A pick-and-place apparatus and a chip automatic test system

Abstract

The application provides a pick-and-place device and a chip automatic testing system. By testing individual bare chips after wafer cutting, defects or unqualified products that may not be found in wafer-level testing can be more accurately identified. These defects may be introduced during wafer cutting, such as cutting damage, contamination, etc. Therefore, this testing method can effectively improve the yield of the final product and reduce resource waste and cost increase caused by unqualified bare chips flowing into subsequent production links. Furthermore, through the pick-and-place device, testing device, and pick-out device, an automated processing flow of "placing bare chips in chip carriers, placing the chip carriers on a tray, batch testing through the tray, and picking out the bare chips from the chip carriers after testing" can be realized, improving processing speed and reducing labor costs and human errors.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically, to a pick-and-place device and an automated chip testing system. Background Technology

[0002] While wafer-level testing is relatively mature for advanced process chips (such as HBM chips), there are no good solutions for chip-level testing.

[0003] Taking HBM chips as an example, HBM stands for High Bandwidth Memory, a high-performance DRAM based on 3D stacking technology, designed to meet the high demands for memory bandwidth and capacity in fields such as high-performance computing, artificial intelligence, and graphics processing. HBM is a new type of memory chip technology that achieves high-speed, high-bandwidth memory access by vertically stacking multiple DRAM chips and using advanced packaging technologies such as through-silicon vias (TSVs) and microbumps.

[0004] The manufacturing process of HBM chips mainly includes: thinning and bumping the memory core wafer, and then cutting it to obtain multiple bare dies; thinning and bumping the logic wafer; stacking multiple bare dies on the logic wafer to obtain a stacked wafer; cutting the stacked wafer and debonding or peeling it to obtain multiple stacked bare chips; and packaging these stacked bare chips into tape and reel before proceeding to the subsequent mass production process.

[0005] Existing technologies for testing HBM chips mainly include testing of memory core wafers, logic wafers, and stacked wafers. However, during the manufacturing process of HBM chips, after obtaining the stacked wafers, wafer dicing and wafer debonding or stripping are performed. This process may generate defective HBM cells. These defective HBM cells are assembled into 2.5D packages, leading to a decrease in product yield. Summary of the Invention

[0006] The purpose of this application is to provide a pick-and-place device and an automatic chip testing system to solve the technical problem that the prior art only performs wafer-level testing and cannot detect unqualified bare chips after wafer dicing, resulting in a decrease in product yield.

[0007] An embodiment of this application provides a pick-and-place device, including: a carrier transfer device, a chip transfer device, and a pick-and-place robotic arm assembly;

[0008] The carrier transfer device is used to transfer the chip carrier to the pick-and-place station;

[0009] The chip transfer device is used to transfer a tape or frame containing bare chips to the pick-and-place station;

[0010] The pick-and-place robot group is used to place the bare chips in the pick-and-place station into the chip carriers in the pick-and-place station, and move the chip carriers with the bare chips to the tray at the entrance of the testing device.

[0011] In some optional embodiments, the pick-and-place robot group comprises a first robot, a second robot, and a moving-in robot.

[0012] The first robot is used to suck the cover plate of the chip carrier to expose the cavities inside the chip carrier.

[0013] The second robot is used to suck the bare chips on the tape, and place the bare chips into the chip carrier from the opening of the chip carrier.

[0014] The first robot is further used to cover the opening of the chip carrier with the cover plate after the bare chips are placed into the chip carrier.

[0015] The moving-in robot is used to clamp the carrier body of the chip carrier, and move the chip carrier with the bare chips to the empty position of the tray at the entrance of the testing device after the opening of the chip carrier is covered with the cover plate.

[0016] In some optional embodiments, the pick-and-place robot group further comprises a turnover device.

[0017] The second robot is used to suck the bare chips on the Frame, place the bare chips on the turnover device for turning over, suck the turned-over bare chips, and place the bare chips into the chip carrier from the opening of the chip carrier.

[0018] In some optional embodiments, a CCD camera is arranged on the second robot; the CCD camera is used to perform necessary appearance inspection on the front surface, back surface, and side surface of the bare chip during the process of sucking the bare chip and placing the bare chip into the chip carrier, to ensure that the selected bare chip is free of abnormalities.

[0019] In some optional embodiments, the second robot comprises a pressure feedback monitoring module; during the process of placing the bare chip into the chip carrier, the pressure for pressing the bare chip is detected in real time according to the pressure feedback monitoring module, and the pressing force is adjusted, so that the pressure is controlled to be less than or equal to a set value.

[0020] In some optional embodiments, the bottom plate surface of the chip carrier has a positioning mark; the second robot places the bare chip into the chip carrier according to the positioning mark, and the positioning accuracy during the process of placing the bare chip into the chip carrier is less than 30 um.

[0021] In some optional embodiments, the carrier moving-in device comprises a first clamping assembly.

[0022] A first clamping assembly is used to clamp the chip carrier; the first clamping assembly is released after the bare chip is placed into the chip carrier.

[0023] In some optional embodiments, the pick-and-place robot group comprises a first robot and a second robot.

[0024] The first robot is used to suck the cover plate of the chip carrier to expose the cavity inside the chip carrier.

[0025] The second robot is used to suck the bare chip and place the bare chip into the chip carrier from the opening of the chip carrier.

[0026] The first robot is further used to cover the opening of the chip carrier with the cover plate after the bare chip is placed into the chip carrier.

