A handling device and method for semiconductor substrate processing

Abstract

The present invention belongs to the technical field of semiconductor substrates, and specifically relates to a handling device and method for semiconductor substrate processing; it includes a transfer equipment table and a purification box; a conveyor belt is further arranged on the transfer equipment table, and the purification box is placed on the conveyor belt; a buffer pad is arranged on the inner bottom surface of the purification box, and the semiconductor substrate is located inside the purification box and placed on the top of the buffer pad; a position moving and pressure regulating component is further arranged on the transfer equipment table, and the number of the position moving and pressure regulating components is two groups, and they are symmetrically arranged on both sides of the top of the transfer equipment table, so that the conveyor belt is located between the two groups of position moving and pressure regulating components; through the gas production and pollution prevention unit, it is possible to avoid the semiconductor substrate from being contaminated during the transfer process, and avoid the particulate matter in the air from falling into the conductive area of the substrate, resulting in risks such as electric leakage or short circuit during use, so as to maintain the integrity of the circuit, ensure and improve the performance and stability of the semiconductor substrate during use, and also improve the handling effect of the device.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor substrates, and specifically relates to a handling device and method for processing semiconductor substrates. Background Art

[0002] A semiconductor substrate is a basic material used to support and connect various electronic components in semiconductor devices. It is usually made of semiconductor materials such as silicon, germanium, gallium arsenide, etc., or made of insulating materials such as sapphire, quartz, etc. after special treatment for semiconductor manufacturing; since semiconductor production involves multiple complex processing steps, and the handling device can quickly transfer the substrate from one process to the next, avoiding waiting time during production, greatly improving the overall production efficiency, and enabling each process to be closely connected.

[0003] Existing handling devices are prone to contaminating the substrate during the transfer process, and cannot ensure that the substrate is in a pollution-free state during transfer. If the substrate is contaminated during the transfer or particulate matter in the air falls onto the conductive area of the chip on the substrate, there will not only be risks such as short circuits and leakage, but also damage the integrity of the circuit, making the performance of the semiconductor substrate unable to be guaranteed, thereby reducing the stability of the substrate during use and reducing the handling effect of the device. Summary of the Invention

[0004] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a handling device and method for processing semiconductor substrates, effectively solving the problems in the above background art.

[0005] To achieve the above object, the present invention provides the following technical solution: A handling device for processing semiconductor substrates, including a transfer equipment table and a purification box; a conveyor belt is further provided on the transfer equipment table, and the purification box is placed on the conveyor belt; a buffer pad is provided on the inner bottom surface of the purification box, and the semiconductor substrate is located in the purification box and placed on the top of the buffer pad; a position-moving and pressure-regulating component is further provided on the transfer equipment table, and the number of the position-moving and pressure-regulating components is two groups, and they are symmetrically arranged on both sides of the top of the transfer equipment table, so that the conveyor belt is located between the two groups of position-moving and pressure-regulating components; the position-moving and pressure-regulating component is used to increase the friction between the purification box and the conveyor belt during transfer; a gas-generation and pollution-prevention unit is further provided on the purification box, and the gas-generation and pollution-prevention unit is used to prevent the semiconductor substrate from being contaminated during transfer.

[0006] Preferably, the gas-making and pollution-stopping unit includes a driving motor disposed on the top of the purification box; the bottom of the purification box is placed on the conveyor belt; a braking gear is installed on the output end of the driving motor, and a driving bevel gear is further installed on the side of the braking gear away from the purification box, and a wind-making and drainage mechanism is arranged on the driving bevel gear; a braking rack is arranged on each of the opposite sides of the braking gear, and the braking rack is meshed with the braking gear; two braking square plates are installed on the braking rack, a braking cylinder is jointly connected to the opposite surfaces of the two braking square plates, a braking substrate is slidably arranged on the braking cylinder, and the braking substrate is fixedly arranged on the top of the purification box.

[0007] Preferably, a bent square rod is installed on each of the braking square plates at the two braking racks, and the two bent square rods are respectively located on the front and rear sides of the purification box; a U-shaped square rod is connected to each of the bent square rods, the opening of the U-shaped square rod faces the conveyor belt and a braking cross block is further installed, limiting square plates are installed on both sides of the braking cross block, limiting cylinders are slidably arranged on the limiting square plates, and the limiting cylinders are fixedly arranged on the purification box; a limiting spring is sleeved on the limiting cylinder, one end of the limiting spring is fixedly connected to the purification box, and the other end is fixedly connected to the limiting square plate.

[0008] Preferably, the position-moving and pressure-regulating assembly includes two auxiliary bases symmetrically arranged on one side of the top of the conveying equipment table, an auxiliary square column is fixedly installed on the auxiliary base, and an auxiliary limiting plate is further installed at the end of the auxiliary square column away from the auxiliary base; an auxiliary spring is sleeved on the auxiliary square column, one end of the auxiliary spring is fixedly connected to the auxiliary limiting plate, and the other end is connected to an auxiliary slider which is slidably arranged on the auxiliary square column; adjusting substrates are installed on the opposite surfaces of the two auxiliary sliders, adjusting cylinders are slidably arranged on the adjusting substrates, one end of the adjusting cylinder is connected to an adjusting limiting plate, and an adjusting cross plate is installed at the other end, and an adjusting lock block is fixedly installed on the side of the adjusting cross plate facing the top of the auxiliary square column; a plurality of adjusting lock grooves are arranged on the side of the auxiliary square column facing the adjusting lock block, and the adjusting lock block passes through the auxiliary slider and is connected to the adjusting lock groove.

