A head-binding component, an eutectic device, and a chip mounting method

Abstract

The present invention relates to the field of eutectic technology, and particularly relates to a bonding head assembly, an eutectic device, and a chip mounting method. The bonding head assembly includes a driving assembly, a nozzle assembly, and a vision assembly. The nozzle assembly is provided at the output end of the driving assembly. The nozzle assembly includes a nozzle seat, a nozzle, a first transparent member, and a second transparent member. A through hole is provided in the nozzle seat, and the vision assembly is arranged to be aligned with the through hole. The nozzle is provided at one end of the through hole, and the first transparent member is provided at the other end of the through hole to close the port of the through hole. A through adsorption channel is provided in the nozzle, the adsorption channel communicates with the through hole, and an air path connection hole is provided on the inner wall of the through hole. A transmissive observation window is further provided on the nozzle, the observation window is spaced from the adsorption channel, and when projected along the axial direction of the through hole, the projection of the observation window is located within the projection of the through hole. The bonding head assembly provided by the present invention can perform high-precision positioning on multiple chips during the eutectic mounting process.

Description

Technical Field

[0001] The present invention relates to the field of eutectic technology, and particularly relates to a bonding head assembly, an eutectic device, and a chip mounting method. Background Art

[0002] When the existing eutectic device performs mounting, it usually calibrates only one current chip. This results in poor position and angle accuracy between chips in the case where multiple chips need to be mounted on the same substrate. Summary of the Invention

[0003] In order to solve the problem of poor position and angle accuracy between chips when the existing eutectic device mounts multiple chips on the same substrate, the present invention provides a bonding head assembly, an eutectic device, and a chip mounting method.

[0004] To solve the above technical problems, the present invention provides the following technical solution: A bonding head assembly, the bonding head assembly includes a driving component, a suction nozzle component, and a vision component. The suction nozzle component is arranged at the output end of the driving component. The suction nozzle component includes a suction nozzle seat, a suction nozzle, a first transparent member, and a second transparent member. The suction nozzle seat is provided with a through hole. The vision component is arranged to align with the through hole. The suction nozzle is arranged at one end of the through hole. The first transparent member is arranged at the other end of the through hole and closes the port of the through hole. The suction nozzle is provided with a through adsorption channel, and the adsorption channel communicates with the through hole. An air path connection hole is arranged on the inner wall of the through hole. The suction nozzle is further provided with a transparent observation window, and the observation window is arranged at an interval from the adsorption channel. When projected along the axial direction of the through hole, the projection of the observation window is located within the projection of the through hole. The bonding head assembly is used to mount chips on a substrate provided with at least two chip mounting positions, including the following steps: Transfer the chip to the first chip mounting position through the suction nozzle component. When transferring the chip, the vision component observes the orientation of the chip through the through hole and the adsorption channel, and adjusts the orientation of the chip according to the observation result. When transferring the chip to other chip mounting positions through the suction nozzle component, the suction nozzle picks up the corresponding chip and moves it directly above the corresponding chip mounting position on the substrate. At this time, the adsorption channel and the observation window are respectively aligned with the chip mounting position of the already mounted chip and the chip mounting position of the to-be-mounted chip. The vision component respectively identifies the feature points of the two chips through the adsorption channel and the observation window, and at the same time, cooperates with the driving component to correct the relative position and angle of the two chips, thereby completing the mounting.

[0005] Preferably, the observation window includes an observation hole and a second transparent member that closes the observation hole.

[0006] Preferably, the driving assembly includes a hollow motor, the nozzle assembly is arranged at the output end of the hollow motor, a through hollow channel is arranged on the hollow motor, and the hollow channel is aligned with the through hole; when projected along the axial direction of the through hole, the projection of the through hole is located within the projection of the hollow channel, or the projection of the through hole overlaps with the projection of the hollow channel.

[0007] Preferably, an installation groove is provided at one end of the nozzle seat facing away from the nozzle corresponding to the through hole, and the first transparent member is arranged in the installation groove.

[0008] Preferably, a receiving space is provided between the nozzle and the nozzle seat, and the second transparent member is arranged in the receiving space; the second transparent member is arranged to avoid the adsorption channel, or a relief hole is provided on the second transparent member corresponding to the adsorption channel.

[0009] To solve the above technical problems, the present invention provides another technical solution as follows: a eutectic device, including a main body and the above-mentioned bonding head assembly movably arranged on the main body; the eutectic device further includes a transfer table arranged on the main body, at least two vacuum suction holes are provided on the transfer table, and the interval between adjacent vacuum suction holes on the transfer table corresponds to the interval between the observation window and the adsorption channel.

[0010] Preferably, the eutectic device further includes a eutectic table, a eutectic area is provided on the eutectic table, at least one vacuum suction hole is provided on the eutectic area; a heating module is further provided on the eutectic table for heating the eutectic area.

