High-speed loading and unloading system for high-density integrated circuit lead frames

Abstract

The present invention relates to the technical field of lead frame handling equipment, and specifically to a high-speed loading and unloading system for high-density integrated circuit lead frames, comprising a turntable and a transposition drive module; a plurality of groups of clamping mechanisms for clamping lead frames are arranged separately around the central axis of the turntable, the ends of the support rods are provided with abutment assemblies, the support rods of each group of clamping mechanisms are slidably mounted on the turntable, and a horizontal pushing mechanism for pushing the corresponding clamping mechanism is provided on the side of the turntable. When in use, the front of the horizontal pushing seat can cooperate with the abutment roller to push the abutment assembly and the clamping mechanism to move synchronously with the conveyor steel belt, and the abutment roller rolls along the front of the horizontal pushing seat. Compared with the existing technology, the loading and unloading method is faster, meeting the increasingly accelerated production line processing needs. When the sheet handling mechanism is in use, one group of sheet picking and placing modules takes the lead frame, and the other group of sheet picking and placing modules puts down the lead frame, one taking and one putting, and high work efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of lead frame handling equipment, and in particular to a high-speed loading and unloading system for high-density integrated circuit lead frames. Background Art

[0002] As an important carrier in the semiconductor integrated chip packaging process, the lead frame is an important bridge connecting the internal circuit and the external lead. It is also a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead end of the chip and the external lead to form an electrical circuit. It acts as a bridge connecting to the external wires. Lead frames are required in most semiconductor integrated blocks and are an important basic material in the electronic information industry.

[0003] During the electroplating process, lead frames need to be loaded and unloaded. In the prior art, lead frames are transported from a horizontal conveyor belt (laying horizontally) to a steel conveyor belt (standing upright) for loading, or vice versa. The steel conveyor belt, as disclosed in Chinese patents such as CN202989310U, CN202989325U, CN116926647A, and CN116853783A, transfers lead frames by clamping the upper side of the upright lead frame. External force is used to activate elastic clips on the steel conveyor belt to release and clamp the lead frame.

[0004] The transfer of the lead frame between the horizontal conveyor belt and the conveyor steel belt is achieved by a flipping mechanism. Therefore, the applicant has previously developed a flipping and transferring mechanism for clamping the integrated circuit lead frame as disclosed in the Chinese patent document with the publication number CN219216591U, which includes a clamping pad in contact with one side of the lead frame, the clamping pad is equipped with a clamping assembly for clamping the edge of the lead frame, the clamping assembly includes a rotating part and a plurality of clamping claws, the clamping pad is provided with a sliding part for mounting the rotating part and a sliding part for the sliding part A sliding guide piece slides on the clamping pad to adjust the position of the clamping claws; when clamping, the clamping pad contacts the contact surface of the lead frame, and the rotating part of the clamping assembly drives the clamping claws to flip, and the end thereof rests against the edge of the bottom panel of the lead frame, so that the lead frame fits to the bottom of the clamping pad. On the one hand, it will not contact the electroplating area on the bottom surface of the lead frame, which can prevent wear and damage. On the other hand, when clamping, the lead frame will not bend, which can reduce damage to the lead frame caused by bending deformation, effectively protect the lead frame, and facilitate clamping and transportation.

[0005] To increase the speed of loading and unloading, the applicant has developed a rotary loading device that uses multiple clamping mechanisms to rotate 360° to quickly clamp and release the lead frame at different positions. This technology has not yet been disclosed. The existing flip transfer mechanism can move synchronously with the steel belt, realizing the transfer of lead frames to and from the steel belt without stopping. Therefore, in order to maintain the requirement of non-stop operation, the rotary loading urgently needs to be designed with a follow-up non-stop structure. During the testing phase, it was found that when the horizontal push mechanism pushes some clamping mechanisms to synchronize with the conveyor steel belt, the horizontal push mechanism will interfere with the next rotating clamping mechanism when it resets, which restricts the rotation speed of the multiple clamping mechanisms. Summary of the Invention

[0006] In view of the above technical problems in the prior art, the present invention provides a high-speed loading and unloading system for high-density integrated circuit lead frames.

[0007] To achieve the above objectives, the present invention provides the following technical solutions:

[0008] Provides a high-speed loading and unloading system for high-density integrated circuit lead frames, including a turntable with a horizontally arranged central axis and a transposition drive module for driving the turntable to rotate step by step;

[0009] A plurality of clamping mechanisms for clamping the lead frame are arranged separately around the central axis of the turntable. Each clamping mechanism includes a support rod and a clamping assembly operatively mounted on the support rod for clamping / relaxing the lead frame. The support rod is provided with an opening / closing drive module for driving the clamping assembly to clamp / relax. The support rod is provided with a limit member to limit the axial displacement of the clamping assembly relative to the support rod. Each clamping assembly includes two rotating drums rotatably mounted on the support rod and arranged in parallel, and clips respectively fixed to the two rotating drums. The opening / closing drive module is used to drive the two rotating drums to rotate in opposite directions, thereby driving the clips of the two rotating drums to move closer to clamp the lead frame or away from each other to release the lead frame.

