A diode structure convenient for welding and its production process

Abstract

The present application relates to a diode structure that is easy to weld, comprising a tube core, a tube shell, and two electrodes, wherein the two electrodes are formed on the tube core and extend into the tube shell, and the tube shell comprises a top connector, a middle connector, and a bottom connector. By coordinating the top connector, the middle connector, and the bottom connector, a weld seam that matches the electrodes can be pre-configured in the tube shell, thereby improving the convenience and stability of the diode during welding and fixing; by providing a polymer thickener during the molding of the top and bottom connectors, the fluidity and compaction of the powder can be improved, thereby improving the molding quality and performance of the product; by configuring the molding process of the top and bottom connectors, the molding dimensions of the top and bottom connectors can be precisely controlled during molding, and the error between the top and bottom connectors and the design dimensions can be greatly reduced.

Description

Technical Field

[0001] The present application relates to the technical field of radio frequency diodes, and in particular to a diode structure that is easy to weld and a production process thereof. Background Art

[0002] With the continuous optimization of single-chip RF chips in terms of power, efficiency, and size, analog circuit functional modules such as power amplification, filtering, and switching can be implemented on a single bare die or by stacking several chips. To ultimately integrate a fully functional microwave component in a single package, further improve the integration level, and realize the deviceization of microwave components, it is necessary to integrate digital circuit chips such as AD / DA, power control, and digital processing into the RF tube shell.

[0003] Radio frequency diodes are commonly used for amplifying and processing high-frequency signals. Their structural design must ensure electrode stability and good electrical contact. However, existing RF diodes suffer from the following issues when the electrodes are soldered into the tube housing: The electrodes can shift during the soldering process due to a lack of support, resulting in weak welds or poor electrical contact; and the solder cannot flow properly to the required filler areas, leading to poor soldering, cold joints, or incomplete welds. Summary of the Invention

[0004] In order to improve the problems raised in the above background technology, the present application provides a diode structure that is easy to weld and a production process thereof.

[0005] The present application provides a diode structure that is easy to weld using the following technical solution:

[0006] A diode structure that is easy to weld, includes a tube core, a tube shell and two electrodes, the two electrodes are formed on the tube core, and the two electrodes extend into the tube shell, the tube shell includes a top connector, a middle connector and a bottom connector, the two ends of the middle connector are fixedly connected to the opposite sides of the top connector and the bottom connector respectively, the bottom connector includes a substrate, a convex column and a bottom column, the upper surface of the substrate is in contact with the bottom of the middle connector, the convex column is formed at the top center of the substrate and extends into the bottom of the middle connector, the convex column is formed at the bottom center of the substrate and protrudes downward, the substrate separates the bottom of the inner cavity of the middle connector to form a weld for welding with the electrodes, and the top of the inner cavity of the middle connector forms a placement cavity for cooperating with the tube core installation.

[0007] Furthermore, the top connecting piece includes an annular plate, a skirt and a positioning area. The lower surface of the annular plate is in contact with the top of the middle connecting piece. The skirt is formed on the top of the annular plate and is located on the outside of the annular plate cavity. The top connecting piece is used to seal the top opening of the middle connecting piece, and the internal cavity of the skirt forms a positioning area.

[0008] Furthermore, outer walls of the top connector and the bottom connector are both provided with a nickel plating layer and a gold plating layer.

[0009] Furthermore, the middle connecting piece is configured as a ceramic ring.

[0010] The present application provides a production process for a diode structure that is easy to weld using the following technical solutions:

[0011] Step 1: Connect the middle connecting piece and the bottom connecting piece into an integrated structure by means of resistance welding;

[0012] Step 1: Place the tube core provided with two electrodes into the integrated structure consisting of the middle connector and the bottom connector obtained in step 2, and insert the two electrodes into the weld;

[0013] Step 1: Fill the gap of the weld with solder and fix the two electrodes in the tube shell by brazing;

[0014] Step 1: The top connector, the middle connector and the bottom connector obtained in the step are integrated into a complete tube shell by resistance welding, and the tube core is sealed with the top connector.