[0011] Preferably, the eutectic device further includes an elastic limit assembly, at least two elastic pressing blocks are provided on the elastic limit assembly, and the interval between adjacent two of the elastic pressing blocks matches the interval between adjacent two of the eutectic positions.

[0012] Preferably, the elastic limit assembly further includes a pressing block seat and a cover plate, an installation channel matching the number of elastic pressing blocks is provided on the pressing block seat, the cover plate covers the pressing block seat to close the installation channel, the elastic pressing block includes a connected elastic member and a pressing block, and one end of the elastic member away from the pressing block is connected to the cover plate, and the pressing block is exposed after passing through the installation channel.

[0013] To solve the above technical problems, the present invention provides another technical solution as follows: a chip mounting method, in the eutectic mounting process, the chip is mounted through the bonding head assembly as described above; the method includes the following steps: transferring the substrate to the eutectic stage, where at least two chip mounting positions are provided on the substrate; transferring the chip to the first chip mounting position through the nozzle assembly. When transferring the chip, the vision assembly observes the orientation of the chip through the through hole and the adsorption channel, and adjusts the orientation of the chip according to the observation result; when transferring the chip to other chip mounting positions through the nozzle assembly, the nozzle picks up the corresponding chip and moves it directly above the corresponding chip mounting position on the substrate. At this time, the adsorption channel and the observation window are respectively aligned with the chip mounting position of the already mounted chip and the chip mounting position of the chip to be mounted. The vision assembly identifies the feature points of the two chips respectively through the adsorption channel and the observation window, and at the same time cooperates with the driving assembly to correct the relative position and angle of the two chips, thus completing the mounting.

[0014] Compared with the prior art, a bonding head assembly, an eutectic device and a chip mounting method provided by the present invention have the following beneficial effects:

[0015] 1. A bonding head assembly provided by an embodiment of the present invention ensures high-precision positioning of multiple chips during the eutectic mounting process by introducing a synchronous vision monitoring and correction mechanism for adjacent chips, and solves the problem of poor position and angle accuracy between chips when multiple chips are mounted on the same substrate by existing eutectic devices; specifically, in this solution, a through hole is provided on the nozzle seat, so that the nozzle seat itself does not block the vision assembly from observing the chip through the adsorption channel on the nozzle; at the same time, spaced observation windows are provided on the nozzle, so that the vision assembly can observe adjacent chips through the observation windows; and air passage connection holes are provided on the inner wall of the through hole to provide a vacuum adsorption function for the nozzle, and a first transparent member is provided at one end of the through hole, which can not affect the operation of the vision assembly while maintaining the sealing of the system.

[0016] 2. In the bonding head assembly of an embodiment of the present invention, a hole is first opened on the observation window and then sealed with a second transparent member, so as to complete the setting of the observation window in a relatively simple assembly and production method; wherein, the second transparent member is used to close the through hole without affecting the vision assembly to observe the chip through it.

[0017] 3. In the bonding head assembly of an embodiment of the present invention, the hollow channel inside the hollow motor is aligned with the through hole on the nozzle seat or its projection overlaps, ensuring an unobstructed line of sight from the vision assembly to the chip. This design allows the vision assembly to directly observe the chip located in the adsorption channel of the nozzle through the hollow channel and the through hole, so as to achieve precise monitoring of the position and posture of the chip. That is, in the bonding head assembly of this embodiment, the vision assembly, the hollow motor and the nozzle assembly can be longitudinally stacked, with a simple structure and a small space occupancy rate.

[0018] 4. In the bonding head assembly according to the embodiment of the present invention, the installation groove provides a stable installation platform, enhancing the fixing of the first transparent member and ensuring the reliability during long-term use.

[0019] 5. In the bonding head assembly according to the embodiment of the present invention, the second transparent member is disposed in the accommodation space between the nozzle and the nozzle seat, which can effectively protect and fix the second transparent member; meanwhile, the positional relationship between the second transparent member and the adsorption channel ensures that it does not interfere with the normal picking of the chip by the nozzle.

[0020] 6. The eutectic equipment provided by the embodiment of the present invention also has the same beneficial effects as the above-mentioned bonding head assembly because it includes the above-mentioned bonding head assembly, and will not be elaborated herein.

[0021] 7. In the eutectic equipment according to the embodiment of the present invention, the vacuum suction holes and the heating module on the eutectic area are key components for realizing efficient and precise chip mounting; during the eutectic mounting process, the substrate needs to be accurately fixed on the eutectic stage to ensure the accuracy of the mounting position. The vacuum suction holes tightly adsorb the substrate on the eutectic stage by generating negative pressure, preventing it from shifting during the operation; the heating module can precisely control the temperature of the eutectic area to ensure that the appropriate temperature is reached to complete the eutectic process.

