Wear-resistant wafer cleaning device

Abstract

The invention belongs to the technical field of chip processing, and particularly discloses a wear-resistant wafer cleaning device which comprises a base for supporting a wafer, supports, a cleaning brush and a mounting plate, the supports are symmetrically arranged on the two sides of the base, the mounting plate is arranged between the supports which are symmetrically arranged, and two driving wheels are symmetrically arranged on the two sides of the top of the mounting plate. A driven wheel is arranged below the driving wheel, and a cleaning brush is arranged on the top of the support. The wear-resistant wafer cleaning device is simple in structure, the wafer can be cleaned in a vertical state all the time by changing the structural design of the driven wheel, the cleaning brush can make contact with the surface of the wafer all the time, the wafer is cleaned, wafer scrapping is avoided, the wear-resistant performance of the driving wheel is enhanced by changing the included angle of the wheel teeth of the driving wheel, and the service life of the wafer is prolonged. The service life is prolonged and the maintenance cost is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of chip processing, and in particular to a wear-resistant wafer cleaning device. Background Art

[0002] Wafer is a basic material in the semiconductor manufacturing process. It is usually made of high-purity single crystal silicon, but can also be made of other semiconductor materials such as gallium arsenide (GaAs) or silicon carbide (SiC). The surface of the wafer is very flat, and the thickness and diameter vary according to different applications and process requirements. The single crystal silicon rod is sliced ​​into thin slices to form a wafer. The sliced ​​wafer is ground and polished to achieve the required flatness and smoothness. The wafer surface is thoroughly cleaned by chemical and physical methods to remove impurities and contaminants.

[0003] During the wafer grinding process, the wafer surface needs to be cleaned after each grinding, because the surface of the wafer has been adsorbed on the wafer due to particles and impurities stuck during grinding. It is difficult to remove the particles and impurities on the surface of the wafer by cleaning liquid, and a cleaning device is needed to clean the wafer. Generally, the particles and impurities on the surface of the wafer can only be cleaned by brushes and pure water. In the cleaning equipment, the accessories that directly contact the wafer are the driven wheel, the driving wheel and the cleaning brush. The driven wheel and the driving wheel of the traditional design generally need to be replaced once every 2 months. Due to the continuous operation of the production line, the slot of the driven wheel constantly rubs against the wafer, causing the slot gap to widen, which can easily cause the wafer to stand upright and tilt to one side. The brush cleaning the corresponding side does not contact the wafer and is not cleaned thoroughly, resulting in unclean wafers, which will lead to the scrapping of wafers. This seriously hinders the improvement of the quality and efficiency of chip processing, and directly causes economic losses to chip factories due to the scrapping of wafers. Summary of the invention

[0004] The purpose of the present invention is to provide a wear-resistant wafer cleaning device with a simple structure. By changing the structural design of the driven wheel, the wafer can always be kept in a vertical state for cleaning, and the cleaning brush can always contact the wafer surface to clean the wafer and avoid wafer scrapping; by changing the tooth angle of the driving wheel, the wear resistance of the driving wheel is enhanced, the service life is extended, and the maintenance cost is reduced.

[0005] To achieve the above-mentioned purpose, the present invention provides a wear-resistant wafer cleaning device, including a base for supporting the wafer, a bracket, a cleaning brush, and a mounting plate, wherein symmetrically arranged brackets are provided on both sides of the base, a mounting plate is provided between the symmetrically arranged brackets, two symmetrically arranged driving wheels are provided on both sides of the top of the mounting plate, a driven wheel is provided under the driving wheel, and a cleaning brush is provided on the top of the bracket.

[0006] Preferably, two parallel rotating shafts are provided on the top of the bracket, and cleaning brushes are circumferentially arranged on the outer surfaces of the two rotating shafts, and the length of the cleaning brushes is greater than the diameter of the wafer.

[0007] Preferably, both ends of the rotating shaft are rotatably connected to the bracket respectively.

[0008] Preferably, the connection line between the two driving wheels and the driven wheels is an isosceles triangle, the two driving wheels and the driven wheels are rotatably connected to the mounting plate respectively, and the driving wheels and the driven wheels are in contact with the edge of the wafer respectively.

[0009] Preferably, a wafer slot is provided on the outer surface of the driven wheel along the circumferential direction, and a drainage groove is provided at the bottom of the slot. The slot includes a vertical portion and a V-shaped portion. The vertical portion is located above the V-shaped portion and is connected to the V-shaped portion. The V-shaped portion is connected to the drainage groove, and the side wall thickness of the slot is 2.9±0.1 mm.

[0010] Preferably, a plurality of evenly distributed gear teeth are provided on the outer surface of the driving wheel along the circumferential direction, gear tooth grooves are provided between adjacent gear teeth, and the angle between the edge of the gear tooth and the edge of the gear tooth groove is a rounded angle design.

[0011] Preferably, the driving wheel and the driven wheel are both made of ternary peroxide fluororubber.

