A highly integrated dual-band composite three-dimensional interconnected transceiver component

Abstract

The present application proposes a highly integrated dual-band composite three-dimensional interconnected transceiver component, in which the first-level power control circuit board in the first cavity is communicatively connected to the W / Ka transceiver frequency conversion circuit in the third cavity through an RF connector; the W / Ka receiving frequency conversion circuit in the second cavity has multiple external RF interfaces and W / Ka signal waveguide ports, and the multiple external RF interfaces pass through the first cavity and the first cavity cover to be interconnected with the outside, and the W / Ka signal waveguide port is connected to the external first antenna waveguide port; the third cavity is equipped with a W / Ka transceiver frequency conversion circuit, and the W / Ka transceiver frequency conversion circuit has a W / Ka signal waveguide port, and the W / Ka signal waveguide port passes through the fourth cavity and the fourth cavity cover to be connected to the external second antenna waveguide port. The present invention integrates the W / Ka frequency band and its frequency conversion circuit structure into the main body, and realizes the three-dimensional interconnection integration of RF circuits of different frequency bands in a smaller space.

Description

Technical Field

[0001] The present application relates to the field of microwave and millimeter wave technology, and in particular to a highly integrated dual-frequency composite three-dimensional interconnected transceiver component. Background Art

[0002] Currently, active phased array radars (AESA) are widely used in the communications field due to their superior performance compared to traditional radar antennas. However, with the continuous advancement of communications technology, the electromagnetic environment in which radars operate has become increasingly complex, placing higher demands on radar performance. The transceiver module is a core component of AESA radars, and its performance directly impacts the overall radar performance. To meet the needs of future communications development, the design of transceivers capable of operating in multiple frequency bands has become an inevitable trend. A review of relevant technical materials reveals that while several dual-band composite antennas have been developed, reports on dual-band composite transceiver modules are rare, and most operate in frequency bands below the Ka-band. This limited operating frequency band hinders performance improvements in applications such as precision imaging and guidance. Furthermore, most existing dual-band composite transceiver modules are large and brick-shaped, which is inconsistent with the trend toward miniaturization of radar antennas. Summary of the Invention

[0003] The main purpose of this application is to provide a highly integrated dual-frequency composite three-dimensional interconnected transceiver component, aiming to realize multi-band, multi-channel, high-power, and highly integrated phased array radar applications.

[0004] To achieve the above-mentioned objectives, the present application provides a highly integrated dual-band composite three-dimensional interconnected transceiver component, comprising: a first cavity cover plate, a first double-sided cavity plate, a third cavity cover plate, a second double-sided cavity plate and a fourth cavity cover plate stacked in sequence; the first double-sided cavity plate has a first cavity and a second cavity back to back, the second double-sided cavity plate has a third cavity and a fourth cavity back to back, the first cavity cover plate is arranged on the surface of the first cavity, and the fourth cavity cover plate is arranged on the surface of the fourth cavity; a first-level power control circuit board is arranged in the first cavity, a W / Ka transceiver frequency conversion circuit is carried inside the third cavity, and the first-level power control circuit board is communicatively connected to the W / Ka transceiver frequency conversion circuit through a radio frequency connector; an external W / Ka intermediate frequency transmission signal is transmitted to the W / Ka transceiver frequency conversion circuit through the first-level power control circuit board to excite the W / Ka transceiver frequency conversion circuit; the second cavity is equipped with a W / Ka receiving frequency conversion circuit, The W / Ka receiving frequency conversion circuit has multiple external RF interfaces and W / Ka signal waveguide ports, and the multiple external RF interfaces pass through the first cavity and the first cavity cover to be interconnected with the outside, and the W / Ka signal waveguide port passes through the third cavity cover, the third cavity, the fourth cavity and the fourth cavity cover to be connected to the external first antenna waveguide port; the W / Ka receiving frequency conversion circuit is used to receive W / Ka signals, transmit Ka intermediate frequency signals, receive W / ka composite intermediate frequency signals and receive W intermediate frequency signals through the W / Ka signal waveguide port and the external RF interface; the third cavity is equipped with a W / Ka transceiver frequency conversion circuit, and the W / Ka transceiver frequency conversion circuit has a W / Ka signal waveguide port, and the W / Ka signal waveguide port passes through the fourth cavity and the fourth cavity cover to be connected to the external second antenna waveguide port; the W / Ka transceiver frequency conversion circuit is used to up-convert the W / Ka intermediate frequency signal and the W / Ka RF signal.

[0005] Optionally, a first-level power control circuit board is provided in the first cavity, and a second-level power control circuit board is provided in the fourth cavity; the second-level power control circuit board and the first-level power control circuit board are internally plugged in; wherein, external power supply and control signals are transmitted to the second-level power control circuit board through the first-level power control circuit board to control the power supply of the second-level power control circuit board.