[0022] 8. In the eutectic equipment according to the embodiment of the present invention, the elastic pressing block can provide a certain downward pressure for the chip under the eutectic process. The elastic pressing block can automatically adjust the applied pressure according to the chips with different thicknesses to ensure that each chip can receive appropriate pressure and achieve the application of high-precision pressure. This is applicable not only to chips with standard thickness but also to chips with different thicknesses caused by manufacturing tolerances or design requirements. When chips with different specifications need to be processed, the elastic pressing block can quickly respond and adjust to the appropriate working state without frequent hardware replacement or complex recalibration, improving the operation efficiency; the interval between adjacent two elastic pressing blocks matches the interval between adjacent two eutectic positions, ensuring that each chip mounting position can be accurately covered, and the elastic pressing block can provide a uniform pressure distribution on the entire contact surface, avoiding the problem of excessive or insufficient local pressure, thereby improving the quality and reliability of the eutectic mounting.

[0023] 9. In the eutectic equipment according to the embodiments of the present invention, the pressing block seat serves as the basic framework of the entire elastic limiting component, providing stable support for all components. It ensures that even in a high-frequency operation environment, the elastic pressing block can maintain its position and function unchanged. The cover plate closes the top of the installation channel, preventing external dust, impurities, etc. from entering the interior and protecting the elastic member and other precision components from contamination or damage. The installation channel on the pressing block seat provides an accurate guiding path for each elastic pressing block, ensuring that the pressing block can move along a predetermined direction during operation without lateral deviation. This design ensures that each elastic pressing block can accurately align with the corresponding chip mounting position. The presence of the elastic member enables the pressing block to adaptively adjust when abutting against the chip, thereby accommodating the thickness difference of the chips and providing high-precision eutectic pressure without the need to frequently replace hardware or perform complex recalibration.

[0024] 10. The chip mounting method provided by the embodiments of the present invention also has consistent beneficial effects because it uses the bonding head assembly described above for chip mounting, and will not be elaborated here. Description of the Drawings

[0025] Figure 1 is the front view of the bonding head assembly provided by the embodiments of the present invention Figure 1 .

[0026] Figure 2 is the cross-sectional view of the nozzle assembly provided by the embodiments of the present invention.

[0027] Figure 3 is the cross-sectional view of a partial structure of the bonding head assembly provided by the embodiments of the present invention.

[0028] Figure 4 is the front view of the bonding head assembly provided by the embodiments of the present invention Figure 2 .

[0029] Figure 5 is the exploded schematic view of the nozzle assembly provided by the embodiments of the present invention.

[0030] Figure 6 is the block diagram of the eutectic equipment provided by the embodiments of the present invention.

[0031] Figure 7 is the cooperation schematic view of partial modules of the eutectic equipment provided by the embodiments of the present invention.

[0032] Figure 8 is the working state schematic view of the elastic limiting component provided by the embodiments of the present invention.

[0033] Description of the Reference Numerals:

[0034] 100, eutectic equipment; 10, bonding head assembly;

[0035] 1. Driving assembly; 11. Hollow motor; 111. Hollow channel; 12. Ordinary motor; 13. Synchronous belt assembly;

[0036] 2. Nozzle assembly; 21. Nozzle seat; 211. Through hole; 2111. Gas path connection hole; 212. Installation groove; 22. Nozzle; 221. Adsorption channel; 222. Observation window; 2221. Observation hole; 2222. Second transparent part; 22221. Avoidance hole; 223. Accommodation space; 23. First transparent part;

[0037] 3. Vision assembly; 4. Eutectic stage; 41. Eutectic area; 42. Vacuum suction hole; 43. Heating module; 5. Elastic limit assembly; 51. Elastic pressing block; 511. Elastic part; 512. Pressing block; 52. Pressing block seat; 521. Installation channel; 53. Cover plate. Detailed implementation manners

[0038] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0039] In the embodiments provided by the present invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0040] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present invention. Therefore, the "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. Those skilled in the art should also know that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to the present invention.

[0041] In various embodiments of the present invention, it should be understood that the magnitude of the sequence numbers of the above processes does not necessarily mean the inevitable sequence of execution. The execution sequence of each process should be determined according to its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

[0042] The flowcharts and block diagrams in the accompanying drawings of the present invention illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagram may represent a module, a segment of a program, or a part of code that contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, which is determined based on the functions involved. It should be particularly noted that each block in the block diagram and / or flowchart, as well as combinations of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system that performs the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0043] Please refer to Figure 1 and Figure 2 , the first embodiment of the present invention provides a head binding assembly 10. The head binding assembly 10 includes a driving assembly 1, a nozzle assembly 2, and a vision assembly 3. The nozzle assembly 2 is provided at the output end of the driving assembly 1. The nozzle assembly 2 includes a nozzle seat 21, a nozzle 22, a first transparent member 23, and a second transparent member 2222. A through hole 211 is provided in the nozzle seat 21, and the vision assembly 3 is disposed opposite to the through hole 211. The nozzle 22 is provided at one end of the through hole 211, and the first transparent member 23 is provided at the other end of the through hole 211 to close the port of the through hole 211. An adsorption channel 221 is provided through the nozzle 22, and the adsorption channel 221 communicates with the through hole 211. An air path connection hole 2111 is provided on the inner wall of the through hole 211. The nozzle 22 is further provided with a transparent observation window 222, and the observation window 222 is spaced from the adsorption channel 221. When projected along the axial direction of the through hole 211, the projection of the observation window 222 is located within the projection of the through hole 211.

