Wafer test equipment

Abstract

The invention provides wafer testing equipment, and relates to the technical field of wafer testing. The first sliding rail assembly is installed on the bearing table. The probe seat group is installed on the first sliding rail assembly and comprises at least one probe seat sliding in the extending direction of the first sliding rail assembly, and each probe seat comprises a probe assembly, a PCB and a cable assembly. One end of the cable assembly is connected with the PCB, and the other end of the cable assembly is connected with the testing machine. And the probe assembly is detachably connected with the PCB and is used for being in contact with a tested chip on the wafer to be tested. According to the technical scheme, on one hand, a plurality of tested chips are tested at the same time through a plurality of probe seats, and the test efficiency of the chips can be improved; and on the other hand, when the probe assembly is replaced, the cable assembly does not need to be disassembled, and only the probe assembly needs to be disassembled and replaced, so that the probe card can be prevented from being damaged, the replacement time of the probe card is saved, and the test efficiency of the tested chip is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer testing, and in particular to a wafer testing device. Background Art

[0002] Normally, functional tests are required for the chips on the wafer, and a probe holder is generally used to contact the pad on the chip to obtain the chip signal. Conventional multi-pin pin cards have their own cables, and the other end of the cable is connected to the tester. The multi-pin pin card is installed from bottom to top. The number of pin cards is generally 10-16. When disassembling and assembling a multi-pin pin card, it is necessary to disassemble and assemble it from the source meter end of the tester, which makes it easy for the pin card to have the cable solder joints fall off due to external force during use, causing damage to the pin card, increasing the risk of damage to the pin card during replacement, and replacing the pin card takes a long time, affecting the wafer test efficiency. Summary of the invention

[0003] An object of the present invention is to provide a wafer testing device to solve the technical problems in the prior art that the needle card is easily damaged during the needle card replacement process and it takes a long time, resulting in low wafer testing efficiency.

[0004] A further object of the present invention is to simplify the structure of wafer testing equipment.

[0005] Another object of the present invention is to improve the convenience of replacing the probe assembly.

[0006] In particular, the present invention provides a wafer testing device, comprising:

[0007] Loading platform;

[0008] A testing device, the testing device is located below the carrying platform, and the testing device is used to place the wafer to be tested;

[0009] at least one first slide rail assembly, wherein the first slide rail assembly is mounted on the bearing platform;

[0010] At least one probe seat group is installed on the first slide rail assembly and includes at least one probe seat sliding along the extension direction of the first slide rail assembly, the probe seat includes a probe assembly, a PCB board and a cable assembly; one end of the cable assembly is connected to the PCB board, and the other end is connected to the tester; the probe assembly is detachably connected to the PCB board and is used to contact the chip to be tested on the wafer to be tested.

[0011] Optionally, the first slide rail assembly includes a support plate, the interior of the support plate is provided with at least one first channel for conveying protective gas, and the surface of the support plate has at least one gas outlet hole communicating with the first channel;

[0012] The probe assembly is close to the air outlet.

[0013] Optionally, there are multiple air outlet holes, which are divided into at least one group of air outlet holes, and at least one group of air outlet holes is arranged on a side of the support plate close to the probe assembly and has multiple air outlet holes arranged at intervals along the extension direction of the support plate.

[0014] Optionally, at least one second channel is provided inside or at the bottom of the support plate, and the second channel is used for conveying cooling liquid or cooling gas.

[0015] Optionally, there are multiple first slide rail assemblies, and the multiple first slide rail assemblies are arranged on the bearing platform at intervals along the first direction, and each of the first slide rail assemblies extends along a second direction perpendicular to the first direction;

[0016] There are multiple probe seat groups, each of which is mounted on a corresponding first slide rail assembly, and each of which includes multiple probe seats.

[0017] Optionally, it also includes:

[0018] A pair of second slide rail assemblies, the pair of second slide rail assemblies extend along the first direction, each of the first slide rail assemblies is located between the pair of second slide rail assemblies, and both ends are respectively slidably connected to one of the second slide rail assemblies.

[0019] Optionally, it also includes:

[0020] A plurality of flipping assemblies, each of which is mounted at an end of the first slide rail assembly, and the flipping assemblies are configured to controllably drive the corresponding first slide rail assembly to rotate a preset angle relative to the second slide rail assembly to facilitate replacement of the probe assembly.

[0021] Optionally, each of the probe seats further comprises an adjusting component, the adjusting component being used to controllably adjust the position of the PCB board, thereby adjusting the position of the probe assembly, the adjusting component comprising:

[0022] An X-axis adjustment module, the X-axis adjustment module is slidably connected to the corresponding first slide rail assembly and is used for controlling the position of the PCB board in the X-axis direction;

[0023] A Y-axis adjustment module, which is installed above the X-axis adjustment module and is used to controllably adjust the position of the PCB board in the Y-axis direction;

[0024] A Z-axis adjustment module is connected to the Y-axis adjustment module and is used for controlling the position of the PCB board in the Z-axis direction.

[0025] Optionally, the adjustment component further includes:

[0026] A TZ-axis adjustment module, which is installed above the Y-axis adjustment module and is used to controllably drive the PCB to rotate a preset angle in the TZ direction to adjust the position of the PCB. The Z-axis adjustment module is installed in front of the TZ-axis adjustment module;

[0027] A TX axis adjustment module is installed on the front side of the Z axis adjustment module, and is used to controllably drive the PCB board to rotate a preset angle in the TX direction to adjust the position of the PCB board.