[0006] Optionally, the first-level power control circuit board is communicatively connected to the internal low-frequency socket, the external low-frequency socket and multiple SMP RF connectors, the second-level power control circuit board is communicatively connected to the internal low-frequency plug, and the internal low-frequency plug passes through the third cavity, the third cavity cover and the internal low-frequency socket in sequence; the external low-frequency socket is communicatively connected to the W / Ka receiving frequency conversion circuit; at least one of the multiple SMP RF connectors passes through the second cavity and the third cavity cover through the KK connector and is communicatively connected to the internal surface-mounted SMP connector in the third cavity; wherein, the external low-frequency socket is used to supply power and provide power control signals to the W / Ka receiving frequency conversion circuit and the first-level power control circuit board; the internal low-frequency socket is used to supply power and provide power control signals to the second-level power control circuit board; and the SMP RF connector is used to provide an excitation signal to the W / Ka transceiver frequency conversion circuit.

[0007] Optionally, the W / Ka receiving frequency conversion circuit is respectively communicatively connected to multiple external SMP connectors and multiple internal surface-mount SMP connectors; at least one of the multiple external SMP connectors passes through the first cavity and the first cavity cover to be plugged into an external RF connector; at least one of the multiple internal surface-mount SMP connectors passes through the third cavity cover and the third cavity through a KK connector to be plugged into the RF interface of the W / Ka receiving frequency conversion circuit.

[0008] Optionally, the second cavity is also equipped with a first local oscillator distribution circuit, which has a first common distribution link and multiple first distribution branches that are communicatively connected; the first common distribution link is communicatively connected to a single frequency doubling multifunctional chip; multiple first distribution branches are communicatively connected to the W / Ka receiving frequency conversion circuit and the local oscillator signal transmitting waveguide port, and the local oscillator signal transmitting waveguide port passes through the third cavity cover and is communicatively connected to the local oscillator signal receiving waveguide port of the third cavity.

[0009] Optionally, the W / Ka receiving frequency conversion circuit includes two W-band microwave receiving circuits and two Ka-band microwave receiving circuits, and the W / Ka signal waveguide port includes two W-band waveguide ports and two Ka signal waveguide ports; the two W-band microwave receiving circuits are respectively communicated with the two W-band waveguide ports, respectively communicated with the two distribution branches, and respectively communicated with the two W-band frequency doubling and mixing multi-functional chips; the two Ka-band microwave receiving circuits are respectively communicated with the two Ka signal waveguide ports, respectively communicated with the two distribution branches, and respectively communicated with the two first mixers.

[0010] Optionally, the W / Ka transceiver frequency conversion circuit is respectively communicatively connected to the plurality of the internal surface mount SMP connectors; at least one of the plurality of the internal surface mount SMP connectors passes through the third cavity cover through a KK plug, and the second cavity is vertically interconnected with the SMP RF connector.

[0011] Optionally, the third cavity is equipped with a second local oscillator distribution circuit, which has a second common distribution link and multiple second distribution branches that are communicatively connected; the second common distribution link is communicatively connected to a single frequency doubling multifunctional chip; multiple second distribution branches are communicatively connected to the W / Ka transceiver frequency conversion circuit and the local oscillator signal receiving waveguide port, and the local oscillator signal receiving waveguide port passes through the third cavity cover and is communicatively connected to the local oscillator signal transmitting waveguide port.

[0012] Optionally, the W / Ka transceiver frequency conversion circuit has two communication connection branches, each branch including one Ka-band microwave transceiver circuit and two W-band microwave transceiver circuits;

[0013] The W / Ka signal waveguide port includes a first W / Ka signal waveguide port and a second W / Ka signal waveguide port, and the first W / Ka signal waveguide port and the second W / Ka signal waveguide port each include a Ka signal waveguide port and two W-band waveguide ports; each of the Ka-band microwave transceiver circuits is communicatively connected to the second mixer and the Ka signal waveguide port respectively; each of the W-band microwave transceiver circuits includes a first 3dB waveguide electrobridge, a W-band bidirectional amplifier, a second 3dB waveguide electrobridge and a W-band waveguide port that are communicatively connected in sequence.

[0014] Optionally, the adjacent first cavity cover plate, first double-sided cavity plate, third cavity cover plate, second double-sided cavity plate and fourth cavity cover plate are all connected by screws.