[0044] It can be understood that a bonding head assembly 10 provided by an embodiment of the present invention ensures high-precision positioning of multiple chips during the eutectic mounting process by introducing a synchronous vision monitoring and correction mechanism for adjacent chips, solving the problem of poor position and angle accuracy between chips when the existing eutectic equipment 100 mounts multiple chips on the same substrate. Specifically, in this solution, a through hole 211 is provided on the nozzle seat 21, so that the nozzle seat 21 itself does not obstruct the vision component 3 from observing the chip through the adsorption channel 221 on the nozzle 22. At the same time, spaced observation windows 222 are provided on the nozzle 22, so that the vision component 3 can observe adjacent chips through the observation windows 222. An air path connection hole 2111 is provided on the inner wall of the through hole 211 to provide a vacuum adsorption function for the nozzle 22, and a first transparent member 23 is provided at one end of the through hole 211, which can achieve the effect of not affecting the operation of the vision component 3 while maintaining the system's airtightness.

[0045] It should be noted that the bonding head assembly 10 referred to in this embodiment is generally applied to eutectic or eutectic equipment for completing the chip pasting operation.

[0046] It should be noted that when projected along the axial direction of the through hole 211, the projection of the observation window 222 being located within the projection of the through hole 211 can ensure that the line of sight of the vision component 3 to the observation window 222 is not blocked.

[0047] As an implementation manner, the axial directions of the through hole 211 and the adsorption channel 221 are arranged in parallel.

[0048] As an implementation manner, the through hole 211 and the adsorption channel 221 are coaxial. The coaxial arrangement provides a direct and unobstructed observation path for the vision component 3, ensuring that the vision component 3 can directly observe the state of the chip through the through hole 211 and the adsorption channel 221, thereby achieving more precise position and attitude adjustment.

[0049] As an implementation manner, the first transparent member 23 is eutectically connected to the nozzle seat 21. For example, the first transparent member 23 can be fixed to the nozzle seat 21 by gluing or clamping.

[0050] Please continue to refer to Figure 2 , as an implementation manner, the observation window 222 includes an observation hole 2221 and a second transparent member 2222 that closes the observation hole 2221.

[0051] It can be understood that in the bonding head assembly 10 of the embodiment of the present invention, a hole is first opened in the observation window 222 and then sealed with the second transparent member 2222, completing the setting of the observation window 222 in a relatively simple assembly and production manner. Among them, the second transparent member 2222 is used to close the through hole 211 while not affecting the vision component 3 from observing the chip through it.

[0052] It should be noted that the observation window 222 can be arranged in various ways; in other embodiments, a transparent component can be directly arranged on one side of the suction nozzle 22 to form the observation window 222; or the suction nozzle 22 itself can be arranged to be made of a transparent material to form the observation window 222.

[0053] As an implementation manner, the axial direction of the observation hole 2221 is parallel to the axial direction of the through hole 211 .

[0054] As an implementation mode, high-transmittance glass is selected for the first transparent member 23 and the second transparent member 2222. High-transmittance glass has excellent optical properties, can minimize light loss, and ensure that the image quality received by the visual component 3 is higher and clearer.

[0055] See also Figure 3 As an embodiment, the driving assembly 1 includes a hollow motor 11, and the nozzle assembly 2 is arranged at the output end of the hollow motor 11. The hollow motor 11 is provided with a penetrating hollow channel 111, and the hollow channel 111 is aligned with the through hole 211; along the axial direction of the through hole 211 ( Figure 3 The projection of the through hole 211 is located within the projection of the hollow channel 111, or the projection of the through hole 211 overlaps with the projection of the hollow channel 111.

[0056] It can be understood that in the head binding assembly 10 of the embodiment of the present invention, the hollow channel 111 inside the hollow motor 11 is aligned with the through hole 211 on the nozzle seat 21 or its projection overlaps, ensuring a clear and unobstructed line of sight from the visual component 3 to the chip. This design allows the visual component 3 to directly observe the chip located in the adsorption channel 221 of the nozzle 22 through the hollow channel 111 and the through hole 211, thereby achieving accurate monitoring of the chip position and posture, that is, in the head binding assembly 10 of this embodiment, the visual component 3, the hollow motor 11 and the nozzle assembly 2 can be stacked vertically, with a simple structure and a small space occupancy rate.