[0009] Preferably, an adjusting spring is sleeved on the adjusting cylinder. One end of the adjusting spring is connected to the adjusting limit plate, and the other end is connected to the adjusting substrate. A pressure cross block is commonly connected to the opposite surfaces of the two auxiliary moving sliders. Two pressure square columns are slidably arranged on the pressure cross block. U-shaped bases are installed at one ends of the pressure square columns close to the conveyor belt. Transmission pulleys are installed in the U-shaped bases. The two transmission pulleys are commonly connected to a conveyor belt. The side wall of the conveyor belt is made of rubber material and contacts the side surface of the purification square box. A plurality of load-bearing rollers are installed in the opposite surfaces of the conveyor belt. The load-bearing rollers are attached to the inner wall of the conveyor belt close to the purification square box. The plurality of load-bearing rollers are commonly connected to a support substrate, and the support substrate is connected to the U-shaped base. A rotation motor is installed on one of the U-shaped bases, and the rotation motor is connected to the transmission pulley. A pressure spring is sleeved on the pressure square column. One end of the pressure spring is connected to the U-shaped base, and the other end is connected to the pressure cross block.

[0010] Preferably, an elastic sliding stop unit is further arranged on the braking rack. The elastic sliding stop unit includes first square plates arranged on both sides of the braking rack. Elastic sliding rods are penetrated through the first square plates, and the elastic sliding rods are in sliding fit with the first square plates. Second square plates are installed at one ends of the elastic sliding rods far from the braking rack. Elastic teeth are commonly connected to the opposite surfaces of the two second square plates. The elastic teeth are located on the rotation path of the braking gear and are meshed with each other. An extrusion spring is sleeved on the elastic sliding rod. One end of the extrusion spring is connected to the first square plate, and the other end is connected to the second square plate.

[0011] Preferably, the air blowing and drainage mechanism includes two symmetrically arranged rotating bevel gears meshed with the driving bevel gear. Rotating shafts are installed on the opposite surfaces of the two rotating bevel gears. First substrates are installed at one ends of the rotating shafts far from the driving bevel gear. The first substrates are arranged on the top of the purification square box. First helical gears are further installed on the rotating shafts. The first helical gears are meshed with second helical gears. Driving rotating shafts are installed on the second helical gears. Second substrates are connected to the driving rotating shafts. The second substrates are arranged on the first substrates. A first pulley is installed at one end of the driving rotating shaft far from the second helical gear. A belt is connected to the first pulley. A second pulley is connected to the belt. The belt is in sliding fit with the second pulley and the first pulley. A wind blowing rotating shaft is installed on one side of each of the second pulley and the first pulley close to the purification square box.

[0012] Preferably, ventilation circular grooves corresponding to the number and positions of the second pulleys and the first pulleys are provided at the top of the purification square box. One side of the ventilation circular groove extends to the inner top surface of the purification square box, and the other side extends to the top of the purification square box. A filter plate is installed on the top of the purification square box through bolts, and the filter plate covers the ventilation circular groove; the end of the air-making rotating shaft away from the second pulley passes through the filter plate and is connected with a plurality of fan blades, and the fan blades are located in the ventilation circular groove; the two air-making rotating shafts are jointly connected with a T-shaped substrate, and the T-shaped substrate is arranged on the top of the purification square box; a scraping inclined block is also installed on the air-making rotating shaft, and the inclined surface of the scraping inclined block contacts the top of the filter plate.

[0013] Preferably, a stop cylinder is penetrated through the braking cross block, and the stop cylinder is slidably matched with the braking cross block; a stop limiting plate is installed at the end of the stop cylinder away from the purification square box; a hollow cylinder is slidably arranged at the end of the stop cylinder close to the purification square box, and the end of the hollow cylinder away from the stop cylinder is arranged on the purification square box; an airbag is also arranged in the purification square box, and air inlet holes are also arranged on the side surface of the airbag and the purification square box, and the air inlet holes are communicated with the hollow cylinder; the air inlet holes and the bent square rod are in the same position; the outer wall of the airbag is connected with the inner wall of the purification square box, and the inner wall of the airbag contacts the semiconductor substrate when the airbag expands; a stop spring is also sleeved on the stop cylinder, one end of the stop spring is connected with the stop limiting plate, and the other end is connected with the braking cross block.

[0014] The present invention also provides a handling method for processing semiconductor substrates, including the following steps:

[0015] S001. Place a plurality of semiconductor substrates to be handled in the purification square box, so as to convey the semiconductor substrates to the use area through the movement of the conveyor belt;

[0016] S002. Place a plurality of semiconductor substrates on the buffer pads in the purification square box, so as to reduce the impact force generated by the shaking of the semiconductor substrates during conveyance;

[0017] S003. Operate the air-making and pollution-stopping unit to provide a clean environment for the semiconductor substrates during conveyance to avoid contamination.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] (1) Start the drive motor, so that its output end drives the brake gear to rotate, making it engage with two brake racks to move towards each other. Make it move in a limited way on the brake substrate through the brake cylinder. Under the action of the bending square rod, make the two U-shaped square rods move towards each other, so that the brake cross blocks on them all move towards the purification square box, thereby driving the stop cylinder to move in the hollow cylinder, making the gas inside it enter the airbag through the air injection hole, making the airbag expand more and more from the initial shriveled state, making its inner wall move and contact the semiconductor substrate, thus wrapping the semiconductor, that is, setting it in a sealed state, avoiding the pollution of the semiconductor substrate during the transmission process, thereby isolating it, avoiding the particles in the air falling onto the conductive area of the substrate, resulting in risks such as electric leakage or short circuit during use, maintaining the integrity of the circuit, ensuring the use performance of the semiconductor substrate, thus improving the stability of the semiconductor substrate during use, and also improving the handling effect of the device. Brief Description of the Drawings

[0020] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation to the present invention.