[0015] The embodiment of the present application proposes a highly integrated dual-band composite three-dimensional interconnected transceiver component, which is provided with a first-level power control circuit board in the first cavity, a W / Ka transceiver frequency conversion circuit in the third cavity, and the first-level power control circuit board and the W / Ka transceiver frequency conversion circuit are communicatively connected through a radio frequency connector; the second cavity is equipped with a W / Ka receiving frequency conversion circuit, and the W / Ka receiving frequency conversion circuit has multiple external radio frequency interfaces and W / Ka signal waveguide ports, and the multiple external radio frequency interfaces pass through the first cavity and the first cavity cover to be interconnected with the outside, and the W / Ka signal waveguide port passes through the third cavity cover and the third cavity, the fourth cavity, and the fourth cavity. The cavity and the fourth cavity cover are connected to the first external antenna waveguide port; the third cavity is equipped with a W / Ka transceiver frequency conversion circuit, which has a W / Ka signal waveguide port. The W / Ka signal waveguide port passes through the fourth cavity and the fourth cavity cover and is connected to the second external antenna waveguide port. The present invention integrates the W / Ka frequency band and its frequency conversion circuit structure into the main body, realizes the three-dimensional interconnection integration of radio frequency circuits of different frequency bands in a smaller space, and can realize full array combination of high and low frequency band signals to meet the future application requirements of multi-band, multi-channel, high-power and high-integration of phased array radars. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a side view structural diagram of the dual-frequency composite three-dimensional interconnected transceiver component;

[0017] Figure 2 A schematic diagram of the waveguide port layout at the front end of the dual-band composite three-dimensional interconnected transceiver component;

[0018] Figure 3 A schematic diagram of the connector layout at the rear end of the dual-band composite three-dimensional interconnect transceiver assembly;

[0019] Figure 4 A schematic diagram of a first-level power control circuit board disposed in the first cavity;

[0020] Figure 5 A schematic diagram of a radio frequency circuit disposed in the second cavity;

[0021] Figure 6 A schematic diagram of a radio frequency circuit disposed in the third cavity;

[0022] Figure 7 A schematic diagram of a secondary power supply control circuit board disposed in the fourth cavity;

[0023] Figure 8 This is a schematic diagram of the three-dimensional interconnection layout of the circuits inside the dual-band composite three-dimensional interconnection transceiver component.

[0024] In the above drawings, the meanings of the various marks are as follows: 1. First cavity cover plate; 2. First double-sided cavity plate; 3. Second cavity cover plate; 4. Second double-sided cavity plate; 5. Fourth cavity cover plate; 6. Ka-band waveguide port; 7. W-band waveguide port; 8. External low-frequency socket; 9. External SMP connector; 10. Internal low-frequency socket; 11. Primary power control circuit board; 12. Internal vertical transmission SMP connector; 13. Internal surface mount SMP connector; 14. First frequency multifunctional chip; 15. Local oscillator waveguide port; 16. W-band frequency multifunctional chip; 17. 3dB waveguide bridge; 18. W-band bidirectional amplifier; 19. Secondary power control circuit board; 20. Internal low-frequency plug; 21. SSMA to SMP connector. DETAILED DESCRIPTION

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0026] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0027] In the present invention, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0028] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0029] Reference Figure 1 , the first embodiment of the highly integrated dual-frequency composite three-dimensional interconnected transceiver component of the present application provides a highly integrated dual-frequency composite three-dimensional interconnected transceiver component, the highly integrated dual-frequency composite three-dimensional interconnected transceiver component includes: a first cavity cover plate 1, a first double-sided cavity plate 2, a third cavity cover plate 3, a second double-sided cavity plate 4 and a fourth cavity cover plate 5 stacked in sequence; the first double-sided cavity plate 2 has a first cavity and a second cavity back to back, the second double-sided cavity plate has a third cavity and a fourth cavity back to back, the first cavity cover plate 1 is arranged on the surface of the first cavity, and the fourth cavity cover plate 5 is arranged on the surface of the fourth cavity; a first-level power control circuit board 11 is provided in the first cavity, and a W / Ka transceiver frequency conversion circuit is carried out in the third cavity, and the first-level power control circuit board 11 is communicatively connected to the W / Ka transceiver frequency conversion circuit through a radio frequency connector; an external W / Ka intermediate frequency transmission signal is transmitted to the W / Ka transceiver frequency conversion circuit through the first-level power control circuit board 11 to stimulate the W / Ka transceiver frequency conversion circuit Excitation; the second cavity is equipped with a W / Ka receiving frequency conversion circuit, which has multiple external RF interfaces and a first W / Ka signal waveguide port. The multiple external RF interfaces pass through the first cavity and the first cavity cover 1 to be interconnected with the outside, and the first W / Ka signal waveguide port passes through the third cavity cover 3, the fourth cavity, the fourth cavity and the fourth cavity cover 5 to be connected to the external first antenna waveguide port; the W / Ka receiving frequency conversion circuit is used to receive W / Ka signals, transmit Ka intermediate frequency signals, receive W / ka composite intermediate frequency signals and receive W intermediate frequency signals through the first W / Ka signal waveguide port and the external RF interface; the third cavity is equipped with a W / Ka transceiver frequency conversion circuit, which has a second W / Ka signal waveguide port. The second W / Ka signal waveguide port passes through the fourth cavity and the fourth cavity cover 5 to be connected to the external second antenna waveguide port; the W / Ka transceiver frequency conversion circuit is used to up-convert the W / Ka intermediate frequency signal and the W / Ka RF signal.

