Automatic photomask graphic data generation system and use method thereof

Abstract

The invention relates to the technical field of electrical digital data processing, and provides a photomask graphic data automatic generation system and a use method thereof.The method comprises the steps that a metadata structured shell is manufactured, and a corresponding metadatabase is established based on the manufactured metadata structured shell; the metadata structured shell is composed of a shell layer, a core layer and an environment adaptation layer, client data and a mask template modeling data deployment system directory are stored in the shell layer, a specific source file and a mask template modeling data deployment system are arranged in the core layer, and an interface interconnected with a corresponding operating system is arranged in the environment adaptation layer. It is ensured that the metadata structured shell can be identified by the corresponding operating system. Due to the adoption of the technical scheme, the metadata structured shell is generated, the design is easy to uniformly read and reduce errors, the method is not limited by different databases and database structures, and barrier-free circulation of data is greatly promoted.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic digital data processing, and in particular to a system for automatically generating photomask graphic data and a method for using the system. Background Art

[0002] In the field of high-precision processing such as semiconductor manufacturing and photolithography technology, integrated circuit design companies need to send their chip design drafts to the mask factory before putting their designed chips into production, and the mask factory will make the mask. For example, in the prior art, the invention titled "Photomask Manufacturing Method and Layout Pattern for Manufacturing Photomask" with patent application number CN202310762744.6 discloses a photomask manufacturing method, including providing a target pattern, generating a first bias pattern according to the target pattern and a first deviation value, and then generating a second bias pattern according to the first bias pattern and the second deviation value, and then performing a Boolean operation on the first bias pattern and the second bias pattern to obtain a first auxiliary feature, and then outputting the target pattern and the first auxiliary feature output to manufacture the photomask. The photomask thus formed has a shortened manufacturing time and improved fidelity, which helps to faithfully transfer the target pattern to the semiconductor substrate.

[0003] It can be learned from this patent that the conventional requirements for data information accuracy are very high, and the formats used by different mask factories in the prior art are different, resulting in the chip factory needing to save multiple sets of data formats provided by different mask factories. Different formats are not universal. Even if the template information of the mask is forcibly decoded through templates of different data formats, some data details will have deviations, resulting in the inability to accurately generate chips and an increase in chip defective rates. At the same time, different chip factories are also worried that the mask information corresponding to the chips they designed can be easily obtained by other units, and hope to further improve the confidentiality of their own design documents. Summary of the invention

[0004] The purpose of the present invention is to provide a system for automatically generating photomask pattern data and a method for using the system, which can realize unified processing of mask template information of different formats through a complete set of systems, and the processed data can be read out through a set of systems, and the mold making accuracy after reading is guaranteed. At the same time, the possibility of leakage of mask template information is also reduced.

[0005] In order to achieve the above-mentioned purpose, the present invention provides an automatic generation system for photomask graphic data, including making a metadata structured shell and establishing a corresponding metadata database based on the made metadata structured shell; the metadata structured shell is composed of a shell layer, a core layer and an environment adaptation layer, wherein the shell layer stores customer information and a mask molding data deployment system directory, while the core layer is provided with specific source files and a mask molding data deployment system, and the environment adaptation layer has an interface interconnected with a corresponding operating system to ensure that the metadata structured shell can be recognized by the corresponding operating system.

[0006] Preferably, the specific steps of making the metadata structured shell are: the system accesses the main chip layout database provided by the customer, obtains the database information, mask generation table and related files for auxiliary work provided by the customer from the main chip layout database and gives them to the customer engineering department; the customer engineering department plans the mask processing based on the information obtained from the main chip layout database and the specifications provided by the chip factory, clarifies the mask requirements and issues a data release notification, and then performs unit merging and design rule inspection and cleaning based on the data obtained from the above two data sources. If the unit merging and design rule inspection and cleaning are completed, it is directly sent to the mask data engineering department, combined with the mask grade specifications and mask-related quality specifications provided by the mask factory, to generate the source file and conversion data file recorded in the metadata structured shell. This method of making metadata structured shells can effectively improve the accuracy and standardization of the source file data. It accesses multiple databases, integrates the information and specifications of customers, chip factories and mask factories, uses standardized processes for data processing, and reduces human errors.

[0007] Preferably, when the unit merging and design rule checking and cleaning process is not completed, the design service and product department will conduct layout merging and design rule checking; after the layout merging and rule checking are completed, they will be placed in the metadata database, and a data release / revision notice will be issued, and the data will be sent to the mask data engineering department. Combined with the mask grade specifications and mask-related quality specifications provided by the mask factory, the source files and conversion data files recorded in the metadata structured shell are generated. This processing method can use the power of professional departments to solve key tasks that have not been completed in the early stage, ensure data compliance and completeness, ensure the smooth progress of the metadata structured shell generation process, and improve data quality and product reliability. Avoid the appearance of defective source files.

