Front-end conditioning circuit integrated packaging module and packaging method for gravitational waves

Abstract

The present invention relates to an integrated packaging module and packaging method for a front-end conditioning circuit for gravitational waves, belonging to the field of semiconductor packaging technology. The front-end circuit is integrated into a single package, significantly reducing the circuit area and facilitating temperature control, which is beneficial for improving the temperature consistency of the front-end conditioning circuit. The integrated packaging of the front-end conditioning circuit also facilitates electromagnetic interference protection of the circuit. When measuring in space environments, it can avoid the impact of cosmic radiation on the front-end analog circuit of the measurement system, greatly enhancing the anti-interference capability of the measurement system. The module is suitable for precise measurement of gravitational wave signals in space-borne and high-radiation applications.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor packaging technology, and in particular relates to an integrated packaging module and packaging method for a front-end conditioning circuit for gravitational waves. Background Art

[0002] Weak signal detection is an important research direction in modern electronic technology and signal processing technology. It involves accurately extracting, recovering and measuring weak signals from complex background noise. Such signals are usually easily masked due to their extremely low amplitude. Therefore, improving the ability to detect weak signals is of great significance in scientific research, engineering applications and daily life.

[0003] Interstellar laser interferometry systems for space-based gravitational wave detection place extremely high demands on the accuracy of detecting weak signals like gravitational waves. The performance of front-end conditioning circuits is particularly crucial. These circuits must possess an excellent noise floor and robust interference immunity. Existing front-end signal circuits often utilize discrete components, which results in long circuits and significant board space occupation. This makes signals susceptible to interference and makes impedance consistency difficult to control, hindering effective extraction, amplification, and filtering of gravitational wave signals.

[0004] Integrating the front-end conditioning circuit into an integrated chip can significantly reduce the circuit area, making measures to combat electromagnetic radiation interference and circuit temperature consistency more efficient, and also improving the front-end conditioning circuit's weak signal acquisition performance. An integrated chip integration solution based on IPD (Integrated Passive Devices) technology can achieve effective integration of front-end conditioning circuit components by etching directly on the wafer. However, active amplifier components such as operational amplifiers cannot be directly integrated and often require external amplifier circuits and single-ended to differential conversion circuits to achieve integration, thus failing to maximize circuit area reduction. Furthermore, due to the highly customized design structure within passive integrated devices, impedance discontinuities are prone to occur when connecting the passive integrated devices to external circuits, causing signal reflections. This also hinders the overall temperature control of the front-end conditioning circuit, resulting in poor temperature consistency and poor measurement of weak signals. Therefore, there is a need for a method for integrating the front-end conditioning circuit into an integrated package to improve the front-end conditioning circuit's processing performance for weak signals. Summary of the Invention

[0005] To address the aforementioned problems in the prior art, the present invention provides an integrated packaging module and packaging method for a front-end conditioning circuit for gravitational waves. The technical problems to be solved by the present invention are achieved through the following technical solutions:

[0006] The present invention provides an integrated packaging module for a front-end conditioning circuit for gravitational waves, comprising: a front-end conditioning circuit, a silicon wafer, an ABF interconnect substrate, and packaging pins. Several silicon wafers are spaced apart on the ABF interconnect substrate, and several front-end conditioning circuits are laid out on the silicon wafers in a one-to-one correspondence to form several signal pathways. The signal pathways are isolated from each other, and each signal pathway is used to receive and amplify a gravitational wave signal to be measured. Several packaging pins are evenly spaced apart on the lower surface of the ABF interconnect substrate, and several through-holes are spaced apart on each silicon wafer. The front-end conditioning circuit is connected to the ABF interconnect substrate via the through-holes, and is interconnected with the several packaging pins via the ABF interconnect substrate.

[0007] In one embodiment of the present invention, each front-end conditioning circuit includes: a first bandpass filter, a two-stage operational amplifier, and a second bandpass filter connected in sequence; the first bandpass filter is used to receive and filter the gravitational wave signal to be measured to obtain a first filtered signal; the two-stage operational amplifier is used to perform two-stage amplification on the first filtered signal to obtain a two-stage amplified signal; and the second bandpass filter is used to filter the two-stage amplified signal to obtain a second filtered signal.