[0030] Specifically, the W / Ka dual-band composite three-dimensional interconnected transceiver assembly consists of five layers of cavities, from bottom to top: a first cavity cover plate 1, a first double-sided cavity plate 2, a third cavity cover plate 3, a second double-sided cavity plate 4, and a fourth cavity cover plate 5. The first double-sided cavity plate 2 has a first cavity on one side, housing a primary power control circuit board 11. The second cavity has a second cavity on the other side, housing a W / Ka receive frequency conversion circuit. The second double-sided cavity plate 4 has a third cavity on one side and a fourth cavity on the other side. The third cavity cover plate 3 serves as a partition wall. The third cavity houses the W / Ka transmit / receive frequency conversion circuit. The first-level power control circuit board 11 is communicatively connected to the W / Ka transceiver frequency conversion circuit via a radio frequency connector. An external W / Ka intermediate frequency (IF) transmission signal is transmitted to the W / Ka transceiver frequency conversion circuit via the first-level power control circuit board 11 to excite the W / Ka transceiver frequency conversion circuit. The second cavity houses a W / Ka receiving frequency conversion circuit, which has multiple external RF interfaces and a first W / Ka signal waveguide port. These multiple external RF interfaces extend through the first cavity and the first cavity cover 1 to connect to the outside. The first W / Ka signal waveguide port extends through the third cavity cover 3, the third cavity, the fourth cavity, and the fourth cavity cover 5 to connect to the external first antenna waveguide port. The W / Ka receiving frequency conversion circuit is configured to receive W / Ka signals, transmit Ka IF signals, receive W / Ka composite IF signals, and receive W IF signals via the first W / Ka signal waveguide port and the external RF interface. The third cavity houses a W / Ka transceiver frequency conversion circuit with a second W / Ka signal waveguide port. This port passes through the fourth cavity and the fourth cavity cover 5, connecting to the external second antenna waveguide port. The W / Ka transceiver frequency conversion circuit is used to up-convert the W / Ka intermediate frequency (IF) and W / Ka radio frequency (RF) signals.

[0031] In an embodiment of the present invention, a first-level power control circuit board 11 is provided in the first cavity, and a second-level power control circuit board 19 is provided in the fourth cavity; the second-level power control circuit board 19 and the first-level power control circuit board 11 are internally plugged in; wherein, external power and control signals are transmitted to the second-level power control circuit board 19 through the first-level power control circuit board 11 to control the power supply of the second-level power control circuit board 19.

[0032] In an embodiment of the present invention, the first-level power control circuit board 11 is communicatively connected to the internal low-frequency socket 10, the external low-frequency socket 8 and multiple SMP RF connectors 12, the second-level power control circuit board 19 is communicatively connected to the internal low-frequency plug 20, and the internal low-frequency plug 20 passes through the third cavity and the third cavity cover 3 in sequence and is plugged into the internal low-frequency socket 10; the external low-frequency socket 8 is communicatively connected to the W / Ka receiving frequency conversion circuit; at least one of the multiple SMP RF connectors 12 passes through the second cavity and the third cavity cover 3 through a KK connector and is communicatively connected to the internal surface-mounted SMP connector 13 in the third cavity; wherein, the external low-frequency socket 8 is used to supply power and provide power control signals to the W / Ka receiving frequency conversion circuit and the first-level power control circuit board 11; the internal low-frequency socket 10 is used to supply power and provide power control signals to the second-level power control circuit board 19; and the SMP RF connector 12 is used to provide an excitation signal to the W / Ka transceiver frequency conversion circuit.

[0033] In this embodiment, a primary power control circuit board 11 is provided in the first cavity to supply power to the radio frequency circuit in the second cavity. A secondary power control circuit board 19 is provided in the fourth cavity to supply power to the radio frequency circuit in the third cavity. The interconnection between the power control circuit and the radio frequency circuit can be achieved through a variety of schemes, which are not limited to a single one. Here, an optimization is made and one of the feasible options is given: the second cavity and the third cavity respectively have a powered insulator for supplying power to each active chip in the radio frequency circuit. When this scheme is adopted, the powered insulator is provided near the power supply end of the corresponding radio frequency chip, fixed to the cavity by sintering, and passes through the partition wall between the first double-sided cavity plate 2 and the second double-sided cavity plate 4, respectively, and is connected to the primary power control circuit board and the secondary power control circuit board respectively.