[0028] Optionally, each of the probe seats further comprises a limit assembly, and the limit assembly comprises:

[0029] A handle, the handle is rotatably connected to the adjustment assembly, the handle has an operating portion and an abutting portion abutting against the first slide rail assembly, the operating portion is configured to rotate the handle when operated, thereby driving the abutting portion to separate from the first slide rail assembly, so that the probe seat is in a free state;

[0030] A first elastic member, one end of which is connected to the handle, and the other end of which is connected to the adjustment assembly, the first elastic member is used to drive the handle to reset so that the abutting portion abuts against the first slide rail assembly, thereby placing the probe seat in a locked state.

[0031] The wafer testing equipment in the present invention comprises a loading platform, a testing device, at least one first slide rail assembly and at least one group of probe seat groups, and the first slide rail assembly is mounted on the loading platform. The probe seat group is mounted on the first slide rail assembly and comprises at least one probe seat sliding along the extension direction of the first slide rail assembly, and the probe seat comprises a probe assembly, a PCB board and a cable assembly. One end of the cable assembly is connected to the PCB board, and the other end is connected to the tester. The probe assembly is detachably connected to the PCB board and is used to contact the chip under test on the wafer to be tested. On the one hand, the above technical scheme tests multiple chips under test simultaneously through multiple probe seats, which can improve the test efficiency of the chip. On the other hand, when replacing the probe assembly, it is not necessary to disassemble the cable assembly, and it is only necessary to disassemble and replace the probe assembly, which can avoid damage to the pin card, and save the replacement time of the pin card, further improving the test efficiency of the chip under test.

[0032] Furthermore, the first slide rail assembly in the present invention includes a support plate, the interior of the support plate is provided with at least one first channel for conveying protective gas, the surface of the support plate has at least one gas outlet connected to the first channel, and the probe assembly is close to the gas outlet. The above technical solution eliminates the additional pipeline for conveying protective gas, and cleverly sets an airway for conveying protective gas inside the support plate. On the one hand, it can provide an inert gas environment for the wafer to be tested, and simplifies the structure of the wafer testing equipment, saving layout space. On the other hand, the probe assembly is placed close to the gas outlet, and the protective gas blown out from the gas outlet can also dissipate heat for the probe assembly, avoiding damage to the probe assembly due to being in a high-temperature test environment for a long time, thereby increasing the service life of the probe assembly.

[0033] Furthermore, the wafer testing device of the present invention further comprises a plurality of flipping assemblies, each of which is mounted at the end of the first slide rail assembly, and the flipping assemblies are configured to controllably drive the corresponding first slide rail assembly to rotate a preset angle relative to the second slide rail assembly, so as to facilitate replacement of the probe assembly. The above technical solution can realize the flipping of the first slide rail assembly through the flipping assemblies, thereby facilitating the operator to operate from above and replace the probe assembly, thereby improving convenience.

[0034] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0036] Figure 1 is a schematic structural diagram of a wafer testing device according to an embodiment of the present invention;

[0037] Figure 2 is a schematic partial enlarged diagram of a wafer testing device according to an embodiment of the present invention;

[0038] Figure 3 is a schematic installation diagram of a probe assembly, a first slide rail assembly, and a second slide rail assembly in a wafer testing device according to an embodiment of the present invention;

[0039] Figure 4 is a schematic structural diagram of a probe seat installed on a first slide rail assembly according to an embodiment of the present invention;

[0040] Figure 5 is a schematic structural diagram of a probe base at an angle according to an embodiment of the present invention;

[0041] Figure 6 is a schematic structural diagram of a probe base according to another angle of an embodiment of the present invention;

[0042] Figure 7 is a schematic structural diagram of an angle of a support plate in a first slide rail assembly according to an embodiment of the present invention;

[0043] Figure 8 is a schematic structural diagram of a support plate and a sealing plate in a first slide rail assembly according to an embodiment of the present invention;

[0044] Fig. 9 is a schematic structural diagram of a support plate in a first slide rail assembly according to an embodiment of the present invention at another angle;

[0045] Fig.10 is a schematic structural diagram of a first slide rail assembly after flipping according to an embodiment of the present invention;

[0046] Fig.11 is a schematic structural diagram of a probe base according to another embodiment of the present invention from another angle;

[0047] Fig.12 is a schematic structural diagram of a probe seat according to another embodiment of the present invention;

[0048] Reference numerals:

[0049] 1000-wafer test equipment, 100-probe seat, 200-first slide rail assembly, 300-wafer to be tested, 400-shielding plate, 500-visual device, 600-carrying table, 700-testing device, 800-second slide rail assembly, 210-support plate, 211-first channel, 212-air outlet, 213-second channel, 220-sealing plate, 10-PCB board, 20-probe assembly, 21-substrate, 22-probe head, 30-adjustment assembly, 31-X-axis adjustment module, 32-Y-axis adjustment module, 33-TZ-axis adjustment module, 34-Z-axis adjustment module, 35-TX-axis adjustment module, 311-first bottom plate, 312- The first knob, 313-the first slide rail, 314-the first slide plate, 315-the bump, 316-the second elastic member, 321-the second knob, 322-the second slide rail, 323-the second slide plate, 324-the third elastic member, 331-the second bottom plate, 332-the first rotating plate, 333-the third knob, 334-the first part, 335-the second part, 336-the fourth elastic member, 341-the fourth knob, 342-the third slide rail, 343-the third slide plate, 351-the fifth knob, 352-the second rotating plate, 23-the connecting member, 40-the limiting assembly, 41-the abutting part, 42-the operating part, 43-the first elastic member, 44-the rotating shaft, 50-the bolt. DETAILED DESCRIPTION

[0050] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0051] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "left", "right", "front", "back", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0052] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or some of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.