[0027] The first robot or the second robot is used to clamp the carrier body of the chip carrier after the first clamping assembly is released, and move the chip carrier with the bare chip placed therein to the empty position of the tray at the entrance of the testing device.

[0028] In some optional embodiments, the chip feeding device is used to feed the bare chip to the pick-and-place station when the bare chip needs to be tested, and feed the bare chip to the tape-and-reel station when the bare chip does not need to be tested.

[0029] The chip automatic testing system provided by the embodiments of the present application comprises a pick-and-place device, a testing device and a taking-out device.

[0030] The pick-and-place device is used to place the bare chip obtained by cutting a wafer into a corresponding chip carrier, and place the chip carrier with the bare chip placed therein to the empty position of the tray at the entrance of the testing device.

[0031] The testing device is used to move the tray at the entrance of the testing device to a testing station, and test the chip carriers on at least two placement regions of the tray; after the testing, the tray is moved to the exit of the testing device.

[0032] The taking-out device is used to obtain the chip carriers on the tray at the exit of the testing device; the bare chip is taken out from the chip carrier, wherein the qualified bare chip enters a tape-and-reel packaging link or is placed back to a frame.

[0033] In the technical solution, the single bare chip is tested after wafer cutting, so that the defects or unqualified products that may not be found in wafer-level testing can be more accurately identified. These defects may be introduced in the wafer cutting process, such as cutting damage, contamination, etc. Therefore, the testing method can effectively improve the yield of the final product and reduce the waste of resources and increase in cost caused by the inflow of unqualified bare chips into subsequent production links. Moreover, through the taking and placing device, the testing device, and the taking-out device, the automatic processing flow of "placing the bare chip in the chip carrier, then placing the chip carrier on the tray, testing in batches through the tray, and then taking the bare chip out of the chip carrier" can be realized, so as to improve the processing speed and reduce the labor cost and human error.

[0034] In some optional embodiments, the taking and placing device comprises a carrier feeding device, a chip feeding device, and a taking and placing robot group.

[0035] The carrier feeding device is configured to feed the chip carrier to the taking and placing station.

[0036] The chip feeding device is configured to feed the bare chip to the taking and placing station.

[0037] The taking and placing robot group is configured to place the bare chip in the chip carrier at the taking and placing station, and move the chip carrier with the bare chip to the tray at the entrance of the testing device.

[0038] In the technical solution, the carrier feeding device and the chip feeding device, such as a conveyor belt, stop when the carrier feeding device feeds the chip carrier to the taking and placing station, and the chip feeding device also stops when the corresponding bare chip is fed to the taking and placing station. Then, the bare chip is placed in the chip carrier by the taking and placing robot, and the chip carrier with the bare chip is placed on the empty position of the tray at the entrance of the testing device. Then, the carrier feeding device and the chip feeding device are started, and the above process is repeated until a set number of chip carriers are placed on the tray at the entrance of the testing device. The tray is sent into the testing device for chip testing, and the empty tray is placed at the entrance of the testing device to fill the next tray.

[0039] In some optional embodiments, the chip feeding device is configured to feed the bare chip to the taking and placing station when the bare chip needs to be tested, and feed the bare chip to the tape feeding station when the bare chip does not need to be tested.

[0040] In some optional embodiments, the taking and placing robot group comprises a first robot, a second robot, and a moving-in robot.

[0041] The first robot is configured to suck the cover plate of the chip carrier to expose the cavity inside the chip carrier.

[0042] The second mechanical arm is used to pick up the bare chip and put the bare chip into the chip carrier from the opening of the chip carrier;

[0043] The first mechanical arm is also used to cover the opening of the chip carrier with the cover plate after the bare chip is put into the chip carrier;

[0044] The moving-in mechanical arm is used to clamp the carrier body of the chip carrier, and after the opening of the chip carrier is covered with the cover plate, the chip carrier with the bare chip placed therein is moved to the empty position of the tray at the entrance of the testing device.

[0045] The cover plate of the chip carrier has positioning marks, and the first mechanical arm accurately picks up the cover plate of the chip carrier through the positioning marks. The bare chip also has positioning marks, and the second mechanical arm accurately picks up the bare chip through the positioning marks. The cavity inside the chip carrier has positioning marks, and the second mechanical arm can accurately place the bare chip into the chip carrier through the positioning marks.

[0046] The second mechanical arm has a pressure feedback monitoring module, which detects the feedback pressure in real time and adjusts the force during the process of putting the bare chip into the chip carrier, so as to avoid damaging the bare chip.

[0047] In the above technical solution, the moving-in mechanical arm clamps the carrier body of the chip carrier on the pick-and-place station, the first mechanical arm picks up the cover plate of the chip carrier, the second mechanical arm picks up the bare chip and puts it into the chip carrier, the first mechanical arm covers the opening of the chip carrier with the cover plate, and finally, the moving-in mechanical arm moves the chip carrier to the empty position of the tray at the entrance of the testing device and releases the chip carrier.

[0048] In some optional embodiments, the testing device comprises a tray conveying device and a testing machine;

[0049] The tray conveying device is used to convey the tray at the entrance of the testing device to the testing station;

[0050] The testing machine is used to perform chip testing on each chip carrier on the tray at the testing station;

[0051] The tray conveying device is also used to convey the tray at the testing station to the exit of the testing device.

[0052] In the above technical solution, the entire testing process is realized automatically, including conveying the tray from the entrance to the testing station by the tray conveying device, performing chip testing on the chip carrier on the tray by the testing machine, and conveying the tested tray to the exit by the tray conveying device. This process design greatly reduces manual intervention and improves testing efficiency and accuracy.

