Discharging mechanism for semiconductor device processing

Abstract

The invention discloses a blanking mechanism for semiconductor device processing, and relates to the technical field of semiconductor device processing, the blanking mechanism comprises a guide assembly, a displacement assembly and a blanking assembly, the guide assembly comprises a guide disc, a drop point seat, a vent groove, a waste outlet, a blanking port, a first electromagnet and a second electromagnet, and the drop point seat is arranged in the guide disc. By means of the annular design of the guide disc and the displacement disc, the device can conduct reciprocating discharging in a circumferential mode, compared with a traditional discharging mode adopting a mechanical arm, discharging operation can be conducted more efficiently, meanwhile, quality detection of semiconductor devices and screening of unqualified products can be automatically achieved in the circumferential rotating process, and the production efficiency is improved. In addition, the structure of the equipment is more compact due to circumferential rotating blanking, more space is saved compared with a manipulator type blanking mode, the equipment adopts a point-to-point blanking mode, a precise positioning part does not need to be used, the cost is saved, and meanwhile the fault rate is lower than that of the manipulator type blanking mode.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor device processing, in particular to a material unloading mechanism for semiconductor device processing. Background Art

[0002] Semiconductor devices refer to various electronic components manufactured using the special electrical properties of semiconductor materials (such as silicon, germanium, etc.). These devices play an extremely important role in modern electronic technology due to their unique performance. According to their functions and structures, semiconductor devices are divided into diodes, transistors, integrated circuits, etc. With the development of science and technology, new semiconductor materials and technologies continue to emerge, promoting the research and development and application of semiconductor devices with higher performance and lower power consumption, and greatly promoting the progress and development of information technology and related fields. During the processing of semiconductor devices, it is usually necessary to use a blanking mechanism to make them fall onto the surface of the PCB board for subsequent assembly.

[0003] The common unloading mechanism for semiconductor device processing on the market is often in the form of a robot. However, when using a robot to unload materials, the unloading speed is often slow due to the long displacement stroke of the robot. If the robot displacement speed is fast, displacement accuracy errors are prone to occur. In addition, the use of a robot to unload materials cannot detect semiconductor devices. If the semiconductor device body is damaged, it will cause PCB board failure after assembly with the PCB board.

[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and a material unloading mechanism for semiconductor device processing is proposed. Summary of the invention

[0005] The object of the present invention is to provide a material unloading mechanism for semiconductor device processing to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a material unloading mechanism for semiconductor device processing, comprising a guide assembly, a displacement assembly and a material unloading assembly, the guide assembly comprising a guide plate, a landing seat, a vent, a waste outlet, a material unloading port, a first electromagnet and a second electromagnet, a landing seat is arranged inside the guide plate, and a waste outlet is opened inside the guide plate, a material unloading port is opened inside the guide plate, a first electromagnet and a second electromagnet are buried inside the guide plate, a fixed frame is arranged at the outer end of the guide plate, and a barrel is arranged at the outer end of the fixed frame, a motor is arranged at the outer end of the guide plate, and a driving gear is arranged at the output end of the motor, a displacement assembly is arranged inside the guide plate, an exhaust and blowing machine is arranged at the top of the fixed frame, and a blowing port is arranged on the outer side of the bottom of the exhaust and blowing machine, and a visual camera is arranged at the outer end of the fixed frame.

[0007] Furthermore, the displacement assembly includes a displacement disk, meshing teeth, balls, a receiving disk, a snap-fit ​​seat, a tension spring, an armature and a magnetic transmission plate, the outer end of the displacement disk is provided with an engagement tooth groove, and the bottom end of the displacement disk is provided with a ball, receiving disks are provided on both sides of the interior of the displacement disk, and a snap-fit ​​seat is arranged inside the receiving disk, a tension spring is provided between the receiving disks, and the outer end of the receiving disk is provided with an armature, and a magnetic transmission plate is buried inside the displacement disk.

