A device for generating differential signal traces of an SMD high-speed connector

Abstract

The application discloses a kind of SMD high-speed connector differential signal wire generation device, obtain the component requirement information of high-speed connector, obtain the via requirement information of high-speed signal via, differential signal wire is divided into fixed several section line segment, and the parameter of each line segment is set, the parameter of each line segment of differential signal wire, component requirement information, via requirement information is substituted into simulation program, input simulation requirement, obtain simulation result, according to simulation result analysis obtains the parameter of each line segment of differential signal wire, component requirement information, via requirement information, call the function module of PCB design program, automatically generate differential signal wire.The application provides a kind of SMD high-speed connector differential signal wire generation device, greatly reduce the workload of PCB designer, improve the generation efficiency of differential signal wire and the precision of differential signal wire.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of PCB design, more particularly, to a device for generating differential signal traces of SMD high-speed connectors. BACKGROUND

[0002] SMD (Surface Mount Device) high-speed connectors are components used for fast and efficient data transmission between electronic devices, commonly used in computers, communication devices and other high-performance electronic systems to achieve high-speed data exchange. The characteristics of SMD connectors are that they can be directly mounted on the surface of a printed circuit board (PCB), rather than the traditional through-hole mounting method, which makes SMD connectors more compact, saves space, and facilitates automation production. SMD high-speed connectors are widely used in various high-speed data transmission interfaces such as LVDS, IEEE1394 and USB2.0, which usually require high data transmission rate and low bit error rate, and SMD high-speed connectors are the ideal choice to meet these requirements.

[0003] High-speed differential signals are signals transmitted on two parallel wires, which are called differential pairs. This signal transmission method has the advantages of strong anti-interference ability and good noise immunity, so it is very suitable for high-speed data transmission. In SMD high-speed connectors, differential signals can effectively reduce electromagnetic interference and improve signal integrity and reliability.

[0004] In the prior art, the differential signal traces of high-speed connectors are mostly laid out by manual drawing, which results in a large workload for PCB designers and errors in manual operation, and the precision of the drawn differential signal traces is low, which makes the PCB design efficiency low and the quality poor. SUMMARY

[0005] In order to solve the problem of manual drawing of differential signal traces of existing high-speed connectors, the present application provides a device for generating differential signal traces of SMD high-speed connectors, which greatly reduces the workload of PCB designers and improves the generation efficiency and precision of differential signal traces.

[0006] The technical scheme of the present application is as follows:

[0007] A device for generating differential signal traces of SMD high-speed connectors,

[0008] obtaining component requirement information of the high-speed connector,

[0009] obtaining via requirement information of the high-speed signal via,

[0010] dividing the differential signal traces into a fixed number of line segments and setting parameters of each line segment,

[0011] The parameters of each line segment of the differential signal trace, component requirement information, via requirement information are substituted into the simulation program, simulation requirements are input, and simulation results are obtained,

[0012] According to the simulation results, the parameters of each line segment of the differential signal trace, component requirement information, via requirement information are obtained, and a function module of a PCB design program is called to automatically generate the differential signal trace.

[0013] The differential signal trace generation device of the SMD high-speed connector, the parameters of each line segment of the differential signal trace include line width, arc radius, starting point coordinates, ending point coordinates, and arc direction.

[0014] The differential signal trace generation device of the SMD high-speed connector, the simulation program simulates the internal equal length and impedance balance of the differential signal trace.

[0015] The internal equal length of the differential signal trace refers to the lengths of the two differential signal traces in a differential pair should be as equal as possible. Since differential signals are transmitted through a pair of wires, the signal on one wire is the inverted version of the signal on the other wire. To ensure that both signals reach the receiving end at the same time and maintain the correct phase relationship with each other, the electrical lengths of the two traces must be the same. If the lengths are not consistent, it will cause a time delay difference between the signals, which will affect the quality of the signals and cause the so-called "skew" problem, which may cause data errors or reduce the overall performance of the system.

