High-precision full-automatic die bonder with high working efficiency and use method
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Patent Information
- Application Number
- CN202411557173.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-04
- Publication Date
- 2025-03-11
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing crystal solidifiers are less efficient in feeding and feeding, require manual participation, and the steps are cumbersome, resulting in low efficiency, especially in the dispensing process, and the calibration of workpieces of different specifications is not fast and accurate enough.
A high-precision fully automatic crystal-fixing machine is designed, adopting a multi-module design, including loading module, runner module, dispensing module, welding head module, wafer disk module and hoisting module. Through the coordinated work of these modules, rapid loading, dispensing and adsorption assembly of frames and wafers can be achieved.
It realizes the rapid and efficient loading, dispensing and adsorption assembly processes of chips and frames, improves production accuracy and efficiency, reduces manual participation, and ensures the safety and efficiency of operations.
Smart Images
Figure CN119601499A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of crystal bonding machines, and in particular to a high-precision fully automatic crystal bonding machine with high working efficiency and a use method thereof. Background Art
[0002] The die bonder is mainly used for wafer fixation and wafer heating in the oven. In the semiconductor manufacturing process, the die bonder can fix the wafer at a specific position in the process for subsequent processing, such as gold wire ultrasonic welding, chip mounting, etc. At the same time, it can also provide a constant temperature environment in the oven to ensure the quality and stability of the wafer.
[0003] The applicant discovered through error detection that the existing crystal bonding machines are inefficient in loading and feeding materials, most of them require manual participation, have many steps, and the loading speed is slow and very cumbersome, resulting in low efficiency. At the same time, the efficiency is not high when dispensing glue, and the speed is slow. The calibration of the dispensing position for workpieces of different specifications is not fast and accurate enough.
[0004] Therefore, it is particularly necessary to design a high-precision fully automatic die bonding machine with high working efficiency and a method of use to solve the above technical problems. Summary of the invention
[0005] The object of the present invention is to provide a high-precision fully automatic die bonding machine with high working efficiency and a method of using the same, so as to solve the existing problems raised in the above-mentioned background technology.
[0006] In order to solve the above technical problems, the present invention provides a high-precision fully automatic crystal bonding machine with high working efficiency, comprising: a frame module, which includes a main frame, a module mounting platform is installed on the top of the main frame, and the module mounting platform is divided into two layers, a feeding module, including a box-type feeding mechanism and a stacking feeding mechanism, the box-type feeding mechanism is installed on the top of the main frame and is used for stacking and loading IC frame material box clips, the stacking feeding mechanism is installed on the top of the module mounting platform and is located obliquely above one side of the box-type feeding mechanism, a flow channel module, the flow channel module is installed on two brackets on the top of the module mounting platform, and the stacking feeding mechanism is used to grab and Place it in the flow channel module for transportation, a glue dispensing module, which is installed on the top of the module mounting platform and located on one side of the stacking loading mechanism, and is used for fast glue dispensing of the transport frame on the flow channel module, a welding head module, which is installed on the top of the module mounting platform and located on one side of the glue dispensing module, a wafer disc module, which is installed on the top of the module mounting platform and located below the flow channel module, and the wafer disc module is used to fix the wafer disc for feeding in the XY direction, and a lifting module, which is installed on the inside of the main frame, and is used to lift the chip inside the wafer disc fixed by the wafer disc module and adsorb it to the welding head module, and the welding head module places the adsorbed chip on the frame.
[0007] Preferably, a material unloading module is installed at the other end of the main frame relative to the box-type loading mechanism, and the material unloading module also adopts a box-type unloading structure design.
[0008] Preferably, the dispensing module includes a guide rail fixed on the top of the module mounting platform, and the top of the guide rail has two designed sliders that slide electromagnetically. The sliders are electromagnetically slidably connected to the bottom slide rail of the driving box, and one side of the driving box is rotatably connected to the dispensing head, and the dispensing head is driven to rotate by installing an electric cam structure inside the driving box.