[0008] Furthermore, the guide plate is sleeve-connected with the displacement plate, and the ball is in contact with the lower surface of the displacement plate.

[0009] Furthermore, the driving gear is meshed with the meshing tooth groove, and the displacement plate rotates inside the guide plate through the meshing of the driving gear and the meshing tooth groove.

[0010] Furthermore, the magnetic force transfer plate transfers the magnetic force of the first electromagnet and the second electromagnet, and the magnetic force transfer plate is electromagnetically adsorbed and connected to the armature.

[0011] Furthermore, the receiving trays are elastically connected via tension springs, and the receiving trays are fixedly connected to the armature.

[0012] Furthermore, a suction pipe is arranged at the top of the suction and blowing machine, and a docking seat is arranged at the end of the suction pipe, an electric push rod is arranged at the bottom end of the docking seat, and a sealed cover is arranged at the bottom end of the electric push rod, an air suction hose is arranged between the docking seat and the sealed cover, and a blanking assembly is arranged on the outer side of the bottom of the guide plate.

[0013] Furthermore, the blanking assembly includes a blanking seat A, a blanking seat B, a pressure spring, a sealed soft film, a suction groove and an electrically controlled stopper. The blanking seat B is arranged on the outer side of the bottom of the blanking seat A, and a pressure spring is arranged between the blanking seat A and the blanking seat B. A sealed soft film is arranged between the blanking seat A and the blanking seat B. A suction groove is opened on the outer side of the bottom of the blanking seat B, and an electrically controlled stopper is arranged on the inner side of the bottom of the blanking seat B.

[0014] Furthermore, the suction pipe is connected to the closed cover through a docking seat and a suction hose, and the closed cover is connected to the inside of the blanking seat A and the blanking seat B through a discharge port.

[0015] Furthermore, the blanking seat A is sleeve-connected with the blanking seat B, and the blanking seat B is elastically connected with the blanking seat A through a pressure spring.

[0016] The present invention provides a material unloading mechanism for semiconductor device processing, which has the following beneficial effects:

[0017] 1. The rotation of the displacement disk of the present invention can drive the semiconductor device to move to the intersection of the magnetic force transmission plate and the first electromagnet and the second electromagnet. At this time, the magnetic force of the first electromagnet and the second electromagnet can be transmitted to the magnetic force transmission plate, so that the magnetic force transmission plate obtains magnetic force. After the magnetic force is generated, the armature can be attracted. After the armature is attracted, it can pull the receiving disk to move in the direction of the magnetic force transmission plate and stretch the tension spring, so that the receiving disks on both sides of the device can generate an outward pulling force on the fixed semiconductor device. If the current semiconductor device has internal damage or cracks, it will be damaged or broken under the pulling. Through this design, the device can detect whether the current semiconductor device is damaged, and the device can detect whether the current semiconductor device is damaged by controlling the first electromagnet and the second electromagnet. The pulling force is adjusted by the magnetic force of the electromagnet, which allows the equipment to flexibly adjust the pulling force according to the type of semiconductor device being tested, which makes the use of the equipment more flexible. At the intersection of the magnetic transmission plate and the first and second electromagnets, the receiving tray is just at the top of the ventilation slot. During the pulling test, the integrated exhaust and blowing machine can make a high-speed airflow blow out through the air port, which allows the high-speed airflow to blow on the surface of the semiconductor device and pass through the ventilation slot. The blowing of the high-speed airflow is coordinated with the pulling in the above process. If cracks appear on the surface of the semiconductor device or fragments break out, they will be blown out of the ventilation slot under the blowing of the high-speed airflow, which makes it easier to capture the damaged state of the semiconductor device after it is moved to the bottom of the visual camera.

