Wave crest detection device and method for wave crest welding equipment

Abstract

The invention discloses a wave crest detection device and method for wave crest welding equipment. The wave crest welding equipment comprises a nozzle used for spraying solder waves with wave crests; the wave crest detection device comprises a data processing and control part, and a window photoelectric emission part and a window photoelectric receiving part which are erected on the wave-soldering equipment; the window photoelectric emission part and the window photoelectric receiving part are erected on the first side and the third side of the nozzle respectively; the data processing and control unit comprises an emission control assembly used for controlling the window photoelectric emission part to emit parallel incident light in an array form towards the solder wave direction, and a receiving control assembly used for controlling the window photoelectric receiving part to receive a detection light signal. And the data processing component is used for calculating, analyzing and acquiring wave crest data of the solder wave based on the detection optical signal.

Description

Technical Field

[0001] The present invention relates to the technical field of wave soldering, and in particular to a wave soldering equipment wave crest detection device and method. Background Art

[0002] In the wave soldering process, the characteristics of the wave crest play a decisive role in the soldering quality. Traditional wave crest detection methods have many limitations and it is difficult to accurately monitor key parameters such as wave crest height and wave crest stability.

[0003] For example, the mechanical contact detection method may interfere with the normal shape of the wave crest and has a slow response speed. For another example, the ordinary photoelectric detection method requires manual alignment of the line laser and the center of the nozzle before use, which results in large manual errors. In addition, the solder wave ejected from the nozzle may have a wave crest deviation problem (left deviation flow, right deviation flow, etc.). When the center line of the nozzle is inconsistent with the line laser, the induced jet flow will be inaccurate or fail, and the wave crest height information cannot be accurately obtained, which will lead to welding defects. Moreover, the nozzle will be cleaned during the welding process, resulting in thick smoke. The thick smoke will interfere with the detection light or signal, causing deviations in the detection results, leading to misjudgment of the wave crest height, which is not conducive to the stable operation of the wave soldering process. The detection device needs to be moved during the detection process.

[0004] Therefore, it is necessary to propose a wave crest detection device for wave soldering equipment to reduce manual errors, reduce the impact of the detection device on the crest, and improve detection efficiency and accuracy. Summary of the invention

[0005] The purpose of the present invention is to provide a wave soldering equipment wave crest detection device and method to solve the above-mentioned problems in the prior art.

[0006] In order to achieve the above-mentioned object, the present invention provides a wave crest detection device for wave soldering equipment.

[0007] The wave soldering equipment further comprises a moving part and a nozzle, wherein the moving part is used to drive the wave soldering equipment to move along the soldering direction, and the nozzle is used to spray a solder wave with a crest; the nozzle has a liquid outlet surface, and the soldering direction is parallel to the liquid outlet surface;

[0008] The wave crest detection device includes a data processing and control component, and a window photoelectric emitting component and a window photoelectric receiving component mounted on the wave soldering equipment; the window photoelectric emitting component is mounted on the first side of the nozzle, and the window photoelectric receiving component is mounted on the third side of the nozzle, the first side and the third side are relatively distributed, the first side points to the third side as the detection direction, and the detection direction is parallel to the liquid outlet surface and perpendicular to the welding direction;

[0009] Among them, the data processing and control unit includes an emission control component, a receiving control component and a data processing component; the emission control component is used to control the window photoelectric emission component to emit parallel incident light in the form of an array in the direction of the solder wave; the receiving control component is used to control the window photoelectric receiving component to receive the detection light signal; the data processing component is used to convert the detection light signal into a detection electrical signal, and calculate and analyze the detection electrical signal to obtain the peak data of the solder wave.

[0010] In some embodiments, the nozzle of the wave soldering device includes a first liquid outlet and a second liquid outlet, the liquid outlet surface is arranged at the upper end of the first liquid outlet, the lower end of the first liquid outlet is connected to the upper end of the second liquid outlet, and the lower end of the second liquid outlet is connected to the wave soldering device;

[0011] Wherein, along the vertical direction perpendicular to the liquid outlet surface, the inner diameter of the second liquid outlet portion gradually increases from top to bottom, and the inner diameter of the first liquid outlet portion remains unchanged from top to bottom.

[0012] In some embodiments, the window photoelectric emission component includes a first housing, a first window and a photoelectric emission unit, the first housing and the first window form a first closed cavity for accommodating the photoelectric emission unit; the first window is disposed on the first side of the nozzle;

[0013] The photoelectric emission unit includes an M*N (M>2, N>2) array formed by multiple groups of light-emitting components, and each group of the light-emitting components includes a photodiode and a focusing lens arranged on a side of the light-emitting diode close to the nozzle.

