A method, system, device and medium for controlling the copper plating thickness of a pressing plate

Abstract

The present application discloses a method, system, device and medium for controlling the copper thickness of a pressing plate, including the following steps: obtaining a depth image of a target electroplating hole on a target pressing plate; obtaining a measured depth h of the target electroplating hole according to the depth image to obtain a measured thickness h' of the electroplated copper layer; determining whether the measured thickness h' is within a preset theoretical thickness range; wherein the theoretical thickness is a range value; if not, obtaining copper thickness compensation data of the electroplated copper layer and returning to obtaining the depth image of the target electroplating hole on the target pressing plate until the measured thickness h' is within the theoretical thickness range; if so, obtaining the thickness uniformity of the electroplated copper layer; determining whether the thickness uniformity meets the qualified standard; if not, obtaining copper thickness adjustment data of the electroplated copper layer and returning to obtaining the thickness uniformity of the electroplated copper layer until the thickness uniformity meets the qualified standard; if so, ending. The present application has the advantage of improving the accuracy of controlling the copper thickness of the pressing plate.

Description

Technical Field

[0001] The present application relates to the technical field of PCB electroplating process data processing, and in particular to a method, system, equipment and medium for controlling the thickness of electroplated copper on a pressure plate. Background Art

[0002] As the frequency of the working environment of optical module products becomes higher and higher, the impedance tolerance of optical module products becomes more and more stringent, and the stacking design space becomes narrower and more complex (such as combined pressing, mechanical half-hole buried hole grounding, etc.). How to improve the copper thickness quality of the PCB board before the pattern transfer to improve the stability control of the impedance during the subsequent pattern transfer production has become a problem encountered by the industry.

[0003] At present, the traditional copper thickness control of the pressing plate requires multiple copper plating, micro-etching and grinding from material cutting to pattern transfer, which is seriously unfavorable to the copper thickness control on the PCB copper foil. In the traditional process, the copper thickness R value from material cutting to pattern transfer will probably exceed 0.4mil, and this copper thickness R value is not conducive to impedance control at all. Therefore, the copper thickness of the pressing plate needs to be strictly controlled during the PCB manufacturing process. The existing copper thickness control method of the pressing plate has low accuracy and large measurement error, which affects product quality. Summary of the invention

[0004] The main purpose of the present application is to provide a method, system, equipment and medium for controlling the thickness of electroplated copper on a pressure plate, aiming to solve the technical problem of low precision of the existing method for controlling the thickness of copper on a pressure plate.

[0005] To achieve the above object, the present application provides a method for controlling the thickness of electroplated copper on a pressure plate, comprising the following steps:

[0006] Acquire a depth image of a target electroplated hole on a target counter-pressing plate; wherein the target counter-pressing plate comprises a base layer, a substrate copper layer is disposed on the top surface of the base layer, a dry film layer is disposed on the top surface of the substrate copper layer, a selectively plated hole is disposed in the dry film layer, the selectively plated hole is filled with an electroplated copper layer, and the top surface of the electroplated copper layer is lower than the top surface of the dry film layer to form a target electroplated hole;

[0007] According to the depth image, the measured depth h of the target electroplated hole is obtained to obtain the measured thickness h' of the electroplated copper layer; wherein h'=Hh, H is the thickness of the dry film layer;

[0008] Determine whether the measured thickness h' is within a preset theoretical thickness range; wherein the theoretical thickness is a range value;

[0009] If not, the copper thickness compensation data of the electroplated copper layer is obtained, and the process returns to obtaining the depth image of the target electroplated hole on the target pressing plate until the measured thickness h' is within the theoretical thickness range; if so, the thickness uniformity of the electroplated copper layer is obtained;

[0010] Determine whether the thickness uniformity meets the qualified standard;

[0011] If not, obtain the copper thickness adjustment data of the electroplated copper layer and return to obtain the thickness uniformity of the electroplated copper layer until the thickness uniformity meets the qualified standard; if so, end.

[0012] Optionally, obtaining the thickness uniformity of the electroplated copper layer includes:

[0013] Extract the target area in the depth image; wherein, the target area is the area where the target electroplated hole is located;

[0014] Divide the target area into grids to obtain multiple areas to be measured;

[0015] Obtain the detected thickness H' of the electroplated copper layer corresponding to each area to be measured;

[0016] Select the maximum value H' among multiple detected thicknesses H'; max and the minimum value H'; min ;

[0017] According to the maximum value H' max and the minimum value H' min , obtain the thickness uniformity of the electroplated copper layer.

[0018] Optionally, let the thickness uniformity be Q, and the expression of Q is:

[0019] Q = K / (H' max - H' min );

[0020] In the formula, K is an adjustment coefficient.

