Semiconductor chip packaging device

Abstract

The invention relates to a semiconductor chip packaging device which comprises a base table, a heating block, an auxiliary block, an arc sliding rail, a transmission block and a spraying block, a substrate is arranged above the base table, an inverted chip is installed at the top end of the substrate, the substrate and the chip are connected through a metal ball, the transmission block controls the spraying block to move, and the spraying block is arranged on the base table. The spraying block guides glue in the glue bottle to be sprayed to the gap between the chip and the substrate towards the gap between the chip and the substrate, an arc sliding rail is arranged on the periphery of the chip and the substrate, a telescopic displacement block is arranged at the arc sliding rail, the position of the telescopic displacement block can be changed at the arc sliding rail, the telescopic displacement block is connected with a bubble removing needle and a partition piece, and the bubble removing needle is connected with the partition piece. Through the combined action of the two metal balls, the gaps between the metal balls are defoamed, and meanwhile, the sizing material is disturbed to promote uniform distribution of the sizing material.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a semiconductor chip packaging device. Background Art

[0002] The packaging of semiconductor chips is of vital importance in the modern electronics industry. It not only protects the chips, but also affects the performance, reliability and manufacturing cost of the entire electronic equipment. Packaging the chip can protect the chip from physical damage, moisture, dust and other environmental factors, improve the durability and service life of the component, and help the chip dissipate the heat generated during operation, avoid damage caused by overheating, and improve the reliability and performance of the device; In the existing flip chip process, the chip is inverted and covered on top of the substrate, and a number of metal balls are arranged between the chip and the substrate to connect the chip and the substrate. The flip chip can create more connection points between the chip and the substrate, which can greatly improve the performance of the chip. At the same time, when flipping the chip, it is necessary to fill the space between the chip and the substrate with thermal conductive adhesive to dissipate the heat of the chip. The thermal conductive adhesive is mostly sprayed, and the capillary phenomenon of the liquid is used to make the liquid continuously cover the gap between the metal balls. However, due to the relatively viscous physical properties of the thermal conductive adhesive and the dense distribution of the metal balls, it is very easy to cause bubbles to form between the metal balls, accompanied by uneven thermal conductive adhesive. Summary of the invention

[0003] The object of the present invention is to provide a semiconductor chip packaging device to solve the problems of poor clamping stability caused by the workpiece clamping method in the prior art and narrow applicability for single-direction welding of the workpiece weld.

[0004] To achieve the above object, the present invention provides the following technical solutions: A semiconductor chip packaging device comprises a base, a substrate is mounted on the top of the base, a plurality of linear arrays of metal balls and flip-chips are arranged above the substrate, a heating block is arranged below the substrate, and the heating block is connected to the substrate by controlling the metal balls above the substrate to release heat; An auxiliary block is arranged above the base, a transmission block is arranged above the auxiliary block, a power supply is arranged between the base and the transmission block, the transmission block is movably connected with a spraying block, the spraying block is connected with a glue bottle, and the spraying block controls the glue in the glue bottle to spray between the chip and the substrate; The auxiliary block includes an arc slide rail, a telescopic displacement block, a displacement belt, and a debubble needle. The telescopic displacement block is slidably connected in the arc slide rail, and the displacement belt is arranged in the telescopic displacement block. The displacement belt includes a toothed belt and two gears, and each of the two ends of the gear is hinged with a rotating shaft. The telescopic displacement block is hinged with a positioning plate, and one end of a plurality of first telescopic rods is movably connected in the positioning plate, and a debubble needle is hinged at the other end of each of the first telescopic rods, and the first telescopic rod controls the debubble needle to extend into the gap between the metal balls through telescopic control.

[0005] Optionally, a plurality of clamping slide rails are provided in the heating block, each of the clamping slide rails is slidably connected to a clamping plate, and the clamping plate is connected to the base station through a sliding control substrate.

[0006] Optionally, a plurality of second telescopic rods are connected to the auxiliary block, and the second telescopic rods are symmetrically arranged with the telescopic displacement block as the center. The second telescopic rods control the telescopic displacement block to slide on the arc slide rail by telescoping. When the telescopic displacement block moves on the arc slide rail, the telescopic displacement block itself can maintain its connection with the second telescopic rods and the arc slide rail by telescoping.

