Wafer cleaning and purging frame and cleaning method thereof

Abstract

The invention discloses a wafer cleaning and purging frame and a cleaning method thereof.The wafer cleaning and purging frame comprises a base and a bearing frame arranged on the left side of the base, a wafer storage box is placed at the top of the bearing frame, a plurality of parallel wafer substrates are stored in the wafer storage box, and a wiping structure is arranged at the top of the base through a transmission structure; the transmission structure can drive the wiping structure to move to the interior of the wafer storage box and wipe the surface of the wafer substrate, and the other side of the top of the base is provided with a lifting structure connected with the transmission structure. And the lifting structure can drive the transmission structure to vertically lift, so that the transmission structure is in contact with a plurality of parallel wafer substrates in sequence. According to the wafer cleaning and purging frame, the wafer substrates can be automatically wiped and purged, the cleaning efficiency and cleanliness are improved, meanwhile, the multiple wafer substrates can be continuously cleaned, and the wafer cleaning and purging frame is suitable for the automatic cleaning requirement of a large-scale wafer production line.

Description

Technical Field

[0001] The invention relates to the technical field of wafer cleaning and purging, and in particular to a wafer cleaning and purging rack and a cleaning method thereof. Background Art

[0002] Wafer cleaning and purging is a crucial part of semiconductor post-process production. It is mainly used to remove impurities and particles on the surface of the wafer to ensure the purity of the wafer surface, thereby improving the quality and reliability of semiconductor devices. During the wafer manufacturing process, the wafer will continue to come into contact with various organic matter, particles and metals, thereby generating pollutants. If these pollutants are not removed, the wafer yield will decrease and the device quality will deteriorate. Therefore, wafer cleaning and purging is a key step to ensure the purity of the wafer surface and improve the quality of semiconductor devices.

[0003] For example, the patent application number disclosed on the China Patent Network is: 202323489871.8, and the patent name is: A carrier box for wafer purging, including a carrier box body for wafer purging, a workbench is fixedly installed above the carrier assembly, a filter plate is installed above the workbench, a second fixture is fixedly installed on the right side above the filter plate, a first fixture is installed on the left side of the second fixture, a telescopic column is fixedly installed below the first fixture, a rubber fixing plate is provided at the end of the telescopic column, the filter plate is installed through the workbench to collect the purged debris and dust, and the first fixture and the second fixture fix the wafer and the wafer placement plate placed below, and the internal telescopic column drives the rubber fixing plate to squeeze and fix the wafer, which is not easy to cause scratches on the surface of the wafer, so as to facilitate purging and cleaning of the wafer.

[0004] However, existing wafer purge devices mainly use air flow purge as the main cleaning method, which is effective for most impurities and particles on the wafer surface. However, for some stubborn impurities, such as grease, photoresist residues or tiny particles tightly attached to the wafer surface, air flow purge may not be able to completely remove them. These stubborn impurities may affect the purity of the wafer surface and the quality of subsequent processes, limiting the flexibility and effectiveness of wafer cleaning, making it impossible to achieve ideal cleanliness in some cases.

[0005] In addition, wafers are usually connected by extrusion and fixation. This method requires repeated disassembly and assembly of the wafers during operation. The disassembly and assembly process is not only time-consuming and labor-intensive, but may also cause damage or contamination to the wafer surface. Existing wafer purge devices usually only provide one or a limited number of wafer fixation methods, which limits their ability to adapt to wafers of different sizes, shapes and materials. With the continuous development of semiconductor technology, wafer sizes and shapes are becoming increasingly diversified, and existing fixation methods may not be able to meet future needs.

[0006] Therefore, it is necessary to design and create a wafer cleaning purge rack and a cleaning method thereof. Summary of the invention

[0007] In order to solve the problems raised in the above background technology, the purpose of the present invention is to provide a wafer cleaning purge rack and a cleaning method thereof, which have the advantages of convenient disassembly and assembly of wafers while improving the cleaning effect.

[0008] To achieve the above-mentioned object, the present invention provides the following technical solutions: a wafer cleaning purge rack and a cleaning method thereof, comprising a base;

[0009] A bearing frame arranged on the left side of the base;

[0010] A wafer storage box is placed on the top of the carrier frame, and a plurality of parallel wafer substrates are stored inside the wafer storage box. A wiping structure is arranged on the top of the base through a transmission structure, and the transmission structure can drive the wiping structure to move so that it moves to the inside of the wafer storage box and wipes the surface of the wafer substrate. A lifting structure connected to the transmission structure is arranged on the other side of the top of the base, and the lifting structure can drive the transmission structure to lift vertically so that it contacts with a plurality of parallel wafer substrates in sequence. An intermittent moving structure is arranged on the surface of the transmission structure, and the transmission structure can use the intermittent moving structure to drive the lifting structure to lift intermittently during the movement. A purge assembly is arranged on the other side of the transmission structure, and the purge assembly can pressurize and convey the external airflow so that it can purge the wafer substrate. The purge assembly is connected to the transmission structure through a linkage structure, and the linkage structure can be used to drive the transmission structure to run synchronously during the operation of the purge assembly.

[0011] As a preferred embodiment of the present invention, the wafer storage box includes a box body placed on the top of the carrier frame, and guide rails are fixedly connected to both sides of the inner wall of the box body. The wafer substrate is inserted into the inner side of the guide rails and is slidably connected to the guide rails. The wafer substrate can be separated from the box body by sliding displacement.

