Electric connection method, electric connection structure and terminal product

Abstract

An electric connection method comprises the following steps that a conductive piece is placed in a circuit board, the circuit board comprises a circuit layer, the circuit layer comprises a main body part and a protruding part located on the surface of the main body part, the circuit layer is made of shape memory alloy, the conductive piece is provided with a groove, and the protruding part is contained in the groove; and pressing the circuit board and the conductive piece so as to enable the circuit board and the conductive piece to be connected with each other after the protruding part is deformed. The invention also provides an electric connection structure and a terminal product. The electric connection structure manufactured by adopting the electric connection method is high in connection reliability, and the electric connection structure and the electric connection structure can be separated in a heating mode.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board electrical connection, and in particular to an electrical connection method, an electrical connection structure and a terminal product. Background Art

[0002] The battery control board in the car is usually connected to the circuit board and the nickel sheet by soldering with solder paste, that is, the bonding force between the nickel sheet and the circuit board is only provided by the solder paste, and the bonding force is weak; and when the battery control board fails and the circuit board and the nickel sheet need to be separated, the above structure is difficult to be freely disassembled. Summary of the invention

[0003] In view of this, it is necessary to provide an electrical connection method and an electrical connection structure with reliable connection and convenient separation to solve the above problems.

[0004] An electrical connection method comprises the following steps: placing a conductive member in a circuit board, the circuit board comprising a circuit layer, the circuit layer comprising a main body and a protruding portion located on the surface of the main body, the material of the circuit layer being a shape memory alloy, the conductive member having a groove, the protruding portion being accommodated in the groove; pressing the circuit board and the conductive member together so that the protruding portion is deformed, thereby connecting the circuit board and the conductive member to each other.

[0005] In some embodiments of the present application, before the step of accommodating the protrusion in the conductive member, the connection method further includes: providing a conductive glue on the circuit layer; when the protrusion is accommodated in the conductive member, the conductive glue is accommodated in the groove.

[0006] In some embodiments of the present application, along the extension direction of the circuit board, the protrusion has a first width, the groove has a second width, the second width is the minimum width of the groove, and the first width is less than or equal to the second width.

[0007] In some embodiments of the present application, along the extending direction of the circuit board, the groove has a third width, and the third width is greater than the second width.

[0008] In some embodiments of the present application, before the pressing step, there is a gap between the protruding portion and the inner wall of the groove; after the pressing step, the protruding portion is deformed to fill the gap.

[0009] An electrical connection structure includes a circuit board and a conductive member. The circuit board includes a circuit layer, the circuit layer includes a main body and a protruding portion located on the surface of the main body, and the circuit layer is made of a shape memory alloy; a groove is formed on the conductive member, the protruding portion is received in the groove and connected to the conductive member.

[0010] In some embodiments of the present application, the surface of the conductive member facing the circuit board is connected to the main body.

[0011] In some embodiments of the present application, the electrical connection structure further includes a conductive adhesive, the conductive adhesive is located on a surface of the circuit layer facing the conductive member, and the conductive adhesive bonds the circuit board and the conductive member.

[0012] In some embodiments of the present application, along the extension direction of the circuit board, the groove has a second width, the second width is located at the opening of the groove, the protrusion has a third width, the third width is located in the area other than the opening, and the third width is greater than the second width.

[0013] In some embodiments of the present application, the shape memory alloy is made of copper-zinc alloy.

[0014] A terminal product includes an electrical connection structure.

[0015] The electrical connection method provided in the embodiment of the present application uses a circuit layer made of shape memory alloy to press together with a conductive part, so that the protrusion received in the groove of the conductive part is deformed and embedded in the groove of the conductive part, thereby realizing the mutual electrical connection between the circuit board and the conductive part, replacing the solder paste welding used in the related technology to avoid the occurrence of cold solder joints, empty solder joints, bubbles, etc.; the deformed protrusion matches the shape of the groove, which can increase the connection reliability between the circuit board and the conductive part. The electrical connection structure made by the method of the present application can heat the interconnected area by heating so that the part of the circuit layer embedded in the groove can restore the deformation, so that the circuit board and the conductive part can be easily separated without damaging the circuit board or the conductive part. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic cross-sectional view of a single-sided copper clad laminate provided in an embodiment of the present application.

[0017] Figure 2 For Figure 1 The cross-sectional view of the single-sided copper clad laminate after the first circuit etching is performed to form a protruding portion.

[0018] Figure 3 For Figure 2 The structure shown is a schematic cross-sectional view of a circuit substrate formed by performing a second circuit etching.

[0019] Figure 4 For Figure 3 The schematic cross-sectional view of the circuit board obtained after a portion of the surface of the circuit substrate is covered with a protective layer.