[0008] Preferably, in the mask data engineering department, the field layout is generated based on the acquired data. During the generation process of the field layout, data input and data segmentation of the mask molding data deployment system are required, and finally a workbench view is presented. The mask processing information is determined based on the workbench view, and the mask processing information is saved separately as a source file and a conversion data file.

[0009] Preferably, the specification provided by the chip manufacturer at least includes a bias table, design rules, and specified mask level information, so as to ensure that the metadata structured shell is indeed usable.

[0010] The present invention also includes a method for using a system for automatically generating photomask graphic data, characterized in that, when making a mask, a local device obtains a metadata structured shell from a metadata database; the environment adaptation layer in the metadata structured shell identifies the operating system where the local device is located and automatically configures it; the local device uploads customer information, and compares the obtained customer information with the customer information in the shell layer to confirm the identity of the local device. After the identity is determined, the corresponding mask molding data deployment system is selected from the mask molding data deployment system directory, and the mask molding data deployment system is used to decode the open source file into device data and software data that can be recognized by the local device, and the obtained device data is used to configure the device, and the obtained software data is used to perform molding.

[0011] Preferably, when the mask mold making data deployment system parses the corresponding source file, the metadata database is connected to the mask mold making data deployment system, and the mask mold making data deployment system obtains the corresponding source file according to the conversion data file. The mask mold making data deployment system at least includes: a database management system, a plate making information processing system, a mask design manuscript management system, and a mask import management system; the database management system includes a mask mold making login system and a mask mold making typesetting planning system; the mask mold making typesetting planning system is connected to the plate making information processing system, and the plate making information processing system is connected to the mask data processing system and A platemaking specification management system; parsing the source file into equipment data and software data in the platemaking information processing system, connecting the mask design completion management system in the platemaking information processing system, and connecting the mask design completion management system to the mask import management system; outputting the software data in a standardized information format in the metadata database: reading platemaking information in different formats, and decomposing the platemaking information into meta-molding data and meta-mask information; the meta-molding data includes typesetting frame information and component molding information; the meta-mask information includes product code and production line information; and there is also mask layer information that belongs to both the meta-molding data and the meta-mask information.

[0012] Preferably, data and optical compensation information, a data file description table and a layout diagram are formed in the mask import management system, and the mask import management system is connected to the mask data processing system through a process integration module.

[0013] Preferably, the layout frame information includes data frame layout information, test component information on the cutting line and single modular test component information; after the data frame layout information is acquired, it is repackaged together and encrypted, and the encrypted file adds the work file's layout GDSII and CD image label.

[0014] Preferably, the mask factory manufactures the mask through the frame GDSII and CD image label of the work file, and the mask control system in the mask factory monitors the manufacturing process and performs incoming material quality control and final inspection on the mask.

[0015] Due to the adoption of the technical solution, the present invention generates a metadata structured shell, which can be used as an intermediate layer in chip design software and manufacturing process management systems. When designers design chips, they input, store and retrieve source files through the metadata structured shell. In the manufacturing process, production equipment and process control systems also use this shell to obtain source files required for chip manufacturing. The metadata structured shell plays a key role in organizing, protecting and transmitting metadata in the field of chip manufacturing, which helps to improve the efficiency and quality of chip design and manufacturing.

[0016] At the same time, by simplifying the communication and file exchange between chip manufacturers, mask manufacturers and customers, it can be gradually expanded to industry standards, thereby simplifying the operation processes of each company. In addition, in outsourced production, the simplification of file exchange will make it unnecessary for friendly factories to interpret the processing mode again, nor to transmit the processing mode of customers, which greatly improves work efficiency and data security. The automated procedures for data processing are separated and will not be affected by changes in customer processing modes, which further ensures the stability and efficiency of the process. These measures not only save development and testing costs, but also reduce the risk of program modifications. The design of the metadata structured shell is easy to read uniformly and reduce errors. It is not restricted by different databases and database structures, which greatly promotes the barrier-free flow of data. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 It is the structure of the metadata structured shell of the photomask pattern data automatic generation system of the present invention.

[0018] Figure 2 This is a metadata structured shell production method of the photomask graphic data automatic generation system of the present invention.

[0019] Figure 3 The present invention is a schematic diagram of the structure of the mask plate modeling data deployment system of the automatic generation system of the photomask pattern data.

[0020] Figure 4 It is a schematic diagram of the process of obtaining data from a source file by the automatic generation system of photomask graphic data of the present invention.

[0021] Figure 5It is a schematic diagram of manufacturing a single mask layer using the automatic photomask pattern data generation system of the present invention in an embodiment.

[0022] Figure 6 It is a schematic diagram of the structure of a complete set of masks finally manufactured by using the automatic generation system of photomask pattern data of the present invention in an embodiment. DETAILED DESCRIPTION

[0023] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0024] In order to clearly express the contents involved in the present invention, the meanings of some abbreviations involved in the present invention are first explained.