[0008] In one embodiment of the present invention, the front-end conditioning circuit integrated packaging module further includes: a resistive pilot distribution module; the resistive pilot distribution module is arranged on the ABF interconnect substrate and is respectively connected to a plurality of front-end conditioning circuits; the resistive pilot distribution module is used to receive a pilot signal and distribute the pilot signal into a plurality of pilot operation signals.

[0009] In one embodiment of the present invention, each front-end conditioning circuit further includes: a fully differential amplifier; the fully differential amplifier is connected to the ABF interconnect substrate via a plurality of through holes and is interconnected with the resistive pilot distribution module via the ABF interconnect substrate; the fully differential amplifier is connected to the second bandpass filter and is used to perform a differential operation on the second filtered signal and the pilot operation signal to obtain and output a differential signal.

[0010] In one embodiment of the present invention, each signal path further includes: a programmable resistor connected to the two-stage operational amplifier, and configured to change the amplification factor of the two-stage operational amplifier by changing the resistance value.

[0011] In one embodiment of the present invention, the plurality of through holes are filled with a conductive material, and the conductive material includes copper.

[0012] In one embodiment of the present invention, the first bandpass filter and the second bandpass filter are both resistor-capacitor filters; the first bandpass filter and the second bandpass filter both include a plurality of resistor-capacitor components, and the resistor-capacitor components include resistors or capacitors.

[0013] The present invention also provides a packaging method for a front-end conditioning circuit for gravitational waves, comprising:

[0014] Step 1: Place several silicon chips and resistive pilot distribution modules on an ABF interconnect substrate. Place a first bandpass filter, a two-stage operational amplifier die, a second bandpass filter, a fully differential amplifier die, and a programmable resistor die on each silicon chip in sequence.

[0015] Step 2: Using RDL technology, fan out several pins of the first bandpass filter, the two-stage operational amplifier die, the second bandpass filter, the fully differential amplifier die, and the programmable resistor die to correspondingly placed silicon wafers; wherein the several pins include interconnect pins and input and output pins;

[0016] Step 3: sequentially connecting the first bandpass filter, the two-stage operational amplifier die, the second bandpass filter, the fully differential amplifier die, and the programmable resistor die on each silicon wafer through a plurality of interconnect pins to form a plurality of signal paths;

[0017] Step 4: A plurality of through holes are provided on each silicon wafer, and a plurality of input and output pins are led out to the ABF interconnect substrate through the plurality of through holes to respectively connect the resistive pilot distribution module and a plurality of BGA package pins of the ABF interconnect substrate;

[0018] Step 5: Encapsulate several silicon chips and the ABF interconnect substrate in a metal shell and fill it with thermal conductive material.

[0019] In one embodiment of the present invention, the first bandpass filter and the second bandpass filter both include a plurality of resistor and capacitor components, the plurality of resistor and capacitor components of the first bandpass filter are interconnected by bonding wires, and the plurality of resistor and capacitor components of the second bandpass filter are interconnected by bonding wires; the two-stage operational amplifier bare chip and the fully differential amplifier bare chip both include a plurality of peripheral components, the plurality of peripheral components of the two-stage operational amplifier bare chip and its interconnection pins are interconnected by bonding wires, and the plurality of peripheral components of the fully differential amplifier bare chip and its interconnection pins are interconnected by bonding wires.

[0020] In one embodiment of the present invention, the input and output pins include: a test signal input pin, a pilot signal input pin, a communication configuration pin, and a differential signal output pin.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The present invention's integrated packaging module for the front-end conditioning circuit for gravitational waves utilizes system-level packaging technology to integrate the front-end circuit into a single package. This significantly reduces circuit area and facilitates temperature control, which helps improve the temperature consistency of the front-end conditioning circuit, making it less susceptible to temperature fluctuations. This improves signal stability and avoids measurement errors caused by temperature changes. The integrated packaging of the front-end conditioning circuit also facilitates electromagnetic interference protection for the circuit. When measuring in space environments, it can prevent the impact of cosmic radiation on the front-end analog circuits of the measurement system, greatly enhancing the measurement system's anti-interference capability. This makes it suitable for precise measurement of gravitational wave signals in spaceborne and high-radiation applications.