[0053] Specifically, the tray is uniformly provided with a plurality of placement areas, each of which is used for placing a chip carrier, and the placement areas are numbered. The test machine tests the chip carriers in each numbered placement area, and after testing, the chip carriers corresponding to the placement areas with different numbers are labeled as qualified or unqualified.

[0054] In some optional embodiments, the test device further comprises a tray recycling device.

[0055] The tray recycling device is used to move the empty tray to the test device entrance after all the chip carriers on the tray at the test device exit are removed.

[0056] In the above technical solution, the tray conveying device can continuously convey the tray from the test device entrance to the test station, the test machine can efficiently test the chip carriers on the tray that reaches the test station, and after the test is completed, the tray conveying device quickly conveys the tray to the exit to prepare for the next test cycle. This continuous operation mode significantly improves the test efficiency.

[0057] Specifically, the tray recycling device can be a mechanical arm that grabs the edge of the empty tray and then moves to the test device entrance for placement. The tray recycling device can also be a conveyor belt.

[0058] In some optional embodiments, the taking-out device comprises a carrier conveying-out device, a qualified chip conveying-out device, and a taking-out mechanical arm group.

[0059] The taking-out mechanical arm group is used to move the chip carriers on the tray at the test device exit to the taking-out station, take the bare chips from the chip carriers, place the qualified bare chips on the qualified chip conveying-out device, and place the empty chip carriers on the carrier conveying-out device.

[0060] The qualified chip conveying-out device is used to send the qualified bare chips to the tape feeding and taking-out station.

[0061] The carrier conveying-out device is connected to the carrier conveying-in device, and the empty chip carriers are conveyed to the taking-out station by the carrier conveying-out device and the carrier conveying-in device.

[0062] In some optional embodiments, the taking-out device further comprises an NG chip conveying-out device, which is used to send the unqualified bare chips to the recycling station.

[0063] In some optional embodiments, the taking-out mechanical arm group comprises a third mechanical arm, a fourth mechanical arm, and a moving-out mechanical arm.

[0064] The third mechanical arm is used to suck the cover plate of the chip carrier to expose the bare chip inside the chip carrier.

[0065] The fourth mechanical arm is used for sucking the bare chips, and placing the qualified bare chips on the qualified chip conveying-out device or placing the unqualified bare chips on the NG chip carrier of the NG chip conveying-out device, wherein the NG chip carrier comprises a tray, a tape or a Frame.

[0066] The third mechanical arm is also used for covering the opening of the chip carrier with the cover plate after the bare chips are taken out from the chip carrier.

[0067] The moving-out mechanical arm is used for moving the chip carrier on the tray at the outlet of the testing device to the taking-out station and clamping the carrier body of the chip carrier, and releasing the chip carrier to the carrier conveying-out device after the opening of the chip carrier is covered with the cover plate.

[0068] The cover plate of the chip carrier is provided with a positioning mark, and the third mechanical arm can accurately suck the cover plate of the chip carrier through the positioning mark. The cavity inside the chip carrier is provided with a positioning mark, and the fourth mechanical arm can accurately take out the bare chips from the chip carrier through the positioning mark.

[0069] In some optional embodiments, the fourth mechanical arm is provided with a CCD camera, which is used for performing necessary appearance inspection on the front surface, the back surface and the side surface of the bare chip during the process of sucking the bare chip inside the chip carrier and placing the bare chip on the qualified chip conveying-out device, so as to ensure that the selected bare chip is not abnormal.

[0070] In some optional embodiments, the carrier conveying-in device comprises a first clamping assembly.

[0071] The first clamping assembly is used for clamping the chip carrier, and is released after the bare chip is placed in the chip carrier.

[0072] In some optional embodiments, the taking-and-placing mechanical arm group comprises a first mechanical arm and a second mechanical arm.

[0073] The first mechanical arm is used for sucking the cover plate of the chip carrier to expose the cavity inside the chip carrier.

[0074] The second mechanical arm is used for sucking the bare chip and placing the bare chip into the chip carrier from the opening of the chip carrier.

[0075] The first mechanical arm is also used for covering the opening of the chip carrier with the cover plate after the bare chip is placed into the chip carrier.

[0076] The first mechanical arm or the second mechanical arm is used for clamping the carrier body of the chip carrier after the first clamping assembly is released, and moving the chip carrier with the bare chip placed therein to the empty position of the tray at the inlet of the testing device.

[0077] In the technical solution, the carrier-in device has the first clamping assembly for clamping the carrier body of the chip carrier, and the first mechanical arm and the second mechanical arm can realize the process of taking out the bare chip from the chip carrier. After the bare chip is taken out from the chip carrier, the first mechanical arm and the second mechanical arm are in an idle state, and the first mechanical arm or the second mechanical arm can be used to move the chip carrier to the empty position of the tray at the entrance of the test equipment.

[0078] In some optional embodiments, the taking-out device comprises a carrier-out device, a qualified chip-out device, and a taking-out mechanical arm group.

[0079] The taking-out mechanical arm group is used to move the chip carrier on the tray at the exit of the test equipment to the taking-out station, take out the bare chip from the chip carrier, place the qualified bare chip on the qualified chip-out device, and place the empty chip carrier on the carrier-out device.

[0080] The qualified chip-out device is used to send the bare chip to the tape feeding station.

[0081] The carrier-out device comprises a second clamping assembly, and the second clamping assembly is used to clamp the carrier body of the chip carrier when the chip carrier is moved to the taking-out station.