[0034] Furthermore, to facilitate overall low-frequency signal processing, the present invention provides an internal low-frequency control signal transmission structure. While this configuration is not unique, an optimization is provided herein, citing one feasible option: a pair of internal low-frequency sockets 10 are mounted on the primary power control circuit board 11, and another internal low-frequency plug 20 is mounted on the secondary power control circuit board 19. These plugs pass through the second cavity, the third cavity cover, and the third cavity, connecting them via a plug-in arrangement. When this solution is employed, the external total power supply and control signals are transmitted to the secondary power control circuit board 19 via the primary power control circuit board 11, facilitating power supply control of the entire transceiver assembly.

[0035] Furthermore, the primary power control circuit board 11 in the first cavity includes two low-frequency signal rectangular connector sockets and two SMP RF connectors. One socket is an external low-frequency socket 8, which is connected to the external power supply and control signal, providing power and control signals to the circuits in the first and second cavities. The other socket is an internal low-frequency socket 10, which is connected to the internal low-frequency plug 20 on the secondary power control circuit board 19 in the fourth cavity. The external power is transmitted through this socket through the first, second, and third cavities to the secondary power control circuit board 19 in the fourth cavity, providing power and control signals to the circuits in the second double-sided cavity board 4. The two SMP RF connectors 12 are both internal connectors. They pass through the second and third cavity covers 3 through KK connectors and are vertically interconnected with the two internal surface-mount SMP connectors 13 in the third cavity, providing W / ka intermediate frequency transmission signal excitation for the circuits in the third cavity.

[0036] In an embodiment of the present invention, the W / Ka receiving frequency conversion circuit is communicatively connected to multiple external SMP connectors 9 and multiple internal surface-mounted SMP connectors 13; at least one of the multiple external SMP connectors 9 passes through the first cavity and the first cavity cover 1 and is plugged into the external RF connector; at least one of the multiple internal surface-mounted SMP connectors 13 passes through the third cavity cover 3 through a KK connector and is plugged into the RF interface of the W / Ka receiving frequency conversion circuit.

[0037] Exemplarily, the circuit in the second cavity has seven external SMP connectors 9, two internal surface-mount SMP connectors, one local oscillator signal transmitting waveguide port, two W signal receiving waveguide ports, and two Ka signal receiving waveguide ports. The seven external SMP connectors 9 are external RF interfaces, which pass through the first cavity and are vertically interconnected with the external RF connector. Through the seven RF connectors, one local oscillator signal is input, one W intermediate frequency signal is transmitted, one Ka intermediate frequency signal is transmitted, three W / ka composite intermediate frequency signals are received, and one W intermediate frequency signal is received. The two internal surface-mount SMP connectors 13 are internal interfaces, which pass through the third cavity cover 3 via KK connectors and are vertically interconnected with the RF interface in the second cavity.

[0038] In an embodiment of the present invention, the second cavity is also equipped with a first local oscillator distribution circuit, which has a first common distribution link and multiple first distribution branches that are communicatively connected; the first common distribution link is communicatively connected to the single-frequency multifunctional chip 14; multiple first distribution branches are communicatively connected to the W / Ka receiving frequency conversion circuit and the local oscillator signal transmitting waveguide port, and the local oscillator signal transmitting waveguide port passes through the third cavity cover 3 and is communicatively connected to the local oscillator signal receiving waveguide port of the third cavity.

[0039] In an exemplary embodiment, the local oscillator distribution circuit includes a first local oscillator distribution circuit, which is responsible for providing local oscillator excitation for a total of ten transmit and receive channels in the W / Ka band. A single-frequency multifunction chip 14 is installed on its common distribution link. Each first distribution branch is also equipped with a driver amplifier and attenuator. Adjusting the attenuation of the attenuator can adjust the local oscillator excitation for each channel. Using this solution, the local oscillator signal flows as follows: The local oscillator signal excitation enters the microstrip circuit in the second cavity through the external SMP connector 9. It first passes through the single-frequency multifunction chip 14 and is split into two single-frequency multifunction signals. One of the signals then passes through the driver amplifier, attenuator, and power splitter before being distributed to one W / Ka receive frequency conversion circuit. The other signal is split into two paths by a power splitter. One path is directly distributed to the W / Ka receiving and frequency conversion circuit, while the other path passes through the local oscillator signal transmission waveguide port and is transmitted to the microstrip circuit in the third cavity. Finally, the signal transmitted to the third cavity passes through the power splitter, driver amplifier, and attenuator in sequence, distributing the first-frequency-doubled local oscillator signal to each W / Ka transceiver and frequency conversion circuit in the third cavity. The local oscillator signal transmission waveguide port is an internal interface that passes through the third cavity cover plate 3 and interconnects with the local oscillator signal receiving waveguide port in the third cavity.

