Time sequence path conversion method and related equipment
By converting the physical unit and physical connection information of the timing path transmitted across chips to the same coordinate system, the problems of low timing path analysis efficiency and line breakage are solved, and continuous and complete analysis of timing paths are achieved, and analysis efficiency is improved.
Patent Information
- Application Number
- CN202411630174.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-03-11
AI Technical Summary
In the prior art, the analysis efficiency of timing paths is low, especially when cross-chip transmission, because the independent coordinate system of different chips causes line breaks in the timing path, which makes analysis difficult.
By obtaining the timing paths transmitted across chips, physical units and physical connection information are extracted, and based on the target through holes and target bonding structures, this information is divided into n data sets, and then the information in these data sets is converted to the same coordinate system, so that the coordinates of the target through holes and target bonding structures of adjacent data sets coincide.
The continuous and complete display of timing paths in the same coordinate system is realized, which simplifies the analysis process and improves the analysis efficiency of timing paths.
Smart Images
Figure CN119598925A_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the field of chip technology, and specifically to a timing path conversion method and related equipment. Background Art
[0002] Static Timing Analysis (STA) is an important method to ensure that the timing performance of digital circuit design meets expectations. It divides the complex design into a series of timing path sets and analyzes the signal transmission on each timing path to ensure that the timing performance of digital circuit design meets expectations.
[0003] However, the current analysis efficiency of timing paths needs to be improved. Summary of the invention
[0004] In view of this, an embodiment of the present application provides a timing path conversion method and related devices to improve the analysis efficiency of the timing path.
[0005] To achieve the above objectives, the embodiments of the present application provide the following technical solutions.
[0006] In a first aspect, an embodiment of the present application provides a method for converting a timing path, including:
[0007] Acquire a timing path for cross-chip transmission, wherein the timing path is based on a target through hole and a target bonding structure corresponding to the target through hole for vertical interconnection between different chips; wherein the target through hole is located in one chip, and the target bonding structure is located in another opposite chip;
[0008] Extracting physical unit and physical connection information on the timing path;
[0009] Based on the target through hole and the target bonding structure, the physical unit and physical connection information are divided into n data sets, wherein the physical unit and physical connection information in adjacent data sets are located in different coordinate systems;
[0010] The physical units and physical connection information in the n data sets are converted into the same coordinate system, wherein the coordinates of the corresponding target through holes and target bonding structures in adjacent data sets coincide with each other.
[0011] Optionally, the step of dividing the physical unit and physical connection information into n data sets based on the target through hole and the target bonding structure includes:
[0012] The target through hole or the target bonding structure is used as the start and end marks of a data set, and the physical unit and physical connection information is divided into n data sets.
[0013] Optionally, the timing path includes a timing start point and a timing end point.
[0014] Optionally, when the timing path passes through a target through hole and a target bonding structure corresponding to the target through hole, the step of dividing the physical unit and physical connection information into n data sets using the target through hole or the target bonding structure as the start and end marks of the data set is specifically:
[0015] Divide the physical unit and physical connection information of the timing path from the timing start point to the target through hole into a first data set;
[0016] The physical unit and physical connection information of the timing path from the target bonding structure corresponding to the target through hole to the timing end point is divided into a second data set.
[0017] Optionally, when the timing path passes through two target through holes and target bonding structures corresponding to the two target through holes, and the two target through holes are respectively a first target through hole and a second target through hole, and the target bonding structures corresponding to the two target through holes are respectively a first target bonding structure and a second target bonding structure, the step of dividing the physical unit and physical connection information into n data sets using the target through holes or the target bonding structures as start and end marks of the data sets is specifically:
[0018] Divide the physical unit and physical connection information of the timing path from the timing start point to the first target through hole into a first data set;
[0019] dividing the physical unit and physical wiring information of the timing path from the first target bonding structure to the second target through hole into a second data set;
[0020] The physical unit and physical connection information of the timing path from the second target bonding structure to the timing endpoint is divided into a third data set.
[0021] Optionally, when the timing path passes through three target through holes and target bonding structures corresponding to the three target through holes, and the three target through holes are respectively a first target through hole, a second target through hole and a third target through hole, and the target bonding structures corresponding to the three target through holes are respectively a first target bonding structure, a second target bonding structure and a third target bonding structure, the step of dividing the physical unit and physical connection information into n data sets using the target through holes or the target bonding structures as start and end marks of the data sets is specifically:
[0022] Divide the physical unit and physical connection information of the timing path from the timing start point to the first target through hole into a first data set;
[0023] dividing the physical unit and physical connection information of the timing path from the first target bonding structure to the second target bonding structure into a second data set;
[0024] Dividing the physical unit and physical connection information of the timing path from the second target through hole to the third target through hole into a third data set;
[0025] The physical unit and physical connection information of the timing path from the third target bonding structure to the timing endpoint is divided into a fourth data set.
[0026] Optionally, the step of converting the physical units and physical connection information in the n data sets into the same coordinate system includes:
[0027] Taking the coordinates of the target through hole and the target bonding structure corresponding to the target through hole as reference points, the physical unit and physical connection information of a data set among the n data sets are projected along the vertical direction to the coordinate system of the data set adjacent to the data set.
[0028] Optionally, the step of projecting the physical unit and physical connection line information of a data set among the n data sets along the vertical direction to a coordinate system where a data set adjacent to the data set is located includes:
[0029] In reverse order of the target through-holes or the target bonding structures, the physical units and physical connection line information in the n data sets are projected into the same coordinate system in the vertical direction.
[0030] Optionally, the timing path includes at least a clock path.
[0031] In a second aspect, an embodiment of the present application provides a timing path conversion device, including:
[0032] An acquisition module, used for acquiring a timing path for cross-chip transmission, wherein the timing path is based on a target through hole and a target bonding structure corresponding to the target through hole for vertical interconnection between different chips; wherein the target through hole is located in one chip, and the target bonding structure is located in another opposite chip;
[0033] An extraction module, used to extract physical unit and physical connection information on the timing path;
[0034] A partitioning module, configured to partition the physical unit and physical connection information into n data sets based on the target through hole and the target bonding structure, wherein the physical unit and physical connection information in adjacent data sets are located in different coordinate systems;
[0035] The conversion module is used to convert the physical unit and physical connection information in the n data sets into the same coordinate system, wherein the coordinates of the corresponding target through holes and target bonding structures in adjacent data sets overlap.