[0025] MPW: Multi-Project Wafer, which has special significance for photomask data used in chip manufacturing. Its background is to reduce chip design costs, especially the costs of small-batch production or chip prototyping. The operation mode is that the foundry receives chip layout data from different customers according to rules and schedules, and after processing, it is reasonably arranged in different areas of the same wafer. Multiple functional chip layouts can coexist, and each chip undergoes lithography, etching and other processes at the same time. Through MPW, costs can be greatly reduced, and the progress of research and development can be accelerated, allowing multiple design projects to quickly enter the manufacturing stage and shortening the cycle from design to testing.

[0026] GDSII: Graphic Data System II is a standard file format for the exchange of integrated circuit layout data. It is a data format widely used in the field of chip design and manufacturing, mainly used to describe the physical layout of integrated circuits (ICs). This file format can accurately record the geometry, location information, and hierarchical relationships of various physical structures on the chip.

[0027] MEBES: Manufacturing Electron - Beam Exposure Standard is a mask data format mainly used in electron beam exposure systems. It plays an important role in the chip manufacturing process, especially in the high-precision mask production process. It is a format developed to meet the requirements of electron beam lithography technology for mask data accuracy and complexity.

[0028] RDDS: Reticle Data Deployment System. RDDS data is mainly used to collect reticle data and output according to the process parameters of each technology node. It is a comprehensive data set that covers all key information from the receipt and processing of reticle information to its final application in the lithography process.

[0029] Mask: A mask or reticle plays a key role as a template in the chip manufacturing process. It is like a "light shield" with a pattern designed according to the chip layout. In the photolithography process, light passes through the transparent part of the mask and shines on the surface of the silicon wafer coated with photoresist, causing the photoresist to undergo chemical changes, thereby transferring the pattern on the mask to the silicon wafer.

[0030] Metadatabase: According to the general definition, a metadatabase is a special database mainly used to store data about data, namely metadata. In the present invention, the metadata structured shell and various source files and part of the information parsed from the source files are stored in the same database, and this database is named metadatabase.

[0031] As an embodiment, a system for automatically generating photomask pattern data of the present invention includes making a metadata structured shell, and establishing a corresponding metadata database based on the made metadata structured shell. Figure 1 As shown, the metadata structured shell is composed of a shell layer, a core layer and an environment adaptation layer, wherein the shell layer stores customer information and a mask molding data deployment system directory, while the core layer is provided with specific source files and a mask molding data deployment system, and the environment adaptation layer has an interface interconnected with the corresponding operating system to ensure that the metadata structured shell can be recognized by the corresponding operating system.

[0032] like Figure 2As shown, the process is initiated by the customer, and the system accesses the main chip layout database provided by the customer. The main chip layout database (Main Chip Layout Data Base) is the basic layout data source for the entire chip manufacturing process. It carries key information such as the chip layout in a specific file format, and will be passed to other relevant departments for further operation and processing. The database information, mask generation table and related files for auxiliary work provided by the customer are obtained from the main chip layout database and given to the customer engineering department; the customer engineering department plans the mask processing based on the information obtained from the main chip layout database and the specifications provided by the chip factory, clarifies the mask requirements and issues a data release notification. At this time, the data obtained from the above two data sources are used to perform unit merging and design rule inspection and cleaning. If the unit merging and design rule inspection and cleaning are completed, it is sent directly to the mask data engineering department, combined with the mask grade specifications and mask-related quality specifications provided by the mask factory, to generate source files and conversion data files recorded in the metadata structured shell.

[0033] Among them, the main chip layout database is the key foundation of the chip manufacturing process, which includes the following important contents: Physical-layer Layout: This is the presentation of the physical structure of the chip on a plane. It records in detail the position, shape and size of each physical component in the chip (such as transistors, capacitors, resistors, etc.). For example, for a transistor, the specific location of its source, drain and gate and the distance between them are indicated. This information is crucial for processes such as lithography, because lithography needs to accurately transfer the patterns of these physical structures to silicon wafers. It also includes the layout of different functional modules on the chip (such as CPU core, cache, I / O interface, etc.). Taking the CPU core as an example, the positional relationship of its internal arithmetic logic unit (ALU), registers and other components will be clearly displayed in the layout to ensure that the signal transmission path between them meets the design requirements.

[0034] Metal - Wiring - layer Layout: It mainly records the layout of metal wires in the chip. These metal wires are used to connect various physical components to achieve signal transmission. It contains information such as the width, thickness, and direction of the wires. For example, in advanced process chips, in order to reduce signal delay, metal wiring may adopt a multi-layer structure, and the wiring direction of each layer may be perpendicular to each other (such as one layer for horizontal wiring and the other layer for vertical wiring), and the main chip layout database will describe the specific layout of each layer of metal wiring in detail.