[0018] 2. After the semiconductor device of the present invention is moved to the top of the discharge port, the locking seat releases the semiconductor device, which allows the semiconductor device to enter from the discharge port into the interior of the discharge seat A. Since the discharge seat A is connected to the discharge seat B, the semiconductor device will eventually fall to the bottom of the discharge seat B and be blocked by the electrically controlled block. The inner contour size of the bottom of the discharge seat B matches the outer contour size of the semiconductor device, which enables the semiconductor device to seal the bottom of the discharge seat B. After the semiconductor device is discharged, the electric push rod works to drive the sealed cover to fit the top surface of the displacement disk. The sealed cover is fastened to the inside of the displacement disk, the discharge seat A and the inside of the discharge seat B. At this time, the suction and blowing machine performs suction work, and the suction force can be exerted through the suction pipe, the docking seat and the suction soft The suction force is transmitted to the inside of the closed cover through the tube, and the closed cover is connected with the inside of the blanking seat B at this time. The suction force can be transmitted to the outside of the equipment through the suction groove. The landing point when the outer contour of the blanking seat B is completely fitted with the outer contour of the material holder is the assembly point of the semiconductor device and the PCB board, and the material holder can load the PCB board. After the suction force is transmitted to the outside from the suction groove, the blanking seat B will squeeze the pressure spring to adjust its position under the action of the suction force until it fits with the material holder. Through this design, if the positioning point of the material holder of the blanking seat B is offset, the equipment can still adjust the blanking seat B to the designated landing point. Under the action of the suction force, the equipment can also effectively clean the dust and foreign matter adhering to the surface of the PCB board and the material holder, to avoid short circuit due to dust and foreign matter when the semiconductor device and the PCB board are installed.

[0019] 3. Benefiting from the annular design of the guide plate and the displacement plate, the present invention enables the equipment to perform reciprocating feeding in a circular manner. Compared with the traditional robot-type feeding method, it can perform feeding operations more efficiently. At the same time, it can automatically realize the quality inspection of semiconductor devices and the screening of unqualified products during the circular rotation. In addition, the circular rotation feeding also makes the structure of the equipment more compact, which saves more space than the robot-type feeding. The present equipment adopts a point-to-point feeding method and does not require the use of precision positioning components. This saves costs and has a lower failure rate than the robot-type feeding. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A is a schematic diagram of the three-dimensional overall structure of a material unloading mechanism for semiconductor device processing according to the present invention;

[0021] Figure 2 FIG. B is a schematic diagram of the three-dimensional overall structure of a material unloading mechanism for semiconductor device processing according to the present invention;

[0022] Figure 3 FIG. C is a schematic diagram of the three-dimensional overall structure of a material unloading mechanism for semiconductor device processing according to the present invention;

[0023] Figure 4 It is a schematic diagram of a top view of a displacement component of a material unloading mechanism for processing semiconductor devices according to the present invention;

[0024] Figure 5 A material unloading mechanism for semiconductor device processing according to the present invention Figure 4 The enlarged structural diagram at A in the middle;

[0025] Figure 6 It is a schematic diagram of the overall structure of a displacement assembly of a material unloading mechanism for semiconductor device processing according to the present invention;

[0026] Figure 7 It is a schematic structural diagram of a blanking state of a blanking seat B of a blanking mechanism for semiconductor device processing of the present invention;

[0027] Figure 8 It is a schematic diagram of the overall cross-sectional structure of a material unloading mechanism for semiconductor device processing according to the present invention;

[0028] Fig. 9 The present invention is a schematic diagram of the overall cross-sectional structure of a blanking mechanism for semiconductor device processing.

[0029] In the figure: 1. guide assembly; 101. guide plate; 102. drop point seat; 103. ventilation groove; 104. waste outlet; 105. feed port; 106. first electromagnet; 107. second electromagnet; 2. fixing frame; 3. barrel; 4. motor; 5. driving gear; 6. displacement assembly; 601. displacement plate; 602. meshing tooth groove; 603. ball bearing; 604. receiving plate; 605. snap-fit ​​seat; 606. pull force spring; 607, armature; 608, magnetic transmission plate; 7, suction and blowing machine; 8, blowing port; 9, visual camera; 10, suction tube; 11, docking seat; 12, electric push rod; 13, closed cover; 14, suction hose; 15, blanking assembly; 1501, blanking seat A; 1502, blanking seat B; 1503, pressure spring; 1504, closed soft film; 1505, suction groove; 1506, electric control block. DETAILED DESCRIPTION