[0021] Optionally, obtaining the detected thickness H' of the electroplated copper layer corresponding to each area to be measured includes:

[0022] Select multiple initial measurement points distributed in a rectangular array in the area to be measured;

[0023] According to the initial measurement points, obtain the highest measurement point and the lowest measurement point in the area to be measured; wherein, the highest measurement point is the initial measurement point closest to the top surface of the dry film layer in the area to be measured, and the lowest measurement point is the initial measurement point farthest from the top surface of the dry film layer in the area to be measured;

[0024] Obtain the first spacing value d1 from the highest measurement point to the top surface of the dry film layer and the second spacing value d2 from the lowest measurement point to the top surface of the dry film layer in each area to be measured;

[0025] According to the first spacing value d1 and the second spacing value d2, obtain the first detected thickness H1' and the second detected thickness H2'; wherein, H1' = H - d1, H2' = H - d2.

[0026] Optionally, according to the initial measurement points, obtain the highest measurement point and the lowest measurement point in the area to be measured, including:

[0027] Obtain the depth values of each initial measurement point, and screen out the alternative highest point with the smallest depth value and the alternative lowest point with the largest depth value among the initial measurement points;

[0028] Construct a first regional circle with the alternative highest point as the center; wherein, the radius of the first regional circle is less than or equal to half of the distance between adjacent initial measurement points;

[0029] Select multiple first alternative measurement points within the first regional circle;

[0030] Determine whether there is a first alternative measurement point that satisfies the first condition within the first regional circle. If not, output the alternative highest point as the highest measurement point. If so, output the first alternative measurement point with the smallest depth value as the alternative highest point, and return to construct a first regional circle with the alternative highest point as the center; wherein, the first condition is that the depth value of the first alternative measurement point is less than the depth value of the alternative highest point;

[0031] Construct a second regional circle with the alternative lowest point as the center; wherein, the radius of the second regional circle is less than or equal to half of the distance between adjacent initial measurement points;

[0032] Select multiple second alternative measurement points within the second regional circle;

[0033] Determine whether there is a second alternative measurement point that satisfies the second condition within the second regional circle. If not, output the alternative lowest point as the lowest measurement point. If so, output the second alternative measurement point with the largest depth value as the alternative lowest point, and return to construct a second regional circle with the alternative lowest point as the center; wherein, the second condition is that the depth value of the second alternative measurement point is greater than the depth value of the alternative lowest point.

[0034] Optionally, the copper thickness compensation data includes copper increasing compensation data and copper decreasing compensation data;

[0035] Obtain the copper thickness compensation data of the electroplated copper layer, including:

[0036] If the measured thickness h' is greater than the theoretical thickness, obtain the first difference between the measured thickness h' and the standard thickness value, and output the first difference as the copper decreasing compensation data; wherein, the standard thickness value is the median of the theoretical thickness;

[0037] If the measured thickness h' is less than the theoretical thickness, obtain the second difference between the measured thickness h' and the standard thickness value, and output the second difference as the copper increasing compensation data.

[0038] Optionally, the copper thickness adjustment data includes copper increasing adjustment data and copper decreasing adjustment data;

[0039] Obtain the copper thickness adjustment data of the electroplated copper layer, including:

[0040] If the measured thickness h' is greater than the standard thickness value, obtain the third difference between the measured thickness h' and the standard thickness value, and output the third difference as the copper reduction adjustment data;

[0041] If the measured thickness h' is less than the standard thickness value, obtain the fourth difference between the measured thickness h' and the standard thickness value, and output the fourth difference as the copper increase adjustment data.

[0042] To achieve the above object, the present application also provides a control system for the electroplated copper thickness of the press plate, including:

[0043] An image acquisition module, configured to acquire a depth image of a target electroplated hole on a target press plate; wherein, the target press plate includes a base layer, a base copper layer is provided on the top surface of the base layer, a dry film layer is provided on the top surface of the base copper layer, a selective plating hole is provided in the dry film layer, the selective plating hole is filled with an electroplated copper layer, and the top surface of the electroplated copper layer is lower than the top surface of the dry film layer to form a target electroplated hole;

[0044] A data acquisition module, configured to obtain the measured depth h of the target electroplated hole according to the depth image to obtain the measured thickness h' of the electroplated copper layer; wherein, h' = H - h, and H is the thickness of the dry film layer;

[0045] A first judgment module, configured to judge whether the measured thickness h' is within a preset theoretical thickness range; wherein, the theoretical thickness is a range value;

[0046] A first data processing module, configured to, if not, obtain the copper thickness compensation data of the electroplated copper layer, and return to acquire the depth image of the target electroplated hole on the target press plate until the measured thickness h' is within the theoretical thickness range; if so, obtain the thickness uniformity of the electroplated copper layer;

[0047] A second judgment module, configured to judge whether the thickness uniformity meets the qualified standard;

[0048] A second data processing module, configured to, if not, obtain the copper thickness adjustment data of the electroplated copper layer, and return to obtain the thickness uniformity of the electroplated copper layer until the thickness uniformity meets the qualified standard; if so, end.

[0049] To achieve the above object, the present application also provides a computer device, which includes a memory and a processor, a computer program is stored in the memory, and the processor executes the computer program to implement the above method.