[0021] In the drawings:

[0022] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 is a schematic diagram of the structure of the purification square box of the present invention;

[0024] Figure 3 is a schematic diagram of the structure of the pressure cross block of the present invention;

[0025] Figure 4 is a cross-sectional view of the airbag of the present invention;

[0026] Figure 5 is a schematic diagram of the structure of the brake substrate of the present invention;

[0027] Figure 6 is a schematic diagram of the structure of the conveyor belt of the present invention;

[0028] Figure 7 is a cross-sectional view of the hollow cylinder of the present invention;

[0029] Figure 8 is a schematic diagram of the structure of the brake cross block of the present invention;

[0030] Figure 9 is a schematic diagram of the structure of the adjustment lock groove of the present invention;

[0031] Figure 10 is a cross-sectional view of the buffer pad of the present invention;

[0032] Figure 11For the present invention Figure 5 Schematic diagram of the partial enlarged structure at position A in the present invention;

[0033] Figure 12 Cross-sectional view of the ventilation circular groove of the present invention.

[0034] In the figure: 1. Conveyor equipment table; 2. Purification square box; 3. Buffer pad; 4. Driving motor; 5. Braking gear; 6. Driving bevel gear; 7. Braking rack; 8. Braking square plate; 9. Braking cylinder; 10. Braking base plate; 11. Bent square rod; 12. U-shaped square rod; 13. Braking cross block; 14. Limiting square plate; 15. Limiting cylinder; 16. Limiting spring; 17. Auxiliary driving base; 18. Auxiliary driving square column; 19. Auxiliary driving limiting plate; 20. Auxiliary driving spring; 21. Auxiliary driving slider; 22. Adjusting base plate; 23. Adjusting cylinder; 24. Adjusting limiting plate; 25. Adjusting cross plate; 26. Adjusting lock block; 27. Adjusting lock groove; 28. Adjusting spring; 29. Pressure cross block; 30. Pressure square column; 31. U-shaped base; 32. Driving pulley; 33. Conveyor belt; 34. Load-bearing roller; 35. Support base plate; 36. Rotating motor; 37. Pressure spring; 38. First square plate; 39. Elastic sliding rod; 40. Second square plate; 41. Elastic tooth; 42. Extrusion spring; 43. Rotating bevel gear; 44. Rotating shaft; 45. First base plate; 46. First helical gear; 47. Second helical gear; 48. Driving rotating shaft; 49. Second base plate; 50. First pulley; 51. Belt; 52. Second pulley; 53. Wind-making rotating shaft; 54. Ventilation circular groove; 55. Filter plate; 56. Fan blade; 57. T-shaped base plate; 58. Scraping inclined block; 59. Stopping cylinder; 60. Stopping limiting plate; 61. Hollow cylinder; 62. Airbag; 63. Air injection hole; 64. Stopping spring. Specific embodiments

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0036] Embodiment, consisting of Figures 1 to 12Provided, the present invention includes a transfer device table 1 and a purification box 2; a conveyor belt is further provided on the transfer device table 1, and the purification box 2 is placed on the conveyor belt; a buffer pad 3 is provided on the inner bottom surface of the purification box 2, and the semiconductor substrate is located inside the purification box 2 and placed on the top of the buffer pad 3; a position-moving and pressure-regulating component is further provided on the transfer device table 1, and the number of the position-moving and pressure-regulating components is two groups, and they are symmetrically arranged on both sides of the top of the transfer device table 1, so that the conveyor belt is located between the two groups of position-moving and pressure-regulating components; the position-moving and pressure-regulating component is used to increase the friction force between the purification box 2 and the conveyor belt during transfer; a gas-generation and pollution-prevention unit is further provided on the purification box 2, and the gas-generation and pollution-prevention unit is used to prevent the semiconductor substrate from being polluted during transfer;

[0037] The semiconductor substrate to be transported is placed in the purification box 2, and the purification box 2 is placed on the conveyor belt, so that the semiconductor substrate can be transported to the area where it is needed; it is worth mentioning that the purification box 2 is equivalent to a closed space, which can prevent the semiconductor substrate from being polluted during the transportation process, ensuring that the semiconductor substrate is in a pollution-free state during transportation, thereby avoiding risks such as short circuits and leakage when the semiconductor substrate during transportation is polluted or particulate matter in the air falls into the conductive area of the chip on the substrate, and at the same time avoiding damage to the integrity of the circuit. It is worth mentioning that the semiconductor substrate is placed on the buffer pad 3 inside the purification box 2. The buffer and absorption performance brought by the buffer pad 3 can prevent the semiconductor substrate from being damaged due to shaking during transportation. The impact force generated when the semiconductor substrate shakes can be absorbed by the above buffer performance, improving the stability of the semiconductor substrate during transportation, thereby improving the stability of the device when transporting the semiconductor substrate, further avoiding damage to the circuit or chip on the semiconductor substrate, improving the use effect of the device, and ensuring the use performance of the semiconductor substrate, thus improving the transportation effect of the device.