[0030] See also Figures 1 to 9 The present invention provides a technical solution: a material unloading mechanism for semiconductor device processing, comprising a guide assembly 1, a displacement assembly 6 and a material unloading assembly 15, wherein the guide assembly 1 comprises a guide plate 101, a drop point seat 102, a venting groove 103, a waste outlet 104, a material unloading port 105, a first electromagnet 106 and a second electromagnet 107, wherein the drop point seat 102 is arranged inside the guide plate 101, and the waste outlet 104 is opened inside the guide plate 101, and the material unloading port 105 is opened inside the guide plate 101 A first electromagnet 106 and a second electromagnet 107 are buried inside the guide plate 101, a fixed frame 2 is arranged at the outer end of the guide plate 101, and a barrel 3 is arranged at the outer end of the fixed frame 2, a motor 4 is arranged at the outer end of the guide plate 101, and a driving gear 5 is arranged at the output end of the motor 4, a displacement component 6 is arranged inside the guide plate 101, a suction and blowing machine 7 is arranged at the top of the fixed frame 2, and a blowing port 8 is arranged on the outer side of the bottom of the suction and blowing machine 7, and a visual camera 9 is arranged at the outer end of the fixed frame 2.

[0031] See also Figures 1 to 9, the displacement assembly 6 includes a displacement disk 601, an engaging tooth groove 602, a ball 603, a receiving disk 604, a snap-fit ​​seat 605, a tension spring 606, an armature 607 and a magnetic force transmission plate 608, the outer end of the displacement disk 601 is provided with an engaging tooth groove 602, and the bottom end of the displacement disk 601 is provided with a ball 603, the inner sides of the displacement disk 601 are provided with receiving disks 604, and the inner part of the receiving disk 604 is provided with a snap-fit ​​seat 605, a tension spring 606 is provided between the receiving disks 604, and the outer end of the receiving disk 604 is provided with an armature 607, the inner part of the displacement disk 601 is buried with a magnetic force transmission plate 608, and the guide The guide plate 101 is sleeve-connected with the displacement plate 601, and the ball 603 is fitted with the lower surface of the displacement plate 601, the driving gear 5 is meshed with the meshing tooth groove 602, and the displacement plate 601 rotates inside the guide plate 101 through the meshing of the driving gear 5 with the meshing tooth groove 602, the magnetic force transmission plate 608 transmits the magnetic force of the first electromagnet 106 and the second electromagnet 107, and the magnetic force transmission plate 608 is electromagnetically adsorbed and connected with the armature 607, the receiving plates 604 are elastically connected by the tension spring 606, and the receiving plates 604 are fixedly connected with the armature 607, and a suction pipe 10 is arranged at the top of the suction and blowing machine 7, and the suction pipe A docking seat 11 is provided at the end of the guide plate 101, an electric push rod 12 is arranged at the bottom end of the docking seat 11, and a closed cover 13 is arranged at the bottom end of the electric push rod 12, and a suction hose 14 is arranged between the docking seat 11 and the closed cover 13, and a blanking assembly 15 is arranged on the outer side of the bottom of the guide plate 101, and the blanking assembly 15 includes a blanking A seat 1501, a blanking B seat 1502, a pressure spring 1503, a closed soft film 1504, a suction groove 1505 and an electric control block 1506, and a blanking B seat 1502 is arranged on the outer side of the bottom of the blanking A seat 1501, and a pressure spring 1503 is arranged between the blanking A seat 1501 and the blanking B seat 1502. 503, a sealed soft film 1504 is provided between the blanking material A seat 1501 and the blanking material B seat 1502, a suction groove 1505 is provided on the outer side of the bottom of the blanking material B seat 1502, and an electric control stopper 1506 is provided on the inner side of the bottom of the blanking material B seat 1502, the suction pipe 10 is connected with the sealed cover 13 through the docking seat 11 and the suction hose 14, and the sealed cover 13 is connected with the blanking material A seat 1501 and the blanking material B seat 1502 through the discharge port 105, the blanking material A seat 1501 is sleeve-connected with the blanking material B seat 1502, and the blanking material B seat 1502 is elastically connected with the blanking material A seat 1501 through the pressure spring 1503;