[0014] In some embodiments, the window photoelectric receiving unit includes a second housing, a second window and a photoelectric receiving unit, wherein the second housing and the second window form a second closed cavity for accommodating the photoelectric receiving unit; the second window is provided with the third side of the nozzle;

[0015] The photoelectric receiving unit includes an M*N (M>2, N>2) array formed by multiple groups of receiving components, and each group of the receiving components includes a photodiode and a focusing lens arranged on a side of the photodiode close to the nozzle.

[0016] In some embodiments, the parameter selection unit is used to select welding parameters; wherein the welding parameters include a preset wave peak height.

[0017] In some embodiments, the photoelectric emission unit forms a first angle with the liquid outlet surface, so that the parallel incident light obliquely irradiates the solder wave.

[0018] In some embodiments, the photoelectric receiving unit forms a second angle with the liquid outlet surface, and the absolute value difference between the first angle and the second angle is less than 10°.

[0019] In some embodiments, the first angle is greater than 25° and less than 55°; or, the second angle is greater than 25° and less than 55°.

[0020] In some embodiments, the window photoelectric emitting component further includes a first height adjustment device for adjusting the first angle; the window photoelectric receiving component further includes a second height adjustment device for adjusting the second angle;

[0021] The data processing and control unit further includes an angle control component, which is used to adjust the first angle based on the preset wave peak height and adjust the second angle based on the first angle.

[0022] In some embodiments, a baffle assembly is arranged at the liquid outlet position of the nozzle, and the baffle assembly includes a first baffle arranged on the first side of the nozzle, a second baffle arranged on the second side of the nozzle, a third baffle arranged on the third side of the nozzle, and a fourth baffle arranged on the fourth side of the nozzle; the second side is distributed opposite to the fourth side, and the second side pointing to the fourth side is the welding direction,

[0023] Wherein, the data processing and control unit further includes a baffle control component, and the baffle control component is used to control the baffle component to adjust the crest deflection of the solder wave.

[0024] The present invention also provides a wave crest detection method for wave soldering equipment, which uses the wave crest detection device for selective soldering equipment as described above to perform wave crest detection.

[0025] The present invention utilizes the array-formed parallel incident light emitted by the window photoelectric emitting component to illuminate the surface of the solder wave, so that the detection light signals received by each area of ​​the window photoelectric receiving component are different. With the help of accurate mathematical model calculation, it can not only detect the peak height, but also effectively detect at least part of the wave height in the key detection area of ​​the peak, and calculate the corresponding peak steepness and peak deviation in turn. Compared with the traditional peak detection device, the present invention does not need to continuously adjust the position of the peak detection device during the detection process, and can accurately identify the slight difference in peak height, overcome the problem of insufficient traditional detection accuracy, and can accurately detect the peak steepness and peak deviation at the same time. In addition, because the detection direction is perpendicular to the welding direction, the present invention can at least detect the peak data of the solder wave when it is not welded in real time. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of this specification, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 It is a schematic diagram of a wave crest detection device for wave soldering equipment according to some embodiments of this specification;

[0028] Figure 2 is a schematic diagram of a nozzle of a wave crest detection device of a wave soldering equipment according to some embodiments of this specification;

[0029] Figure 3 It is a detection schematic diagram of a wave crest detection device for wave soldering equipment according to some embodiments of this specification;

[0030] Figure 4 It is another detection schematic diagram of a wave crest detection device for wave soldering equipment according to some embodiments of this specification;

[0031] Figure 5 This is a detection schematic diagram of another type of wave crest detection device for wave soldering equipment when the wave crest height changes according to some embodiments of this specification. DETAILED DESCRIPTION

[0032] The following description provides specific application scenarios and requirements of this specification, with the purpose of enabling those skilled in the art to make and use the contents of this specification. Various local modifications to the disclosed embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of this specification. Therefore, this specification is not limited to the embodiments shown, but to the widest scope consistent with the claims.

[0033] The terms used herein are only used for the purpose of describing specific example embodiments and are not restrictive. For example, unless the context clearly indicates otherwise, as used herein, the singular forms "a", "an" and "the" may also include plural forms. When used in this specification, the terms "include", "comprise" and / or "contain" mean that the associated integers, steps, operations, elements and / or components exist, but do not exclude the existence of one or more other features, integers, steps, operations, elements, components and / or groups or that other features, integers, steps, operations, elements, components and / or groups may be added in the system / method.