[0036] In a third aspect, an embodiment of the present application provides an electronic device comprising at least one memory and at least one processor, wherein the memory stores one or more computer executable instructions, and the processor calls the one or more computer executable instructions to execute the timing path conversion method as described in the first aspect above.
[0037] In a fourth aspect, an embodiment of the present application provides a storage medium, which stores one or more computer-executable instructions. When the one or more computer-executable instructions are executed, the method for converting the timing path described in the first aspect above is implemented.
[0038] In a fifth aspect, an embodiment of the present application provides a computer program product, comprising one or more computer executable instructions, which, when executed, implement the method for converting the timing path as described in the first aspect above.
[0039] An embodiment of the present application provides a method for converting a timing path and related equipment, wherein the method for converting a timing path includes: obtaining a timing path for cross-chip transmission, wherein the timing path performs vertical interconnection between different chips based on a target through hole and a target bonding structure corresponding to the target through hole; wherein the target through hole is located in one chip, and the target bonding structure is located in another relatively opposite chip; extracting physical units and physical connection information on the timing path; based on the target through hole and the target bonding structure, dividing the physical units and physical connection information into n data sets, wherein the physical units and physical connection information in adjacent data sets are located in different coordinate systems; converting the physical units and physical connection information in the n data sets into the same coordinate system, wherein the coordinates of the corresponding target through holes and target bonding structures in adjacent data sets coincide.
[0040] It can be seen that the timing path conversion method provided in the embodiment of the present application converts the physical units and physical connection information in n data sets into the same coordinate system, wherein the physical units and physical connection information in adjacent data sets are located in different coordinate systems, so that the physical units and physical connection information on the timing path are located in the same coordinate system, thereby avoiding the problem of line breakage (i.e., incomplete timing path view) caused by the timing path being presented based on different coordinate systems, so that the timing path appears as a continuous and complete image in the same coordinate system, thereby simplifying the process of analyzing the timing path, facilitating analysts to analyze the transmission of signals on the timing path, and improving the analysis efficiency of the timing path. BRIEF DESCRIPTION OF THE DRAWINGS
[0041] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.
[0042] Figure 1 It is an optional flow chart of the method for converting the timing path provided in the embodiment of the present application;
[0043] Figure 2 It is a schematic diagram of an optional structure of a timing path for cross-chip transmission provided in an embodiment of the present application;
[0044] Figure 3 is another optional structural diagram of the timing path of cross-chip transmission provided in an embodiment of the present application;
[0045] Figure 4 It is another optional structural diagram of the timing path of cross-chip transmission provided in the embodiment of the present application;
[0046] Figure 5-Figure 6 The embodiment of the present application provides Figure 2 The schematic diagram of the optional conversion structure is shown as an example of the timing path of cross-chip transmission;
[0047] Figure 7-Figure 9 The embodiment of the present application provides Figure 3 The schematic diagram of the optional conversion structure is shown as an example of the timing path of cross-chip transmission;
[0048] Fig.10 It is a schematic diagram of an optional structure of a timing path conversion device provided in an embodiment of the present application;
[0049] Fig.11 It is an optional block diagram of the electronic device provided in the embodiment of the present application. DETAILED DESCRIPTION
[0050] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.
[0051] As described in the background technology, static timing analysis (STA) is an important method to ensure that the timing performance of digital circuit design meets expectations. It divides complex designs into a series of timing path sets and analyzes the transmission of signals on each timing path to ensure that the timing performance of digital circuit design meets expectations. However, the current analysis efficiency of timing paths needs to be improved.
[0052] After in-depth analysis, the inventor believes that the cross-chip transmission characteristics of the timing path are one of the key factors that lead to the need to improve its analysis efficiency. Specifically, in integrated circuit design, a complete timing path often needs to cross multiple chips. Since each chip has its own independent coordinate system, the timing path is presented based on different coordinate systems, which leads to the problem of line breakage in the timing path (i.e., the timing path view is incomplete), making the analysis of the timing path extremely difficult. For example, the timing path may have no problems in various parts on different chips, but the timing path may have a detour.
[0053] In addition, for timing paths that are transmitted across different chips, it is difficult to accurately judge whether the drive or load at the interface connecting different chips is reasonable based on the information on a single chip. It is often necessary to consider the load or drive of the timing path on another chip. This cross-chip timing path analysis requirement also poses a higher challenge to the analysis of the timing path.
[0054] Based on this, an embodiment of the present application provides a method for converting a timing path and related equipment, wherein the method for converting the timing path includes: obtaining a timing path for cross-chip transmission, wherein the timing path performs vertical interconnection between different chips based on a target through hole and a target bonding structure corresponding to the target through hole; wherein the target through hole is located on one chip, and the target bonding structure is located on another relatively opposite chip; extracting physical units and physical connection information on the timing path; based on the target through hole and the target bonding structure, dividing the physical units and physical connection information into n data sets, wherein the physical units and physical connection information in adjacent data sets are located in different coordinate systems; converting the physical units and physical connection information in the n data sets to the same coordinate system, wherein the coordinates of the corresponding target through holes and target bonding structures in adjacent data sets coincide.
[0055] It can be seen that the timing path conversion method provided in the embodiment of the present application converts the physical units and physical connection information in n data sets into the same coordinate system, wherein the physical units and physical connection information in adjacent data sets are located in different coordinate systems, so that the physical units and physical connection information on the timing path are located in the same coordinate system, thereby avoiding the problem of line breakage (i.e., incomplete timing path view) caused by the timing path being presented based on different coordinate systems, so that the timing path appears as a continuous and complete image in the same coordinate system, thereby simplifying the process of analyzing the timing path, facilitating analysts to analyze the transmission of signals on the timing path, and improving the analysis efficiency of the timing path.
[0056] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.
[0057] refer to Figure 1 , Figure 1 is an optional flow chart of the method for converting the timing path provided in the embodiment of the present application. Figure 1 As shown, the method for converting the timing path may include the following steps:
[0058] Step S100, obtaining a timing path for cross-chip transmission.
