Low stress package for environmental sensor

Abstract

The one or more sensor devices are encapsulated within the elastomeric material on the top surface of the carrier substrate. The carrier substrate includes one or more recessed channels adjacent to each sensor device, the one or more recessed channels being filled with a portion of the elastomeric material to create a flange region flush with the top surface of the carrier substrate. A cover, which may include a liquid or gas input port or other related structure, may be placed over each sensor device and bonded to the carrier substrate at the flange region, creating a seal between the cover and the carrier substrate surrounding each sensor device.

Description

Technical Field

[0001] Embodiments of the subject matter described herein relate to environmental sensors, electronic device packaging, and multi-chip integration. Background Art

[0002] Semiconductor devices and other electronic devices are often assembled into packages to protect the device from damage and provide macroscopic electrical contact. Packages can be made of a variety of materials including polymers and ceramics. Environmental sensors such as gas sensors and pressure sensors often require special packages that expose the sensing element to the external environment while continuing to protect the sensing element from damage or degradation. Some gas or pressure sensors are partially encapsulated in an elastomeric package, which may include gas ports or fluid hose connectors and other structures. Summary of the invention

[0003] In one example embodiment, a method includes enclosing a first sensor device within a volume of elastomeric material on a top surface of a carrier substrate; and bonding a cover to the carrier substrate, the cover overlying the volume of elastomeric material such that the cover is separated from the volume of elastomeric material by a gap in a first region above the first sensor device. The first sensor device is adjacent to a first recessed channel in the carrier substrate. The volume of elastomeric material has a first height above the carrier substrate in the first region above the first sensor device. A portion of the volume of elastomeric material fills the first recessed channel and forms a first flange region recessed to below the first height in a second region adjacent to the first region.

[0004] In an example embodiment, the method further includes disposing an adhesive material on the first flange area, and bonding the cover to a top surface of the first flange area via the adhesive material disposed on the flange.

[0005] In an exemplary embodiment, the method further includes placing an adhesive material on a portion of the bottom surface of the cover corresponding to the first flange area, and bonding the cover to the top surface of the first flange area via the adhesive material placed on the portion of the bottom surface of the cover.

[0006] In an example embodiment, the first sensor device is a pressure sensor having a predetermined pressure operating range, and wherein the elastomeric material is configured to deform in response to an ambient pressure within the operating range of the pressure sensor.

[0007] In an example embodiment, the gap between the cover and the elastomeric material is sized such that the cover and the elastomeric material remain separated by the gap within the pressure operating range of the pressure sensor.

[0008] In an example embodiment, the cover includes a port having an opening over the pressure sensor, the elastomeric material over the pressure sensor being exposed through the opening.

[0009] In an example embodiment, the cover has a modulus of elasticity greater than the modulus of elasticity of the elastomeric material.

[0010] In an exemplary embodiment, the method further includes: encapsulating a second sensor device within the volume of elastomeric material on the carrier substrate, wherein the second sensor device is adjacent to a second recessed channel in the carrier substrate, and the second recessed channel is disposed between the first sensor device and the second sensor device; wherein the volume of elastomeric material has a first height higher than the carrier substrate in a third area above the second sensor device; and wherein the volume of elastomeric material fills the second recessed channel and forms a second flange area recessed to below the first height between the first sensor device and the second sensor device.

[0011] In an example embodiment, the method further includes bonding the cover to a top surface of the second flange area.

[0012] In an example embodiment, the method further comprises singulating the carrier substrate along lines passing through the second recessed channels to produce a first component including the first sensor device and a second component including the second sensor device.

[0013] In an example embodiment, the top surface of the carrier substrate in the first region extends to a second height above the bottom of the first recessed channel; and wherein the first flange region extends to the second height above the bottom of the first recessed channel.

[0014] In another example embodiment, a device includes: a first sensor device disposed on a top surface of a carrier substrate adjacent to a first recessed channel in the carrier substrate; a volume of elastomeric material disposed on the carrier substrate encapsulating the first sensor device; and a cover disposed over the volume of elastomeric material.

[0015] The volume of elastomeric material has a first height above the carrier substrate in a first region above the first sensor device. A portion of the volume of elastomeric material fills a first recessed channel to form a first flange region recessed below the first height in a second region adjacent to the first region. The cover is bonded to the first flange region in the second region, the cover overlying the volume of elastomeric material such that the cover is separated from the volume of elastomeric material by a gap in the first region.