[0010] The end of the support rod is provided with a resisting assembly, which includes a resisting support, a floating seat, a floating spring and a resisting roller. The resisting support is fixed to the support rod, and the floating seat is slidably mounted on the resisting support with a controlled stroke. The floating spring applies force to the floating seat so that the floating seat elastically protrudes relative to the resisting support. The resisting roller is rotatably mounted on the floating seat.

[0011] The support rods of each group of clamping mechanisms are slidably mounted on the turntable, and a transverse pushing mechanism for pushing the corresponding clamping mechanism is provided on the side of the turntable, so that the support rod and the clamping assembly thereon can move synchronously with the conveyor belt; the transverse pushing mechanism includes a bracket, a follower rail and a follower seat, the follower rail is fixed to the bracket and parallel to the external conveyor belt, the follower seat can be slidably mounted on the follower rail, and the bracket is provided with a follower driving module for driving the follower seat; the follower seat is provided with a transverse pushing seat, the front of the transverse pushing seat can cooperate with the abutting roller to push the abutting assembly and the clamping mechanism to move synchronously with the external conveyor belt; the back of the transverse pushing seat is provided with a yielding inclined surface, which cooperates with the abutting roller to overcome the action of the floating spring and make the floating seat retract relative to the abutting support;

[0012] The device also includes a sheet handling mechanism, including a transfer module and two sets of sheet pick-up and placement modules for picking up and placing lead frames. The transfer module includes a stand, a rotating frame, and a transfer drive. The rotating frame is rotatably mounted on the stand, and the rotating axis of the rotating frame is arranged longitudinally. The two sets of sheet pick-up and placement modules are mounted on the rotating frame, and the two sets of sheet pick-up and placement modules are symmetrically arranged with respect to the rotating axis of the rotating frame. The transfer drive is used to drive the rotating frame to rotate, thereby driving the two sets of sheet pick-up and placement modules to switch back and forth between the two sheet pick-up and placement stations.

[0013] One of the wafer pick-up and placement stations is equipped with a wafer carrier for receiving the lead frame transferred by the wafer pick-up and placement module. The wafer carrier is equipped with a wafer pushing assembly for pushing the lead frame laterally. The clamping mechanism cooperates with the wafer carrier to clamp the lead frame on it or place the lead frame on it.

[0014] Specifically, each clip includes a clip body and a plurality of parallelly arranged clip strips extending integrally from the clip body, and the clip strips of the clips on the two rotating drums are aligned with each other; and / or: the bottom of the horizontal push seat is arc-shaped.

[0015] Specifically, the abutting assembly further includes a guide bearing installed on the floating seat, and the abutting support is provided with a groove for the guide bearing to slide.

[0016] Specifically, the turntable includes a first disk body, a middle rod and a second disk body, the first disk body and the second disk body are fixed to the two ends of the middle rod, the first disk body and the second disk body are provided with one-to-one aligned linear bearings, and the support rods are passed through the linear bearings that match the first disk body and the second disk body; the clamping mechanism is provided with a reset spring to keep each group of clamping mechanisms in such an initial position: the clamping assembly is biased toward the first disk body or the second disk body, and each support rod is aligned and passes out of the turntable with equal lengths. After the force of the horizontal pushing mechanism on the support rod is released, the reset spring drives the support rod to return to the initial position; the reset spring is sleeved outside the support rod, and it is compressed to apply thrust to the clamping assembly.

[0017] Specifically, an extension rod is fixed at the rotation center of the first disk body, and the extension rod is connected to the first bearing seat; the transposition drive module includes a transposition drive motor, and the output shaft of the transposition drive motor is connected to the extension rod; and / or: an extension tube is fixed at the rotation center of the second disk body, and the extension tube is connected to the second bearing seat; the second bearing seat is connected to a pneumatic slip ring, and a through-tube hole is opened near the rotation center of the second disk body, and the pneumatic slip ring is connected to the opening and closing drive finger cylinder through a soft air tube, and the soft air tube passes through the extension tube and the through-tube hole.

[0018] Specifically, the number of opening and closing drive modules in each group of clamping mechanisms is more than two, the supporting seat is provided with a diverter seat, the diverter seat is provided with an air inlet manifold, an air outlet manifold, two or more air inlet diverter channels and two or more air outlet diverter channels, each air inlet diverter channel is connected to the air inlet manifold, and each air outlet diverter channel is connected to the air outlet manifold; the air outlet end of the pneumatic slip ring is connected to the air inlet end of the opening and closing drive finger cylinder of more than two groups of opening and closing drive modules via the air inlet manifold and the air inlet diverter channel; the air inlet end of the pneumatic slip ring is connected to the air outlet end of the opening and closing drive finger cylinder of more than two groups of opening and closing drive modules via the air outlet manifold and the air outlet diverter channel.