[0023] The present invention integrates various modules of the front-end circuit on independent silicon chips. The front-end circuit on each silicon chip forms a signal path, which increases the isolation between signal paths and reduces signal crosstalk.

[0024] The present invention encapsulates a resistive pilot distribution module within the module and uses a pilot insertion method to individually reduce the time jitter noise in each signal path to eliminate the impact of time jitter. The fully differential amplifier directly outputs a differential signal that is a mixture of the gravitational wave signal to be measured and the pilot signal, which also facilitates the subsequent digital circuit to directly use this differential signal for pilot correction operations.

[0025] Under the premise of realizing the integration of the front-end conditioning circuit, the present invention adopts a programmable resistor as the feedback resistor of the operational amplifier, and realizes a variable amplification factor through the programmable resistor. Under the premise of ensuring integration, the portability of use is increased, and a flexible configuration method is provided to meet different project requirements, thereby greatly improving the project development efficiency.

[0026] The present invention's packaging method for an integrated front-end conditioning circuit module for gravitational waves integrates and packages the front-end conditioning circuit, facilitating temperature control and electromagnetic protection in the system. This ensures better temperature consistency in the front-end conditioning circuit and suppresses measurement noise. The packaged module can be used in strong electromagnetic radiation environments such as outer space, facilitating the detection of gravitational wave signals.

[0027] The present invention adopts a bare tape chip to solve the impedance discontinuity problem caused by the traditional wafer packaging structure, effectively suppressing signal reflection; and adopts a bonding wire packaging process to greatly shorten the transmission and interconnection length of the signal path, improve the interconnection impedance accuracy, reduce the influence of signal transmission reflection and crosstalk, and achieve the purpose of suppressing the transmission phase change of the signal.

[0028] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 1 is a schematic structural diagram of an integrated packaging module for a front-end conditioning circuit for gravitational waves provided by an embodiment of the present invention;

[0030] Figure 2 1 is a cross-sectional view of a front-end conditioning circuit integrated packaging module for gravitational waves provided by an embodiment of the present invention;

[0031] Figure 3 is a structural block diagram of a front-end conditioning circuit provided by an embodiment of the present invention;

[0032] Figure 4 1 is a structural perspective view of an integrated packaging module for a front-end conditioning circuit for gravitational waves provided by an embodiment of the present invention;

[0033] Figure 5 This is a flow chart of a method for integrating a front-end conditioning circuit for gravitational waves provided by an embodiment of the present invention.

[0034] Icons: 1-front-end conditioning circuit; 10-first bandpass filter; 20-two-stage operational amplifier; 30-second bandpass filter; 40-fully differential amplifier; 50-programmable resistor; 2-silicon wafer; 21-through hole; 3-ABF interconnect substrate; 4-package pin; 5-resistive pilot distribution module. DETAILED DESCRIPTION

[0035] To further illustrate the technical means and effects employed by the present invention to achieve the intended purpose, the following detailed description of an integrated packaging module and packaging method for a front-end conditioning circuit for gravitational waves, as proposed in the present invention, is provided in conjunction with the accompanying drawings and specific embodiments.

[0036] The aforementioned and other technical contents, features, and effects of the present invention are clearly presented in the following detailed description of the specific embodiments in conjunction with the accompanying drawings. Through the description of the specific embodiments, a deeper and more specific understanding of the technical means and effects adopted by the present invention to achieve the intended purpose can be obtained. However, the accompanying drawings are provided for reference and illustration purposes only and are not intended to limit the technical solutions of the present invention.

[0037] Example 1

[0038] like Figures 1 to 4As shown, the present invention provides an integrated packaging module for a front-end conditioning circuit for gravitational waves, comprising: a front-end conditioning circuit 1, a silicon wafer 2, an ABF interconnect substrate 3, and packaging pins 4. Several silicon wafers 2 are spaced apart on the ABF interconnect substrate 3, and several front-end conditioning circuits 1 are laid out one-to-one on the several silicon wafers 2 to form several signal pathways. The several signal pathways are isolated from each other, and each signal pathway is used to receive and amplify a gravitational wave signal to be measured. Several packaging pins 4 are evenly spaced apart on the lower surface of the ABF interconnect substrate 3, and several through-holes 21 are spaced apart on each silicon wafer 2. The front-end conditioning circuit 1 is connected to the ABF interconnect substrate 3 through the several through-holes 21, and is interconnected with the several packaging pins 4 through the ABF interconnect substrate 3.