[0082] The carrier-out device is connected with the carrier-in device, and the empty chip carrier is transmitted to the taking-out station through the carrier-out device and the carrier-in device.

[0083] In some optional embodiments, the taking-out mechanical arm group comprises a third mechanical arm and a fourth mechanical arm.

[0084] The third mechanical arm is used to suck the cover plate of the chip carrier to expose the bare chip inside the chip carrier.

[0085] The fourth mechanical arm is used to suck the bare chip, place the qualified bare chip on the qualified chip-out device, or place the unqualified bare chip on the NG chip carrier of the NG chip-out device. The NG chip carrier comprises a tray, a tape, or a Frame.

[0086] The third mechanical arm is also used to cover the opening of the chip carrier with the cover plate after the bare chip is taken out from the chip carrier.

[0087] The third mechanical arm or the fourth mechanical arm is also used to move the chip carrier on the tray at the exit of the test equipment to the taking-out station.

[0088] In some optional embodiments, the bare chip comprises an HBM chip, a 3D stacked chip, or an advanced process package chip. BRIEF DESCRIPTION OF DRAWINGS

[0089] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments of the present application. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be regarded as a limitation to the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0090] Figure 1 A schematic diagram of a chip automatic test system provided by the embodiments of the present application is shown in FIG. 1.

[0091] Figure 2 A schematic diagram of a test device provided by the embodiments of the present application is shown in FIG. 2.

[0092] Figure 3 A schematic diagram of a pick-and-place device provided by the first embodiment of the present application is shown in FIG. 3.

[0093] Figure 4 A schematic diagram of a pick-out device provided by the first embodiment of the present application is shown in FIG. 4.

[0094] Figure 5 A schematic diagram of a pick-and-place device provided by the second embodiment of the present application is shown in FIG. 5.

[0095] Figure 6 A schematic diagram of a pick-out device provided by the second embodiment of the present application is shown in FIG. 6.

[0096] FIG. 1: pick-and-place device, 11: carrier transmission-in device, 12: chip transmission-in device, 13: pick-and-place robot group, 131: first robot, 132: second robot, 133: moving-in robot, 2: test device, 21: tray transmission device, 22: test machine, 23: tray recycling device, 3: pick-out device, 31: carrier transmission-out device, 32: qualified chip transmission-out device, 33: NG chip transmission-out device, 34: pick-out robot group, 341: third robot, 342: fourth robot, 343: moving-out robot. DETAILED DESCRIPTION

[0097] The technical solutions of the embodiments of the present application will be described below in combination with the drawings in the embodiments of the present application.

[0098] Please refer to Figure 1 , Figure 1 A schematic diagram of a chip automatic test system provided by the embodiments of the present application is shown in FIG. 1. The system includes: pick-and-place device 1, test device 2 and pick-out device 3.

[0099] The pick-and-place device 1 is used to place the bare chips obtained by cutting the wafer into the corresponding chip carriers, and place the chip carriers with the bare chips on the empty positions of the tray at the entrance of the testing device 2. The testing device 2 is used to move the tray at the entrance of the testing device 2 to the testing station, and test the chip carriers on at least two placement areas of the tray; after testing, the tray is moved to the exit of the testing device 2. The taking-out device 3 is used to obtain the chip carriers on the tray at the exit of the testing device 2; the bare chips are taken out from the chip carriers, wherein the qualified bare chips enter the tape packaging link or are placed back on the Frame. The Frame is a structure obtained by cutting the wafer.

[0100] In the embodiments of the present application, by testing the individual bare chips after wafer cutting, the defects or unqualified products that may not be found in wafer-level testing can be more accurately identified. These defects may be introduced in the wafer cutting process, such as cutting damage, contamination, etc. Therefore, the testing method can effectively improve the yield of the final product, reduce the waste of resources and increase the cost caused by the inflow of unqualified bare chips into the subsequent production link. Moreover, through the pick-and-place device 1, the testing device 2 and the taking-out device 3, the automatic processing flow of "placing the bare chips in the chip carriers, then placing the chip carriers on the tray, testing in batches through the tray, and then taking out the bare chips from the chip carriers" can be realized, the processing speed is improved, and the labor cost and human errors are reduced.

[0101] The pick-and-place device provided in the embodiments of the present application comprises a carrier transmission device, a chip transmission device and a pick-and-place mechanical arm group; the carrier transmission device is used to transmit the chip carriers to the pick-and-place station; the chip transmission device is used to transmit the tape containing the bare chips or the Frame to the pick-and-place station; and the pick-and-place mechanical arm group is used to place the bare chips in the chip carriers at the pick-and-place station, and move the chip carriers with the bare chips to the tray at the entrance of the testing device.

[0102] In some optional embodiments, the pick-and-place mechanical arm group comprises a first mechanical arm, a second mechanical arm and a moving-in mechanical arm; the first mechanical arm is used to suck the cover plate of the chip carrier to expose the cavity inside the chip carrier; the second mechanical arm is used to suck the bare chips on the tape and place the bare chips into the chip carrier from the opening of the chip carrier; the first mechanical arm is further used to cover the opening of the chip carrier with the cover plate after the bare chips are placed into the chip carrier; and the moving-in mechanical arm is used to clamp the carrier body of the chip carrier, and move the chip carrier with the bare chips to the empty position of the tray at the entrance of the testing device after the opening of the chip carrier is covered with the cover plate.

[0103] In some optional embodiments, the second mechanical arm is provided with a CCD camera; the CCD camera is configured to perform necessary appearance inspection on the front surface, back surface and side surface of the bare chip during the process of picking up the bare chip and placing the bare chip into the chip carrier, so as to ensure that the picked bare chip is free of abnormalities.