[0019] Specifically, the sheet picking and placing module includes a lifting seat, a longitudinal driving component installed on the turntable for driving the lifting seat to move up and down, a clip slide rail installed on the lifting seat, two sets of clip arms slidably installed on the clip slide rail, and a clip driving component for driving the two sets of clip arms to move closer / away; the longitudinal driving component is an electric cylinder fixed to the turntable, and its telescopic rod is connected to the lifting seat; the lifting seat is fixed with a lifting guide column, and the turntable is provided with a longitudinal linear bearing, and the lifting guide column passes through the longitudinal linear bearing.

[0020] Specifically, the push-piece assembly includes a push-piece rod, a push-piece driving component for driving the push-piece rod to lift and move laterally, and the film carrier is provided with a push-piece slot for the push-piece rod to pass through and move laterally; the push-piece driving component includes a push-piece base and a push-piece longitudinal movement seat, the push-piece longitudinal movement seat is installed on the push-piece base, the push-piece base is provided with a push-piece lifting cylinder for driving the push-piece longitudinal movement seat to move up and down, and the push-piece rod is installed on the push-piece longitudinal movement seat; the push-piece driving component also includes a push-piece power component for driving the push-piece base to move laterally.

[0021] Specifically, the pushing rods are arranged in two rows on the top of the pushing longitudinal movement seat, and space for the lead frame to be placed is left between the two rows of pushing rods; the carrier table is provided with a splicing station, a transition station and a discharge station arranged in sequence, the splicing station is close to the transfer module to receive the lead frame from the pick-up and placement module, the two rows of pushing rods move the lead frame of the splicing station to the transition station, and at the same time move the lead frame of the transition station to the discharge station; the discharge station is provided with a support body, which is a plurality of grids arranged at intervals.

[0022] Beneficial effects of the present invention:

[0023] The high-speed loading and unloading system for high-density integrated circuit lead frames of the present invention, when in use, rotates a turntable driving multiple groups of clamping mechanisms. Each group of clamping mechanisms on the turntable can independently close to clamp the lead frame or independently open to release the lead frame at different positions. Furthermore, when cooperating with a conveyor belt to load and unload materials, a horizontal push mechanism can move the corresponding support rod and the clip thereon synchronously with the conveyor belt. This allows the clip and the conveyor belt to remain relatively stationary, facilitating the removal of lead frames from the conveyor belt or the transfer of lead frames to the conveyor belt without stopping the machine. Compared with the prior art, the loading and unloading method is faster, meeting the needs of increasingly faster assembly line processing and production. Furthermore, the front of the horizontal push seat can cooperate with abutting rollers to push the abutting assembly and the clamping mechanism to move synchronously with the conveyor belt. At the same time, the turntable continues to rotate, and the abutting rollers roll along the front of the horizontal push seat. A yield slope is provided on the back of the horizontal push seat, which cooperates with the top roller. When the horizontal push seat is reset, the support rod and the top assembly pushed forward are also reset. The yield slope of the next set of clamping mechanisms can overcome the force of the floating spring and make the floating seat retract relative to the top support to avoid it, so that the horizontal push seat is reset to the other side of the top assembly, thus avoiding interference and jamming of the mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of the structure of the rotary high-speed material handling equipment for high-density integrated circuit lead frames in the embodiment.

[0025] Figure 2 Schematic diagram of a portion of the structure of a rotary high-speed material handling device for a high-density integrated circuit lead frame in an embodiment.

[0026] Figure 3 Schematic diagram of the horizontal thrust mechanism in the embodiment.

[0027] Figure 4 This is a structural diagram of the rotary high-speed material handling equipment in the embodiment after the horizontal pushing mechanism is hidden.

[0028] Figure 5 Schematic diagram of the structure of the disc in the embodiment.

[0029] Figure 6 Schematic diagram of the structure of the clamping mechanism in the embodiment.

[0030] Figure 7 Schematic diagram of a single drum and its clips in an embodiment.

[0031] Figure 8 2 is an exploded view of the clamping mechanism in the embodiment.

[0032] Figure 9 Schematic diagram of the structure of a single opening and closing drive module in the embodiment.

[0033] Figure 10Schematic diagram of two rotating drums and their clips in the embodiment.

[0034] Figure 11 2 is a cross-sectional view of the diverter seat in the embodiment.

[0035] Figure 12 Schematic diagram of the abutment assembly in the embodiment.

[0036] Figure 13 2 is an exploded view of the abutment assembly in the embodiment.

[0037] Figure 14 Schematic diagram of the transverse push seat in the embodiment.

[0038] Figure 15 Schematic diagram of the structure of the film moving mechanism in the embodiment.

[0039] Figure 16 It is an exploded view of the sheet moving mechanism in the embodiment.

[0040] Figure 17 Schematic diagram of the structure of the transfer module in the embodiment.