[0039] In this embodiment, each front-end conditioning circuit 1 includes: a first bandpass filter 10, a two-stage operational amplifier 20, and a second bandpass filter 30 connected in sequence; the first bandpass filter 10 is used to receive and filter the gravitational wave signal to be measured to obtain a first filtered signal; the two-stage operational amplifier 20 is used to perform two-stage amplification on the first filtered signal to obtain a two-stage amplified signal; and the second bandpass filter 30 is used to filter the two-stage amplified signal to obtain a second filtered signal.

[0040] In this embodiment, the front-end conditioning circuit integrated packaging module further includes: a resistive pilot distribution module 5; the resistive pilot distribution module 5 is arranged on the ABF interconnect substrate 3 and is respectively connected to a plurality of front-end conditioning circuits 1; the resistive pilot distribution module 5 is used to receive the pilot signal and distribute the pilot signal into a plurality of pilot operation signals.

[0041] In this embodiment, each front-end conditioning circuit 1 further includes: a fully differential amplifier 40; the fully differential amplifier 40 is connected to the ABF interconnect substrate 3 through a plurality of through holes 21, and is interconnected with the resistive pilot distribution module 5 through the ABF interconnect substrate 3; the fully differential amplifier 40 is connected to the second bandpass filter 30, and is used to perform a differential operation on the second filtered signal and the pilot operation signal to obtain and output a differential signal.

[0042] The principle is that for gravitational wave signal detection, noise floor performance in the MHz frequency band is particularly important, and the impact of sampling time jitter is particularly significant. Sampling time jitter mainly includes encoding clock jitter and analog-to-digital converter (ADC) aperture jitter. Sampling time jitter causes the actual sampling time to deviate from the ideal sampling time, thereby introducing phase measurement error. The magnitude of the phase measurement error is proportional to the frequency of the gravitational wave signal to be detected. Taking a heterodyne laser interferometer as an example, its phase meter is used to measure the phase difference between two interferometric beat signals. The two phase signals are affected by different sampling time jitter noise. Because the two ADCs use the same encoding clock, most of the encoding clock jitter effect in the differential phase can be subtracted by the differential. However, the remaining clock jitter noise is still limited by the common-mode rejection ratio of the two ADC clock lines. Therefore, the sampling time jitter noise of each channel must be reduced separately. The influence of timing jitter can be eliminated by inserting a pilot tone. This requires mixing a high-frequency signal into the gravitational wave signal to be measured. Therefore, the gravitational wave signal to be measured and the high-frequency pilot tone signal are connected to the positive and negative differential inputs of a fully differential amplifier 40, respectively, to perform a differential operation on the two signals. After the differential operation, the two differential signals are transmitted to the ADC chip in the back-end circuit for acquisition, thus eliminating the influence of timing jitter.

[0043] In an optional embodiment, each signal path further includes: a programmable resistor 50 , which is connected to the two-stage operational amplifier 20 and is used to change the amplification factor of the two-stage operational amplifier 20 by changing the resistance value.

[0044] In an optional embodiment, the first bandpass filter 10 and the second bandpass filter 30 are both resistor-capacitor filters; the first bandpass filter 10 and the second bandpass filter 30 both include a plurality of resistor-capacitor components, which include resistors or capacitors.

[0045] It's worth noting that since the gravitational wave signals to be measured are distributed within the 5MHz to 25MHz range, it's necessary to ensure the amplitude of the gravitational wave signals within the passband, maintain phase distortion, and filter out noise signals outside the passband. Therefore, both the first bandpass filter 10 and the second bandpass filter 30 utilize a quintic Bessel bandpass filter structure, which offers minimal phase shift distortion and excellent amplitude-frequency ripple characteristics. Furthermore, to achieve a high signal amplification factor, and given the relatively low gain-bandwidth product of current domestic operational amplifiers, a two-stage operational amplifier structure is employed in this embodiment.

