Method for manufacturing electronic component and apparatus for manufacturing electronic component

Abstract

The invention provides an electronic component manufacturing method and an electronic component manufacturing apparatus, which can improve vibration-in performance and arrangement performance of an electronic component. A method for manufacturing an electronic component includes an alignment step in which electronic components (1) are aligned in a unified manner using an alignment device (100). The alignment device (100) is provided with: a second flat plate (120) having a second through-hole (122); and a third flat plate (130) having a third through-hole (132) smaller than the second through-hole and having an elastic member (134) disposed on the inner wall thereof. The arrangement step includes a step of pressing the electronic component (1), which is arranged by the magnet (150) and falls into the second through-hole (122), by using a pressing member (160), moving the electronic component (1) in the second through-hole (122) to the third through-hole (132), and holding the electronic component (1) by the elastic member (134).

Description

[0001] This application is a divisional application of an invention patent application with an application date of September 29, 2022, an application number of 202211204965.3, and an invention name of “Method for manufacturing electronic components and device for manufacturing electronic components”. Technical Field

[0002] The present invention relates to a method for manufacturing an electronic component and an apparatus for manufacturing an electronic component. Background Art

[0003] When manufacturing electronic components, a holding fixture is used to hold the electronic components in a given state. Patent document 1 discloses such a holding fixture and an arrangement plate. The holding fixture disclosed in patent document 1 has a holding hole whose inner surface is elastic, and the arrangement plate is arranged on the upper surface side of the holding fixture and has a plurality of through holes. In addition, patent document 1 discloses the following content, namely,

[0004] Arrange and hold the electronic components by performing the following operations:

[0005] ·Configure multiple electronic components on the array board;

[0006] By vibrating the alignment plate, the electronic components are vibrated into the through holes of the alignment plate, thereby arranging the electronic components;

[0007] The electronic components vibrated into the array plate are pressed against the holding holes of the holding jig using the pressing member, thereby holding the electronic components.

[0008] Prior Art Literature

[0009] Patent Literature

[0010] Patent Document 1: Japanese Patent Application Publication No. 2010-182876

[0011] From the viewpoint of electronic component alignment, the through-holes of the alignment plate are preferably small. However, if the through-holes of the alignment plate are reduced in size, it becomes difficult to vibrate the electronic components into the through-holes of the alignment plate when the alignment plate is vibrated to vibrate the electronic components into the through-holes of the alignment plate.

[0012] Therefore, from the perspective of the vibration resistance of the electronic components, it is necessary to enlarge the through-holes of the arrangement plate. However, if the through-holes of the arrangement plate are enlarged, the posture of the electronic components in the through-holes of the arrangement plate will become unstable. Therefore, when the electronic components are pressed into the holding holes of the holding fixture, the electronic components are arranged and held in an unstable posture. Summary of the invention

[0013] Problem that the invention aims to solve

[0014] An object of the present invention is to provide a method for manufacturing an electronic component and an apparatus for manufacturing an electronic component, which improve the vibration property and arrangement property of the electronic component.

[0015] Technical solutions to solve problems

[0016] The manufacturing method of electronic components according to the present invention is a manufacturing method of electronic components including an arrangement process of uniformly arranging a plurality of electronic components using an arrangement device. The arrangement device comprises: a second plate having a plurality of second through holes arranged in a given direction; and a third plate having a plurality of third through holes arranged in the given direction, configured to overlap with the second plate, wherein the plurality of third through holes are smaller than the plurality of second through holes, and a plurality of elastic members are respectively arranged on the inner walls of the plurality of third through holes. The arrangement process includes: a first holding process, in which a plurality of electronic components arranged by a magnet and respectively falling into the plurality of second through holes are respectively pressed by a plurality of pressing members, so that the plurality of electronic components in the plurality of second through holes are respectively moved to the plurality of third through holes, and the plurality of electronic components are respectively held by the plurality of elastic members on the inner walls of the plurality of third through holes.

[0017] The manufacturing device of electronic components according to the present invention is a manufacturing device of electronic components including an arrangement device for uniformly arranging a plurality of electronic components. The arrangement device comprises: a second plate having a plurality of second through holes arranged in a given direction; a third plate having a plurality of third through holes arranged in the given direction and arranged overlapping with the second plate, wherein the plurality of third through holes are smaller than the plurality of second through holes, and a plurality of elastic members are respectively arranged on the inner walls of the plurality of third through holes; and a control unit for controlling the arrangement device as a whole. The control unit presses the plurality of electronic components respectively by using a plurality of pressing members, thereby causing the plurality of electronic components that fall into the plurality of second through holes and are arranged by magnets to be respectively moved to the plurality of third through holes, and the plurality of electronic components are respectively held by the plurality of elastic members on the inner walls of the plurality of third through holes.

[0018] Effects of the Invention

[0019] According to the present invention, the vibration-impedance and arrangement properties of electronic components can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic plan view showing an aligning device included in the electronic component manufacturing apparatus according to the present embodiment.

[0021] Figure 2 yes Figure 1This is a schematic cross-sectional view taken along line II-II of an aligning device included in the electronic component manufacturing device shown.

[0022] Figure 3 It is a schematic diagram showing a vibration-in step in an arrangement step in the method for manufacturing an electronic component according to the present embodiment.

[0023] Figure 4 This is a schematic diagram showing a first alignment step (first flat plate alignment step) among the alignment steps in the method for manufacturing an electronic component according to the present embodiment.

[0024] Figure 5 This is a schematic diagram showing a second alignment step (second flat plate alignment step) among the alignment steps in the method for manufacturing an electronic component according to the present embodiment.