[0053] Unless otherwise clearly defined and limited, the terms "connection", "installation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. A person skilled in the art should be able to understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0054] Unless otherwise defined, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0055] Figure 1 is a schematic structural diagram of a wafer testing device 1000 according to an embodiment of the present invention, Figure 2 is a schematic partial enlarged diagram of a wafer testing device 1000 according to an embodiment of the present invention, Figure 32 is a schematic installation diagram of a probe assembly 20, a first slide rail assembly 200 and a second slide rail assembly 800 in a wafer testing device 1000 according to an embodiment of the present invention. Figure 4 is a schematic structural diagram of a probe seat 100 installed on a first slide rail assembly 200 according to an embodiment of the present invention, Figure 5 is a schematic structural diagram of a probe seat 100 at one angle according to an embodiment of the present invention, Figure 6 FIG. 1 is a schematic structural diagram of a probe seat 100 according to another embodiment of the present invention. Figures 1 to 6 As shown, in a specific embodiment, the wafer testing equipment 1000 includes a carrier 600, a test device 700, at least one first slide rail assembly 200 and at least one probe seat group. The test device 700 is located below the carrier 600, and a wafer 300 to be tested is placed on the test device 700. The first slide rail assembly 200 is mounted on the carrier 600. The probe seat group is mounted on the first slide rail assembly 200, and includes at least one probe seat 100 sliding along the extension direction of the first slide rail assembly 200, and the probe seat 100 includes a probe assembly 20, a PCB board 10 and a cable assembly. One end of the cable assembly is connected to the PCB board 10, and the other end is connected to the tester. The probe assembly 20 is detachably connected to the PCB board 10 and is used to contact the chip to be tested on the wafer 300 to be tested. Here, the protective gas can be an inert gas, such as nitrogen. The interior of the test device 700 has a heating component to perform a high temperature test on the wafer 300 to be tested.

[0056] On the one hand, this embodiment can improve the test efficiency of the chips by testing multiple chips under test simultaneously through multiple probe seats 100. On the other hand, when replacing the probe assembly 20, it is not necessary to disassemble the cable assembly, but only to disassemble and replace the probe assembly 20, which can avoid damage to the needle card and save the replacement time of the needle card, further improving the test efficiency of the chip under test.

[0057] Generally, in order to ensure the accuracy of test data during the test of multiple chips on the wafer 300, an inert gas environment needs to be provided for the wafer 300. In the prior art, a separate gas supply pipeline needs to be set up to provide an inert gas environment for the wafer 300, resulting in a complex structure of the wafer testing device 1000.

[0058] Figure 7 is a schematic structural diagram of a support plate 210 in a first slide rail assembly 200 according to an embodiment of the present invention at an angle. Figure 8 FIG. 2 is a schematic structural diagram of a support plate 210 and a sealing plate 220 in a first slide rail assembly 200 according to an embodiment of the present invention. Figure 7 and Figure 8As shown, in some embodiments, the first rail assembly 200 includes a support plate 210, the support plate 210 has at least one first channel 211 for conveying protective gas, and the surface of the support plate 210 has at least one gas outlet 212 connected to the first channel 211. The probe assembly 20 is close to the gas outlet 212.

[0059] This embodiment eliminates the additional pipeline for conveying protective gas, and cleverly sets an air duct for conveying protective gas inside the support plate 210. On the one hand, it can provide an inert gas environment for the wafer 300 to be tested and save layout space. On the other hand, the probe assembly 20 is placed close to the air outlet 212. The protective gas blown out from the air outlet 212 can also dissipate heat for the probe assembly 20, thereby preventing the probe assembly 20 from being damaged due to being in a high-temperature test environment for a long time, thereby increasing the service life of the probe assembly 20.

[0060] In some embodiments, the number of the air outlet holes 212 is multiple, and the multiple air outlet holes 212 are divided into at least one group of air outlet holes, and the at least one group of air outlet holes is arranged on a side of the support plate 210 close to the probe assembly 20, and has multiple air outlet holes 212 arranged at intervals along the extension direction of the support plate 210, see Figure 4 .

[0061] In other embodiments, there are two groups of gas outlet holes, and the two groups of gas outlet holes are respectively arranged on two opposite sides of the support plate 210, so as to increase the input amount of the protective gas.

[0062] In some embodiments, the first slide rail assembly 200 further includes a pair of first slide rails, the pair of first slide rails are mounted on the support plate 210, and the corresponding probe seat assembly is slidably mounted on the pair of first slide rails.

[0063] The small slide used in the standard needle holder has not been specifically tested for the testing requirements in a long-term high-temperature environment. This will cause the needle card to move in the XY horizontal direction during the high-temperature wafer testing, causing fluctuations in the test data and damage to the needle card.