[0007] Optionally, the outer side of each of the debubble needles is connected to a symmetrically arranged auxiliary debubble fork, and the first telescopic rod controls the auxiliary debubble fork to enter the gap between the metal balls through telescopic control.

[0008] Optionally, one end of a third telescopic rod is further provided in the telescopic displacement block, the other end of the third telescopic rod is connected to a connecting block, a plurality of partition pieces are hinged at the connecting block, the partition pieces are movably connected to the connecting block, each of the debubble needles passes through the partition piece and enters the gap between the metal balls, and the auxiliary debubble fork connected to each debubble needle will contact the partition piece when passing through the partition piece.

[0009] Optionally, a splash plate is hingedly connected to the spray block, and the splash plate is located outside the spray block and away from the chip.

[0010] Optionally, the auxiliary debubble fork has an arc shape, and the center of the auxiliary debubble fork is arranged toward a side close to the chip.

[0011] Beneficial effects: 1. The debubble needle of the present invention and the auxiliary debubble fork connected thereto can move in the gap between the metal balls, so that the auxiliary debubble fork can cyclically produce bending deformation during the movement, and can burst the bubbles by its own relatively large movement, thereby achieving a good debubble effect.

[0012] 2. The circular arc slide rail of the present invention can allow the telescopic displacement block to change its position through continuous sliding, so that the telescopic displacement block can be opposite to the three surfaces of the chip away from the spraying block, thereby controlling the debubble needle and the auxiliary debubble fork connected thereto to move from different directions relative to the gap between the metal balls, and can disturb the thermal conductive glue between the metal balls, thereby making the thermal conductive glue more uniform between the chip and the substrate, and can help the thermal conductive glue better utilize its own physical properties to assist the chip operation.

[0013] 3. The partition sheet and splash plate of the present invention are arranged around the chip and cooperate with the debubbling needle and the spray block respectively, thereby preventing the debubbling needle and the spray block from overflowing the thermal conductive adhesive during operation, and effectively preventing other components on the substrate surface from being affected. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the three-axis side structure of the whole invention.

[0015] Figure 2 It is a schematic diagram of the connection between the circular arc slide rail and the telescopic displacement block of the present invention.

[0016] Figure 3 It is a connection schematic diagram of the spray block of the present invention.

[0017] Figure 4 It is a schematic diagram of the telescopic displacement block of the present invention.

[0018] In the figure: 1. base; 11. substrate; 12. metal ball; 13. chip; 14. heating block; 15. power supply; 16. clamping slide; 17. clamping plate; 18. splash plate; 2. auxiliary block; 21. arc slide; 22. telescopic displacement block; 23. displacement belt; 231. toothed belt; 232. gear; 24. bubble removal needle; 241. auxiliary bubble removal fork; 25. rotating shaft; 26. adjustment plate; 27. first telescopic rod; 28. second telescopic rod; 3. transmission block; 4. spraying block; 5. glue bottle; 6. partition piece; 61. third telescopic rod; 62. connecting block. DETAILED DESCRIPTION

[0019] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] Please refer to Figure 1-Figure 4 The present invention provides a semiconductor chip packaging device, and the specific implementation scheme is as follows: like Figure 1 , Figure 2 and Figure 3 As shown, a semiconductor chip packaging device includes a base 1, a substrate 11 is installed on the top of the base 1, a flip-mounted chip 13 is covered on the top of the substrate 11, a plurality of metal balls 12 are arranged on the opposite surface of the chip 13 and the substrate 11, the metal balls 12 are connected to the chip 13, after the metal balls 12 correspond to the substrate 11, a heating block 14 is arranged below the substrate 11, the heating block 14 passes through the base 1 and is connected to a power source 15, the heating block 14 controls the metal balls 12 above the substrate 11 to liquefy by heat release, after heating is stopped, the metal balls 12 are solidified, and then the metal balls 12 encapsulate the chip 13 and the substrate 11, a plurality of clamping slide rails 16 are arranged in the heating block 14, each clamping slide rail 16 is slidably connected with a clamping plate 17, the clamping plate 17 controls the two ends of the substrate 11 to contact with the base 1 and the clamping plate 17 respectively by sliding, and then the clamping plate 17 and the base 1 can limit the substrate 11.

