Intelligent radio frequency transceiver

Abstract

The invention relates to the field of wireless communication equipment, and discloses an intelligent radio frequency transceiver device, which comprises a controller, a shell and a circuit board located in the shell, a plurality of module units are arranged on the circuit board, a heat dissipation module is arranged in the shell, a sensor module is further arranged in the shell, and the sensor module is connected with the controller. The sensor module is used for detecting the temperature in the shell in real time, the heat dissipation module is electrically connected with the controller, the heat dissipation module is adjusted according to the temperature in the shell, and a damping module is further arranged in the shell and used for reducing impact on the circuit board during falling or collision. By arranging the heat dissipation module, the angle adjusting assembly of the heat dissipation module and the heat shrinkage characteristic of the memory alloy spring, intelligent adjustment of the angle of the heat dissipation fan is achieved, the heat dissipation efficiency is improved, the cost is reduced, space utilization is optimized, and the heat dissipation problem of the device can be relieved.

Description

Technical Field

[0001] The present invention relates to the field of wireless communication equipment, and in particular to an intelligent radio frequency transceiver. Background Art

[0002] As the core component of wireless communication system, the mechanical structure design of RF transceiver is directly related to the performance, reliability and service life of the device. Traditional RF transceiver faces a series of challenges.

[0003] First, the RF transceiver generates a lot of heat during operation. If the heat dissipation is poor, the internal temperature of the device will be too high, thus affecting the stability and life of the electronic components. Traditional heat dissipation design usually uses heat sinks, fans and other heat dissipation elements, but these methods rely too much on temperature sensors. Although fans can be activated in time for heat dissipation, they cannot perform directional heat dissipation according to the different heat on the circuit board, resulting in a unified airflow direction that cannot meet the needs of excessive local heat. There is still a situation of excessively high local temperature, which affects the stability of the internal circuit board. Summary of the invention

[0004] The purpose of the present invention is to provide an intelligent radio frequency transceiver to solve the technical problem that the existing fan cannot perform directionally heat dissipation according to the different heat on the circuit board, resulting in the unified airflow direction being unable to meet the demand for excessive local heat, and the local temperature is still too high, affecting the stability of the internal circuit board.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] An intelligent radio frequency transceiver comprises a controller, a housing and a circuit board located inside the housing, the circuit board is provided with a plurality of module units, a heat dissipation module is provided inside the housing, a sensor module is further provided inside the housing, the sensor module is used to detect the temperature inside the housing in real time, the heat dissipation module is electrically connected to the controller, and the heat dissipation module is adjusted according to the temperature inside the housing;

[0007] A shock absorbing module is also arranged in the shell to reduce the impact on the circuit board when it falls or collides.

[0008] Furthermore, the heat dissipation module includes a heat sink, a plurality of heat sinks are provided, the heat sinks are provided on the circuit board and are provided one-to-one with the module units, and the shell is provided with heat dissipation holes, and the heat dissipation holes are used to dissipate the heat inside the shell to the outside of the shell;

[0009] The heat dissipation module also includes a heat dissipation fan, which is movably connected to the inside of the shell. An angle adjustment component is provided on one side of the heat dissipation fan, and the angle adjustment component is used to adjust the airflow direction of the heat dissipation fan according to the heat concentration area inside the shell.

[0010] Furthermore, the angle adjustment assembly includes a plurality of pull ropes, which are evenly distributed along the circumference of the cooling fan, and the other ends of the pull ropes are movably connected to the inner wall of the shell, and each of the pull ropes is connected in series with a memory alloy spring, and the pull ropes are grouped into four and at least one group is provided.

[0011] Furthermore, ventilation grooves are provided on the side walls of the shell, and ventilation components are provided in each ventilation groove. Multiple ventilation components are connected by connecting rods. The ventilation components cooperate with the angle adjustment components. When the memory alloy springs connected in series on multiple pull ropes are contracted and kept balanced, the ventilation components are operated to open the ventilation grooves provided on the side walls of the shell.

[0012] Furthermore, the ventilation assembly includes a ventilation baffle, which is slidably installed in the ventilation slot, and the upper and lower sides of the ventilation baffle are provided with open slots, and two adjacent ventilation baffles are fixedly connected by the connecting rod, and the inner side surface of the ventilation baffle is provided with a sliding portion, and the sliding portion is connected to the pull rope, and a limiting orifice plate is provided on the inner side wall of the shell at a position corresponding to the ventilation baffle, the pull rope passes through the limiting orifice plate, and a touch switch is provided at the bottom of the limiting orifice plate, and a pressing portion is provided on the pull rope, and a plurality of the touch switches are connected in series and electrically connected to the controller;

[0013] A dynamic bag is arranged in the opening groove at the bottom of the ventilation baffle. The dynamic bag is electrically connected to the controller. The dynamic bag becomes hard when the power is on and becomes soft when the power is off.