[0012] The advantages and beneficial effects of the present invention using the above-mentioned wear-resistant wafer cleaning device are: The invention has a simple structure and is easy to operate. By changing the structural design of the driven wheel, the wafer can always be kept in a vertical state for cleaning, and the cleaning brush can always contact the surface of the wafer to clean the wafer, thereby avoiding the wafer from being scrapped due to inadequate cleaning. By changing the tooth angle of the driving wheel, the wear resistance of the driving wheel is enhanced, the service life is extended, and the maintenance cost is reduced. By setting a suitable wall thickness of the slot, it can be ensured that the downward pressure of the wafer's own weight does not deform the side wall of the V-shaped groove of the driven wheel, and the wafer will not be stuck and cannot rotate. By adding a drainage groove under the slot, cleaning water is discharged, so that the cleaning reaches the best state.

[0013] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of a wear-resistant wafer cleaning device of the present invention; Figure 2 It is a schematic cross-sectional view of a driven wheel in a wear-resistant wafer cleaning device of the present invention; Figure 3 It is a schematic diagram of the connection between a wafer and a card slot in a wear-resistant wafer cleaning device of the present invention; Figure 4 It is a schematic diagram of the prior art driven wheel slot schematic diagram; Figure 5 It is a schematic diagram of a driven wheel in a wear-resistant wafer cleaning device of the present invention; Figure 6 It is a schematic diagram of a driving wheel in a wear-resistant wafer cleaning device of the present invention; Figure 7 It is a schematic diagram of the driving wheel teeth of the prior art; Figure 8 It is a schematic diagram of the driving wheel teeth in a wear-resistant wafer cleaning device of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] 1. Wafer; 2. Cleaning brush; 3. Mounting plate; 4. Driven wheel; 5. Driving wheel; 6. Base; 7. Bracket; 8. Rotating shaft; 9. Card slot; 10. Drain trough; 11. Rounded corners. DETAILED DESCRIPTION

[0016] The technical solution of the present invention is further described below through the accompanying drawings and embodiments.

[0017] Unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0018] Example 1 like Figure 1 As shown, a wear-resistant wafer cleaning device includes a base 6 supporting a wafer 1, a bracket 7, a cleaning brush 2, and a mounting plate 3. The base 6 is provided with symmetrically arranged brackets 7 on both sides, and a mounting plate 3 is provided between the symmetrically arranged brackets 7. Two symmetrically arranged driving wheels 5 are provided on both sides of the top of the mounting plate 3. A driven wheel 4 is provided below the driving wheel 5. The connecting line between the two driving wheels 5 and the driven wheel 4 forms an isosceles triangle. The two driving wheels 5 and the driven wheel 4 are respectively rotatably connected to the mounting plate 3, and the driving wheels 5 and the driven wheels 4 are respectively in contact with the edge of the wafer 1. Figure 5 As shown, the outer surface of the driven wheel 4 is provided with a wafer 1 clamping groove 9 along the circumferential direction, and the bottom of the clamping groove 9 is provided with a drainage groove 10 (as shown in FIG. Figure 2As shown), the slot 9 includes a vertical portion and a V-shaped portion, the vertical portion is located above the V-shaped portion and is connected to the V-shaped portion, the V-shaped portion is connected to the drainage groove 10, and the side wall thickness of the slot 9 is 2.9±0.1mm.

[0019] like Figure 6 As shown, the outer surface of the driving wheel 5 is provided with a plurality of evenly distributed gear teeth along the circumferential direction, gear tooth grooves are provided between adjacent gear teeth, and the angle between the gear tooth edge and the gear tooth groove edge is designed as a rounded angle 11. The material of the driving wheel 5 and the driven wheel 4 are both ternary peroxide fluororubber.

[0020] A cleaning brush 2 is provided on the top of the bracket 7. Two parallel rotating shafts 8 are provided on the top of the bracket 7, and both ends of the rotating shafts 8 are rotatably connected to the bracket 7. The cleaning brushes 2 are circumferentially arranged on the outer surfaces of the two rotating shafts 8, and the length of the cleaning brushes 2 is greater than the diameter of the wafer 1.

[0021] The driving mechanism and driving principle of the device of the present invention are both prior art. When in use, the wafer 1 is placed between the two rotating shafts 8, and the bottom edge of the wafer 1 is located in the card slot 9 of the driven wheel 4, and the width of the card slot 9 is adapted to the edge thickness of the wafer 1. The two driving wheels 5 are in contact with the edge of the wafer 1. The rotating shaft 8 rotates under the action of the driving mechanism, and the rotating shaft 8 is provided on both sides of the wafer 1. The rotating shaft 8 is provided with a cleaning brush 2. The rotation of the rotating shaft 8 drives the cleaning brush 2 to rotate, and the two sides of the wafer 1 can be cleaned. The two driving wheels 5 clamp the wafer 1, and the driving wheels 5 rotate under the action of the driving mechanism. The wafer 1 rotates following the driving wheels 5, and the driven wheel 4 rotates with the rotation of the wafer 1. When the wafer 1 rotates, the cleaning brush 2 also rotates, so that the two sides of the wafer 1 can be cleaned as a whole.