[0064] Fig. 9 FIG. 2 is a schematic structural diagram of the support plate 210 in the first slide rail assembly 200 according to another embodiment of the present invention. Fig. 9As shown, in a preferred embodiment, at least one second channel 213 is provided inside or at the bottom of the support plate 210, and the second channel 213 is used to transport cooling liquid or cooling gas, so that the support plate 210 can be cooled during the high-temperature test of the wafer 300 to prevent the support plate 210 from expanding and deforming, causing the probe seat 100 to be displaced, and affecting the test effect. Here, it can be understood that the support plate 210 adopts a dual-channel design, and the cooling liquid or cooling gas transported by the second channel 213 is transported to the outside of the wafer testing equipment 1000, and the cooling liquid or cooling gas circulates to take away the heat of the support plate 210. The protective gas transported by the first channel 211 is blown into the interior of the wafer testing equipment 1000, thereby providing an inert gas environment for the wafer 300 to be tested, and preventing the wafer 300 to be tested from oxidizing. When the second channel 213 is set at the bottom of the support plate 210, see Figure 5 and Figure 6 , it is necessary to set a sealing plate 220 below the support plate 210 to seal the second channel 213. However, when the second channel 213 is arranged inside the support plate 210, it is not necessary to set the sealing plate 220.

[0065] In a preferred embodiment, the first slide rail assembly 200 is made of metal or ceramic material with extremely low thermal expansion coefficient, such as Invar alloy. Due to the temperature control in the form of liquid cooling, the equipment will vibrate at the moment of temperature control startup, thereby affecting the test. At the same time, the liquid cooling pipeline has high requirements for the sealing environment, and after aging during long-term high-temperature testing, the risk of liquid leakage will be greatly increased. Therefore, in a preferred embodiment, the second channel 213 transports gas for cooling.

[0066] In some embodiments, the number of the first rail assembly 200 is multiple, and the multiple first rail assemblies 200 are arranged on the carrier 600 at intervals along the first direction, and each first rail assembly 200 extends along a second direction perpendicular to the first direction. The number of probe seat groups is multiple, and each probe seat group is correspondingly installed on a first rail assembly 200, and each probe seat group includes multiple probe seats 100. Here, the first direction can be the front-to-back direction of the wafer testing equipment 1000, and the second direction can be the left-to-right direction of the wafer testing equipment 1000. In other embodiments, the first direction can be the left-to-right direction of the wafer testing equipment 1000, and the second direction can be the front-to-back direction of the wafer testing equipment 1000.

[0067] This embodiment provides a plurality of first rail assemblies 200, and a plurality of probe seats 100 are provided on each first rail assembly 200. The probe assembly 20 of each probe seat 100 can contact a chip on the wafer 300 to be tested, so that multiple chips can be tested at the same time, thereby improving the test efficiency. Each probe seat 100 can slide along the corresponding first rail assembly 200, thereby adjusting the position of the probe seat 100 so that the corresponding probe assembly 20 contacts the corresponding chip.

[0068] In some embodiments, the wafer testing device 1000 includes a visual device 500, and a person can observe the position of the probe assembly 20 and the corresponding chip through the visual device 500, and manually adjust the position of the probe assembly 20 according to the image displayed by the visual device 500, so as to finally make the probe assembly 20 contact with the corresponding chip. In other words, this embodiment uses the visual device 500 to assist the needle test.

[0069] In some embodiments, the wafer testing device 1000 further includes a pair of second rail assemblies 800, the pair of second rail assemblies 800 extend along the first direction, each first rail assembly 200 is located between the pair of second rail assemblies 800, and both ends are slidably connected to a second rail assembly 800. It can be understood that the probe seat 100 can adjust the position in the second direction by sliding along the first rail assembly 200, and can also adjust the position in the first direction by sliding the first rail assembly 200 along the second rail assembly 800, so as to achieve adjustment in two directions.

[0070] Fig.10 FIG. 2 is a schematic structural diagram of a first slide rail assembly 200 after flipping according to an embodiment of the present invention. Fig.10 As shown, in a preferred embodiment, the wafer testing device 1000 further includes a plurality of flip assemblies, each of which is mounted at the end of the first slide rail assembly 200, and the flip assembly is configured to controllably drive the corresponding first slide rail assembly 200 to rotate a preset angle relative to the second slide rail assembly 800, so as to facilitate the replacement of the probe assembly 20. Here, the flip assembly may include a bearing and an operating member, the bearing being mounted on a slider on the second slide rail assembly 800, and the two ends of the support plate 210 of the first slide rail assembly 200 being respectively connected to the bearing, and the corresponding first slide rail assembly 200 is driven to rotate through the operating member. Here, the preset angle may be selected according to specific design requirements, for example, it may be 90°.