[0009] Preferably, a camera module is installed on one side of the drive box, and the camera of the camera module is used for positioning the frame to the glue dispensing station and for detection after glue dispensing.
[0010] Preferably, the wafer disc module includes a base fixed on the top of the module mounting table, the top of the base is electromagnetically slidably connected to a middle seat, the top of the middle seat is electromagnetically slidably connected to a clamping frame, and the inner side of the clamping frame is electromagnetically slidably installed with a pneumatic gripper mechanism for grabbing the wafer disc and moving it from one side of the clamping frame to the top thereof, and the pneumatic gripper mechanism can only move horizontally forward and backward.
[0011] Preferably, clamping plates driven to move by electric screws are installed on the top and inner side of the clamping frame, and the clamping plates clamp the wafer from top to bottom, and the clamping plates are provided with circular openings.
[0012] Preferably, when the pneumatic gripper mechanism grabs the wafer and moves it to the top of the clamping frame, it passes through the opening between the upper clamping plate and the clamping frame.
[0013] Preferably, the wafer disk module also includes a driving box fixed inside the main frame, one side of the driving box is connected to a lifting seat for lifting, and the lifting seat is electromagnetically slidably connected to a tray, the tray is used for limiting the stacking of wafer disks, and the tray is located on one side of the base.
[0014] Preferably, the lifting module includes a module seat fixed to the inner wall of the main frame, an electric push rod is installed on the top of the module seat, and a chip push rod is installed on the top output end of the electric push rod. The chip push rod can pass through the module mounting table and the clamping frame, and eject the chip in the round wafer and adsorb the welding head module through the circular opening of the clamping plate below.
[0015] The present invention also provides a method for using a high-precision fully automatic die bonding machine with high working efficiency, comprising:
[0016] S1. Transportation and processing
[0017] First, each module is installed on the rack module, and then the storage frame is loaded through the loading module and transported to the flow channel module for transportation. It is transported to the dispensing module and stopped to prepare for dispensing.
[0018] S2. Glue dispensing
[0019] The frame is transported to the designated location for dispensing processing. This is the first process. The dispensing module moves in the XY direction, the camera module is calibrated, and then the servo motor drives the cam mechanism to drive the dispensing head to perform dispensing in the Z direction. After the operation is completed, it is transported to the next process by the runner module.
[0020] S3. Assembly Processing
[0021] After the frame is glued, it is transported to the assembly position. The wafer disc is first fixed by the wafer disc module for feeding in the XY direction. Then the lifting module lifts the chip on the wafer disc module, and the chip is separated from the wafer disc and rises to a height that can be adsorbed by the welding head module. The welding head module has an adsorption function and can accurately adsorb the chip lifted by the lifting module. After the welding head module adsorbs the chip, it will move it to the top of the frame pre-dotted with glue by the glue dispensing module, and ensure the alignment of the chip and the frame through a precise positioning system. After the alignment is completed, the welding head module will gently place the chip on the frame so that it is in close contact with the glue. Subsequently, the crystal bonder will solidify the glue in a certain way, thereby firmly sticking the chip to the frame, and finally transport it to the unloading module for collection.
[0022] S4. Chip feeding process
[0023] With a pallet that can be raised, lowered and translated, a pneumatic gripper mechanism is used to automatically replace the old wafer disc with the new one, and then the wafer disc module is clamped and fixed using the screw structure on the module and two clamping plates.
[0024] The beneficial effects of the present invention are:
[0025] 1. The present invention adopts a multi-module design to quickly load and transport frames and wafer trays, so that the loading of chips and frames is very fast and efficient, no human intervention is required, the safety is very good, the production accuracy is improved, and the two are carried out independently without interfering with each other. Moreover, the dispensing and adsorption assembly work can be carried out synchronously. The overall operation is very efficient, and the efficiency is very high in mass production.
[0026] 2. The present invention adopts the design of the dispensing module. The frame is transported to the bottom of the dispensing head and stops. The guide rail 1 cooperates with the slider and the drive box to enable the dispensing head to move in the XY direction, so as to flexibly adjust the position. At the same time, the cam mechanism inside the drive box is driven to rotate the left and right dispensing heads to the appropriate position for dispensing. The operation is very fast and convenient, which improves the work efficiency of dispensing.