[0104] In some optional embodiments, the pick-and-place mechanical arm group further comprises a turnover device; the second mechanical arm is configured to pick up the bare chip on the Frame, place the bare chip onto the turnover device to turn over the bare chip, pick up the turned-over bare chip and place the turned-over bare chip into the chip carrier from the opening of the chip carrier.

[0105] In some optional embodiments, the second mechanical arm comprises a pressure feedback monitoring module; during the process of placing the bare chip into the chip carrier, the pressure for pressing the bare chip is detected in real time according to the pressure feedback monitoring module and the pressing force is adjusted, so that the pressure is controlled to be less than or equal to a set value.

[0106] In some optional embodiments, the bottom plate surface of the chip carrier is provided with a positioning mark; the second mechanical arm places the bare chip into the chip carrier according to the positioning mark, wherein the positioning accuracy during the process of placing the bare chip into the chip carrier is less than 30 um.

[0107] Please refer to Figure 2 , Figure 2 a schematic diagram of a test device 2 provided in the embodiments of the present application.

[0108] In some optional embodiments, the test device 2 comprises a tray conveying device 21 and a test machine 22.

[0109] The tray conveying device 21 is configured to convey the tray at the entrance of the test device 2 to a test station; the test machine 22 is configured to perform chip testing on each chip carrier on the tray at the test station; and the tray conveying device 21 is further configured to convey the tray at the test station to the exit of the test device 2.

[0110] In the embodiments of the present application, the entire test process is realized in an automatic manner, i.e., the tray conveying device 21 conveys the tray from the entrance to the test station, the test machine 22 performs chip testing on the chip carrier on the tray, and then the tray conveying device 21 conveys the tested tray to the exit, which greatly reduces manual intervention and improves the test efficiency and accuracy.

[0111] Specifically, the tray is uniformly distributed with a plurality of placement areas, each of which is used to place a chip carrier, and the placement areas are numbered. The test machine 22 tests the chip carriers in each numbered placement area, and after testing, the chip carriers corresponding to the placement areas with different numbers are labeled as qualified or unqualified. For example, there are a total of eight placement areas, numbered 1-8, of which the first and second areas are unqualified, and the third, fourth, fifth, sixth, seventh and eighth areas are qualified. After subsequently grabbing the chip carriers in the first and second areas and removing the bare chips, the bare chips are unqualified chips. After subsequently grabbing the chip carriers in the third, fourth, fifth, sixth, seventh and eighth areas and removing the bare chips, the bare chips are qualified chips.

[0112] In some optional embodiments, the test device 2 further comprises a tray recycling device 23, which is used to move the empty tray to the entrance of the test device 2 after all the chip carriers on the tray at the exit of the test device 2 are removed.

[0113] In the embodiments of the present application, the tray conveying device 21 can continuously convey the tray from the entrance of the test device 2 to the test station, and the test machine 22 efficiently tests the chip carriers on the tray that reaches the test station. After testing, the tray conveying device 21 quickly conveys the tray to the exit, preparing for the next test cycle. This continuous operation mode significantly improves the test efficiency.

[0114] Specifically, the tray recycling device 23 can be a mechanical arm that grabs the edge of the empty tray and then moves to the entrance of the test device 2 for placement.

[0115] Please refer to Figure 3 , Figure 3 The schematic diagram of the pick-and-place device 1 provided in the first embodiment of the present application.

[0116] In some optional embodiments, the pick-and-place device 1 comprises a carrier conveying-in device 11, a chip conveying-in device 12, and a pick-and-place mechanical arm group 13.

[0117] The carrier conveying-in device 11 is used to convey the chip carriers to the pick-and-place station; the chip conveying-in device 12 is used to convey the bare chips to the pick-and-place station when the bare chips need to be tested, and convey the bare chips to the tape pick-and-place station when the bare chips do not need to be tested; the pick-and-place mechanical arm group 13 is used to place the bare chips in the pick-and-place station into the chip carriers in the pick-and-place station, and move the chip carriers with the bare chips to the tray at the entrance of the test device 2.

[0118] In the embodiment of the present application, the carrier incoming device 11 and the chip incoming device 12 are, for example, a conveyor belt, and the carrier incoming device 11 stops when the chip carrier is conveyed to the pick-and-place station, and the chip incoming device 12 also stops when the corresponding bare chip is conveyed to the pick-and-place station. Then, the bare chip is placed into the chip carrier by the pick-and-place robot, and the chip carrier with the bare chip placed therein is placed on the empty slot of the tray at the entrance of the test equipment 2. After that, the carrier incoming device 11 and the chip incoming device 12 are started, and the above process is repeated until a set number of chip carriers are placed on the tray at the entrance of the test equipment 2. The tray is sent into the test equipment 2 for chip testing, and the empty tray is placed at the entrance of the test equipment 2 to fill the next tray.

[0119] In some optional embodiments, the pick-and-place robot group 13 includes a first robot 131, a second robot 132, and a moving-in robot 133. The first robot 131 is used to suck the cover plate of the chip carrier to expose the cavity inside the chip carrier. The second robot 132 is used to suck the bare chip and place the bare chip into the chip carrier from the opening of the chip carrier. The first robot 131 is also used to cover the opening of the chip carrier with the cover plate after the bare chip is placed into the chip carrier. The moving-in robot 133 is used to clamp the carrier body of the chip carrier, and move the chip carrier with the bare chip placed therein to the empty slot of the tray at the entrance of the test equipment 2 after the opening of the chip carrier is covered with the cover plate.