[0034] These and other features of the present specification, as well as the operation and function of the related elements of the structure, and the economy of combination and manufacture of the parts can be significantly improved in view of the following description. Reference is made to the accompanying drawings, all of which form a part of this specification. However, it should be clearly understood that the drawings are for illustration and description purposes only and are not intended to limit the scope of this specification.

[0035] The flowcharts used in this specification illustrate the operations implemented by the system according to some embodiments in this specification. It should be clearly understood that the operations of the flowcharts may not be implemented in sequence. On the contrary, the operations may be implemented in reverse order or simultaneously. In addition, one or more other operations may be added to the flowchart. One or more operations may be removed from the flowchart.

[0036] Figure 1 It is a schematic diagram of a wave crest detection device for wave soldering equipment according to some embodiments of this specification.

[0037] In some embodiments, Figure 1 As shown, the wave soldering equipment 100 may also include a moving part and a nozzle 101, wherein the moving part is used to drive the wave soldering equipment 100 to move along the soldering direction, and the nozzle 101 is used to spray a solder wave 1012 with a crest. The nozzle 101 has a liquid outlet surface 1011. The wave crest detection device 200 of the wave soldering equipment 100 may include a data processing and control part, and a window photoelectric emitting part 203 and a window photoelectric receiving part 204 mounted on the wave soldering equipment 100. The window photoelectric emitting part 203 is mounted on the first side of the nozzle 101, and the window photoelectric receiving part 204 is mounted on the third side of the nozzle 101.

[0038] Specifically, the data processing and control unit includes an emission control component, a receiving control component and a data processing component. The emission control component is used to control the window photoelectric emission component 203 to emit the parallel incident light 300 in the form of an array in the direction of the solder wave 1012; the receiving control component is used to control the window photoelectric receiving component 204 to receive the detection light signal 400; the data processing component is used to convert the detection light signal 400 into a detection electrical signal, and calculate and analyze the detection electrical signal to obtain the peak data of the solder wave 1012, and the peak data includes one or more of the peak height, peak steepness and peak deviation.

[0039] The present application also provides a detection method for performing wave peak detection based on the liquid level height detection device of the selective welding equipment.

[0040] In some embodiments, the specific working principle of the wave crest detection device of the wave soldering equipment is as follows:

[0041] Step S1, when the wave soldering equipment 100 is running and the nozzle 101 sprays a solder wave 1012 with a wave crest, the window photoelectric emission component 203 arranged on the first side of the nozzle 101 emits an array of parallel incident light 300 in the direction of the solder wave 1012 under the instruction of the emission control component;

[0042] Step S2, at least part of the parallel incident light 300 is reflected along a predetermined optical path by the surface of the solder wave 1012, and each area of ​​the window photoelectric receiving component 204 arranged on the third side of the nozzle 101 receives the detection light signal 400 under the action of the receiving control component, and converts the detection light signal 400 into a detection electrical signal; the detection light signal 400 includes a reflected light signal reflected by the surface of the solder wave 1012 and an incident light signal not reflected by the surface of the solder wave 1012;

[0043] Step S3, the data processing component substitutes the detection electrical signals received by each area of ​​the window photoelectric receiving component 204 into the detection electrical signal-height relationship mathematical model in the memory to calculate the solder wave 1012 peak data.

[0044] It should be noted that, in the embodiment of the present specification, the welding direction is parallel to the liquid outlet surface 1011, the detection direction is parallel to the liquid outlet surface 1011 and perpendicular to the welding direction, and the vertical direction is perpendicular to the liquid outlet surface 1011; the first side of the liquid outlet surface 1011 is relatively distributed with the third side, the second side of the liquid outlet surface 1011 is relatively distributed with the fourth side, the detection direction is directed from the first side to the third side, the welding direction is directed from the second side to the fourth side, and the vertical direction is the direction in which the liquid outlet surface 1011 is away from the nozzle 1012. In addition, in the embodiment of the present specification, the peak height refers to the height of the peak in the vertical direction; the peak steepness refers to the degree of inclination of the solder wave 1012 in the peak key detection area (also refers to the peak adjacent area); the peak deflection refers to the situation in which the peak in the peak key detection area is biased toward one or more of the first side, the second side, the third side or the fourth side compared to the opposite side, for example, the peak deflection is the first side, that is, the peak is biased toward the first side relative to the third side.