[0057] See also Figure 4 As a variation, the driving component 1 may also include a common motor 12, which is disposed on the side of the nozzle component 2. The output shaft of the common motor 12 is connected to the nozzle component 2 via a synchronous belt component 13, thereby realizing a transmission connection; the visual component 3 is directly disposed above the nozzle component 2.

[0058] See also Figure 5 As an implementation manner, a mounting groove 212 is provided at one end of the nozzle holder 21 facing away from the nozzle 22 corresponding to the through hole 211 , and the first transparent member 23 is disposed in the mounting groove 212 .

[0059] It can be understood that in the bonding head assembly 10 of the embodiment of the present invention, the installation groove 212 provides a stable installation platform, enhancing the fixation of the first transparent member 23 and ensuring the reliability during long-term use.

[0060] Please continue to refer to Figure 5 , as an implementation manner, a receiving space 223 is provided between the nozzle 22 and the nozzle seat 21, and the second transparent member 2222 is disposed in the receiving space 223; the second transparent member 2222 is arranged to avoid the adsorption channel 221, or a relief hole 22221 corresponding to the adsorption channel 221 is provided on the second transparent member 2222.

[0061] It can be understood that in the bonding head assembly 10 of the embodiment of the present invention, disposing the second transparent member 2222 in the receiving space 223 between the nozzle 22 and the nozzle seat 21 can effectively protect and fix the second transparent member 2222; meanwhile, the positional relationship between the second transparent member 2222 and the adsorption channel 221 ensures that it will not interfere with the normal picking of the chip by the nozzle 22.

[0062] It should be noted that the nozzle 22 and the nozzle seat 21 are hermetically connected. After the nozzle 22 is installed on the nozzle seat 21, the air path connection hole 2111 is only communicated with the outside through the through hole 211, the relief hole 22221 and the adsorption channel 221 in sequence, so as to provide the nozzle 22 with vacuum adsorption ability.

[0063] Please refer to Figure 6 , to solve the above technical problems, the present invention provides another technical solution as follows: a eutectic device 100, including a main body and the above bonding head assembly 10 movably disposed on the main body.

[0064] It can be understood that the eutectic device 100 provided by the embodiment of the present invention also has the same beneficial effects as the above bonding head assembly 10 because it includes the above bonding head assembly 10, and will not be elaborated here.

[0065] As an implementation manner, the eutectic device 100 further includes a turntable, and at least two vacuum suction holes are provided on the turntable. The interval between adjacent vacuum suction holes on the turntable corresponds to the interval between the observation window and the adsorption channel.

[0066] Please refer to Figure 7 , as an implementation manner, the eutectic device 100 further includes a eutectic stage 4. A eutectic area 41 is provided on the eutectic stage 4, and at least one vacuum suction hole 42 is provided on the eutectic area 41; a heating module 43 is further provided on the eutectic stage 4 for heating the eutectic area 41.

[0067] It can be understood that in the eutectic device 100 of the embodiments of the present invention, the vacuum suction holes 42 and the heating module 43 on the eutectic region 41 are key components for realizing efficient and precise chip mounting; during the eutectic mounting process, the substrate needs to be precisely fixed on the eutectic stage 4 to ensure the accuracy of the mounting position. The vacuum suction holes 42 tightly adsorb the substrate on the eutectic stage 4 by generating negative pressure to prevent displacement during operation; the heating module 43 can precisely control the temperature of the eutectic region 41 to ensure that the appropriate temperature is reached to complete the eutectic process.

[0068] Please refer to Figure 8 , as an implementation manner, the eutectic device 100 further includes an elastic limit component 5. At least two elastic pressing blocks 51 are provided on the elastic limit component 5, and the interval between two adjacent elastic pressing blocks 51 matches the interval between two adjacent eutectic positions.

[0069] It can be understood that in the eutectic device of the embodiments of the present invention, the elastic pressing block 51 can provide a certain downward pressure for the chip under the eutectic process. The elastic pressing block 51 can automatically adjust the applied pressure according to chips of different thicknesses to ensure that each chip can receive appropriate pressure and achieve the application of high-precision pressure. This is not only applicable to chips of standard thickness, but also can handle chips of different thicknesses caused by manufacturing tolerances or design requirements. When chips of different specifications need to be processed, the elastic pressing block 51 can quickly respond and adjust to a suitable working state without frequently replacing hardware or performing complex recalibration, improving the operation efficiency; the interval between two adjacent elastic pressing blocks 51 matches the interval between two adjacent eutectic positions, ensuring that each chip mounting position can be accurately covered, and the elastic pressing block 51 can provide a uniform pressure distribution on the entire contact surface, avoiding problems of excessive or too small local pressure, thereby improving the quality and reliability of eutectic mounting.

[0070] Optionally, the elastic limit component 5 can be installed on the same mounting head as the nozzle component 2, or can be installed on different mounting heads respectively, that is, the elastic limit component 5 and the nozzle component 2 can be controlled to move by the same group of manipulators or can be controlled to move by different manipulators respectively, and can be designed and selected according to the actual layout and requirements of the machine tool equipment.