[0027] 3. The present invention installs a camera module at a driving box, which can determine the dispensing position more accurately and quickly without manual description. At the same time, it can perform detection after dispensing, further improving work efficiency and accuracy.
[0028] 4. The present invention adopts the wafer disc module design, and the wafer discs can be stacked on the pallet. When taking materials, the wafer disc is located on one side of the clamping frame. A pneumatic gripper mechanism grabs a wafer disc to the top of the clamping frame, and the electric screw drives the clamping plate to perform displacement clamping to complete automatic grabbing and loading. In this way, the chips in the wafer disc can be loaded automatically, and at the same time, the loading speed and efficiency are effectively improved. At the same time, the pallet can be raised and lowered to avoid the height being reduced and unable to be grabbed due to the number of wafer discs. At the same time, the pallet can be moved left and right, which is more flexible to operate. The wafer disc with used chips can be placed on the surface of the other end of the pallet.
[0029] 5. Through the design of lifting the module seat, the wafer disk, starting the electric push rod, the chip push rod moves up to eject the chip from the wafer disk, and the chip is adsorbed to the welding head module at the corresponding position above, which is very convenient. At the same time, the middle seat slides electromagnetically on the base, and the clamping frame slides electromagnetically on the middle seat, which can move the clamping frame in the XY direction, so that the chips closely distributed on the wafer disk can be regularly lifted to the welding head module in sequence for adsorption, and continuous loading processing can be carried out with high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] The present invention is further described below in conjunction with the accompanying drawings and embodiments.
[0031] Figure 1 The present invention provides a high-efficiency, high-precision, fully automatic crystal bonding machine and a method of using the same. Figure 1 ;
[0032] Figure 2 The present invention provides a high-efficiency, high-precision, fully automatic crystal bonding machine and a method of using the same. Figure 2 ;
[0033] Figure 3 A three-dimensional diagram of a frame module of a high-precision fully automatic die bonding machine with high working efficiency and a method of using the same in the present invention;
[0034] Figure 4A three-dimensional diagram of a cassette-type loading mechanism of a high-precision fully automatic crystal bonding machine with high working efficiency and a method of using the present invention;
[0035] Figure 5 A three-dimensional diagram of a stacking feeding mechanism of a high-precision fully automatic crystal bonding machine with high working efficiency and a method of using the present invention;
[0036] Figure 6 A three-dimensional diagram of a dispensing module of a high-precision fully automatic die bonding machine with high working efficiency and a method of using the present invention;
[0037] Figure 7 A three-dimensional diagram of a lifting module of a high-precision fully automatic die bonding machine with high working efficiency and a method of using the present invention;
[0038] Figure 8 A three-dimensional diagram of a wafer plate module of a high-precision fully automatic crystal bonding machine with high working efficiency and a method of using the present invention;
[0039] Fig. 9 A three-dimensional diagram of the interior of a clamping frame of a high-precision fully automatic crystal bonding machine with high working efficiency and a method of using the same in the present invention;
[0040] Fig.10 This is a disassembled stereoscopic diagram of a wafer disc module of a high-precision fully automatic crystal bonding machine with high working efficiency and a method of using the present invention.
[0041] In the figure:
[0042] 00, rack module; 001, main frame; 002, module mounting table; 01, loading module; 011, box-type loading mechanism; 012, stacking loading mechanism; 02, flow channel module; 03, dispensing module; 031, guide rail 1; 032, slider; 033, drive box; 034, dispensing head; 04, welding head module; 05, wafer disk module; 051, base; 052, middle seat; 053, clamping frame; 054, pneumatic gripper mechanism; 055, clamping plate; 056, drive box; 057, tray; 06, lifting module; 061, module seat; 062, electric push rod; 063, chip push rod; 07, unloading module; 08, camera module. DETAILED DESCRIPTION
[0043] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.