[0041] Figure 18 Schematic diagram of the structure of the push piece assembly in the embodiment.

[0042] Figure 19 Schematic diagram of the structure of the wafer stage in the embodiment.

[0043] Figure 20 This is an exploded view of the wafer stage in the embodiment.

[0044] Reference numerals:

[0045] The material clamping mechanism 1; the support rod 11, the first rod body 111, the second rod body 112; the rotating drum 12, the concave plane 121; the opening and closing drive module 13, the opening and closing drive finger cylinder 131, the connecting rod transmission group 132; the supporting seat 14, the limit member 15; the clamping piece 16, the piece body 161, the clamping strip 162, the protective cover 163; the diverter seat 17, the air inlet manifold 171, the air outlet manifold 172, the air inlet manifold 173, the air outlet manifold 174, and the return spring 18.

[0046] Rotating disc 21 , first disc body 211 , middle rod 212 , second disc body 213 , through-hole 2131 , extension rod 214 , first bearing seat 215 , extension tube 216 , second bearing seat 217 ; transposition drive module 22 , transposition drive motor 221 ; pneumatic slip ring 23 .

[0047] Conveyor steel belt H.

[0048] The horizontal pushing mechanism 3 , the bracket 31 , the follower rail 32 , the follower seat 33 , the follower drive module 34 , the horizontal pushing seat 35 , and the yielding inclined surface 351 .

[0049] The supporting assembly 400 , the supporting support 401 , the floating seat 402 , the floating spring 403 , the supporting roller 404 , and the guide bearing 405 .

[0050] Transfer module 50, vertical frame 501, vertical frame body 502, horizontal frame body 503, rotating frame 504, transfer drive member 505;

[0051] The sheet picking and placing module 51, the lifting seat 511, the longitudinal driving member 512, the sheet clamping slide rail 513, the sheet clamping arm 514, and the lifting guide column 515;

[0052] The wafer stage 52, the wafer pushing groove 521, the wafer joining station 522, the transition station 523, the wafer discharging station 524, the wafer supporting body 525, and the blocking piece 526;

[0053] The push piece assembly 53 , the push piece rod 531 , the push piece base 532 , the push piece longitudinal displacement seat 533 , the push piece lifting cylinder 534 , and the push piece power part 535 . DETAILED DESCRIPTION

[0054] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0055] The high-speed loading and unloading system of the high-density integrated circuit lead frame of this embodiment is as follows: Figures 1 to 20 As shown, it includes a turntable 21 with a horizontally arranged central axis and a transposition drive module 22 for driving the turntable 21 to rotate step by step. There are multiple groups of clamping mechanisms 1 arranged separately around the central axis of the turntable 21. There are a total of eight groups of clamping mechanisms 1 in the figure, and the adjacent two groups are arranged at 45°.

[0056] The turntable 21 includes a first disk body 211, a center rod 212, and a second disk body 213. The first disk body 211 and the second disk body 213 are fixed to the two ends of the center rod 212. An extension rod 214 is fixed at the rotation center of the first disk body 211, and the extension rod 214 is connected to a first bearing seat 215. The transposition drive module 22 includes a transposition drive motor 221, and the output shaft of the transposition drive motor 221 is connected to the extension rod 214. An extension cylinder 216 is fixed at the rotation center of the second disk body 213, and the extension cylinder 216 is connected to a second bearing seat 217. During use, the transposition drive motor 221 drives the extension rod 214, the first disk body 211, the second disk body 213, the center rod 212, and the extension cylinder 216 to rotate as a whole, thereby driving multiple groups of clamping mechanisms 1 to switch to different positions in sequence around 360° stepwise.

[0057] In this embodiment, each set of clamping mechanisms 1 includes a support rod 11 and two rotating drums 12. The support rod 11 includes a first rod body 111 and a second rod body 112 arranged in parallel and fixed to each other. The first disk body 211 and the second disk body 213 are provided with linear bearings aligned one by one. The first rod body 111 and the second rod body 112 are slidably provided with linear bearings that match the first disk body 211 and the second disk body 213. The sliding direction of the first rod body 111 and the second rod body 112 is parallel to the movement direction of the conveyor belt. The two rotating drums 12 are rotatably mounted on the outside of the first rod body 111 and the second rod body 112 via bearings. The support rod 11 is provided with an opening and closing drive module 13 for driving the two rotating drums 12 to rotate in opposite directions. The support rod 11 is fixed with a bearing seat 14, and the opening and closing drive module 13 is mounted on the bearing seat 14. The support rod 11 is provided with a limiter 15 to restrict the axial displacement of the drum 12 relative to the support rod 11. It can be seen that the relative axial positions of the support rod 11, the bearing seat 14, and the drum 12 are fixed. The two drums 12 are each provided with an outward-facing clip 16. The drums 12 and the clips 16 together serve as a clamping assembly. During use, when clamping, the opening and closing drive module 13 drives the two drums 12 to rotate in opposite directions (one clockwise and the other counterclockwise), thereby driving the clips 16 on the two drums 12 to approach and clamp the lead frame. To release the clamped lead frame, the reverse operation can be performed.