[0071] In the prior art, an external large shielding cover is generally used. A large box shielding cover is directly mounted on the outside of the wafer testing equipment 1000. The shielding cover is filled with a nitrogen environment, and the dual displays of the equipment are placed in the large shielding cover. However, the standard external large shielding cover is large in size and heavy in weight, and requires a large flow rate of inert gas filled inside the equipment box. The standard display is located inside the equipment, which affects the normal use of the equipment. In this embodiment, the wafer testing equipment 1000 also includes a shielding plate 400. The shielding plate 400 is disposed above the probe seat group and is configured to move in a controlled manner to shield the probe seat group and the wafer 300 to be tested, so as to isolate the probe seat group and the wafer 300 to be tested from the outside world. This embodiment does not require the provision of a large shielding cover. The shielding plate 400 can be disposed above the probe seat 100. When shielding is required, the shielding plate 400 can be directly pulled to isolate the wafer 300 to be tested from the external environment, forming a sealed environment, thereby solving the problem of excessive consumption of inert gas. See. Figure 1 When the shielding plate 400 is closed, the dual displays are placed outside the sealed cavity, which is convenient for device operation. A wiring hole is designed at the rear of the device for cable entry and exit.

[0072] In some embodiments, the probe assembly 20 includes a substrate 21 and at least one probe head 22, and the substrate 21 is detachably connected to the PCB board 10 and is electrically connected to the PCB board 10. The probe head 22 is mounted on the substrate 21 and contacts the chip to be tested on the wafer 300 to be tested. Here, the number of the probe heads 22 is multiple, and the number of the probe heads 22 can be set according to the test requirements of the chip, for example, 5-16 probe heads 22 can be selected. Here, since the wafer 300 needs to be in a high temperature environment when performing a heating test, the probe seat 100 also needs to be in a high temperature environment, and being in a high temperature environment for a long time will cause the probe assembly 20 of the probe seat 100 to be thermally deformed, affecting the test effect. Therefore, this embodiment designs the substrate 21 to be made of ceramic material, which can reduce the amount of thermal deformation caused by being in high temperature for a long time.

[0073] In some embodiments, the PCB board 10 is arranged along the vertical direction of the probe seat 100, and the substrate 21 is arranged along the horizontal direction or the vertical direction of the probe seat 100. Figure 2 , Figure 2 The middle substrate 31 is arranged along the vertical direction of the probe seat 100, which is equivalent to using a vertical needle card structure, with the installation surface of the needle card placed in the Z direction. When the substrate 21 is arranged along the vertical direction of the probe seat 100, a probe is welded on the PCB board 10, and a Pad electrode is designed on the back of the substrate 21. After the substrate 21 and the PCB board 10 are installed, the probe contacts the Pad electrode, so that the substrate 21 and the PCB board 10 are electrically connected. Figure 4 , Figure 4The middle substrate 21 is arranged along the horizontal direction of the probe base 100. When the substrate 21 is arranged along the horizontal direction of the probe base 100, it needs to be electrically connected to the PCB board 10 through the connector 23.

[0074] Fig.11 is a schematic structural diagram of a probe base at another angle according to an embodiment of the present invention, Fig.12 FIG. 1 is a schematic structural diagram of a probe seat according to another embodiment of the present invention. Fig.11 and Fig.12 As shown, and see Figure 5 and Figure 6 In some embodiments, each probe seat 100 further includes an adjustment component 30 , which is connected to the PCB board 10 , and the adjustment component 30 is configured to controllably adjust the position of the PCB board 10 , thereby adjusting the position of the probe assembly 20 .

[0075] In some embodiments, the adjustment component 30 includes an X-axis adjustment module 31, a Y-axis adjustment module 32, and a Z-axis adjustment module 34. The X-axis adjustment module 31 is slidably connected to the corresponding first slide rail assembly 200, and is used to controllably adjust the position of the PCB board 10 in the X-axis direction. The Y-axis adjustment module 32 is installed above the X-axis adjustment module 31, and is used to controllably adjust the position of the PCB board 10 in the Y-axis direction. The Z-axis adjustment module 34 is connected to the Y-axis adjustment module 32, and is used to controllably adjust the position of the PCB board 10 in the Z-axis direction. This embodiment can realize the position adjustment of the PCB board 10 in the three directions of the X-axis, the Y-axis, and the Z-axis through the X-axis adjustment module 31, the Y-axis adjustment module 32, and the Z-axis adjustment module 34, so that the position adjustment of the probe assembly 20 in the three directions of the X-axis, the Y-axis, and the Z-axis can be realized, and the probe head 22 of the probe assembly 20 can be aligned with the pad on the corresponding chip.

[0076] In some embodiments, the X-axis adjustment module 31 includes a first base plate 311, at least one first slide rail 313, a first slide plate 314 and a first knob 312. The first slide rail 313 is mounted on the first base plate 311 and arranged along the X-axis direction. The first slide plate 314 is mounted on the first slide rail 313. The first knob 312 is mounted on the first base plate 311 and is configured to move in a controlled manner along the X-axis direction to push the first slide plate 314 to slide along the first slide rail 313, thereby adjusting the position of the PCB board 10 in the X-axis direction. Here, the first knob 312 has a rod body extending along the X-axis direction and a circular rotating member, and the circular rotating member is mounted at the end of the rod body. Compared with the structure of the micrometer head in the prior art, the volume is smaller and it is easy to adjust. In addition, a knurling structure is added to the periphery of the circular rotating member to increase the friction.

[0077] In some embodiments, the number of the first slide rails 313 is multiple, which can increase the stability of the movement of the first slide plate 314. For example, a double slide rail design can be adopted.