[0059] The timing path is based on a target through hole and a target bonding structure corresponding to the target through hole for vertical interconnection between different chips; wherein the target through hole is located on one chip, and the target bonding structure is located on another opposite chip. In an optional implementation, the projections of the target through hole and the target bonding structure in the vertical direction almost completely overlap. Specifically, when the projection error of the target through hole and the target bonding structure in the vertical direction is less than 15%, it can be regarded as being in the range of almost complete overlap.
[0060] A timing path refers to a channel for data to be transmitted from one node to another. It not only covers the path for data signal transmission, but also includes the path for clock signal transmission (i.e., clock path). Each timing path has a timing start point and a timing end point, which are used to indicate the starting position and the ending position of the data flow. The timing start point and the timing end point both correspond to corresponding clock start points.
[0061] In an alternative implementation, reference Figure 2 , Figure 2 is a schematic diagram of an optional structure of a timing path for cross-chip transmission provided in an embodiment of the present application. Figure 2 As shown, the timing path is based on the target via (such as Figure 2 ) and a target bonding structure corresponding to the target through hole (as shown in Figure 2 ) to vertically interconnect different chips; wherein the target through hole is located in a chip (ie, Figure 2 The target bonding structure is located on another chip (i.e., Figure 2 In die 2), the projections of the target through hole and the target bonding structure in the vertical direction almost completely overlap.
[0062] by Figure 2 Take the timing path of cross-chip transmission as an example. The timing start point of the timing path is located at F1 in module A of die 1, and the timing end point is located at F2 in module B of die 2. In the figure, F1 and F2 can be registers. Among them, the clock start point of F1 is located at C1 in module A of die 1, and the clock start point of F2 is located at C2 in module Y of die 2. Figure 2 As can be seen from the figure, the data on this timing path is transmitted from the timing start point (i.e., F1 in module A in die 1), passes through D1 in module A in die 1, then passes through the TSV in module X in die 1 and the BPV in module Y in die 2, passes through D2 in module Y in die 2, and is finally transmitted to the timing end point (i.e., F2 in module B in die 2).
[0063] The data signal transmission path in the timing path can be expressed as: die 1 / A / F1→die1 / A / D1→die 1 / X / TSV→die 2 / Y / BPV→die 2 / Y / D2→die 2 / B / F2. The transmission path of the clock signal at the transmitting end can be expressed as: die 1 / A / C1→die 1 / A / F1, and the transmission path of the clock signal at the receiving end can be expressed as: die 2 / Y / C2→die 2 / B / F2.
[0064] In another alternative implementation, reference Figure 3 , Figure 3 FIG. 1 is another optional structural diagram of the timing path of cross-chip transmission provided by the embodiment of the present application. Figure 3 As shown, the timing path is based on the target via (such as Figure 3 1 and TSV 2 in FIG. 1 ) and a target bonding structure corresponding to the target through hole (as shown in FIG. Figure 3The vertical interconnection between different chips is performed as shown in BPV 1 and BPV 2 in the figure; wherein, the projections of TSV 1 and BPV 1 in the vertical direction almost completely overlap (that is, TSV 1 corresponds to BPV 1), realizing the vertical interconnection between die 1 and die 2; the projections of TSV 2 and BPV 2 in the vertical direction almost completely overlap (that is, TSV 2 corresponds to BPV 2), realizing the vertical interconnection between die 2 and die 3.
[0065] by Figure 3 Take the timing path of cross-chip transmission as an example. The timing start point of the timing path is located at F1 in module A of die 1, and the timing end point is located at F2 in module Z of die 3. In the figure, F1 and F2 can be registers. Among them, the clock start point of F1 is located at C1 in module A of die 1, and the clock start point of F2 is located at C2 in module D of die 3. Figure 3 As can be seen from the figure, the data on this timing path is transmitted from the timing start point (i.e., F1 in module A in die 1), passes through D1 in module A in die 1, then passes through TSV 1 in module X in die 1 and BPV 1 in module Y in die 2, passes through D2 in module Y in die 2 and D3 in module B in die 2, then passes through TSV 2 in module B in die 2 and BPV 2 in module D in die3, passes through D4 in module D in die 3, and is finally transmitted to the timing end point (i.e., F2 in module Z in die 3).
[0066] The data signal transmission path in the timing path can be expressed as: die 1 / A / F1→die1 / A / D1→die 1 / X / TSV 1→die 2 / Y / BPV 1→die 2 / Y / D2→die 2 / B / D3→die2 / B / TSV 2→die 3 / D / BPV 2→die 3 / D / D4→die 3 / Z / F2. The transmission path of the clock signal at the transmitting end can be expressed as: die 1 / A / C1→die 1 / A / F1, and the transmission path of the clock signal at the receiving end can be expressed as: die 3 / D / C2→die 3 / Z / F2.
[0067] In yet another optional implementation, reference Figure 4 , Figure 4 FIG. 1 is another optional structural diagram of the timing path of cross-chip transmission provided by the embodiment of the present application. Figure 4 As shown, the timing path is based on the target via (such as Figure 4 1, TSV 2 and TSV 3 in FIG. 1 ) and a target bonding structure corresponding to the target through hole (as shown in FIG. Figure 4The vertical interconnection between different chips is performed as shown in BPV 1, BPV 2 and BPV 3 in the figure; wherein, the projections of TSV 1 and BPV 1 in the vertical direction almost completely overlap (that is, TSV 1 corresponds to BPV 1), realizing the vertical interconnection between die 1 and die 2; the projections of TSV 2 and BPV 2 in the vertical direction almost completely overlap (that is, TSV 2 corresponds to BPV 2), realizing the vertical interconnection between die 1 and die 2; the projections of TSV 3 and BPV 3 in the vertical direction almost completely overlap (that is, TSV 3 corresponds to BPV 3), realizing the vertical interconnection between die 1 and die 3.
