Nozzle flow adjusting method, control system, storage medium and electronic equipment

Abstract

The invention discloses a nozzle flow adjusting method, a control system, a storage medium and electronic equipment, and the method comprises the following steps: connecting a nozzle with a polishing machine, and determining a time parameter and an initial flow parameter of injecting a polishing medium; performing injection polishing on the nozzle, and respectively adjusting the time parameter or the initial flow parameter to obtain a corresponding relation with an actual flow parameter; the corresponding relation between the flow of the micropore ceramic nozzle product and the polishing time and the initial flow is determined, and the polishing time is accurately set according to a rule curve, so that the purpose of accurately controlling the flow is achieved, the operation efficiency is improved, and the purpose of accurately controlling the flow of the micropore ceramic nozzle product through one-time fluid polishing treatment is achieved.

Description

Technical Field

[0001] The invention relates to the field of polishing equipment, and in particular to a nozzle flow regulation method, a control system, a storage medium and an electronic device. Background Art

[0002] Existing microporous ceramic nozzles are mainly used in semiconductor etching equipment to deliver polishing liquid or gas required for etching, and are used in combination with multiple pieces. Therefore, precise control of the flow rate of the microporous ceramic nozzles and ensuring the consistency of the flow rate between different nozzles help improve process stability. However, since friction is also generated between the polishing liquid and the nozzle, the nozzle will become fatigued and damaged after long-term use, causing the flow rate ejected from the micropores to change, affecting the polishing effect of the product to be processed. Summary of the invention

[0003] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a nozzle flow regulation method, control system, storage medium and electronic equipment.

[0004] In order to achieve the above object, the present invention adopts the following technical solution: a nozzle flow rate regulation method, comprising:

[0005] S1: Connect the nozzle to the polishing machine and determine the time parameters and initial flow parameters for injecting the polishing medium;

[0006] S2: performing injection polishing on the nozzle, adjusting the time parameter or the initial flow parameter respectively, and obtaining a corresponding relationship with the actual flow parameter.

[0007] As a further description of the above technical solution: in step S1, the following steps are also included:

[0008] S11: preparing a fluid polishing medium, and injecting the polishing medium into the polishing machine;

[0009] S12: Set the pressure range and air inlet pressure range of the polishing machine.

[0010] As a further description of the above technical solution: in step S2, adjusting the time parameter includes setting different time parameters for a plurality of nozzles and setting the same initial flow parameter, and testing the change of the actual flow parameter under different time parameters.

[0011] As a further description of the above technical solution: in step S2, adjusting the initial flow parameters includes: setting different initial flow parameters for a plurality of nozzles, and setting the same time parameters, and detecting changes in actual flow parameters under the same time parameters.

[0012] As a further description of the above technical solution: the polishing medium includes a mixture of particles of inorganic non-metallic material and deionized water.

[0013] As a further description of the above technical solution: the concentration range of the polishing medium is 0.5%-5%.

[0014] As a further description of the above technical solution: the pressure range is 50-100kg, the air intake pressure range is 5-10MPa, and the time parameter is 10-120s.

[0015] Also included is a control system, which is applicable to the adjustment method described in any one of the above technical solutions, including:

[0016] A storage module for storing polishing media;

[0017] A control module receives the determined time parameter and the initial flow parameter, and controls the polishing machine to output the polishing medium in the storage module;

[0018] The detection module detects the actual flow parameters of the nozzle.

[0019] It also includes a computer-readable storage medium storing a computer program for running the adjustment method, wherein the computer program enables a computer to execute the adjustment method as described in any one of the above technical solutions.

[0020] Also included is an electronic device, comprising:

[0021] one or more processors; memory; and

[0022] One or more programs, wherein the one or more programs are stored in the memory and are configured to be executed by the one or more processors, and the programs include a method for executing the adjustment method described in any one of the above technical solutions.

[0023] The above technical solution has the following advantages or beneficial effects:

[0024] The corresponding relationship between the flow rate, polishing time and initial flow rate of microporous ceramic nozzle products is determined, and the polishing time is accurately set according to the regular curve to achieve the purpose of accurately controlling the flow rate, improve work efficiency, and achieve the purpose of accurately controlling the flow rate of microporous ceramic nozzle products through a single fluid polishing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 The process of the adjustment method proposed by the present invention Figure 1 ;

[0026] Figure 2 The process of the adjustment method proposed by the present invention Figure 2 ;

[0027] Figure 3 It is the regular curve of the time parameter and the actual flow parameter in the present invention;

[0028] Figure 4 is the regular curve of the initial flow parameter and the actual flow parameter in the present invention;

[0029] Figure 5 This is a micrograph of the inner surface of the nozzle of the present invention before polishing;

[0030] Figure 6 This is a micrograph of the inner surface of the nozzle after polishing in the present invention;

[0031] Figure 7 This is a schematic diagram of the structure of the control system proposed by the present invention.