[0050] To achieve the above object, the present application further provides a computer-readable storage medium, on which a computer program is stored, and a processor executes the computer program to implement the above method.

[0051] The beneficial effects that the present application can achieve are as follows:

[0052] In the present application, a depth image of a target electroplating hole on a target press plate is acquired. Since the depth image can contain the distance information of each pixel point from the camera, the measured depth h of the target electroplating hole can be obtained based on this depth image. Then, subtracting the measured depth h from the known thickness H of the dry film layer, the measured thickness h' of the electroplated copper layer can be accurately calculated. Based on the machine vision recognition technology, the present application is more accurate and effective in measurement compared with traditional thickness gauges. Then, it is judged whether the measured thickness h' is within the preset theoretical thickness range. If not, the copper thickness compensation data of the electroplated copper layer needs to be obtained. The copper thickness compensation data can be used to guide the thickness increase and decrease processing technology of the electroplated copper layer. After the thickness of the electroplated copper layer is increased or decreased, the depth image of the target electroplating hole is acquired again to calculate the measured thickness h' until the measured thickness h' is within the theoretical thickness range, so that the thickness of the electroplated copper layer can be accurately controlled within the theoretical thickness range. Since the thickness uniformity of the electroplated copper layer is also one of the important indicators affecting the product quality, the judgment of whether the thickness uniformity of the electroplated copper layer meets the qualified standard is also considered here. If not, the copper thickness adjustment data of the electroplated copper layer is obtained. The copper thickness adjustment data can be used to guide the thickness fine-tuning processing technology of the electroplated copper layer. After adjustment, the thickness uniformity of the electroplated copper layer can be promoted. Then, the thickness uniformity of the electroplated copper layer is recalculated until the thickness uniformity meets the qualified standard. Therefore, based on the depth image, the present application can accurately control both the thickness and the uniformity of the electroplated copper layer, thereby greatly improving the product quality. Description of the Drawings

[0053] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings required to be used in the description of the specific embodiments or the prior art. In all the drawings, similar elements or parts are generally denoted by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0054] Figure 1 It is a schematic flowchart of a method for controlling the electroplated copper thickness of a press plate in an embodiment of the present application;

[0055] Figure 2 It is a schematic structural diagram of a target press plate in an embodiment of the present application;

[0056] Figure 3 It is a schematic diagram after dividing the target area into grids in an embodiment of the present application;

[0057] Figure 4 Schematic diagram of the principle for screening the highest measurement point and the lowest measurement point in the area to be measured in the embodiments of the present application;

[0058] Figure 5 Schematic diagram of the principle for calculating the first spacing value d1 and the second spacing value d2 in the embodiments of the present application.

[0059] Reference numerals:

[0060] 110 - base layer, 120 - base copper layer, 130 - dry film layer, 140 - electroplated copper layer, 150 - target electroplated hole, 160 - target area, 170 - area to be measured, 180 - initial measurement point, 190 - alternative highest point, 210 - alternative lowest point, 220 - first area circle, 230 - first alternative measurement point, 240 - second area circle, 250 - second alternative measurement point.

[0061] The realization of the purpose, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. Specific embodiments

[0062] Next, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0063] It should be noted that all the directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative position relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0064] In the present application, unless otherwise clearly defined and limited, the terms "connection", "fixation", etc. shall be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0065] In addition, if the descriptions such as "first" and "second" are involved in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and / or" appearing throughout the text includes three parallel scenarios. Taking "A and / or B" as an example, it includes Scenario A, or Scenario B, or the scenario where both A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present application.

[0066] Embodiment 1

[0067] Refer to Figures 1 - 5 , this embodiment provides a method for controlling the copper thickness of a pressing plate during electroplating, including the following steps:

[0068] Obtain a depth image of the target electroplating hole 150 on the target pressing plate; wherein, the target pressing plate includes a base layer 110, a base copper layer 120 is provided on the top surface of the base layer 110, a dry film layer 130 is provided on the top surface of the base copper layer 120, a selective plating hole is provided in the dry film layer 130, the selective plating hole is filled with an electroplated copper layer 140, and the top surface of the electroplated copper layer 140 is lower than the top surface of the dry film layer 130 to form the target electroplating hole 150;

[0069] According to the depth image, obtain the measured depth h of the target electroplating hole 150 to obtain the measured thickness h' of the electroplated copper layer 140; wherein, h' = H - h, and H is the thickness of the dry film layer 130;

[0070] Judge whether the measured thickness h' is within the preset theoretical thickness range; wherein, the theoretical thickness is a range value;

[0071] If not, obtain the copper thickness compensation data of the electroplated copper layer 140, and return to obtain the depth image of the target electroplating hole 150 on the target pressing plate until the measured thickness h' is within the theoretical thickness range; if so, obtain the thickness uniformity of the electroplated copper layer 140;

[0072] Judge whether the thickness uniformity meets the qualified standard;

[0073] If not, obtain the copper thickness adjustment data of the electroplated copper layer 140, and return to obtain the thickness uniformity of the electroplated copper layer 140 until the thickness uniformity meets the qualified standard; if so, end.