[0012] As a preferred embodiment of the present invention, the wiping structure includes a wiping disc arranged on the top of the base through a transmission structure, and the top of the wiping disc is movably connected with two symmetrical cranks through a pin shaft, and the side of the crank away from the wiping disc is interconnected with the transmission structure, and the transmission structure can drive the crank to swing and use the shear force during the swing to push the wiping disc to move to the inside of the box body.

[0013] As a preferred embodiment of the present invention, the transmission structure includes a connecting frame installed on the top of the base through a lifting structure, a threaded assembly is arranged inside the connecting frame, and the threaded assembly is composed of two symmetrical screws, and screw sleeves are threaded on both sides of the surface of the threaded assembly. The end of the crank away from the wiping disk extends to the top of the screw sleeve and is movably connected to the screw sleeve through a pin shaft. The purge assembly is arranged on one side of the connecting frame and can drive the threaded assembly to rotate by utilizing a linkage structure. During the rotation of the threaded assembly, the threads can be used to push the screw sleeves to move toward each other and squeeze the rocker arm to generate shear force.

[0014] As a preferred embodiment of the present invention, the purge assembly includes a fan body arranged on one side of a connecting frame, a transmission motor is fixedly connected to one side of the fan body, a shaft is fixedly connected to the output end of the transmission motor, an end of the shaft away from the transmission motor passes through the fan body and is interconnected with an impeller inside the fan body, and the linkage structure is installed on the surface of one end of the shaft passing through the fan body and can drive the threaded assembly to rotate synchronously when the transmission motor rotates.

[0015] As a preferred embodiment of the present invention, the linkage structure is composed of conical wheels fixedly connected to the surface of the shaft and the surface of the threaded component respectively, and the teeth on the surface of the conical wheels are meshed with each other.

[0016] As a preferred embodiment of the present invention, a movable block is fixedly connected to the inner surface of the base, and both sides of the movable block are movably connected to limit rods through pins. The limit rods extend to the outside of the box body away from the side of the movable block and can be plugged into the box body. The limit rods moved to both sides of the box body can limit the forward and backward movement of the box body.

[0017] As a preferred embodiment of the present invention, an extension plate is fixedly connected to the inner side of the screw sleeve, and the extension plate extends from the side of the screw sleeve away from the screw sleeve to the outside of the limiting rod and is fixedly connected to a trapezoidal block, and the outer surface of the trapezoidal block is arranged to be inclined. In the process of the screw sleeve carrying the trapezoidal block to move toward each other through the extension plate, the inclined surface can be used to squeeze the limiting rod to swing, and a spring plate is fixedly connected to the surface of the limiting rod, and the side of the spring plate away from the limiting rod is in contact with the surface of the carrier frame, and the spring plate can elastically support and reset the limiting rod.

[0018] As a preferred embodiment of the present invention, a translation rod is inserted into the side of the inner surface of the base close to the movable block, and the side of the translation rod away from the base extends to the left side of the box body through the bottom of the supporting frame, and the surface of the translation rod is fixedly connected with a claw located on the left side of the box body, and the end of the translation rod located inside the base is fixedly connected with a force rod, and the end of the limit rod close to the movable block is fixedly connected with a fork sleeved on the surface of the force rod, and when the limit rod swings, the fork can be used to support the force rod so that it pulls the translation rod to move horizontally inside the base.

[0019] A wafer cleaning purge rack and a cleaning method thereof, comprising the following steps:

[0020] Initial preparation: The wafer substrates are neatly inserted into the rails in the wafer storage box to ensure that the wafer substrates remain parallel and stable. The wafer storage box is placed on top of the carrier to prepare for subsequent cleaning work:

[0021] Movement and wiping of the wiping structure: A threaded assembly is provided inside the connection frame, which is composed of two screws with reciprocating thread grooves on the surfaces of the symmetrical surfaces. Two screw sleeves are threadedly connected on the surface of the threaded assembly. The screw sleeves are movably connected to the crank through a pin. When the threaded assembly rotates, the screw sleeves will move toward each other under the action of the threads and drive the crank to swing through the pin. When the crank swings, its shear force is used to push the wiping disk to move to the inside of the wafer storage box to wipe the surface of the wafer substrate and reduce the amount of impurities attached to the surface of the wafer substrate:

[0022] Starting and purging of the purge assembly: The fan body is fixed on one side of the connection frame, and the output end of the transmission motor is connected to the impeller inside the fan body through a shaft. When the transmission motor is started, the shaft will drive the impeller inside the fan body to run and pressurize and extract the external airflow. The squeezed airflow is discharged through the output end of the fan body to effectively purge the wafer substrate inside the box:

[0023] Operation of linkage structure: Conical wheels are fixed on the surface of the shaft and the surface of the threaded component respectively. The teeth on the surface of the conical wheels mesh with each other to form a linkage structure. When the shaft rotates, the threaded component is driven to rotate through the conical wheel linkage structure, thereby realizing the movement of the screw sleeve and the wiping action of the wiping structure;

[0024] Positioning of the box body: a movable block is fixed on the inner surface of the base, and the movable block is movably connected to the limit rod through a pin shaft. The limit rod can be inserted into the outside of the wafer storage box to limit its forward and backward movement, thereby ensuring the stability of the wafer storage box during the cleaning process. When the screw sleeve moves, the limit rod is squeezed by the extension plate and the trapezoidal block to swing. At the same time, when the limit rod swings, it supports the force rod through the fork, pulling the translation rod to move horizontally inside the base. When the translation rod moves, it carries the claw to move to the left and close to the wafer storage box. When the claw is inserted into the surface of the box body, the box body is clamped and fixed.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. The present invention provides a wafer cleaning and blowing rack, which can automatically wipe and blow the wafer substrate, thereby improving the cleaning efficiency and cleanliness. At the same time, it can continuously clean multiple wafer substrates, and is suitable for the automated cleaning needs of large-scale wafer production lines.