[0021] An auxiliary block 2 is arranged above the base 1, a transmission block 3 is arranged above the auxiliary block 2, a spray block 4 is sleeved on the transmission block 3, a power supply 15 is arranged between the base 1 and the transmission block 3, the power supply 15 supplies power to the auxiliary block 2, the transmission block 3 and the spray block 4, the spray block 4 is arranged with a certain inclination at a portion close to the chip 13 and the substrate 11, a splash plate 18 is hinged at one end of the spray block 4 close to the chip 13 and the substrate 11, and the splash plate 18 is inclined in the direction of the inclination of the spray block 4 to prevent The splash plate 18 is located outside the spray block 4, and the splash plate 18 is located outside the spray block 4 away from the chip 13 and the substrate 11. When the spray block 4 sprays the adhesive toward between the chip 13 and the substrate 11, the spray block 4 sprays the adhesive at an angle. When the adhesive starts to spray and ends to spray, the splash plate 18 can prevent the adhesive from splashing onto the surface of the substrate 11 that is not connected to the metal ball 12, thereby reducing the impact of the adhesive on other electronic devices connected to the substrate 11. The transmission block 3 includes a square frame, and a lateral moving block and a radial moving block are slidably connected to the top and bottom ends of the square frame respectively. The lateral moving block and the radial moving block are sleeved on the outside of the spray block 4. A number of positioning telescopic rods are respectively arranged in the lateral moving block and the radial moving block. All the positioning telescopic rods are symmetrically arranged with the spray block 4 as the center. The positioning telescopic rods in the lateral moving block control the spray block 4 to move laterally relative to the square block by telescoping, and the positioning telescopic rods in the radial moving block control the spray block 4 to move radially relative to the square block by telescoping.

[0022] The spray block 4 is specifically a nozzle structure. A glue bottle 5 is connected to the outside of the spray block 4. A filling port is set on the outside of the glue bottle 5. The filling port is used to add glue. At the same time, the glue bottle 5 is also externally connected to a booster pump. The booster pump can apply pressure to the inside of the glue bottle 5. The glue in the glue bottle 5 flows into the spray block 4 under pressure and is sprayed out through the spray block 4. The spray block 4 mainly plays a nozzle guiding function and can guide the glue to flow between the chip 13 and the substrate 11. The spray block 4 guides the glue in the glue bottle 5 to contact the metal ball 12 between the chip 13 and the substrate 11.

[0023] like Figure 1-Figure 4 As shown, the auxiliary block 2 includes an arc slide rail 21, a telescopic displacement block 22, a displacement belt 23, and a bubble removal needle 24. The telescopic displacement block 22 is slidably connected in the arc slide rail 21. The displacement belt 23 is arranged in the telescopic displacement block 22. The displacement belt 23 includes a toothed belt 231 and two gears 232. The two gears 232 are arranged up and down. The toothed belt 231 is sleeved on the outer sides of the two gears 232. The rotating shafts 25 arranged on both sides of the gears 232 pass through the telescopic displacement block 22 and are connected to the power supply 15. The rotating shaft 25 is rotated by the electric control gear 232. When the toothed belt 231 faces the core A positioning plate 26 is hinged on one side of the sheet 13, and a rotating shaft 25 connected by two gears 232 can adjust the toothed belt 231 to move up and down by rotating in opposite directions. An auxiliary telescopic rod is hinged on one side of the telescopic displacement block 22 close to the positioning plate 26, and the positioning plate 26 is hinged. When the toothed belt 231 moves up and down, one end of the positioning plate 26 can be driven to swing accordingly, and then the other end of the positioning plate 26 swings in the opposite direction. The swing of the positioning plate 26 drives the first telescopic rod 27, the debubble needle 24 and the auxiliary debubble fork 241 to tilt. Therefore, when there are certain components on the surface of the substrate 11 that are located on the running paths of the debubble needle 24 and the auxiliary debubble fork 241, the debubble needle 24 and the auxiliary debubble fork 241 can avoid them to a certain extent, and then the debubble needle 24 and the auxiliary debubble fork 241 can enter between the chip 13 and the substrate 11 in a direction inclined relative to the horizontal plane to debubble the gaps between the metal balls 12; The materials of the debubble needle 24 and the auxiliary debubble fork 241 are both relatively soft materials and can undergo large bending deformation. At the same time, the auxiliary debubble fork 241 has an arc shape, and the center of the auxiliary debubble fork 241 is set toward the side close to the chip 13, so that the auxiliary debubble fork 241 will be in more complete contact with the metal ball 12, and then as the first telescopic rod 27 controls the debubble needle 24 to go deeper through the telescopic control, the auxiliary debubble fork 241 will bend, and after bending until the auxiliary debubble fork 241 can pass through the gap between the metal balls 12, the auxiliary debubble fork 241 encounters a larger The auxiliary bubble-removing fork 241 will bend again when passing through the gap between the next metal ball 12 and the metal ball 12; when the first telescopic rod 27 controls the bubble-removing needle 24 to move away from the chip 13 through telescopic control, the auxiliary bubble-removing fork 241 will still bend when passing through the gap between the metal balls 12 and the metal balls 12, but compared with when the bubble-removing needle 24 moves toward the direction close to the chip 13, the auxiliary bubble-removing fork 241 will produce relatively smaller deformation when moving away from the chip 13.