[0035] Functional - Module Description includes module type and function: Clarify the type of each functional module, such as digital signal processing module (DSP), analog front-end module (AFE), etc. At the same time, describe the function of each module in detail. For example, the DSP module is responsible for filtering and modulation of digital signals, and the database will record its specific algorithm implementation and the characteristics of input and output signals. For complex functional modules, such as the graphics processing unit (GPU) in the system on chip (SoC), it will include the graphics rendering algorithms it supports (such as vertex shading, pixel shading, etc.), the interaction method with other modules (such as memory controller, display interface, etc.), etc.

[0036] Module - Interface Information: Record the interface signals of each functional module, including the signal name, type (such as digital signal or analog signal), level standard (such as TTL level, CMOS level), etc. For example, the interface signals of a storage module may include address bus signals, data bus signals, read and write control signals, etc. The database will detail the bit width, transmission direction and other information of these signals to ensure that the modules can communicate correctly.

[0037] It also includes design rule-related data (Design - Rule - Related Data), such as minimum size constraints (Minimum - Size Constraints): which stipulates the minimum size of various physical structures in the chip. For example, the minimum channel length of the transistor, the minimum width of the metal line, etc. These minimum size constraints are set based on the capabilities of the chip manufacturing process to ensure that the chip can reliably implement the designed functions during the manufacturing process. If these dimensions are smaller than the specified values, it may cause process deviations in the manufacturing process, such as short circuits, leakage, and other problems. There are also minimum size requirements for gaps in the chip (such as the spacing between two adjacent metal lines). This is to prevent crosstalk between signals and ensure the independence and accuracy of signal transmission.

[0038] Also includes spacing rules (Spacing - Rules): In addition to the metal line spacing mentioned above, it also includes spacing rules between different functional modules. For example, in order to avoid electromagnetic interference between analog modules and digital modules, the minimum distance between them will be specified. At the same time, within the same functional module, there are also spacing requirements between different physical structures, such as the spacing between transistors and capacitors, to ensure that they do not affect each other during operation.

[0039] The above is the specific database information (DB Information): one of the important files delivered from the customer, which contains various detailed data descriptions related to the chip layout database. It also includes the Mask Generation Table: a document that guides the planning of mask production, and clarifies the specifications and requirements required for mask generation.

[0040] Others include related documents: some other auxiliary or supplementary documents related to chip layout, design, etc., such as electrical parameters: including electrical parameters of each chip component, such as the threshold voltage of the transistor, the on-resistance, the capacitance of the capacitor, the resistance of the resistor, etc. These electrical parameters directly affect the performance of the chip, such as the working speed and power consumption of the chip. For example, by adjusting the threshold voltage of the transistor, the working current of the chip can be controlled, thereby affecting the balance between the power consumption and speed of the chip. For the power network in the chip, parameters such as power supply voltage, power supply current, and isolation requirements between different power domains will be recorded to ensure that each part of the chip can stably obtain the required power supply. And some process parameters: parameters related to the chip manufacturing process, such as the resolution of lithography, the depth control parameters of etching, etc. These parameters need to be strictly controlled during the chip manufacturing process. The main chip layout database records these parameters to provide accurate operating basis for manufacturing equipment. For example, parameters such as exposure dose and focal length in the lithography process will be adjusted according to the set values ​​in the database to ensure that the chip layout can be accurately copied to the silicon wafer.

[0041] The customer engineering department plans mask processing based on the information obtained from the main chip layout database and the specifications provided by the chip factory, clarifies mask requirements and issues data release notices. Reticle Tooling planning refers to the overall planning of mask processing based on the contents of the received mask generation table and other files, and determines the processing steps, sequence, process points and other arrangements. And mask molding requirements (Reticlerequisition): clarify the specific requirements for masks in terms of quantity, type, accuracy and other aspects during the chip manufacturing process, and form corresponding documents. Data Release Notice is issued for the above data: it is used to inform subsequent links which data are already available or have been officially released, ensuring that each department obtains and uses the corresponding data at the right time.

[0042] What the chip manufacturer provides are data tables and design rules: they clearly define the various rules that need to be followed in the chip design process, such as wiring rules, component layout rules, etc., to ensure the performance and manufacturability of the chip, as well as specifying mask grades: according to the different functional requirements, accuracy requirements and other factors of the chip, determine the mask grade required for each part.

[0043] At this time, based on the data obtained from the above two data sources, the unit merger and the design rule inspection and cleaning judgment are carried out. If the unit merger and the design rule inspection and cleaning are completed, they are sent directly to the mask data engineering department, combined with the mask grade specifications and mask-related quality specifications provided by the mask factory, to generate source files and conversion data files recorded in the metadata structured shell. When it is determined that the unit merger and design rule inspection and cleaning process is not completed, the layout merger and design rule inspection are carried out through the design service and product department; after the layout merger and rule inspection are completed, it is placed in the metadata database, and a data release / revision notice is issued, and the data is sent to the mask data engineering department, combined with the mask grade specifications and mask-related quality specifications provided by the mask factory, to generate source files and conversion data files recorded in the metadata structured shell.