[0014] Furthermore, when the plurality of touch switches are in a pressed state, the dynamic capsule becomes hard when powered on under the control of the controller, and the pull rope drives the plurality of ventilation baffles to move upward at the same time to open the ventilation slots for ventilation.

[0015] Furthermore, the shock absorbing module includes at least one shock absorbing layer made of elastic material, the shock absorbing layer is arranged on the bottom side wall of the shell, and the inner side wall of the shell is also provided with a shock absorbing layer, and the shock absorbing layer is arranged between the circuit board and the shell to absorb and disperse the impact force generated when falling or colliding;

[0016] A bracket is also arranged on the inner wall of the shell, and an elastic connecting piece is arranged on the bracket, and an end of the elastic connecting piece is connected to the circuit board.

[0017] Furthermore, the elastic connecting member is a shock-absorbing spring or a shock-absorbing rubber pad.

[0018] Beneficial effects of the present invention:

[0019] (1) The present invention arranges a plurality of pull ropes equally at four or eight positions, and then identifies the heat generated at each position by connecting memory alloy springs in series. When the temperature of the memory alloy springs is reached, the springs shrink and reset, causing the cooling fan to be pulled to shift at that position, thereby allowing the cooling fan to concentrate the airflow below that position, thereby achieving a method of preferentially cooling the circuit board area with higher heat, so that the local temperature of the circuit board is maintained within a controllable range, thereby maximizing the use of the cooling fan.

[0020] (2) The present invention cleverly combines the pull rope and the memory alloy spring, and the component can flexibly adjust the angle of the cooling fan without adding extra space burden; this compact design enables the cooling system to better adapt to various compact electronic equipment environments; and, since the component can automatically adjust the angle of the cooling fan according to the heat distribution, the airflow can be more concentratedly blown to the high-temperature area, thereby improving the heat dissipation efficiency, reducing the overall temperature of the circuit board, and extending the service life of the electronic equipment. By reducing the number of electronic components and simplifying the system design, the component reduces the risk of system failure and improves the reliability and stability of the system. At the same time, the durability of the memory alloy spring also ensures the long-term stable operation of the cooling system. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be further described below in conjunction with the accompanying drawings.

[0022] Figure 1 It is a partial three-dimensional schematic diagram of the present invention;

[0023] Figure 2 It is a schematic diagram of the internal structure of the present invention;

[0024] Figure 3 This is a schematic structural diagram of a heat dissipation module of the present invention;

[0025] Figure 4 It is a state schematic diagram of the dynamic capsule in the present invention.

[0026] Description of the drawings: 1. Shell; 2. Circuit board; 3. Heat dissipation module; 32. Heat dissipation holes; 33. Cooling fan; 34. Angle adjustment assembly; 341. Pull rope; 342. Memory alloy spring; 343. Ventilation slot; 344. Ventilation assembly; 345. Connecting rod; 3441. Ventilation baffle; 3442. Opening slot; 3443. Sliding part; 3444. Limiting hole plate; 3445. Touch switch; 3446. Pressing part; 3447. Dynamic capsule; 4. Shock absorption module; 41. Shock absorption layer; 42. Bracket; 43. Elastic connector. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] See also Figure 1-Figure 4 As shown, the present invention is an intelligent radio frequency transceiver device, including a controller, a housing 1 and a circuit board 2 located inside the housing 1, wherein the circuit board 2 is provided with a plurality of module units, wherein the module units are module units of an existing radio frequency transceiver module, and no further details are given here, wherein a heat dissipation module 3 is provided inside the housing 1, wherein a sensor module is further provided inside the housing 1, wherein the sensor module is used for detecting the temperature inside the housing 1 in real time, wherein the heat dissipation module 3 is electrically connected to the controller, and the heat dissipation module 3 is adjusted according to the temperature inside the housing 1; and the sensor module is a temperature sensor;

[0029] A shock absorbing module 4 is also disposed in the housing 1 to reduce the impact on the circuit board 2 when it falls or collides.

[0030] The heat dissipation module 3 includes a heat sink, and a plurality of heat sinks are provided. The heat sinks are arranged on the circuit board 2 and correspond to the module units one by one. The housing 1 is provided with heat dissipation holes 32, and the heat dissipation holes 32 are used to dissipate the heat inside the housing 1 to the outside of the housing 1;

[0031] The heat dissipation module 3 also includes a heat dissipation fan 33, which is movably connected to the inside of the shell 1. An angle adjustment component 34 is provided on one side of the heat dissipation fan 33, and the angle adjustment component 34 is used to adjust the airflow direction of the heat dissipation fan 33 according to the heat concentration area inside the shell 1.

