SOIC small-shape integrated circuit packaging device

Abstract

The invention relates to the technical field of integrated circuits, in particular to an SOIC small-shape integrated circuit packaging device. Comprising a packaging box, a groove is formed in the packaging box, a plurality of transmission rollers are arranged in the groove and sleeved with a conveying belt, a pressing device, a moving device and a conveying device are arranged in the packaging box, the pressing device is arranged on one side of the moving device, and the conveying device is arranged on the other side of the moving device. A second cam is driven to rotate through a transmission shaft, when the bottommost end of the second cam rotates to the upper portion, a moving rod drives a connecting rod to move downwards, a pressing plate moves downwards to press an integrated circuit, the integrated circuit is pressed before packaging, the phenomenon of position deviation of the integrated circuit in the packaging process is prevented, and the packaging efficiency is improved. When the transmission shaft rotates, the first cam is driven to rotate, the first cam drives the packaging head to move to package the integrated circuit, packaging is conducted after pressing is conducted through the pressing plate, and the packaging quality of the integrated circuit is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuits, and in particular to a SOIC small outline integrated circuit packaging device. Background Art

[0002] Integrated circuit packaging has been advancing along with the development of integrated circuits. With the continuous development of various industries such as aerospace, aviation, machinery, light industry, and chemical industry, the whole machine is also changing towards multi-function and miniaturization. This requires that the integration of integrated circuits is getting higher and higher, and the functions are getting more and more complex. Correspondingly, the integrated circuit packaging density is required to be higher and higher, the number of leads is increasing, and the size is getting smaller and smaller, the weight is getting lighter, and the replacement is getting faster and faster. The rationality and scientificity of the packaging structure will directly affect the quality of the integrated circuit.

[0003] When packaging existing integrated circuits, the integrated circuits are placed on a conveyor belt and pressed and packaged by a packaging head. Plastic packaging materials such as epoxy resin are used. The plastic packaging materials are cured at high temperature to form a packaging body that protects the chip and leads. However, the epoxy resin material has adhesion and can easily cause the integrated circuit to move during operation. At the same time, during the pressing process, if the pressure distribution is uneven, the integrated circuit may be subjected to greater pressure in some areas and less pressure in other areas, thereby causing the integrated circuit to move, affecting the packaging quality of the integrated circuit and reducing the packaging efficiency of the integrated circuit. Summary of the invention

[0004] The object of the present invention is to provide a SOIC small outline integrated circuit packaging device to solve the problems raised in the above background technology.

[0005] To achieve the above object, a SOIC small outline integrated circuit packaging device is provided, comprising a packaging box, a groove is provided inside the packaging box, a plurality of transmission rollers are arranged inside the groove, a conveyor belt is sleeved on the plurality of transmission rollers, a pressing device, a moving device and a conveying device are arranged inside the packaging box, and the pressing device is arranged on one side of the moving device, and the conveyor belt is used to place the integrated circuit;

[0006] The integrated circuit is placed on the conveyor belt. The pressing device presses the integrated circuit when working, and the pressing device drives the moving device to work while pressing. After the moving device is driven by the pressing device, it packages the integrated circuit pressed by the pressing device. After the moving device packages the integrated circuit pressed by the pressing device, the pressing device synchronously drives the conveying device to work, so that the conveying device transports the packaged integrated circuit.

[0007] As a further improvement of the present technical solution, the pressing device includes a motor fixedly connected to the inside of the packaging box, the output end of the motor is fixedly connected to a transmission shaft, a No. 2 cam is fixedly connected to the transmission shaft, a moving rod is arranged at the upper end of the No. 2 cam, a connecting rod is arranged on one side of the moving rod, an end of the connecting rod away from the moving rod is fixedly connected to a fixed plate, the fixed plate is located above the integrated circuit, the motor drives the transmission shaft to rotate, the transmission shaft drives the No. 2 cam to rotate, the No. 2 cam drives the connecting rod to move downward, so that the fixed plate moves downward to press the integrated circuit.

[0008] As a further improvement of the present technical solution, the fixed plate is internally slidably connected to two sliding rods, the lower ends of the sliding rods are fixedly connected to a pressing plate, the upper end of the pressing plate and the lower side of the fixed plate are fixedly connected to a spring, and the spring is arranged on the pressing plate, and when the fixed plate moves downward and is pressed, the pressing plate is driven downward and squeezes the spring, and the integrated circuit is buffered under the action of the spring.