[0044] like Figure 1-Figure 10As shown, a high-precision fully automatic crystal bonding machine with high working efficiency and a method of using the same are provided, wherein the frame module 00 comprises a main frame 001, a module mounting platform 002 is mounted on the top of the main frame 001, the module mounting platform 002 is divided into two layers, a feeding module 01 comprises a box-type feeding mechanism 011 and a stacking feeding mechanism 012, the box-type feeding mechanism 011 is mounted on the top of the main frame 001, and is used for stacking and loading IC frame material box clips, the stacking feeding mechanism 012 is mounted on the top of the module mounting platform 002 and is located obliquely above one side of the box-type feeding mechanism 011, a flow channel module 02, the flow channel module 2 is mounted on two brackets on the top of the module mounting platform 002, and the stacking feeding mechanism 012 is used to grab and place the frame loaded by the box-type feeding mechanism 011 To the flow channel module 2 for transportation, glue dispensing module 03, glue dispensing module 03 is installed on the top of the module mounting platform 002 and is located on the side of the stacking loading mechanism 012, and is used for fast glue dispensing of the transport frame on the flow channel module 2, welding head module 04, welding head module 04 is installed on the top of the module mounting platform 002 and is located on the side of glue dispensing module 03, wafer disk module 05, wafer disk module 05 is installed on the top of the module mounting platform 002 and is located below the flow channel module 02, wafer disk module 05 is used to fix the wafer disk for feeding in the XY direction, lifting module 06, lifting module 06 is installed on the inner side of the main frame 001, and is used to lift the chip inside the wafer disk fixed by the wafer disk module 05 and adsorb it with the welding head module 04, and the welding head module 04 places the adsorbed chip on the frame.
[0045] As mentioned above, the present invention can quickly carry out the loading and transportation of frames and wafer trays through multi-module design, so that the loading of chips and frames is very fast and efficient, no human intervention is required, the safety is very good, the production accuracy is improved, and the two are carried out independently without interfering with each other, and the dispensing and adsorption assembly work can be carried out synchronously. The overall operation is very efficient, and the efficiency is very high in mass production.
[0046] See Figure 6 The dispensing module 03 includes a guide rail 031 fixed on the top of the module mounting platform 002. The top of the guide rail 031 has two designed sliders 032 for electromagnetic sliding. The sliders 032 are electromagnetically slidably connected to the bottom slide rail of the driving box 033, and one side of the driving box 033 is rotatably connected to the dispensing head 034, and the driving box 033 is internally installed with an electric cam structure to drive the dispensing head 034 to rotate.
[0047] As mentioned above, during processing, the frame is first transported from the loading module 01 to the runner module 02, and the frame is stacked on the box-type loading mechanism 011 during loading, and is grabbed one by one by the stacking loading mechanism 012 and transferred to the runner module 02. The loading module 01 and the runner module 02 can be assembled by the user by selecting a suitable structure or a structure that the user is good at operating. This is a prior art, and the specific structure and operation principle are not described in detail. The frame is transported to the bottom of the dispensing head 034 and stops. The guide rail 031, the slider 032 and the drive box 033 cooperate to make the two dispensing heads 034 move synchronously and oppositely in the XY direction, so as to flexibly adjust the position. At the same time, the electric cam mechanism inside the drive box 033 is driven to make the left and right dispensing heads 034 rotate to the appropriate position for dispensing. The operation is very fast and convenient, which improves the work efficiency of dispensing.
[0048] A camera module 08 is installed on one side of a driving box 033. The camera of the camera module 08 is used to position the frame to the glue dispensing station and to detect after glue dispensing.
[0049] As mentioned above, by installing a camera module 08 at a driving box 033, the dispensing position can be determined more accurately and quickly without manual aiming, and at the same time, inspection can be performed after dispensing, further improving work efficiency and accuracy.