[0038] The gas-making and pollution-stopping unit of this embodiment includes a driving motor 4, and the driving motor 4 is arranged on the top of the purification box 2; the bottom of the purification box 2 is placed on the conveyor belt; a braking gear 5 is installed on the output end of the driving motor 4, and a driving bevel gear 6 is also installed on the side of the braking gear 5 away from the purification box 2, and a wind-making and drainage mechanism is arranged on the driving bevel gear 6; a braking rack 7 is arranged on each of the opposite sides of the braking gear 5, the braking rack 7 is meshed with the braking gear 5, two braking square plates 8 are installed on the braking rack 7, a braking cylinder 9 is jointly connected to the opposite surfaces of the two braking square plates 8, a braking substrate 10 is slidably arranged on the braking cylinder 9, and the braking substrate 10 is fixedly arranged on the top of the purification box 2; a bent square rod 11 is installed on one of the braking square plates 8 at each of the two braking racks 7, and the two bent square rods 11 are respectively located on the front and rear sides of the purification box 2; a U-shaped square rod 12 is connected to each of the bent square rods 11, the opening of the U-shaped square rod 12 faces the conveyor belt and a braking cross block 13 is also installed, limiting square plates 14 are installed on both sides of the braking cross block 13, a limiting cylinder 15 is slidably arranged on the limiting square plates 14, and the limiting cylinder 15 is fixedly arranged on the purification box 2; a limiting spring 16 is sleeved on the limiting cylinder 15, one end of the limiting spring 16 is fixedly connected to the purification box 2, and the other end is fixedly connected to the limiting square plate 14; a stop cylinder 59 penetrates through the braking cross block 13, and the stop cylinder 59 is slidably matched with the braking cross block 13; a stop limiting plate 60 is installed at the end of the stop cylinder 59 away from the purification box 2; a hollow cylinder 61 is slidably arranged at the end of the stop cylinder 59 close to the purification box 2, and the end of the hollow cylinder 61 away from the stop cylinder 59 is arranged on the purification box 2; an airbag 62 is further arranged in the purification box 2, an air injection hole 63 is also arranged on the side surface of the airbag 62 and the purification box 2, and the air injection hole 63 is communicated with the hollow cylinder 61; the air injection hole 63 is in the same position as the bent square rod 11; the outer wall of the airbag 62 is connected to the inner wall of the purification box 2, and the inner wall of the airbag 62 contacts the semiconductor substrate when the airbag expands; a stop spring 64 is also sleeved on the stop cylinder 59, one end of the stop spring 64 is connected to the stop limiting plate 60, and the other end is connected to the braking cross block 13;

[0039] After the semiconductor substrate to be transported is placed in the purification box 2, the driving motor 4 is started, and its output end drives the brake gear 5 to rotate, causing it to engage the two brake racks 7 to move towards each other. Through the brake cylinder 9, it is limited to move on the brake substrate 10. Under the action of the bending square rod 11, the two U-shaped square rods 12 move towards each other, so that the brake cross blocks 13 on them all move towards the purification box 2, driving the stop cylinder 59 to move in the hollow cylinder 61. The gas inside it enters the airbag 62 through the air injection hole 63, causing the airbag 62 to expand more and more from its initial deflated state. Its inner side wall moves and contacts the semiconductor substrate, thus wrapping and enclosing the semiconductor, avoiding contamination of the semiconductor substrate during transportation, isolating it, and preventing particulate matter in the air from falling onto the conductive area of the substrate, which may cause risks such as leakage or short circuit during use, maintaining the integrity of the circuit, ensuring the use performance of the semiconductor substrate, improving the stability of the semiconductor substrate during use, and enhancing the handling effect of the device; and the airbag 62 is made of materials with low pollution and high stability, such as polytetrafluoroethylene, etc.; it is worth mentioning that when the brake cross block 13 moves, it is limited to move on the limit cylinder 15 through the limit square plate 14, making the limit spring 16 in a buffered state, avoiding the brake cross block 13 from shaking during movement, improving the use effect of the airbag 62. At the same time, when it is not necessary to transport the semiconductor substrate, it means that it needs to be taken out of the purification box 2. At this time, just cut off the power supply of the driving motor 4, so that the limit spring 16 is no longer limited. Through the reset of the limit spring 16, the brake cross block 13 is driven to reset and move, making the airbag 62 no longer in an inflated state, releasing the limit setting for the semiconductor substrate, enabling the semiconductor substrate to be smoothly transported to the next processing step, reducing the energy consumption of the device during use, and enhancing the handling effect of the device;

[0040] The position-actuated voltage regulating component of this embodiment includes two auxiliary actuating bases 17 symmetrically arranged on one side of the top of the conveying equipment table 1. An auxiliary actuating square column 18 is fixedly installed on the auxiliary actuating base 17. An auxiliary actuating limit plate 19 is also installed at the end of the auxiliary actuating square column 18 away from the auxiliary actuating base 17; an auxiliary actuating spring 20 is sleeved on the auxiliary actuating square column 18. One end of the auxiliary actuating spring 20 is fixedly connected to the auxiliary actuating limit plate 19, and the other end is connected to an auxiliary actuating slider 21. The auxiliary actuating slider 21 is slidably arranged on the auxiliary actuating square column 18; adjusting substrates 22 are installed on the opposite surfaces of the two auxiliary actuating sliders 21. An adjusting cylinder 23 is slidably arranged on the adjusting substrate 22. One end of the adjusting cylinder 23 is connected to an adjusting limit plate 24, and an adjusting cross plate 25 is installed at the other end. An adjusting lock block 26 is fixedly installed on the side of the adjusting cross plate 25 facing the top of the auxiliary actuating square column 18; a number of adjusting lock grooves 27 are arranged on the side of the auxiliary actuating square column 18 facing the adjusting lock block 26. The adjusting lock block 26 passes through the auxiliary actuating slider 21 and is connected to the adjusting lock groove 27; an adjusting spring 28 is sleeved on the adjusting cylinder 23. One end of the adjusting spring 28 is connected to the adjusting limit plate 24, and the other end is connected to the adjusting substrate 22; a pressure cross block 29 is jointly connected to the opposite surfaces of the two auxiliary actuating sliders 21. Two pressure square columns 30 are slidably arranged on the pressure cross block 29. U-shaped bases 31 are installed at the ends of the pressure square columns 30 close to the conveyor belt. A driving pulley 32 is installed in the U-shaped base 31. The two driving pulleys 32 are jointly connected to a conveyor belt 33. The side wall of the conveyor belt 33 is made of rubber material and contacts the side surface of the purification square box 2; a number of load-bearing rollers 34 are installed inside the opposite surfaces of the conveyor belt 33. The load-bearing rollers 34 are attached to the inner wall of the conveyor belt 33 close to the purification square box 2; a support substrate 35 is jointly connected to the number of load-bearing rollers 34. The support substrate 35 is connected to the U-shaped base 31; a rotary motor 36 is installed on one of the U-shaped bases 31. The rotary motor 36 is connected to the driving pulley 32; a pressure spring 37 is sleeved on the pressure square column 30. One end of the pressure spring 37 is connected to the U-shaped base 31, and the other end is connected to the pressure cross block 29;