[0045] It should be noted that, since the crest of a complete solder wave 1012 is in the shape of a hemisphere, unlike ordinary photoelectric detection means, when the array-shaped parallel incident light 300 emitted by the window photoelectric emitting component 203 irradiates the surface of the solder wave 1012, on the one hand, due to the different reflection paths of the solder wave 1012 surface in different areas, the intensity of the reflected light 400 received by the window photoelectric receiving component 204 is different; on the other hand, due to the different crest heights of the solder wave 1012, the intensity of the incident light 300 passing through is also different. As a result, the detection light signal 400 received by each area of ​​the window photoelectric receiving component 204 is different. With the calculation of the precise mathematical model, not only the crest height can be detected, but also at least part of the wave height of the key detection area of ​​the crest can be effectively detected, and the corresponding crest steepness and crest deviation can be calculated in turn. Compared with the traditional crest detection device, the present invention does not need to continuously adjust the position of the crest detection device during the detection process, and can accurately identify the slight difference in crest height, overcome the problem of insufficient traditional detection accuracy, and can accurately detect the crest steepness and crest deviation at the same time. In addition, since the detection direction is perpendicular to the welding direction, the present invention can at least detect the wave crest data of the solder wave 1012 when it is not welded in real time.

[0046] In some embodiments, the mathematical model of the detected light signal-height relationship is established according to a pre-established correspondence between the height based on a large number of experiments and theoretical derivations and the detected light signal 400 received by each area of ​​the window photoelectric receiving component 204. By substituting the detected light signal 400 of each area of ​​the window photoelectric receiving component 204 into the model, the height value of the corresponding position of each area of ​​the window photoelectric receiving component 204 is calculated to obtain the peak data.

[0047] In some embodiments, the specific working principle of the wave crest detection device 200 of the wave soldering equipment 100 also includes:

[0048] Step S0, before the wave soldering equipment 100 is started, initialization calibration is performed. Specifically, various parameters in the data processing and control unit are set, and the emission control component determines the initial emission parameters of the window photoelectric emission component 203 emitting the parallel incident light 300, such as setting a suitable intensity and wavelength of the incident light 300, the intensity should ensure that the reflected light 400 has sufficient recognition, and the wavelength can reduce the interference of ambient light; the receiving control component adjusts the sensitivity and other parameters of the window photoelectric emission component 204 so that it can accurately receive and detect the optical signal 400.

[0049] Figure 2 It is a schematic diagram of a nozzle of a wave crest detection device of a wave soldering equipment according to some embodiments of the present specification.

[0050] In some embodiments, Figure 2As shown, along the vertical direction, the nozzle 101 includes a first liquid outlet portion 1013 and a second liquid outlet portion 1014, a liquid outlet surface 1011 is arranged at the upper end of the first liquid outlet portion 1013, a lower end of the first liquid outlet portion 1013 is connected to an upper end of the second liquid outlet portion 1014, and a lower end of the second liquid outlet portion 1014 is connected to the wave soldering equipment 100. Such a double-layer structure design is helpful to finely control the flow state of the solder liquid inside the nozzle 101, so as to form a stable and satisfactory solder wave 1012 at the liquid outlet surface 1011.

[0051] Furthermore, along the vertical direction, the inner diameter of the second liquid outlet 1014 gradually increases from top to bottom to form a solder liquid acceleration section. With such a configuration, when the solder liquid passes through the solder liquid acceleration section from bottom to top, the flow rate of the solder liquid can be significantly increased, ensuring that a solder wave 1012 with sufficient kinetic energy and crest height can be formed at the liquid outlet surface 1011 to meet the requirements of crest height and impact force of different welding processes. For example, in some welding scenarios with high requirements for solder penetration and filling performance, appropriate crest height and impact force can ensure that the solder fully fills the solder joints, improve welding quality, and reduce the probability of defects such as cold solder joints.

[0052] Furthermore, along the vertical direction, the inner diameter of the first liquid outlet portion 1013 remains unchanged from top to bottom to form a solder liquid stabilization section. Due to the presence of air in the nozzle 101, when the continuously accelerated solder liquid is rapidly ejected from the nozzle 101, it is easy to entrain the air and eject it together, thereby forming a solder wave 1012 with air bubbles at the liquid outlet surface 1011, thereby affecting the welding quality, such as causing pores and looseness in the solder joints. The existence of the solder liquid stabilization section allows the accelerated solder liquid to stabilize, and the air bubbles are squeezed out of the solder liquid by the combined action of the solder liquid's own gravity and the thrust of the solder liquid ejection, thereby ensuring that the solder wave 1012 ejected from the nozzle 101 is free of bubbles, making the solder wave 1012 formed at the liquid outlet surface 1011 more uniform and stable, thereby improving the consistency and reliability of the solder joint quality.