[0046] Taking the setting of 4 signal paths as an example, the integrated packaging module of the front-end conditioning circuit for gravitational waves in this embodiment includes 5 strip-shaped areas, such as Figure 1 As shown, a resistive pilot distribution module 5 is placed in the central area of ​​the ABF interconnect substrate 3 to implement the one-to-four pilot signal splitting function. To achieve effective signal isolation, two silicon wafers 2 are placed on either side of the resistive pilot distribution module 5. A first bandpass filter 10, a two-stage operational amplifier 20, a second bandpass filter 30, and a fully differential amplifier 40 are then sequentially placed on each silicon wafer 2 to form a total of four signal paths. The components in the front-end conditioning circuit 1 are first interconnected through the silicon wafer 2 to achieve signal lines. Signal lines that need to be led outward are connected to the ABF interconnect substrate 3 by drilling holes in the silicon wafer 2. Further connections to components outside the silicon wafer 2 are achieved through the ABF interconnect substrate 3 and several package pins 4.

[0047] It is understandable that any number of front-end circuits may be integrated to form corresponding signal paths, and the number of signal paths is not limited in this embodiment.

[0048] For example, Figure 2 and Figure 3 As shown, various components of the front-end circuit 1 are placed on the silicon wafer 2, and an ABF interconnect substrate 3 is located below the silicon wafer 2. Several through holes 21 are filled with conductive materials to achieve signal transmission, and the conductive materials include copper.

[0049] like Figures 1 to 3 The figure below illustrates the integrated package module for the front-end conditioning circuit for gravitational waves of this embodiment. Internally, the module comprises a first bandpass filter 10, a two-stage operational amplifier 20, a second bandpass filter 30, a fully differential amplifier 40, and a resistive pilot distribution module 5, each connected to its peripheral circuitry. The fully differential amplifier 40 introduces the pilot operation signal output by the resistive pilot distribution module 5 into the signal path. Externally, the four signal paths are interconnected with several package pins 4 via an ABF interconnect substrate 3, which in turn connects to external circuitry via these pins, facilitating user development and use.

[0050] For example, the two-stage operational amplifier 20 can use the domestic chip SC7503, which has the advantages of low noise, high slew rate and large gain-bandwidth product; the fully differential amplifier 40 can use the domestic chip SC7516; the programmable resistor 50 can use the AD5272 chip, and the resistance control can be completed through the IIC (Inter-Integrated Circuit, integrated circuit bus) communication protocol to adjust the amplification factor of the two-stage operational amplifier 20.

[0051] It is understandable that the models of the two-stage operational amplifier 20 , the fully differential amplifier 40 and the programmable resistor 50 can be selected according to actual needs, and this embodiment does not limit the specific models.

[0052] The operating principle of this embodiment of the integrated front-end conditioning circuit package module for gravitational waves is that the front-end conditioning circuit 1, comprising a first bandpass filter 10, a two-stage operational amplifier 20, a second bandpass filter 30, a fully differential amplifier 40, and a programmable resistor 50, is integrated on a silicon chip to achieve noise filtering and amplification of the gravitational wave signal to be measured. The gravitational wave signal to be measured passes sequentially through the first bandpass filter 10, the two-stage operational amplifier 20, the second bandpass filter 30, and the differential amplifier 40. An externally input pilot signal is converted into four pilot operation signals by a resistive pilot distribution module 5. These four pilot operation signals are then differentially processed with the processed gravitational wave signal to be measured in four corresponding fully differential amplifiers 40. The fully differential amplifiers 40 ultimately output the combined differential signals.

[0053] It's worth noting that since the gravitational wave signal received in this embodiment is a voltage signal converted by a four-quadrant photodiode in the preceding stage, the directly converted voltage signal may contain spike noise, which can saturate the amplifier circuit, leading to measurement errors and even damage to subsequent devices. Furthermore, the directly converted voltage signal also contains certain signal spurs. Therefore, passing it through a first bandpass filter 10 can improve the quality of the gravitational wave signal to be measured. After filtering, the improved gravitational wave signal to be measured is effectively amplified within a specified bandwidth in a two-stage operational amplifier 20. Furthermore, since the weak signal, after passing through the two-stage operational amplifier 20, will introduce the amplifier's own noise and peripheral circuit noise, a second bandpass filter 30 is added after the two-stage operational amplifier 20 to improve signal quality.