[0040] In an embodiment of the present invention, the W / Ka receiving frequency conversion circuit includes two W-band microwave receiving circuits and two Ka-band microwave receiving circuits, and the W / Ka signal waveguide port includes two W-band waveguide ports 7 and two Ka signal waveguide ports; the two W-band microwave receiving circuits are respectively communicated with the two W-band waveguide ports 7, respectively communicated with the two distribution branches, and respectively communicated with the two W-band frequency multi-function chips 16; the two Ka-band microwave receiving circuits are respectively communicated with the two Ka-band waveguide ports 6, respectively communicated with the two distribution branches, and respectively communicated with the two first mixers.

[0041] In an embodiment of the present invention, the W / Ka transceiver frequency conversion circuit has two communication-connected branches, each branch includes a Ka-band microwave transceiver circuit and two W-band microwave transceiver circuits; the W / Ka signal waveguide port includes a first sub-W / Ka signal waveguide port and a second sub-W / Ka signal waveguide port, and the first sub-W / Ka signal waveguide port and the second sub-W / Ka signal waveguide port each include a Ka signal waveguide port and two W-band waveguide ports 7; each Ka-band microwave transceiver circuit is respectively communication-connected to the second mixer and the Ka signal waveguide port; each W-band microwave transceiver circuit includes a first 3dB waveguide bridge 17, a W-band bidirectional amplifier 18, a second 3dB waveguide bridge and a W-band waveguide port 7 that are communication-connected in sequence.

[0042] In an embodiment of the present invention, the W / Ka transceiver frequency conversion circuit is respectively connected to multiple internal surface-mounted SMP connectors 13 for communication; at least one of the multiple internal surface-mounted SMP connectors 13 passes through the third cavity cover 3 through a KK plug, and the second cavity is vertically interconnected with the SMP RF connector 12.

[0043] Exemplarily, the W-band transceiver circuit has a two-transmit and four-receive architecture, with two transceiver circuits located in the third cavity and the other two receiving circuits located in the second cavity. The W / Ka signal waveguide port is an external interface, passing through the third cavity cover 3, the third and fourth cavities, and interconnecting with the external antenna waveguide port. The final stage of the W-band transmitting circuit is configured as a W-band bidirectional amplifier 18, and a 3dB waveguide bridge 17 is used for power synthesis and distribution. In addition, each transceiver branch is also provided with a W-band frequency multiplication and mixing multifunctional chip 16, which can perform a second frequency multiplication on the local oscillator's first frequency multiplication signal, and then perform up and down conversion on the intermediate frequency and radio frequency signals. When using this solution, the W-band signal flow is as follows: During transmission, the IF excitation signal is first input through the external SMP connector 9 in the second cavity, passes through the KK connector and the SMP RF socket 9 in the third cavity, and is vertically transmitted to the secondary power control circuit board 19 in the fourth cavity. Then, in the fourth cavity, the IF signal is split into two IF signals by a power splitter. These signals then pass through a phase shifter, a driver amplifier, and an RF glass insulator, and are vertically transmitted to the two W-band transmission branches in the third cavity. Next, in the third cavity, the IF signal and the first-harmonic frequency of the local oscillator are up-converted by the W-band frequency multi-function mixing chip 16 to generate the W-band excitation signal. This excitation signal is split into two by the first 3dB waveguide bridge 17, amplified by a W-band bidirectional amplifier, and then power-combined by the second 3dB waveguide bridge 17. Finally, the signal passes through the W-band waveguide port and through the fourth cavity, transmitting to the antenna. During reception, the receiving signal is input through the antenna and the W waveguide port. Among them, two receiving signals are in the third cavity, and are sequentially passed through the 3dB waveguide bridge 17, the W-band bidirectional amplifier 18, the 3dB waveguide bridge 17, and the W-band frequency doubling and mixing multifunctional chip 16, and are down-converted into intermediate frequency signals. They are then vertically transmitted to the external SMP connector 9 in the second cavity through the internal surface-mounted SMP connector 13 and the KK connector for output; the other two receiving signals are directly transmitted to the second cavity through the W-band waveguide port 7, and are sequentially passed through the low-noise amplifier, the W-band frequency doubling and mixing multifunctional chip, the phase shifter, and the switch, and are output through the external SMP connector 9.