[0024] A plurality of second telescopic rods 28 are connected to the auxiliary block 2, and the second telescopic rods 28 are symmetrically arranged with the telescopic displacement block 22 as the center. The telescopic directions of the second telescopic rods 28 on both sides of the telescopic displacement block 22 are opposite. Therefore, the second telescopic rods 28 on both sides of the telescopic displacement block can control the telescopic displacement block 22 and the circular arc slide rail 21 to move in the same plane by telescopic control. A telescopic structure is arranged inside the telescopic displacement block 22, and the telescopic displacement block 22 is divided into two parts, namely a fixed part connected to the second telescopic rod 28 and a movable part connected to the circular arc slide rail 21. In the telescopic structure in the telescopic displacement block 22, the movable part of the telescopic displacement block 22 will telescope and move relative to the fixed part of the telescopic displacement block 22, and the movable part of the telescopic displacement block 22 will also swing at a certain angle relative to the fixed part of the telescopic displacement block 22, so that the telescopic displacement block 22 can adapt to sliding in the circular arc slide rail 21. At the same time, the second telescopic rods 28 on both sides of the telescopic displacement block respectively control the position of the telescopic displacement block 22 at the arc slide rail 21 through telescopic control, so as to achieve the purpose of changing the relative position of the telescopic displacement block 22 and the chip 13. Through the second telescopic rods 28, the telescopic displacement block 22 can slide at the arc slide rail 21 until the telescopic displacement block 22 is respectively opposite to the three surfaces of the chip 13 away from the spray block 4, so that the debubbling needle 24 can correspond to the gap between the metal balls 12 and the metal balls 12, and the debubbling can be carried out smoothly.

[0025] The outer side of each debubble needle 24 is connected to a symmetrically arranged auxiliary debubble fork 241, so that the symmetrically arranged auxiliary debubble forks 241 can be in the same plane, and then when the debubble needle 24 enters the gap between the metal balls 12, the two symmetrically arranged auxiliary debubble forks 241 can avoid contact with the chip 13 or the substrate 11 while assisting in debubble removal, thereby reducing damage to the chip 13 or the substrate 11.

[0026] One end of a third telescopic rod 61 is also provided in the telescopic displacement block 22, and the other end of the third telescopic rod 61 is connected with a connecting block 62, and a plurality of partition pieces 6 are hinged at the connecting block 62, and the partition pieces 6 are movably connected to the connecting block 62, and each partition piece 6 is arranged in a linear array along the connecting block 62. When the first telescopic rod 27 is extended and retracted, the debubble needle 24 and the auxiliary debubble fork 241 will pass through the gap between the partition pieces 6, and then can pass through the partition piece 6 to enter between the chip 13 and the substrate 11, and when the auxiliary debubble fork 241 passes through the gap between the partition pieces 6 When the auxiliary bubble removal fork 241 passes through the partition piece 6 and moves toward the chip 13, the auxiliary bubble removal fork 241 will bend greatly, and then bend to be able to pass through the gap between the partition pieces 6, and then enter the gap between the metal balls 12 and the metal balls 12. When the auxiliary bubble removal fork 241 passes through the partition piece 6 in the direction away from the chip 13, the auxiliary bubble removal fork 241 will have a relatively small deformation until it can pass through the gap between the partition pieces 6. However, at this time, when the auxiliary debubble fork 241 passes through the gap between the partition pieces 6, most of the glue adsorbed on the surfaces of the debubble needle 24 and the auxiliary debubble fork 241 will be scraped off by the partition pieces 6 located on both sides of the debubble needle 24, and the scraped glue will come into contact with the surface of the nearest metal ball 12. These metal balls 12 are located on the three sides of the chip 13 away from the spray block 4, and thus the surfaces of these metal balls 12 that are not directly sprayed by the spray block 4 will have parts that are not coated with glue. However, these parts that are not coated with glue will come into contact with the glue scraped off by the partition pieces 6. The surface of the metal ball 12 is completely covered with glue, which can effectively improve the heat dissipation performance of the metal ball 12, and at the same time can further ensure the uniformity of the glue between the chip 13 and the substrate 11, thereby assisting the smooth operation of the chip 13.