[0016] Impedance balance of the differential signal trace refers to the two differential signal traces in a differential pair need to have the same characteristic impedance. Characteristic impedance is a parameter related to signal transmission lines, which determines the voltage-to-current ratio when the signal propagates along the line. Unbalanced impedance will cause signal reflection, increase signal distortion, and affect signal quality. In addition, unbalanced impedance may also cause an increase in common-mode to differential-mode noise, further affecting signal integrity. To achieve impedance balance, PCB designers usually use specific layout rules, such as controlling trace width, spacing, and distance from the reference plane, etc.

[0017] The differential signal trace generation device of the SMD high-speed connector, the line segment shape and structure of the differential signal trace are preset, so that only the parameters of the line segment of one differential signal trace and the position-related parameters of the line segments of the remaining differential signal traces are in an undetermined state.

[0018] Thus, during the simulation program running, the simulation content only includes the positions of the differential signal traces and the parameters of the line segments of a differential signal trace, and the line segment of the differential signal trace is limited by the fixed parameters (such as line width, arc radius, and arc direction) of the line segments of the remaining differential signal traces, so that the parameter variation range of the line segment of the differential signal trace in the undetermined state is limited, the workload of the simulation is reduced, the simulation speed is accelerated, and the efficiency of the PCB design is improved.

[0019] Due to the preset differential signal trace line segment, the related parameter data of the preset differential signal trace line segment form a fixed data packet, during the generation of the differential signal trace, the generation device calls the content of the fixed data packet, replaces the data in the undetermined state in the fixed data packet with the simulation result data, calls the preset function module of the PCB design program, and generates the differential signal trace according to the content of the newly composed data packet.

[0020] The generation device of the differential signal trace of the SMD high-speed connector described above, the component requirement information includes position information and model information of the high-speed connector.

[0021] The generation device of the differential signal trace of the SMD high-speed connector described above, the via requirement information includes position information of the high-speed signal via.

[0022] The generation device of the differential signal trace of the SMD high-speed connector described above, the differential signal trace is two parallel PCB traces,

[0023] The differential signal trace is divided into six segments, and the differential signal trace includes a differential trace zero line segment, a differential trace first line segment, a differential trace second line segment, a differential trace third line segment, a differential trace fourth line segment, and a differential trace fifth line segment, and the ends of the two line segments in any one segment of the differential trace line segment are flush,

[0024] The differential trace zero line segment, the differential trace first line segment, the differential trace second line segment, the differential trace third line segment, the differential trace fourth line segment, and the differential trace fifth line segment are connected in the above order,

[0025] The end point of the differential trace zero line segment is connected with the high-speed signal via, and the end point of the differential trace fifth line segment is connected with the high-speed signal pad of the high-speed connector.

[0026] Further, one of the ground vias of the ground pads of the high-speed connector is located on the axis of symmetry of the two differential signal traces.

[0027] Further, the connection point of the differential trace fourth line segment and the differential trace fifth line segment, and the ground via of the ground pad of the high-speed connector are located on the same straight line.

[0028] Further, the fifth line segment of the differential trace is a straight line segment connecting the high-speed signal pad,

[0029] The fourth line segment of the differential trace connects the fifth line segment of the differential trace and tends to converge,

[0030] The third line segment of the differential trace is a transition line segment between the fourth line segment of the differential trace and the second line segment of the differential trace,

[0031] The second line segment of the differential trace is a variable line segment, and the second line segment of the differential trace is affected by the simulation result,

[0032] The zeroth line segment of the differential trace is a lead-out line segment from the high-speed signal via hole,

[0033] The first line segment of the differential trace is a transition line segment between the second line segment of the differential trace and the zeroth line segment of the differential trace.

[0034] Further, four ground vias are arranged around the high-speed signal via hole, and the ground vias are arranged in a quadrilateral top corner structure.

[0035] Further, the ground pads of the high-speed connector are arranged side by side with the high-speed signal pads of the high-speed connector, and the ground vias are arranged near one end of the high-speed signal pads.

[0036] Further, a ground via is arranged on the central axis between the ground pads of the high-speed connector, and the connection points of the ground via and the fourth line segment of the differential trace and the fifth line segment of the differential trace are located on the same straight line.

[0037] Further, the high-speed connector is an axisymmetric structure.

[0038] Further, the differential signal trace is an axisymmetric structure.