[0041] When the semiconductor substrate moves as the purification box 2 moves through the conveyor belt, the two sides of the purification box 2 come into contact with the conveyor belt 33. By starting the rotary motor 36, it drives a driving pulley 32 to rotate. With the cooperation of the conveyor belt 33, the other driving pulley 32 rotates, so that the conveyor belt 33 keeps moving, and the moving direction of the conveyor belt 33 is the same as that of the conveyor belt. Since the two sides of the purification box 2 are attached to the conveyor belt 33, it not only assists in the movement of the purification box 2, increases the friction force when the purification box 2 moves, and avoids the situation that the purification box 2 slips in place due to insufficient friction force when contacting the conveyor belt, thus assisting the purification box 2 to move smoothly, so that the semiconductor substrate can be smoothly conveyed to the required use area. At the same time, it is also used to position the movement of the purification box 2, avoiding phenomena such as deviation or dislocation when the purification box 2 moves, enabling the purification box 2 to always be conveyed along the path, improving the stability of the purification box 2 when moving, and enabling it to always move at the center position of the conveyor belt, improving the handling effect of the device; At the same time, the adjusting cross plate 25 can also be pulled upward, so that it moves on the adjusting substrate 22 through the adjusting cylinder 23, making the adjusting spring 28 in a buffered state. Then, the adjusting lock block 26 on the adjusting cross plate 25 disengages from the auxiliary moving slider 21 and is no longer connected to the adjusting lock groove 27, thus releasing the limit setting of the auxiliary moving slider 21. At this time, by pulling the pressure cross block 29, the auxiliary moving slider 21 on it moves in a limited manner on the auxiliary moving square column 18, making the auxiliary moving spring 20 in a buffered state. Thus, under the action of the pressure square column 30 and the pressure spring 37, the conveyor belt 33 is driven to displace, so that the contact distance between the conveyor belt 33 and the purification box 2 can be adjusted according to different situations, that is, the friction force between the two in contact is adjusted as needed, avoiding the situation that the purification box 2 slips in place due to the small number of substrates loaded in the purification box 2 resulting in a small friction force when the purification box 2 contacts the conveyor belt. At this time, by increasing the friction force between the purification box 2 and the conveyor belt 33, that is, reducing the distance between the two, the above phenomenon can be avoided, enabling the purification box 2 to convey different numbers of semiconductor substrates at one time, avoiding the limitation of the handling quantity during the handling of the device, and improving the handling effect of the device; And it can also avoid the situation that the purification box 2 is heavier due to the large number of substrates loaded in it. If the purification box 2 shakes or deviates during the conveying process, it will strongly impact the conveyor belt 33, causing a large impact force. It moves through the pressure square column 30 on the pressure cross block 29 to relieve the above impact force, and at the same time, the pressure spring 37 is also in a buffered state, reducing the impact force caused by the purification box 2 hitting the conveyor belt during conveying, improving the stability of the purification box 2 during conveying, and further improving the use effect of the device;Meanwhile, after the position of the conveyor belt 33 is adjusted, release the adjusting cross plate 25. The reset of the adjusting spring 28 drives the adjusting lock block 26 to move back to its original position, passing through the auxiliary moving slider 21 and connecting with the adjusting lock groove 27, thereby limiting the conveyor belt 33 in its current position, preventing it from being displaced or dislocated due to non-human factors or the above-mentioned impact force during use, improving the safety of the device during use, and preventing the auxiliary moving spring 20 in the buffer state from resetting. The elastic force generated acts on the adjusting lock block 26, strengthening the frictional force between it and the adjusting lock groove 27, and preventing the adjusting lock block 26 from being displaced due to non-human factors and releasing the limit on the auxiliary moving slider 21, reducing the limitations of the device during use.

[0042] An elastic sliding stop unit is further provided on the brake rack 7 of this embodiment; the elastic sliding stop unit includes first square plates 38 arranged on both sides of the brake rack 7, an elastic sliding rod 39 is penetrated through the first square plates 38, and the elastic sliding rod 39 is in sliding fit with the first square plates 38; a second square plate 40 is installed at one end of the elastic sliding rod 39 away from the brake rack 7, an elastic tooth 41 is commonly connected to the opposite surfaces of the two second square plates 40, the elastic tooth 41 is located on the rotation path of the brake gear 5 and meshes with it; a compression spring 42 is sleeved on the elastic sliding rod 39, one end of the compression spring 42 is connected to the first square plate 38, and the other end is connected to the second square plate 40;