[0032] The angle adjustment assembly 34 includes a plurality of pull ropes 341, and the plurality of pull ropes 341 are evenly distributed along the circumference of the cooling fan 33. The other ends of the pull ropes 341 are movably connected to the inner wall of the shell 1. A memory alloy spring 342 is connected in series to each of the pull ropes 341. Four pull ropes 341 form a group and at least one group is provided.

[0033] The present invention arranges a plurality of pull cords 341 equally at four or eight positions, and then identifies the heat generated at each position by connecting the memory alloy springs 342 in series. When the temperature of the memory alloy springs 342 is reached, the memory alloy springs 342 shrink and reset, so that the cooling fan 33 is pulled to deviate from the position, so that the cooling fan 33 concentrates the airflow below the position, thereby achieving a method of preferentially cooling the circuit board 2 area with higher heat, so that the local temperature of the circuit board 2 is maintained within a controllable range, so as to maximize the use of the cooling fan 33.

[0034] The above method does not require the arrangement of multiple temperature sensors. On the one hand, through the thermal contraction characteristics of the memory alloy spring 342, the component can intelligently respond to the heat changes in different areas of the circuit board 2 without relying on additional temperature sensors; this adaptive heat dissipation adjustment mechanism enables the cooling fan 33 to automatically adjust the angle according to the heat distribution, and preferentially dissipate heat in the high-temperature area, thereby improving the heat dissipation efficiency; on the other hand, compared with the traditional heat dissipation system based on temperature sensors, the component avoids the arrangement of multiple temperature sensors and related circuit connections, simplifies the system design, and reduces the production cost; at the same time, the use of the memory alloy spring 342 also reduces the number of electronic components, further saving costs;

[0035] In addition, through the ingenious combination of the pull rope 341 and the memory alloy spring 342, the component can flexibly adjust the angle of the cooling fan 33 without adding extra space burden; this compact design enables the cooling system to better adapt to various compact electronic equipment environments; and, because the component can automatically adjust the angle of the cooling fan 33 according to the heat distribution, the airflow can be more concentratedly blown to the high-temperature area, thereby improving the heat dissipation efficiency, reducing the overall temperature of the circuit board 2, and extending the service life of the electronic equipment. By reducing the number of electronic components and simplifying the system design, the component reduces the risk of system failure and improves the reliability and stability of the system. At the same time, the durability of the memory alloy spring 342 also ensures the long-term stable operation of the cooling system;

[0036] In summary, the angle adjustment component 34 realizes intelligent adjustment of the angle of the cooling fan 33 by utilizing the thermal contraction characteristics of the memory alloy spring 342, which not only improves the heat dissipation efficiency and reduces costs, but also optimizes space utilization and enhances system reliability, providing a more efficient and reliable heat dissipation solution for electronic equipment.

[0037] The shell 1 is also provided with ventilation grooves 343 on its side wall, and each ventilation groove 343 is provided with a ventilation assembly 344. A plurality of ventilation assemblies 344 are connected by a connecting rod 345. The ventilation assembly 344 cooperates with the angle adjustment assembly 34. When the memory alloy springs 342 connected in series on a plurality of pull ropes 341 are contracted and kept balanced, the ventilation assembly 344 is operated to open the ventilation grooves 343 on the side wall of the shell 1.

[0038] The ventilation assembly 344 includes a ventilation baffle 3441, which is slidably installed in the ventilation slot 343, and the upper and lower sides of the ventilation baffle 3441 are provided with opening slots 3442, and the two adjacent ventilation baffles 3441 are fixedly connected by the connecting rod 345, and the inner side surface of the ventilation baffle 3441 is provided with a sliding portion 3443, and the sliding portion 3443 is connected to the pull rope 341, and a limiting hole plate 3444 is provided at the position corresponding to the ventilation baffle 3441 on the inner side wall of the shell 1, and the pull rope 341 passes through the limiting hole plate 3444, and a touch switch 3445 is provided at the bottom of the limiting hole plate 3444, and a pressing portion 3446 is provided on the pull rope 341, and a plurality of the touch switches 3445 are connected in series and electrically connected to the controller;

[0039] A dynamic capsule 3447 is disposed in the open groove 3442 at the bottom of the ventilation baffle 3441. The dynamic capsule 3447 is electrically connected to the controller. The dynamic capsule 3447 becomes hard when power is on and becomes soft when power is off.

[0040] When the plurality of touch switches 3445 are in a pressed state, the dynamic capsule 3447 becomes hard when powered on under the control of the controller, and the pull rope 341 drives the plurality of ventilation baffles 3441 to move upward at the same time to open the ventilation slots 343 for ventilation.

[0041] In order to solve the problem that when the overall temperature inside the housing 1 is too high, the temperature cannot be quickly reduced by adjusting the wind direction of the fan, a ventilation assembly 344 is provided. By using a plurality of ventilation slots 343 provided around the housing 1, once the memory alloy springs 342 connected in series on the four pull ropes 341 are heated and contracted to an extreme state, the heat dissipation fan 33 is in a balanced state, which affects the rapid extraction of heat inside the housing 1.