[0074] In this embodiment, a depth image of the target electroplating hole 150 on the target press plate is acquired through collection. Since the depth image may contain the distance information of each pixel point from the camera, the measured depth h of the target electroplating hole 150 can be obtained based on this depth image. Then, by subtracting the measured depth h from the known thickness H of the dry film layer 130, the measured thickness h' of the electroplated copper layer 140 can be accurately calculated. Based on the machine vision recognition technology in this embodiment, it is more accurate and effective than measuring with a traditional thickness gauge. Then, it is determined whether the measured thickness h' is within the preset theoretical thickness range. If not, the copper thickness compensation data for the electroplated copper layer 140 needs to be obtained. The copper thickness compensation data can be used to guide the thickness increase or decrease processing technology of the electroplated copper layer 140 (i.e., thickening treatment or thinning treatment). After the thickness of the electroplated copper layer 140 is increased or decreased, the depth image of the target electroplating hole 150 is acquired again to calculate the measured thickness h' until the measured thickness h' is within the theoretical thickness range, so that the thickness of the electroplated copper layer 140 can be accurately controlled within the theoretical thickness range. Since the thickness uniformity of the electroplated copper layer 140 is also one of the important indicators affecting the product quality, it is also considered here to determine whether the thickness uniformity of the electroplated copper layer 140 meets the qualified standard. If not, the copper thickness adjustment data for the electroplated copper layer 140 is obtained. The copper thickness adjustment data can be used to guide the thickness fine-tuning processing technology of the electroplated copper layer 140 (i.e., thickening treatment or thinning treatment). After adjustment, the thickness uniformity of the electroplated copper layer 140 can be promoted, and then the thickness uniformity of the electroplated copper layer 140 is recalculated until the thickness uniformity meets the qualified standard. Therefore, based on the depth image in this embodiment, the thickness and uniformity of the electroplated copper layer 140 can be accurately controlled simultaneously, thereby greatly improving the product quality.

[0075] As an alternative embodiment, obtaining the thickness uniformity of the electroplated copper layer 140 includes:

[0076] Extracting the target area 160 from the depth image; wherein, the target area 160 is the area where the target electroplating hole 150 is located;

[0077] Dividing the target area 160 into grids to obtain a plurality of areas to be measured 170;

[0078] Obtaining the detected thickness H' of the electroplated copper layer 140 corresponding to each area to be measured 170;

[0079] Selecting the maximum value H' max and the minimum value H' min ;

[0080] According to the maximum value H' max and the minimum value H' min , obtaining the thickness uniformity of the electroplated copper layer 140.

[0081] In this embodiment, when evaluating the thickness uniformity of the electroplated copper layer 140, the target region 160 corresponding to the target electroplated hole 150 can be extracted based on the depth image. To improve the detection accuracy, the target region 160 is divided into a plurality of regions to be measured 170 by grid division, and then the detected thickness H' of the electroplated copper layer 140 corresponding to each region to be measured 170 is calculated respectively, rather than directly and roughly calculating the thickness of the electroplated copper layer 140 corresponding to the entire target region 160. Then, the maximum value H' that can best reflect the thickness fluctuation characteristics of the electroplated copper layer 140 among the multiple detected thicknesses H' is selected. max and the minimum value H'. min , and finally the thickness uniformity can be accurately calculated.

[0082] As an alternative embodiment, let the thickness uniformity be Q, and the expression of Q is:

[0083] Q = K / (H' max - H' min );

[0084] In the formula, K is an adjustment coefficient.

[0085] In this embodiment, the difference between the maximum value H' max and the minimum value H' min can reflect the thickness fluctuation degree of the electroplated copper layer 140. Here, an adjustment coefficient K is set to characterize the correlation degree between the difference (H' max - H' min ) and the thickness uniformity Q, and the difference (H' max - H' min ) and the thickness uniformity Q are set in an inverse proportion relationship. Finally, the thickness uniformity Q with reference and guidance can be calculated for subsequent numerical comparison, that is, the larger the value of the thickness uniformity Q, the better the uniformity.

[0086] As an alternative embodiment, obtaining the detected thickness H' of the electroplated copper layer 140 corresponding to each region to be measured 170 includes:

[0087] Selecting a plurality of initial measurement points 180 distributed in a rectangular array in the region to be measured 170;

[0088] According to the initial measurement points 180, obtaining the highest measurement point and the lowest measurement point in the region to be measured 170; wherein, the highest measurement point is the initial measurement point 180 closest to the top surface of the dry film layer 130 in the region to be measured 170, and the lowest measurement point is the initial measurement point 180 farthest from the top surface of the dry film layer 130 in the region to be measured 170;

[0089] Obtain the first spacing value d1 from the highest measurement point in each area 170 to be measured to the top surface of the dry film layer 130 and the second spacing value d2 from the lowest measurement point to the top surface of the dry film layer 130;

[0090] According to the first spacing value d1 and the second spacing value d2, obtain the first detected thickness H1' and the second detected thickness H2'; where, H1' = H - d1, H2' = H - d2.