[0078] In some embodiments, the first slide plate 314 has a protrusion 315 protruding toward the bottom of the probe seat 100, and the protrusion 315 is arranged opposite to the first knob 312 so that it can abut against the protrusion 315 when the first knob 312 moves, thereby pushing the first slide plate 314 to slide along the first slide rail 313. The X-axis adjustment module 31 also includes a second elastic member 316, one end of the second elastic member 316 is connected to the first base plate 311, and the other end is connected to the first slide plate 314. The second elastic member 316 is in a compressed state when the first slide plate 314 is pushed, so that when the first knob 312 rotates in the opposite direction, the elastic force of the second elastic member 316 is used to drive the first slide plate 314 to move in the opposite direction.

[0079] In some embodiments, the Y-axis adjustment module 32 includes at least one second slide rail 322, a second slide plate 323 and a second knob 321. The second slide rail 322 is installed above the first slide plate 314 and arranged along the Y-axis direction. The second slide plate 323 is installed on the second slide rail 322. The second knob 321 is installed on the first slide plate 314 and is configured to move in a controlled manner along the Y-axis direction to push the second slide plate 323 to slide along the second slide rail 322, thereby adjusting the position of the PCB board 10 in the Y-axis direction. In other words, the first slide plate 314 of the X-axis adjustment module 31 is a moving base plate of the Y-axis adjustment module 32, which can greatly compress the longitudinal space of the probe seat 100. Here, the structure of the second knob 321 is the same as that of the first knob 312, and the rod body of the second knob 321 extends along the Y-axis direction.

[0080] In this embodiment, the X-axis adjustment module 31 and the Y-axis adjustment module 32 are designed with a stacked structure, which is relatively compact and can reduce the volume of the probe seat 100 .

[0081] In some embodiments, the number of the second slide rails 322 is multiple, which can increase the stability of the movement of the second slide plate 323. For example, a double slide rail design can be adopted.

[0082] In some embodiments, the Y-axis adjustment module 32 also includes a third elastic member 324, one end of the third elastic member 324 is connected to the first slide 314, and the other end is connected to the second slide 323. The third elastic member 324 is in a compressed state when the second slide 323 is pushed, so that when the second knob 321 is rotated in the opposite direction, the elastic force of the third elastic member 324 can be used to drive the second slide 323 to move in the opposite direction.

[0083] In some embodiments, the adjustment assembly 30 also includes a TZ-axis adjustment module 33, which is installed above the Y-axis adjustment module 32 and is used to controllably drive the PCB board 10 to rotate a preset angle in the TZ direction to adjust the position of the PCB board 10. The Z-axis adjustment module 34 is installed on the front side of the TZ-axis adjustment module 33.

[0084] This embodiment superimposes the TZ-axis adjustment module 33 with the X-axis adjustment module 31 and the Y-axis adjustment module 32. It can be understood that the X-axis adjustment module 31, the Y-axis adjustment module 32 and the TZ-axis adjustment module 33 are vertically superimposed on the probe seat 100, making the structure of the probe seat 100 more compact and further reducing the volume of the probe seat 100.

[0085] In some embodiments, the adjustment assembly 30 further includes a TX axis adjustment module 35, which is installed on the front side of the Z axis adjustment module 34 and is used to controllably drive the PCB board 10 to rotate a preset angle in the TX direction to adjust the position of the PCB board 10. The TX direction here can be understood as the horizontal direction of the probe seat 100.

[0086] In this embodiment, the Z-axis adjustment module 34 and the TX-axis adjustment module 35 are designed with a stacked structure. It can be understood that the Z-axis adjustment module 34 and the TX-axis adjustment module 35 are arranged in a lateral stack on the probe seat 100 , which can greatly compress the lateral space of the probe seat 100 and further reduce the volume of the probe seat 100 .

[0087] In a preferred embodiment, the TZ axis adjustment module 33 is detachably connected to the Y axis adjustment module 32. That is, the X axis adjustment module 31 and the Y axis adjustment module 32 can be detached from the other three axes for easy maintenance and replacement. Specifically, the TZ axis adjustment module 33 is connected to the Y axis adjustment module 32 by a plurality of bolts 50.

[0088] In some embodiments, the TZ-axis adjustment module 33 includes a second base plate 331, a first rotating plate 332, and a third knob 333, wherein the second base plate 331 is mounted above the Y-axis adjustment module 32. The first rotating plate 332 includes a first portion 334 mounted above the second base plate 331, the first portion 334 being arranged in a horizontal direction and rotatably connected to the second base plate 331. The third knob 333 is mounted on the second base plate 331 and is configured to be controlled to move in the Y-axis direction to push the first rotating plate 332 to rotate a preset angle in the TZ direction, thereby adjusting the position of the PCB board 10 in the TZ direction. Here, the structure of the third knob 333 is the same as that of the first knob 312, and the rod body of the third knob 333 extends in the Y-axis direction.

[0089] In some embodiments, the first rotating plate 332 also includes a second portion 335 arranged in the vertical direction, the second portion 335 is connected to the first portion 334, and is located at the front side of the first portion 334. The Z-axis adjustment module 34 includes at least one third slide rail 342, a third slide plate 343 and a fourth knob 341, the third slide rail 342 is installed on the front side of the second portion 335, and is arranged along the Z-axis direction. The third slide plate 343 is installed on the third slide rail 342, and the fourth knob 341 is installed on the third slide rail 343, and is configured to be controlled to move along the Z-axis direction to push the third slide plate 343 to slide along the third slide rail 342, thereby adjusting the position of the PCB board 10 in the Z-axis direction. Here, it can be understood that the first rotating plate 332 is L-shaped, that is, it can be used as a moving bottom plate of the Z-axis adjustment module 34, and can be used as a rotating plate of the TZ-axis adjustment module 33, so that the probe seat 100 structure is more compact and the volume of the probe seat 100 is reduced. The structure of the fourth knob 341 is the same as that of the first knob 312 , and the rod of the fourth knob 341 extends along the Z-axis direction.