[0039] Further, the distance between the two PCB traces of the second line segment of the differential trace is smaller than the distance between the line segments of all other differential signal traces.

[0040] According to the above-mentioned scheme, the present application has the beneficial effects that,

[0041] 1. Simplify the design content of the differential signal trace, and automatically complete the wiring of the differential signal trace according to the input or the PCB design completed in the previous step, greatly reduce the workload of the designer, improve the efficiency of the PCB design, and reduce errors.

[0042] 2. The differential signal trace is combined with the simulation, so that the simulation result is directly used as the design requirement information of the differential signal trace, and the differential signal trace is automatically generated according to the preset differential signal trace design structure, simplifying the PCB design.

[0043] 3. The preset differential signal wire structure makes the structure of the differential signal wire standardized and normalized, facilitating identification and subsequent inspection and confirmation. BRIEF DESCRIPTION OF DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort based on these drawings.

[0045] Figure 1 Schematic diagram of the differential signal wire layout structure of the present application Figure 1 .

[0046] Figure 2 Schematic diagram of the differential signal wire layout structure of the present application Figure 2 .

[0047] Figure 3 Schematic diagram of the differential signal wire layout structure of the present application Figure 3 .

[0048] In the drawings, various reference signs represent:

[0049] 01. first end point; 02. second end point; 03. third end point; 04. fourth end point; 05. fifth end point; 06. sixth end point; 07. seventh end point; 08. eighth end point; 09. ninth end point;

[0050] 10. first differential signal wire zeroth segment; 11. first differential signal wire first segment; 12. first differential signal wire second segment; 13. first differential signal wire third segment; 14. first differential signal wire fourth segment; 15. first differential signal wire fifth segment;

[0051] 20. second differential signal wire zeroth segment; 21. second differential signal wire first segment; 22. second differential signal wire second segment; 23. second differential signal wire third segment; 24. second differential signal wire fourth segment; 25. second differential signal wire fifth segment;

[0052] 31. ground pad; 32. high-speed signal pad. DETAILED DESCRIPTION

[0053] In order to make the technical problems to be solved by the present application, technical solutions and beneficial effects more clearly understood, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0054] The application discloses a device for generating differential signal traces of an SMD high-speed connector, which obtains component requirement information of the high-speed connector, obtains via requirement information of high-speed signal vias, divides the differential signal traces into fixed segments, sets parameters of each segment, inputs the parameters of each segment of the differential signal traces, the component requirement information and the via requirement information into a simulation program, inputs simulation requirements, obtains simulation results, analyzes the parameters of each segment of the differential signal traces, the component requirement information and the via requirement information according to the simulation results, and automatically generates the differential signal traces by calling a function module of a PCB design program.

[0055] The application performs graphic analysis on a high-speed differential signal wiring design graph, converts the differential signal traces into an analysis formula which can be calculated, and contains parameters of each segment in the analysis formula.

[0056] The generated differential signal traces are as shown in the figure. Figure 1 The application divides the differential signal traces into six segments, and for two pairs of differential signal traces, there are six groups of differential segments, and the end portions of each group of segments are flush.

[0057] The first differential signal trace is the left trace in the figure. Figure 1 The first differential signal trace includes a first differential signal trace first segment 11, a first differential signal trace second segment 12, a first differential signal trace third segment 13, a first differential signal trace fourth segment 14, a first differential signal trace fifth segment 15 and a first differential signal trace zeroth segment 10. The first differential signal trace zeroth segment 10 is connected with the first differential signal trace first segment 11, and the connection point therebetween is a first connection point of the differential signal traces. The first differential signal trace first segment 11 is connected with the first differential signal trace second segment 12, and the connection point therebetween is a second connection point of the first differential signal trace. The first differential signal trace second segment 12 is connected with the first differential signal trace third segment 13, and the connection point therebetween is a third connection point of the first differential signal trace. The first differential signal trace third segment 13 is connected with the first differential signal trace fourth segment 14, and the connection point therebetween is a fourth connection point of the first differential signal trace. The first differential signal trace fourth segment 14 is connected with the first differential signal trace fifth segment 15, and the connection point therebetween is a fifth connection point of the first differential signal trace.