[0050] See Figure 8-Figure 10 The wafer disk module 05 includes a base 051 fixed on the top of the module mounting platform 002. The top of the base 051 is electromagnetically slidably connected to a middle seat 052. The top of the middle seat 052 is electromagnetically slidably connected to a clamping frame 053. The inner side of the clamping frame 053 is electromagnetically slidably installed with a pneumatic gripper mechanism 054 for grabbing the wafer disk. The pneumatic gripper mechanism 054 can only move horizontally back and forth and move from one side of the clamping frame 053 to its top. The top and inner side of the clamping frame 053 are both installed with a clamping plate 055 driven by an electric screw. The clamping plate 055 clamps the wafer from top to bottom, and the clamping plates 055 are all provided with circular openings. When the pneumatic gripper mechanism 054 grabs the wafer and moves it to the top of the clamping frame 053, it passes through the opening between the upper clamping plate 055 and the clamping frame 053. The wafer module 05 also includes a driving box 056 fixed to the inner side of the main frame 001. A lifting seat is connected to one side of the driving box 056 for lifting. A tray 057 is electromagnetically slidably connected to the lifting seat. The tray 057 is used for limiting the stacking of wafers. The tray 057 is located on one side of the base 051.
[0051] As described above, through the design of the wafer disc module 05, the wafer discs can be stacked on the tray 057. When taking materials, the wafer discs are located on one side of the clamping frame 053. A wafer disc is grabbed to the top of the clamping frame 053 through the pneumatic gripper mechanism 054, and the clamping plate 055 is driven by the electric screw to perform displacement clamping to complete automatic grabbing and loading. In this way, the chips in the wafer disc can be automatically loaded, and at the same time, the loading speed and efficiency are effectively improved. At the same time, the tray 057 can be raised and lowered to avoid the height being reduced and unable to be grabbed due to the decrease in the number of wafer discs. At the same time, the tray 057 can move left and right, which is more flexible to operate. The wafer disc with used chips can be placed on the other end surface of the tray 057 for easy replacement.
[0052] See Figure 7 The lifting module 06 includes a module seat 061 fixed on the inner wall of the main frame 001, an electric push rod 062 is installed on the top of the module seat 061, and a chip push rod 063 is installed on the top output end of the electric push rod 062. The chip push rod 063 can pass through the module mounting platform 002 and the clamping frame 053, and eject the chip in the round wafer through the circular opening of the clamping plate 055 below and adsorb it to the welding head module 04.
[0053] The lifting module seat 061 can be fixed on the inner wall of the main frame 001 and is located below the clamping frame 053. After the material is taken out, the electric push rod 062 is started, and the chip push rod 063 moves upward to push the chip out of the wafer disk, and the chip is adsorbed with the welding head module 04 at the corresponding position above. It should be noted that the welding head module 04 and the flow channel module 02 are misaligned at this time, and then the assembly operation can be carried out, which is very convenient. At the same time, the middle seat 052 electromagnetically slides on the base 051, and the clamping frame 053 electromagnetically slides on the middle seat 052, so that the clamping frame 053 can move in the XY direction, so that the chips tightly arrayed on the wafer disk can be regularly lifted to the welding head module 04 in sequence for adsorption, and continuous loading processing can be carried out with high efficiency.
[0054] A material unloading module 07 is installed at the other end of the main frame 001 relative to the box-type loading mechanism 011, and the material unloading module 07 also adopts a box-type unloading structure design.
[0055] As described above, the unloading module 07 can be used to stack and temporarily collect the processed semi-finished products, thereby facilitating subsequent transportation and testing operations.
[0056] By design
[0057] The present invention also provides a method for using a high-precision fully automatic die bonding machine with high working efficiency, comprising:
[0058] S1. Transportation and processing
[0059] First, each module is installed on the rack module 00, and then the storage frame is loaded through the loading module 01, and transported to the flow channel module 02 for transportation, and then transported to the dispensing module 03 to stop and prepare for the dispensing work.
[0060] S2. Glue dispensing
[0061] The frame is transported to the designated location for dispensing processing. This is the first process. The dispensing module 03 moves in the XY direction, the camera module 08 is calibrated, and then the servo motor drives the cam mechanism to drive the dispensing head 034 to perform dispensing in the Z direction. After the operation is completed, it is transported to the next process by the runner module 02.