[0027] 2. The present invention is slidably connected to the wafer substrate through the guide rail, which facilitates the placement and positioning of the wafer substrate and ensures the stability and safety of the wafer substrate during storage and cleaning.

[0028] 3. The present invention drives the crank to swing through the transmission structure, and uses the shear force during the swing to push the wiping disk to move to the inside of the wafer storage box to wipe the surface of the wafer substrate, thereby achieving effective cleaning of the surface of the wafer substrate.

[0029] 4. The present invention realizes precise control of the wiping structure through the cooperation of the threaded assembly and the screw sleeve, and at the same time utilizes the thread to push the screw sleeve to move toward each other and squeeze the rocker to generate shear force, thereby providing a stable power source for the wiping structure.

[0030] 5. The present invention generates a pressurized airflow through the combination of a fan body and a transmission motor to purge the wafer substrate, thereby effectively removing residues and impurities on the surface of the wafer substrate and improving cleanliness.

[0031] 6. The present invention realizes the synchronous operation of the purge assembly and the transmission structure by meshing the teeth of the conical wheel, simplifies the overall structure, and improves the operating efficiency and stability.

[0032] 7. The present invention is connected to the base through a movable block, which can be plugged into the outside of the wafer storage box to limit the forward and backward movement of the wafer storage box, thereby ensuring stability and safety during the cleaning process.

[0033] 8. The present invention squeezes the limit rod with an inclined surface to make it swing, and at the same time, the spring plate elastically supports and resets the limit rod, thereby realizing automatic control and reset of the limit rod and improving the convenience and stability of operation.

[0034] 9. The present invention can drive the wafer storage box to move through the combination of the translation rod and the clamping claw, so as to facilitate the removal of the cleaned wafer substrate. At the same time, the cooperation of the shift fork and the force-bearing rod is utilized to realize the automatic movement and positioning of the wafer storage box, thereby improving the degree of automation of the operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of the structure of the present invention;

[0036] Figure 2 It is a schematic diagram of the main structure of the present invention;

[0037] Figure 3 It is a schematic diagram of the local structure of the present invention;

[0038] Figure 4 It is a schematic diagram of the transmission structure of the present invention;

[0039] Figure 5 It is a top view schematic diagram of the local structure of the present invention;

[0040] Figure 6 It is a schematic diagram of the lifting structure of the present invention;

[0041] Figure 7 This is a schematic diagram of the structure of the purge assembly of the present invention when viewed from above;

[0042] Figure 8 For the present invention Figure 7 Enlarged structural diagram at A in the middle.

[0043] In the figure: 1. base; 2. carrier frame; 3. wafer storage box; 4. wafer substrate; 5. transmission structure; 6. wiping structure; 7. lifting structure; 8. intermittent moving structure; 9. purge assembly; 10. linkage structure; 11. box body; 12. guide rail; 13. wiping plate; 14. crank; 15. connecting frame; 16. threaded assembly; 17. screw sleeve; 18. fan body; 19. transmission motor; 20. shaft; 21. conical wheel; 22. movable block ; 23. Limit rod; 24. Extension plate; 25. Trapezoidal block; 26. Spring plate; 27. Translation rod; 28. Claw; 29. ​​Force rod; 30. Fork; 31. Pulley; 32. Belt; 33. Gear; 34. Tooth plate; 35. Frame; 36. Reciprocating screw; 37. Transmission plate; 38. Ratchet; 39. Bushing; 40. Support; 41. Push block; 42. Bracket; 43. Connecting rod; 44. Support frame; 45. Rocker arm; 46. Push rod. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] like Figures 1 to 8 As shown, a wafer cleaning and blowing rack and a cleaning method thereof provided by the present invention include a base 1;

[0046] A support frame 2 is arranged on the left side of the base 1;

[0047] A wafer storage box 3 is placed on the top of the carrier frame 2, and a plurality of parallel wafer substrates 4 are stored inside the wafer storage box 3. A wiping structure 6 is arranged on the top of the base 1 through a transmission structure 5. The transmission structure 5 can drive the wiping structure 6 to move so that it moves to the inside of the wafer storage box 3 and wipes the surface of the wafer substrate 4. A lifting structure 7 connected to the transmission structure 5 is arranged on the other side of the top of the base 1. The lifting structure 7 can drive the transmission structure 5 to lift vertically so that it can contact with a plurality of parallel wafer substrates 4 in sequence. An intermittent moving structure 8 is arranged on the surface of the transmission structure 5. The transmission structure 5 can use the intermittent moving structure 8 to drive the lifting structure 7 to lift intermittently during the movement. A purge assembly 9 is arranged on the other side of the transmission structure 5. The purge assembly 9 can pressurize and convey the external airflow so that it can purge the wafer substrate 4. The purge assembly 9 is connected to the transmission structure 5 through a linkage structure 10. During the operation of the purge assembly 9, the linkage structure 10 can be used to drive the transmission structure 5 to run synchronously.