[0068] by Figure 4 Take the timing path of cross-chip transmission as an example. The timing start point of the timing path is located at F1 in module A of die 1, and the timing end point is located at F2 in module E of die 3. In the figure, F1 and F2 can be registers. Among them, the clock start point of F1 is located at C1 in module A of die 1, and the clock start point of F2 is located at C2 in module E of die 3. Figure 4 As can be seen from the figure, the data on this timing path is transmitted from the timing start point (i.e., F1 in module A in die 1), passes through D1 in module A in die 1, then passes through TSV 1 in module X in die 1 and BPV 1 in module Y in die 2, passes through D2 in module Y in die 2 and D3 in module D in die 2, then passes through BPV 2 in module D in die 2 and TSV 2 in module B in die 1, passes through D4 in module C in die 1, then passes through TSV 3 in module C in die 1 and BPV 3 in module Z in die 3, passes through D5 in module Z in die 3, and is finally transmitted to the timing end point (i.e., F2 in module E in die 3).
[0069] The data signal transmission path in the timing path can be expressed as: die 1 / A / F1→die1 / A / D1→die 1 / X / TSV 1→die 2 / Y / BPV 1→die 2 / Y / D2→die 2 / D / D3→die2 / D / BPV 2→die 1 / B / TSV 2→die 1 / C / D4→die 1 / C / TSV 3→die 3 / Z / BPV 3→die 3 / Z / D5→die 3 / E / F2. The transmission path of the clock signal at the transmitter can be expressed as: die 1 / A / C1→die 1 / A / F1, and the transmission path of the clock signal at the receiver can be expressed as: die 3 / E / C2→die3 / E / F2.
[0070] Continue to refer Figure 1 , execute step S200 to extract the physical unit and physical connection information on the timing path.
[0071] The physical unit and physical connection information on the timing path are extracted to provide a basis for the subsequent step of dividing the physical unit and physical connection information into n data sets based on the target through hole and the target bonding structure.
[0072] The physical unit refers to a specific hardware component or functional module inside the chip. These physical units can be tiny electronic components, such as transistors, etc., or more complex structures, such as logic gates, registers, memory units, processor cores, etc. In other embodiments, the physical unit can also refer to different functional areas or modules on the chip, such as input / output units (I / O units), clock management units (CMUs), power management units (PMUs), etc.
[0073] In this embodiment, the physical unit may include but is not limited to a logic unit, an interface unit, a clock unit, etc. The logic unit may be, for example, a flip-flop, a latch, and a logic gate (such as AND, OR, NOT gate), etc. The interface unit may be, for example, a serial / parallel interface, a memory interface, and a network interface, etc. The clock unit may be, for example, a clock buffer, a clock divider, and a clock tree, etc.
[0074] The physical wiring information refers to the metal interconnection and wiring structure inside the chip, which is used to connect various physical units and realize signal transmission. Figure 2 In module A of die 1, the connection between F1, C1 and D1 is responsible for transmitting data signals and clock signals inside the chip.
[0075] Continue to refer Figure 1 , executing step S300, based on the target through hole and the target bonding structure, dividing the physical unit and physical connection information into n data sets.
[0076] The physical units and physical connection information in adjacent data sets are located in different coordinate systems.
[0077] In a specific implementation, the step of dividing the physical unit and physical connection information into n data sets based on the target through hole and the target bonding structure may include: taking the target through hole or the target bonding structure as the start and end marks of the data set, and dividing the physical unit and physical connection information into n data sets.
[0078] In an optional implementation, Figure 2 For example, taking the target through hole (such as Figure 2 ) or the target bonding structure (as shown in the TSV in Figure 2 As shown in BPV in the figure, the start and end marks of the data set are used to divide the physical unit and physical connection information into n data sets. Figure 2 The timing path in the embodiment passes through a target through hole and a target bonding structure corresponding to the target through hole. When the timing path passes through a target through hole and a target bonding structure corresponding to the target through hole, the step of dividing the physical unit and physical connection information into n data sets with the target through hole or the target bonding structure as the start and end marks of the data set is specifically as follows: dividing the physical unit and physical connection information of the timing path from the timing start point to the target through hole into a first data set; dividing the physical unit and physical connection information of the timing path from the target bonding structure corresponding to the target through hole to the timing end point into a second data set.
[0079] The timing start point and the timing end point both correspond to corresponding clock start points. The clock start point of F1 is located at C1 in module A of die1, and the clock start point of F2 is located at C2 in module Y of die 2. Accordingly, the first data set may be die1 / A / C1→die 1 / A / F1→die 1 / A / D1→die1 / X / TSV, and the second data set may be die 2 / Y / BPV→die2 / Y / D2→die 2 / B / F2←die2 / Y / C2.
[0080] from Figure 2 It can be seen that module A and module X in die 1 are on the same plane as TSV (i.e., the same two-dimensional coordinate system), and BPV in die 2 is on another plane with module Y and module B (i.e., another same two-dimensional coordinate system). Figure 2 TSV in the same coordinate system (for example Figure 2 C1, F1, D1) and physical wiring information in the first data set (for example, [TSV (C1, F1, D1)]); the target bonding structure corresponding to the target through hole (such as Figure 2 BPV in the same coordinate system (for example Figure 2 The target through hole and the target bonding structure are one-to-one corresponding, so the second data set can also be expressed as [TSV-BPV (C2, F2, D2)].
[0081] In another optional implementation, Figure 3 For example, taking the target through hole (such as Figure 3 1 and TSV 2 in FIG. 1 ) or the target bonding structure (as shown in FIG. Figure 3 BPV 1 and BPV 2 in FIG. 1 are start and end marks of the data set, and the physical unit and physical connection information are divided into n data sets. It can be seen that Figure 3 The timing path in the embodiment passes through two target through holes and target bonding structures corresponding to the target through holes. When the timing path passes through two target through holes and target bonding structures corresponding to the two target through holes, and the two target through holes are respectively a first target through hole and a second target through hole, and the target bonding structures corresponding to the two target through holes are respectively a first target bonding structure and a second target bonding structure, the step of dividing the physical units and physical wiring information into n data sets with the target through holes or the target bonding structures as the start and end marks of the data sets is specifically as follows: dividing the physical units and physical wiring information of the timing path from the timing start point to the first target through hole into a first data set; dividing the physical units and physical wiring information of the timing path from the first target bonding structure to the second target through hole into a second data set; and dividing the physical units and physical wiring information of the timing path from the second target bonding structure to the timing end point into a third data set.