[0090] In some embodiments, the number of the third slide rails 342 is multiple, which can increase the stability of the movement of the third slide plate 343. For example, a double slide rail design can be adopted.

[0091] In some embodiments, the TZ-axis adjustment module 33 also includes a fourth elastic member 336, one end of the fourth elastic member 336 is connected to the first rotating plate 332, and the other end is connected to the second slide plate 323. The fourth elastic member 336 is in a compressed state when the first rotating plate 332 is pushed to rotate, so that when the third knob 333 rotates in the opposite direction, the elastic force of the fourth elastic member 336 is used to drive the first rotating plate 332 to rotate in the opposite direction.

[0092] In some embodiments, the Z-axis adjustment module 34 also includes a fifth elastic member, one end of the fifth elastic member is connected to the first rotating plate 332, and the other end is connected to the third slide plate 343. The fifth elastic member is in a compressed state when the third slide plate 343 is pushed, so that when the fourth knob 341 rotates in the opposite direction, the elastic force of the fifth elastic member can be used to drive the third slide plate 343 to move in the opposite direction.

[0093] In some embodiments, the TX axis adjustment module 35 includes a second rotating plate 352 and a fifth knob 351, the second rotating plate 352 is rotatably connected to the third slide plate 343, and is arranged along the Z axis direction, and the PCB board 10 is mounted on the second rotating plate 352. The fifth knob 351 is mounted on the second rotating plate 352 and is configured to be controlled to move along the Y axis direction to abut against the third slide plate 343, thereby pushing the first rotating plate 332 to rotate a preset angle along the TX direction, thereby adjusting the position of the PCB board 10 in the TX direction. The TX direction here can be understood as the left and right direction of the probe seat 100. The structure of the fifth knob 351 is the same as that of the first knob 312, and the rod body of the fifth knob 351 extends along the Y axis direction.

[0094] In some embodiments, the TX axis adjustment module 35 also includes a sixth elastic member, one end of the sixth elastic member is connected to the second rotating plate 352, and the other end is connected to the third slide plate 343. The sixth elastic member is in a compressed state when the second rotating plate 352 is pushed to rotate, so that when the fifth knob 351 rotates in the opposite direction, the elastic force of the sixth elastic member can be used to drive the second rotating plate 352 to rotate in the opposite direction.

[0095] This embodiment designs the positions of the knobs on each axis based on ergonomics and optimizes the feeling after adjustment, which can ensure one-handed adjustment in a small space and improve the convenience of adjustment.

[0096] In some embodiments, each probe seat 100 also includes a limit assembly 40, the limit assembly 40 includes a handle and a first elastic member 43, the handle is rotatably connected to the adjustment assembly 30, the handle has an operating portion 42 and an abutment portion 41 abutting against the first slide rail assembly 200, and the operating portion 42 is configured to rotate the handle when being operated, thereby driving the abutment portion 41 to separate from the first slide rail assembly 200, so that the probe seat 100 is in a free state. One end of the first elastic member 43 is connected to the handle, and the other end is connected to the adjustment assembly 30. The first elastic member 43 is used to drive the handle to reset, so that the abutment portion 41 abuts against the first slide rail assembly 200, so that the probe seat 100 is in a locked state. Here, the limit assembly 40 includes a rotating shaft 44, and the handle is rotatably connected to the adjustment assembly 30 through the rotating shaft 44, and the handle rotates around the rotating shaft 44. The first elastic member 43 is a spring. In other embodiments, the first elastic member 43 can also be other components having the same elastic properties as the spring.

[0097] like Figure 8As shown, the probe seat 100 is mounted on the first slide rail assembly 200 and can slide along the first slide rail assembly 200. When the probe seat 100 needs to be moved to the target position so that the probe head 22 contacts the chip to be tested on the wafer 300 to be tested, the operating part 42 of the manual operation handle is rotated so that the abutment portion 41 is separated from the first slide rail assembly 200. At this time, the probe seat 100 can be pushed to move along the first slide rail assembly 200, and the first elastic member 43 is in an extended state. When the probe seat 100 moves to the target position, it can be directly released. The elastic force of the first elastic member 43 can drive the handle to reset, so that the abutment portion 41 abuts against the first slide rail assembly 200 again to lock the probe seat 100.

[0098] Since the probe seat 100 will have thermal expansion problems during the high-temperature test of the wafer 300 to be tested, the probe head 22 will be displaced in the XYZ direction when in contact with the wafer 300 to be tested, which will cause inaccurate test data, and more seriously damage the probe head 22. Therefore, the probe seat 100 of this embodiment uses metal materials with extremely low thermal expansion coefficients, such as ceramics or Invar alloys. The test was carried out in an environment of continuous 300°C, and the test time exceeded 2 months. The stability of the test device data was better than 1%, and during the test, the offset of the probe head 22 was less than 5μm, which reduced the problem of thermal expansion during the test and improved the accuracy of the test data.