[0032] The specific operation is as follows: the barrel 3 works to deliver the semiconductor device to be processed from its bottom outlet; the drop seat 102 and the bottom outlet of the barrel 3 are located on the same vertical line, so that the semiconductor device removed from the inside of the barrel 3 can fall into the top of the drop seat 102, and the receiving tray 604 is arranged at the top outer end of the drop seat 102, so that after the semiconductor device falls on the top of the drop seat 102, it can be surrounded by the receiving tray 604, and the semiconductor device can be clamped by the engagement seat 605 at this time, and the driving gear 5 is driven to rotate by the motor 4 at this time, so that the driving gear 5 can drive the displacement disk 601 to rotate inside the guide disk 101 by meshing with the meshing tooth groove 602, because the engagement seat 605 processes the semiconductor device at this time In the clamping state, the semiconductor device can rotate with the rotation of the displacement disk 601. The rotation of the displacement disk 601 can drive the semiconductor device to move to the intersection of the magnetic force transfer plate 608 and the first electromagnet 106 and the second electromagnet 107. At this time, the magnetic force of the first electromagnet 106 and the second electromagnet 107 can be transmitted to the magnetic force transfer plate 608, so that the magnetic force transfer plate 608 obtains the magnetic force. After the magnetic force transfer plate 608 generates magnetic force, it can attract the armature 607. After the armature 607 is attracted, it can pull the receiving plate 604 to move in the direction of the magnetic force transfer plate 608 and stretch the tension spring 606, so that the receiving plate 604 on both sides of the equipment can generate an outward pulling force on the fixed semiconductor device. If the current semiconductor device If there is internal damage or cracks in the component, it will be damaged or broken under the pulling. Through this design, the device can detect whether the current semiconductor device is damaged, and the device can adjust the pulling force by controlling the magnetic force of the first electromagnet 106 and the second electromagnet 107, so that the device can flexibly adjust the pulling force according to the type of semiconductor device detected, which makes the use of the device more flexible. At the intersection of the magnetic transfer plate 608 and the first electromagnet 106 and the second electromagnet 107, the receiving tray 604 will be at the top of the ventilation groove 103. During the pulling test, the exhaust and blowing integrated machine 7 can be operated to make a high-speed airflow blow out through the blowing port 8, so that the high-speed airflow can blow on the surface of the semiconductor device and pass through the ventilation groove 103. The air groove 103 is blown by high-speed airflow in combination with the pulling in the above process. If cracks or broken fragments appear on the surface of the semiconductor device, they will be blown out of the air groove 103 under the blowing of the high-speed airflow, which makes it easier to photograph the damaged state of the semiconductor device after it is moved to the bottom of the visual camera 9. The qualified semiconductor devices detected by the visual camera 9 will be moved to the top of the discharge port 105, and the unqualified ones will be released by the snap seat 605 to move the semiconductor devices out of the equipment from the waste outlet 104. After the qualified semiconductor devices are moved to the top of the discharge port 105, the snap seat 605 releases the semiconductor devices, which allows the semiconductor devices to enter the inside of the blanking seat A 1501 from the discharge port 105. Because the blanking seat A 1501 is connected with the blanking seat B 1502,Finally, the semiconductor device will fall to the bottom of the blanking seat B 1502 and be blocked by the electric control block 1506. The inner contour size of the bottom of the blanking seat B 1502 matches the outer contour size of the semiconductor device, so that the semiconductor device can block the bottom of the blanking seat B 1502. After the semiconductor device is blanked, the electric push rod 12 works to drive the sealing cover 13 to fit the top surface of the displacement plate 601. Through the buckling of the sealing cover 13, the inner part of the displacement plate 601, the blanking seat A 1501 and the blanking seat B 1502 can be fitted. 02 is connected internally, at this time, the suction and blowing integrated machine 7 performs suction work, and the suction force can be transmitted to the inside of the closed cover 13 through the suction pipe 10, the docking seat 11, and the suction hose 14, and the closed cover 13 is now connected to the inside of the blanking B seat 1502, and the suction force can be transmitted to the outside of the equipment through the suction groove 1505. The landing point when the outer contour of the blanking B seat 1502 is completely fitted with the outer contour of the material seat is the assembly point of the semiconductor device and the PCB board, and the material seat can load the PCB board, and the suction force is transmitted from the suction groove 1505 to the outside After that, under the action of suction force, the blanking seat B 1502 will squeeze the pressure spring 1503 to adjust the position until it fits with the material seat. Through this design, if the positioning point of the blanking seat B 1502 material seat is offset, the equipment can still adjust the blanking seat B 1502 to the specified blanking point. Under the action of suction force, the equipment can also effectively clean the dust and foreign matter adhering to the surface of the PCB board and the material seat to avoid short circuit due to dust and foreign matter when the semiconductor device and the PCB board are installed. Thanks to the annular design of the guide plate 101 and the displacement plate 601 The design enables the equipment to perform reciprocating feeding in a circular manner. Compared with the traditional robot-type feeding method, it can perform feeding operations more efficiently. At the same time, it can automatically realize the quality inspection of semiconductor devices and the screening of unqualified products during the circular rotation. In addition, the circular rotation feeding also makes the structure of the equipment more compact, which saves more space than the robot-type feeding. This equipment adopts a point-to-point feeding method and does not require the use of precision positioning components. This saves costs and has a lower failure rate than the robot-type feeding.