[0082] The timing start point and the timing end point both correspond to corresponding clock start points. The clock start point of F1 is located at C1 in module A of die1, and the clock start point of F2 is located at C2 in module D of die 3. Accordingly, the first data set may be die1 / A / C1→die 1 / A / F1→die 1 / A / D1→die1 / X / TSV 1, the second data set may be die 2 / Y / BPV 1→die 2 / Y / D2→die 2 / B / D3→die 2 / B / TSV 2, and the third data set may be die 3 / D / BPV 2→die 3 / D / D4→die 3 / Z / F2←die 3 / D / C2.
[0083] from Figure 3 It can be seen that module A and module X in die 1 are in the same plane as TSV 1 (i.e., the same two-dimensional coordinate system), BPV 1 in die 2 is in another same plane as module Y, module B, and TSV 2 (i.e., another same two-dimensional coordinate system), and BPV 2 in die 3 is in another same plane as module D and module Z (i.e., another same two-dimensional coordinate system). Figure 3 TSV 1 in the same coordinate system (for example Figure 3C1, F1, D1) and physical wiring information in the first data set (for example, [TSV 1 (C1, F1, D1)]); the first target bonding structure (such as Figure 3 1) and the second target via (as shown in Figure 3 TSV 2 in the same coordinate system (for example Figure 3 D2, D3) and physical wiring information into a second data set (e.g., [BPV 1 (D2, D3)]); the second target bonding structure (e.g. Figure 3 2 in BPV) in the same coordinate system (e.g. Figure 3 The C2, F2, D4) and physical connection information are divided into a third data set (for example, [BPV 2 (C2, F2, D4)]).
[0084] Since the target through-holes and the target bonding structures are in one-to-one correspondence, the second data set may also be expressed as [TSV 1-BPV 1 (D2, D3)], and the third data set may also be expressed as [TSV 2-BPV 2 (C2, F2, D4)].
[0085] In yet another optional implementation, Figure 4 For example, taking the target through hole (such as Figure 4 ) or the target bonding structure (as shown in TSV 1, TSV 2 and TSV 3 in FIG. Figure 4 BPV 1, BPV 2 and BPV 3 in FIG. 1 are start and end marks of the data set, and the physical unit and physical connection information are divided into n data sets. It can be seen that Figure 4 The timing path in the data set passes through three target through holes and target bonding structures corresponding to the target through holes. When the timing path passes through three target through holes and target bonding structures corresponding to the three target through holes, and the three target through holes are respectively the first target through hole, the second target through hole and the third target through hole, and the target bonding structures corresponding to the three target through holes are respectively the first target bonding structure, the second target bonding structure and the third target bonding structure, the physical unit and the physical connection line are connected by using the target through hole or the target bonding structure as the start and end mark of the data set. The step of dividing the information into n data sets is specifically: dividing the physical units and physical connection information of the timing path from the timing start point to the first target through hole into a first data set; dividing the physical units and physical connection information of the timing path from the first target bonding structure to the second target bonding structure into a second data set; dividing the physical units and physical connection information of the timing path from the second target through hole to the third target through hole into a third data set; dividing the physical units and physical connection information of the timing path from the third target bonding structure to the timing end point into a fourth data set.
[0086] The timing start point and the timing end point both correspond to corresponding clock start points. The clock start point of F1 is located at C1 in module A of die1, and the clock start point of F2 is located at C2 in module E of die 3. Accordingly, the first data set may be die1 / A / C1→die 1 / A / F1→die 1 / A / D1→die1 / X / TSV 1, the second data set may be die 2 / Y / BPV 1→die 2 / Y / D2→die 2 / D / D3→die 2 / D / BPV 2, the third data set may be die 1 / B / TSV 2→die 1 / C / D4→die 1 / C / TSV 3, and the fourth data set may be die 3 / Z / BPV 3→die 3 / Z / D5→die 3 / E / F2←die3 / E / C2.
[0087] from Figure 4 It can be seen that module A, module X, TSV 1, module B, TSV 2, module C and TSV 3 in die 1 are in the same plane (i.e., the same two-dimensional coordinate system), wherein the timing path through module A, module X, TSV 1 is continuous, and the timing path through module B, TSV 2, module C and TSV 3 is continuous; BPV 1 in die 2 is in another same plane with module Y, module D and BPV 2 (i.e., another same two-dimensional coordinate system); BPV 3 in die 3 is in another same plane with module Z and module E (i.e., another same two-dimensional coordinate system). At this time, the first target through hole (such as Figure 4 1 in the same coordinate system and on a physical unit (eg, Figure 4 C1, F1, D1) and physical wiring information in the first data set (for example, [TSV 1 (C1, F1, D1)]); the first target bonding structure (such as Figure 4 1) and the second target bonding structure (as shown in BPV 1 in Figure 4 2 in BPV) in the same coordinate system (e.g. Figure 4 D2, D3) and physical wiring information into a second data set (e.g., [BPV 1 (D2, D3)]); Figure 4 2 in the same coordinate system and on a physical unit (eg, Figure 4 D4 in the figure) and physical wiring information into a third data set (e.g., [TSV 2 (D4)]); and the third target bonding structure (e.g. Figure 43 in BPV 3) in the same coordinate system (e.g. Figure 4 The C2, F2, D5) and physical connection information are divided into a fourth data set (for example, [BPV 3 (C2, F2, D5)]).
[0088] Among them, since the target through hole and the target bonding structure are one-to-one corresponding, the second data set can also be expressed as [TSV 1-BPV 1 (D2, D3)], the third data set can also be expressed as [BPV2-TSV 2 (D4)], and the fourth data set can also be expressed as [TSV 3-BPV 3 (C2, F2, D5)].
[0089] Continue to refer Figure 1 , execute step S400 to convert the physical units and physical connection information in the n data sets into the same coordinate system.
[0090] By converting the physical units and physical connection information in n data sets into the same coordinate system, the timing paths transmitted across chips can be displayed in the same view. This eliminates the need for analysts to frequently switch between multiple databases and tool interfaces, significantly reducing the analysis time of cross-chip timing paths and greatly improving the efficiency of overall circuit design.