[0043] When the brake gear 5 rotates, it will engage with the brake rack 7 to move. When the brake rack 7 moves to the maximum position, it can no longer move, which will cause the brake gear 5 to engage with the elastic tooth 41. When the two engage, the elastic tooth 41 is limited to move on the first square plate 38 through the elastic slide rod 39 on the second square plate 40, so that the compression spring 42 is in a buffered state. When the brake gear 5 rotates and no longer contacts the elastic tooth 41 during the rotation gap, it is not stressed, resulting in the compression spring 42 no longer being limited, so it resets and drives the elastic tooth 41 to reset and move to the next tooth groove of the brake gear 5 to wait for the next contact between the brake gear 5 and the elastic tooth 41, and repeat the above movement, so that the elastic tooth 41 moves back and forth continuously, causing the brake gear 5 to rotate continuously and continuously apply pressure to the brake rack 7. However, since the brake rack 7 has been displaced to the maximum position, according to the above description, the brake rack 7 can always be in the current position, avoiding the phenomenon of resetting of the brake rack 7 during use, so that the stop cylinder 59 always remains in the current position and avoids moving, resulting in gas loss in the airbag 62, so that the airbag 62 always remains in the current state and enables the air-making and air-draining mechanism to continuously purify the gas flowing in the purification box 2 and the surrounding gas during transmission, enabling the air-making and air-draining mechanism and the gas-making and pollution-stopping unit to share a driving source, reducing the limitations of the device during use, while reducing energy consumption, improving the environmental protection effect of the device during use, avoiding the increase in energy consumption caused by using multiple driving sources during device use, resulting in an increase in the use cost of the device, and improving the handling effect of the device. It is worth mentioning that when the brake cross block 13 on the gas-making and pollution-stopping unit drives the stop cylinder 59 to move in the hollow cylinder 61, when the stop cylinder 59 moves to the maximum position, that is, when the airbag 62 is fully inflated, the stop cylinder 59 can no longer move. At this time, the brake rack 7 can continue to move, driving the brake cross block 13 to continue to move, and it is limited to move on the stop cylinder 59, so that the stop spring 64 is in a buffered state, increasing the connection strength between the stop cylinder 59 and the hollow cylinder 61. Through the buffering force brought by the stop spring 64, even if the stop cylinder 59 has a slight displacement during the use of the airbag 62, the gas in the airbag 62 will not decrease. At the same time, the contact strength between the brake gear 5 and the elastic tooth 41 is increased, improving the handling effect of the device and also improving the effect of the gas-making and pollution-stopping unit during use.

[0044] The air-blowing and drainage mechanism of this embodiment includes two symmetrically arranged rotating bevel gears 43 meshed and connected with the driving bevel gear 6. Rotating shafts 44 are installed on the opposite surfaces of the two rotating bevel gears 43. One end of the rotating shaft 44 away from the driving bevel gear 6 is installed with a first substrate 45, and the first substrate 45 is arranged on the top of the purification box 2; a first helical gear 46 is also installed on the rotating shaft 44, the first helical gear 46 is meshed and connected with a second helical gear 47, a driving rotating shaft 48 is installed on the second helical gear 47, and a second substrate 49 is connected to the driving rotating shaft 48, and the second substrate 49 is arranged on the first substrate 45; one end of the driving rotating shaft 48 away from the second helical gear 47 is installed with a first pulley 50, a belt 51 is connected to the first pulley 50, a second pulley 52 is connected to the belt 51, and the belt 51 is in sliding fit with the second pulley 52 and the first pulley 50; one air-blowing rotating shaft 53 is installed on one side of the second pulley 52 and the first pulley 50 close to the purification box 2; ventilation circular grooves 54 corresponding to the number and positions of the second pulley 52 and the first pulley 50 are provided on the top of the purification box 2. One side of the ventilation circular groove 54 extends to the inner top surface of the purification box 2, and the other side extends to the top of the purification box 2. A filter plate 55 is installed on the top of the purification box 2 through bolts, and the filter plate 55 covers the ventilation circular groove 54; one end of the air-blowing rotating shaft 53 away from the second pulley 52 passes through the filter plate 55 and is connected with a plurality of fan blades 56, and the fan blades 56 are located in the ventilation circular groove 54; the two air-blowing rotating shafts 53 are jointly connected with a T-shaped substrate 57, and the T-shaped substrate 57 is arranged on the top of the purification box 2; a scraping inclined block 58 is also installed on the air-blowing rotating shaft 53, and the inclined surface of the scraping inclined block 58 contacts the top of the filter plate 55;

[0045] When the driving motor 4 is in use, it will also drive the driving bevel gear 6 to rotate, causing it to engage and rotate two rotating bevel gears 43. Through the transmission of the rotating shaft 44, the second helical gear 47, and the driving rotating shaft 48, the first pulley 50 is driven to rotate. With the cooperation of the belt 51, the second pulley 52 is driven to rotate, causing the air-making rotating shafts 53 on the second pulley 52 and the first pulley 50 to rotate. As a result, a number of fan blades 56 rotate within the ventilation circular groove 54, and the generated wind force acts on the purification square box 2, thereby introducing external gas into the purification square box 2. This can neutralize the polluted gas within the purification square box 2, preventing the semiconductor substrate from being at risk of contamination due to a large amount and high concentration of polluted gas accumulated within the purification square box 2. At the same time, the provided filter plate 55 can prevent particulate matter doped in the external gas from entering the purification square box 2 and falling into the conductive area of the substrate, avoiding risks such as short circuits or electric leakage when the substrate is in use, and further preventing the integrity of the circuit from being damaged, thus ensuring the performance of the substrate during use. It is worth mentioning that when the driving bevel gear 6 engages and rotates two symmetrically arranged rotating bevel gears 43, the rotation directions of the two rotating bevel gears 43 are opposite. A number of fan blades 56 at one location introduce external gas into the purification square box 2, while a number of fan blades 56 at the other location discharge the gas within the purification square box 2. This prevents the harmful gas carried by the semiconductor substrate when it is placed in the purification square box 2 from being at an angle and remaining there for a long time, which could damage the substrate, strengthening the gas circulation effect around the substrate within the purification square box 2 and improving the stability of the substrate during use and the handling effect of the device. At the same time, when the air-making rotating shaft 53 rotates, it will drive the scraping bevel block 58 to rotate, continuously rotating on the top of the filter plate 55, thereby being able to scrape off the impurities or harmful substances adhered and adsorbed on the top of the filter plate 55, preventing them from accumulating on the top of the filter plate 55 for a long time and affecting the gas fluidity, thus reducing the limitations of the device during use and improving the use effect of the air-making and exhaust mechanism.