[0054] It is understandable that the overall circuit structure of the front-end conditioning circuit 1 can also correspond to different application scenarios. For example, the current structure of filtering-amplification-filtering-single-ended to differential can be adjusted to different structures such as amplification-filtering-single-ended to differential, filtering-amplification-single-ended to differential or amplification-single-ended to differential. This is not limited in this embodiment.

[0055] The present invention's integrated front-end conditioning circuit packaging module for gravitational waves, based on system-in-package (SiP) technology, integrates the front-end circuit into an integrated package. This significantly reduces circuit area, saves PCB (Printed Circuit Board) board space, and facilitates temperature control, which helps improve the temperature consistency of the front-end conditioning circuit, making it less susceptible to temperature fluctuations, improving signal stability, and avoiding measurement errors caused by temperature changes. The integrated packaging of the front-end conditioning circuit also helps protect the circuit from electromagnetic interference. When measuring in space environments, it can prevent the impact of cosmic radiation on the front-end analog circuit of the measurement system, greatly enhancing the anti-interference capability of the measurement system. It is suitable for precise measurement of gravitational wave signals in space-borne and high-radiation applications.

[0056] The present invention integrates various modules of the front-end circuit on independent silicon chips. The front-end circuit on each silicon chip forms a signal path, which increases the isolation between signal paths and reduces signal crosstalk.

[0057] The present invention encapsulates a resistive pilot distribution module within the module and uses a pilot insertion method to individually reduce the time jitter noise in each signal path to eliminate the impact of time jitter. The fully differential amplifier directly outputs a differential signal that is a mixture of the gravitational wave signal to be measured and the pilot signal, which also facilitates the subsequent digital circuit to directly use this differential signal for pilot correction operations.

[0058] Under the premise of realizing the integration of the front-end conditioning circuit, the present invention adopts a programmable resistor as the feedback resistor of the operational amplifier, and realizes a variable amplification factor through the programmable resistor. Under the premise of ensuring integration, the portability of use is increased, and a flexible configuration method is provided to meet different project requirements, thereby greatly improving the project development efficiency.

[0059] Example 2

[0060] like Figure 5 As shown, this embodiment provides a packaging method for a front-end conditioning circuit integrated packaging module for gravitational waves, which is used to prepare the front-end conditioning circuit integrated packaging module for gravitational waves of Example 1. The packaging method includes:

[0061] Step 1: Place several silicon chips and resistive pilot distribution modules on the ABF interconnect substrate, and place the first bandpass filter, two-stage operational amplifier bare chip, second bandpass filter, fully differential amplifier bare chip and programmable resistor bare chip on each silicon chip in sequence.

[0062] It is worth noting that placing the four signal paths on separate silicon chips can increase the isolation between the signal paths and reduce crosstalk.

[0063] Step 2: Use RDL technology to fan out several pins of the first bandpass filter, the two-stage operational amplifier bare chip, the second bandpass filter, the fully differential amplifier bare chip, and the programmable resistor bare chip to the corresponding silicon wafers; among them, several pins include interconnect pins and input and output pins.

[0064] It's worth noting that fan-out pins fall into two categories: interconnect pins that need to be interconnected on the silicon wafer, and input / output pins that pass through the silicon wafer to connect to the resistive pilot distribution module on the ABF interconnect substrate, or input / output pins that need to be externally connected. Exemplary input / output pins include: test signal input pins, pilot signal input pins, communication configuration pins, and differential signal output pins.

[0065] Step 3: Connect the first bandpass filter, the two-stage operational amplifier bare chip, the second bandpass filter, the fully differential amplifier bare chip, and the programmable resistor bare chip on each silicon wafer in sequence through a plurality of interconnect pins to form a plurality of signal paths.