[0053] Preferably, in some embodiments, the ratio of the inner diameter of the lower end of the second liquid outlet portion 1014 to the inner diameter of the upper end of the second liquid outlet portion 1014 is in the range of 2-2.5. With such a configuration, the flow rate variation law of the solder liquid in the acceleration section can be accurately adjusted, the speed increase of the solder liquid in the solder liquid acceleration section can be effectively controlled, and the solder liquid can be ensured to have just the right speed and kinetic energy when it sprays out of the liquid surface 1011, thereby stably forming a solder wave 1012 with a specified wave crest height.

[0054] Preferably, in some embodiments, the ratio of the height of the second liquid outlet 1014 in the vertical direction to the height of the first liquid outlet 1013 in the vertical direction is in the range of 1.1-1.6. This arrangement can control the relative height of the stable section of the solder liquid, while meeting the requirements of acceleration and stability, ensuring that the solder liquid has just the right speed and kinetic energy when it sprays out of the liquid surface 1011, and has no bubble structure, thereby stably forming a solder wave 1012 with a specified wave crest height.

[0055] It should be noted that the present invention aims to generate a hemispherical solder wave 1012 at the liquid outlet surface 1011 of the nozzle 101. Only such a shape can meet the requirements of most welding processes.

[0056] In some implementations, the window photoelectric emission component 203 includes a first housing, a first window and a photoelectric emission unit. Specifically, the first housing and the first window form a first closed cavity for accommodating the photoelectric emission unit. The first window is disposed on the first side of the nozzle 101. Preferably, in some embodiments, the photoelectric emission unit includes an M*N (M>2, N>2) array formed by a plurality of groups of light-emitting components, each group of light-emitting components including a photodiode and a focusing lens disposed on the side of the light-emitting diode close to the nozzle 101. In this way, the array distribution of the plurality of light-emitting components can provide more comprehensive and uniform light coverage, and the focusing lens focuses the light emitted by the photodiode into a beam with high parallelism and concentrated energy, thereby enhancing the effect of light irradiating the surface of the solder wave 1012, and making the detection light signal 400 more regular and detectable.

[0057] In some embodiments, the window photoelectric receiving unit includes a second housing, a second window and a photoelectric receiving unit. Specifically, the second housing and the second window form a second closed cavity for accommodating the photoelectric receiving unit. The second window is provided on the third side of the nozzle 101. Preferably, in some embodiments, the photoelectric receiving unit includes an M*N (M>2, N>2) array formed by a plurality of groups of receiving components, each group of receiving components including a photodiode and a focusing lens provided on the side of the photodiode close to the nozzle 101. With such a configuration, the array structure of the receiving unit can widely collect the detection light signals 400 from different areas on the surface of the solder wave 1012, and the focusing lens accurately focuses the detection light signals 400 on the photodiode, thereby improving the reception efficiency and accuracy of the detection light signals 400.

[0058] It should be noted that the multiple light emitting component arrays of the photoelectric emitting unit and the multiple receiving component arrays of the photoelectric receiving unit can simultaneously perform multi-area detection on the surface of the solder wave 1012. This makes the light intensity data of each area of ​​the photoelectric receiving unit more accurate and the difference more obvious, ensuring the high efficiency of the data detection of the key detection area of ​​the wave crest on the surface of the solder wave 1012. The closed cavity and focusing lens design make it highly adaptable to the operating environment of the wave soldering equipment 100, and it can still perform stable detection even in the presence of ambient light interference, solder liquid temperature fluctuations or slight equipment vibrations.

[0059] In some embodiments, the peak detection device 200 also includes a parameter selection unit for selecting welding parameters. Specifically, the welding parameters include a preset peak height. The preset peak height is set based on factors such as the process requirements of the product to be welded, the characteristics of the welding material, and the specific production standards. For example, for the welding of some precision electronic components, a relatively low and precisely controlled peak height may be required to avoid problems such as short circuits caused by excessive solder; while for some larger welding objects with slightly higher requirements for solder adhesion, a slightly higher peak height will be set.

[0060] Figure 3 It is a detection schematic diagram of a wave crest detection device for wave soldering equipment shown in some embodiments of this specification.

[0061] In some embodiments, Figure 3 As shown, the window photoelectric emitting component 203 emits parallel incident light 300 parallel to the liquid outlet surface 1011. The parallel incident light 300 irradiated in parallel can cover the surface of the solder wave 1012 on one side close to the window photoelectric emitting component 203. Specifically, when the wave peak height is H1, a part of the parallel incident light 300 is reflected on the surface of the solder wave 1012 on this side to form a reflected light signal, and another part of the parallel incident light 300 passes through the top of the solder wave 1012 to form an incident light signal. The reflected light signal and the incident light signal together constitute the detection light signal 400 received by the window photoelectric receiving component 204.