[0032] Legend:

[0033] 1. Storage module; 2. Control module; 3. Detection module. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Reference Figure 1 , an embodiment provided by the present invention: a nozzle flow rate regulation method, comprising: S1: connecting the nozzle to the polishing machine, determining the time parameters and initial flow rate parameters of injecting the polishing medium;

[0036] S2: Perform injection polishing on the nozzle, adjust the time parameter or the initial flow parameter respectively, and obtain the corresponding relationship with the actual flow parameter.

[0037] In this embodiment, the nozzle and the polishing machine are connected, and the time parameters and initial parameters for spraying the polishing medium are determined according to the type of nozzle being processed, so that the polishing medium is sprayed out from the nozzle. For multiple nozzles of the same type, the time parameters and initial flow parameters of multiple groups of nozzles are determined, and the actual flow parameters of the nozzles are detected to obtain the corresponding relationship between the time parameters and the actual flow parameters, and the corresponding relationship between the initial flow parameters and the actual flow parameters, and generate a regular curve. The polishing time can be accurately set according to the regular curve to achieve the purpose of accurately controlling the flow rate, improve the working efficiency, and achieve the purpose of accurately controlling the flow rate of microporous ceramic nozzle products through a single fluid polishing process.

[0038] Reference Figure 2 , in step S1, further comprising the steps of:

[0039] S11: preparing a fluid polishing medium and injecting the polishing medium into a polishing machine;

[0040] S12: Set the pressure range and air inlet pressure range of the polishing machine.

[0041] In this embodiment, the polishing medium includes a mixture of particles of inorganic non-metallic material and deionized water. Among them, the inorganic non-metallic material is boron carbide (B4C). When the concentration of the polishing medium is too high, it is easy to clog the micropores; if the time setting of fluid polishing is not appropriate, it may be necessary to repeatedly process multiple times, or the flow improvement effect in the later stage of polishing is significantly reduced, which wastes time. After research, it is found that when the concentration range of the polishing medium is 0.5%-5%, preferably 2.5%, the pressure range is 50-100kg, preferably 80kg, the air inlet pressure range is 5-10MPa, preferably 7MPa, and the time parameter is 10-120s, there is a better polishing effect.

[0042] The mixture of boron carbide and deionized water can be used as a polishing medium for the processing of hard materials, such as the grinding and polishing of sapphire, silicon carbide and other wafers. Boron carbide particles, carried by deionized water, can evenly act on the surface of the processed material, and achieve efficient processing of the material through its high hardness and good grinding performance. At the same time, deionized water can play a cooling and cleaning role, reducing heat accumulation and impurity residues during the processing process.

[0043] In step S2, adjusting the time parameters includes setting different time parameters for a plurality of nozzles and setting the same initial flow parameters, and testing the change of the actual flow parameters under different time parameters.

[0044] In this embodiment, when the concentration (2.5%), pressure (80kg), intake pressure (7MPa) and other parameters of the polishing medium are fixed, the flow rate change trend of the ceramic nozzle under different time parameters is tested. Figure 3 , is the regular curve of time parameters and actual flow parameters. The horizontal axis is the polishing time, the left vertical axis is the flow value of the nozzle, and the right vertical axis is the flow change value of the nozzle every 20 seconds. The number of nozzles is 2. As the polishing time increases, the flow change trend gradually slows down, and the flow change value every 20 seconds continues to decrease. It can be seen that the polishing effect is most obvious in the first 40 seconds. When the polishing time exceeds 40 seconds, the efficiency will be significantly reduced.

[0045] In step S2, adjusting the initial flow parameters includes: setting different initial flow parameters for a plurality of nozzles, setting the same time parameters, and detecting changes in the actual flow parameters under the same time parameters.

[0046] In this embodiment, when the concentration (2.5%), pressure (80kg), air inlet pressure (7MPa) and polishing time parameters of the polishing medium are kept fixed, the flow rate change trend of the microporous ceramic nozzle under different initial flow rate parameters is tested after being treated with the same polishing medium. Figure 4 , which is the regular curve of the initial flow parameters and the actual flow parameters. After 20s of polishing, the flow of ceramic nozzle products with different initial flow parameters generally increases by nearly 2%, and the flow of ceramic nozzles with different initial flow rates increases to a strong consistency.

[0047] Reference Figure 5 and Figure 6 The nozzle was tested for morphology. The internal surface morphology of the microporous ceramic nozzle was tested before and after fluid polishing. By comparison, it can be found that the particles on the product surface are significantly reduced after fluid polishing.

[0048] Reference Figure 7 The present invention also provides an embodiment of a control system, which is applicable to the adjustment method of any one of the above technical solutions, including:

[0049] Storage module 1, used for storing polishing media;

[0050] The control module 2 receives the determined time parameter and the initial flow parameter, and controls the polishing machine to output the polishing medium in the storage module 1;

[0051] The detection module 3 detects the actual flow parameters of the nozzle.

[0052] It is understandable that the control system provided in the embodiment of the present invention corresponds to the above-mentioned adjustment method, and the explanations, examples, beneficial effects and other parts of the relevant contents can refer to the corresponding contents in the adjustment method, which will not be repeated here.