[0066] In an optional embodiment, the first bandpass filter and the second bandpass filter both include a plurality of resistor and capacitor components, the plurality of resistor and capacitor components of the first bandpass filter are interconnected by bonding wires, and the plurality of resistor and capacitor components of the second bandpass filter are interconnected by bonding wires; the two-stage operational amplifier bare chip and the fully differential amplifier bare chip both include a plurality of peripheral components, the plurality of peripheral components of the two-stage operational amplifier bare chip and its interconnection pins are interconnected by bonding wires, and the plurality of peripheral components of the fully differential amplifier bare chip and its interconnection pins are interconnected by bonding wires.

[0067] It is understandable that the structures of the first bandpass filter and the second bandpass filter and the resistance and capacitance of the corresponding resistor and capacitor components can be adjusted to achieve responses with different amplitude frequencies and phase frequencies, and this is not limited in this embodiment.

[0068] Step 4: A plurality of through holes are provided on each silicon wafer, and a plurality of input and output pins are led out to the ABF interconnect substrate through the plurality of through holes to respectively connect the resistive pilot distribution module and a plurality of BGA package pins of the ABF interconnect substrate;

[0069] Step 5: Encapsulate several silicon chips and the ABF interconnect substrate in a metal shell and fill it with thermal conductive material.

[0070] Exemplarily, the metal housing package uses a through-body interface to reduce heat dissipation requirements and reduce package size.

[0071] The present invention's packaging method for an integrated front-end conditioning circuit module for gravitational waves integrates and packages the front-end conditioning circuit, facilitating temperature control and electromagnetic protection in the system. This ensures better temperature consistency in the front-end conditioning circuit and suppresses measurement noise. The packaged module can be used in strong electromagnetic radiation environments such as outer space, facilitating the detection of gravitational wave signals.

[0072] The present invention adopts a bare tape chip to solve the impedance discontinuity problem caused by the traditional wafer packaging structure, effectively suppressing signal reflection; and adopts a bonding wire packaging process to greatly shorten the transmission and interconnection length of the signal path, improve the interconnection impedance accuracy, reduce the influence of signal transmission reflection and crosstalk, and achieve the purpose of suppressing the transmission phase change of the signal.

[0073] It should be noted that, in this document, relational terms such as first and second are used solely to distinguish one entity or operation from another, and do not necessarily require or imply any actual relationship or order between these entities or operations. Furthermore, the terms "comprise," "include," or any other variations thereof are intended to encompass non-exclusive inclusion, such that an article or device comprising a list of elements includes not only those elements but also other elements not explicitly listed. Without further limitation, an element defined by the phrase "comprising a..." does not preclude the presence of additional identical elements in the article or device comprising the element. Terms such as "connected" or "connected" are not limited to physical or mechanical connections but may include electrical connections, whether direct or indirect. References to orientations or positional relationships, such as "upper," "lower," "left," and "right," are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate description and simplify the description of the present invention. They do not indicate or imply that the device or element referred to must have, be constructed, or operate in a specific orientation, and are therefore not to be construed as limiting the present invention.

[0074] The above is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention should not be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A front-end conditioning circuit integrated packaging module for gravitational waves, characterized in that: include: Front-end conditioning circuit, silicon wafer, ABF interconnect substrate and package pins; wherein, a plurality of the silicon chips are spaced apart and arranged on the ABF interconnect substrate; a plurality of the front-end conditioning circuits are laid on the plurality of the silicon chips in a one-to-one correspondence to form a plurality of signal paths; the plurality of signal paths are isolated from each other, and each of the signal paths is used to receive and amplify a gravitational wave signal to be detected; A plurality of package pins are evenly spaced on the lower surface of the ABF interconnection substrate, and a plurality of through holes are spaced on each silicon wafer. The front-end conditioning circuit is connected to the ABF interconnection substrate through the plurality of through holes, and is interconnected with the plurality of package pins through the ABF interconnection substrate.

2. The front-end conditioning circuit integrated packaging module according to claim 1, characterized in that: Each of the front-end conditioning circuits includes: a first bandpass filter, a two-stage operational amplifier, and a second bandpass filter connected in sequence; the first bandpass filter is used to receive a gravitational wave signal to be measured and filter the gravitational wave signal to be measured to obtain a first filtered signal; the two-stage operational amplifier is used to perform two-stage amplification on the first filtered signal to obtain a two-stage amplified signal; and the second bandpass filter is used to filter the two-stage amplified signal to obtain a second filtered signal.