[0025] Figure 6 This is a schematic diagram showing a first holding step in an arrangement step in the method for manufacturing an electronic component according to the present embodiment.

[0026] Figure 7 It is a schematic diagram showing the second holding step in the arrangement step in the method for manufacturing the electronic component according to the present embodiment.

[0027] Figure 8 It is a schematic diagram showing a conductive member arrangement step in the method for manufacturing an electronic component according to the present embodiment.

[0028] Fig. 9 It is a perspective view showing an example of the electronic component (laminated ceramic capacitor) according to the present embodiment.

[0029] Fig.10 yes Fig. 9 An example of an electronic component (a multilayer ceramic capacitor) is shown in a cross-sectional view taken along line XX (LT cross section).

[0030] Fig.11 As Fig. 9 A cross-sectional view (WT cross-sectional view) taken along line XI-XI of a multilayer ceramic capacitor as an example of the electronic component shown.

[0031] Fig.12 It is a schematic cross-sectional view showing an electronic component arrangement device and an arrangement step according to a comparative example.

[0032] Description of Reference Numerals

[0033] 1: Electronic components (laminated ceramic capacitors);

[0034] 100: Arrangement device (manufacturing device);

[0035] 110: 1st arrangement plate (1st flat plate);

[0036] 112: 1st through hole;

[0037] 120: second arrangement plate (second flat plate);

[0038] 122: second through hole;

[0039] 130: holding fixture (3rd plate);

[0040] 132: 3rd through hole;

[0041] 134: elastic member;

[0042] 140: holding plate (4th plate);

[0043] 150: magnet;

[0044] 152: Taiwan;

[0045] 160: pressing member;

[0046] 170: Control department. DETAILED DESCRIPTION

[0047] Hereinafter, an example of an embodiment of the present invention will be described with reference to the attached drawings. In addition, the same reference numerals are given to the same or corresponding parts in each drawing.

[0048] (Electronic components: Multilayer ceramic capacitors)

[0049] First, as an example of an electronic component manufactured by the manufacturing method and the manufacturing apparatus according to the present embodiment, Figures 9 to 11 A multilayer ceramic capacitor will be described. Fig. 9 is a perspective view showing an example of an electronic component (a multilayer ceramic capacitor) according to the present embodiment. Fig.10 yes Fig. 9 An example of an electronic component (a multilayer ceramic capacitor) is shown in a cross-sectional view taken along line XX. Fig.11 yes Fig. 9 An example of an electronic component (a multilayer ceramic capacitor) is shown in a cross-sectional view taken along line XI-XI. Figures 9 to 11 The electronic component (laminated ceramic capacitor) 1 shown includes a laminate 10 , an external electrode 40 , and a conductive member 50 . The external electrode 40 includes a first external electrode 41 and a second external electrode 42 .

[0050] exist Figures 9 to 11The XYZ orthogonal coordinate system is shown in FIG. The X direction is the length direction L of the electronic component 1 and the laminate 10, the Y direction is the width direction W of the electronic component 1 and the laminate 10, and the Z direction is the stacking direction T of the electronic component 1 and the laminate 10. Thus, Fig.10 The section shown is also called the LT section. Fig.11 The section shown is also referred to as the WT section.

[0051] In addition, the longitudinal direction L, the width direction W, and the stacking direction T do not necessarily have to be orthogonal to each other, and may be intersecting to each other.

[0052] The stacked body 10 has a substantially rectangular parallelepiped shape and has a first main surface TS1 and a second main surface TS2 opposing in the stacking direction T, a first side surface WS1 and a second side surface WS2 opposing in the width direction W, and a first end surface LS1 and a second end surface LS2 opposing in the longitudinal direction L.

[0053] It is preferable that the corners and ridges of the laminate 10 are rounded. The corner is a portion where three surfaces of the laminate 10 intersect, and the ridge is a portion where two surfaces of the laminate 10 intersect.

[0054] like Fig.10 as well as Fig.11 As shown, the laminate 10 includes a plurality of dielectric layers 20 and a plurality of internal electrode layers 30 laminated in the lamination direction T. In addition, the laminate 10 includes an inner layer portion 10A in the lamination direction T and a first outer layer portion 10B and a second outer layer portion 10C disposed so as to sandwich the inner layer portion 10A.

[0055] The inner layer portion 10A includes a part of the plurality of dielectric layers 20 and the plurality of internal electrode layers 30. In the inner layer portion 10A, the plurality of internal electrode layers 30 are arranged to face each other via the dielectric layer 20. The inner layer portion 10A is a portion that generates electrostatic capacitance and substantially functions as a capacitor.

[0056] The first outer layer portion 10B is arranged on the first main surface TS1 side of the stacked body 10, and the second outer layer portion 10C is arranged on the second main surface TS2 side of the stacked body 10. More specifically, the first outer layer portion 10B is arranged between the internal electrode layer 30 closest to the first main surface TS1 among the plurality of internal electrode layers 30 and the first main surface TS1, and the second outer layer portion 10C is arranged between the internal electrode layer 30 closest to the second main surface TS2 among the plurality of internal electrode layers 30 and the second main surface TS2. The first outer layer portion 10B and the second outer layer portion 10C do not include the internal electrode layer 30, and each include a portion of the plurality of dielectric layers 20 other than a portion used for the inner layer portion 10A. The first outer layer portion 10B and the second outer layer portion 10C are portions that function as protective layers for the inner layer portion 10A.

[0057] As the material of the dielectric layer 20, for example, BaTiO 3 、CaTiO 3 、SrTiO 3 or CaZrO 3 In addition, as the material of the dielectric layer 20, Mn compounds, Fe compounds, Cr compounds, Co compounds, Ni compounds, etc. may be added as subcomponents.