[0016] In an example embodiment, the cover is bonded to the first flange area via an adhesive material disposed between a bottom surface of the cover and a top surface of the first flange area.

[0017] In an example embodiment, the first sensor device is a pressure sensor having a predetermined operating range, and wherein the elastomeric material is configured to deform in response to an ambient pressure within the operating range of the pressure sensor.

[0018] In an example embodiment, the gap between the cover and the elastomeric material is sized such that the cover and the elastomeric material remain separated by the gap within the operating range of the pressure sensor.

[0019] In one example embodiment, the cover includes a fluid port having an opening above the pressure sensor, the elastomeric material above the pressure sensor being exposed through the opening.

[0020] In an example embodiment, the cover has a modulus of elasticity greater than the modulus of elasticity of the elastomeric material.

[0021] In an example embodiment, the elastic modulus of the cover is at least one thousand times greater than the elastic modulus of the elastomeric material.

[0022] In an exemplary embodiment, the device further includes: a second sensor device, which is disposed on the top surface of the carrier substrate and encapsulated in the volume of elastomeric material, wherein the second sensor device is adjacent to a second recessed channel in the carrier substrate, and the second recessed channel is disposed between the first sensor device and the second sensor device; wherein the volume of elastomeric material has a first height higher than the carrier substrate in a third area above the second sensor device; and wherein the volume of elastomeric material fills the second recessed channel and forms a second flange area recessed to below the first height between the first sensor device and the second sensor device.

[0023] In an example embodiment, the top surface of the carrier substrate in the first region extends to a second height above a bottom of the first recessed channel; and wherein the first flange region extends to the second height above the bottom of the first recessed channel. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present disclosure is illustrated by way of examples, embodiments, etc. and is not limited by the accompanying drawings, in which the same reference numerals indicate similar elements. For simplicity and clarity, the elements in the drawings are shown and are not necessarily drawn to scale. The drawings are incorporated with the detailed description and form a part of the specification and are used to further illustrate the examples, embodiments, etc., and to explain various principles and advantages according to the present disclosure, wherein:

[0025] Figure 1 Perspective, plan, and cross-sectional elevation views are shown of a dual pressure sensor device packaged in accordance with one or more embodiments.

[0026] Figure 2 According to one or more embodiments, a Figure 1 During the step of the process of the device and similar device Figure 1 Cross-sectional view of the device.

[0027] Figure 3 Show Figure 1 A cross-sectional view of the device, the cross-sectional view showing in more detail Figure 2 The characteristics of the process. DETAILED DESCRIPTION

[0028] The following detailed description provides examples for the purpose of understanding and is not intended to limit the invention or the application and uses of the invention. In addition, no one is expected to be bound by any expressed or implied theory presented in the previous technical field, background technology or the following detailed description.

[0029] For the sake of simplicity and clarity of illustration, the drawings show the overall construction mode, and the description and details of well-known features and technologies may be omitted so as not to unnecessarily obscure the present invention. In addition, the elements in the drawings are not necessarily drawn to scale. For example, the sizes of some elements or regions in the drawings may be exaggerated relative to other elements or regions to help improve the understanding of the embodiments of the present invention.

[0030] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims can be used to distinguish similar elements and are not necessarily used to describe a specific sequence or time order. It should be understood that the terms used in this way are interchangeable in appropriate circumstances, so that the embodiments of the present invention described herein (for example) can operate in a sequence other than the sequence described or otherwise described herein. In addition, the terms "including", "having" and any variants thereof are intended to cover non-exclusive inclusions, so that a process, method, article or device including a series of elements is not necessarily limited to those elements, but may include other elements that are not explicitly listed or inherent to such processes, methods, articles or devices. The term "coupled" as used herein is defined as being connected directly or indirectly in an electrical or non-electrical manner. As used herein, the terms "substantially" and "substantially" mean sufficient to achieve the stated purpose in a practicable manner, and minor defects (if any) are not important for the stated purpose.

[0031] Unless otherwise stated, directional references such as “top”, “bottom”, “left”, “right”, “above”, “below”, etc. are not intended to require any preferred orientation, but are made for illustrative purposes with reference to the orientation of the corresponding figure or figures.