[0048] refer to Figure 3 The wafer storage box 3 includes a box body 11 placed on the top of the carrier frame 2, and guide rails 12 are fixedly connected to both sides of the inner wall of the box body 11. The wafer substrate 4 is inserted into the inner side of the guide rail 12 and is slidably connected to the guide rail 12. The wafer substrate 4 can be separated from the box body 11 by sliding displacement.

[0049] As a technical optimization solution of the present invention, the guide rail 12 is slidably connected to the wafer substrate 4, which facilitates the placement and positioning of the wafer substrate 4 and ensures the stability and safety of the wafer substrate 4 during storage and cleaning.

[0050] refer to Figure 4 The wiping structure 6 includes a wiping disc 13 arranged on the top of the base 1 through a transmission structure 5. The top of the wiping disc 13 is movably connected to two symmetrical cranks 14 through a pin shaft. The side of the crank 14 away from the wiping disc 13 is interconnected with the transmission structure 5. The transmission structure 5 can drive the crank 14 to swing and use the shear force during the swing to push the wiping disc 13 to move to the inside of the box body 11.

[0051] As a technical optimization solution of the present invention, the crank 14 is driven to swing through the transmission structure 5, and the shear force during the swing is used to push the wiping disk 13 to move to the inside of the wafer storage box 3 to wipe the surface of the wafer substrate 4, thereby achieving effective cleaning of the surface of the wafer substrate 4.

[0052] refer to Figure 4The transmission structure 5 includes a connection frame 15 installed on the top of the base 1 through the lifting structure 7. A threaded assembly 16 is arranged inside the connection frame 15. The threaded assembly 16 is composed of two symmetrical screws. Both sides of the surface of the threaded assembly 16 are threadedly connected with screw sleeves 17. The end of the crank 14 away from the wiping disk 13 extends to the top of the screw sleeve 17 and is movably connected to the screw sleeve 17 through a pin. The purge assembly 9 is arranged on one side of the connection frame 15 and can use the linkage structure 10 to drive the threaded assembly 16 to rotate. During the rotation of the threaded assembly 16, the screw sleeve 17 can be pushed to move toward each other by the thread and squeeze the swing rod 45 to produce The top of the wiping disc 13 passes through the top of the crank 14 and is movably connected to the crank 14 through a bearing. A pulley 31 is installed on the top of the wiping disc 13 and the top of the right-side screw sleeve 17. A belt 32 is sleeved on the surface of the pulley 31. A gear 33 is fixedly connected to the surface of the pulley 31 on the top of the screw sleeve 17. A toothed plate 34 is provided on the surface of the connecting frame 15 and is located on one side of the gear 33. The teeth on the surface of the toothed plate 34 mesh with the teeth on the surface of the gear 33. In the process of the screw sleeve 17 carrying the pulley 31 to move, the meshing state of the toothed plate 34 and the teeth can be used to generate torque and drive the wiping disc 13 to rotate through the belt 32.

[0053] As a technical optimization scheme of the present invention, precise control of the wiping structure 6 is achieved through the cooperation of the threaded assembly 16 and the screw sleeve 17. At the same time, the thread is used to push the screw sleeve 17 to move toward each other and squeeze the rocker arm 45 to generate shear force, thereby providing a stable power source for the wiping structure 6. Through the cooperation of the pulley 31, the belt 32 and the gear 33, the rotation of the screw sleeve 17 during the movement is achieved, thereby improving the wiping effect and uniformity. At the same time, the meshing state of the tooth plate 34 and the teeth is used to generate torque, thereby providing a stable power source for the rotation of the wiping disk 13.

[0054] refer to Figure 4 The purge assembly 9 includes a fan body 18 arranged on one side of the connecting frame 15, a transmission motor 19 is fixedly connected to one side of the fan body 18, and a shaft 20 is fixedly connected to the output end of the transmission motor 19. The end of the shaft 20 away from the transmission motor 19 penetrates the fan body 18 and is interconnected with the impeller inside the fan body 18. The linkage structure 10 is installed on the surface of one end of the shaft 20 penetrating the fan body 18 and can drive the threaded assembly 16 to rotate synchronously when the transmission motor 19 rotates.

[0055] As a technical optimization solution of the present invention, a pressurized airflow is generated through the combination of the fan body 18 and the drive motor 19 to purge the wafer substrate 4, thereby effectively removing residues and impurities on the surface of the wafer substrate 4 and improving the cleanliness.

[0056] refer to Figure 4The linkage structure 10 is composed of a conical wheel 21 fixedly connected to the surface of the shaft 20 and the surface of the threaded component 16 respectively, the teeth on the surface of the conical wheel 21 mesh with each other, the end of the connecting frame 15 close to the fan body 18 is fixedly connected to a bracket 42, and a connecting rod 43 is movably connected inside the bracket 42. The axis of the connecting rod 43 and the meshing point of the two conical wheels 21 are perpendicular to each other, and the bottom end of the connecting rod 43 is fixedly connected to a support frame 44, and the side of the support frame 44 away from the connecting rod 43 is fixedly connected to the outer surface of the fan body 18, and the surface of the connecting rod 43 is fixedly connected to a swing rod 45 located at the bottom of the connecting frame 15, and the bottom of the screw sleeve 17 close to the fan body 18 is fixedly connected to a push rod 46 located inside the swing rod 45, and the push rod 46 is slidably connected to the swing rod 45. When the screw sleeve 17 is affected by the thread on the surface of the threaded component 16 and moves, it can drive the push rod 46 to slide inside the swing rod 45.