[0062] S3. Assembly Processing
[0063] After the frame is glued, it is transported to the assembly position. First, the wafer disk is fixed by the wafer disk module 05 for feeding in the XY direction. Then the lifting module 06 lifts the chip on the wafer disk module 05. The chip is separated from the wafer disk and rises to a height that can be adsorbed by the welding head module 04. The welding head module 04 has an adsorption function and can accurately adsorb the chip lifted by the lifting module 06. After adsorbing the chip, the welding head module 04 will move it to the top of the frame pre-dotted with glue by the glue dispensing module 03, and ensure the alignment of the chip and the frame through a precise positioning system. After the alignment is completed, the welding head module 04 will gently place the chip on the frame so that it is in close contact with the glue. Subsequently, the crystal bonding machine will solidify the glue by certain methods such as heating and pressurization, thereby firmly sticking the chip to the frame, and finally transport it to the unloading module 07 for collection.
[0064] S4. Chip feeding process
[0065] In conjunction with the tray 057 that can be raised, lowered and translated, the pneumatic gripper mechanism 054 is used to automatically replace the old wafer disc with the new one, and then the lead screw structure on the wafer disc module is used in conjunction with the two clamping plates 055 to clamp and fix it.
[0066] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.
Claims
1. A high-precision fully automatic die bonding machine with high working efficiency, characterized in that: include: A rack module (00) comprises a main frame (001), a module mounting platform (002) is mounted on the top of the main frame (001), and the module mounting platform (002) is divided into two layers; A feeding module (01) comprises a box-type feeding mechanism (011) and a stacking feeding mechanism (012), wherein the box-type feeding mechanism (011) is mounted on the top of the main frame (001) and is used for stacking and loading IC frame material box clips, and the stacking feeding mechanism (012) is mounted on the top of the module mounting platform (002) and is located obliquely above one side of the box-type feeding mechanism (011); A flow channel module (02), wherein the flow channel module (2) is mounted on two brackets on the top of the module mounting platform (002), and the stacking loading mechanism (012) is used to grab the frame loaded by the box-type loading mechanism (011) and place it on the flow channel module (2) for transportation; A glue dispensing module (03), the glue dispensing module (03) being mounted on the top of the module mounting platform (002) and located on one side of the stacking feeding mechanism (012), and being used for fast glue dispensing on the transport frame on the runner module (2); A welding head module (04), wherein the welding head module (04) is mounted on the top of the module mounting platform (002) and is located on one side of the dispensing module (03); A wafer disc module (05), the wafer disc module (05) is mounted on the top of the module mounting platform (002) and is located below the flow channel module (02), and the wafer disc module (05) is used to fix the wafer disc for feeding in the XY direction; A lifting module (06) is installed on the inner side of the main frame (001) and is used to lift the chip inside the wafer disc fixed by the wafer disc module (05) and adsorb it to the welding head module (04), and the welding head module (04) places the adsorbed chip on the frame.
2. A high-precision fully automatic die bonding machine with high working efficiency as claimed in claim 1, characterized in that: The main frame (001) is provided with a material unloading module (07) at the other end relative to the box-type loading mechanism (011), and the material unloading module (07) also adopts a box-type unloading structure design.
3. A high-precision fully automatic die bonding machine with high working efficiency as claimed in claim 1, characterized in that: The dispensing module (03) includes a guide rail (031) fixed on the top of the module mounting platform (002), and the top of the guide rail (031) has two designed sliders (032) for electromagnetic sliding. The sliders (032) are electromagnetically slidably connected to the bottom slide rail of the driving box (033), and one side of the driving box (033) is rotatably connected to the dispensing head (034), and the driving box (033) is installed with an electric cam structure inside to drive the dispensing head (034) to rotate.
4. A high-precision fully automatic die bonding machine with high working efficiency as claimed in claim 3, characterized in that: A camera module (08) is installed on one side of the driving box (033), and the camera of the camera module (08) is used to locate the frame to the glue dispensing station and to detect after glue dispensing.