3. The front-end conditioning circuit integrated packaging module according to claim 2, characterized in that: Also includes: Resistive pilot distribution module; The resistive pilot frequency distribution module is provided on the ABF interconnect substrate and is respectively connected to a plurality of the front-end conditioning circuits; The resistive pilot distribution module is used to receive a pilot signal and distribute the pilot signal into a plurality of pilot operation signals.

4. The front-end conditioning circuit integrated packaging module according to claim 3, characterized in that: Each of the front-end conditioning circuits further includes: a fully differential amplifier; the fully differential amplifier is connected to the ABF interconnect substrate through a plurality of the through holes, and is interconnected with the resistive pilot distribution module through the ABF interconnect substrate; The fully differential amplifier is connected to the second bandpass filter and is used to perform a differential operation on the second filtered signal and the pilot operation signal to obtain and output a differential signal.

5. The front-end conditioning circuit integrated packaging module according to claim 2, characterized in that: Each of the signal paths further includes a programmable resistor connected to the two-stage operational amplifier and configured to change the amplification factor of the two-stage operational amplifier by changing the resistance value.

6. The front-end conditioning circuit integrated packaging module according to claim 1, characterized in that: Several of the through holes are filled with a conductor material, and the conductor material includes copper.

7. The front-end conditioning circuit integrated packaging module according to claim 2, characterized in that: The first band-pass filter and the second band-pass filter are both resistor-capacitor filters; the first band-pass filter and the second band-pass filter both include a plurality of resistor-capacitor components, and the resistor-capacitor components include resistors or capacitors.

8. A packaging method for a front-end conditioning circuit integrated packaging module for gravitational waves, characterized in that: The method is used to prepare the integrated packaging module for the front-end conditioning circuit for gravitational waves according to any one of claims 1 to 7, the packaging method comprising: Step 1: Placing several silicon chips and resistive pilot frequency distribution modules on an ABF interconnect substrate, and sequentially placing a first bandpass filter, a two-stage operational amplifier die, a second bandpass filter, a fully differential amplifier die, and a programmable resistor die on each silicon chip; Step 2: fanning out several pins of the first bandpass filter, the two-stage operational amplifier die, the second bandpass filter, the fully differential amplifier die, and the programmable resistor die to the correspondingly placed silicon wafers using RDL technology; wherein the several pins include interconnect pins and input / output pins; Step 3: sequentially connecting the first bandpass filter, the two-stage operational amplifier bare chip, the second bandpass filter, the fully differential amplifier bare chip, and the programmable resistor bare chip on each of the silicon wafers through a plurality of the interconnect pins to form a plurality of signal paths; Step 4: a plurality of through holes are provided on each silicon wafer, and a plurality of input and output pins are led out to the ABF interconnect substrate through the plurality of through holes to respectively connect the resistive pilot distribution module and a plurality of BGA package pins of the ABF interconnect substrate; Step 5: Encapsulate the plurality of silicon chips and the ABF interconnect substrate as a whole in a metal shell, and fill the metal shell with a thermal conductive material.

9. The packaging method of the integrated packaging module for the front-end conditioning circuit for gravitational waves according to claim 8, characterized in that: The first band-pass filter and the second band-pass filter each include a plurality of resistor and capacitor components, wherein the plurality of resistor and capacitor components of the first band-pass filter are interconnected by bonding wires, and the plurality of resistor and capacitor components of the second band-pass filter are interconnected by bonding wires; The two-stage operational amplifier bare chip and the fully differential amplifier bare chip both include several peripheral devices. The several peripheral devices of the two-stage operational amplifier bare chip and their interconnection pins are interconnected through bonding wires, and the several peripheral devices of the fully differential amplifier bare chip and their interconnection pins are interconnected through bonding wires.

10. The packaging method of the integrated packaging module for the front-end conditioning circuit for gravitational waves according to claim 8, characterized in that: The input and output pins include: a test signal input pin, a pilot signal input pin, a communication configuration pin and a differential signal output pin.

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