[0046] The present invention also provides a handling method for semiconductor substrate processing, including the following steps:

[0047] S001. Place a number of semiconductor substrates to be handled in the purification square box 2, and through the movement of the conveyor belt, the semiconductor substrates are conveyed to the usage area;

[0048] S002. A number of semiconductor substrates are placed on the buffer pads 3 within the purification square box 2 to reduce the impact force generated by the shaking of the semiconductor substrates during conveyance;

[0049] S003. Operate the gas-making and pollution-preventing unit to provide a clean environment for the semiconductor substrates during conveyance to avoid contamination.

[0050] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0051] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A transport device for semiconductor substrate processing, comprising a transport device platform (1) and a purification box (2); the transport device platform (1) is also provided with a conveyor belt, and the purification box (2) is placed on the conveyor belt; the characteristics are: A buffer pad (3) is provided on the inner bottom surface of the purification box (2), and the semiconductor substrate is located in the purification box (2) and placed on the top of the buffer pad (3); the conveying device platform (1) is also provided with a position-controlled pressure-regulating assembly, and the number of the position-controlled pressure-regulating assemblies is two groups, and they are symmetrically arranged on both sides of the top of the conveying device platform (1), so that the conveyor belt is located between the two groups of position-controlled pressure-regulating assemblies; the position-controlled pressure-regulating assembly is used to increase the friction between the purification box (2) and the conveyor belt during transportation; the purification box (2) is also provided with an air-control and pollution-preventing unit, and the air-control and pollution-preventing unit is used to prevent the semiconductor substrate from being contaminated during transportation; The air control and pollution prevention unit comprises a driving motor (4), and the driving motor (4) is arranged on the top of the purification box (2); the bottom of the purification box (2) is placed on the conveyor belt; a brake gear (5) is installed on the output end of the driving motor (4), and a driving bevel gear (6) is also installed on the side of the brake gear (5) away from the purification box (2), and a wind-generating and air-discharging mechanism is arranged on the driving bevel gear (6); a brake rack (7) is arranged on the opposite side of the brake gear (5), and the brake rack (7) is meshingly connected with the brake gear (5); two brake square plates (8) are installed on the brake rack (7), and the opposite surfaces of the two brake square plates (8) are commonly connected to a brake cylinder (9), and a brake substrate (10) is slidably arranged on the brake cylinder (9), and the brake substrate (10) is fixedly arranged on the top of the purification box (2); A bent square rod (11) is installed on each braking square plate (8), and the two bent square rods (11) are respectively located on the front and rear sides of the purification square box (2); the bent square rod (11) is connected to a U-shaped square rod (12), the opening of the U-shaped square rod (12) faces the conveyor belt and is also installed with a braking cross block (13), and limiting square plates (14) are installed on both sides of the braking cross block (13), and a limiting cylinder (15) is slidably arranged on the limiting square plate (14), and the limiting cylinder (15) is fixedly arranged on the purification square box (2); a limiting spring (16) is sleeved on the limiting cylinder (15), one end of the limiting spring (16) is fixedly connected to the purification square box (2), and the other end is fixedly connected to the limiting square plate (14); The wind-generating and air-discharging mechanism comprises two symmetrically arranged rotating bevel gears (43) meshingly connected with the driving bevel gear (6); rotating shafts (44) are mounted on opposite sides of the two rotating bevel gears (43); a first substrate (45) is mounted on one end of the rotating shaft (44) away from the driving bevel gear (6); the first substrate (45) is disposed on the top of the purification box (2); a first bevel gear (46) is also mounted on the rotating shaft (44); the first bevel gear (46) is meshingly connected with a second bevel gear (47); a driving rotating shaft (48) is mounted on the second bevel gear (47). A second base plate (49) is connected to the driving shaft (48), and the second base plate (49) is arranged on the first base plate (45); a first pulley (50) is installed at one end of the driving shaft (48) away from the second bevel gear (47), a belt (51) is connected to the first pulley (50), and the belt (51) is connected to the second pulley (52), and the belt (51) is slidably matched with the second pulley (52) and the first pulley (50); a wind-generating shaft (53) is installed on the side of the second pulley (52) and the first pulley (50) close to the purification box (2).