[0091] In this embodiment, when calculating the detected thickness H' of the corresponding electroplated copper layer 140 in each area 170 to be measured, since the thickness uniformity of the electroplated copper layer 140 can be reflected by the flatness of its upper surface, and there is also a certain degree of unevenness on the upper surface of each subdivided area 170 to be measured, the detected thickness H' here should include the first detected thickness H1' corresponding to the position with the maximum thickness and the second detected thickness H2' corresponding to the position with the minimum thickness. At the same time, in this embodiment, a plurality of initial measurement points 180 are uniformly selected in a rectangular array, and the initial measurement point 180 can represent a pixel point. Using the depth information of the depth image, the highest measurement point and the lowest measurement point in the initial measurement points 180 can be screened out according to the depth information first, and then the distances from the highest measurement point and the lowest measurement point to the top surface of the dry film layer 130 are calculated respectively to obtain the first spacing value d1 and the second spacing value d2, and then the corresponding first detected thickness H1' and the second detected thickness H2' can be calculated. Since a first detected thickness H1' and a second detected thickness H2' can be calculated for each area 170 to be measured, a plurality of data of the first detected thickness H1' and the second detected thickness H2' are finally formed, and finally the maximum value among the plurality of first detected thicknesses H1' is selected as the final H' max , and the minimum value among the plurality of second detected thicknesses H2' is selected as the final H' min That's it. The data has strong reliability and the calculation is accurate and effective.

[0092] As an alternative embodiment, according to the initial measurement points 180, obtaining the highest measurement point and the lowest measurement point in the area 170 to be measured includes:

[0093] Obtain the depth value of each initial measurement point 180, and screen out the alternative highest point 190 with the minimum depth value and the alternative lowest point 210 with the maximum depth value among the initial measurement points 180;

[0094] Construct a first area circle 220 with the alternative highest point 190 as the center; where the radius of the first area circle 220 is less than or equal to half of the distance between adjacent initial measurement points 180;

[0095] Select a plurality of first alternative measurement points 230 within the first area circle 220;

[0096] Determine whether there is a first alternative measurement point 230 that satisfies the first condition within the first region circle 220. If not, output the alternative highest point 190 as the highest measurement point. If so, output the first alternative measurement point 230 with the smallest depth value as the alternative highest point 190, and return to construct a first region circle 220 with the alternative highest point 190 as the center; wherein, the first condition is that the depth value of the first alternative measurement point 230 is less than the depth value of the alternative highest point 190.

[0097] Construct a second region circle 240 with the alternative lowest point 210 as the center; wherein, the radius of the second region circle 240 is less than or equal to half of the distance between adjacent initial measurement points 180.

[0098] Select multiple second alternative measurement points 250 within the second region circle 240.

[0099] Determine whether there is a second alternative measurement point 250 that satisfies the second condition within the second region circle 240. If not, output the alternative lowest point 210 as the lowest measurement point. If so, output the second alternative measurement point 250 with the largest depth value as the alternative lowest point 210, and return to construct a second region circle 240 with the alternative lowest point 210 as the center; wherein, the second condition is that the depth value of the second alternative measurement point 250 is greater than the depth value of the alternative lowest point 210.

[0100] In this embodiment, since the pixel points corresponding to the initial measurement points 180 are not necessarily exactly the highest measurement point and the lowest measurement point, in order to improve the calculation accuracy here, the alternative highest point 190 with the smallest depth value and the alternative lowest point 210 with the largest depth value (the larger the depth value, the lower the relative position of the pixel point) in the initial measurement points 180 can be selected as much as possible according to the depth value of each initial measurement point 180. When looking for the highest measurement point, first construct a first region circle 220 with the alternative highest point 190 as the center. The first region circle 220 is a reasonable search range, and then select multiple first alternative measurement points 230 within the first region circle 220, compare the depth values with the alternative highest point 190, and determine whether there is a first alternative measurement point 230 that satisfies the first condition. If not, it means that the alternative highest point 190 already belongs to the ideal pixel point with the highest relative position. At this time, the alternative highest point 190 can be directly output as the highest measurement point. If so, update the first alternative measurement point 230 with the smallest depth value to the new alternative highest point 190, and then reconstruct a first region circle 220 with the new alternative highest point 190 as the center until the highest measurement is found. Similarly, when looking for the lowest measurement point, a second region circle 240 is constructed based on the above principle for searching, so that the ideal highest measurement point and lowest measurement point can be accurately found to improve the data accuracy.

[0101] As an alternative embodiment, the copper thickness compensation data includes copper addition compensation data and copper reduction compensation data;

[0102] Obtaining the copper thickness compensation data of the electroplated copper layer 140 includes:

[0103] If the measured thickness h' is greater than the theoretical thickness, obtain the first difference between the measured thickness h' and the standard thickness value, and output the first difference as the copper reduction compensation data; wherein, the standard thickness value is the median of the theoretical thickness;

[0104] If the measured thickness h' is less than the theoretical thickness, obtain the second difference between the measured thickness h' and the standard thickness value, and output the second difference as the copper addition compensation data.