[0032] It should be understood that the steps of the various processes described herein are non-limiting examples of suitable processes according to embodiments and are for illustration purposes. Systems and devices according to embodiments herein may use any suitable process, including processes that omit the steps described above, processes that perform those steps and similar steps in a different order, etc. It should also be understood that well-known features may be omitted for clarity.

[0033] The devices and methods described herein enable the assembly of sensor devices encapsulated by elastomeric materials on semiconductor substrates, printed circuit boards, and other substrates, followed by the placement of rigid or semi-rigid covers over these devices, which covers may include external connections for liquid or gas hoses and similar structures. Features of various embodiments allow many devices to be assembled (e.g., using panel-level processing techniques) and then singulated into smaller units without compromising the encapsulation of the sensor device or having to seal the covers to the resulting singulated substrates.

[0034] Figure 1 An example device is shown in accordance with one or more embodiments. The device 100 is formed on a carrier substrate 102 (eg, a printed circuit board) and includes two sensor devices 120. Figure 1 In the example of FIG. 1 , the sensor device 120 is formed on the corresponding tube core 110 and / or is electrically and mechanically coupled to the corresponding tube core 110. The sensor device 120 can be connected to the corresponding tube core 110 through one or more electrical interconnects (by Figure 1 The sensor devices 120 are electrically coupled to the carrier substrate 102 (represented by wire bonds from the die 110 to the carrier substrate 102 in FIG. 1 ). The sensor devices 120 are disposed within a cover 150 that includes a port 155 having an aperture 157 disposed above each sensor device 120. The sensor devices 120 are enclosed within a volume of elastomeric material 130 that is separated from an inner surface of the cover 150 by an air gap 140. In one or more embodiments, the elastic modulus of the cover (e.g., cover 150) is greater than the elastic modulus of the elastomeric material 130. If one or more of the sensor devices 120 are pressure sensors, the elastomeric material 130 can be configured to have an elastic modulus that allows the elastomeric material to deform when pressure is applied to the elastomeric material from the surrounding environment through the aperture 157 in the corresponding port 155, thereby transmitting the applied pressure to the corresponding sensor device 120. Any suitable structure may be used to convert the applied pressure into an electrical signal including, by way of non-limiting example, piezoelectric elements, piezoresistive elements, magnetoresistive elements, combinations thereof, and the like.

[0035] like Figure 1 As shown, carrier substrate 102 includes a recessed channel 105 adjacent to each sensor device 120. During assembly of a device (e.g., device 100), elastomeric material 130 can be dispensed and molded such that elastomeric material 130 fills recessed channels 105, as shown, to create a flange or portions of one or more continuous flanges around sensor devices 120. For convenience, individual flanges or portions of flanges may be described herein as "flange regions."

[0036] The cover 150 is sized to surround the sensor device 120 and is bonded to the flange in the recessed channel 105 due to the air gap 140 between the cover 150 and the elastomeric material 130 immediately surrounding the sensor device 120 (e.g., using a Figure 1 The recessed channel 105 between the two sensor devices 120 shown allows the two sensor devices to be mechanically isolated from each other and from the cover 150. Thus, the device 100 shown can be used as a differential pressure sensor, where each sensor device 120 measures a different pressure based on the ambient environment created within each aperture 157 (e.g., by connecting a separate gas or liquid hose to each port 155 of the cover 150).

[0037] As from Figure 1As can be appreciated from the plan view of the carrier substrate 102, multiple devices, such as device 100, can be formed on a single carrier substrate 102. As shown, the recessed channel 105 can extend along the entire length of the carrier substrate 102, which can facilitate a high-volume manufacturing process in which the elastomeric material 130 can be molded or otherwise dispensed onto the entire carrier substrate at one time. Therefore, each sensor device 120 can be completely encapsulated and the devices can be isolated from each other. Because the volume of elastomeric material 130 encapsulates the sensor device 120 and also fills the recessed channel 105, the carrier substrate 102 can be segmented using known equipment without damaging the sensor device 120 or requiring special processing (e.g., segmenting in a clean room environment). In addition, filling the recessed channel 105 with the elastomeric material 130 forms a flange area around each sensor device 120. The flange area formed by the elastomeric material 130 provides a level surface for subsequent bonding of the cover 150 and can achieve an airtight seal between the cover 150 and the flange area (ie, the elastomeric material 130 within the recessed channel 105 ).