[0009] As a further improvement of the present technical solution, the moving device includes a support frame fixedly connected to the inside of the packaging box, a sleeve fixedly connected to the inside of the support frame, a push rod slidably connected to the inside of the sleeve, a slider fixedly connected to one side of the push rod, and the slider is slidably connected to the sleeve, a packaging head is provided at one end of the slider away from the sleeve, the movement of the push rod drives the slider to move, and the slider drives the packaging head to move to package the integrated circuit.

[0010] As a further improvement of the present technical solution, the transmission shaft is fixedly connected to cam No. 1, and the positions of cam No. 1 and cam No. 2 are staggered. Cam No. 1 is arranged at the end of the push rod away from the sleeve. When the transmission shaft rotates, cam No. 1 is driven to rotate, and the rotation of cam No. 1 drives the push rod to move.

[0011] As a further improvement of the technical solution, a roller is provided at one end of the push rod and the moving rod, a slide groove is provided on the second cam and the first cam, and the roller is slidably connected inside the slide groove.

[0012] As a further improvement of the present technical solution, the conveying device includes a dial fixedly connected to the transmission shaft, a groove wheel is fixedly connected to the transmission roller, and a plurality of grooves matching the size of the dial are opened on the groove wheel. The rotation of the transmission shaft drives the dial to rotate, the rotation of the dial drives the groove wheel to rotate, and the rotation of the groove wheel drives the conveyor belt to rotate, thereby conveying the packaged integrated circuits on the conveyor belt.

[0013] As a further improvement of the technical solution, the upper end of the moving rod is fixedly connected to a support plate, both ends of the support plate are fixedly connected to movable blocks, and the movable blocks are slidably connected to the side walls of the packaging box.

[0014] As a further improvement of the technical solution, a rectangular groove is opened inside the movable rod, and a bolt is rotatably connected inside the rectangular groove. The bolt is threadedly connected to the connecting rod, and the bolt is rotated to adjust the position of the connecting rod.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. In the SOIC small outline integrated circuit packaging device, the transmission shaft drives the No. 2 cam to rotate, and the No. 2 cam drives the moving rod to move back and forth. When the bottom end of the No. 2 cam rotates to the top, the moving rod drives the connecting rod to move downward, and the connecting rod drives the fixed plate to move toward the conveyor belt, so that the pressing plate moves downward to press the integrated circuit. By pressing the integrated circuit before packaging, the integrated circuit is prevented from positional displacement during packaging, thereby improving the stability of the integrated circuit during packaging.

[0017] 2. In the SOIC small outline integrated circuit packaging device, the transmission shaft rotates to drive the No. 1 cam to rotate, and the rotation of the No. 1 cam drives the push rod to move. When the bottom end of the No. 2 cam rotates to the top, the bottom end of the No. 1 cam rotates to one side of the push rod. The movement of the push rod drives the slider to move, and the slider drives the packaging head to move to package the integrated circuit. The packaging is performed after pressing by the pressing plate, which improves the packaging quality of the integrated circuit.

[0018] 3. In the SOIC small outline integrated circuit packaging device, the dial is driven to rotate by the rotation of the transmission shaft. When the packaging head is packaged, the dial is rotated into the slot, so that the rotation of the dial drives the groove wheel to rotate, and the rotation of the groove wheel drives the conveyor belt to rotate, and the packaged integrated circuits on the conveyor belt are transported, which improves production efficiency and reduces labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 It is a first cross-sectional schematic diagram of the packaging box of the present invention;

[0021] Figure 3 is a second cross-sectional schematic diagram of the packaging box of the present invention;

[0022] Figure 4 A half-section schematic diagram of a packaging box of the present invention;

[0023] Figure 5 It is a structural schematic diagram of the conveyor belt of the present invention;

[0024] Figure 6 It is a structural schematic diagram of the mobile device of the present invention;

[0025] Figure 7It is a structural schematic diagram of the pressing device of the present invention;

[0026] Figure 8 It is a schematic structural diagram of the conveying device of the present invention.