[0105] In this embodiment, according to the magnitude relationship between the measured thickness h' and the theoretical thickness, if the measured thickness h' is greater than the theoretical thickness, copper reduction treatment is required (the thickness of the electroplated copper layer 140 can be reduced by micro-etching with acid solution). After the copper reduction treatment, the thickness of the electroplated copper layer 140 should be made to fit the most ideal standard thickness value as much as possible. Therefore, the first difference between the measured thickness h' and the standard thickness value is output as the copper reduction compensation data to guide the copper reduction treatment process operation. Similarly, when the measured thickness h' is less than the theoretical thickness, copper addition treatment is required (i.e., copper is plated again to increase the thickness of the electroplated copper layer 140), and the second difference between the measured thickness h' and the standard thickness value can be output as the copper addition compensation data to guide the copper addition treatment process operation.

[0106] As an alternative embodiment, the copper thickness adjustment data includes copper addition adjustment data and copper reduction adjustment data;

[0107] Obtaining the copper thickness adjustment data of the electroplated copper layer 140 includes:

[0108] If the measured thickness h' is greater than the standard thickness value, obtain the third difference between the measured thickness h' and the standard thickness value, and output the third difference as the copper reduction adjustment data;

[0109] If the measured thickness h' is less than the standard thickness value, obtain the fourth difference between the measured thickness h' and the standard thickness value, and output the fourth difference as the copper addition adjustment data.

[0110] In this embodiment, when the thickness of the electroplated copper layer 140 needs to be adjusted, since the measured thickness h' is already within the theoretical thickness range at this time, the adjusted thickness should also fit the most ideal standard thickness value as much as possible. When the measured thickness h' is greater than the standard thickness value, the third difference between the measured thickness h' and the standard thickness value can be output as the copper reduction adjustment data to guide the copper reduction treatment process operation. Similarly, when the measured thickness h' is less than the standard thickness value, the fourth difference between the measured thickness h' and the standard thickness value is output as the copper addition adjustment data to guide the copper addition treatment process operation.

[0111] Example 2

[0112] Reference Figures 1 - 2 , based on the same inventive concept as the foregoing embodiments, this embodiment also provides a control system for electroplating copper thickness of a pressing plate, including:

[0113] An image acquisition module, configured to acquire a depth image of a target electroplating hole 150 on a target pressing plate; wherein, the target pressing plate includes a base layer 110, a base copper layer 120 is provided on the top surface of the base layer 110, a dry film layer 130 is provided on the top surface of the base copper layer 120, a selective plating hole is provided in the dry film layer 130, the selective plating hole is filled with an electroplated copper layer 140, and the top surface of the electroplated copper layer 140 is lower than the top surface of the dry film layer 130 to form a target electroplating hole 150;

[0114] A data acquisition module, configured to acquire a measured depth h of the target electroplating hole 150 according to the depth image to obtain a measured thickness h' of the electroplated copper layer 140; wherein, h' = H - h, and H is the thickness of the dry film layer 130;

[0115] A first judgment module, configured to judge whether the measured thickness h' is within a preset theoretical thickness range; wherein, the theoretical thickness is a range value;

[0116] A first data processing module, configured to, if not, acquire copper thickness compensation data of the electroplated copper layer 140, and return to acquire a depth image of the target electroplating hole 150 on the target pressing plate until the measured thickness h' is within the theoretical thickness range; if so, acquire the thickness uniformity of the electroplated copper layer 140;

[0117] A second judgment module, configured to judge whether the thickness uniformity meets the qualified standard;

[0118] A second data processing module, configured to, if not, acquire copper thickness adjustment data of the electroplated copper layer 140, and return to acquire the thickness uniformity of the electroplated copper layer 140 until the thickness uniformity meets the qualified standard; if so, end.

[0119] For the relevant explanations and examples of each module in the device of this embodiment, reference can be made to the method of the foregoing embodiments, which will not be elaborated here.

[0120] Example 3

[0121] Based on the same inventive concept as the foregoing embodiments, this embodiment provides a computer device, which includes a memory and a processor. A computer program is stored in the memory, and the processor executes the computer program to implement the above method.

[0122] Example 4

[0123] Based on the same inventive concept as the foregoing embodiments, this embodiment provides a computer-readable storage medium, on which a computer program is stored, and a processor executes the computer program to implement the above method.