[0062] It should be noted that when using Figure 3 In the embodiment shown, in order to allow the parallel incident light 300 to at least cover the crest of the solder wave 1012, the distribution height of the photoelectric emission unit along the vertical direction needs to cover the height of the key detection area of ​​the crest of the solder wave 1012. In particular, the crest detection device 200 of the present invention needs to adapt to solder waves 1012 with different preset crest heights, that is, the distribution height of the photoelectric emission unit needs to cover all preset crest heights of the solder wave 1012, which further puts forward extremely stringent requirements on the installation accuracy and adjustability of the photoelectric emission unit.

[0063] Figure 4This is another detection schematic diagram of a wave crest detection device for wave soldering equipment shown in some embodiments of this specification.

[0064] In some embodiments, Figure 4 As shown, the photoelectric emitting unit and the liquid outlet surface 1011 form a first angle, so that the parallel incident light 300 obliquely irradiates the solder wave 1012. When the wave crest height is H1, the obliquely irradiated parallel incident light 300 can completely cover the wave crest key detection area, and the wave crest key detection area can all reflect the parallel incident light 300 and then be received by the photoelectric receiving unit, so that the wave crest parameter detection is more complete.

[0065] Compared to Figure 3 The horizontal illumination of the embodiment shown, on the one hand, the oblique illumination can better cover various parts of the key detection area of ​​the crest, including the first side, the second side, the third side and the fourth side of the key detection area of ​​the crest, and no matter how these parts of the crest change dynamically, the reflected light signals of the above parts can be more stably acquired by the photoelectric receiving unit, which is helpful to comprehensively and continuously detect the actual state of the crest in the entire flow process. On the other hand, the oblique illumination reduces the proportion of the incident light signal in the detection light signal 400, making the signal distribution of the detection light signal 400 more uniform, and improving the accuracy of the detection.

[0066] It should be noted that for the shape of the solder wave 1012, the oblique illumination avoids the reflected light signal from being scattered too much in other directions due to the reflection angle problem, but can be reflected more concentratedly in the direction of the photoelectric receiving unit, thereby increasing the probability of the reflected light signal entering the second window of the photoelectric receiving unit and being captured by the photodiode of the photoelectric receiving unit, thereby ensuring that there is a sufficiently strong and clear reflected light signal for subsequent analysis, thereby improving the accuracy and reliability of detection.

[0067] Further, in some embodiments, the photoelectric receiving unit is at a second angle to the liquid outlet surface 1011, and the absolute value difference between the first angle and the second angle is less than 10°, so that the reflected light 400 is reflected to the photoelectric receiving unit. According to the reflection symmetry characteristic of light, the second angle is set to be as symmetrical as possible with the first angle to ensure that the light reflected from the wave crest key detection area of ​​the solder wave 1012 can be received to the greatest extent.

[0068] Furthermore, in some embodiments, the first angle is greater than 25° and less than 55°. This arrangement ensures, on the one hand, that the incident light 300 has a sufficient inclination to cover the surface of the critical detection area of ​​the wave crest, and on the other hand, avoids excessive inclination, which causes the incident light 300 to be blocked by the component to be welded, or the reflected light signal cannot be received by the photoelectric receiving unit.

[0069] It needs to be further explained that if Figure 5 As shown ( Figure 5 is another detection schematic diagram of a wave crest detection device for wave soldering equipment according to some embodiments of this specification when the wave crest height changes. Figure 4 The H1 becomes Figure 5 When H2), the angle of the parallel incident light remains unchanged, and the reflection path of the reflected light signal formed by it irradiating the surface of the solder wave 1012 will change, and then the detection light signal received by different areas of the window photoelectric receiving component 204 will also change.

[0070] In some embodiments, the window photoelectric emitting component 203 also includes a first height adjustment device for adjusting the first angle. The window photoelectric receiving component 204 also includes a second height adjustment device for adjusting the second angle. The data processing and control unit also includes an angle control component, which is used to adjust the first angle based on the preset peak height and the second angle based on the first angle. In this way, the photoelectric emitting unit and the photoelectric receiving unit can dynamically adjust the angle based on the preset peak height, so that the incident light 300 can cover the solder waves 1012 with different preset peak heights and collect the reflected light 400, which can make the detection range of the peak detection device 200 wider. The precise adjustment of the first angle and the second angle allows the incident light 300 to be accurately focused on key detection areas such as the middle contour line of the peak of the solder wave 1012, and the reflected light 400 can also be more efficiently collected by the receiving unit.