[0058] The second differential signal trace is as shown in the figure. Figure 1The second differential signal trace includes a second differential signal trace first segment 21, a second differential signal trace second segment 22, a second differential signal trace third segment 23, a second differential signal trace fourth segment 24, a second differential signal trace fifth segment 25, and a second differential signal trace zeroth segment 20. The second differential signal trace zeroth segment 20 is connected to the second differential signal trace first segment 21, and the connection point therebetween is a differential signal trace first connection point. The second differential signal trace first segment 21 is connected to the second differential signal trace second segment 22, and the connection point therebetween is a second differential signal trace second connection point. The second differential signal trace second segment 22 is connected to the second differential signal trace third segment 23, and the connection point therebetween is a second differential signal trace third connection point. The second differential signal trace third segment 23 is connected to the second differential signal trace fourth segment 24, and the connection point therebetween is a second differential signal trace fourth connection point. The second differential signal trace fourth segment 24 is connected to the second differential signal trace fifth segment 25, and the connection point therebetween is a second differential signal trace fifth connection point.

[0059] The position of the high-speed connector is fixed, and the ground pad 31 and the high-speed signal pad 32 of the high-speed connector are fixed in position. The high-speed signal pad 32 is connected to the fifth segment of the differential signal trace, i.e., the first differential signal trace fifth segment 15 is connected to the high-speed signal pad 32 on the left side of the high-speed connector, and the second differential signal trace fifth segment 25 is connected to the high-speed signal pad 32 on the right side of the high-speed connector. On the other hand, the top end point of the ground pad 31 of the high-speed connector, i.e., the first ground via and the second ground via of the high-speed connector, and the midpoint of the line connecting the first ground via and the second ground via are provided with a third ground via. The first ground via is the fifth end point 05, the third ground via is the sixth end point 06, and the second ground via is the seventh end point 07. The position of the high-speed connector is fixed, so that the positions of the ground pad 31 and the high-speed signal pad 32 are fixed. In the actual design process, the size and dimensions of the pads of the high-speed connector are also fixed values, i.e., the positions of the first ground via, the second ground via, and the third ground via are fixed (meaning that the X and Y coordinate values are fixed), which also means that the positions and coordinate values of the fifth end point 05, the sixth end point 06, and the seventh end point 07 are fixed. When the position and model of the high-speed connector are input during design, the coordinate values of the fifth end point 05, the sixth end point 06, and the seventh end point 07 can be obtained (if only the position of the high-speed connector is determined, i.e., only the X value of the fifth end point 05, the sixth end point 06, and the seventh end point 07 is determined, the Y value is affected by the model and size of the high-speed connector and is not determined, wherein the X coordinate of the sixth end point 06 is the X coordinate of the midpoint of the high-speed connector).

[0060] The high-speed connector is connected with high-speed signal vias through differential signal traces, and two high-speed signal vias are connected with the high-speed signal pads 32 of the high-speed connector through the first differential signal trace and the second differential signal trace respectively. Four ground vias distributed as the top corners of a quadrilateral are arranged around the two high-speed signal vias. The high-speed signal via on the left side is the eighth end point 08, the high-speed signal via on the right side is the ninth end point 09, and the four ground vias are the first end point 01, the second end point 02, the third end point 03 and the fourth end point 04 respectively. The first end point 01 is located at the upper left, the second end point 02 is located at the upper right, the third end point 03 is located at the lower left, and the fourth end point 04 is located at the lower right. According to the PCB design requirements, the positions of the high-speed signal vias and the ground vias around them depend on the PCB design diagram, which means that the positions of the high-speed signal vias and the ground vias around them are fixed when determining the differential signal traces, which are known conditions.

[0061] According to the above structural features, for each figure, the coordinates and parameter information in the PCB design software are as follows.

[0062] For each line segment of the differential signal trace, the parameters include line width, radius of curvature (zero value for straight line), starting point coordinates, end point coordinates, and arc direction (i.e. clockwise direction is positive direction).

[0063] For the pair of differential signal traces, the axes of the differential signal traces pass through the sixth end point 06.