[0120] In the embodiment of the present application, the cover plate of the chip carrier has a positioning mark, and the first robot 131 accurately sucks the cover plate of the chip carrier through the positioning mark. The bare chip also has a positioning mark, and the second robot 132 accurately sucks the bare chip through the positioning mark. The cavity inside the chip carrier has a positioning mark, and the second robot 132 can accurately place the bare chip into the chip carrier through the positioning mark. The second robot 132 has a pressure feedback monitoring module, which detects the feedback pressure in real time and adjusts the force when the bare chip is placed into the chip carrier, so as to avoid damaging the bare chip.

[0121] In the embodiment of the present application, the carrier body of the chip carrier on the pick-and-place station is clamped by the moving-in robot 133, the cover plate of the chip carrier is sucked by the first robot 131, the bare chip is sucked and placed into the chip carrier by the second robot 132, the opening of the chip carrier is covered with the cover plate by the first robot 131, and finally, the chip carrier is moved to the empty slot of the tray at the entrance of the test equipment 2 by the moving-in robot 133 and released.

[0122] Specifically, the mechanical arm is usually composed of a controller, a driver, an arm, an end effector and the like. In the process of sucking the chip (or cover plate), the mechanical arm mainly relies on its end effector, which usually contains a suction cup or other precision clamp, for accurately picking up, transporting and placing the chip from the production line to the designated position. The mechanical arm works by negative pressure suction, that is, the chip (or cover plate) is adsorbed on the suction cup by the principle of the suction cup, and the chip (or cover plate) is transported through the extension, rotation and lifting of the arm.

[0123] Please refer to Figure 4 , Figure 4 The schematic diagram of the taking-out device 3 provided in the first embodiment of the present application is shown in FIG. 1.

[0124] In some optional embodiments, the taking-out device 3 comprises a carrier transmission device 31, a qualified chip transmission device 32, an NG chip transmission device 33 and a taking-out mechanical arm group 34.

[0125] The taking-out mechanical arm group 34 is used to move the chip carrier on the tray at the outlet of the testing device 2 to a taking-out station, and take out the bare chips from the chip carrier, place the qualified bare chips on the qualified chip transmission device 32, place the unqualified bare chips on the NG chip transmission device 33, and place the empty chip carrier on the carrier transmission device 31.

[0126] The qualified chip transmission device 32 is used to send the bare chips to a tape feeding and taking-out station. The NG chip transmission device 33 is used to send the bare chips to a recycling station. The carrier transmission device 31 is connected with the carrier transmission-in device 11, and the empty chip carrier is transmitted to the taking-out station through the carrier transmission device 31 and the carrier transmission-in device 11.

[0127] In some optional embodiments, the taking-out mechanical arm group 34 comprises a third mechanical arm 341, a fourth mechanical arm 342 and a moving-out mechanical arm 343.

[0128] The third mechanical arm 341 is used to suck the cover plate of the chip carrier to expose the bare chips inside the chip carrier. The fourth mechanical arm 342 is used to suck the bare chips, and place the qualified bare chips on the qualified chip transmission device 32 or place the unqualified bare chips on the NG chip transmission device 33. The third mechanical arm 341 is also used to cover the opening of the chip carrier with the cover plate after the bare chips are taken out from the chip carrier. The moving-out mechanical arm 343 is used to move the chip carrier on the tray at the outlet of the testing device 2 to the taking-out station, and clamp the carrier body of the chip carrier; after the opening of the chip carrier is covered with the cover plate, the chip carrier is released onto the carrier transmission device 31.

[0129] The cover plate of the chip carrier has positioning marks, and the third mechanical arm 341 accurately sucks the cover plate of the chip carrier through the positioning marks. The cavity inside the chip carrier has positioning marks, and the fourth mechanical arm 342 can accurately take out the bare chip from the chip carrier through the positioning marks.

[0130] In some optional embodiments, a CCD camera is arranged on the fourth mechanical arm; the CCD camera is used to perform necessary appearance inspection on the front, back and side of the bare chip during the process of sucking the bare chip inside the chip carrier and placing the bare chip into the qualified chip delivery device, so as to ensure that the selected bare chip is not abnormal.

[0131] Please refer to Figure 5 , Figure 5 The taking and placing equipment 1 provided for the second embodiment of the application is shown in the schematic diagram. The difference from the first embodiment is that the carrier delivery device 11 of the embodiment includes a first clamping assembly.

[0132] The first clamping assembly is used to clamp the chip carrier; the first clamping assembly is released after the bare chip is placed into the chip carrier.

[0133] In some optional embodiments, the taking and placing mechanical arm group 13 includes a first mechanical arm 131 and a second mechanical arm 132.

[0134] The first mechanical arm 131 is used to suck the cover plate of the chip carrier to expose the cavity inside the chip carrier. The second mechanical arm 132 is used to suck the bare chip and place the bare chip into the chip carrier from the opening of the chip carrier. The first mechanical arm 131 is also used to cover the opening of the chip carrier with the cover plate after the bare chip is placed into the chip carrier. The first mechanical arm 131 or the second mechanical arm 132 is used to clamp the carrier body of the chip carrier; after the opening of the chip carrier is covered with the cover plate, the chip carrier with the bare chip placed therein is moved to the empty position of the tray at the entrance of the testing equipment 2.