[0057] As a technical optimization scheme of the present invention, the teeth of the conical wheel 21 mesh with each other to achieve synchronous operation of the purge assembly 9 and the transmission structure 5, simplifying the overall structure and improving the operating efficiency and stability. The combination of the connecting rod 43 and the push rod 46 can transmit the power of the movement of the screw sleeve 17 and drive the rocker arm 45 to swing, further enhancing the linkage and stability of the overall structure. At the same time, the sliding of the push rod 46 inside the rocker arm 45 can achieve real-time monitoring and feedback of the operating status of the purge assembly 9, thereby improving the reliability and stability of the overall system.

[0058] refer to Figure 5 A movable block 22 is fixedly connected to the inner surface of the base 1, and both sides of the movable block 22 are movably connected to limit rods 23 through pins. The limit rods 23 extend to the outside of the box body 11 away from the side of the movable block 22 and can be plugged into the box body 11. The limit rods 23 moved to both sides of the box body 11 can limit the forward and backward movement of the box body 11.

[0059] As a technical optimization solution of the present invention, the movable block 22 is connected to the base 1 and can be plugged into the outside of the wafer storage box 3 to limit the forward and backward movement of the wafer storage box 3, thereby ensuring stability and safety during the cleaning process.

[0060] refer to Figure 5 An extension plate 24 is fixedly connected to the inner side of the screw sleeve 17. The side of the extension plate 24 away from the screw sleeve 17 extends to the outside of the limit rod 23 and is fixedly connected to a trapezoidal block 25. The outer surface of the trapezoidal block 25 is arranged to be inclined. When the screw sleeve 17 moves toward each other through the extension plate 24 and the trapezoidal block 25, the inclined surface can be used to squeeze the limit rod 23 to swing. A spring plate 26 is fixedly connected to the surface of the limit rod 23. The side of the spring plate 26 away from the limit rod 23 contacts the surface of the carrier 2. The spring plate 26 can elastically support and reset the limit rod 23.

[0061] As a technical optimization solution of the present invention, the limit rod 23 is squeezed by the inclined surface to swing, and the spring plate 26 elastically supports and resets the limit rod 23, thereby realizing automatic control and reset of the limit rod 23 and improving the convenience and stability of operation.

[0062] refer to Figure 3 A translation rod 27 is inserted into the side of the inner surface of the base 1 close to the movable block 22, and the side of the translation rod 27 away from the base 1 extends to the left side of the box body 11 through the bottom of the supporting frame 2. The surface of the translation rod 27 is fixedly connected with a claw 28 located on the left side of the box body 11, and the end of the translation rod 27 located inside the base 1 is fixedly connected with a force rod 29, and the end of the limit rod 23 close to the movable block 22 is fixedly connected with a fork 30 sleeved on the surface of the force rod 29. When the limit rod 23 swings, the fork 30 can be used to support the force rod 29 so that it pulls the translation rod 27 to move horizontally inside the base 1.

[0063] As a technical optimization solution of the present invention, the combination of the translation rod 27 and the clamping claw 28 can drive the wafer storage box 3 to move, so as to facilitate the removal of the cleaned wafer substrate 4. At the same time, the cooperation of the shift fork 30 and the force-bearing rod 29 can realize the automatic movement and positioning of the wafer storage box 3, thereby improving the degree of automation of the operation.

[0064] refer to Figure 1 , a wafer cleaning purge rack and a cleaning method thereof, comprising the following steps:

[0065] Initial preparation: The wafer substrates 4 are neatly inserted into the guide rails 12 in the wafer storage box 3 to ensure that the wafer substrates 4 remain parallel and stable. The wafer storage box 3 is placed on top of the carrier 2 to prepare for subsequent cleaning work:

[0066] Movement and wiping of the wiping structure 6: A threaded assembly 16 is provided inside the connection frame 15, which is composed of two screws with reciprocating thread grooves on the surfaces symmetrical to each other. Two screw sleeves 17 are threadedly connected to the surface of the threaded assembly 16. The screw sleeve 17 is movably connected to the crank 14 through a pin shaft. When the threaded assembly 16 rotates, the screw sleeve 17 moves toward each other under the action of the thread, and drives the crank 14 to swing through the pin shaft. When the crank 14 swings, its shear force is used to push the wiping disk 13 to move to the inside of the wafer storage box 3, wipe the surface of the wafer substrate 4, and reduce the amount of impurities attached to the surface of the wafer substrate 4:

[0067] Starting and purging of the purge assembly 9: The fan body 18 is fixed to one side of the connection frame 15, and the output end of the transmission motor 19 is connected to the impeller inside the fan body 18 through the shaft 20. When the transmission motor 19 is started, the shaft 20 will drive the impeller inside the fan body 18 to run and pressurize and extract the external airflow. The squeezed airflow is discharged through the output end of the fan body 18 to effectively purge the wafer substrate 4 inside the box body 11:

[0068] Operation of the linkage structure 10: Conical wheels 21 are fixed to the surfaces of the shaft 20 and the threaded assembly 16, respectively. The teeth on the surfaces of the conical wheels 21 mesh with each other to form the linkage structure 10. When the shaft 20 rotates, the threaded assembly 16 is driven to rotate through the conical wheel 21 linkage structure 10, thereby realizing the movement of the screw sleeve 17 and the wiping action of the wiping structure 6.