[0124] The above are only the preferred embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied to other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A method for controlling the thickness of electroplated copper on a pressing plate, characterized in that: The following steps are involved: Acquire a depth image of a target electroplated hole on a target counter-pressing plate; wherein the target counter-pressing plate comprises a base layer, a substrate copper layer is disposed on the top surface of the base layer, a dry film layer is disposed on the top surface of the substrate copper layer, a selectively plated hole is disposed in the dry film layer, the selectively plated hole is filled with an electroplated copper layer, and the top surface of the electroplated copper layer is lower than the top surface of the dry film layer, so as to form the target electroplated hole; According to the depth image, obtaining the measured depth h of the target electroplated hole to obtain the measured thickness h' of the electroplated copper layer; wherein h'=Hh, H is the thickness of the dry film layer; Determine whether the measured thickness h' is within a preset theoretical thickness range; wherein the theoretical thickness is a range value; If not, then obtain the copper thickness compensation data of the electroplated copper layer, and return to the depth image of the target electroplated hole on the target pressure plate until the measured thickness h' is within the theoretical thickness range; if so, then obtain the thickness uniformity of the electroplated copper layer, including: extracting the target area in the depth image; wherein the target area is the area where the target electroplated hole is located; gridding the target area to obtain a plurality of areas to be tested; obtaining the detection thickness H' of the electroplated copper layer corresponding to each of the areas to be tested; screening out the maximum value H' among the plurality of detection thicknesses H' max and minimum value H' min According to the maximum value H' max and the minimum value H' min , obtain the thickness uniformity of the electroplated copper layer; the obtaining of the detection thickness H' of the electroplated copper layer corresponding to each of the test areas includes: selecting a plurality of initial measurement points distributed in a rectangular array in the test area; obtaining the highest measurement point and the lowest measurement point in the test area according to the initial measurement points; wherein the highest measurement point is the initial measurement point closest to the top surface of the dry film layer in the test area, and the lowest measurement point is the initial measurement point farthest from the top surface of the dry film layer in the test area; obtaining a first spacing value d1 from the highest measurement point to the top surface of the dry film layer and a second spacing value d2 from the lowest measurement point to the top surface of the dry film layer in each of the test areas; obtaining a first detection thickness H1' and a second detection thickness H2' according to the first spacing value d1 and the second spacing value d2; wherein H1'=H-d1, H2'=H-d2; screening out the maximum value among the plurality of first detection thicknesses H1' as the final H' max , select the minimum value among multiple second detection thicknesses H2' as the final H' min ; The method of obtaining the highest measurement point and the lowest measurement point in the area to be measured according to the initial measurement point includes: obtaining the depth value of each of the initial measurement points, and screening out the candidate highest point with the smallest depth value and the candidate lowest point with the largest depth value among the initial measurement points; constructing a first area circle with the candidate highest point as the center; wherein the radius of the first area circle is less than or equal to half of the distance between adjacent initial measurement points; selecting multiple first candidate measurement points in the first area circle; judging whether there is a first candidate measurement point that meets the first condition in the first area circle, and if not, outputting the candidate highest point as the highest measurement point, and if so, outputting the first candidate measurement point with the smallest depth value as the candidate highest point, and returning to the method of constructing the first area circle with the candidate highest point as the center. A first area circle; wherein the first condition is that the depth value of the first candidate measurement point is less than the depth value of the candidate highest point; a second area circle is constructed with the candidate lowest point as the center; wherein the radius of the second area circle is less than or equal to half of the distance between adjacent initial measurement points; multiple second candidate measurement points are selected in the second area circle; it is determined whether there is a second candidate measurement point that meets the second condition in the second area circle, if not, the candidate lowest point is output as the lowest measurement point, if so, the second candidate measurement point with the largest depth value is output as the candidate lowest point, and the process returns to the construction of a second area circle with the candidate lowest point as the center; wherein the second condition is that the depth value of the second candidate measurement point is greater than the depth value of the candidate lowest point; Determining whether the thickness uniformity meets the qualification standard; If not, the copper thickness adjustment data of the electroplated copper layer is obtained, and the process returns to the step of obtaining the thickness uniformity of the electroplated copper layer until the thickness uniformity meets the qualified standard; if yes, the process ends.

2. A method for controlling the thickness of electroplated copper on a pressure plate as claimed in claim 1, characterized in that The thickness uniformity is Q, and the expression of Q is: Q=K / (H' max -H' min ); Where K is the adjustment coefficient.

3. A method for controlling the thickness of electroplated copper on a pressing plate as claimed in claim 1, characterized in that: The copper thickness compensation data includes copper increase compensation data and copper reduction compensation data; The step of obtaining the copper thickness compensation data of the electroplated copper layer comprises: If the measured thickness h' is greater than the theoretical thickness, a first difference between the measured thickness h' and the standard thickness value is obtained, and the first difference is output as the copper reduction compensation data; wherein the standard thickness value is the middle value of the theoretical thickness; If the measured thickness h' is less than the theoretical thickness, a second difference between the measured thickness h' and the standard thickness value is obtained, and the second difference is output as the copper increase compensation data.

