6. The spliced ​​radiator according to claim 5, characterized in that: The spliced ​​radiator includes a plurality of the first radiating units, and a longitudinal section of the whole formed by splicing two adjacent first radiating units is in the shape of the letter "W" or the shape of a "J".

7. The spliced ​​radiator according to claim 5, characterized in that: The spliced ​​radiator also includes a second radiating unit, which includes a second radiating body and a second splicing portion located on the second radiating body, and the second splicing portion is configured to be connected to the first splicing portion to splice the first radiating body and the second radiating body.

8. The spliced ​​radiator according to claim 7, characterized in that: The second heat dissipation body is a flat plate structure. Along the length direction of the first heat dissipation unit, the first heat dissipation body includes a tail end, the tail end is planar, and the second heat dissipation body and the tail end are located on the same plane.

9. The spliced ​​radiator according to claim 5, characterized in that: The spliced ​​radiator is provided with air flow channels and / or heat dissipation holes.

10. The spliced ​​radiator according to claim 7, characterized in that: The first heat dissipation body is provided with a plurality of heat dissipation fins; And / or, the second heat dissipation body is provided with a plurality of heat dissipation fins.

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