[0022] like Figure 7 and Figure 8 As shown, when the wafer 1 rotates, the edge of the wafer 1 and the gear teeth on the driving wheel 5 rub against each other, and the gear teeth are squeezed by the wafer 1 under the gravity of the wafer 1. In the prior art, the connection between the edge of the gear teeth of the driving wheel 5 and the gear tooth groove is designed as a right angle. Since the right angle is in direct contact with the wafer 1, it is squeezed and will be worn out for a long time. The present invention changes the design here from a right angle to a rounded corner 11 (R angle), which greatly reduces the friction resistance, improves the wear resistance of the driving wheel 5, and extends the service life of the driving wheel 5.

[0023] like Figure 3 and Figure 4As shown, in the prior art, the slot 9 of the driven wheel 4 is a traditional right-angle U-shaped slot, while the driven wheel 4 of the present invention adopts a brand-new structure, which is optimized from the traditional right-angle U-shaped slot to a V-shaped slot design. This structure can efficiently and evenly disperse the downward pressure of the wafer 1. The edge of the wafer 1 is V-shaped and fits perfectly with the newly designed driven wheel 4 structure, ensuring that the wafer 1 does not have a unilateral tilt problem. After repeated tests and optimizations, the most suitable structural form has been identified to ensure that the wafer 1 can remain in a vertical state during the cleaning process, so that both sides of the wafer 1 can be fully contacted by the cleaning brush.

[0024] After precise calculation and experimental verification, the most suitable thickness parameter of the side wall of the card slot 9 is determined to be 2.9±0.1mm. This thickness can ensure that the downward pressure of the wafer 1 itself will not deform the side wall of the V-shaped groove of the driven wheel 4, and will not block the wafer 1 from rotating.

[0025] In order to further enhance the reliability of the driving wheel 5, the present invention also innovatively designs the bottom of the V-shaped groove and adds a drainage groove 10. The clean water flowing through the surface of the wafer 1 is promptly discharged from the driven wheel 4 through the drainage groove 10, which significantly improves the cleaning effect of the wafer 1.

[0026] During use, the wafer 1 is inserted between the two rotating shafts 8 and rotated for cleaning. During the removal process, the wafer 1 is always kept in a vertical state, so that it can still work stably in a fast cleaning operation environment, and the driving wheel 5 is not easily damaged, ensuring the continuity and reliability of chip processing.

[0027] Therefore, the present invention adopts the above-mentioned wear-resistant wafer cleaning device, which has a simple structure. By changing the structural design of the driven wheel, the wafer can always be kept in a vertical state for cleaning, and the cleaning brush can always contact the wafer surface to clean the wafer and avoid wafer scrapping; by changing the tooth angle of the driving wheel, the wear resistance of the driving wheel is enhanced, the service life is extended, and the maintenance cost is reduced.

[0028] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solution of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solution to deviate from the spirit and scope of the technical solution of the present invention.

Claims

1. A wear-resistant wafer cleaning device, characterized in that: It includes a base for supporting the wafer, a bracket, a cleaning brush and a mounting plate. Symmetrically arranged brackets are arranged on both sides of the base, a mounting plate is arranged between the symmetrically arranged brackets, two symmetrically arranged driving wheels are arranged on both sides of the top of the mounting plate, a driven wheel is arranged under the driving wheel, and a cleaning brush is arranged on the top of the bracket.

2. The wear-resistant wafer cleaning device according to claim 1, characterized in that: Two parallel rotating shafts are arranged on the top of the bracket, and cleaning brushes are circumferentially arranged on the outer surfaces of the two rotating shafts, and the length of the cleaning brushes is greater than the diameter of the wafer.

3. The wear-resistant wafer cleaning device according to claim 2, characterized in that: The two ends of the rotating shaft are respectively rotatably connected to the bracket.

4. The wear-resistant wafer cleaning device according to claim 1, characterized in that: The connecting line between the two driving wheels and the driven wheels is an isosceles triangle. The two driving wheels and the driven wheels are rotatably connected to the mounting plate respectively, and the driving wheels and the driven wheels are in contact with the edge of the wafer respectively.

5. The wear-resistant wafer cleaning device according to claim 1, characterized in that: The outer surface of the driven wheel is provided with a wafer slot along the circumferential direction, and a drainage groove is provided at the bottom of the slot. The slot includes a vertical portion and a V-shaped portion. The vertical portion is located above the V-shaped portion and is connected to the V-shaped portion. The V-shaped portion is connected to the drainage groove. The side wall thickness of the slot is 2.9±0.1mm.

6. The wear-resistant wafer cleaning device according to claim 1, characterized in that: The outer surface of the driving wheel is provided with a plurality of evenly distributed gear teeth along the circumferential direction, gear tooth grooves are provided between adjacent gear teeth, and the angle between the edge of the gear tooth and the edge of the gear tooth groove is a rounded angle design.

7. The wear-resistant wafer cleaning device according to claim 1, characterized in that: The materials of the driving wheel and the driven wheel are both ternary peroxide fluororubber.

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