[0135] In the embodiment of the application, since the carrier delivery device 11 has the first clamping assembly for clamping the carrier body of the chip carrier, the first mechanical arm 131 and the second mechanical arm 132 can realize the process of taking out the bare chip from the chip carrier. After the bare chip is taken out from the chip carrier, the first mechanical arm 131 and the second mechanical arm 132 are in an idle state, and the first mechanical arm 131 or the second mechanical arm 132 can be used to move the chip carrier to the empty position of the tray at the entrance of the testing equipment 2.

[0136] Please refer to Figure 6 , Figure 6 The taking-out equipment provided for the second embodiment of the application is shown in the schematic diagram.

[0137] In some optional embodiments, the taking-out device 3 comprises a carrier conveying-out device 31, a qualified chip conveying-out device 32, an NG chip conveying-out device 33 and a taking-out robot group 34.

[0138] The taking-out robot group 34 is used to move the chip carrier on the tray at the outlet of the testing device 2 to a taking-out station, take out the bare chips from the chip carrier, place the qualified bare chips on the qualified chip conveying-out device 32, place the unqualified bare chips on the NG chip conveying-out device 33, and place the empty chip carrier on the carrier conveying-out device 31. The taking-out robot group 34 in the embodiment comprises a third robot arm 341 and a fourth robot arm 342.

[0139] The qualified chip conveying-out device 32 is used to send the bare chips to a tape feeding station, and the NG chip conveying-out device 33 is used to send the bare chips to a recycling station.

[0140] The carrier conveying-out device 31 comprises a second clamping assembly, which is used to clamp the carrier body of the chip carrier when the chip carrier is moved to the taking-out station. The carrier conveying-out device 31 is connected with the carrier conveying-in device 11, and the empty chip carrier is conveyed to the taking-and-feeding station through the carrier conveying-out device 31 and the carrier conveying-in device 11.

[0141] In some optional embodiments, the taking-out robot group comprises a third robot arm and a fourth robot arm. The third robot arm is used to suck the cover plate of the chip carrier to expose the bare chips inside the chip carrier. The fourth robot arm is used to suck the bare chips, place the qualified bare chips on the qualified chip conveying-out device, or place the unqualified bare chips on the NG chip carrier of the NG chip conveying-out device. The NG chip carrier comprises a tray, a tape or a Frame. The third robot arm is also used to cover the opening of the chip carrier with the cover plate after the bare chips are taken out from the chip carrier. The third robot arm or the fourth robot arm is also used to move the chip carrier on the tray at the outlet of the testing device to the taking-out station.

[0142] In some optional embodiments, the bare chips comprise HBM chips, 3D stacked chips or advanced process package chips.

[0143] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other manners. The above-described device embodiments are merely schematic. For example, the division of the units is only a logical function division. There can be another division manner in actual implementation. For example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections between the units can be indirect couplings or communication connections through some interfaces, devices or units, and can be electrical, mechanical or in other forms.

[0144] In addition, the units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, i.e., may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0145] Furthermore, the functional modules in each embodiment of the present application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0146] In this paper, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations.

[0147] The above is only an embodiment of the present application and is not used to limit the protection scope of the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A pick-and-place apparatus, characterized by The chip testing device comprises a carrier conveying device, a chip conveying device and a pick-and-place robot group. The carrier conveying device is used for conveying a chip carrier to a pick-and-place station. The chip conveying device is used for conveying a tape or a Frame containing bare chips to the pick-and-place station, wherein the Frame is a structure obtained by cutting a wafer. The pick-and-place robot group is used for placing the bare chips in the pick-and-place station into the chip carrier in the pick-and-place station, and moving the chip carrier with the bare chips to a tray at an entrance of a testing device. The testing device directly tests the chip carrier on the tray. The pick-and-place robot group comprises a first robot, a second robot and a moving-in robot. The first robot is used for sucking a cover plate of the chip carrier to expose a cavity in the chip carrier. The second robot is used for sucking the bare chips on the tape and placing the bare chips into the chip carrier from an opening of the chip carrier.

2. The pick-and-place apparatus of claim 1, wherein, The first robot is further used for covering the opening of the chip carrier with the cover plate after the bare chips are placed into the chip carrier.

3. The pick-and-place apparatus of claim 1, wherein, The moving-in robot is used for clamping a carrier body of the chip carrier and moving the chip carrier with the bare chips to an empty position of the tray at the entrance of the testing device after the opening of the chip carrier is covered with the cover plate. Alternatively, the pick-and-place robot group comprises the first robot and the second robot.

4. The pick-and-place apparatus of claim 1, wherein, The carrier conveying device comprises a first clamping assembly.

5. The pick-and-place apparatus of claim 1, wherein, The first clamping assembly is used for clamping the chip carrier. The first clamping assembly is released after the bare chips are placed into the chip carrier. The first robot is used for sucking the cover plate of the chip carrier to expose the cavity in the chip carrier. The second robot is used for sucking the bare chips and placing the bare chips into the chip carrier from the opening of the chip carrier. The first robot is further used for covering the opening of the chip carrier with the cover plate after the bare chips are placed into the chip carrier. The first robot or the second robot is used for clamping the carrier body of the chip carrier and moving the chip carrier with the bare chips to the empty position of the tray at the entrance of the testing device after the first clamping assembly is released. A CCD camera is arranged on the second robot. The CCD camera is used for appearance detection of the bare chips during the process of sucking the bare chips and placing the bare chips into the chip carrier. The pick-and-place robot group further comprises a turnover device. The second robot is used for sucking the bare chips on the Frame, placing the bare chips on the turnover device for turnover, sucking the turned-over bare chips and placing the turned-over bare chips into the chip carrier from the opening of the chip carrier. The second robot comprises a pressure feedback monitoring module. During the process of placing the bare chips into the chip carrier, the pressure feedback monitoring module is used for real-time detection of the pressure for pressing the bare chips and force adjustment, so that the pressure is controlled to be less than or equal to a set value. A bottom plate surface of the chip carrier has a positioning mark. The second robot places the bare chips into the chip carrier according to the positioning mark, and positioning accuracy during the process of placing the bare chips into the chip carrier is less than 30 um.