[0033] In summary, when the unloading mechanism for semiconductor device processing is used, the barrel 3 is first operated to deliver the semiconductor device to be processed from its bottom outlet, and the drop seat 102 and the bottom outlet of the barrel 3 are located on the same vertical line, so that the semiconductor device removed from the barrel 3 can fall into the top of the drop seat 102, and the receiving tray 604 is arranged at the top outer end of the drop seat 102, so that after the semiconductor device falls on the top of the drop seat 102, it can be surrounded by the receiving tray 604, and at this time, the semiconductor device can be clamped by the engaging seat 605;

[0034] Then, the motor 4 drives the active gear 5 to rotate, and the active gear 5 can drive the displacement plate 601 to rotate inside the guide plate 101 by meshing with the meshing tooth groove 602. Since the engaging seat 605 is in a clamping state for the semiconductor device at this time, the semiconductor device can rotate together with the rotation of the displacement plate 601. Through the rotation of the displacement plate 601, the semiconductor device can be driven to move to the intersection of the magnetic force transmission plate 608 and the first electromagnet 106 and the second electromagnet 107. At this time, the magnetic force of the first electromagnet 106 and the second electromagnet 107 can be transmitted to the magnetic force transmission plate 608, so that the magnetic force transmission plate 608 obtains magnetic force. After the magnetic force transmission plate 608 generates magnetic force, it can 07 is attracted, and after the armature 607 is attracted, it can pull the receiving tray 604 to move in the direction of the magnetic force transmission plate 608 and stretch the tension spring 606, so that the receiving trays 604 on both sides of the device can generate an outward pulling force on the fixed semiconductor device. If the current semiconductor device has internal damage or cracks, it will be damaged or broken under the pulling. Through this design, the device can detect whether the current semiconductor device is damaged, and the device can adjust the pulling force by controlling the magnetic force of the first electromagnet 106 and the second electromagnet 107, so that the device can flexibly adjust the pulling force according to the type of semiconductor device detected, which makes the use of the device more flexible;