[0099] This embodiment improves the structure of the needle card, by adding a PCB board 10, using a cable assembly to connect the PCB board 10 to the test machine, and detachably connecting the probe assembly 20 to the PCB board 10, which is equivalent to separating the cable assembly from the probe assembly 20. When replacing the probe assembly 20, there is no need to disassemble the cable assembly, and only the probe assembly 20 needs to be disassembled and replaced, which can avoid damage to the needle card, save the replacement time of the needle card, and improve the test efficiency of the wafer 300. In addition, the adjustment assembly 30 of this embodiment adopts a five-axis adjustment structure, which can improve the adjustability of the position of the needle card during the chip needle insertion process, and optimize the five-axis adjustment structure, so that the structure of the probe seat 100 is more compact and small in size, and more probe seats 100 can be arranged in the same space, and 18 probe seats 100 can be compatible within the range of 8-inch wafers, which can improve the wafer test efficiency.

[0100] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived based on the content disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all these other variations or modifications.

Claims

1. A wafer testing device, characterized in that: include: Loading platform; A testing device, the testing device is located below the carrying platform, and the testing device is used to place the wafer to be tested; at least one first slide rail assembly, wherein the first slide rail assembly is mounted on the bearing platform; At least one probe seat group is installed on the first slide rail assembly and includes at least one probe seat sliding along the extension direction of the first slide rail assembly, the probe seat includes a probe assembly, a PCB board and a cable assembly; one end of the cable assembly is connected to the PCB board, and the other end is connected to the tester; the probe assembly is detachably connected to the PCB board and is used to contact the chip to be tested on the wafer to be tested.

2. The wafer testing device according to claim 1, characterized in that: The first slide rail assembly includes a support plate, the interior of the support plate is provided with at least one first channel for conveying protective gas, and the surface of the support plate has at least one gas outlet hole communicating with the first channel; The probe assembly is close to the air outlet.

3. The wafer testing device according to claim 2, characterized in that: There are multiple air outlet holes, which are divided into at least one group of air outlet holes. At least one group of air outlet holes is arranged on a side of the support plate close to the probe assembly and has multiple air outlet holes arranged at intervals along the extension direction of the support plate.

4. The wafer testing equipment according to claim 2, characterized in that: At least one second channel is provided inside or at the bottom of the support plate, and the second channel is used for conveying cooling liquid or cooling gas.

5. The wafer testing equipment according to claim 1, characterized in that: There are multiple first slide rail assemblies, and the multiple first slide rail assemblies are arranged on the bearing platform at intervals along a first direction, and each of the first slide rail assemblies extends along a second direction perpendicular to the first direction; There are multiple probe seat groups, each of which is mounted on a corresponding first slide rail assembly, and each of which includes multiple probe seats.

6. The wafer testing equipment according to claim 5, characterized in that: Also includes: A pair of second slide rail assemblies, the pair of second slide rail assemblies extend along the first direction, each of the first slide rail assemblies is located between the pair of second slide rail assemblies, and both ends are respectively slidably connected to one of the second slide rail assemblies.

7. The wafer testing device according to claim 6, characterized in that: Also includes: A plurality of flipping assemblies, each of which is mounted at an end of the first slide rail assembly, and the flipping assemblies are configured to controllably drive the corresponding first slide rail assembly to rotate a preset angle relative to the second slide rail assembly to facilitate replacement of the probe assembly.

8. The wafer testing equipment according to claim 1, characterized in that: Each of the probe seats further includes an adjustment component, which is used to controllably adjust the position of the PCB board, thereby adjusting the position of the probe assembly, and the adjustment component includes: An X-axis adjustment module, the X-axis adjustment module is slidably connected to the corresponding first slide rail assembly and is used for controlling the position of the PCB board in the X-axis direction; A Y-axis adjustment module, which is installed above the X-axis adjustment module and is used to controllably adjust the position of the PCB board in the Y-axis direction; A Z-axis adjustment module is connected to the Y-axis adjustment module and is used for controlling the position of the PCB board in the Z-axis direction.

9. The wafer testing device according to claim 8, characterized in that: The adjustment component also includes: A TZ-axis adjustment module, which is installed above the Y-axis adjustment module and is used to controllably drive the PCB to rotate a preset angle in the TZ direction to adjust the position of the PCB. The Z-axis adjustment module is installed in front of the TZ-axis adjustment module; A TX axis adjustment module is installed on the front side of the Z axis adjustment module, and is used to controllably drive the PCB board to rotate a preset angle in the TX direction to adjust the position of the PCB board.

10. The wafer testing equipment according to claim 9, characterized in that: Each of the probe seats also includes a limit assembly, and the limit assembly includes: A handle, the handle is rotatably connected to the adjustment assembly, the handle has an operating portion and an abutting portion abutting against the first slide rail assembly, the operating portion is configured to rotate the handle when operated, thereby driving the abutting portion to separate from the first slide rail assembly, so that the probe seat is in a free state; A first elastic member, one end of which is connected to the handle, and the other end of which is connected to the adjustment assembly, the first elastic member is used to drive the handle to reset so that the abutting portion abuts against the first slide rail assembly, thereby placing the probe seat in a locked state.

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