[0038] The elastomeric material 130 can be any suitable material including silicone-based materials, and can be formed using any suitable method. For example, the polymer precursor material can be dispensed by a molded fixture and subsequently cured using heat or ultraviolet light. The elastomeric material 130 can be selected for its ability to maintain its overall shape while still being sufficiently deformed to transmit pressure changes to the sensor device 120 within the design range of ambient pressure. As a non-limiting example, the elasticity of the elastomeric material 130 can also be modified by adding filler materials such as glass or silica particles, carbon particles, etc. to achieve the desired modulus. The cover 150 can be made of any suitable material, including well-known molding compounds. Generally, it is desirable that the elastic modulus of the cover 150 is greater than the elastic modulus of the elastomeric material 130 (i.e., the cover 150 is relatively rigid compared to the elastomeric material 130).

[0039] As an example, in one or more embodiments, the elastic modulus of an elastomeric material such as elastomeric material 130 is in the range of 0.2-15 MPa, while the elastic modulus of a covering such as cover 150 is at least 15-20 GPa. In one or more embodiments, the elastic modulus of the covering is at least 1000 times the elastic modulus of the elastomeric material.

[0040] Figure 2 Describe suitable for forming Figure 1The process 200 includes steps 210, 220, 230, and 240 described below with reference to the components of the device 100. It should be understood that in one or more embodiments, steps of the process 200 or similar steps may be omitted or replaced in addition to the steps described herein. Figure 2 The steps may be performed in any suitable order other than the order described.

[0041] At step 210, a carrier substrate 102 is received with recessed channels 105 formed in its top surface. The vertical dashed lines dividing the carrier substrate 102 indicate where the carrier substrate 102 may subsequently be singulated into individual portions.

[0042] At step 220 , the sensor device 120 (which may be mounted or otherwise formed on the die 110 ) is coupled to the carrier substrate 102 adjacent to the recessed channel 105 formed on the top surface of the carrier substrate 102 .

[0043] At step 230, a molded fixture 232 is positioned over the carrier substrate 102. The molded fixture 232 includes a cavity that allows for the introduction of the elastomeric material 130. The precursor material of the elastomeric material 130. The recessed channels 105 allow the elastomeric material 130 to surround the sensor device 120 and fill the recessed channels 105, thereby forming a flange adjacent to the sensor device 120.

[0044] At step 240, the molded fixture 232 has been removed, leaving the elastomeric material 130 surrounding each sensor device 120, wherein the flange is formed in the recessed channel 105 of the carrier substrate 102. The carrier substrate has been singulated to produce individual devices 100 including a pair of sensor devices 120, such as Figure 1 The cover 150 is positioned over the sensor device 120 and is bonded to the elastomeric material 130 within the recessed channel 105, as shown. Figure 1 In one or more embodiments, as shown, an adhesive material is applied to the portion of the cover 150 that will contact the elastomeric material 130 in the recessed channel 105. It should be understood that in one or more embodiments, an adhesive such as adhesive material 152 is applied directly to the elastomeric material 130 instead of the cover 150. In still other embodiments, the cover 150 is directly bonded to the elastomeric material 130 via a heat bonding process or another other suitable process.

[0045] Figure 3A cross-sectional view is shown that illustrates features of a process (e.g., process 200) described in more detail in conjunction with using process 200 to form device 100. The relative dimensions of various structures have been modified for clarity. In cross section 310, molded fixture 232 is positioned above carrier substrate 102. It should be understood that while molded fixture 232 appears to be suspended above carrier substrate 102, it may instead contact substrate 102 at a location that is not visible in the depicted cross section. The protrusion in the molded fixture that forms cavity 235 above sensor device 120 is positioned so that recessed channel 105 remains at least partially open to cavity 235. Thus, when a material such as elastomeric material 130 (or a precursor material to elastomeric material 130) is introduced into the cavity (e.g., via an aperture not shown in the molded fixture), the material may flow into recessed channel 105, as schematically indicated by the dashed arrow, thereby forming flange region 325 in elastomeric material 130, as shown in cross section 320.