[0044] In the mask data engineering department, the field layout is generated according to the acquired data. Field layout generation is the technical focus of the present invention. According to the relevant files such as the chip layout transmitted previously, the layout structure of the field on the mask is generated, and the specific patterns and functional divisions of different areas on the mask are determined, providing a detailed layout basis for the subsequent specific steps of mask production.

[0045] It specifically includes the division of functional areas: For processor chips, this includes the CPU core area. Within this area, sub-areas such as instruction decoding units, arithmetic logic units (ALUs), and register stacks are divided. For example, the ALU area is further subdivided according to its operation functions (such as addition, multiplication, etc.) to ensure that the layout of different operation units is reasonable to reduce signal transmission delays. For memory chips, such as DRAM, the memory cell array area is divided. This area is composed of a large number of memory cells (such as memory cells composed of capacitors and transistors), and there will be peripheral circuit areas such as row decoders and column decoders for reading and writing memory cells.

[0046] For the input / output (I / O) area: including the physical areas corresponding to various interface pins, such as the chip's power pins, ground pins, data input and output pins, etc. The layout of these pins needs to take into account factors such as signal integrity and electromagnetic compatibility. For example, high-speed data interface pins will be placed in an area close to the edge of the chip and well isolated from each other to reduce signal reflection and crosstalk. There will also be buffer circuit areas for connecting the chip's internal functional modules and external devices, such as input buffers and output buffers, and their layout should facilitate the effective transmission of signals and the adaptation of driving capabilities.

[0047] For auxiliary functional area: including clock generation and distribution circuit area. Clock signal is the key to normal operation of the chip. The layout of this area should ensure that the clock signal can be evenly and quickly distributed to each required functional module. For example, a tree-shaped or mesh-shaped clock distribution network will be used, and its layout in the chip will be optimized according to the location of the functional module and the load requirements of the clock signal.

[0048] There is also a test circuit area for functional testing and fault diagnosis after chip manufacturing. The layout of these test circuits should facilitate the injection of test signals and the collection of test results without affecting the normal function of the chip.

[0049] After the area is divided, the pattern is generated and arranged. According to the requirements of the chip design, the specific layout pattern in each functional area is generated. Taking the transistor as an example, when generating the field layout, the pattern shape and size of the transistor's active area, gate, etc. will be determined. For metal wiring, the detailed pattern of each metal wire's direction, bending angle, connection method, etc. will be determined. These patterns are generated based on the layout information in the main chip layout database and combined with the requirements of the manufacturing process.

[0050] For some special structures, such as the via patterns between multi-layer metal interconnects in a chip, they will be designed based on the connection relationship between metal layers and electrical performance requirements. The size, shape, and distribution density of the vias will be determined during the field layout generation process to ensure good electrical connections between different metal layers.

[0051] The pattern arrangement follows certain symmetry and repetitive rules. In some chip functional modules, such as memory cell arrays, memory cells are arranged in a certain matrix form. This regular arrangement helps improve chip manufacturing efficiency and performance stability. For example, in DRAM chips, memory cells are arranged in rows and columns, and the spacing and alignment between rows and columns must comply with design rules and manufacturing process requirements.

[0052] At the same time, the relative position relationship between different patterns should be considered to avoid short circuits and interference. For example, in the analog circuit area of ​​the chip, it is necessary to ensure that the analog signal routing is kept at a sufficient distance from the digital signal routing, and the layout is carried out according to certain shielding rules to prevent digital signals from interfering with analog signals.

[0053] It is also necessary to adapt the lithography field division and layout one by one. The basis for the division of the lithography field is to divide the entire field layout of the chip into multiple lithography fields according to the exposure area size and accuracy requirements of the lithography equipment. The size and shape of the lithography field are usually determined by the technical parameters of the lithography equipment. For example, for a common lithography equipment, its exposure field may be a square area with a side length of tens of millimeters. When the field layout is generated, the chip layout needs to be reasonably divided according to this size. Considering the complexity of the chip layout and the requirements of the manufacturing process, the division of the lithography field may also be combined with the functional areas of the chip. For example, try to divide a complete functional module (such as a small processor sub-module) into one lithography field to reduce the errors and performance impact that may occur when splicing different lithography fields.

[0054] The layout adaptation strategy is to adapt the layout of the chip layout within each lithography field. This includes adjusting the position and size of the pattern to ensure that the pattern can be accurately transferred to the silicon wafer during the lithography process. For example, for patterns close to the edge of the lithography field, appropriate scaling or offset may be performed to compensate for pattern deformation caused by edge effects during the lithography process.

[0055] It is also necessary to consider the stitching strategy between different lithography fields. In the intersection area of ​​adjacent lithography fields, some special alignment marks and stitching patterns will be designed to achieve precise alignment and stitching during the lithography process to ensure the integrity and accuracy of the entire chip layout.