[0058] The plurality of internal electrode layers 30 include a plurality of first internal electrode layers 31 and a plurality of second internal electrode layers 32. The plurality of first internal electrode layers 31 and the plurality of second internal electrode layers 32 are alternately arranged in the stacking direction T of the stacked body 10.

[0059] The first internal electrode layer 31 includes a counter electrode portion 31A and a lead electrode portion 31B, and the second internal electrode layer 32 includes a counter electrode portion 32A and a lead electrode portion 32B.

[0060] The opposing electrode portion 31A and the opposing electrode portion 32A are opposed to each other via the dielectric layer 20 in the stacking direction T of the stacked body 10. The shapes of the opposing electrode portion 31A and the opposing electrode portion 32A are not particularly limited, and may be, for example, substantially rectangular. The opposing electrode portion 31A and the opposing electrode portion 32A are portions that generate electrostatic capacitance and substantially function as capacitors.

[0061] The lead electrode portion 31B extends from the counter electrode portion 31A toward the first end surface LS1 of the stacked body 10 and is exposed at the first end surface LS1. The lead electrode portion 32B extends from the counter electrode portion 32A toward the second end surface LS2 of the stacked body 10 and is exposed at the second end surface LS2. The shapes of the lead electrode portions 31B and 32B are not particularly limited, and may be, for example, substantially rectangular.

[0062] Thus, the first internal electrode layer 31 is connected to the first external electrode 41, and a gap exists between the first internal electrode layer 31 and the second end surface LS2 of the stack 10, that is, the second external electrode 42. In addition, the second internal electrode layer 32 is connected to the second external electrode 42, and a gap exists between the second internal electrode layer 32 and the first end surface LS1 of the stack 10, that is, the first external electrode 41.

[0063] The first internal electrode layer 31 and the second internal electrode layer 32 contain metal Ni as a main component. In addition, the first internal electrode layer 31 and the second internal electrode layer 32 may contain at least one selected from metals such as Cu, Ag, Pd or Au, or alloys containing at least one of these metals such as Ag-Pd alloy as a main component, or may contain it as a component other than the main component. Furthermore, the first internal electrode layer 31 and the second internal electrode layer 32 may also contain particles of a dielectric having the same composition system as the ceramic contained in the dielectric layer 20 as a component other than the main component. In addition, in this specification, the so-called main component metal is defined as the metal component with the highest weight %.

[0064] like Fig.11 As shown, the stack 10 has an electrode opposing portion W30 in which the internal electrode layer 30 is opposed in the width direction W, and a first side spacer WG1 and a second side spacer WG2 arranged to sandwich the electrode opposing portion W30. The first side spacer WG1 is located between the electrode opposing portion W30 and the first side surface WS1, and the second side spacer WG2 is located between the electrode opposing portion W30 and the second side surface WS2. More specifically, the first side spacer WG1 is located between one end of the first side surface WS1 side of the internal electrode layer 30 and the first side surface WS1, and the second side spacer WG2 is located between one end of the second side surface WS2 side of the internal electrode layer 30 and the second side surface WS2. The first side spacer WG1 and the second side spacer WG2 do not include the internal electrode layer 30, but only include the dielectric layer 20. The first side spacer WG1 and the second side spacer WG2 are portions that function as protective layers for the internal electrode layer 30. In addition, the first side spacer WG1 and the second side spacer WG2 are also referred to as W spaces.

[0065] like Fig.10As shown, the laminate 10 has an electrode opposing portion L30 where the first internal electrode layer 31 and the second internal electrode layer 32 of the internal electrode layer 30 are opposed to each other in the longitudinal direction L, a first end spacer LG1, and a second end spacer LG2. The first end spacer LG1 is located between the electrode opposing portion L30 and the first end surface LS1, and the second end spacer LG2 is located between the electrode opposing portion L30 and the second end surface LS2. More specifically, the first end spacer LG1 is located between one end of the second internal electrode layer 32 on the first end surface LS1 side and the first end surface LS1, and the second end spacer LG2 is located between one end of the first internal electrode layer 31 on the second end surface LS2 side and the second end surface LS2. The first end spacer LG1 does not include the second internal electrode layer 32 but includes the first internal electrode layer 31 and the dielectric layer 20, and the second end spacer LG2 does not include the first internal electrode layer 31 but includes the second internal electrode layer 32 and the dielectric layer 20. The first end spacer LG1 is a portion that functions as an extraction electrode portion of the first internal electrode layer 31 that is extracted to the first end surface LS1, and the second end spacer LG2 is a portion that functions as an extraction electrode portion of the second internal electrode layer 32 that is extracted to the second end surface LS2. The first end spacer LG1 and the second end spacer LG2 are also referred to as L-spaces.

[0066] In addition, the opposing electrode portion 31A of the first internal electrode layer 31 and the opposing electrode portion 32A of the second internal electrode layer 32 are located at the electrode opposing portion L30. In addition, the lead electrode portion 31B of the first internal electrode layer 31 is located at the first end spacer LG1, and the lead electrode portion 32B of the second internal electrode layer 32 is located at the second end spacer LG2.

[0067] The external electrode 40 includes a first external electrode 41 and a second external electrode 42 .

[0068] The first external electrode 41 is arranged on the first end surface LS1 of the stacked body 10 and is connected to the first internal electrode layer 31. The first external electrode 41 may extend from the first end surface LS1 to a portion of the first main surface TS1 and a portion of the second main surface TS2. In addition, the first external electrode 41 may extend from the first end surface LS1 to a portion of the first side surface WS1 and a portion of the second side surface WS2.