[0071] It should be noted that by adjusting the angles of the photoelectric emitting unit and the photoelectric receiving unit, it is possible to better adapt to the peak detection of solder waves with different preset peak heights. There is no need to require the photoelectric emitting unit or the photoelectric receiving unit to be set to a distribution height that covers all preset peak heights as much as possible, or to be set to a height that can be adjusted in real time, which simplifies the complexity of the peak detection device 200 and optimizes the size of the peak detection device 200.

[0072] In some embodiments, the specific working principle of adjusting the angle of the wave crest detection device of the wave soldering equipment is as follows:

[0073] Step T1: before the wave soldering equipment 100 starts working, the operator determines the soldering parameters, including the preset wave crest height, through the parameter selection unit;

[0074] Step T2: the angle control component controls the first height adjustment device to adjust the first angle of the window photoelectric emitting component 203 according to the preset peak height; wherein, a pre-established corresponding relationship model is stored inside the angle control component, and the model is obtained through a large number of experiments and theoretical analysis, and describes the first angle value range required for achieving the best light irradiation effect on the peak key detection area (i.e., the peak adjacent area) of the solder wave 1012 with different preset heights; illustratively, if the preset peak height is low, a smaller first angle may be required to allow the incident light 300 to irradiate the peak more smoothly and focus on the target detection area; if the preset peak height is high, the first angle may be increased accordingly to ensure that the light can cover the key area at the higher position of the peak of the solder wave 1012;

[0075] Step T3: The angle control component controls the second height adjustment device based on the adjusted first angle to adjust the second angle of the window photoelectric receiving component 204; wherein, the angle control component stores a correlation model between the first angle and the second angle, which is obtained through a large number of experiments and theoretical analysis, and describes the corresponding second angle for different first angles in order to achieve the receiving effect of the photoelectric receiving unit.

[0076] In some embodiments, the first height adjustment device and the second height adjustment device may adopt a mechanical transmission mechanism, such as a screw-nut mechanism or a gear rack mechanism. In some embodiments, the first height adjustment device and the second height adjustment device may adopt an electric adjustment mechanism, such as an electric push rod mechanism.

[0077] It should be noted that the peak height is preset by the parameter selection unit, and the first angle and the second angle are adjusted in linkage based on the peak height, so that the entire peak detection device 200 can closely fit the actual needs of different welding products and processes. Whether it is delicate electronic component welding or other welding scenes that are relatively extensive but require solder quantity, the peak height of the solder wave 1012 can be guaranteed to be in the best state, improve welding quality, and reduce welding defects caused by inappropriate peak height, such as cold solder joints, too much or too little solder, etc.

[0078] In some embodiments, the peak detection device 200 further includes a baffle assembly disposed at the liquid outlet surface 1011 of the nozzle 101, and the baffle assembly includes a first baffle, a second baffle, a third baffle, and a fourth baffle disposed on four sides of the nozzle 101. The first baffle is disposed on the first side of the nozzle 101, the second baffle is disposed on the second side of the nozzle 101, the third baffle is disposed on the third side of the nozzle 101, and the fourth baffle is disposed on the fourth side of the nozzle 101.

[0079] Specifically, the data processing and control unit also includes a baffle control component, which is used to control the baffle component to adjust the crest deflection of the solder wave 1012 to ensure the accuracy of the detection of the crest height.

[0080] In some embodiments, the working principle of the baffle control assembly controlling the baffle assembly to adjust the crest deflection of the solder wave 1012 is as follows:

[0081] Step M1: When the data processing component detects that the crest of the solder wave 1012 is biased to the first side, the baffle control component controls the third baffle to move toward the direction of the solder wave 1012; wherein, during the movement of the third baffle, it will have a certain blocking and guiding effect on the flow of the solder wave 1012, thereby changing the flow state of the solder wave 1012;

[0082] Step M2: Repeat step M1 until the data processing component determines that the solder wave 1012 no longer has any deviation, that is, the wave crest returns to a normal, ideal flow state, at which time the second baffle stops moving.

[0083] It should be noted that, through the coordinated work of the baffle assembly and the baffle control assembly, the crest deviation of the solder wave 1012 can be corrected in a timely and accurate manner. Regardless of whether the crest deviation is caused by slight vibration of the equipment, uneven flow of the solder liquid, or other factors, the flow path of the crest can be changed by adjusting the position of the baffle to restore it to a normal state that meets the welding requirements, thereby ensuring the accuracy of the crest height detection during the welding process, and ensuring that the solder wave 1012 can evenly act on the surface of the workpiece to be welded, thereby improving the welding quality and reducing welding defects caused by crest deviation, such as insufficient local solder, cold solder joints, short circuits, and other problems. The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of this specification. Although not explicitly stated here, those skilled in the art may make various modifications, improvements and corrections to this specification. Such modifications, improvements and corrections are suggested in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this specification.