[0056] In the process of generating the field layout, RDDS data entry is required: the relevant RDDS data is input, and data fracturing is performed: the received relevant data is segmented. This provides the mask production system with necessary data support so that it can accurately produce masks according to design requirements.

[0057] Job Deck View: This is a preview of the mask pattern on a computer screen before the mask is made in the mask exposure machine. This helps to find possible errors in computer graphics conversion before the actual mask exposure costs are incurred.

[0058] Mask Tooling Information: Contains various process information involved in the mask processing, such as the processing equipment parameters used, the specific time schedule of the processing steps, etc., providing detailed guidance for the actual mask processing operations.

[0059] Finally, save the source files and converted data files (Save Source and Converted Data File.Doc.): Save the source files involved in the mask production process and the related data files after conversion to facilitate subsequent tracing, review and possible further optimization, ensuring the data integrity and traceability of the entire mask production process.

[0060] When making a mask, the local device obtains the metadata structured shell from the metadata database; the environment adaptation layer in the metadata structured shell identifies the operating system of the local device and automatically configures it; the local device uploads customer information, compares the obtained customer information with the customer information in the shell layer to confirm the identity of the local device, and after confirming the identity, selects the corresponding mask molding data deployment system from the mask molding data deployment system directory, and uses the mask molding data deployment system to decode the open source file into device data and software data that can be recognized by the local device, uses the obtained device data to configure the device, and uses the obtained software data to make a mold. Figure 3 As shown, when the mask mold making data deployment system parses the corresponding source file, the metadata database is connected to the mask mold making data deployment system, and the mask mold making data deployment system obtains the corresponding source file according to the conversion data file. The mask mold making data deployment system at least includes: a database management system, a plate making information processing system, a mask design completion management system, and a mask import management system; the database management system includes a mask mold making login system and a mask mold making typesetting planning system; the mask mold making typesetting planning system is connected to the plate making information processing system, and the plate making information processing system is connected to the mask data processing system and Platemaking specification management system; in the platemaking information processing system, the source file is parsed into equipment data and software data, the platemaking information processing system is connected to the mask design manuscript management system, and the mask design manuscript management system is connected to the mask import management system; the software data after the standardized information format is output in the metadata database: read the platemaking information in different formats, and decompose the platemaking information into meta-mold data and meta-mask information; meta-mold data includes layout frame information and component mold information; meta-mask information includes product code and production line information; and mask layer information that belongs to both meta-mold data and meta-mask information. Data and optical compensation information, data file description table and layout diagram are formed in the mask import management system, and the mask import management system is connected to the mask data processing system through the process integration module.

[0061] like Figure 4 As shown, the software data in the standardized information format is output in the metadata database: platemaking information in different formats is read, and the platemaking information is decomposed into meta-mold data and meta-mask information; meta-mold data includes layout frame information and component mold information; meta-mask information includes product code and production line information; and mask layer information that belongs to both meta-mold data and meta-mask information. The layout frame information includes data frame layout information, test component information on the cutting line, and single modular test component information; the data frame layout information is repackaged and encrypted after acquisition, and the encrypted file adds the work file frame GDSII and CD map label. The data source after the standardized information format is paper platemaking data or electronic file, and the paper platemaking data is manually input into the metadata database. Data and optical compensation information, data file description table and layout diagram are formed in the mask import management system. The mask import management system is connected to the mask data processing system through the process integration module. The mask mold making data deployment system generates a Boolean operation script file for mask data processing. The Boolean operation format and syntax of the Boolean operation script file are similar to: FINAL = ((Operand-1)|(Operand-2 {operator Operand-2}*)) Operator = (AND|OR|NOT|XOR|…) Operand-1 = {REVERSE}* Pattern Operand-2 = Pattern {(SIZING value)*|(SCALE value)|(ORIENTATIONvalue)}* Pattern = (Layers|MEBES|OASIS.MASK|CFLT|CREF) Layers = {[DB#]}*L(ID){( <space>{[DB#]}*L(ID))+}* ID = (0-9)+{(,0-9)+}*{;(0-9)+{(,0-9)+}*}*.