[0069] The second external electrode 42 is arranged on the second end surface LS2 of the stacked body 10 and is connected to the second internal electrode layer 32. The second external electrode 42 may also extend from the second end surface LS2 to a portion of the first main surface TS1 and a portion of the second main surface TS2. In addition, the second external electrode 42 may also extend from the second end surface LS2 to a portion of the first side surface WS1 and a portion of the second side surface WS2.

[0070] The first external electrode 41 includes a first base electrode layer 41A and a first plating layer 41B, and the second external electrode 42 includes a second base electrode layer 42A and a second plating layer 42B. Alternatively, the first external electrode 41 may be formed only of the first plating layer 41B, and the second external electrode 42 may be formed only of the second plating layer 42B.

[0071] The first base electrode layer 41A and the second base electrode layer 42A may also be a fired layer containing metal and glass. As glass, a glass component containing at least one selected from B, Si, Ba, Mg, Al, or Li can be cited. As a specific example, borosilicate glass can be used. As a metal, Cu is included as a main component. In addition, as a metal, for example, at least one selected from metals such as Ni, Ag, Pd, or Au, or alloys such as Ag-Pd alloys can be included as a main component, or as a component other than the main component.

[0072] The fired layer is a layer obtained by applying a conductive paste containing metal and glass to the laminate by dipping and firing. In addition, the fired layer may be fired after the internal electrode layer is fired, or may be fired simultaneously with the internal electrode layer. In addition, the fired layer may also be a plurality of layers.

[0073] Alternatively, the first foundation electrode layer 41A and the second foundation electrode layer 42A may be resin layers containing conductive particles and a thermosetting resin. The resin layer may be formed on the above-mentioned fired layer or may be formed directly on the laminate without forming a fired layer.

[0074] The resin layer is a layer obtained by applying a conductive paste containing conductive particles and a thermosetting resin to the laminate by a coating method and then firing it. In addition, the resin layer may be fired after firing the internal electrode layer or may be fired simultaneously with the internal electrode layer. In addition, the resin layer may also be a plurality of layers.

[0075] The thickness of each of the first foundation electrode layer 41A and the second foundation electrode layer 42A, which are fired layers or resin layers, is not particularly limited, and may be 1 μm or more and 10 μm or less.

[0076] Alternatively, the first foundation electrode layer 41A and the second foundation electrode layer 42A may be thin film layers of 1 μm or less formed by depositing metal particles using a thin film forming method such as sputtering or vapor deposition.

[0077] The first plating layer 41B covers at least a portion of the first base electrode layer 41A, and the second plating layer 42B covers at least a portion of the second base electrode layer 42A. The first plating layer 41B and the second plating layer 42B include, for example, at least one selected from metals such as Cu, Ni, Ag, Pd, or Au, or alloys such as Ag-Pd alloys.

[0078] The first plating layer 41B and the second plating layer 42B may each be formed of a plurality of layers. Preferably, the two-layer structure is a Ni plating layer and a Sn plating layer. The Ni plating layer can prevent the base electrode layer from being corroded by the solder when the ceramic electronic component is mounted, and the Sn plating layer can improve the wettability of the solder when the ceramic electronic component is mounted, making it easy to mount.

[0079] The thickness of each of the first plating layer 41B and the second plating layer 42B is not particularly limited, and may be 1 μm or more and 10 μm or less.

[0080] The conductive member 50 is disposed on the mounting surface side of the external electrode 40, namely the first external electrode 41 and the second external electrode 42. Examples of the conductive member 50 include a bump and an interposer. This can suppress the occurrence of so-called howling. This will be described in detail below.

[0081] In such an electronic component 1, when a voltage is applied between the external electrodes 40, the dielectric layer 20 generates field-induced strain according to the applied voltage. When the electronic component 1 is surface-mounted on a substrate, the electronic component 1 deforms the substrate due to the field-induced strain, and a sound called "howling" is generated due to the frequency of the deformation. If the "howling" becomes louder, it will cause a noise problem.

[0082] Regarding this problem, it is known to suppress the wetting and rising of solder in order to suppress the howling. For example, by arranging a conductive member 50 such as a bump or an interposer on the mounting surface side of the electronic component 1, the wetting and rising of solder can be suppressed, and the generation of the howling can be suppressed.

[0083] (Method for manufacturing electronic components)

[0084] Next, a method for manufacturing the electronic component (laminated ceramic capacitor) 1 is described. First, a dielectric sheet for the dielectric layer 20 and a conductive paste for the internal electrode layer 30 are prepared. The dielectric sheet and the conductive paste contain a binder and a solvent. As the binder and the solvent, known materials can be used.

[0085] Next, conductive paste is printed on the dielectric sheet in a predetermined pattern, for example, to form an internal electrode pattern on the dielectric sheet. Screen printing, gravure printing, or the like can be used as a method for forming the internal electrode pattern.

[0086] Next, a predetermined number of dielectric sheets for the second outer layer portion 10C on which the internal electrode pattern is not printed are stacked. Dielectric sheets for the inner layer portion 10A on which the internal electrode pattern is printed are stacked in sequence. A predetermined number of dielectric sheets for the first outer layer portion 10B on which the internal electrode pattern is not printed are stacked on top. Thus, a laminated sheet is produced.

[0087] Next, the laminated sheets are pressed in the stacking direction by isostatic pressing or the like to produce a laminated block. Next, the laminated block is cut into a given size to cut out laminated small pieces. At this time, the corners and ridges of the laminated small pieces are rounded by roller grinding or the like. Next, the laminated small pieces are fired to produce a laminated body 10. Although the firing temperature also depends on the materials of the dielectric and the internal electrode, it is preferably above 900°C and below 1400°C.