[0020] Figure 5 For the general Figure 4 The schematic cross-sectional view shows a protruding portion of a circuit board being placed behind a groove of a conductive member.

[0021] Figure 6 For pressing Figure 5 The schematic cross-sectional view of the electrical connection structure obtained after the circuit board, the conductive member and the protruding portion are deformed is shown.

[0022] Figure 7 A cross-sectional schematic diagram of an electrical connection structure provided in another embodiment of the present application.

[0023] Main component symbols

[0024]

[0025] DETAILED DESCRIPTION

[0026] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth to facilitate a full understanding of the present application, and the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this article are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes all and any combination of one or more related listed items.

[0028] In the embodiments of the present application, for the convenience of description and not to limit the present application, the term "connection" used in the patent application specification and claims of the present application is not limited to physical or mechanical connection, whether direct or indirect. "Up", "down", "above", "below", "left", "right", etc. are only used to indicate relative position relationship. When the absolute position of the described object changes, the relative position relationship also changes accordingly.

[0029] See also Figures 1 to 6 The present application embodiment provides a method for electrically connecting a circuit board 10 and a conductive member 20, which may include the following steps:

[0030] Step S1: Please refer to Figures 1 to 3, a circuit board 10 is provided, wherein the circuit board 10 includes a circuit layer 13 , wherein the circuit layer 13 includes a main body 132 and a protruding portion 134 located on a surface of the main body 132 .

[0031] The circuit board 10 further includes a substrate layer 12, and the circuit layer 13 is stacked with the substrate layer 12. The circuit layer 13 and the substrate layer 12 may be one layer or multiple layers.

[0032] The material of the substrate layer 12 is an insulating material, which can be selected from one of flexible materials such as polyimide (PI), liquid crystal polymer (LCP) and modified polyimide (MPI), or one of hard materials such as polypropylene (PP) and polytetrafluoroethylene (PTFE). In this embodiment, the material of the substrate layer 12 is PI.

[0033] The conductive layer 191 is made of a shape memory alloy. Shape memory alloys (SMA) are materials composed of two or more metal elements that have a shape memory effect (SME) through thermoelasticity and martensitic phase transformation and its inversion. After heating, the shape memory alloy can return to its initial shape. In this embodiment, the shape memory alloy is a copper-zinc alloy.

[0034] See also Figures 1 to 3 Taking the example that the number of layers of the circuit layer 13 and the substrate layer 12 are both one layer, the method for manufacturing the circuit board 10 may include the following steps:

[0035] Step S11: Please refer to Figure 1 , providing a single-sided copper clad laminate 19 , including a substrate layer 12 and a conductive layer 191 located on the surface of the substrate layer 12 .

[0036] Step S12: Please refer to Figure 2 , a first line etching is performed on the conductive layer 191 to form a protruding portion 134 .

[0037] The surface portion of the conductive layer 191 away from the substrate layer 12 is etched, and the portion of the conductive layer 191 away from the substrate layer 12 and not etched protrudes relative to the etched conductive layer 191 , thereby forming the protruding portion 134 .

[0038] Step S13: Please refer to Figure 3The conductive layer 191 is subjected to a second circuit etching to form a main body portion 132 , and the main body portion 132 and the protruding portion 134 together form a circuit layer 13 .

[0039] Circuits are fabricated on the remaining conductive layer 191 after the first etching to form the main body 132 . The protruding portion 134 is located on a surface of the main body 132 away from the substrate layer 12 and protrudes relative to the main body 132 .

[0040] The circuit layer 13 and the base material layer 12 together form a circuit substrate 11. In other embodiments, when the base material layer 12 and the circuit layer 13 are multiple layers, the protruding portion 134 is located at the outermost layer of the circuit substrate 11, and the material of the circuit layer 13 provided with the protruding portion 134 is a shape memory alloy, and the material of other circuit layers 13 is not limited, and the manufacturing steps of the circuit substrate 11 are also adjusted accordingly.

[0041] In this embodiment, the circuit layer 13 and the base material layer 12 are stacked along the first direction L1, and the circuit substrate 11 extends along the second direction L2. The cross section of the protruding portion 134 is rectangular. In other embodiments, the cross section of the protruding portion 134 is not limited.

[0042] Along the second direction L2, the protruding portion 134 has a first width W1, and the first width W1 is the maximum width of the protruding portion 134. In this embodiment, the cross section of the protruding portion 134 is a rectangle.

[0043] Step S2: Please refer to Figure 4 A protective layer 15 is covered on a portion of the surface of the main body 132 , and the protective layer 15 also covers the base material layer 12 exposed to the main body 132 .

[0044] Along the second direction L2, the circuit substrate 11 is divided into a first area I and a second area II, and the protruding portion 134 is located in the first area I. The protective layer 15 covers the second area II of the circuit substrate 11, and the protruding portion 134 and the circuit layer 13 located in the first area I are exposed to the protective layer 15. The material of the protective layer 15 is an insulating material.