5. A high-precision fully automatic die bonding machine with high working efficiency as claimed in claim 1, characterized in that: The wafer disk module (05) includes a base (051) fixed on the top of the module mounting platform (002); the top of the base (051) is electromagnetically slidably connected to a middle seat (052); the top of the middle seat (052) is electromagnetically slidably connected to a clamping frame (053); the inner side of the clamping frame (053) is electromagnetically slidably installed with a pneumatic gripper mechanism (054) for grabbing the wafer disk and moving it from one side of the clamping frame (053) to the top thereof; the pneumatic gripper mechanism (054) can only move horizontally forward and backward.
6. A high-precision fully automatic die bonding machine with high working efficiency as claimed in claim 5, characterized in that: The top and inner side of the clamping frame (053) are both equipped with clamping plates (055) that are driven to move by an electric screw rod. The clamping plates (055) clamp the wafer from top to bottom, and the clamping plates (055) are each provided with a circular opening.
7. A high-precision fully automatic die bonding machine with high working efficiency as claimed in claim 6, characterized in that: When the pneumatic gripper mechanism (054) grabs the round wafer and moves it to the top of the clamping frame (053), it passes through the opening between the upper clamping plate (055) and the clamping frame (053).
8. A high-precision fully automatic die bonding machine with high working efficiency as claimed in claim 7, characterized in that: The wafer disk module (05) also includes a driving box (056) fixed on the inner side of the main frame (001), one side of the driving box (056) is connected to a lifting seat for lifting, and the lifting seat is electromagnetically slidably connected to a tray (057), and the tray (057) is used for limiting the stacking of round wafers, and the tray (057) is located on one side of the base (051).
9. A high-precision fully automatic die bonding machine with high working efficiency as claimed in claim 6, characterized in that: The lifting module (06) includes a module seat (061) fixed on the inner wall of the main frame (001), an electric push rod (062) is installed on the top of the module seat (061), and a chip push rod (063) is installed on the top output end of the electric push rod (062). The chip push rod (063) can pass through the module mounting platform (002) and the clamping frame (053), and eject the chip in the round wafer through the circular opening of the clamping plate (055) below and adsorb it to the welding head module (04).
10. A method for using a high-precision fully automatic die bonding machine with high working efficiency as claimed in any one of claims 1 to 9, characterized in that: The method of use comprises the following steps: S1. Transportation and processing First, each module is installed on the rack module (00), and then the storage frame is loaded through the loading module (01), and transported to the flow channel module (02) for transportation, and then transported to the dispensing module (03) and stopped to prepare for dispensing. S2. Glue dispensing The frame is transported to the designated location for dispensing. This is the first process. The dispensing module (03) moves in the XY direction, the camera module (08) performs calibration, and then the servo motor drives the cam mechanism to drive the dispensing head (034) to perform dispensing in the Z direction. After the operation is completed, it is transported to the next process by the runner module (02). S3. Assembly Processing After the frame is glued, it is transported to the assembly position. First, the wafer disk is fixed by the wafer disk module (05) for feeding in the XY direction. Then, the lifting module (06) lifts the chip on the wafer disk module (05). The chip is separated from the wafer disk and rises to a height that can be adsorbed by the welding head module (04). The welding head module (04) has an adsorption function and can accurately adsorb the chip lifted by the lifting module (06). After adsorbing the chip, the welding head module (04) will move it to the top of the frame pre-dotted with glue by the glue dispensing module (03), and ensure the alignment of the chip and the frame through a precise positioning system. After the alignment is completed, the welding head module (04) will gently place the chip on the frame so that it is in close contact with the glue. Subsequently, the crystal bonding machine solidifies the glue by a certain method (such as heating, pressurization, etc.), thereby firmly sticking the chip to the frame, and finally transporting it to the unloading module (07) for collection. S4. Chip feeding process In conjunction with a tray (057) that can be raised, lowered and translated, a pneumatic gripper mechanism (054) is used to automatically replace the old wafer disc with the new one, and then the lead screw structure on the wafer disc module is used in conjunction with two clamping plates (055) to clamp and fix them.