2. A semiconductor substrate processing transport device according to claim 1, characterized in that: The position regulating assembly comprises two auxiliary bases (17) symmetrically arranged on one side of the top of the conveying equipment platform (1), an auxiliary square column (18) being fixedly mounted on the auxiliary base (17), and an auxiliary limiting plate (19) being mounted on one end of the auxiliary square column (18) away from the auxiliary base (17); an auxiliary spring (20) is sleeved on the auxiliary square column (18), one end of the auxiliary spring (20) is fixedly connected to the auxiliary limiting plate (19), and the other end is connected to an auxiliary slider (21), and the auxiliary slider (21) is slidably arranged on the auxiliary square column (18); the two auxiliary An adjustment base plate (22) is installed on the opposite back side of the slider (21), an adjustment cylinder (23) is slidably arranged on the adjustment base plate (22), one end of the adjustment cylinder (23) is connected to an adjustment limit plate (24), and the other end is installed with an adjustment transverse plate (25), and an adjustment lock block (26) is fixedly installed on the side of the adjustment transverse plate (25) facing the top of the auxiliary square column (18); a plurality of adjustment lock grooves (27) are arranged on the side of the auxiliary square column (18) facing the adjustment lock block (26), and the adjustment lock block (26) passes through the auxiliary slider (21) and is connected with the adjustment lock groove (27).

3. A semiconductor substrate processing transport device according to claim 2, characterized in that: The adjusting cylinder (23) is sleeved with an adjusting spring (28), one end of the adjusting spring (28) is connected to the adjusting limit plate (24), and the other end is connected to the adjusting base plate (22); the opposing surfaces of the two auxiliary sliding blocks (21) are commonly connected to a pressure cross block (29), two pressure square columns (30) are slidably arranged on the pressure cross block (29), and the ends of the pressure square columns (30) close to the conveyor belt are both installed with a U-shaped base (31), a transmission pulley (32) is installed in the U-shaped base (31), and the two transmission pulleys (32) are commonly connected to a conveyor belt (33), and the side wall of the conveyor belt (33) is made of rubber and is connected to the purification box (2). The conveyor belt (33) is provided with a plurality of load-bearing rollers (34) mounted on the opposite surface of the conveyor belt (33), and the load-bearing rollers (34) and the conveyor belt (33) are in contact with the inner wall of the purification box (2); the plurality of load-bearing rollers (34) are connected to a supporting base plate (35), and the supporting base plate (35) is connected to the U-shaped base (31); a rotating motor (36) is mounted on one of the U-shaped bases (31), and the rotating motor (36) is connected to the transmission pulley (32); a pressure spring (37) is sleeved on the pressure column (30), and one end of the pressure spring (37) is connected to the U-shaped base (31), and the other end is connected to the pressure cross block (29).

4. The semiconductor substrate processing transport device according to claim 1, characterized in that: The brake rack (7) is also provided with an elastic sliding stop unit; the elastic sliding stop unit comprises a first square plate (38) provided on both sides of the brake rack (7); an elastic sliding rod (39) is provided through the first square plate (38); the elastic sliding rod (39) and the first square plate (38) are slidably matched; a second square plate (40) is installed at one end of the elastic sliding rod (39) away from the brake rack (7); the opposite surfaces of the two second square plates (40) are connected with elastic teeth (41); the elastic teeth (41) are located on the rotation path of the brake gear (5) and the two are meshed; an extrusion spring (42) is sleeved on the elastic sliding rod (39); one end of the extrusion spring (42) is connected to the first square plate (38), and the other end is connected to the second square plate (40).

5. The semiconductor substrate processing transport device according to claim 1, characterized in that: The top of the purification box (2) is provided with ventilation circular grooves (54) corresponding in number and position to the second pulley (52) and the first pulley (50); one side of the ventilation circular groove (54) extends to the inner top surface of the purification box (2), and the other side extends to the top of the purification box (2); a filter plate (55) is installed on the top of the purification box (2) by bolts, and the filter plate (55) covers the ventilation circular groove (54); one end of the wind-generating rotating shaft (53) away from the second pulley (52) passes through the filter plate (55) and is connected to a plurality of fan blades (56), and the fan blades (56) are located in the ventilation circular groove (54); the two wind-generating rotating shafts (53) are commonly connected to a T-shaped base plate (57), and the T-shaped base plate (57) is arranged on the top of the purification box (2); a scraping inclined block (58) is also installed on the wind-generating rotating shaft (53), and the inclined surface of the scraping inclined block (58) contacts the top of the filter plate (55).

6. The semiconductor substrate processing transport device according to claim 1, characterized in that: A stop cylinder (59) is provided through the brake block (13), and the stop cylinder (59) is slidably matched with the brake block (13); a stop limit plate (60) is installed at the end of the stop cylinder (59) away from the purification box (2); a hollow cylinder (61) is slidably provided at the end of the stop cylinder (59) close to the purification box (2), and the end of the hollow cylinder (61) away from the stop cylinder (59) is provided on the purification box (2); an air bag (62) is also provided in the purification box (2), and the air bag (62) An air delivery hole (63) is also provided on the side of the purification box (2), and the air delivery hole (63) is communicated with the hollow cylinder (61); the air delivery hole (63) and the bent square rod (11) are located at the same position; the outer wall of the airbag (62) is connected to the inner wall of the purification box (2), and the inner wall of the airbag (62) contacts the semiconductor substrate when it is expanded; a stop spring (64) is also sleeved on the stop cylinder (59), one end of the stop spring (64) is connected to the stop limit plate (60), and the other end is connected to the brake horizontal block (13).

7. A method for conveying a semiconductor substrate for processing, using the conveying device for semiconductor substrate processing according to claim 1, characterized in that: Includes steps: S001. Placing a plurality of semiconductor substrates to be transported in the purification box (2), so that the semiconductor substrates can be transported to the use area by the movement of the conveyor belt; S002. A plurality of semiconductor substrates are placed on a buffer pad (3) in a purification box (2) to reduce the impact force generated by shaking of the semiconductor substrates during transportation; S003. Operate the gas control and pollution prevention unit to provide a clean environment for the semiconductor substrate during transportation to prevent contamination.

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