[0027] The working process of a semiconductor chip 13 sealing device of this embodiment is as follows: the side of the chip 13 connected with the metal ball 12 is covered on the top of the substrate 11, and then the clamping plate 17 is controlled to limit the substrate 11, and the heating block 14 is controlled to start heat release. After the metal ball 12 is liquefied, the heating block 14 stops heat release, and the metal ball 12 solidifies again after cooling, and the metal ball 12 becomes an arc-shaped object. Then the chip 13 and the substrate 11 are connected through the metal ball 12, and the current and signal can be transmitted between the chip 13 and the substrate 11 through the metal ball 12. Through the positioning telescopic rod, the lateral moving block and the radial moving block of the transmission block 3, the position of the spray block 4 can be moved according to the specifications of different chips 13, so that the position of the spray block 4 is matched with the position of the chip 13 and the substrate 11. The booster pump connected to the device sprays the glue in the glue bottle 5 through the spray block 4 to the surface of the metal ball 12 between the chip 13 and the substrate 11. The splash plate 18 located outside the spray block 4 can prevent the glue from splashing to other positions of the substrate 11. When the glue is sprayed into the metal ball 12 area, the glue can continuously fill the gap between the metal balls 12 and the metal balls 12 between the chip 13 and the substrate 11 through the capillary phenomenon between the metal balls 12 and the metal balls 12. During the filling, bubbles may be generated in the gap between the metal balls 12 because the glue is relatively viscous, the pressure of the spray is too high or too low, and the speed of the spray is too fast. After the glue sprayed by the spray block 4 basically covers the chip 13 and the metal ball 12 in the substrate 11, the second telescopic rod 28 controls the telescopic displacement block 22 to slide in the arc slide rail 21, and then slides to the side of the chip 13 away from the spray block 4, and then controls the rotation of the gear 232 through the rotating shaft 25, and then the toothed belt 231 moves accordingly, and then the adjustment plate 26 begins to have a certain deviation relative to the horizontal plane, and the third telescopic rod 61 controls the partition plate 6 to move close to the side of the chip 13 away from the spray block 4 through telescopic control, and then the first telescopic rod 27 in the adjustment plate 26 can pass through the partition plate 6 while avoiding some electronic devices on the substrate 11 when controlling the position of the debubbling needle 24 through telescopic control, and debubbles the gap between the metal balls 12 and the metal balls 12; When the debubble needle 24 and the auxiliary debubble fork 241 penetrate into the gap between the metal balls 12 and 12, the symmetrically arranged auxiliary debubble fork 241 will contact the metal balls 12, and as the debubble needle 24 continues to penetrate, the auxiliary debubble fork 241 will bend until it passes through the gap between the metal balls 12 and 12, and when the debubble needle 24 moves in a direction away from the chip 13, the auxiliary debubble fork 241 will also bend, but the bending amplitude will be relatively small, until the auxiliary debubble fork 241 contacts the partition sheet 6, and the glue attached to the surface of the debubble needle 24 and the auxiliary debubble fork 241 will be scraped off by the partition sheet 6, and the scraped glue will be in contact with the outermost surface of the metal ball 12 because the partition sheet 6 is close to the side of the chip 13 away from the spraying block 4, and the side of the outermost metal ball 12 that was not covered with glue through the capillary phenomenon will also be covered with glue; After completion, the second telescopic rod 28 controls the telescopic displacement block 22 to slide on the arc slide rail 21 through telescopic control until the telescopic displacement block 22 stays opposite to the other two surfaces of the chip 13 that are not connected to the spray block 4, and then the bubble removal needle 24 and the auxiliary bubble removal fork 241 repeat the above operation, and then in addition to debubbling the gap between the metal balls 12 and assisting the glue between the metal balls 12 to become more uniform, the glue can also be applied to other metal balls 12 that are connected to the edge of the chip 13 but not directly in contact with the glue sprayed by the spray block 4, and the surfaces of the metal balls 12 that are not coated can be covered with glue, thereby effectively improving the heat dissipation performance of the chip 13 and the substrate 11.