[0064] According to the figure features, the two ends of the third segment of the differential signal trace are tangent to the second segment of the differential signal trace and the fourth segment of the differential signal trace respectively, the first segment of the differential signal trace is tangent to the zeroth segment of the differential signal trace and the second segment of the differential signal trace respectively, in other words, one end of the third line segment 13 of the first differential signal trace is tangent to the fourth line segment 14 of the first differential signal trace, the other end of the third line segment 13 of the first differential signal trace is tangent to the second line segment 12 of the first differential signal trace, one end of the first line segment 11 of the first differential signal trace is tangent to the second line segment 12 of the first differential signal trace, the first differential signal trace is tangent to the zeroth line segment 10 of the first differential signal trace, one end of the third line segment 23 of the second differential signal trace is tangent to the fourth line segment 24 of the second differential signal trace, the other end of the third line segment 23 of the second differential signal trace is tangent to the second line segment 22 of the second differential signal trace, one end of the first line segment 21 of the second differential signal trace is tangent to the second line segment 22 of the second differential signal trace, and the second differential signal trace is tangent to the zeroth line segment 20 of the second differential signal trace.

[0065] In addition, the fifth segment of the differential signal trace should be connected with the high-speed signal pad 32 of the high-speed connector, and other parts of the differential signal trace should be arranged above the ground pad 31 of the high-speed connector, so that the connection point of the fourth segment of the differential signal trace and the fifth segment of the differential signal trace should be flush with the ground via of the high-speed connector, that is, the Y coordinate value of the connection point of the fourth segment 14 of the first differential signal trace and the fifth segment 15 of the first differential signal trace is equal to the Y coordinate value of the connection point of the fourth segment 24 of the second differential signal trace and the fifth segment 25 of the second differential signal trace, and is equal to the Y coordinate value of the fifth end point 05, the sixth end point 06 and the seventh end point 07.

[0066] When the position and the type of the high-speed connector are determined, the coordinates of the fifth end point 05, the sixth end point 06 and the seventh end point 07 are determined (X value is determined, Y value is determined), when the position of the high-speed connector is determined and the type is not determined, the X coordinate of the fifth end point 05, the sixth end point 06 and the seventh end point 07 is determined, and the Y coordinate is not determined, and the Y coordinate values of the fifth end point 05, the sixth end point 06 and the seventh end point 07 are equal.

[0067] The high-speed signal via and the ground via around it are artificially set or are required by PCB design, that is, when the differential signal trace needs to be determined, the position of the high-speed signal via and the ground via around it is determined (X value is determined, Y value is determined). In the present application, the structure and position information of the high-speed signal via and the ground via around it can be obtained by simulation results of PCB design requirements or artificially set.

[0068] Each end point, such as the first end point 01, the second end point 02, the third end point 03, the fourth end point 04, the fifth end point 05, the sixth end point 06, the seventh end point 07, the eighth end point 08 and the ninth end point 09, can be determined by design requirements (such as artificially setting the position or the position and type of the high-speed connector required by PCB design) or simulation results of other PCB design contents (such as simulation results of the position of the high-speed signal via obtained by simulation of other requirement factors).

[0069] For each segment of the differential signal trace, the end point of the zeroth segment of the differential signal trace coincides with the high-speed signal via, and the end point of the fifth segment of the differential signal trace is also connected with the high-speed signal pad 32 of the high-speed connector, according to the connection rule, when the position and the type of the high-speed connector are determined, the position of the end point of the fifth segment of the differential signal trace is also determined.

[0070] According to the above known content, the parameters of each segment of the differential signal trace are substituted into the simulation running program, and the simulation requirements of equal length and impedance balance are obtained, and the parameters of each segment of the differential signal trace, including the line width, the radius of curvature, the starting point coordinate, the end point coordinate and the arc direction, are determined.