[0044] Furthermore, the present application optimizes and improves the Ka-band microwave transceiver circuit. The Ka-band transceiver circuit is a one-transmitter-three-receiver architecture, in which one transceiver circuit is arranged in the third cavity, and the other two receiving circuits are arranged in the second cavity. Each circuit is provided with a mixer to perform up- and down-conversion on the Ka-band signal. When this scheme is adopted, the Ka-band signal flows as follows: during transmission, first, the intermediate frequency excitation signal is input by the external SMP connector 9 in the second cavity, passes through the KK connector, and is vertically transmitted to the microstrip circuit in the third cavity; secondly, in the third cavity, the intermediate frequency signal is up-converted by the driver and the mixer to obtain the Ka-band excitation signal; finally, after two stages of power amplification, the signal passes through the circulator, passes through the Ka-band waveguide port 6, and passes through the fourth cavity to transmit the signal to the antenna. During reception, the received signal is input through the antenna and the Ka-band waveguide port 6. Two of the received signals are in the second cavity, and the other is in the third cavity. They pass through the low-noise amplifier, mixer, phase shifter, and switch in sequence, and are output through the external SMP connector 9.

[0045] In an embodiment of the present invention, the third cavity is equipped with a second local oscillator distribution circuit, which has a second common distribution link and multiple second distribution branches that are communicatively connected; the second common distribution link is communicatively connected to the single-frequency multifunctional chip 14; the multiple second distribution branches are communicatively connected to the W / Ka transceiver frequency conversion circuit and the local oscillator signal receiving waveguide port, and the local oscillator signal receiving waveguide port passes through the third cavity cover 3 and is communicatively connected to the local oscillator signal transmitting waveguide port.

[0046] In the embodiment of the present invention, the adjacent first cavity cover plate 1 , first double-sided cavity plate 2 , third cavity cover plate 3 , second double-sided cavity plate 4 and fourth cavity cover plate 5 are all connected by screws.

[0047] The above are only preferred embodiments of the present application and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A highly integrated dual-band composite three-dimensional interconnected transceiver component, characterized in that: include: A first cavity cover plate, a first double-sided cavity plate, a third cavity cover plate, a second double-sided cavity plate, and a fourth cavity cover plate stacked in sequence; The first double-sided cavity plate has a first cavity and a second cavity back to back, the second double-sided cavity plate has a third cavity and a fourth cavity back to back, the first cavity cover plate is provided on the surface of the first cavity, and the fourth cavity cover plate is provided on the surface of the fourth cavity; A primary power control circuit board is provided in the first cavity, a W / Ka transceiver frequency conversion circuit is provided in the third cavity, and the primary power control circuit board is communicatively connected to the W / Ka transceiver frequency conversion circuit via a radio frequency connector; The external W / Ka intermediate frequency transmission signal is transmitted to the W / Ka transceiver frequency conversion circuit through the first-level power supply control circuit board to stimulate the W / Ka transceiver frequency conversion circuit; The second cavity is equipped with a W / Ka receiving frequency conversion circuit, which has multiple external RF interfaces and a first W / Ka signal waveguide port. The multiple external RF interfaces pass through the first cavity and the first cavity cover to be interconnected with the outside, and the first W / Ka signal waveguide port passes through the third cavity cover, the third cavity, the fourth cavity, and the fourth cavity cover to be connected to the external first antenna waveguide port; The W / Ka receiving frequency conversion circuit is used to receive W / Ka signals, transmit Ka intermediate frequency signals, receive W / Ka composite intermediate frequency signals and receive W intermediate frequency signals through the first W / Ka signal waveguide port and the external radio frequency interface; The W / Ka transceiver frequency conversion circuit has a second W / Ka signal waveguide port, and the second W / Ka signal waveguide port passes through the fourth cavity and the fourth cavity cover and is connected to the external second antenna waveguide port; The W / Ka transceiver frequency conversion circuit is used to perform up / down conversion on the W / Ka intermediate frequency signal and the W / Ka radio frequency signal.

2. The highly integrated dual-band composite three-dimensional interconnected transceiver assembly according to claim 1, characterized in that: A secondary power supply control circuit board is provided in the fourth cavity; The secondary power control circuit board is internally plugged into the primary power control circuit board; The external power supply and control signal are transmitted to the secondary power control circuit board through the primary power control circuit board to control the power supply of the secondary power control circuit board.