[0028] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A semiconductor chip packaging device, characterized in that: It comprises a base (1), a substrate (11) is mounted on the top of the base (1), a plurality of linear array metal balls (12) and a flip-chip (13) are arranged above the substrate (11), a heating block (14) is arranged below the substrate (11), and the heating block (14) is connected to the substrate (11) by controlling the metal balls (12) above the substrate (11) to release heat; An auxiliary block (2) is arranged above the base (1), a transmission block (3) is arranged above the auxiliary block (2), a power supply (15) is arranged between the base (1) and the transmission block (3), the transmission block (3) is movably connected to a spray block (4), the spray block (4) is connected to a glue bottle (5), and the spray block (4) controls the glue in the glue bottle (5) to be sprayed between the chip (13) and the substrate (11); The auxiliary block (2) comprises an arc slide rail (21), a telescopic displacement block (22), a displacement belt (23), and a bubble removal needle (24). The telescopic displacement block (22) is slidably connected inside the arc slide rail (21). The displacement belt (23) is arranged inside the telescopic displacement block (22). The displacement belt (23) comprises a toothed belt (231) and two gears (232). Both ends of each gear (232) are hinged with a rotating shaft (25). The telescopic displacement block (22) is hinged with a positioning plate (26). One end of a plurality of first telescopic rods (27) is movably connected inside the positioning plate (26). The other end of each first telescopic rod (27) is hinged with a bubble removal needle (24). The first telescopic rod (27) controls the bubble removal needle (24) to extend into the gap between the metal balls (12) by telescoping.

2. The semiconductor chip packaging device according to claim 1, characterized in that: A plurality of clamping slide rails (16) are arranged in the heating block (14), each of the clamping slide rails (16) is slidably connected to a clamping plate (17), and the clamping plate (17) is connected to the base platform (1) through a sliding control substrate (11).

3. The semiconductor chip packaging device according to claim 1, characterized in that: The auxiliary block (2) is connected to a plurality of second telescopic rods (28), the second telescopic rods (28) being symmetrically arranged with the telescopic displacement block (22) as the center, the second telescopic rods (28) controlling the telescopic displacement block (22) to slide on the arc slide rail (21) by telescoping, and when the telescopic displacement block (22) moves on the arc slide rail, the telescopic displacement block (22) itself can maintain its connection with the second telescopic rods (28) and the arc slide rail (21) by telescoping.

4. The semiconductor chip packaging device according to claim 1, characterized in that: The outer side of each of the debubble needles (24) is connected to a symmetrically arranged auxiliary debubble fork (241), and the first telescopic rod (27) controls the auxiliary debubble fork (241) to enter the gap between the metal balls (12) by telescoping.

5. The semiconductor chip packaging device according to claim 1, characterized in that: One end of a third telescopic rod (61) is also arranged in the telescopic displacement block (22), and the other end of the third telescopic rod (61) is connected to a connecting block (62). A plurality of partition pieces (6) are hingedly connected to the connecting block (62), and the partition pieces (6) are movably connected to the connecting block (62). Each of the bubble removal needles (24) passes through the partition piece (6) and enters the gap between the metal balls (12). The auxiliary bubble removal fork (241) connected to each bubble removal needle (24) contacts the partition piece (6) when passing through the partition piece (6).

6. The semiconductor chip packaging device according to claim 1, characterized in that: A splash plate (18) is hingedly connected to the spray block (4), and the splash plate (18) is located outside the spray block (4) and away from the chip (13).

7. The semiconductor chip packaging device according to claim 4, characterized in that: The auxiliary debubble fork (241) has an arc shape, and the center of the auxiliary debubble fork (241) is arranged toward a side close to the chip (13).

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