[0015] Furthermore, the bottom connector and the top connector are both made of molybdenum copper or tungsten copper mixed with lubricants, plasticizers, sintering aids, non-metallic inclusion control agents, oxide additives, silicate additives, carbide additives, polymer thickeners, and hard particle thickeners to form a powder mixture, and the powder mixture is formed into a desired shape by pressure molding or pressureless molding using a mold that cooperates with the bottom connector and the top connector. The polymer thickener is set to polyvinyl alcohol or polymethacrylate, and the polymer thickener is used to improve the fluidity and compaction of the powder mixture.

[0016] Furthermore, when the nickel plating layer and the gold plating layer on the outer surface of the bottom connector and the top connector are electroplated, a zoned electroplating method is adopted and different electroplating parameters are set for each zone to achieve plating layers of different thicknesses.

[0017] Furthermore, the area division of the zoned electroplating is performed according to the error between the actual molding of the top connector and the bottom connector and the design size, and a mask is applied on the areas not plated in the zoned electroplating to prevent the deposition of the plating solution on these areas.

[0018] The beneficial technical effects of the present application are as follows: by coordinating the top connector, the middle connector and the bottom connector, a weld that matches the electrode can be pre-configured in the tube shell, thereby improving the convenience and stability of welding and fixing the diode; by setting the polymer thickener during the molding of the top connector and the bottom connector, the fluidity and compaction of the powder can be improved, thereby improving the molding quality and performance of the product; by setting the molding process of the top connector and the bottom connector, the molding dimensions of the top connector and the bottom connector can be accurately controlled during molding, and the error between the top connector and the design dimension is greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 1 is a schematic structural diagram of a tube shell in a diode structure that is easy to weld according to an embodiment of the present application;

[0020] Figure 2 yes Figure 1 Front view of the middle tube shell;

[0021] Figure 3 yes Figure 1 Schematic diagram of the structure after the middle tube shell is cut open;

[0022] Figure 4 yes Figure 1 Cross-sectional view of the mid-tube shell.

[0023] Figure numerals: 10, top connector; 11, annular plate; 12, skirt; 13, positioning area; 20, middle connector; 30, bottom connector; 31, base plate; 32, boss; 33, bottom column; 40, weld. DETAILED DESCRIPTION

[0024] The following will clearly and completely describe the technical solution of this application in conjunction with the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0025] The embodiments of the present application disclose a diode structure that is easy to weld and a production process thereof.

[0026] The diode structure convenient for soldering includes a tube core, a tube shell and two electrodes, wherein the two electrodes are formed on the tube core and extend into the tube shell. Figures 1 to 4 The tube shell includes a top connector 10, a middle connector 20 and a bottom connector 30. The two ends of the middle connector 20 are fixedly connected to the opposite sides of the top connector 10 and the bottom connector 30 respectively.

[0027] In this embodiment, the top connector 10 may include an annular plate 11, a skirt 12, and a positioning area 13. The lower surface of the annular plate 11 is in contact with the top of the middle connector 20. The skirt 12 is formed on the top of the annular plate 11 and is located outside the cavity of the annular plate 11. The top connector 10 is used to cover the top opening of the middle connector 20. The inner cavity of the skirt 12 forms the positioning area 13.

[0028] In this embodiment, the middle connecting member 20 can be made of ceramic material and have an annular structure.

[0029] In this embodiment, the bottom connector 30 may include a base plate 31, a protrusion 32, and a bottom post 33. The upper surface of the base plate 31 is in contact with the bottom of the middle connector 20. The protrusion 32 is formed at the top center of the base plate 31 and extends into the bottom of the middle connector 20. The protrusion 32 is formed at the bottom center of the base plate 31 and protrudes downward. The base plate 31 separates the bottom of the inner cavity of the middle connector 20 to form a weld 40 for welding with the electrode. The top of the inner cavity of the middle connector 20 forms a placement cavity for accommodating the tube die installation.

[0030] In this embodiment, the top connector 10 and the bottom connector 30 can be made of molybdenum copper or tungsten copper material to form an integral structure, and the outer walls of the top connector 10 and the bottom connector 30 can also be electroplated with nickel and gold layers in sequence.