[0069] Positioning of the box body 11: a movable block 22 is fixed on the inner surface of the base 1, and the movable block 22 is movably connected to the limit rod 23 through a pin shaft. The limit rod 23 can be inserted into the outside of the wafer storage box 3 to limit its forward and backward movement, thereby ensuring the stability of the wafer storage box 3 during the cleaning process. When the screw sleeve 17 moves, the limit rod 23 is squeezed by the extension plate 24 and the trapezoidal block 25 to swing. At the same time, when the limit rod 23 swings, it supports the force-bearing rod 29 through the fork 30, pulling the translation rod 27 to move horizontally inside the base 1. When the translation rod 27 moves, it carries the claw 28 to move to the left and close to the wafer storage box 3. When the claw 28 is inserted into the surface of the box body 11, the box body 11 is clamped and fixed.

[0070] refer to Figure 6 The lifting structure 7 includes a frame 35 fixedly connected to the top of the base 1, and a reciprocating screw 36 is movably connected to the interior of the frame 35 through a bearing. A transmission plate 37 sleeved on the surface of the reciprocating screw 36 is fixedly connected to the surface of the connecting frame 15, and the transmission plate 37 is threadedly connected to the reciprocating screw 36. The intermittent moving structure 8 includes a ratchet 38 fixedly connected to the surface of the reciprocating screw 36. The surface of the screw sleeve 17 is connected to a sleeve plate 39 located on one side of the connecting frame 15. The surface of the sleeve plate 39 is set to be hollow. The screw sleeve 17 can carry the sleeve plate 39 to move horizontally and can use the hollow inner cavity to move vertically in the sleeve plate 39. The bottom of the sleeve plate 39 is fixedly connected to a support 40, and the side of the support 40 away from the sleeve plate 39 is elastically connected to a push block 41 located on one side of the ratchet 38. The side of the push block 41 away from the support 40 extends to the inside of the ratchet 38 and meshes with the ratchet 38

[0071] As a technical optimization solution of the present invention, the lifting structure 7 realizes the vertical lifting control of the transmission structure 5 through the cooperation of the reciprocating screw 36 and the transmission plate 37. At the same time, the intermittent movement of the transmission structure 5 is realized by the cooperation of the ratchet 38 and the push block 41, so that the wiping structure 6 can contact the wafer substrates 4 at different heights in turn, thereby improving the flexibility and adaptability of cleaning.

[0072] The working principle and use process of the present invention are as follows: First, the wafer substrate 4 is neatly inserted into the guide rail 12 in the wafer storage box 3. The wafer storage box 3 is placed on the top of the carrier frame 2. A frame 35 is installed on the base 1. The frame 35 is movably connected to the reciprocating screw 36 through a bearing. The connecting frame 15 is threadedly connected to the reciprocating screw 36 through a transmission plate 37 to achieve vertical lifting. A threaded assembly 16 is arranged inside the connecting frame 15. It is composed of two screws with reciprocating thread grooves on the surfaces that are symmetrical to each other. Two screw sleeves 17 are threadedly connected to the surface of the threaded assembly 16. The screw sleeve 17 is movably connected to the crank 14 through a pin shaft. The wiping plate 13 is movably connected to the top of the two cranks 14 through a pin shaft, and can be moved to the inside of the wafer storage box 3 under the drive of the screw sleeve 17. The wiping plate 13 can wipe the wafer substrate 4 during the movement to reduce the amount of impurities attached to the surface of the wafer substrate 4. During the movement of the screw sleeve 17, the pulley 31 and the gear 33 and the tooth plate 34 are moved. The meshing state generates torque, which is transmitted to the wiping disc 13 through the belt 32. The wiping disc 13 rotates to improve the wiping effect. The fan body 18 is fixed on one side of the connecting frame 15. The output end of the transmission motor 19 is connected to the impeller inside the fan body 18 through the shaft 20. The surface of the shaft 20 and the surface of the threaded component 16 are respectively fixed with a conical wheel 21. The teeth on the surface of the conical wheel 21 mesh with each other to form a linkage structure 10. A movable block 22 is fixed to the inner surface of the base 1. The movable block 22 is movably connected to the limit rod 23 through a pin shaft. The limit rod 23 can be plugged into the outside of the wafer storage box 3 to limit its forward and backward movement. An extension plate 24 is fixed to the inner side of the screw sleeve 17. The extension plate 24 extends to the limit A trapezoidal block 25 is fixed on the outside of the limiting rod 23, and the trapezoidal block 25 can squeeze the limiting rod 23 to swing. When working, the transmission motor 19 is started to drive the shaft 20 to rotate, and the shaft 20 drives the impeller inside the fan body 18 to run and pressurize the external airflow. The squeezed airflow is discharged through the output end of the fan body 18 and effectively purges the wafer substrate 4 inside the box body 11. At the same time, the shaft 20 drives the threaded component 16 to rotate through the conical wheel 21 linkage structure 10. When the threaded component 16 rotates, it pushes the screw sleeve 17 to move toward each other under the action of the thread. When the screw sleeve 17 moves, the pin shaft drives the crank 14 to swing. When the crank 14 swings, the shear force is used to push the wiping The plate 13 moves to the inside of the wafer storage box 3 to wipe the surface of the wafer substrate 4. At the same time, during the movement of the screw sleeve 17, the extension plate 24 and the trapezoidal block 25 squeeze the limit rod 23 to swing, ensuring the stability of the position of the wafer storage box 3. When the limit rod 23 swings, the fork 30 supports the force-bearing rod 29, pulling the translation rod 27 to move horizontally inside the base 1. When the translation rod 27 moves, the carrying claw 28 moves to the left and approaches the wafer storage box 3. When the claw 28 is plugged into the surface of the box body 11, the box body 11 is clamped and fixed. When the screw sleeve 17 is moved and reset, it is also engaged with the ratchet 38 through the sleeve plate 39, the support 40 and the push block 41.To achieve intermittent lifting, the ratchet 38 drives the reciprocating screw 36 to rotate under the action of the push block 41, and then drives the connecting frame 15 to lift vertically through the transmission plate 37. When the connecting frame 15 is lifted, the threaded assembly 16, the screw sleeve 17, the wiping structure 6 and the purge assembly 9 are driven to lift synchronously, so as to clean the wafer substrates 4 at different heights. When all the wafer substrates 4 are cleaned, the transmission motor 19 is turned off, and the wafer storage box 3 is disengaged from the reset limit rod 23 and the claw 28 respectively. The user can directly replace the entire wafer storage box 3 and repeat the above steps.