4. A method for controlling the thickness of electroplated copper on a pressing plate as claimed in claim 3, characterized in that: The copper thickness adjustment data includes copper increase adjustment data and copper reduction adjustment data; The step of obtaining the copper thickness adjustment data of the electroplated copper layer comprises: If the measured thickness h' is greater than the standard thickness value, a third difference between the measured thickness h' and the standard thickness value is obtained, and the third difference is output as the copper reduction adjustment data; If the measured thickness h' is less than the standard thickness value, a fourth difference between the measured thickness h' and the standard thickness value is obtained, and the fourth difference is output as the copper addition adjustment data.

5. A control system for the thickness of electroplated copper on a pressure plate, characterized in that: include: An image acquisition module is used to acquire a depth image of a target electroplated hole on a target counter-pressing plate; wherein the target counter-pressing plate comprises a base layer, a substrate copper layer is disposed on the top surface of the base layer, a dry film layer is disposed on the top surface of the substrate copper layer, a selectively plated hole is disposed in the dry film layer, the selectively plated hole is filled with an electroplated copper layer, and the top surface of the electroplated copper layer is lower than the top surface of the dry film layer to form the target electroplated hole; A data acquisition module, used to acquire the measured depth h of the target electroplated hole according to the depth image, so as to obtain the measured thickness h' of the electroplated copper layer; wherein h'=Hh, H is the thickness of the dry film layer; A first judgment module is used to judge whether the measured thickness h' is within a preset theoretical thickness range; wherein the theoretical thickness is a range value; The first data processing module is used to obtain the copper thickness compensation data of the electroplated copper layer if no, and return to the depth image of the target electroplated hole on the target pressing plate until the measured thickness h' is within the theoretical thickness range; if yes, obtain the thickness uniformity of the electroplated copper layer, including: extracting the target area in the depth image; wherein the target area is the area where the target electroplated hole is located; gridding the target area to obtain a plurality of areas to be tested; obtaining the detection thickness H' of the electroplated copper layer corresponding to each of the areas to be tested; screening out the maximum value H' among the plurality of detection thicknesses H' max and minimum value H' min According to the maximum value H' max and the minimum value H' min , obtain the thickness uniformity of the electroplated copper layer; the obtaining of the detection thickness H' of the electroplated copper layer corresponding to each of the test areas includes: selecting a plurality of initial measurement points distributed in a rectangular array in the test area; obtaining the highest measurement point and the lowest measurement point in the test area according to the initial measurement points; wherein the highest measurement point is the initial measurement point closest to the top surface of the dry film layer in the test area, and the lowest measurement point is the initial measurement point farthest from the top surface of the dry film layer in the test area; obtaining a first spacing value d1 from the highest measurement point to the top surface of the dry film layer and a second spacing value d2 from the lowest measurement point to the top surface of the dry film layer in each of the test areas; obtaining a first detection thickness H1' and a second detection thickness H2' according to the first spacing value d1 and the second spacing value d2; wherein H1'=H-d1, H2'=H-d2; screening out the maximum value among the plurality of first detection thicknesses H1' as the final H' max , select the minimum value among multiple second detection thicknesses H2' as the final H' min ; The method of obtaining the highest measurement point and the lowest measurement point in the area to be measured according to the initial measurement point includes: obtaining the depth value of each of the initial measurement points, and screening out the candidate highest point with the smallest depth value and the candidate lowest point with the largest depth value among the initial measurement points; constructing a first area circle with the candidate highest point as the center; wherein the radius of the first area circle is less than or equal to half of the distance between adjacent initial measurement points; selecting multiple first candidate measurement points in the first area circle; judging whether there is a first candidate measurement point that meets the first condition in the first area circle, and if not, outputting the candidate highest point as the highest measurement point, and if so, outputting the first candidate measurement point with the smallest depth value as the candidate highest point, and returning to the method of constructing the first area circle with the candidate highest point as the center. A first area circle; wherein the first condition is that the depth value of the first candidate measurement point is less than the depth value of the candidate highest point; a second area circle is constructed with the candidate lowest point as the center; wherein the radius of the second area circle is less than or equal to half of the distance between adjacent initial measurement points; multiple second candidate measurement points are selected in the second area circle; it is determined whether there is a second candidate measurement point that meets the second condition in the second area circle, if not, the candidate lowest point is output as the lowest measurement point, if so, the second candidate measurement point with the largest depth value is output as the candidate lowest point, and the process returns to the construction of a second area circle with the candidate lowest point as the center; wherein the second condition is that the depth value of the second candidate measurement point is greater than the depth value of the candidate lowest point; A second judgment module is used to judge whether the thickness uniformity meets the qualification standard; The second data processing module is used for obtaining the copper thickness adjustment data of the electroplated copper layer if no, and returning to obtaining the thickness uniformity of the electroplated copper layer until the thickness uniformity meets the qualified standard; if yes, ending.

6. A computer device, characterized in that: The computer device comprises a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement a method for controlling the thickness of electroplated copper on a pressure plate as claimed in any one of claims 1 to 4.

7. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and the processor executes the computer program to implement a method for controlling the thickness of electroplated copper on a pressure plate according to any one of claims 1 to 4.

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