[0088] Alternatively, a method of subsequently providing a dielectric for side spacing at the side surfaces WS1 and WS2 of the stack in the width direction W may be applied to the production of the stacked small pieces. In this case, the ends of the internal electrode layers on both sides in the width direction W are aligned (eg, aligned with an error of 5 μm).

[0089] Next, the first end face LS1 of the stacked body 10 is dipped in a conductive paste as an electrode material for the base electrode layer by a dipping method, thereby applying a conductive paste for the first base electrode layer 41A to the first end face LS1. Similarly, the second end face LS2 of the stacked body 10 is dipped in a conductive paste as an electrode material for the base electrode layer by a dipping method, thereby applying a conductive paste for the second base electrode layer 42A to the second end face LS2. Then, by firing these conductive pastes, the first base electrode layer 41A and the second base electrode layer 42A as fired layers are formed. The firing temperature is preferably 600° C. or higher and 900° C. or lower.

[0090] In addition, as described above, the first base electrode layer 41A and the second base electrode layer 42A as resin layers can be formed by applying a conductive paste containing conductive particles and a thermosetting resin by a coating method and then firing the paste, or the first base electrode layer 41A and the second base electrode layer 42A as thin films can be formed by a thin film forming method such as a sputtering method or a vapor deposition method.

[0091] In the above description, the base electrode layer is formed and fired after the stacked small pieces are fired, that is, the stacked body and the external electrodes are fired separately. However, the base electrode layer may be formed and fired before the stacked small pieces are fired, that is, the stacked body and the external electrodes may be fired at the same time.

[0092] Then, the first plating layer 41B is formed on the surface of the first foundation electrode layer 41A to form the first external electrode 41, and the second plating layer 42B is formed on the surface of the second foundation electrode layer 42A to form the second external electrode 42. Through the above steps, the electronic component (laminated ceramic capacitor) 1 is obtained.

[0093] Then, the electronic components 1 are collectively arranged and held (arrangement step). The arrangement step and an arrangement device used in the arrangement step will be described later.

[0094] Then, a conductive member 50 such as a bump or an interposer is arranged on the mounting surface side of the external electrode 40, that is, the first external electrode 41 and the second external electrode 42 (conductive member arrangement step). For example, when forming a bump, a conductive paste is applied or printed on the mounting surface side of the first external electrode 41 and the second external electrode 42 and fired. Examples of the conductive paste include a metal material containing at least one high melting point metal selected from Cu and Ni and Sn as a low melting point metal.

[0095] (Electronic component manufacturing device: Arrangement device)

[0096] Next, refer to Figure 1 as well as Figure 2 The arrangement device in the electronic component manufacturing apparatus according to the present embodiment will be described. Figure 1 is a schematic plan view showing an arrangement device in the electronic component manufacturing device according to the present embodiment, Figure 2 yes Figure 1 A schematic cross-sectional view taken along line II-II of an aligning device in the electronic component manufacturing device shown.

[0097] Figure 1 as well as Figure 2 The arrangement device (manufacturing device) 100 shown is a device for collectively arranging and holding the electronic components 1 in the arrangement step in the above-mentioned method for manufacturing electronic components. The arrangement device 100 includes a first arrangement plate (first flat plate) 110, a second arrangement plate (second flat plate) 120, a holding fixture (third flat plate) 130, a holding plate (fourth flat plate) 140, a magnet 150, a stage 152, a plurality of pressing members 160, and a control unit 170.

[0098] In addition, Figure 1 in, omit Figure 2 The components other than the first arrangement plate 110, the second arrangement plate 120 and the holding fixture 130 in the arrangement device 100. Figure 1 as well as Figure 2 The XYZ orthogonal coordinate system is shown in FIG. Figure 1 as well as Figure 2The XYZ orthogonal coordinate system and Figures 9 to 11 The XYZ orthogonal coordinate systems in the Figure 1 as well as Figure 2 , the XY plane is a plane along the upper and lower surfaces of the first arrangement plate 110 , the second arrangement plate 120 , the holding fixture 130 , and the holding plate 140 , and the Z direction is the overlapping direction of the first arrangement plate 110 , the second arrangement plate 120 , the holding fixture 130 , and the holding plate 140 .

[0099] The first arrangement plate 110 has a plurality of first through holes 112 arranged in the Y direction (given direction) and the X direction. The first through hole 112 is rectangular or substantially rectangular in shape corresponding to the shape of the electronic component 1. For example, if the length of the length direction L of the electronic component 1 is set to L1, the width of the width direction W is set to W1, and the thickness of the thickness direction T is set to T1, then (for example, as in the 1206 size, in most cases, it is generally L1=2×W1=2×T1), the size of the first through hole 112 in the X direction only needs to be greater than L1, preferably about 1.2×L1. The size of the first through hole 112 in the Y direction only needs to be greater than √(W1 2 +T1 2 )×W1 and less than L1, preferably about 1.5×W1. The size of the first through hole 112 in the Z direction only needs to be greater than √(W1 2 +T1 2 )×W1. Thus, in the vibration-in process described later, the electronic component 1 can be easily vibrated into the first through hole 112. In addition, in the first arrangement process described later, the electronic component 1 can be easily rotated in the first through hole 112.

[0100] The upper surface side of the peripheral edge portion of the first through hole 112 in the first array plate 110 is tapered so that the electronic component 1 can be easily vibrated into the first through hole 112 in the vibrating step described later.

[0101] The first array plate 110 is made of metal, resin, or an elastic member, thereby reducing damage to the electronic component 1 .