[0091] Among them, the coordinates of the corresponding target through holes and target bonding structures in adjacent data sets overlap, so that the physical units and physical connection information on the timing path are located in the same coordinate system, thereby avoiding the problem of line breakage (i.e., incomplete timing path view) caused by the timing path being presented based on different coordinate systems, so that the timing path appears as a continuous and complete image in the same coordinate system, thereby simplifying the process of analyzing the timing path, facilitating analysts to analyze the transmission of signals on the timing path, and improving the analysis efficiency of the timing path.
[0092] In an optional implementation, the step of converting the physical units and physical connection information in the n data sets into the same coordinate system may include: taking the coordinates of the target through hole and the target bonding structure corresponding to the target through hole as reference points, projecting the physical units and physical connection information of one data set among the n data sets along the vertical direction to the coordinate system where the data set adjacent to the data set is located. For example, the physical units and physical connection information of the second data set may be projected along the vertical direction to the coordinate system where the first data set is located, or the physical units and physical connection information of the first data set may be projected along the vertical direction to the coordinate system where the second data set is located.
[0093] It should be noted that the above-mentioned projecting the physical units and physical connection information of one data set among the n data sets along the vertical direction to the coordinate system where the data set adjacent to the data set is located is only an optional example. In other embodiments, the physical units and physical connection information of the first data set and the second data set may also be projected along the vertical direction to other coordinate systems except the coordinate system where the first data set and the second data set are located. The embodiment of the present application does not limit the specific conversion method of the data set.
[0094] Specifically, Figure 2 Taking the timing path of cross-chip transmission shown in the figure as an example, the physical unit and physical connection information of the second data set are projected vertically to the coordinate system where the first data set is located. Figure 5-Figure 6 As shown, along the vertical direction projection, since the projections of the target through hole TSV and the target bonding structure BPV in the vertical direction are almost completely overlapped, the coordinates of the TSV, such as T(X t1 , Y t1 ) and the coordinates of BPV such as P(X p2 , Y p2 ) is used as a reference point for coordinate conversion, and the timing path on die2 is projected onto die1 in the vertical direction.
[0095] For example, the coordinates of C2 in the timing path on die2 are (X c2 , Y c2 ), with the coordinates of BPV on the same plane P(X p2 , Y p2 ) as the reference point, the coordinates of C2 can be expressed as: (X p2 , Y p2 )+(X c2 -X p2 , Y c2 -Y p2 ); and the projections of the target through hole TSV and the target bonding structure BPV in the vertical direction almost completely overlap, so the coordinates of C2 after projection can be expressed as: (X t1 , Y t1 )+(X c2 -X p2 , Y c2 -Y p2 ). Similarly, the coordinates of the physical units and physical connection information in the timing path on die2 on die1 are obtained, so that the coordinates of all points in the timing path on die2 can be converted to the plane where die1 is located. Among them, since the timing path on die1 and the target through hole TSV are in the same plane, their coordinates do not change.
[0096] In an optional implementation, the step of projecting the physical units and physical connection information of a data set among n data sets along the vertical direction to the coordinate system where a data set adjacent to the data set is located may include: projecting the physical units and physical connection information of the n data sets along the vertical direction to the same coordinate system in reverse order of the target through holes or the target bonding structures.
[0097] Specifically, Figure 3 Taking the timing path of cross-chip transmission as an example, the physical units and physical connection information in the three data sets are projected vertically to the same coordinate system. Figure 7-Figure 9 As shown, along the vertical direction projection, since the projections of the second target through hole TSV2 and the second target bonding structure BPV2 in the vertical direction are almost completely overlapped, the coordinates of TSV2, such as T2 (X t20 , Y t20 ) and the coordinates of BPV2, such as P2(X p21 , Y p21 ) as a reference point for coordinate conversion, and project the timing path on die3 onto die2 along the vertical direction. Similarly, since the projections of the first target through hole TSV1 and the first target bonding structure BPV1 in the vertical direction almost completely overlap, the coordinates of TSV1, such as T1(X t10 , Y t10 ) and the coordinates of BPV1, such as P1(X p11 , Y p11 ) is used as a reference point for coordinate conversion, and the timing path on die2 is projected onto die1 along the vertical direction. Among them, since the timing path on die3 has been projected onto die2, when the timing path on die2 is projected onto die1 along the vertical direction, the timing path originally on die3 that has been projected onto die2 can also be projected onto die1.
[0098] For example, the coordinates of C2 in the timing path on die3 are (X c2 , Y c2 ), with the coordinates P(X p21 , Y p21 ) as the reference point, the coordinates of C2 can be expressed as: (X p21 , Y p21 )+(X c2 -X p21 , Y c2 -Y p21 ); and the projections of the second target through hole TSV2 and the second target bonding structure BPV2 in the vertical direction almost completely overlap, so the coordinates of C2 after projection can be expressed as: (Xt20 , Y t20 )+(X c2 -X p21 , Y c2 -Y p21 ). Similarly, the coordinates of the physical units and physical connection information in the timing path on die3 on die2 are obtained, so that the coordinates of all points in the timing path on die3 can be converted to the plane where die2 is located. Among them, since the timing path on die2 and the second target through hole TSV2 are in the same plane, their coordinates do not need to be changed.
[0099] The specific method of projecting the timing path on die2 onto die1 along the vertical direction can refer to the description at the corresponding position above, and will not be repeated in the embodiments of the present application.
[0100] It can be seen that the timing path conversion method provided in the embodiment of the present application converts the physical units and physical connection information in n data sets into the same coordinate system, wherein the physical units and physical connection information in adjacent data sets are located in different coordinate systems, so that the physical units and physical connection information on the timing path are located in the same coordinate system, thereby avoiding the problem of line breakage (i.e., incomplete timing path view) caused by the timing path being presented based on different coordinate systems, so that the timing path appears as a continuous and complete image in the same coordinate system, thereby simplifying the process of analyzing the timing path, facilitating analysts to analyze the transmission of signals on the timing path, and improving the analysis efficiency of the timing path.
[0101] The following is an introduction to the timing path conversion device provided in the embodiment of the present application. The timing path conversion device described below can be considered as a software function module or hardware function module required to implement the timing path conversion method provided in the embodiment of the present application. The content of the timing path conversion device described below can be referenced to the content of the method described above.