[0058] In this embodiment, the opening and closing drive module 13 includes an opening and closing drive finger cylinder 131 and a connecting rod transmission group 132. The cylinder barrel of the opening and closing drive finger cylinder 131 is fixed to the supporting seat 14. The connecting rod transmission group 132 includes multiple sections (three sections in this example) of rod sections hinged in sequence. The two output shafts of the opening and closing drive finger cylinder 131 are respectively provided with a connecting rod transmission group 132, and the head and tail of each group of connecting rod transmission groups 132 are respectively fixedly connected to the output shaft of the opening and closing drive finger cylinder 131 and the rotating drum 12. When in use, the stroke of the opening and closing drive finger cylinder 131 determines the rotation amplitude of the rotating drum 12 and the opening and closing degree of the clip 16.

[0059] In this embodiment, each clamping mechanism 1 comprises two opening and closing drive modules 13, which move synchronously. To reduce the use of cylinder pipes, the support base 14 is provided with a diverter seat 17. The diverter seat 17 is provided with an inlet manifold 171, an outlet manifold 172, two inlet manifolds 173, and two outlet manifolds 174. Each inlet manifold 173 connects to the inlet manifold 171, and each outlet manifold 174 connects to the outlet manifold 172. The inlet ends of the two opening and closing drive finger cylinders 131 in the same clamping mechanism 1 are both connected to the inlet manifold 173, and the outlet ends are both connected to the outlet manifold 172.

[0060] In this embodiment, the second bearing block 217 is connected to a pneumatic slip ring 23. A perforation 2131 is formed near the rotation center of the second disk 213. Multiple perforations 2131 are distributed around the rotation center of the second disk 213 and / or are elongated. The pneumatic slip ring is a pre-existing, externally purchased component that provides a tangled, rotatable connection between two sections of air pipe. During operation, the pneumatic slip ring 23 connects to an external air source to provide compressed air to the finger actuator cylinder 131. Specifically, the air supply from the pneumatic slip ring 23 is connected to the air supply of the two opening and closing drive finger cylinders 131 via a flexible air pipe, sequentially through the air inlet confluence channel 171 and the air inlet branch channels 173, providing high-pressure airflow to drive the opening of the opening and closing drive finger cylinders 131. Furthermore, the air supply from the pneumatic slip ring 23 is connected to the air supply of the two opening and closing drive finger cylinders 131 via a flexible air pipe, sequentially through the air outlet branch channels 174 and the air outlet confluence channel 172, allowing the air from the opening and closing drive finger cylinders 131 to circulate. The flexible air pipe passes through the extension tube 216 and the pipe hole 2131, making the air supply arrangement more convenient and simple.

[0061] In this embodiment, the clip 16 comprises a main body 161 and multiple parallel, juxtaposed strips 162 extending from the main body 161. The strips 162 of the clips 16 on the two rotating drums 12 are aligned with each other. Each strip 162 is covered with a soft protective cover 163 to prevent scratching the lead frame. The main body 161 is curved, and the main bodies 161 of the clips 16 on the two rotating drums 12 are bent close to each other, ensuring a larger contact area with the lead frame during clamping. The outer side of the rotating drum 12 is provided with an inwardly concave surface 121, with which the main body 161 is fixedly engaged.

[0062] In this embodiment, a horizontal pushing mechanism 3 is provided on the side of the turntable 21 for pushing the corresponding support rod 11. In this example, the support rod 11 at the upper position is pushed, and the opening of the clip 16 on the support rod 11 is aligned with the conveyor steel belt H, so that the support rod 11 and the clip 16 thereon move synchronously with the conveyor steel belt H. In this way, the clip 16 and the conveyor steel belt H are relatively stationary, which facilitates the removal of the lead frame from the conveyor steel belt H or the handing of the lead frame to the conveyor steel belt H.

[0063] In this embodiment, the clamping mechanism 1 is equipped with a return spring 18, which is sleeved outside the support rods 11. When compressed, the return spring 18 applies a thrust to the support seat 14, thereby maintaining each set of clamping mechanisms 1 in the following initial position: the clamping assembly is offset from the first plate 211, and the support rods 11 extend out of the turntable with equal lengths. In other words, the lengths of the support rods 11 extending out of the first plate are the same, and their ends corresponding to the transverse push seats 35 are longitudinally aligned. After the force applied by the transverse push mechanism 3 to the support rods 11 is released, the return spring 18 drives the support rods 11 back to their initial position.

[0064] A push-up assembly 400 is provided at the end of the support rod 11, and the push-up assembly 400 includes a push-up support 401, a floating seat 402, a floating spring 403 and a push-up roller 404. The push-up support 401 is fixed to the end of the support rod 11, and the floating seat 402 is slidably installed on the push-up support 401 with a controlled stroke. The floating spring 403 applies force to the floating seat 402 so that the floating seat 402 elastically protrudes relative to the push-up support 401, and the push-up roller 404 is rotatably installed on the floating seat 402.