Claims

1. A wave soldering equipment wave crest detection device, characterized in that: The wave soldering equipment further comprises a moving part and a nozzle, wherein the moving part is used to drive the wave soldering equipment to move along the soldering direction, and the nozzle is used to spray a solder wave with a crest; the nozzle has a liquid outlet surface, and the soldering direction is parallel to the liquid outlet surface; The wave crest detection device includes a data processing and control component, and a window photoelectric emitting component and a window photoelectric receiving component mounted on the wave soldering equipment; the window photoelectric emitting component is mounted on the first side of the nozzle, and the window photoelectric receiving component is mounted on the third side of the nozzle, the first side and the third side are relatively distributed, the first side points to the third side as the detection direction, and the detection direction is parallel to the liquid outlet surface and perpendicular to the welding direction; Among them, the data processing and control unit includes an emission control component, a receiving control component and a data processing component; the emission control component is used to control the window photoelectric emission component to emit parallel incident light in the form of an array in the direction of the solder wave; the receiving control component is used to control the window photoelectric receiving component to receive the detection light signal; the data processing component is used to convert the detection light signal into a detection electrical signal, and calculate and analyze the detection electrical signal to obtain the peak data of the solder wave.

2. The peak detection device according to claim 1, characterized in that: The nozzle of the wave soldering device comprises a first liquid outlet and a second liquid outlet, the liquid outlet surface is arranged at the upper end of the first liquid outlet, the lower end of the first liquid outlet is connected to the upper end of the second liquid outlet, and the lower end of the second liquid outlet is connected to the wave soldering device; Wherein, along a vertical direction perpendicular to the liquid outlet surface, the inner diameter of the second liquid outlet portion gradually increases from top to bottom, and the inner diameter of the first liquid outlet portion remains unchanged from top to bottom.

3. The peak detection device according to claim 1, characterized in that: The window photoelectric emission component comprises a first housing, a first window and a photoelectric emission unit, wherein the first housing and the first window form a first closed cavity for accommodating the photoelectric emission unit; the first window is arranged on the first side of the nozzle; The photoelectric emission unit includes an M*N (M>2, N>2) array formed by multiple groups of light-emitting components, and each group of the light-emitting components includes a photodiode and a focusing lens arranged on a side of the light-emitting diode close to the nozzle.

4. The peak detection device according to claim 3, characterized in that: The window photoelectric receiving unit comprises a second housing, a second window and a photoelectric receiving unit, wherein the second housing and the second window form a second closed cavity for accommodating the photoelectric receiving unit; the second window is provided with the third side of the nozzle; The photoelectric receiving unit includes an M*N (M>2, N>2) array formed by multiple groups of receiving components, and each group of the receiving components includes a photodiode and a focusing lens arranged on a side of the photodiode close to the nozzle.

5. The peak detection device according to claim 4, characterized in that: Also includes, A parameter selection unit for selecting welding parameters; Wherein, the welding parameters include a preset wave peak height.

6. The peak detection device according to claim 5, characterized in that: The photoelectric emission unit forms a first angle with the liquid outlet surface, so that the parallel incident light obliquely irradiates the solder wave.

7. The peak detection device according to claim 6, characterized in that: The photoelectric receiving unit forms a second angle with the liquid outlet surface, and the absolute value difference between the first angle and the second angle is less than 10°; The first angle is greater than 25° and less than 55°; or, The second angle is greater than 25° and less than 55°.

8. The peak detection device according to claim 7, characterized in that: The window photoelectric transmitting component further includes a first height adjusting device for adjusting the first angle; the window photoelectric receiving component further includes a second height adjusting device for adjusting the second angle; The data processing and control unit further includes an angle control component, which is used to adjust the first angle based on the preset wave peak height and adjust the second angle based on the first angle.

9. The peak detection device according to claim 1, characterized in that: Also includes, a baffle assembly disposed at the liquid outlet surface position of the nozzle, the baffle assembly comprising a first baffle disposed on the first side of the nozzle, a second baffle disposed on the second side of the nozzle, a third baffle disposed on the third side of the nozzle, and a fourth baffle disposed on the fourth side of the nozzle; the second side is oppositely distributed to the fourth side, and the second side pointing to the fourth side is the welding direction; Wherein, the data processing and control unit further includes a baffle control component, and the baffle control component is used to control the baffle component to adjust the crest deflection of the solder wave.

10. A wave soldering equipment wave crest detection method, characterized in that: The wave soldering equipment wave crest detection device according to any one of claims 1 to 9 is used to perform wave crest detection.

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