[0073] In summary: the wafer cleaning and blowing rack and its cleaning method can automatically wipe and blow the wafer substrate 4, thereby improving the cleaning efficiency and cleanliness. At the same time, multiple wafer substrates 4 can be continuously cleaned, which is suitable for the automated cleaning needs of large-scale wafer production lines.

[0074] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0075] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer cleaning and blowing rack, comprising a base (1); A support frame (2) arranged on the left side of the base (1); Features: A wafer storage box (3) is placed on the top of the carrier (2), and a plurality of wafer substrates (4) are stored in the interior of the wafer storage box (3). A wiping structure (6) is provided on the top of the base (1) through a transmission structure (5). The transmission structure (5) can drive the wiping structure (6) to move to the inside of the wafer storage box (3) and wipe the surface of the wafer substrate (4). A lifting structure (7) connected to the transmission structure (5) is provided on the other side of the top of the base (1). The lifting structure (7) can drive the transmission structure (5) to lift vertically so that it can be aligned with the plurality of parallel wafer substrates (4). The wafer substrates (4) are contacted in sequence; an intermittent moving structure (8) is arranged on the surface of the transmission structure (5); the transmission structure (5) can use the intermittent moving structure (8) to drive the lifting structure (7) to intermittently lift during the movement; a purge component (9) is arranged on the other side of the transmission structure (5); the purge component (9) can pressurize and convey the external airflow so that it can purge the wafer substrate (4); the purge component (9) and the transmission structure (5) are connected in transmission via a linkage structure (10); during the operation of the purge component (9), the linkage structure (10) can be used to drive the transmission structure (5) to operate synchronously.

2. A wafer cleaning and blowing rack according to claim 1, characterized in that: The wafer storage box (3) comprises a box body (11) placed on top of a carrier frame (2), guide rails (12) are fixedly connected to both sides of the inner wall of the box body (11), the wafer substrate (4) is inserted into the inner side of the guide rail (12) and is slidably connected to the guide rail (12), and the wafer substrate (4) can be separated from the box body (11) by sliding displacement.

3. A wafer cleaning and blowing rack according to claim 2, characterized in that: The wiping structure (6) comprises a wiping disc (13) arranged on the top of the base (1) via a transmission structure (5); the top of the wiping disc (13) is movably connected to two symmetrical cranks (14) via a pin; the crank (14) is connected to the transmission structure (5) on a side away from the wiping disc (13); the transmission structure (5) can drive the crank (14) to swing and use the shear force during the swing to push the wiping disc (13) to move into the interior of the box body (11).

4. A wafer cleaning and blowing rack according to claim 3, characterized in that: The transmission structure (5) comprises a connection frame (15) installed on the top of the base (1) through a lifting structure (7); a threaded assembly (16) is arranged inside the connection frame (15); the threaded assembly (16) is composed of two symmetrical screw rods; both sides of the surface of the threaded assembly (16) are threadedly connected with a screw sleeve (17); one end of the crank (14) away from the wiping disk (13) extends to the top of the screw sleeve (17) and is movably connected to the screw sleeve (17) through a pin; the purge assembly (9) is arranged on one side of the connection frame (15) and can drive the threaded assembly (16) to rotate by using a linkage structure (10); during the rotation of the threaded assembly (16), the screw sleeve (17) can be pushed by the thread to move towards each other and squeeze the swing rod (45) to generate a shear force.

5. The wafer cleaning and blowing rack according to claim 4, characterized in that: The purge assembly (9) comprises a fan body (18) arranged on one side of a connection frame (15); a transmission motor (19) is fixedly connected to one side of the fan body (18); an output end of the transmission motor (19) is fixedly connected to a shaft (20); an end of the shaft (20) away from the transmission motor (19) passes through the fan body (18) and is interconnected with an impeller inside the fan body (18); and the linkage structure (10) is mounted on a surface of an end of the shaft (20) passing through the fan body (18) and is capable of driving the threaded assembly (16) to rotate synchronously when the transmission motor (19) rotates.