3. The highly integrated dual-band composite three-dimensional interconnected transceiver assembly according to claim 2, characterized in that: The primary power control circuit board is communicatively connected to the internal low-frequency socket, the external low-frequency socket, and a plurality of SMP radio frequency connectors; the secondary power control circuit board is communicatively connected to the internal low-frequency plug; and the internal low-frequency plug sequentially passes through the third cavity, the third cavity cover, and is plugged into the internal low-frequency socket; The external low-frequency socket is communicatively connected to the W / Ka receiving frequency conversion circuit; At least one of the plurality of SMP RF connectors is communicatively connected to an inner surface-mounted SMP connector in the third cavity through a KK connector passing through the second cavity and the third cavity cover; The external low-frequency socket is used to supply power and provide power supply control signals to the W / Ka receiving frequency conversion circuit and the primary power control circuit board; The internal low-frequency socket is used to supply power to the secondary power control circuit board and provide power supply control signals; The SMP radio frequency connector is used to provide an excitation signal to the W / Ka transceiver frequency conversion circuit.

4. The highly integrated dual-band composite three-dimensional interconnected transceiver assembly according to claim 1, characterized in that: The W / Ka receiving frequency conversion circuit is respectively connected to a plurality of external SMP connectors and a plurality of internal surface mount SMP connectors for communication; At least one of the plurality of external SMP connectors passes through the first cavity and the first cavity cover and is plugged into an external RF connector; At least one of the plurality of inward surface mount SMP connectors passes through the third cavity cover plate via a KK connector and is plugged into the radio frequency interface of the W / Ka receiving frequency conversion circuit.

5. The highly integrated dual-band composite three-dimensional interconnected transceiver assembly according to claim 4, characterized in that: The second cavity is further equipped with a first local oscillator distribution circuit, wherein the first local oscillator distribution circuit has a first common distribution link and a plurality of first distribution branches in communication connection; The first public distribution link is communicatively connected to a primary frequency multi-function chip; Multiple first distribution branches are communicatively connected to the W / Ka receiving frequency conversion circuit and the local oscillator signal transmitting waveguide port, and the local oscillator signal transmitting waveguide port passes through the third cavity cover and is communicatively connected to the local oscillator signal receiving waveguide port of the third cavity.

6. The highly integrated dual-band composite three-dimensional interconnected transceiver assembly according to claim 5, characterized in that: The W / Ka receiving frequency conversion circuit includes two W-band microwave receiving circuits and two Ka-band microwave receiving circuits, and the first W / Ka signal waveguide port includes two W-band waveguide ports and two Ka signal waveguide ports; The two W-band microwave receiving circuits are respectively connected to the two W-band waveguide ports, respectively connected to the two distribution branches, and respectively connected to the two W-band frequency multi-function chips; The two Ka-band microwave receiving circuits are respectively communicatively connected to the two Ka signal waveguide ports, respectively communicatively connected to the two distribution branches, and respectively communicatively connected to the two first mixers.

7. The highly integrated dual-band composite three-dimensional interconnected transceiver assembly according to claim 4, characterized in that: The W / Ka transceiver frequency conversion circuit is respectively communicatively connected to the plurality of internal surface mount SMP connectors; At least one of the plurality of inwardly mounted SMP connectors passes through the third cavity cover plate via a KK plug, and the second cavity is vertically interconnected with the SMP RF connector.

8. The highly integrated dual-band composite three-dimensional interconnected transceiver assembly according to claim 5, characterized in that: The third cavity carries a second local oscillator distribution circuit, wherein the second local oscillator distribution circuit has a second common distribution link and a plurality of second distribution branches in communication connection; The second public distribution link is communicatively connected to the primary frequency multi-function chip; A plurality of second distribution branches are communicatively connected to the W / Ka transceiver frequency conversion circuit and the local oscillator signal receiving waveguide port, and the local oscillator signal receiving waveguide port passes through the third cavity cover plate and is communicatively connected to the local oscillator signal transmitting waveguide port.

9. The highly integrated dual-band composite three-dimensional interconnected transceiver assembly according to claim 8, characterized in that: The W / Ka transceiver frequency conversion circuit has two communication connection branches, each branch including one Ka-band microwave transceiver circuit and two W-band microwave transceiver circuits; The second W / Ka signal waveguide port includes a first sub-W / Ka signal waveguide port and a second sub-W / Ka signal waveguide port, and the first sub-W / Ka signal waveguide port and the second sub-W / Ka signal waveguide port each include a Ka signal waveguide port and two W-band waveguide ports; Each of the Ka-band microwave transceiver circuits is communicatively connected to the second mixer and the Ka signal waveguide port respectively; Each of the W-band microwave transceiver circuits includes a first 3dB waveguide bridge, a W-band bidirectional amplifier, a second 3dB waveguide bridge and a W-band waveguide port that are communicatively connected in sequence.

10. The highly integrated dual-band composite three-dimensional interconnected transceiver assembly according to claim 1, characterized in that: The adjacent first cavity cover plate, the first double-sided cavity plate, the third cavity cover plate, the second double-sided cavity plate and the fourth cavity cover plate are all connected by screws.

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