[0046] example

[0047] Features of the embodiments may be understood with the aid of one or more of the following examples:

[0048] Example 1: A method or apparatus comprising a first sensor device located on a top surface of a carrier substrate and enclosed within a volume of elastomeric material, and a cover bonded to a flange area formed by the volume of elastomeric material. The first sensor device is adjacent to a first recessed channel in the carrier substrate. The volume of elastomeric material has a first height above the carrier substrate in a first region above the first sensor device. The flange area is formed by a portion of the elastomeric material filling the first recessed channel and is recessed to below the first height in a second region adjacent to the first region. The cover is bonded to the flange area in the second region, the cover overlying the volume of elastomeric material such that the cover is separated from the volume of elastomeric material by a gap in the first region.

[0049] Example 2: The device or method of Example 1, further comprising an adhesive material disposed on the flange area, the adhesive material bonding the cover to the top surface of the flange.

[0050] Example 3: The device or method according to Example 1 or 2 includes an adhesive material, wherein the adhesive material is disposed on the portion of the bottom surface of the cover corresponding to the portion, and the cover is bonded to the top surface of the flange area via the adhesive material disposed on the portion of the bottom surface of the cover.

[0051] Example 4: A device or method according to any one of Examples 1 to 3, wherein the first sensor device is a pressure sensor having a predetermined pressure operating range, and the elastomeric material is configured to deform in response to an ambient pressure within the operating range of the pressure sensor.

[0052] Example 5: The device or method of Example 4, wherein the gap between the cover and the elastomeric material is sized such that the cover and the elastomeric material remain separated by the gap within a pressure operating range of the pressure sensor.

[0053] Example 6: The device or method of any one of Examples 1 to 5, wherein the cover includes a fluid port having an opening located above the pressure sensor, and the elastomeric material above the pressure sensor is exposed through the opening.

[0054] Example 7: The device or method of any one of Examples 1 to 6, wherein the elastic modulus of the cover is greater than the elastic modulus of the elastomeric material.

[0055] Example 8: The device or method of any of Examples 1 to 7, further comprising a second sensor device disposed on a top surface of a carrier substrate and encapsulated within the volume of elastomeric material. The second sensor device is adjacent to a second recessed channel in the carrier substrate, the second recessed channel being disposed between the first sensor device and the second sensor device. The volume of elastomeric material has a first height above the carrier substrate in a third region above the second sensor device. A portion of the volume of elastomeric material fills the second recessed channel and forms a second flange region recessed below the first height between the first sensor device and the second sensor device.

[0056] Example 9: The device or method of any one of Examples 1 to 8, comprising bonding the cover to the top surface of the second flange area.

[0057] Example 10: The device or method of any one of Examples 1 to 9, wherein the carrier substrate is a substrate that is divided along lines passing through the second recessed channels to produce a first component including a first sensor device and a second component including a second sensor device.

[0058] Example 11: A device or method according to any one of Examples 1 to 10, wherein the gap between the cover and the elastomeric material is sized so that the cover and the elastomeric material remain separated by the gap within a predetermined pressure operating range of the first sensor device.

[0059] The foregoing detailed description and examples are merely illustrative in nature and are not intended to limit the embodiments of the subject matter or the application and use of such embodiments. As used herein, the word "exemplary" means "serving as an example, instance, or illustration." Any embodiment described herein as exemplary is not necessarily to be construed as preferred or advantageous over other embodiments. Furthermore, no one is intended to be bound by any expressed or implied theory presented in the prior art, background, or detailed description.

[0060] It should be understood that the application of the present invention is not limited to the details of the construction and arrangement of the components set forth in the foregoing description or shown in the accompanying drawings. The present invention can have other embodiments and can be practiced or implemented in various ways. And, it should be understood that the words and terms used herein are for the purpose of description and should not be considered as restrictive. The use of "including" or "having" and its variations herein is intended to cover the items listed thereafter and their equivalents and other items. Unless otherwise specified or limited, the terms "install", "connect", "support" and "couple" and their variations are used in a broad sense and cover direct and indirect installation, connection, support and coupling. In addition, "connect" and "couple" are not limited to physical or mechanical connections or couplings.

[0061] The previous discussion is presented to enable those skilled in the art to make and use embodiments of the present invention. Various modifications to the illustrated embodiments will be apparent to those skilled in the art, and the general principles herein may be applied to other embodiments and applications without departing from embodiments of the present invention. Therefore, embodiments of the present invention are not intended to be limited to the illustrated embodiments, but rather should be given the widest scope consistent with the principles and features disclosed herein. The previous detailed description should be read with reference to the drawings, in which similar elements in different figures have similar reference numerals. The drawings, which are not necessarily drawn to scale, depict selected embodiments, and are not intended to limit the scope of embodiments of the present invention. Those skilled in the art will recognize that the examples provided herein have many useful alternatives and fall within the scope of embodiments of the present invention.