[0035] Then, at the intersection of the magnetic transmission plate 608 and the first electromagnet 106 and the second electromagnet 107, the receiving tray 604 will be exactly at the top of the ventilation groove 103. During the pulling test, the exhaust and blowing integrated machine 7 can make the high-speed airflow blow out through the blowing port 8, so that the high-speed airflow can blow on the surface of the semiconductor device and pass through the ventilation groove 103. Through the blowing of the high-speed airflow and the pulling in the above process, if cracks appear on the surface of the semiconductor device or fragments are broken, they will be blown out of the ventilation groove 103 under the blowing of the high-speed airflow, which makes it easier to shoot the damaged state of the semiconductor device after it is moved to the bottom of the visual camera 9. The qualified semiconductor devices detected by the visual camera 9 will be moved to the top of the discharge port 105, and the unqualified ones will be released by the snap seat 605 to move the semiconductor device out of the equipment from the waste outlet 104;

[0036] After the qualified semiconductor device moves to the top of the material discharge port 105, the locking seat 605 releases the semiconductor device, so that the semiconductor device can enter the inside of the material discharge port A seat 1501 from the material discharge port 105. Since the material discharge seat A seat 1501 is connected with the material discharge seat B seat 1502, the semiconductor device will eventually fall to the bottom of the material discharge seat B seat 1502 and be blocked by the electric control block 1506. The inner contour size of the bottom end of the material discharge seat B seat 1502 matches the outer contour size of the semiconductor device, so that the semiconductor device can block the bottom end of the material discharge seat B seat 1502.

[0037] Finally, after the semiconductor device is blanked, the electric push rod 12 works to drive the sealed cover 13 to fit the top surface of the displacement disk 601. The sealed cover 13 is fastened to the inside of the displacement disk 601, the blanking seat A 1501 and the blanking seat B 1502. At this time, the suction and blowing machine 7 performs suction work, and the suction force can be transmitted to the inside of the sealed cover 13 through the suction pipe 10, the docking seat 11, and the suction hose 14. At this time, the sealed cover 13 is connected to the inside of the blanking seat B 1502, and the suction force can be transmitted to the outside of the equipment through the suction groove 1505. The outer contour of the blanking seat B 1502 is completely in contact with the outer contour of the material seat. The appropriate landing point is the assembly point of the semiconductor device and the PCB board, and the material holder can load the PCB board. After the suction force is transmitted to the outside from the suction groove 1505, under the action of the suction force, the blanking B seat 1502 will squeeze the pressure spring 1503 to adjust the position until it fits with the material holder. Through this design, if the positioning point of the blanking B seat 1502 material holder is offset, the equipment can still adjust the blanking B seat 1502 to the designated landing point. Under the action of the suction force, the equipment can also effectively clean the dust and foreign matter adhering to the surface of the PCB board and the material holder, to avoid short circuit due to dust and foreign matter when the semiconductor device and the PCB board are installed.

[0038] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A material unloading mechanism for semiconductor device processing, characterized in that: The invention comprises a guide assembly (1), a displacement assembly (6) and a blanking assembly (15); the guide assembly (1) comprises a guide plate (101), a drop point seat (102), a venting groove (103), a waste material outlet (104), a blanking port (105), a first electromagnet (106) and a second electromagnet (107); a drop point seat (102) is arranged inside the guide plate (101), a waste material outlet (104) is opened inside the guide plate (101), a blanking port (105) is opened inside the guide plate (101), and a first electromagnet (106) and a second electromagnet (107) are buried inside the guide plate (101). The guide plate (101) is provided with an electromagnet (106) and a second electromagnet (107); a fixing frame (2) is arranged at the outer end of the guide plate (101), and a barrel (3) is arranged at the outer end of the fixing frame (2); a motor (4) is arranged at the outer end of the guide plate (101), and a driving gear (5) is arranged at the output end of the motor (4); a displacement assembly (6) is arranged inside the guide plate (101); a suction and blowing machine (7) is arranged at the top end of the fixing frame (2), and a blowing port (8) is arranged at the outer side of the bottom of the suction and blowing machine (7); and a visual camera (9) is arranged at the outer end of the fixing frame (2).