[0031] In this embodiment, when the bottom connector 30 and the top connector 10 are made of molybdenum copper or tungsten copper to form an integral structure, they can be mixed with lubricants, plasticizers, sintering aids, non-metallic inclusion control agents, oxide additives, silicate additives, carbide additives, polymer thickeners, and hard particle thickeners to form a powder mixture. Then, using a mold that matches the bottom connector 30 and the top connector 10, the powder mixture is formed into a desired shape by pressure molding or pressureless molding.

[0032] Lubricants can include fatty acids, fatty acid salts, fatty acid esters, alcohols, amines, amides, and high molecular polymers. The friction between the metal powder and the mold can cause wear on the mold surface, which in turn exacerbates wear and failure of the equipment. Lubricants can significantly reduce the friction and wear between the mold and the metal powder, thereby extending the service life of the mold. In addition, lubricants can form a coating on the surface of the metal powder and enhance the plastic deformation ability of the powder, which helps to form uniform compaction and deformation, thereby improving the forming quality of the workpiece. The use of lubricants can also avoid errors and irregular shapes of metal powder during the pressing process, thereby improving the surface quality and dimensional accuracy of the workpiece. Plasticizers can be high-boiling point liquid compounds such as esters or low-melting point solid organic compounds. Their main function is to change the rheological properties of the system so that it exhibits good forming performance in the plastic forming process.

[0033] Polymer thickeners, such as polyvinyl alcohol or polymethacrylate, are used to improve the flowability and compactability of the powder mixture. Plasticizer molecules can be inserted between binder polymer molecules, separating the binder component molecules and providing more space for the binder molecules to move. This increases their free volume, thereby reducing the various attractive forces between the binder polymer molecules and improving the rheological properties of the system. By improving the rheological properties of the system, plasticizers can make it easier for the metal powder mixture to form into the desired shape during pressurized or pressureless molding, thereby improving formability. Furthermore, the use of plasticizers can enhance the toughness of the material, making it more resistant to deformation and fracture during subsequent processing and use.

[0034] Sintering aids can be various inorganic and organic compounds, such as alkali metal oxides, alkaline earth metal oxides, halides, borides, carbides, and polymers. Sintering aids can lower the melting point of powder metallurgy materials, facilitating the sintering process. They react with oxides on the surface of metal powders to form low-melting-point eutectics, thereby promoting the sintering reaction. Sintering aids can also improve material properties by refining grain size, reducing porosity, and increasing densification.

[0035] Non-metallic inclusion control agents can be various inorganic salts, oxides, sulfides, and polymers. Their primary function is to remove or reduce non-metallic inclusions in metal powders. These agents can remove non-metallic inclusions, such as oxides and sulfides, from metal powders through chemical reactions or physical adsorption, thereby increasing the purity of the material and improving its physical and mechanical properties.

[0036] Oxide additives can be a variety of metal oxides and non-metal oxides, such as aluminum oxide, copper oxide, zinc oxide, and magnesium oxide. They can react with metal powder to form solid solutions or compounds, thereby improving material properties. Oxide additives can serve as heterogeneous nucleation cores, promoting the nucleation and growth of metal powder during sintering, thereby refining the grain size and reducing porosity, thereby improving the hardness of the material.

[0037] Silicate additives can be various silicate minerals and synthetic silicate compounds, such as sodium silicate, calcium silicate, and aluminum silicate. They react with metal powder to form silicate compounds or glass phases, thereby improving material properties. Silicate additives can promote the densification of metal powders during sintering, reduce porosity, increase the material's densification, and enhance fracture resistance and heat resistance during use.

[0038] Carbide additives can adopt various metal carbides and non-metal carbides, such as silicon carbide, tungsten carbide, titanium carbide, etc. They can improve the performance of the material by reacting with metal powder to form carbide compounds or reinforcement phases.

[0039] Hard particle thickeners can be silicon carbide, diamond, etc., which can improve the hardness and wear resistance of the product, making the product more durable.