[0065] The transverse pushing mechanism 3 comprises a bracket 31, a follower rail 32, and a follower seat 33. The follower rail 32 is fixed to the bracket 31 and parallel to the conveyor belt H. The follower seat 33 is slidably mounted on the follower rail 32. The bracket 31 is equipped with a follower drive module 34 for driving the follower seat 33. The follower seat 33 is equipped with a transverse pushing seat 35. During operation, the front face of the transverse pushing seat 35 engages with abutting rollers 404 to push the abutting assembly 400 and the clamping mechanism 1 to move synchronously with the conveyor belt H. At the same time, the turntable 21 continues to rotate, and the abutting rollers 404 roll along the front face of the transverse pushing seat 35. The back of the horizontal push seat 35 is provided with a yield slope 351, which cooperates with the top roller 404. When the horizontal push seat 35 is reset, the support rod 11 pushed forward and the top assembly 400 are also reset. The yield slope 351 of the next group of clamping mechanisms 1 can overcome the force of the floating spring 403 and make the floating seat 402 retract relative to the top support 401 to avoid it, so that the horizontal push seat 35 is reset to the other side of the top assembly 400, so that the mechanism does not collide and get stuck.

[0066] In this embodiment, the bottom of the horizontal push seat 35 is arc-shaped, and the curvature is substantially consistent with the turntable 21. The push assembly 400 further includes a guide bearing 405 mounted on the floating seat 402. The push support 401 is provided with a groove for the guide bearing 405 to slide, thereby achieving directional reciprocating motion of the floating seat 402.

[0067] In this embodiment, a wafer transfer mechanism is further included, which is used to transfer the lead frame in the surrounding cassette to the clamping mechanism 1 for feeding, or to receive the lead frame in the clamping mechanism 1 and transfer it to the cassette for discharging. It includes a transfer module 50 and two pick-and-place wafer modules 51 for picking and placing the lead frame. The transfer module 50 includes a vertical frame 501, a rotating frame 504 and a transfer driving member 505. The rotating frame 504 is rotatably installed on the vertical frame 501, and the rotation axis of the rotating frame 504 is arranged longitudinally. The two pick-and-place wafer modules 51 are installed on the rotating frame 504, and the two pick-and-place wafer modules 51 are symmetrically arranged with respect to the rotation axis of the rotating frame 504. The transfer driving member 505 (using a motor) is used to drive the rotating frame 504 to rotate, so as to drive the two pick-and-place wafer modules 51 to reciprocally switch between two pick-and-place positions. In this example, it rotates 180° to reciprocally switch positions. The vertical frame 501 includes a vertical frame body 502 in an inverted "U" shape and a horizontal frame body 503. The two ends of the horizontal frame body 503 are connected to the upper ends of the two vertical frame bodies 502. The two pick-and-place wafer modules 51 are arranged on both sides below the horizontal frame body 503. [[ID=II]]

[0068] In this embodiment, the pick-and-place wafer module 51 includes a lifting seat 511, a longitudinal transfer driving member 512 installed on the rotating frame 504 for driving the lifting seat 511 to move up and down, a wafer clamping slide rail 513 installed on the lifting seat 511, two sets of wafer clamping arms 514 slidably installed on the wafer clamping slide rail 513, and a wafer clamping driving member (which can use a cylinder) for driving the two sets of wafer clamping arms 514 to approach / separate. The longitudinal transfer driving member 512 is an electric cylinder fixed to the rotating frame 504, and its telescopic rod is connected to the lifting seat 511; the lifting seat 511 is fixed with a lifting guide post 515, and the rotating frame 504 is provided with a longitudinally arranged linear bearing, and the lifting guide post 515 passes through the longitudinally arranged linear bearing.

[0069] A wafer carrier 52 for receiving the lead frame transferred by the pick-and-place wafer module 51 is provided at one of the pick-and-place positions. The wafer carrier 52 is provided with a wafer pushing component 53 for laterally pushing the lead frame. The wafer pushing component 53 includes a wafer pushing rod 531 and a wafer pushing driving member for driving the wafer pushing rod 531 to lift and laterally move. The wafer carrier 52 is provided with a wafer pushing slot 521 for the wafer pushing rod 531 to pass through and laterally move. The wafer pushing driving member includes a wafer pushing base 532 and a wafer pushing longitudinal movement seat 533. The wafer pushing longitudinal movement seat 533 is installed on the wafer pushing base 532. The wafer pushing base 532 is provided with a wafer pushing lifting cylinder 534 for driving the wafer pushing longitudinal movement seat 533 to move up and down. The wafer pushing rod 531 is installed on the wafer pushing longitudinal movement seat 533; the wafer pushing driving member further includes a wafer pushing power member 535 for driving the wafer pushing base 532 to laterally move.