[0102] In an optional implementation, Fig.10 The following is an exemplary diagram of an optional structure of a timing path conversion device provided in an embodiment of the present application. The timing path conversion device is used to implement the timing path conversion method provided in an embodiment of the present application. Fig.10 As shown, the timing path conversion device may include:
[0103] An acquisition module 1 is used to acquire a timing path for cross-chip transmission, wherein the timing path is based on a target through hole and a target bonding structure corresponding to the target through hole for vertical interconnection between different chips; wherein the target through hole is located in one chip, and the target bonding structure is located in another opposite chip;
[0104] Extraction module 2, used to extract physical unit and physical connection information on the timing path;
[0105] A division module 3 is used to divide the physical unit and physical connection information into n data sets based on the target through hole and the target bonding structure, wherein the physical unit and physical connection information in adjacent data sets are located in different coordinate systems;
[0106] The conversion module 4 is used to convert the physical units and physical connection information in the n data sets into the same coordinate system, wherein the coordinates of the corresponding target through holes and target bonding structures in adjacent data sets overlap.
[0107] Optionally, the division module 3 is used to divide the physical unit and physical connection information into n data sets based on the target through hole and the target bonding structure, including:
[0108] The target through hole or the target bonding structure is used as the start and end marks of a data set, and the physical unit and physical connection information is divided into n data sets.
[0109] Optionally, the timing path includes a timing start point and a timing end point.
[0110] Optionally, when the timing path passes through a target through hole and a target bonding structure corresponding to the target through hole, the physical unit and physical connection information are divided into n data sets with the target through hole or the target bonding structure as the start and end marks of the data set, specifically:
[0111] Divide the physical unit and physical connection information of the timing path from the timing start point to the target through hole into a first data set;
[0112] The physical unit and physical connection information of the timing path from the target bonding structure corresponding to the target through hole to the timing end point is divided into a second data set.
[0113] Optionally, when the timing path passes through two target through holes and target bonding structures corresponding to the two target through holes, and the two target through holes are respectively a first target through hole and a second target through hole, and the target bonding structures corresponding to the two target through holes are respectively a first target bonding structure and a second target bonding structure, the physical unit and physical connection information are divided into n data sets using the target through holes or the target bonding structures as the start and end marks of the data sets, specifically:
[0114] Divide the physical unit and physical connection information of the timing path from the timing start point to the first target through hole into a first data set;
[0115] dividing the physical unit and physical wiring information of the timing path from the first target bonding structure to the second target through hole into a second data set;
[0116] The physical unit and physical connection information of the timing path from the second target bonding structure to the timing endpoint is divided into a third data set.
[0117] Optionally, when the timing path passes through three target through holes and target bonding structures corresponding to the three target through holes, and the three target through holes are respectively a first target through hole, a second target through hole and a third target through hole, and the target bonding structures corresponding to the three target through holes are respectively a first target bonding structure, a second target bonding structure and a third target bonding structure, the physical unit and physical connection information are divided into n data sets using the target through holes or the target bonding structures as the start and end marks of the data sets, specifically:
[0118] Divide the physical unit and physical connection information of the timing path from the timing start point to the first target through hole into a first data set;
[0119] dividing the physical unit and physical connection information of the timing path from the first target bonding structure to the second target bonding structure into a second data set;
[0120] Dividing the physical unit and physical connection information of the timing path from the second target through hole to the third target through hole into a third data set;
[0121] The physical unit and physical connection information of the timing path from the third target bonding structure to the timing endpoint is divided into a fourth data set.
[0122] Optionally, the conversion module 4 is used to convert the physical units and physical connection information in the n data sets into the same coordinate system, including:
[0123] Taking the coordinates of the target through hole and the target bonding structure corresponding to the target through hole as reference points, the physical unit and physical connection information of a data set among the n data sets are projected along the vertical direction to the coordinate system of the data set adjacent to the data set.
[0124] Optionally, projecting the physical unit and physical connection line information of a data set among the n data sets along a vertical direction to a coordinate system where a data set adjacent to the data set is located includes:
[0125] In reverse order of the target through-holes or the target bonding structures, the physical units and physical connection line information in the n data sets are projected into the same coordinate system in the vertical direction.
[0126] Optionally, the timing path includes at least a clock path.
[0127] It can be seen that the timing path conversion method provided in the embodiment of the present application converts the physical units and physical connection information in n data sets into the same coordinate system, wherein the physical units and physical connection information in adjacent data sets are located in different coordinate systems, so that the physical units and physical connection information on the timing path are located in the same coordinate system, thereby avoiding the problem of line breakage (i.e., incomplete timing path view) caused by the timing path being presented based on different coordinate systems, so that the timing path appears as a continuous and complete image in the same coordinate system, thereby simplifying the process of analyzing the timing path, facilitating analysts to analyze the transmission of signals on the timing path, and improving the analysis efficiency of the timing path.
[0128] An embodiment of the present application also provides an electronic device, which may include at least one memory and at least one processor, wherein the memory stores one or more computer executable instructions, and the processor calls the one or more computer executable instructions to execute the aging analysis method as described above.
[0129] As an optional implementation, refer to Fig.11 , Fig.11 is an optional block diagram of an electronic device provided in an embodiment of the present application. Fig.11 As shown, the electronic device may include: at least one processor 10 , at least one communication interface 20 , at least one memory 30 and at least one communication bus 40 .
[0130] In the embodiment of the present application, the number of the processor 10 , the communication interface 20 , the memory 30 and the communication bus 40 is at least one, and the processor 10 , the communication interface 20 , and the memory 30 communicate with each other through the communication bus 40 .
[0131] Optionally, the processor 10 may be a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an NPU (Neural-network Processing Unit), an FPGA (Field Programmable Gate Array), a TPU (Tensor Processing Unit), an AI chip, an ASIC (Application Specific Integrated Circuit), or one or more integrated circuits configured to implement an embodiment of the present application.
[0132] Optionally, the communication interface 20 may be an interface of a communication module for performing network communication.
[0133] The memory 30 may include a high-speed RAM memory, and may also include a non-volatile memory, such as at least one disk memory. The memory 30 stores one or more computer executable instructions, and the processor 10 calls the one or more computer executable instructions to execute the timing path conversion method as described above.