[0040] During the electroplating process for the nickel and gold plating layers on the outer surfaces of the bottom connector 30 and the top connector 10, a zoned electroplating method is used, with different plating parameters set for each zone to achieve different thicknesses of plating. The purpose of using zoned electroplating for the plating is to compare the post-molding dimensional measurements of the bottom connector 30 and the top connector 10 with the designed dimensions. The top connector 10 and the bottom connector 30 are then zoned based on the deviations between the actual molded dimensions and the designed dimensions. By applying different coating thicknesses to different zones, more accurate production control can be achieved for the bottom connector 30 and the top connector 10 after manufacture. During zoned electroplating, a mask can be applied to the unplated areas to prevent deposition of the plating solution in these areas.

[0041] After marking each area, determine the electroplating parameters for each area, including current density, electroplating time, and electroplating solution composition. In the partition electroplating process, the electroplating thickness calculation formula is as follows:

[0042] σ = t × D × η × K;

[0043] in:

[0044] σ is the coating thickness (μm);

[0045] t is the electroplating time (min);

[0046] D is the current density (A / dm²);

[0047] η is the current efficiency;

[0048] K is the electrochemical equivalent (g / Ah), which represents the amount of electricity required to dissolve 1g of any substance at the anode or deposit it at the cathode.

[0049] The production process of a diode structure that is easy to weld includes the following steps:

[0050] Step 1: Connecting the middle connecting member 20 and the bottom connecting member 30 .

[0051] First, the middle connector 20 and the bottom connector 30 are connected to form a single structure using resistance welding. Resistance welding uses the resistance heat generated by an electric current passing through the contact surface and adjacent areas of two workpieces to heat them to a molten or plastic state, thus forming a metallic bond. This welding method offers advantages such as high welding speed, high welding quality, and simple operation, making it well-suited for the production and processing of this diode structure.

[0052] During the connection process, parameters such as welding current, welding time, and welding pressure need to be strictly controlled to ensure the quality and stability of the weld 40. At the same time, the weld 40 also needs to be inspected and tested as necessary to ensure that it meets the design requirements.

[0053] Step 2: Placement of the die and insertion of the electrodes.

[0054] Place the tube die with two electrodes into the integrated structure consisting of the middle connector 20 and the bottom connector 30 obtained in step 1. During placement, ensure the tube die is positioned accurately and the electrodes are aligned with the weld seam 40. Then, insert the two electrodes into the weld seam 40 to prepare for the subsequent welding process.

[0055] Step 3: Filling with solder and welding the electrodes.

[0056] Solder is placed in the gap of weld seam 40. Solder is a metal or alloy material that can lower the melting temperature of the materials being welded and form a good weld. When filling the solder, parameters such as the type, quantity, and filling method of the solder need to be controlled to ensure a smooth welding process and stable welding quality.

[0057] The two electrodes are then brazed to secure them within the tube shell. Brazing is a welding method that uses a filler metal with a lower melting point than the parent metal. The weldment and filler metal are heated to a temperature above the filler metal's melting point but below that of the parent metal. The liquid filler metal wets the parent metal surface, filling the gaps in the joint and then diffuses into the parent metal to create a connection. This welding method offers advantages such as low welding temperature, minimal impact on the parent metal, and smooth, even welded joints.

[0058] During the welding process, parameters such as welding temperature, welding time and welding atmosphere need to be strictly controlled to ensure welding quality and electrode stability. At the same time, necessary inspections and tests are also required on the welded joints to ensure that they meet the design requirements.

[0059] Step 4: Soldering of the top connector 10 and capping of the die.

[0060] The top connector 10 is integrated with the middle connector 20 and the bottom connector 30 obtained in step 1 by resistance welding to form a complete tube shell. During the welding process, it is necessary to ensure that the connection between the top connector 10, the middle connector 20, and the bottom connector 30 is firm and the weld quality is good.

[0061] The die is then capped with the top connector 10. During the capping process, it is necessary to ensure that the gap between the top connector 10 and the die is appropriate. Furthermore, the capped diodes must be inspected and tested to ensure they meet design and usage requirements.