[0062] The connecting lines shown in the various figures included herein are intended to represent exemplary functional relationships and / or physical couplings between the various elements. It should be noted that many alternative or additional functional relationships or physical connections may be present in one or more embodiments of the subject matter. In addition, certain terms may also be used herein only for reference purposes, and therefore do not wish to be restrictive, and unless the context clearly indicates, the terms "first", "second" and other such numerical terms referring to structures do not imply a sequence or order.

[0063] The above description refers to elements or nodes or features being "connected" or "coupled" together. As used herein, unless otherwise expressly stated, "connected" means that one element is directly joined to another element (or is directly communicated with another element), and not necessarily mechanically. Similarly, unless otherwise expressly stated, "coupled" means that one element is directly or indirectly joined to another element (or is directly or indirectly communicated with another element electrically or otherwise), and not necessarily mechanically. Therefore, although the schematic diagrams shown in the figures depict an exemplary arrangement of elements, additional intermediate elements, devices, features, or assemblies may be present in one or more embodiments of the depicted subject matter.

Claims

1. A method, characterized in that include: encapsulating a first sensor device within a volume of elastomeric material on a top surface of a carrier substrate, wherein the first sensor device is adjacent to a first recessed channel in the carrier substrate; wherein the volume of elastomeric material has a first height above the carrier substrate in a first region above the first sensor device; wherein a portion of the volume of elastomeric material fills the first recessed channel and forms a first flange region in a second region adjacent to the first region that is recessed below the first height; and Wherein the method further comprises bonding a cover to the first flange region in the second zone, the cover overlying the volume of elastomeric material such that the cover is separated from the volume of elastomeric material by a gap in the first zone.

2. The method according to claim 1, characterized in that Additionally included is disposing an adhesive material on the first flange area, and bonding the cover to a top surface of the first flange area via the adhesive material disposed on the flange.

3. The method according to claim 1, characterized in that Further included is disposing an adhesive material on a portion of the bottom surface of the cover corresponding to the first flange area, and bonding the cover to a top surface of the first flange area via the adhesive material disposed on the portion of the bottom surface of the cover.

4. The method according to claim 1, characterized in that: The first sensor device is a pressure sensor having a predetermined pressure operating range, and wherein the elastomeric material is configured to deform in response to an ambient pressure within the operating range of the pressure sensor.

5. The method according to claim 4, characterized in that The gap between the cover and the elastomeric material is sized such that the cover and the elastomeric material remain separated by the gap within the pressure operating range of the pressure sensor.

6. The method according to claim 4, characterized in that The cover includes a port having an opening over the pressure sensor, the elastomeric material over the pressure sensor being exposed through the opening.

7. The method according to claim 4, characterized in that The cover has a modulus of elasticity greater than a modulus of elasticity of the elastomeric material.

8. The method according to claim 1, characterized in that Also includes: encapsulating a second sensor device within the volume of elastomeric material on the carrier substrate, wherein the second sensor device is adjacent to a second recessed channel in the carrier substrate, the second recessed channel being disposed between the first sensor device and the second sensor device; wherein the volume of elastomeric material has the first height above the carrier substrate in a third region above the second sensor device; and The volume of elastomeric material fills the second recessed channel and forms a second flange region recessed below the first height between the first sensor device and the second sensor device.

9. The method according to claim 8, characterized in that The method additionally includes bonding the cover to a top surface of the second flange region.

10. A device, characterized in that: include: a first sensor device disposed on a top surface of a carrier substrate adjacent to a first recessed channel in the carrier substrate; a volume of elastomeric material disposed on the carrier substrate encapsulating the first sensor device; as well as a cover disposed over the volume of elastomeric material; wherein the volume of elastomeric material has a first height above the carrier substrate in a first region above the first sensor device; wherein a portion of the volume of elastomeric material fills the first recessed channel to form a first flange region recessed below the first height in a second region adjacent to the first region; and Wherein the cover is bonded to the first flange region in the second zone, the cover overlying the volume of elastomeric material such that the cover and the volume of elastomeric material are separated by a gap in the first zone.

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