[0045] Step S3: Please refer to Figure 5 , providing a conductive member 20 , the conductive member 20 is provided with a groove 21 , and the protruding portion 134 is received in the groove 21 .

[0046] The conductive member 20 may be a metal sheet, such as a nickel sheet, a copper sheet, etc., or may be another circuit board. In the present embodiment, the conductive member 20 is a nickel sheet.

[0047] The conductive member 20 has a second width W2 and a third width W3 along a direction, wherein the second width W2 is the width of the cross section of the groove 21 at the opening, and the third width W3 is the width of any area of ​​the groove 21 except the opening, and the third width W3 is greater than the second width W2. In this embodiment, the cross section of the groove 21 is a trapezoid.

[0048] The conductive member 20 corresponds to the second region II, and the first width W1 is less than or equal to the second width W2, so that the protruding portion 134 can be accommodated in the groove 21. In this embodiment, the first width W1 is equal to the second width W2. After the protruding portion 134 is accommodated in the groove 21, a gap is formed between the protruding portion 134 and the inner wall 212 of the groove 21.

[0049] Step S4: Please refer to Figure 6 The circuit board 10 and the conductive member 20 are pressed together so that the protruding portion 134 is deformed, thereby connecting the circuit board 10 and the conductive member 20 to each other, thereby obtaining an electrical connection structure 100 .

[0050] A mold (not shown) is provided on the side of the circuit board 10 away from the conductive member 20 and the side of the conductive member 20 away from the circuit board 10, respectively, and the mold is used for pressing. The mold may be a steel plate.

[0051] During the pressing process, the shape memory alloy undergoes plastic deformation, and the protrusion 134 is deformed to fill the gap, so that the deformed protrusion 134 can fill the groove 21 as fully as possible, thereby making the protrusion 134 have a larger contact area with the inner wall 212 of the groove 21. In addition, since the third width W3 of the groove 21 is greater than the second width W2, the deformed protrusion 134 has the third width W3 and the second width W2 accordingly. Since the third width W3 is greater than the second width W2, the deformed protrusion 134 can be clamped in the conductive member 20, thereby increasing the connection reliability between the conductive member 20 and the circuit board 10.

[0052] The cross-sectional shape of the groove 21 on the conductive member 20 is not limited to a trapezoid. The inner wall 212 of the groove 21 can be provided with a protrusion or a depression, that is, the inner wall 212 of the groove 21 is uneven, which can increase the electrical connection area between the conductive member 20 and the protruding portion 134 and also increase the connection reliability.

[0053] When the conductive member 20 needs to be separated from the circuit board 10, the area where the conductive member 20 and the circuit board 10 are connected to each other is heated, and the protrusion 134 will return to the shape before pressing. In this embodiment, the protrusion 134 returns to the cross-sectional rectangular shape, and the protrusion 134 can be separated from the groove 21, thereby separating the conductive member 20 from the circuit board 10.

[0054] See also Figure 7 In another embodiment, before the pressing step, the electrical connection method further includes: covering the second area II with a conductive adhesive 30a, wherein the conductive adhesive 30a covers the main body 132 and the protruding portion 134 exposed to the protective layer 15. After the pressing step, the conductive adhesive 30a covering the surface of the protruding portion 134 is also received in the groove 21 to connect the inner wall 212 of the groove 21 and the protruding portion 134; the conductive adhesive 30a covering the surface of the main body 132 connects the main body 132 and the conductive member 20. The provision of the conductive adhesive 30a can further increase the connection reliability between the conductive member 20 and the circuit board 10, and can also improve the conductivity.

[0055] The embodiment of the present application further provides an electrical connection structure 100 of a circuit board 10 and a conductive member 20 , including the circuit board 10 and the conductive member 20 , wherein the circuit board 10 and the conductive member 20 are connected to each other.

[0056] The circuit board 10 includes a circuit substrate 11 and a protective layer 15. The circuit substrate 11 includes a base material layer 12 and a circuit layer 13. The circuit layer 13 is disposed on the surface of the base material layer 12 along a first direction L1. The circuit layer 13 is made of shape memory alloy.

[0057] The circuit layer 13 includes a main body 132 and a protruding portion 134 . The main body 132 is located on a surface of the substrate layer 12 . The protruding portion 134 is located on a surface of the main body 132 away from the substrate layer 12 and protrudes relative to the main body 132 .

[0058] Along the second direction L2 , the circuit substrate 11 is divided into a first area I and a second area II. The protruding portion 134 is located in the first area I, and the protection layer 15 covers the surface of the circuit substrate 11 located in the second area II.