[0062] The Boolean operation command file for mask data processing is used to create a specific command file combined with the form. For example: General Information for Mask Tooling ********************************************************************* STEPPER: ASML Magnification: 1X FLOW: F1001BIWT Unit:MM PROCESS : BIM35WET ORDER : 9876543 OPIMIZED ARRAY = 8 X 5 FIELD STEP SIZE X = 25.92000 Y = 27.90000 FIELD EXPOSURE SIZE X = 26.00000 Y = 27.98000 FIELD LAYOUT COORDINATES XLB = -13.00000 YLB = -14.86500 XLT = -13.00000 YLT = 13.11500 XRB = 13.00000 YRB = -14.86500 XRT = 13.00000 YRT = 13.11500 ARRAY OFFSET X = 0.000000 Y = -0.875000 ********************************************************************* 1)MAIN CHIP CODE: 9876543 2) LAYOUT WINDOW SIZE: X = 3.160000 Y = 5.500000 3) STREET WIDTH X = 0.080000 Y = 0.080000 4) CHIP SIZE X = 3.240000 Y = 5.580000 5) POSITION LIST : (1X) CHIP NAME X-COODINATE Y-COODINATE =========== ============= ============= MAINCHIP_0_8 -11.340000 -12.035000 MAINCHIP_0_8 -8.100000 -12.035000 MAINCHIP_0_8 -4.860000 -12.035000 MAINCHIP_0_8 -1.620000 -12.035000 MAINCHIP_0_8 1.620000 -12.035000 MAINCHIP_0_8 4.860000 -12.035000 MAINCHIP_0_8 8.100000 -12.035000 MAINCHIP_0_8 11.340000 -12.035000 MAINCHIP_1_8 -11.340000 -6.455000 MAINCHIP_1_8 -8.100000 -6.455000 MAINCHIP_1_8 -4.860000 -6.455000 MAINCHIP_1_8 -1.620000 -6.455000 MAINCHIP_1_8 1.620000 -6.455000 MAINCHIP_1_8 4.860000 -6.455000 MAINCHIP_1_8 8.100000 -6.455000 MAINCHIP_1_8 11.340000 -6.455000 MAINCHIP_2_8 -11.340000 -0.875000 MAINCHIP_2_8 -8.100000 -0.875000 MAINCHIP_2_8 -4.860000 -0.875000 MAINCHIP_2_8 -1.620000 -0.875000 …” like Figure 2 As shown, the mask factory is actually the final user of the metadata structured shell of the present invention. On the one hand, it provides data for generating the metadata structured shell. The data provided here include mask grade specifications (Mask Grade Spec.): according to the specified mask grade and other related documents transmitted from the previous link, the specific grade specifications of the mask are further refined and determined, so as to guide the process selection, quality control and other aspects in the mask production process.

[0063] There are also mask incoming and outgoing quality specifications (Mask - Incoming & Outgoing QC Spec.): formulate quality inspection specifications for masks during incoming and outgoing materials, clarify various quality indicators, inspection methods, etc., to ensure that the masks meet the corresponding quality requirements when entering the factory and when shipped after production, and to ensure the quality stability of the mask link in the entire chip manufacturing chain.

[0064] On the other hand, after receiving the files delivered by the mask data engineering, mask making is carried out: according to the data and specifications provided by all the previous links, the actual mask making work is carried out, and the designed mask layout is converted into an actual mask product through a series of complex processes such as lithography and etching.

[0065] The finished masks are subjected to mask incoming quality control (Reticle Incoming QC) (IQC): The incoming masks entering the factory are subjected to quality control. According to the pre-set quality specifications, various testing methods are used to check whether the masks meet the requirements, prevent masks with quality problems from entering the production process, and ensure the basic quality of subsequent chip manufacturing.

[0066] In fact, it is necessary to combine the chip factory's mask control system to conduct mask final inspection (Reticle Final Inspection): After the mask is produced, the final inspection is carried out to comprehensively check the various quality indicators of the mask to ensure that it fully meets the design requirements and quality standards. Only masks that pass the final inspection can be used in subsequent chip manufacturing processes to ensure the quality and performance of chip manufacturing. Figure 5 is the single-layer mask structure obtained, and Figure 6 Shown are the multi-layer masks that are finally generated one by one for chip manufacturing. Figure 6 The mask structure in is a conventional chip mask structure, so it will not be described in detail here. However, it should be noted that for the same chip, the design factory will design it first. This design process is to design the metal layer first according to the instructions, and then design the entire semiconductor device from the metal layer, and finally integrate the metal layer information with the semiconductor device information into the work file's frame GDSII file. And the work file's frame GDSII is shelled. The mask factory obtains information from the document and makes the mask based on the information. Through such a series of sequential department collaboration, file transfer and operation processes, the complete chip manufacturing related links from the initial chip layout data to the final mask production are realized.

[0067] Although the present invention is disclosed as above with preferred embodiments, it is not intended to limit the scope of the present invention. Any person of ordinary skill in the art can make some improvements without departing from the scope of the invention of the present invention, that is, all equivalent improvements made in accordance with the present invention should be covered by the scope of the present invention. In the description of this specification, the description of reference terms "an embodiment / mode", "some embodiments / modes", "examples", "specific examples", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment / mode or example are included in at least one embodiment / mode or example of the present application. In this specification, the schematic representation of the above terms does not necessarily target the same embodiment / mode or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments / modes or examples in a suitable manner. In addition, in the absence of mutual contradiction, a person of ordinary skill in the art can combine and combine the different embodiments / modes or examples described in this specification and the features of the different embodiments / modes or examples.