[0027] The meaning of each number in the figure is:

[0028] 1. Packaging box; 11. Conveyor belt; 12. Transmission roller;

[0029] 2. Pressing device; 21. Second cam; 22. Moving rod; 23. Connecting rod; 24. Fixing plate; 25. Pressing plate; 26. Support plate; 27. Bolt; 28. Motor; 29. ​​Transmission shaft;

[0030] 3. Moving device; 31. Cam No. 1; 33. Push rod; 34. Sleeve; 35. Slider; 36. Packing head;

[0031] 4. Conveying device; 41. Dial; 43. Groove wheel; 44. Notch. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0034] See also Figure 1-Figure 4 As shown, the present embodiment aims to provide a SOIC small outline integrated circuit packaging device, including a packaging box 1, a groove is opened inside the packaging box 1, a plurality of driving rollers 12 are arranged inside the groove, a conveying belt 11 is sleeved on the plurality of driving rollers 12, a pressing device 2, a moving device 3 and a conveying device 4 are arranged inside the packaging box 1, and the pressing device 2 is arranged on one side of the moving device 3, and the conveying belt 11 is used to place the integrated circuit;

[0035] The integrated circuit is placed on the conveyor belt 11, and the pressing device 2 presses the integrated circuit when working, so as to prevent the integrated circuit from being displaced during packaging, thereby improving the stability of the integrated circuit during packaging;

[0036] The pressing device 2 drives the moving device 3 to work while pressing. After being driven by the pressing device 2, the moving device 3 packages the integrated circuit pressed by the pressing device 2, thereby improving the packaging quality of the integrated circuit. After the moving device 3 packages the integrated circuit pressed by the pressing device 2, the pressing device 2 synchronously drives the conveying device 4 to work, so that the conveying device 4 transports the packaged integrated circuit, thereby improving production efficiency and reducing labor costs.

[0037] See also Figure 5 and Figure 7 As shown, the pressing device 2 includes a motor 28 fixedly connected to the inside of the packaging box 1, the output end of the motor 28 is fixedly connected to a transmission shaft 29, the transmission shaft 29 is fixedly connected to a second cam 21, the upper end of the second cam 21 is provided with a moving rod 22, the moving rod 22 is provided with a connecting rod 23 on one side of the moving rod 22, the connecting rod 23 is fixedly connected to a fixing plate 24 at one end away from the moving rod 22, the fixing plate 24 is located above the integrated circuit, the integrated circuit is placed on the conveyor belt 11, the motor 28 is started to drive the transmission shaft 29 to rotate, and the transmission shaft 29 drives the second cam 21 to rotate;

[0038] One end of the push rod 33 and the moving rod 22 are both provided with rollers, and the No. 2 cam 21 and the No. 1 cam 31 are provided with sliding grooves, and the rollers are slidably connected inside the sliding grooves. The No. 2 cam 21 rotates to drive the moving rod 22 to move. When the highest end of the No. 2 cam 21 moves to the top, the No. 2 cam 21 drives the moving rod 22 to move upward, and the connecting rod 23 drives the fixed plate 24 to move upward, and the fixed plate 24 is away from the position of the conveyor belt 11. When the bottom end of the No. 2 cam 21 rotates to the top, the roller at the lower end of the moving rod 22 moves downward along the sliding groove, and the moving rod 22 drives the connecting rod 23 to move downward, and the connecting rod 23 drives the fixed plate 24 to move toward the conveyor belt 11, so that the fixed plate 24 moves downward to press the integrated circuit. By pressing the integrated circuit before packaging, the integrated circuit is prevented from being offset during packaging, thereby ensuring the stability of the integrated circuit during packaging.

[0039] See also Figure 7 As shown, the fixed plate 24 is internally slidably connected to two sliding rods, the lower ends of the sliding rods are fixedly connected to a pressing plate 25, the upper ends of the pressing plate 25 and the lower side of the fixed plate 24 are fixedly connected to a spring, and the spring is arranged on the pressing plate 25. When the fixed plate 24 is moved downward and pressed, the pressing plate 25 is driven downward and squeezes the spring. Under the action of the spring, the integrated circuit is buffered to prevent damage to the integrated circuit caused by excessive pressing force.

[0040] See also Figure 5 and Figure 6 As shown, the transmission shaft 29 is fixedly connected to the No. 1 cam 31, and the positions of the No. 1 cam 31 and the No. 2 cam 21 are staggered. The No. 1 cam 31 is arranged at the end of the push rod 33 away from the sleeve 34. When the transmission shaft 29 rotates, it drives the No. 1 cam 31 to rotate, and the rotation of the No. 1 cam 31 drives the push rod 33 to move. When the bottom end of the No. 2 cam 21 rotates to the top, the bottom end of the No. 1 cam 31 rotates to one side of the push rod 33. The moving device 3 includes a support frame fixedly connected to the inside of the packaging box 1, the inside of the support frame is fixedly connected to the sleeve 34, the inside of the sleeve 34 is slidably connected to the push rod 33, one side of the push rod 33 is fixedly connected to the slider 35, and the slider 35 is slidably connected to the sleeve 34, and the end of the slider 35 away from the sleeve 34 is provided with a packaging head 36, the movement of the push rod 33 drives the slider 35 to move, and the slider 35 drives the packaging head 36 to move to package the integrated circuit, and then the packaging is performed after the pressing plate 25 is pressed, thereby improving the packaging efficiency of the integrated circuit.