[0059] The conductive member 20 is provided with a groove 21 , and the groove 21 is formed by a surface of the conductive member 20 being recessed toward the inside of the conductive member 20 . The protruding portion 134 is received in the groove 21 , thereby being connected to the circuit board 10 .

[0060] The surface of the conductive element 20 facing the circuit board 10 is connected to the main body 132 located in the first area I, thereby increasing the electrical connection area.

[0061] Along the second direction L2, the groove 21 has a second width W2, which is the width of the opening of the groove 21; the protruding portion 134 has a third width W3, which is the width of the protruding portion 134 except at the opening, and the third width W3 is greater than the second width W2, so that the protruding portion 134 is embedded in the groove 21 to increase the connection reliability between the conductive member 20 and the circuit board 10. In this embodiment, the cross-sections of the groove 21 and the protruding portion 134 along the first direction L1 and the second direction L2 are both trapezoidal.

[0062] In other embodiments, the electrical connection structure 100a further includes a conductive adhesive 30a, and the conductive adhesive 30a covers the main body 132 and the protruding portion 134 located in the first area I. The conductive adhesive 30a covering the surface of the protruding portion 134 is also received in the groove 21, and the conductive adhesive 30a covering the surface of the main body 132 connects the main body 132 and the conductive member 20. The provision of the conductive adhesive 30a is conducive to further increasing the connection reliability between the conductive member 20 and the circuit board 10, and can also improve the conductivity.

[0063] The present application also provides a terminal product (not shown), which is a product that uses the electrical connection structure 100 (or 100a), including but not limited to automobiles, mobile phones, computers, cameras, drones, etc.

[0064] The electrical connection method provided in the embodiment of the present application uses a circuit layer 13 made of a shape memory alloy to press the conductive member 20, so that the protrusion 134 received in the groove 21 of the conductive member 20 is deformed and embedded in the groove 21 of the conductive member 20, thereby realizing the mutual electrical connection between the circuit board 10 and the conductive member 20, replacing the solder paste welding used in the related art to avoid the occurrence of cold soldering, empty soldering, bubbles, etc.; the deformed protrusion 134 matches the shape of the groove 21, which can increase the connection reliability between the circuit board 10 and the conductive member 20. The electrical connection structure 100 (or 100a) made by the method of the present application can heat the interconnected area by heating so that the part of the circuit layer 13 embedded in the groove 21 can restore the deformation, and the circuit board 10 and the conductive member 20 can be easily separated without damaging the circuit board 10 or the conductive member 20.

[0065] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. An electrical connection method, characterized in that: The following steps are involved: The conductive member is placed in a circuit board, wherein the circuit board includes a circuit layer, the circuit layer includes a main body and a protruding portion located on the surface of the main body, the material of the circuit layer is a shape memory alloy, the conductive member has a groove, and the protruding portion is accommodated in the groove; as well as The circuit board and the conductive member are pressed together so that the protruding portion is deformed, thereby connecting the circuit board and the conductive member to each other.

2. The electrical connection method according to claim 1, characterized in that: Before the step of accommodating the protruding portion in the conductive member, the connection method further comprises: Disposing conductive glue on the circuit layer; When the protruding portion is received in the conductive member, the conductive glue is received in the groove.

3. The electrical connection method according to claim 1, characterized in that: Along the extending direction of the circuit board, the protruding portion has a first width, and the groove has a second width, the second width is the minimum width of the groove, and the first width is less than or equal to the second width.

4. The electrical connection method according to claim 3, characterized in that: Along the extending direction of the circuit board, the groove has a third width, and the third width is greater than the second width.

5. The electrical connection method according to claim 1, characterized in that: Before the pressing step, there is a gap between the protruding portion and the inner wall of the groove; after the pressing step, the protruding portion is deformed to fill the gap.

6. An electrical connection structure, characterized in that: include: The circuit board comprises a circuit layer, wherein the circuit layer comprises a main body and a protruding portion located on the surface of the main body, and the material of the circuit layer is a shape memory alloy; as well as The conductive member is provided with a groove, and the protruding portion is received in the groove and connected to the conductive member.

7. The electrical connection structure according to claim 6, characterized in that: The surface of the conductive member facing the circuit board is connected to the main body.

8. The electrical connection structure according to claim 6, characterized in that: The electrical connection structure further includes a conductive adhesive, which is located on a surface of the circuit layer facing the conductive member, and the conductive adhesive bonds the circuit board and the conductive member.

9. The electrical connection structure according to claim 6, characterized in that: Along the extending direction of the circuit board, the groove has a second width, the second width is located at the opening of the groove, and the protruding portion has a third width, the third width is located in a region other than the opening, and the third width is greater than the second width.

10. A terminal product, characterized in that: The terminal product includes the electrical connection structure.

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