[0071] As an implementation manner, the elastic limit component 5 further includes a pressing block seat 52 and a cover plate 53. The pressing block seat 52 is provided with mounting channels 521 that match the number of elastic pressing blocks 51. The cover plate 53 covers the pressing block seat 52 to close the mounting channels 521. The elastic pressing block 51 includes an elastic member 511 and a pressing block 512 that are connected. One end of the elastic member 511 away from the pressing block 512 is connected to the cover plate 53, and the pressing block 512 is exposed after passing through the mounting channel 521.

[0072] It can be understood that in the eutectic device 100 according to the embodiments of the present invention, the pressure block seat 52 serves as the basic framework of the entire elastic limit component 5, providing stable support for all components. It ensures that even in a high-frequency operation environment, the elastic pressure block 51 can maintain its position and function unchanged. The cover plate 53 closes the top of the installation channel 521, preventing external dust, impurities, etc. from entering the interior and protecting the elastic member 511 and other precision components from contamination or damage. The installation channel 521 on the pressure block seat 52 provides an accurate guiding path for each elastic pressure block 51, ensuring that the pressure block 512 can move along a predetermined direction during operation without lateral deviation. This design ensures that each elastic pressure block 51 can accurately align with the corresponding chip mounting position. The presence of the elastic member 511 enables the pressure block 512 to adaptively adjust when abutting against the chip, thereby accommodating the thickness differences of the chips and providing high-precision eutectic pressure without the need to frequently replace hardware or perform complex recalibration.

[0073] To solve the above technical problems, the present invention provides another technical solution as follows: A chip mounting method, during the eutectic mounting process, chip mounting is performed through the above-mentioned bonding head assembly; the method includes the following steps:

[0074] S1: Transfer the substrate to the eutectic stage, and at least two chip mounting positions are provided on the substrate;

[0075] S2: Transfer the chip to the first chip mounting position through the suction nozzle assembly. When transferring the chip, the vision component observes the orientation of the chip through the through hole and the adsorption channel, and adjusts the orientation of the chip according to the observation results;

[0076] S3: When transferring the chip to other chip mounting positions through the suction nozzle assembly, the suction nozzle picks up the corresponding chip and moves it directly above the corresponding chip mounting position on the substrate. At this time, the adsorption channel and the observation window are respectively aligned with the chip mounting position of the already mounted chip and the chip mounting position of the to-be-mounted chip. The vision component respectively identifies the feature points of the two chips through the adsorption channel and the observation window, and at the same time, cooperates with the driving component to correct the relative position and angle of the two chips, thereby completing the mounting.

[0077] It can be understood that the chip mounting method provided by the embodiments of the present invention also has consistent beneficial effects because it uses the above-mentioned bonding head assembly for chip mounting, and will not be elaborated here.

[0078] Further, in step S1, after transferring the substrate to the eutectic stage, a negative pressure is generated through the vacuum suction holes of the eutectic stage to tightly adsorb the substrate on the eutectic stage, preventing it from shifting during the operation process and ensuring the accuracy of the mounting position.

[0079] Further, after step S3, it further includes:

[0080] Step S4: Use the elastic pressing blocks on the elastic limiting component to simultaneously hold multiple chips on the substrate, and precisely control the temperature of the eutectic region through the heating module on the eutectic stage to ensure reaching an appropriate temperature to complete the eutectic process.

[0081] Compared with the prior art, a bonding head assembly, a eutectic device, and a chip mounting method provided by the present invention have the following beneficial effects:

[0082] 1. A bonding head assembly provided in an embodiment of the present invention introduces a synchronous vision monitoring and correction mechanism for adjacent chips, ensuring that multiple chips can be highly accurately positioned during the eutectic mounting process, and solving the problem of poor position and angle accuracy between chips when multiple chips are mounted on the same substrate by existing eutectic devices; specifically, in this solution, a through hole is provided on the nozzle seat, so that the nozzle seat itself does not hinder the vision component from observing the chip through the adsorption channel on the nozzle; at the same time, spaced observation windows are provided on the nozzle, so that the vision component can observe adjacent chips through the observation windows; and air path connection holes are provided on the inner wall of the through hole to provide a vacuum adsorption function for the nozzle, and a first transparent member is provided at one end of the through hole, which can not affect the operation of the vision component while maintaining the system's sealing performance.

[0083] 2. In the bonding head assembly of the embodiment of the present invention, a hole is first opened on the observation window and then sealed with a second transparent member, completing the setting of the observation window in a relatively simple assembly and production manner; wherein, the second transparent member is used to close the through hole without affecting the vision component's observation of the chip through it.