[0053] In another embodiment, a computer-readable storage medium is further included, which stores a computer program for executing the triggering method, wherein the computer program causes a computer to execute the following steps:

[0054] S1: connecting at least one or more nozzles to the polishing machine, and determining the time parameters and initial flow parameters of injecting the polishing medium;

[0055] S2: Perform injection polishing on the nozzle, adjust the time parameter or the initial flow parameter respectively, and obtain the corresponding relationship with the actual flow parameter.

[0056] Among them, the computer-readable storage medium can be a computer storage medium or a communication medium. The communication medium includes any medium that facilitates the transmission of a computer program from one place to another. The computer storage medium can be any available medium that can be accessed by a general-purpose or special-purpose computer. For example, a computer-readable storage medium is coupled to a processor so that the processor can read information from the computer-readable storage medium and write information to the computer-readable storage medium. Of course, the computer-readable storage medium can also be a component of the processor. The processor and the computer-readable storage medium can be located in an application-specific integrated circuit (ASIC). In addition, the ASIC can be located in a user device. Of course, the processor and the computer-readable storage medium can also exist in a communication device as discrete components.

[0057] Specifically, the computer-readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk. The storage medium can be any available medium that can be accessed by a general or special-purpose computer.

[0058] In another embodiment, an electronic device is also included, including:

[0059] one or more processors; memory; and

[0060] One or more programs, wherein the one or more programs are stored in a memory and configured to be executed by one or more processors, the programs comprising steps for performing the following steps:

[0061] S1: connecting at least one or more nozzles to the polishing machine, and determining the time parameters and initial flow parameters of injecting the polishing medium;

[0062] S2: Perform injection polishing on the nozzle, adjust the time parameter or the initial flow parameter respectively, and obtain the corresponding relationship with the actual flow parameter.

[0063] Memory is used to store computer programs. The memory may include high-speed random access memory (RAM) and may also include non-volatile memory (NVM), such as at least one disk memory, and may also be a USB flash drive, a mobile hard disk, a read-only memory, a disk or an optical disk.

[0064] A processor is used to execute a computer program stored in a memory to implement the adjustment method in the above embodiment. The processor can be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), etc. A general-purpose processor can be a microprocessor or the processor can be any conventional processor, etc. The steps of the method disclosed in the invention can be directly embodied as being executed by a hardware processor, or can be executed by a combination of hardware and software modules in the processor.

[0065] Optionally, the memory can be independent or integrated with the processor.

[0066] When the memory is a device independent of the processor, the electronic device may further include a bus. The bus is used to connect the memory and the processor. The bus may be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus. The bus may be divided into an address bus, a data bus, a control bus, and the like.

[0067] It should be noted that, through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform. Based on such an understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0068] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A nozzle flow rate regulation method, characterized in that: include: S1: Connect the nozzle to the polishing machine and determine the time parameters and initial flow parameters for injecting the polishing medium; S2: performing injection polishing on the nozzle, adjusting the time parameter or the initial flow parameter respectively, and obtaining a corresponding relationship with the actual flow parameter.

2. The adjustment method according to claim 1, characterized in that: In step S1, the steps are also included: S11: preparing a fluid polishing medium, and injecting the polishing medium into the polishing machine; S12: Set the pressure range and air inlet pressure range of the polishing machine.

3. The adjustment method according to claim 1, characterized in that: In step S2, adjusting the time parameters includes setting different time parameters for a plurality of nozzles and setting the same initial flow parameters, and testing the change of the actual flow parameters under different time parameters.

4. The adjustment method according to claim 1, characterized in that: In step S2, adjusting the initial flow parameters includes: setting different initial flow parameters for a plurality of nozzles, setting the same time parameters, and detecting changes in actual flow parameters under the same time parameters.

5. The adjustment method according to claim 1, characterized in that: The polishing medium includes a mixture of inorganic non-metallic material particles and deionized water.

6. The adjustment method according to claim 1, characterized in that: The concentration of the polishing medium is in the range of 0.5%-5%.

7. The adjustment method according to claim 2, characterized in that: The pressure range is 50-100kg, the air inlet pressure range is 5-10MPa, and the time parameter is 10-120s.

8. A control system, characterized in that: The control system is applicable to the adjustment method described in any one of claims 1 to 7, including: A storage module for storing polishing media; A control module receives the determined time parameter and the initial flow parameter, and controls the polishing machine to output the polishing medium in the storage module; The detection module detects the actual flow parameters of the nozzle.

9. A computer-readable storage medium, characterized in that: It stores a computer program for running the adjustment method, wherein the computer program enables a computer to execute the adjustment method according to any one of claims 1 to 7.

10. An electronic device, characterized in that: include: one or more processors; Memory; as well as One or more programs, wherein the one or more programs are stored in the memory and are configured to be executed by the one or more processors, the programs comprising instructions for executing the adjustment method according to any one of claims 1 to 7.

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