[0068] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0069] Those skilled in the art should understand that the above embodiments are only for the purpose of clearly illustrating the present disclosure, and are not intended to limit the scope of the present disclosure. For those skilled in the art, other changes or modifications may be made based on the above disclosure, and these changes or modifications are still within the scope of the present disclosure.< / space>

Claims

1. A system for automatically generating photomask pattern data, characterized in that: The method includes making a metadata structured shell, and establishing a corresponding metadata database based on the made metadata structured shell; the metadata structured shell consists of a shell layer, a core layer and an environment adaptation layer, wherein the shell layer stores customer information and a mask molding data deployment system directory, while the core layer is provided with specific source files and a mask molding data deployment system, and the environment adaptation layer has an interface interconnected with a corresponding operating system, thereby ensuring that the metadata structured shell can be recognized by the corresponding operating system.

2. A photomask pattern data automatic generation system as claimed in claim 1, characterized in that: The specific steps for making the metadata structured shell are as follows: the system accesses the main chip layout database provided by the customer, obtains the database information, mask generation table and related files for auxiliary work provided by the customer from the main chip layout database and gives them to the customer's engineering department; the customer's engineering department plans the mask processing based on the information obtained from the main chip layout database and the specifications provided by the chip factory, clarifies the mask requirements and issues a data release notification. At this time, the data obtained from the above two data sources are used to check and clean the unit merger and design rules. If the unit merger and design rule inspection and cleaning are completed, they are sent directly to the mask data engineering department, combined with the mask grade specifications provided by the mask factory and the mask-related quality specifications, to generate the source files and conversion data files recorded in the metadata structured shell.

3. A photomask pattern data automatic generation system as claimed in claim 2, characterized in that: When it is determined that the unit merging and design rule checking and cleaning process is not completed, the layout merging and design rule checking are carried out through the design service and product department; after the layout merging and rule checking are completed, it is placed in the metadata database, and a data release / revision notice is issued, and the data is sent to the mask data engineering department. Combined with the mask grade specifications provided by the mask factory and the mask-related quality specifications, the source files and conversion data files recorded in the metadata structured shell are generated.

4. A system for automatically generating photomask pattern data as claimed in claim 2, characterized in that: In the mask data engineering department, the field layout is generated based on the acquired data. During the generation process of the field layout, data input and data segmentation of the mask molding data deployment system are required, and finally the workbench view is presented. The mask processing information is determined based on the workbench view, and the mask processing information is saved in the source file and the conversion data file respectively.

5. The system for automatically generating photomask pattern data according to claim 2, characterized in that: The specifications provided by the chip factory include at least bias tables, design rules, and specified mask level information.

6. A method for using a photomask pattern data automatic generation system, characterized in that: When making a mask, the local device obtains the metadata structured shell from the metadata database; The environment adaptation layer in the metadata structured shell identifies the operating system of the local device and automatically configures it; the local device uploads customer information, and compares the acquired customer information with the customer information in the shell layer to confirm the identity of the local device. After the identity is determined, the corresponding mask molding data deployment system is selected from the mask molding data deployment system directory, and the open source file is decoded by the mask molding data deployment system into device data and software data that can be recognized by the local device, and the acquired device data is used to configure the device, and the acquired software data is used for molding.

7. A system for automatically generating photomask pattern data as claimed in claim 6, characterized in that: When the mask mold making data deployment system parses the corresponding source file, the metadata database is connected to the mask mold making data deployment system, and the mask mold making data deployment system obtains the corresponding source file according to the conversion data file. The mask mold making data deployment system at least includes: a database management system, a plate making information processing system, a mask design completion management system, and a mask import management system; the database management system includes a mask mold making login system and a mask mold making typesetting planning system; the mask mold making typesetting planning system is connected to the plate making information processing system, and the plate making information processing system is connected to the mask data processing system and the plate making information processing system. Plate specification management system; parsing source files into equipment data and software data in the plate making information processing system, connecting the plate making information processing system to the mask design manuscript management system, and connecting the mask design manuscript management system to the mask import management system; outputting software data in a standardized information format in the metadata database: reading plate making information in different formats, and decomposing the plate making information into meta-molding data and meta-mask information; meta-molding data including typesetting frame information and component molding information; meta-mask information including product code and production line information; and mask layer information belonging to both meta-molding data and meta-mask information.

8. The photomask pattern data automatic generation system according to claim 7, characterized in that: Data and optical compensation information, a data file description table and a layout diagram are formed in the mask import management system, and the mask import management system is connected to the mask data processing system through a process integration module.

9. The photomask pattern data automatic generation system according to claim 7, characterized in that: The layout frame information includes data frame layout information, test component information on the cutting line, and single modular test component information; After the data layout information is acquired, it is repackaged and encrypted, and the encrypted file is added with the layout GDSII of the working file and the CD image label.

10. The photomask pattern data automatic generation system according to claim 9, characterized in that: The mask factory uses the work file's frame GDSII and CD image label to produce masks. The mask control system in the mask factory monitors the production process and performs incoming material quality control and final inspection on the masks.

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