[0084] 3. In the bonding head assembly of the embodiment of the present invention, the hollow channel inside the hollow motor is aligned with the through hole on the nozzle seat or their projections overlap, ensuring an unobstructed line of sight from the vision component to the chip. This design allows the vision component to directly observe the chip located in the adsorption channel of the nozzle through the hollow channel and the through hole, thereby realizing precise monitoring of the chip's position and posture. That is, in the bonding head assembly of this embodiment, the vision component, the hollow motor, and the nozzle assembly can be longitudinally stacked, with a simple structure and a small space occupancy rate.

[0085] 4. In the bonding head assembly of the embodiment of the present invention, the installation groove provides a stable installation platform, enhancing the fixing of the first transparent member and ensuring the reliability of long-term use.

[0086] 5. In the bonding head assembly of the embodiment of the present invention, the second transparent member is arranged in the accommodation space between the nozzle and the nozzle seat, which can effectively protect and fix the second transparent member; at the same time, the positional relationship between the second transparent member and the adsorption channel ensures that it does not interfere with the normal picking of the chip by the nozzle.

[0087] 6. The eutectic equipment provided by the embodiments of the present invention includes the above-mentioned bonding head assembly, so it also has the same beneficial effects as the above-mentioned bonding head assembly, which will not be elaborated here.

[0088] 7. In the eutectic equipment of the embodiments of the present invention, the vacuum suction holes and the heating module on the eutectic area are key components for realizing efficient and precise chip mounting; during the eutectic mounting process, the substrate needs to be accurately fixed on the eutectic stage to ensure the accuracy of the mounting position. The vacuum suction holes tightly adsorb the substrate on the eutectic stage by generating negative pressure to prevent it from shifting during the operation; the heating module can precisely control the temperature of the eutectic area to ensure that the appropriate temperature is reached to complete the eutectic process.

[0089] 8. In the eutectic equipment of the embodiments of the present invention, the elastic pressing block can provide a certain downward pressure for the chip under the eutectic process. The elastic pressing block can automatically adjust the applied pressure according to the chips of different thicknesses to ensure that each chip can receive appropriate pressure and achieve the application of high-precision pressure. This is applicable not only to chips of standard thickness but also to chips of different thicknesses caused by manufacturing tolerances or design requirements. When chips of different specifications need to be processed, the elastic pressing block can quickly respond and adjust to the appropriate working state without the need for frequent hardware replacement or complex recalibration, improving the operation efficiency; the interval between two adjacent elastic pressing blocks matches the interval between two adjacent eutectic positions, ensuring that each chip mounting position can be accurately covered. The elastic pressing block can provide a uniform pressure distribution on the entire contact surface to avoid the problem of excessive or too small local pressure, thereby improving the quality and reliability of the eutectic mounting.

[0090] 9. In the eutectic equipment of the embodiments of the present invention, the pressing block seat serves as the basic framework of the entire elastic limiting component and provides a stable support for all components. It ensures that even in a high-frequency operation environment, the elastic pressing block can maintain its position and function unchanged. The cover plate closes the top of the installation channel to prevent external dust, impurities, etc. from entering the interior and protects the elastic parts and other precision components from pollution or damage. The installation channels on the pressing block seat provide precise guiding paths for each elastic pressing block to ensure that the pressing block can move along the predetermined direction during operation without lateral offset. This design ensures that each elastic pressing block can accurately align with the corresponding chip mounting position. The existence of the elastic part enables the pressing block to adaptively adjust when abutting against the chip, thereby being compatible with the thickness difference of the chips and providing high-precision eutectic pressure without the need for frequent hardware replacement or complex recalibration.

[0091] 10. The chip mounting method provided by the embodiments of the present invention uses the above-mentioned bonding head assembly for chip mounting, so it also has the same beneficial effects, which will not be elaborated here.

[0092] The above has introduced in detail a head-binding component, an eutectic device, and a chip mounting method disclosed in the embodiments of the present invention. Specific examples are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention. Any modifications, equivalent replacements, improvements, etc. made within the principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A head binding assembly, characterized in that: The head binding assembly includes a driving assembly, a nozzle assembly and a visual assembly, wherein the nozzle assembly is arranged at the output end of the driving assembly, the nozzle assembly includes a nozzle seat, a nozzle, a first transparent member and a second transparent member, the nozzle seat is provided with a through hole, and the visual assembly is arranged to align with the through hole; The suction nozzle is arranged at one end of the through hole, and the first transparent member is arranged at the other end of the through hole and closes the port of the through hole; the suction nozzle is provided with a penetrating suction channel, the suction channel is connected to the through hole, and an air path connecting hole is provided on the inner wall of the through hole; the suction nozzle is also provided with a transparent observation window, the observation window is arranged at intervals from the suction channel, and is projected along the axial direction of the through hole, and the projection of the observation window is located within the projection of the through hole; the observation window includes an observation hole and a second transparent member closing the observation hole; The head binding assembly is used to implement chip mounting on a substrate provided with at least two chip mounting positions, and includes the following steps: The chip is transferred to the first chip mounting position through the nozzle assembly. When the chip is transferred, the visual assembly observes the position of the chip through the through hole and the adsorption channel, and adjusts the position of the chip according to the observation result; When transferring the chip to other chip mounting positions through the nozzle assembly, the nozzle takes the corresponding chip and moves it to the top of the corresponding chip mounting position on the substrate. At this time, the adsorption channel and the observation window are respectively aligned with the chip mounting position of the mounted chip and the chip mounting position of the chip to be mounted. The visual component recognizes the feature points of the two chips through the adsorption channel and the observation window respectively, and at the same time, the relative position and angle of the two chips are corrected through the cooperation of the driving component to complete the mounting.