6. The wafer cleaning and blowing rack according to claim 5, characterized in that: The linkage structure (10) is composed of a conical wheel (21) which is respectively fixedly connected to the surface of the shaft (20) and the surface of the threaded assembly (16), and the teeth on the surface of the conical wheel (21) mesh with each other.

7. The wafer cleaning and blowing rack according to claim 6, characterized in that: A movable block (22) is fixedly connected to the inner surface of the base (1); both sides of the movable block (22) are movably connected to limit rods (23) via pins; the limit rods (23) extend to the outside of the box body (11) away from the side of the movable block (22) and can be plugged into the box body (11); the limit rods (23) moved to both sides of the box body (11) can limit the forward and backward movement of the box body (11).

8. The wafer cleaning and blowing rack according to claim 7, characterized in that: An extension plate (24) is fixedly connected to the inner side of the screw sleeve (17); a side of the extension plate (24) away from the screw sleeve (17) extends to the outer side of the limiting rod (23) and is fixedly connected to a trapezoidal block (25); an outer surface of the trapezoidal block (25) is arranged to be inclined; when the screw sleeve (17) carries the trapezoidal block (25) to move toward each other through the extension plate (24), the inclined surface can be used to squeeze the limiting rod (23) to swing; a spring plate (26) is fixedly connected to the surface of the limiting rod (23); a side of the spring plate (26) away from the limiting rod (23) contacts the surface of the carrier (2); and the spring plate (26) can elastically support and reset the limiting rod (23).

9. The wafer cleaning and blowing rack according to claim 8, characterized in that: A translation rod (27) is inserted into the inner surface of the base (1) on a side close to the movable block (22); a side of the translation rod (27) away from the base (1) extends to the left side of the box body (11) through the bottom of the support frame (2); a claw (28) located on the left side of the box body (11) is fixedly connected to the surface of the translation rod (27); an end of the translation rod (27) located inside the base (1) is fixedly connected to a force-bearing rod (29); an end of the limit rod (23) close to the movable block (22) is fixedly connected to a shift fork (30) sleeved on the surface of the force-bearing rod (29); when the limit rod (23) swings, the shift fork (30) can be used to support the force-bearing rod (29) so that it pulls the translation rod (27) to move horizontally inside the base (1).

10. A cleaning method for a wafer cleaning purge rack according to claim 9, characterized in that: The following steps are involved: Initial preparation: The wafer substrates (4) are neatly inserted into the guide rails (12) in the wafer storage box (3), ensuring that the wafer substrates (4) remain parallel and stable. The wafer storage box (3) is placed on top of the carrier (2) to prepare for subsequent cleaning work: Movement and wiping of the wiping structure (6): A threaded assembly (16) is arranged inside the connection frame (15), which is composed of two screws with reciprocating thread grooves on the surfaces symmetrical to each other. Two screw sleeves (17) are threadedly connected to the surface of the threaded assembly (16). The screw sleeves (17) are movably connected to the crank (14) through a pin shaft. When the threaded assembly (16) rotates, the screw sleeves (17) move toward each other under the action of the thread and drive the crank (14) to swing through the pin shaft. When the crank (14) swings, its shear force is used to push the wiping disk (13) to move to the inside of the wafer storage box (3) to wipe the surface of the wafer substrate (4), thereby reducing the amount of impurities attached to the surface of the wafer substrate (4): Starting and purging of the purge assembly (9): The fan body (18) is fixed to one side of the connection frame (15), and the output end of the transmission motor (19) is connected to the impeller inside the fan body (18) through the shaft (20). When the transmission motor (19) is started, the shaft (20) drives the impeller inside the fan body (18) to operate and pressurizes and extracts the external airflow. The squeezed airflow is discharged through the output end of the fan body (18), and the wafer substrate (4) inside the box body (11) is effectively purged: Operation of the linkage structure (10): Conical wheels (21) are fixed to the surfaces of the shaft (20) and the threaded assembly (16), respectively. The teeth on the surfaces of the conical wheels (21) mesh with each other to form a linkage structure (10). When the shaft (20) rotates, the threaded assembly (16) is driven to rotate through the conical wheel (21) linkage structure (10), thereby realizing the movement of the screw sleeve (17) and the wiping action of the wiping structure (6); Positioning of the box body (11): a movable block (22) is fixed on the inner surface of the base (1), and the movable block (22) is movably connected to a limit rod (23) through a pin shaft. The limit rod (23) can be inserted into the outer side of the wafer storage box (3) to limit its forward and backward movement, thereby ensuring the stability of the wafer storage box (3) during the cleaning process. When the screw sleeve (17) moves, the limit rod (23) is squeezed by the extension plate (24) and the trapezoidal block (25) to swing. At the same time, when the limit rod (23) swings, it supports the force-bearing rod (29) through the fork (30), pulling the translation rod (27) to move horizontally inside the base (1). When the translation rod (27) moves, it carries the claw (28) to move to the left and close to the wafer storage box (3). When the claw (28) is inserted into the surface of the box body (11), the box body (11) is clamped and fixed.

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