[0070] Specifically, two rows of push rods 531 are arranged on top of the pusher longitudinal displacement seat 533, with space for the lead frame to be placed between the two rows of push rods 531. The wafer carrier 52 is provided with a sequentially arranged wafer splicing station 522, a transition station 523, and a wafer discharge station 524. The wafer splicing station 522 is adjacent to the transfer module 50 to receive the lead frame from the wafer loading and unloading module 51. The two rows of push rods 531 move the lead frame from the wafer splicing station 522 to the transition station 523, and simultaneously move the lead frame from the transition station 523 to the wafer discharge station 524. In other words, the two rows of push rods 531 are inserted on both sides of the lead frame at the wafer splicing station 522. One row of push rods 531 pushes the lead frame from the wafer splicing station 522 to the transition station 523, while the other row of push rods 531 pushes the lead frame from the transition station 523 to the wafer discharge station 524.

[0071] In this embodiment, the sheet discharging station 524 is provided with a sheet supporting body 525, which is a plurality of grids arranged at intervals. The grids are staggered with the clamping strips 162 of the clamping piece 16, so as to facilitate the clamping piece 16 of the clamping mechanism 1 to clamp the lead frame and move it away, or to facilitate the placement of the lead frame.

[0072] In this embodiment, the wafer stage 52 is provided with two stoppers 526 for guiding and limiting the lead frame on both sides. The distance between the two stoppers 526 is adjustable, facilitating guidance and positioning of lead frames of varying specifications. Specifically, the stoppers 526 are provided with rods, and the position of the stoppers 526 is adjusted by tightening or loosening the rods with screws.

[0073] In the description of the present invention, it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

Claims

1. High-speed loading and unloading system for high-density integrated circuit lead frames, characterized by: It includes a turntable with a central axis arranged transversely and a transposition drive module for driving the turntable to rotate step by step; A plurality of clamping mechanisms for clamping the lead frame are arranged separately around the central axis of the turntable. Each clamping mechanism includes a support rod and a clamping assembly operatively mounted on the support rod for clamping / relaxing the lead frame. The support rod is provided with an opening / closing drive module for driving the clamping assembly to clamp / relax. The support rod is provided with a limit member to limit the axial displacement of the clamping assembly relative to the support rod. Each clamping assembly includes two rotating drums rotatably mounted on the support rod and arranged in parallel, and clips respectively fixed to the two rotating drums. The opening / closing drive module is used to drive the two rotating drums to rotate in opposite directions, thereby driving the clips of the two rotating drums to move closer to clamp the lead frame or away from each other to release the lead frame. The end of the support rod is provided with a resisting assembly, which includes a resisting support, a floating seat, a floating spring and a resisting roller. The resisting support is fixed to the support rod, and the floating seat is slidably mounted on the resisting support with a controlled stroke. The floating spring applies force to the floating seat so that the floating seat elastically protrudes relative to the resisting support. The resisting roller is rotatably mounted on the floating seat. The support rods of each group of clamping mechanisms are slidably mounted on the turntable, and a transverse pushing mechanism for pushing the corresponding clamping mechanism is provided on the side of the turntable, so that the support rod and the clamping assembly thereon can move synchronously with the conveyor belt; the transverse pushing mechanism includes a bracket, a follower rail and a follower seat, the follower rail is fixed to the bracket and parallel to the external conveyor belt, the follower seat can be slidably mounted on the follower rail, and the bracket is provided with a follower driving module for driving the follower seat; the follower seat is provided with a transverse pushing seat, the front of the transverse pushing seat can cooperate with the abutting roller to push the abutting assembly and the clamping mechanism to move synchronously with the external conveyor belt; the back of the transverse pushing seat is provided with a yielding inclined surface, which cooperates with the abutting roller to overcome the action of the floating spring and make the floating seat retract relative to the abutting support; The device also includes a sheet handling mechanism, including a transfer module and two sets of sheet pick-up and placement modules for picking up and placing lead frames. The transfer module includes a stand, a rotating frame, and a transfer drive. The rotating frame is rotatably mounted on the stand, and the rotating axis of the rotating frame is arranged longitudinally. The two sets of sheet pick-up and placement modules are mounted on the rotating frame, and the two sets of sheet pick-up and placement modules are symmetrically arranged with respect to the rotating axis of the rotating frame. The transfer drive is used to drive the rotating frame to rotate, thereby driving the two sets of sheet pick-up and placement modules to switch back and forth between the two sheet pick-up and placement stations. One of the wafer pick-up and placement stations is equipped with a wafer carrier for receiving the lead frame transferred by the wafer pick-up and placement module. The wafer carrier is equipped with a wafer pushing assembly for pushing the lead frame laterally. The clamping mechanism cooperates with the wafer carrier to clamp the lead frame on it or place the lead frame on it.

2. The high-speed loading and unloading system for high-density integrated circuit lead frames according to claim 1, characterized in that: Each clip comprises a clip body and a plurality of clip strips integrally extending from the clip body and arranged in parallel. The clip strips of the clips on the two rotating drums are arranged in alignment with each other.