[0041] See also Figure 8 As shown, the conveying device 4 includes a dial 41 fixedly connected to the transmission shaft 29, a groove wheel 43 fixedly connected to the transmission roller 12, and a plurality of grooves 44 matching the size of the dial 41 are formed on the groove wheel 43. The transmission shaft 29 rotates to drive the dial 41 to rotate. When the packaging head 36 is packaged, the dial 41 rotates into the groove 44, so that the rotation of the dial 41 drives the groove wheel 43 to rotate, and the rotation of the groove wheel 43 drives the transmission roller 12 to rotate, and the transmission roller 12 drives the conveyor belt 11 to rotate, so as to convey the packaged integrated circuits on the conveyor belt 11.

[0042] See also Figure 3 As shown, the upper end of the moving rod 22 is fixedly connected to a support plate 26, and both ends of the support plate 26 are fixedly connected to movable blocks. The movable blocks are slidably connected to the side walls of the packaging box 1. When the moving rod 22 moves up and down, it drives the support plate 26 to move, thereby improving the stability of the moving rod 22 during the moving process.

[0043] See also Figure 7 As shown, a rectangular groove is provided inside the movable rod 22, and a bolt 27 is rotatably connected inside the rectangular groove. The bolt 27 is threadedly connected to the connecting rod 23. Since the connecting rod 23 is arranged at an angle, when the position of the connecting rod 23 needs to be adjusted, the bolt 27 is rotated to adjust the position of the connecting rod 23.

[0044] When the SOIC small outline integrated circuit packaging device of the present invention is used, the integrated circuit is placed on the conveyor belt 11, the starting motor 28 drives the transmission shaft 29 to rotate, the transmission shaft 29 drives the second cam 21 to rotate, and the rotation of the second cam 21 drives the moving rod 22 to move. When the highest end of the second cam 21 moves to the upper side, the second cam 21 drives the moving rod 22 to move upward, the connecting rod 23 drives the fixed plate 24 to move upward, and the fixed plate 24 is away from the position of the conveyor belt 11. When the bottom end of the second cam 21 rotates to the upper side, the roller at the lower end of the moving rod 22 moves downward along the slide groove, the moving rod 22 drives the connecting rod 23 to move downward, and the connecting rod 23 drives the fixed plate 24 to move toward the conveyor belt 11, so that the fixed plate 24 moves downward to press the integrated circuit. By pressing the integrated circuit before packaging, the integrated circuit is prevented from being positionally offset during packaging, thereby improving the stability of the integrated circuit during packaging.

[0045] When the transmission shaft 29 rotates, it drives the No. 1 cam 31 to rotate, and the rotation of the No. 1 cam 31 drives the push rod 33 to move. When the bottom end of the No. 2 cam 21 rotates to the top, the bottom end of the No. 1 cam 31 rotates to one side of the push rod 33. The movement of the push rod 33 drives the slider 35 to move, and the slider 35 drives the packaging head 36 to move to package the integrated circuit. The packaging is performed after pressing by the pressing plate 25, which improves the packaging quality of the integrated circuit.

[0046] The transmission shaft 29 rotates to drive the dial 41 to rotate. When the packaging head 36 is packaged, the dial 41 rotates into the slot 44, so that the rotation of the dial 41 drives the groove wheel 43 to rotate, and the rotation of the groove wheel 43 drives the transmission roller 12 to rotate. The transmission roller 12 drives the conveyor belt 11 to rotate, and the packaged integrated circuits on the conveyor belt 11 are transported, thereby improving production efficiency and reducing labor costs.