6. The pick-and-place apparatus of claim 1, wherein, The chip incoming device is used to transfer the bare chips to the pick-and-place station when the bare chips need to be tested, and is used to transfer the bare chips to the tape-and-reel station when the bare chips do not need to be tested.

7. A chip automatic testing system, characterized by, The device comprises: a pick-and-place device according to any one of claims 1-6, and a testing device and a taking-out device; the testing device is used to move the tray at the testing device entrance to the testing station, test the chip carriers on at least two placement areas of the tray, and move the tray to the testing device exit after testing; the taking-out device is used to obtain the chip carriers on the tray at the testing device exit, and take out the bare chips from the chip carriers, wherein the qualified bare chips enter the tape-and-reel process, or are placed back to the Frame or tray.

8. The system of claim 7, wherein, The testing device comprises a tray conveying device and a testing machine. The tray conveying device is used to transfer the tray at the testing device entrance to the testing station. The testing machine is used to test the chips on each chip carrier on the tray at the testing station. The tray conveying device is also used to transfer the tray at the testing station to the testing device exit.

9. The system of claim 7, wherein, The testing device further comprises a tray recycling device. The tray recycling device is used to move the empty tray to the testing device entrance after all the chip carriers on the tray at the testing device exit are removed.

10. The system of claim 9, wherein, The tray recycling device comprises a conveyor belt or a mechanical arm.

11. The system of claim 7, wherein, The taking-out device comprises a carrier outgoing device, a qualified chip outgoing device and a taking-out mechanical arm group. The taking-out mechanical arm group is used to move the chip carriers on the tray at the testing device exit to the taking-out station, take out the bare chips from the chip carriers, place the qualified bare chips on the qualified chip outgoing device, and place the empty chip carriers on the carrier outgoing device. The qualified chip outgoing device is used to send the qualified bare chips to the tape-and-reel pick-and-place station. The carrier outgoing device is connected with the carrier incoming device, and the empty chip carriers are transferred to the pick-and-place station through the carrier outgoing device and the carrier incoming device.

12. The system of claim 11, wherein, The taking-out device further comprises an NG chip outgoing device.

13. The system of claim 11, wherein, The NG chip outgoing device is used to send the unqualified bare chips to the recycling station. The taking-out mechanical arm group comprises a third mechanical arm, a fourth mechanical arm and a moving-out mechanical arm. The third mechanical arm is used to suck the cover plate of the chip carrier, and expose the bare chips inside the chip carrier. The fourth mechanical arm is used to suck the bare chips, and place the qualified bare chips on the qualified chip outgoing device, or place the unqualified bare chips on the NG chip carrier of the NG chip outgoing device; wherein the NG chip carrier comprises a tray, a tape or a Frame. The third mechanical arm is also used to cover the opening of the chip carrier with the cover plate after the bare chips are taken out from the chip carrier. The moving-out mechanical arm is used to move the chip carriers on the tray at the testing device exit to the taking-out station, clamp the carrier body of the chip carrier, and release the chip carrier to the carrier outgoing device after the opening of the chip carrier is covered with the cover plate.

14. The system of claim 13, wherein, The fourth mechanical arm is provided with a CCD camera; the CCD camera is used for appearance detection of the bare chips during the process of sucking the bare chips inside the chip carrier and placing the bare chips to the qualified chip delivery device.

15. The system of claim 7, wherein, The taking-out device comprises a carrier delivery device, a qualified chip delivery device and a taking-out mechanical arm group; The taking-out mechanical arm group is used for moving the chip carrier on the tray at the outlet of the test device to the taking-out station, taking out the bare chips from the chip carrier, placing the qualified bare chips to the qualified chip delivery device and placing the empty chip carrier to the carrier delivery device; The qualified chip delivery device is used for sending the bare chips to the tape feeding and taking-out station; The carrier delivery device comprises a second clamping assembly; the second clamping assembly is used for clamping the carrier body of the chip carrier when the chip carrier is moved to the taking-out station; The carrier delivery device is connected with the carrier delivery-in device, and the empty chip carrier is transmitted to the taking-out station through the carrier delivery device and the carrier delivery-in device.

16. The system of claim 15, wherein, The taking-out mechanical arm group comprises a third mechanical arm and a fourth mechanical arm; The third mechanical arm is used for sucking the cover plate of the chip carrier to expose the bare chips inside the chip carrier; The fourth mechanical arm is used for sucking the bare chips, placing the qualified bare chips to the qualified chip delivery device or placing the unqualified bare chips to the NG chip carrier of the NG chip delivery device; wherein the NG chip carrier comprises a tray, a tape or a Frame; The third mechanical arm is also used for covering the opening of the chip carrier with the cover plate after the bare chips are taken out from the chip carrier; The third mechanical arm or the fourth mechanical arm is also used for moving the chip carrier on the tray at the outlet of the test device to the taking-out station.

17. The system of claim 7, wherein, The bare chips comprise HBM chips, 3D stacked chips or advanced process package chips.

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