3. The high-speed loading and unloading system for high-density integrated circuit lead frames according to claim 1, characterized in that: The bottom of the horizontal push seat is arc-shaped.

4. The high-speed loading and unloading system for high-density integrated circuit lead frames according to claim 1, characterized in that: The abutting assembly also includes a guide bearing installed on the floating seat, and the abutting support is provided with a groove body for the guide bearing to slide.

5. The high-speed loading and unloading system for high-density integrated circuit lead frames according to claim 1 is characterized in that: the turntable includes a first disk body, a middle rod and a second disk body, the first disk body and the second disk body are fixed to the two ends of the middle rod, the first disk body and the second disk body are provided with one-to-one aligned linear bearings, and the support rods are passed through the linear bearings that match the first disk body and the second disk body; the clamping mechanism is provided with a reset spring to keep each group of clamping mechanisms in such an initial position: the clamping assembly is biased toward the first disk body or the second disk body, and each support rod is aligned and passes through the turntable with equal lengths. After the force of the horizontal pushing mechanism on the support rod is released, the reset spring drives the support rod to return to the initial position; the reset spring is sleeved outside the support rod, and it is compressed to apply thrust to the clamping assembly.

6. The high-speed loading and unloading system for high-density integrated circuit lead frames according to claim 5, characterized in that: An extension rod is fixed at the rotation center of the first disk body, and the extension rod is connected to the first bearing seat; the transposition drive module includes a transposition drive motor, and the output shaft of the transposition drive motor is connected to the extension rod; and / or: an extension tube is fixed at the rotation center of the second disk body, and the extension tube is connected to the second bearing seat; the second bearing seat is connected to a pneumatic slip ring, and a through-tube hole is opened near the rotation center of the second disk body. The pneumatic slip ring and the opening and closing drive finger cylinder are connected by a soft air pipe, and the soft air pipe passes through the extension tube and the through-tube hole.

7. The high-speed loading and unloading system for high-density integrated circuit lead frames according to claim 6, characterized in that: The number of opening and closing drive modules in each group of clamping mechanisms is more than two groups, the supporting seat is provided with a diverter seat, the diverter seat is provided with an air inlet manifold, an air outlet manifold, two or more air inlet diverter channels and two or more air outlet diverter channels, each air inlet diverter channel is connected to the air inlet manifold, and each air outlet diverter channel is connected to the air outlet manifold; the air outlet end of the pneumatic slip ring is connected to the air inlet end of the opening and closing drive finger cylinder of more than two groups of opening and closing drive modules via the air inlet manifold and the air inlet diverter channel; the air inlet end of the pneumatic slip ring is connected to the air outlet end of the opening and closing drive finger cylinder of more than two groups of opening and closing drive modules via the air outlet manifold and the air outlet diverter channel.

8. The high-speed loading and unloading system for high-density integrated circuit lead frames according to claim 1, characterized in that: The sheet picking and placing module includes a lifting seat, a longitudinal driving component installed on the turntable for driving the lifting seat to move up and down, a clip slide rail installed on the lifting seat, two sets of clip clamping arms slidably installed on the clip slide rail, and a clip driving component for driving the two sets of clip clamping arms to move closer / away; the longitudinal driving component is an electric cylinder fixed to the turntable, and its telescopic rod is connected to the lifting seat; the lifting seat is fixed with a lifting guide column, and the turntable is provided with a longitudinal linear bearing, and the lifting guide column passes through the longitudinal linear bearing.

9. The high-speed loading and unloading system for high-density integrated circuit lead frames according to claim 1, characterized in that: The push-piece assembly includes a push-piece rod, a push-piece driving component for driving the push-piece rod to lift and move laterally, and the film carrier is provided with a push-piece slot for the push-piece rod to pass through and move laterally; the push-piece driving component includes a push-piece base and a push-piece longitudinal movement seat, the push-piece longitudinal movement seat is installed on the push-piece base, and the push-piece base is provided with a push-piece lifting cylinder for driving the push-piece longitudinal movement seat to move up and down, and the push-piece rod is installed on the push-piece longitudinal movement seat; the push-piece driving component also includes a push-piece power component for driving the push-piece base to move laterally.

10. The high-speed loading and unloading system for high-density integrated circuit lead frames according to claim 9, characterized in that: The ejection rods are arranged in two rows on the top of the ejection longitudinal movement seat, and space for the lead frame is left between the two rows of ejection rods; the wafer carrier is provided with a splicing station, a transition station and a wafer discharge station arranged in sequence. The splicing station is close to the transfer module to receive the lead frame from the pick-up and placement module. The two rows of ejection rods move the lead frame of the splicing station to the transition station, and at the same time move the lead frame of the transition station to the wafer discharge station; the wafer discharge station is provided with a support body, which is a plurality of grids arranged at intervals.

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