[0047] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A SOIC small outline integrated circuit packaging device, comprising a packaging box (1), characterized in that: The packaging box (1) is provided with a groove inside, a plurality of transmission rollers (12) are arranged inside the groove, a conveyor belt (11) is sleeved on the plurality of transmission rollers (12), a pressing device (2), a moving device (3) and a conveying device (4) are arranged inside the packaging box (1), and the pressing device (2) is arranged on one side of the moving device (3), and the conveyor belt (11) is used to place integrated circuits; An integrated circuit is placed on a conveyor belt (11); the pressing device (2) presses the integrated circuit when in operation, and the pressing device (2) drives the moving device (3) to operate while pressing; the moving device (3) is driven by the pressing device (2) to package the integrated circuit pressed by the pressing device (2); and after the moving device (3) packages the integrated circuit pressed by the pressing device (2), the pressing device (2) synchronously drives the conveying device (4) to operate, so that the conveying device (4) transports the packaged integrated circuit.

2. The SOIC small outline integrated circuit package device according to claim 1, characterized in that: The pressing device (2) comprises a motor (28) fixedly connected to the inside of the packaging box (1); the output end of the motor (28) is fixedly connected to a transmission shaft (29); a second cam (21) is fixedly connected to the transmission shaft (29); a moving rod (22) is arranged at the upper end of the second cam (21); a connecting rod (23) is arranged on one side of the moving rod (22); an end of the connecting rod (23) away from the moving rod (22) is fixedly connected to a fixing plate (24); the fixing plate (24) is located above the integrated circuit; the motor (28) drives the transmission shaft (29) to rotate; the transmission shaft (29) drives the second cam (21) to rotate; the second cam (21) drives the connecting rod (23) to move downward, so that the fixing plate (24) moves downward to press the integrated circuit.

3. The SOIC small outline integrated circuit package device according to claim 2, characterized in that: The fixing plate (24) is internally slidably connected to two sliding rods, the lower ends of the sliding rods are fixedly connected to a pressing plate (25), the upper ends of the pressing plate (25) and the lower side of the fixing plate (24) are fixedly connected to a spring, and the spring is arranged on the pressing plate (25). When the fixing plate (24) is moved downward and pressed, the pressing plate (25) is driven downward and squeezes the spring, and the integrated circuit is buffered under the action of the spring.

4. The SOIC small outline integrated circuit package device according to claim 2, characterized in that: The moving device (3) comprises a support frame fixedly connected to the inside of the packaging box (1), a sleeve (34) fixedly connected to the inside of the support frame, a push rod (33) slidably connected to the inside of the sleeve (34), a slider (35) fixedly connected to one side of the push rod (33), and the slider (35) is slidably connected to the sleeve (34), and a packaging head (36) is provided at one end of the slider (35) away from the sleeve (34), the push rod (33) moves to drive the slider (35) to move, and the slider (35) drives the packaging head (36) to move to package the integrated circuit.

5. The SOIC small outline integrated circuit package device according to claim 2, characterized in that: The transmission shaft (29) is fixedly connected to a first cam (31), and the positions of the first cam (31) and the second cam (21) are staggered. The first cam (31) is arranged at an end of the push rod (33) away from the sleeve (34). When the transmission shaft (29) rotates, the first cam (31) is driven to rotate, and the rotation of the first cam (31) drives the push rod (33) to move.

6. The SOIC small outline integrated circuit package device according to claim 4, characterized in that: One end of the push rod (33) and the moving rod (22) are both provided with rollers, and the second cam (21) and the first cam (31) are provided with sliding grooves, and the rollers are slidably connected inside the sliding grooves.

7. The SOIC small outline integrated circuit package device according to claim 1, characterized in that: The conveying device (4) comprises a dial (41) fixedly connected to a transmission shaft (29); a groove wheel (43) fixedly connected to the transmission roller (12); a plurality of grooves (44) matching the size of the dial (41) are formed on the groove wheel (43); the transmission shaft (29) rotates to drive the dial (41) to rotate; the dial (41) rotates to drive the groove wheel (43) to rotate; the groove wheel (43) rotates to drive the conveyor belt (11) to rotate, and the packaged integrated circuits on the conveyor belt (11) are conveyed.

8. The SOIC small outline integrated circuit package device according to claim 2, characterized in that: The upper end of the moving rod (22) is fixedly connected to a support plate (26), and both ends of the support plate (26) are fixedly connected to movable blocks, and the movable blocks are slidably connected to the side walls of the packaging box (1).

9. The SOIC small outline integrated circuit package device according to claim 2, characterized in that: A rectangular groove is provided inside the moving rod (22), and a bolt (27) is rotatably connected inside the rectangular groove. The bolt (27) is threadedly connected to the connecting rod (23). The bolt (27) is rotated to adjust the position of the connecting rod (23).

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