2. The head binding assembly according to claim 1, characterized in that: The driving assembly includes a hollow motor, and the suction nozzle assembly is arranged at the output end of the hollow motor. The hollow motor is provided with a penetrating hollow channel, and the hollow channel is aligned with the through hole; when projected along the axial direction of the through hole, the projection of the through hole is located within the projection of the hollow channel, or the projection of the through hole overlaps with the projection of the hollow channel.

3. The head binding assembly according to claim 1, characterized in that: An end of the nozzle seat facing away from the nozzle is provided with a mounting groove corresponding to the through hole, and the first transparent member is arranged in the mounting groove.

4. The head binding assembly according to claim 1, characterized in that: An accommodating space is provided between the suction nozzle and the suction nozzle seat, and the second transparent member is provided in the accommodating space; the second transparent member is arranged to avoid the adsorption channel, or an avoidance hole is provided on the second transparent member corresponding to the adsorption channel.

5. A eutectic device, characterized in that: It comprises a main body and a head binding assembly as described in any one of claims 1 to 4 which is movably arranged on the main body; the eutectic equipment also comprises a transfer table arranged on the main body, the transfer table is provided with at least two vacuum suction holes, and the interval between adjacent vacuum suction holes on the transfer table corresponds to the interval between the observation window and the adsorption channel.

6. The eutectic device according to claim 5, characterized in that: The eutectic equipment also includes a eutectic table, on which a eutectic region is arranged, and on which at least one vacuum suction hole is arranged; and the eutectic table is also provided with a heating module for heating the eutectic region.

7. The eutectic device according to claim 5, characterized in that: The eutectic device further comprises an elastic limiting component, on which at least two elastic pressing blocks are arranged, and the interval between two adjacent elastic pressing blocks matches the interval between two adjacent eutectic positions.

8. The eutectic device according to claim 7, characterized in that: The elastic limiting assembly also includes a pressure block seat and a cover plate. The pressure block seat is provided with installation channels matching the number of elastic pressure blocks. The cover plate is covered on the pressure block seat to close the installation channels. The elastic pressure block includes a connected elastic member and a pressure block. One end of the elastic member away from the pressure block is connected to the cover plate, and the pressure block is exposed after passing through the installation channel.

9. A chip mounting method, characterized in that: In the eutectic bonding process, the chip is attached through the header assembly; The method comprises the following steps: Transferring the substrate to a eutectic table, the substrate being provided with at least two chip mounting positions; The chip is transferred to the first chip mounting position through the nozzle assembly. When the chip is transferred, the visual assembly observes the position of the chip through the through hole and the adsorption channel, and adjusts the position of the chip according to the observation result; When transferring the chip to other chip mounting positions through the nozzle assembly, the nozzle takes the corresponding chip and moves it to the top of the corresponding chip mounting position on the substrate. At this time, the adsorption channel and the observation window are respectively aligned with the chip mounting position of the mounted chip and the chip mounting position of the chip to be mounted. The visual component recognizes the feature points of the two chips through the adsorption channel and the observation window respectively, and at the same time, the relative position and angle of the two chips are corrected through the cooperation of the driving component to complete the mounting.

10. The chip mounting method according to claim 9, wherein: The observation window includes an observation hole and a second transparent member closing the observation hole.

11. The chip mounting method according to claim 9, wherein: The driving assembly includes a hollow motor, and the suction nozzle assembly is arranged at the output end of the hollow motor. The hollow motor is provided with a penetrating hollow channel, and the hollow channel is aligned with the through hole; when projected along the axial direction of the through hole, the projection of the through hole is located within the projection of the hollow channel, or the projection of the through hole overlaps with the projection of the hollow channel.

12. The chip mounting method according to claim 10, characterized in that: The nozzle assembly comprises a nozzle seat and a first transparent member. An installation groove is provided at one end of the nozzle seat away from the nozzle and corresponding to the through hole, and the first transparent member is arranged in the installation groove.

13. The chip mounting method according to claim 12, wherein: An accommodating space is provided between the suction nozzle and the suction nozzle seat, and the second transparent member is provided in the accommodating space; the second transparent member is arranged to avoid the adsorption channel, or an avoidance hole is provided on the second transparent member corresponding to the adsorption channel.

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