[0134] An embodiment of the present application further provides a storage medium, wherein the storage medium stores one or more computer executable instructions, and when the one or more computer executable instructions are executed, the timing path conversion method as described above is implemented.
[0135] An embodiment of the present application further provides a computer program product, which may include one or more computer executable instructions. When the one or more computer executable instructions are executed, the timing path conversion method described above is implemented.
[0136] The above describes multiple implementation schemes provided by the embodiments of the present application. The various optional methods introduced in each implementation scheme can be combined and cross-referenced with each other without conflict, thereby extending a variety of possible implementation schemes, which can all be considered as implementation schemes disclosed and open in the embodiments of the present application.
[0137] Although the embodiments of the present application are disclosed above, the present application is not limited thereto. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be subject to the scope defined by the claims.
Claims
1. A method for converting a timing path, characterized in that: include: Acquire a timing path for cross-chip transmission, wherein the timing path is based on a target through hole and a target bonding structure corresponding to the target through hole for vertical interconnection between different chips; wherein the target through hole is located in one chip, and the target bonding structure is located in another opposite chip; Extracting physical unit and physical connection information on the timing path; Based on the target through hole and the target bonding structure, the physical unit and physical connection information are divided into n data sets, wherein the physical unit and physical connection information in adjacent data sets are located in different coordinate systems; The physical units and physical connection information in the n data sets are converted into the same coordinate system, wherein the coordinates of the corresponding target through holes and target bonding structures in adjacent data sets coincide with each other.
2. The method for converting a timing path according to claim 1, characterized in that: The step of dividing the physical unit and physical connection information into n data sets based on the target through hole and the target bonding structure includes: The target through hole or the target bonding structure is used as the start and end marks of a data set, and the physical unit and physical connection information is divided into n data sets.
3. The method for converting a timing path according to claim 2, characterized in that: The timing path includes a timing start point and a timing end point.
4. The method for converting a timing path according to claim 3, characterized in that: When the timing path passes through a target through hole and a target bonding structure corresponding to the target through hole, the step of dividing the physical unit and physical connection information into n data sets with the target through hole or the target bonding structure as the start and end marks of the data set is specifically: Divide the physical unit and physical connection information of the timing path from the timing start point to the target through hole into a first data set; The physical unit and physical connection information of the timing path from the target bonding structure corresponding to the target through hole to the timing end point is divided into a second data set.
5. The method for converting a timing path according to claim 3, characterized in that: When the timing path passes through two target through holes and target bonding structures corresponding to the two target through holes, and the two target through holes are respectively a first target through hole and a second target through hole, and the target bonding structures corresponding to the two target through holes are respectively a first target bonding structure and a second target bonding structure, the step of dividing the physical unit and physical connection information into n data sets by using the target through holes or the target bonding structures as start and end marks of the data sets is specifically: Divide the physical unit and physical connection information of the timing path from the timing start point to the first target through hole into a first data set; dividing the physical unit and physical wiring information of the timing path from the first target bonding structure to the second target through hole into a second data set; The physical unit and physical connection information of the timing path from the second target bonding structure to the timing endpoint is divided into a third data set.
6. The method for converting a timing path according to claim 3, characterized in that: When the timing path passes through three target through holes and target bonding structures corresponding to the three target through holes, and the three target through holes are respectively a first target through hole, a second target through hole and a third target through hole, and the target bonding structures corresponding to the three target through holes are respectively a first target bonding structure, a second target bonding structure and a third target bonding structure, the step of dividing the physical unit and physical connection information into n data sets by using the target through holes or the target bonding structures as start and end marks of the data sets is specifically: Divide the physical unit and physical connection information of the timing path from the timing start point to the first target through hole into a first data set; dividing the physical unit and physical connection information of the timing path from the first target bonding structure to the second target bonding structure into a second data set; Dividing the physical unit and physical connection information of the timing path from the second target through hole to the third target through hole into a third data set; The physical unit and physical connection information of the timing path from the third target bonding structure to the timing endpoint is divided into a fourth data set.
7. The method for converting a timing path according to claim 2, characterized in that: The step of converting the physical units and physical connection information in the n data sets into the same coordinate system includes: Taking the coordinates of the target through hole and the target bonding structure corresponding to the target through hole as reference points, the physical unit and physical connection information of a data set among the n data sets are projected along the vertical direction to the coordinate system of the data set adjacent to the data set.
8. The method for converting a timing path according to claim 7, characterized in that: The step of projecting the physical unit and physical connection line information of a data set among the n data sets along the vertical direction to the coordinate system where the data set adjacent to the data set is located includes: In reverse order of the target through-holes or the target bonding structures, the physical units and physical connection line information in the n data sets are projected into the same coordinate system in the vertical direction.
9. The method for converting a timing path according to claim 1, characterized in that: The timing path includes at least a clock path.
10. A timing path conversion device, characterized in that: include: An acquisition module, used for acquiring a timing path for cross-chip transmission, wherein the timing path is based on a target through hole and a target bonding structure corresponding to the target through hole for vertical interconnection between different chips; wherein the target through hole is located in one chip, and the target bonding structure is located in another opposite chip; An extraction module, used to extract physical unit and physical connection information on the timing path; A partitioning module, configured to partition the physical unit and physical connection information into n data sets based on the target through hole and the target bonding structure, wherein the physical unit and physical connection information in adjacent data sets are located in different coordinate systems; The conversion module is used to convert the physical unit and physical connection information in the n data sets into the same coordinate system, wherein the coordinates of the corresponding target through holes and target bonding structures in adjacent data sets overlap.
11. An electronic device, characterized in that: The method comprises at least one memory and at least one processor, wherein the memory stores one or more computer executable instructions, and the processor calls the one or more computer executable instructions to execute the timing path conversion method according to any one of claims 1 to 9.
12. A storage medium, characterized in that: The storage medium stores one or more computer executable instructions, and when the one or more computer executable instructions are executed, the timing path conversion method according to any one of claims 1 to 9 is implemented.
13. A computer program product, characterized in that The method comprises one or more computer executable instructions, and when the one or more computer executable instructions are executed, the method for converting the timing path according to any one of claims 1 to 9 is implemented.