[0062] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A diode structure that is easy to weld, comprising a tube core, a tube shell, and two electrodes, wherein the two electrodes are formed on the tube core and extend into the tube shell, characterized in that: The tube shell comprises a top connector (10), a middle connector (20) and a bottom connector (30), wherein two ends of the middle connector (20) are fixedly connected to opposite sides of the top connector (10) and the bottom connector (30), respectively. The bottom connecting member (30) comprises a base plate (31), a convex column (32) and a bottom column (33); the upper surface of the base plate (31) is in contact with the bottom of the middle connecting member (20); the convex column (32) is formed at the top center of the base plate (31) and extends into the bottom of the middle connecting member (20); the convex column (32) is formed at the bottom center of the base plate (31) and protrudes downward; The substrate (31) separates the bottom of the inner cavity of the middle connector (20) to form a weld (40) for welding with the electrode, and the top of the inner cavity of the middle connector (20) forms a placement cavity for cooperating with the tube core installation.

2. A diode structure that is easy to weld according to claim 1, characterized in that: The top connector (10) comprises an annular plate (11), a skirt (12) and a positioning area (13); the lower surface of the annular plate (11) is in contact with the top of the middle connector (20); the skirt (12) is formed on the top of the annular plate (11) and is located outside the cavity of the annular plate (11); the top connector (10) is used to cover the top opening of the middle connector (20); and the internal cavity of the skirt (12) forms the positioning area (13).

3. A diode structure that is easy to weld according to claim 2, characterized in that: Nickel plating layers and gold plating layers are provided on the outer walls of the top connecting piece (10) and the bottom connecting piece (30).

4. A diode structure that is easy to weld according to claim 3, characterized in that: The middle connecting piece (20) is configured as a ceramic ring.

5. A process for producing a diode structure that is easy to weld according to any one of claims 1 to 4, characterized in that: The following steps are involved: Step 1: The middle connector (20) and the bottom connector (30) are connected into an integral structure by resistance welding. When the nickel-plated layer and the gold-plated layer on the outer surface of the bottom connector (30) and the top connector (10) are electroplated, a zoned electroplating method is adopted and different electroplating parameters are set for each zone to achieve different thicknesses of the plating layer. The zoned electroplating area is divided according to the error between the actual molding of the top connector (10) and the bottom connector (30) and the design size. In the zoned electroplating process, the electroplating thickness calculation formula is as follows: σ = t × D × η × K; in: σ is the coating thickness; t is the electroplating time; D is the current density; η is the current efficiency; K is the electrochemical equivalent, which represents the amount of electricity required to dissolve 1g of any substance at the anode or precipitate 1g at the cathode; Step 2: Place the tube core provided with two electrodes into the integrated structure consisting of the middle connector (20) and the bottom connector (30) obtained in step 1, and insert the two electrodes into the weld (40); Step 3: Fill the gap of the weld (40) with solder, and fix the two electrodes in the tube shell by soldering; Step 4: The top connector (10), the middle connector (20) and the bottom connector (30) obtained in step 1 are integrated into a complete tube shell by resistance welding, and the tube core is sealed with the top connector (10).

6. The process for producing a diode structure that is easy to weld according to claim 5, characterized in that: The bottom connector (30) and the top connector (10) are both made of molybdenum copper or tungsten copper mixed with a lubricant, a plasticizer, a sintering aid, a non-metallic inclusion control agent, an oxide additive, a silicate additive, a carbide additive, a polymer thickener, and a hard particle thickener to form a powder mixture, and the powder mixture is formed into a desired shape by pressure molding or pressureless molding using a mold that matches the bottom connector (30) and the top connector (10).

7. The process for producing a diode structure that is easy to weld according to claim 6, characterized in that: The polymer viscosity enhancer is configured as polyvinyl alcohol or polymethacrylate, and is used to improve the fluidity and compactibility of the powder mixture.

8. The process for producing a diode structure that is easy to weld according to claim 5, characterized in that: In the zone electroplating, a mask is applied on the areas not to be electroplated to prevent the deposition of the electroplating solution on these areas.

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