2. A material unloading mechanism for semiconductor device processing according to claim 1, characterized in that: The displacement assembly (6) comprises a displacement disk (601), an engaging tooth groove (602), a ball bearing (603), a receiving disk (604), a snap-fit ​​seat (605), a tension spring (606), an armature (607) and a magnetic force transmission plate (608); the outer end of the displacement disk (601) is provided with an engaging tooth groove (602), and the bottom end of the displacement disk (601) is provided with a ball bearing (603); the internal sides of the displacement disk (601) are provided with receiving disks (604), and the internal parts of the receiving disks (604) are provided with a snap-fit ​​seat (605); a tension spring (606) is provided between the receiving disks (604), and the outer end of the receiving disk (604) is provided with an armature (607); and the internal parts of the displacement disk (601) are provided with a magnetic force transmission plate (608).

3. A material unloading mechanism for semiconductor device processing according to claim 2, characterized in that: The guide plate (101) is sleeve-connected with the displacement plate (601), and the ball (603) is in contact with the lower surface of the displacement plate (601).

4. A material unloading mechanism for semiconductor device processing according to claim 2, characterized in that: The driving gear (5) is meshed with the meshing tooth groove (602), and the displacement plate (601) rotates inside the guide plate (101) through the meshing of the driving gear (5) and the meshing tooth groove (602).

5. A material unloading mechanism for semiconductor device processing according to claim 2, characterized in that: The magnetic force transmission plate (608) transmits the magnetic force of the first electromagnet (106) and the second electromagnet (107), and the magnetic force transmission plate (608) is electromagnetically adsorbed and connected to the armature (607).

6. A material unloading mechanism for semiconductor device processing according to claim 2, characterized in that: The receiving trays (604) are elastically connected to each other via a tension spring (606), and the receiving trays (604) are fixedly connected to the armature (607).

7. A material unloading mechanism for semiconductor device processing according to claim 1, characterized in that: A suction pipe (10) is arranged at the top of the suction-blowing machine (7), and a docking seat (11) is arranged at the end of the suction pipe (10), an electric push rod (12) is arranged at the bottom end of the docking seat (11), and a sealed cover (13) is arranged at the bottom end of the electric push rod (12), an air suction hose (14) is arranged between the docking seat (11) and the sealed cover (13), and a blanking assembly (15) is arranged on the outer side of the bottom of the guide plate (101).

8. A material unloading mechanism for semiconductor device processing according to claim 7, characterized in that: The blanking assembly (15) comprises a blanking seat A (1501), a blanking seat B (1502), a pressure spring (1503), a sealed soft film (1504), a suction groove (1505) and an electrically controlled stopper (1506); the blanking seat B (1502) is arranged on the outer side of the bottom of the blanking seat A (1501), and a pressure spring (1503) is arranged between the blanking seat A (1501) and the blanking seat B (1502); a sealed soft film (1504) is arranged between the blanking seat A (1501) and the blanking seat B (1502); a suction groove (1505) is opened on the outer side of the bottom of the blanking seat B (1502), and an electrically controlled stopper (1506) is arranged on the inner side of the bottom of the blanking seat B (1502).

9. A material unloading mechanism for semiconductor device processing according to claim 8, characterized in that: The suction pipe (10) is connected to the sealed cover (13) through the docking seat (11) and the suction hose (14), and the sealed cover (13) is connected to the inside of the blanking seat A (1501) and the blanking seat B (1502) through the discharge port (105).

10. A material unloading mechanism for semiconductor device processing according to claim 8, characterized in that: The blanking material A seat (1501) is sleeve-connected with the blanking material B seat (1502), and the blanking material B seat (1502) is elastically connected with the blanking material A seat (1501) via a pressure spring (1503).

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