[0102] The second arrangement plate 120 has a plurality of second through holes 122 arranged in the Y direction (given direction) and the X direction. The second arrangement plate 120 is arranged on the lower surface side of the first arrangement plate 110 so that at least a portion of the second through hole 122 does not overlap with the first through hole 112. The second through hole 122 is rectangular or substantially rectangular in accordance with the shape of the electronic component 1. The size of the second through hole 122 in the Y direction is smaller than the size of the first through hole 112 in the Y direction. In addition, the size of the second through hole 122 in the X direction and the Z direction only needs to be the same as the size of the first through hole 112 in the X direction and the Z direction. Thus, in the second arrangement process and the first holding process described later, the posture of the electronic component 1 can be stabilized.

[0103] The upper surface side of the peripheral edge portion of the second through hole 122 in the second array plate 120 is tapered so that the electronic component 1 can be easily rotated 90 degrees when dropped into the second through hole 122 in the second array step described later.

[0104] The second array plate 120 is made of metal, resin, or an elastic member, thereby reducing damage to the electronic component 1 .

[0105] The holding jig 130 is arranged on the lower surface side of the second array plate 120. The holding jig 130 has a plurality of third through holes 132 arranged in the Y direction (given direction) and the X direction. An elastic member 134 is arranged on the inner wall of the third through hole 132. The holding jig 130 holds the electronic component 1 in the third through hole 132 by the elastic member 134 on the inner wall of the third through hole 132.

[0106] The third through hole 132 is rectangular or substantially rectangular in shape corresponding to the shape of the electronic component 1. The size of the third through hole 132 in the Y direction is smaller than the size of the second through hole 122 in the Y direction. In addition, the sizes of the third through hole 132 in the X direction and the Z direction only need to be the same as the sizes of the second through hole 122 in the X direction and the Z direction.

[0107] The holding jig 130 is made of metal or resin, and the elastic member 134 is made of rubber or silicone resin. This can reduce damage to the electronic component 1.

[0108] The holding plate 140 has adhesiveness and holds the electronic component 1 .

[0109] The stage 152 is a stage for moving the magnet 150 , and is disposed between the first array plate 110 and the magnet 150 . The magnet 150 is a rectangular parallelepiped extending in the X direction, and moves in the Y direction (predetermined direction) along the stage 152 .

[0110] The pressing member 160 is a member for pressing the electronic component 1. The pressing member 160 is a rectangular parallelepiped shape having a rectangular cross section and extending in the Z direction corresponding to the first through hole 112, the second through hole 122, and the third through hole 132. The pressing member 160 includes a metal, a resin, or an elastic member. Thus, damage to the electronic component 1 can be reduced.

[0111] The control unit 170 controls the entire arranging device (manufacturing device) 100. The control unit 170 functions to realize a vibration step, a first arranging step, a second arranging step, a first holding step, and a second holding step in an arranging step described later.

[0112] The control unit 170 includes, for example, a CPU (Central Processing Unit), a DSP (Digital Signal Processor), an FPGA (Field-Programmable Gate Array) and other arithmetic processors. The various functions of the control unit 170 are realized, for example, by executing a program (application) stored in the storage unit. The program (application) can be provided via a network or recorded on a computer readable storage medium 40 such as a CD-ROM (Compact Disc Read only memory) or a DVD (Digital Versatile Disc). As a recording medium, a non-transitory tangible media can be listed.

[0113] (Method for manufacturing electronic components: Arrangement step)

[0114] Next, refer to Figure 3 to Figure 8 The above-mentioned arrangement step in the method for manufacturing an electronic component according to the present embodiment will be described. Figure 3 It is a schematic diagram showing a vibration-in step in an arrangement step in the method for manufacturing an electronic component according to the present embodiment. Figure 4 is a schematic diagram showing a first arrangement step (first flat plate arrangement step) in an arrangement step in a method for manufacturing an electronic component according to the present embodiment. Figure 5 This is a schematic diagram showing a second alignment step (second flat plate alignment step) among the alignment steps in the method for manufacturing an electronic component according to the present embodiment. Figure 6 1 is a schematic diagram showing a first holding step in an arrangement step in a method for manufacturing an electronic component according to the present embodiment. Figure 71 is a schematic diagram showing the second holding step in the arrangement step in the method for manufacturing electronic components according to the present embodiment. Figure 8 It is a schematic diagram showing a conductive member arrangement step in the method for manufacturing an electronic component according to the present embodiment.

[0115] First, a plurality of electronic components 1 having external electrodes 40 formed on the end surfaces of the stacked body 10 are arranged on the upper surface of the first array plate 110. Figure 3 As shown, the first array plate 110 is vibrated under the control of the control unit 170 , so that the electronic components 1 arranged on the upper surface of the first array plate 110 are respectively vibrated into the first through holes 112 of the first array plate 110 (vibration step).

[0116] At this time, as described above, the size of the first through hole 112 in the Y direction is relatively large, so it is easy to vibrate the electronic component 1 into the first through hole 112. In addition, the upper surface side of the peripheral portion of the first through hole 112 in the first array plate 110 is tapered, so it is easy to vibrate the electronic component 1 into the first through hole 112.

[0117] Then, if Figure 4 As shown, the stacking direction T of the electronic components 1 is uniformly arranged. Specifically, the magnet 150 is moved in the Y direction (given direction) on the stage 152 under the control of the control unit 170. As a result, the magnetic lines of force act on the internal electrode layer, and in the first through hole 112, the electronic components 1 whose stacking direction T is not in the Y direction are rotated, and the electronic components 1 are uniformly arranged so that the stacking direction T of all electronic components 1 is consistent with the Y direction, in other words, consistent with the horizontal direction (first arrangement process). The moving speed of the magnet 150 is preferably less than 100 mm / s. In addition, the movement of the magnet 150 can also be performed multiple times.