[0071] In one embodiment, in the PCB design drawing of the same design requirement, in addition to the second line segment of the differential signal trace, the rest of the differential signal trace part can be a certain structure fixed, the line width, the radius of curvature and the direction of the arc are equal, by copying, copy such differential signal trace to any required position, thus determine the part except the second line segment of the differential signal trace, and the second line segment of the differential signal trace is obtained by simulation, and it is required that the second line segment of the differential signal trace avoids the existing components in the PCB design drawing, that is, the second line segment 12 of the first differential signal trace and the second line segment 22 of the second differential signal trace present any shape according to the simulation requirement, the parameters of the first differential signal trace first line segment 11, the first differential signal trace third line segment 13, the first differential signal trace fourth line segment 14, the first differential signal trace fifth line segment 15, the first differential signal trace zero line segment 10, the second differential signal trace first line segment 21, the second differential signal trace third line segment 23, the second differential signal trace fourth line segment 24, the second differential signal trace fifth line segment 25 and the second differential signal trace zero line segment 20 of the differential signal trace in different positions are all the same. As shown in FIG. 1, the second line segment 12 of the first differential signal trace and the second line segment 22 of the second differential signal trace are elongated and curved according to the requirement, so as to avoid the existing electronic components under the condition of satisfying the equal length and impedance balance. Figure 2 , Figure 3 As shown in FIG. 1, the second line segment 12 of the first differential signal trace and the second line segment 22 of the second differential signal trace are elongated and curved according to the requirement, so as to avoid the existing electronic components under the condition of satisfying the equal length and impedance balance.

[0072] The above only describes the preferred embodiments of the present application and is not used to limit the present application, any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A device for generating differential signal traces for SMD high-speed connectors, characterized in that, Obtaining component requirement information of high-speed connector, Obtaining via requirement information of high-speed signal via, Dividing the differential signal trace into fixed several segments, and setting parameters of each segment, Substituting parameters of each segment of the differential signal trace, component requirement information, via requirement information into simulation program, inputting simulation requirement, obtaining simulation result, According to simulation result analysis, obtaining parameters of each segment of the differential signal trace, component requirement information, via requirement information, calling function module of PCB design program, automatically generating differential signal trace; The differential signal trace is two parallel PCB traces, The differential signal trace is divided into six segments, the differential signal trace includes differential trace zeroth segment, differential trace first segment, differential trace second segment, differential trace third segment, differential trace fourth segment, differential trace fifth segment, the end of two segments in any segment of the differential trace is flush, The differential trace zeroth segment, the differential trace first segment, the differential trace second segment, the differential trace third segment, the differential trace fourth segment, the differential trace fifth segment are connected in the above order, The end point of the differential trace zeroth segment is connected with the high-speed signal via, and the end point of the differential trace fifth segment is connected with the high-speed signal pad of the high-speed connector; One of the ground vias of the ground pad of the high-speed connector is located on the axis of symmetry of the two differential signal traces; The connection point of the differential trace fourth segment and the differential trace fifth segment, and the ground via of the ground pad of the high-speed connector are located on the same straight line.

2. The apparatus for generating differential signal traces of an SMD high speed connector according to claim 1, wherein The parameters of each segment of the differential signal trace include line width, arc radius, starting point coordinates, end point coordinates, and arc direction.

3. The apparatus of claim 1, wherein the SMD high speed connector differential signal trace is generated by: The simulation program simulates the internal equal length and impedance balance of the differential signal trace as the simulation requirement.

4. The apparatus of claim 1, wherein the SMD high speed connector differential signal trace is generated by: The line segment shape and structure of the differential signal trace are preset, so that only the parameters of one segment of the differential signal trace and the position related parameters of the remaining segments of the differential signal trace are in an undetermined state.

5. The apparatus of claim 1, wherein the SMD high speed connector differential signal trace is generated by: The component requirement information includes position information and model information of the high-speed connector.

6. The apparatus of claim 1, wherein the SMD high speed connector differential signal trace is generated by: The via requirement information includes position information of the high-speed signal via.

7. The apparatus of claim 1, wherein the SMD high speed connector differential signal trace is generated by a process comprising: The differential trace fifth segment is a straight segment connecting the high-speed signal pad, ​ The differential trace fourth segment connects the differential trace fifth segment and tends to converge, The differential trace third segment is a transition segment between the differential trace fourth segment and the differential trace second segment, The differential trace second segment is a variable segment, and the shape of the differential trace second segment is affected by the simulation result, The differential trace zeroth segment is a lead-out segment from the high-speed signal via, The differential trace first segment is a transition segment between the differential trace second segment and the differential trace first segment.

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