[0118] In addition, instead of moving the magnet 150 in the Y direction, the first array plate 110 may be moved in the Y direction. In other words, the first array plate 110 may be moved relative to the magnet 150 in the Y direction.

[0119] In addition, the magnet 150 may be moved on the upper surface side of the first array plate 110 , or may be moved on the lower surface side of the first array plate 110 .

[0120] At this time, as described above, the size of the first through hole 112 in the Y direction is relatively large, so it is easy to rotate the electronic component 1 in the first through hole 112. In addition, as described above, if the second array plate 120 is arranged on the lower surface side of the first array plate 110 so that at least a portion of the second through hole 122 does not overlap with the first through hole 112, the electronic component 1 can be fixed to the first through hole 112.

[0121] Then, if Figure 5 As shown, the electronic components 1 are uniformly arranged so that the stacking direction T of the electronic components 1 is rotated 90 degrees. Specifically, the first arrangement plate 110 is moved in the Y direction (given direction) by the control of the control unit 170 so that the first through hole 112 and the second through hole 122 are connected. As a result, the electronic components 1 in the first through hole 112 fall into the second through hole 122 of the second arrangement plate 120. At this time, the electronic components 1 are uniformly arranged so that the stacking direction T of the electronic components 1 is rotated 90 degrees from the Y direction (given direction) (second arrangement process). As a result, the electronic components 1 are uniformly arranged so that the stacking direction T of all the electronic components 1 in the second through hole 122 is consistent with the Z direction, in other words, consistent with the vertical direction.

[0122] At this time, as described above, the size of the second through hole 122 in the Y direction is relatively small, so the posture of the electronic component 1 in the second through hole 122 is stable. In addition, the upper surface side of the peripheral portion of the second through hole 122 in the second array plate 120 is tapered, so when the electronic component 1 is dropped from the first through hole 112 to the second through hole 122, it is easy to rotate the electronic component 1 90 degrees.

[0123] In addition, instead of moving the first alignment plate 110 in the Y direction, the second alignment plate 120 and the holding jig 130 may be moved in the Y direction. That is, the second alignment plate 120 and the holding jig 130 may be moved relative to the first alignment plate 110 in the Y direction.

[0124] Then, if Figure 6 As shown, the electronic component 1 is held in the third through hole 132 of the holding jig 130. Specifically, the electronic component 1 is pressed by the pressing member 160 under the control of the control unit 170. As a result, the electronic component 1 in the second through hole 122 is moved to the third through hole 132 of the holding jig 130, and the electronic component 1 is held by the elastic member 134 on the inner wall of the third through hole 132 (first holding step).

[0125] At this time, as described above, since the size of the second through hole 122 in the Y direction is relatively small, the electronic component 1 can be moved to the third through hole 132 and held while maintaining a stable posture in the second through hole 122 .

[0126] Then, if Figure 7As shown, the electronic component 1 is held on the holding plate 140. Specifically, under the control of the control unit 170, the second arrangement plate 120 and the first arrangement plate 110 are removed from the holding fixture 130, and the holding plate 140 is prepared, and the electronic component 1 is pressed by the pressing member 160. As a result, the electronic component 1 in the third through hole 132 is moved to the holding plate 140, and the electronic component 1 is held by the holding plate 140 (second holding step).

[0127] Then, if Figure 8 As shown, a conductive member 50 such as a bump or an interposer is arranged on the mounting surface side of the external electrode 40 of the electronic component 1 held by the holding plate 140 (conductive member arrangement step). For example, when forming a bump, a conductive paste is applied or printed on the mounting surface side of the first external electrode 41 and the second external electrode 42 and fired.

[0128] At this time, as described above, the posture of the electronic component 1 is stabilized, and therefore, for example, the position of the surface on which the conductive paste is applied to the conductive member 50 is stabilized.

[0129] Here, a comparative example considered by the inventors of the present application in the process of obtaining the above-mentioned present embodiment will be described. Fig.12 It is a schematic cross-sectional view showing an electronic component arrangement device and an arrangement step according to a comparative example. Fig.12 The alignment device of the comparative example shown is different from the alignment device 100 of the present embodiment described above mainly in that it includes a first alignment plate 110 , a holding jig 130 , and a pressing member 160 , but does not include a second alignment plate 120 .

[0130] In the arrangement device of the comparative example, from the viewpoint of arrangement of electronic components, it is preferred that the through hole 112 of the first arrangement plate 110 is small. However, if the through hole 112 of the first arrangement plate 110 is made smaller, it becomes difficult to vibrate the electronic component 1 into the through hole 112 when the first arrangement plate 110 is vibrated to vibrate the electronic component 1 into the through hole 112.

[0131] Therefore, from the viewpoint of the vibration resistance of the electronic component, it is necessary to enlarge the through hole 112 of the first arrangement plate 110. However, if the through hole 112 of the first arrangement plate 110 is enlarged, the posture of the electronic component 1 in the through hole 112 becomes unstable. For example, the electronic component 1 becomes tilted in the through hole 112. Therefore, when the electronic component 1 is pressed against the through hole 132 of the holding fixture 130, the electronic component 1 is arranged and held in an unstable posture.

[0132] If the electronic components 1 are arranged and held in an unstable posture in the holding jig 130 , for example, the position of the surface on which the conductive paste is applied to the conductive member 50 becomes unstable in the above-mentioned conductive member placement step.

[0133] In this regard, according to the manufacturing device of electronic components of the present embodiment, in the arrangement device 100, a second arrangement plate 120 is provided between the first arrangement plate 110 and the retaining fixture 130, the first through hole 112 of the first arrangement plate 110 is relatively large, and the second through hole 122 of the second arrangement plate 120 is smaller than the first through hole 112 of the first arrangement plate 110.

[0134] Furthermore, according to the method for manufacturing an electronic component of the present embodiment, in the arrangement step, the electronic component 1 is vibrated into the relatively large first through hole 112 of the first arrangement plate 110 (vibration step), the electronic component 1 is made to fall from the first through hole 112 of the first arrangement plate 110 into the relatively small second through hole 122 of the second arrangement plate 120 (second arrangement step), and the electronic component 1 is pressed from the second through hole 122 of the second arrangement plate 120 into the third through hole 132 of the holding fixture 130 (first holding step).

[0135] Thus, the vibration of the electronic component 1 into the relatively large first through hole 112 of the first arrangement plate 110 can be improved. In addition, the posture of the electronic component 1 can be stabilized in the relatively small second through hole 122 of the second arrangement plate 120. Therefore, when the electronic component 1 is pressed against the third through hole 132 of the holding fixture 130, the electronic component 1 can be arranged and held in a state of maintaining a stable posture. Therefore, the alignment of the position and posture of the electronic component 1 can be improved.

[0136] Furthermore, according to the electronic component manufacturing apparatus of the present embodiment, the alignment device 100 includes the magnet 150 and the stage 152 .

[0137] Furthermore, according to the method for manufacturing electronic components of the present embodiment, in the arrangement step, the stacking directions of the electronic components 1 are uniformly arranged in the horizontal direction (first arrangement step). Furthermore, when the electronic components 1 are dropped from the first through hole 112 of the first arrangement plate 110 into the second through hole 122 of the second arrangement plate 120, the electronic components 1 are rotated 90 degrees, and the stacking directions of the electronic components 1 are uniformly arranged in the vertical direction (second arrangement step).

[0138] This can improve the alignment of the electronic components 1 in the stacking direction.

[0139] The embodiments of the present invention have been described above, but the present invention is not limited to the above-mentioned embodiments, and various changes and deformations can be made. For example, in the above-mentioned embodiments, a method for manufacturing electronic components including an arrangement process for uniformly arranging the positions, postures and stacking directions of electronic components is illustrated. However, the present invention is not limited to this, and can also be applied to a method for manufacturing electronic components including an arrangement process for uniformly arranging the positions and postures of electronic components. In this case, in the arrangement process, the first arrangement process for uniformly arranging the stacking directions of electronic components can be omitted. In this case, the arrangement device in the manufacturing device of the electronic component may not have the magnet 150 and the table 152.

[0140] In addition, in the above-mentioned embodiment, a laminated ceramic capacitor is exemplified as an electronic component. However, the present invention is not limited to this, and can be applied to various laminated electronic components such as laminated inductors and laminated resistors, in which a plurality of dielectric layers and one or more conductor layers are laminated. Furthermore, the present invention is not limited to laminated electronic components, and can be applied to various electronic components.

[0141] In the above-mentioned embodiment, as a process after the arrangement process, a process of collectively arranging conductive members on electronic components is exemplified, but the present invention is not limited thereto, and can be applied as a pre-process for various processes collectively performed on electronic components.

Claims

1. A method for manufacturing an electronic component, comprising an arranging step of uniformly arranging a plurality of electronic components using an arranging device, wherein: The arrangement device comprises: a second flat plate having a plurality of second through holes arranged in a given direction; and The third plate has a plurality of third through holes arranged in the given direction and is arranged to overlap with the second plate, wherein the plurality of third through holes are smaller than the plurality of second through holes, and a plurality of elastic members are respectively arranged on the inner walls of the plurality of third through holes. The arrangement process comprises: The first holding step is to use a plurality of pressing members to respectively press the plurality of electronic components arranged by magnets and respectively dropped into the plurality of second through holes, thereby moving the plurality of electronic components in the plurality of second through holes to the plurality of third through holes, and respectively holding the plurality of electronic components by the plurality of elastic members on the inner walls of the plurality of third through holes.

2. The method for manufacturing an electronic component according to claim 1, wherein: The arrangement device comprises a fourth flat plate having adhesive properties, The arrangement process includes a second holding process after the first holding process, in which the plurality of electronic components are pressed respectively by using the plurality of pressing members, so that the plurality of electronic components in the plurality of third through holes are relatively moved to the fourth flat plate, and the plurality of electronic components are held by the fourth flat plate.

3. An electronic component manufacturing device, comprising an arrangement device for uniformly arranging a plurality of electronic components, wherein: The arrangement device comprises: A second flat plate having a plurality of second through holes arranged in a given direction; a third plate having a plurality of third through holes arranged in the given direction and arranged to overlap with the second plate, wherein the plurality of third through holes are smaller than the plurality of second through holes, and a plurality of elastic members are respectively arranged on inner walls of the plurality of third through holes; and A control unit controls the arrangement device as a whole, The control unit presses the multiple electronic components respectively using the multiple pressing members, thereby moving the multiple electronic components that fall into the multiple second through holes and are arranged by the magnets to the multiple third through holes respectively, and the multiple electronic components are respectively held by the multiple elastic members on the inner walls of the multiple third through holes.

4. The electronic component manufacturing apparatus according to claim 3, wherein: The arrangement device comprises a fourth flat plate having adhesive properties, The control unit presses the electronic components respectively using the pressing members to relatively move the electronic components in the third through holes to the fourth flat plate, and holds the electronic components by the fourth flat plate.

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