[0042] Therefore, through the common traction effect of the multiple pull ropes 341 when they are contracted upward, the pressing part 3446 is driven to contact the touch switch 3445 at the bottom of the limiting hole; because the multiple ventilation baffles 3441 are connected as a whole by the connecting rod 345, and the weight of the ventilation baffles 3441 themselves, a single pull rope 341 cannot drive the multiple ventilation baffles 3441 to move upward when it is contracted. Therefore, the single pull rope 341 will form a force to pull the cooling fan 33 to deflect. Once the temperature is too high, the multiple pull ropes 341 are balanced due to the contraction of the memory alloy spring 342, so the traction force will be applied to the ventilation baffle 3441. The traction force of the multiple pull ropes 341 is used to pull the ventilation baffle 3441 upward, so that when the four touch switches 3445 are all touched, the controller controls the dynamic capsule 3447 to move upward. The dynamic capsule 3447 is energized to make the electrorheological fluid or magnetorheological fluid filled in the dynamic capsule 3447 harden, so that the dynamic capsule 3447 arranged under the ventilation baffle 3441, which was originally pulled up by the pull rope 341, falls and stretches under the action of gravity. Once energized, the dynamic capsule 3447 in the falling and stretched state forms a supporting force for the ventilation baffle 3441, so that the ventilation baffle 3441 always maintains an open state, and multiple ventilation baffles 3441 are moved up at the same time through the connecting rod 345 for linkage, forming a fully ventilated state to maximize internal heat dissipation and ventilation. When the temperature drops, the memory alloy spring 342 stretches again, thereby releasing the balance state, so that the dynamic capsule 3447 is powered off and returns to a soft state and cannot provide support. The ventilation baffle 3441 moves down and resets, waiting for the next emergency heat dissipation situation to come before continuing to work.

[0043] The shock absorbing module 4 includes at least one shock absorbing layer 41 made of elastic material, and the shock absorbing layer 41 is arranged on the bottom side wall of the shell 1. The shock absorbing layer 41 is also arranged on the inner side wall of the shell 1. The shock absorbing layer 41 is arranged between the circuit board 2 and the shell 1 to absorb and disperse the impact force generated when falling or colliding.

[0044] A bracket 42 is further disposed on the inner wall of the housing 1 , and an elastic connector 43 is disposed on the bracket 42 . The end of the elastic connector 43 is connected to the circuit board 2 .

[0045] The elastic connecting member 43 is a shock absorbing spring or a shock absorbing rubber pad.

[0046] The present invention provides a shock absorbing module 4, thereby utilizing the shock absorbing layer 41 in the shock absorbing module 4 for isolation. Once the device falls or collides, the shock absorbing layer 41 between the circuit board 2 and the shell 1 can be utilized to absorb and disperse the impact force, thereby reducing damage to the circuit board 2. In order to further enhance the capability of the shock absorbing module 4, an elastic connection method is added, wherein the circuit board 2 is mounted on the bracket 42 through an elastic connector 43, thereby achieving shock absorption when it falls or collides, thereby avoiding damage to the circuit board 2 caused by hard contact as much as possible, thereby preventing serious malfunctions.

[0047] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. An intelligent radio frequency transceiver device, comprising a controller, a housing (1) and a circuit board (2) located inside the housing (1), wherein the circuit board (2) is provided with a plurality of module units, characterized in that: A heat dissipation module (3) is arranged inside the shell (1), and a sensor module is also arranged inside the shell (1), and the sensor module is used to detect the temperature inside the shell (1) in real time. The heat dissipation module (3) is electrically connected to the controller, and the heat dissipation module (3) is adjusted according to the temperature inside the shell (1); A shock absorbing module (4) is also provided in the housing (1) for reducing the impact on the circuit board (2) when it falls or collides.

2. The intelligent radio frequency transceiver according to claim 1, characterized in that: The heat dissipation module (3) comprises a heat dissipation fin, a plurality of the heat dissipation fins are provided, the heat dissipation fins are arranged on the circuit board (2) and are arranged one-to-one with the module units, and the shell (1) is provided with heat dissipation holes (32), and the heat dissipation holes (32) are used to dissipate heat inside the shell (1) to the outside of the shell (1); The heat dissipation module (3) further comprises a heat dissipation fan (33), wherein the heat dissipation fan (33) is movably connected to the interior of the housing (1), and an angle adjustment component (34) is provided on one side of the heat dissipation fan (33), wherein the angle adjustment component (34) is used to adjust the airflow direction of the heat dissipation fan (33) according to a heat concentration area inside the housing (1).

3. The intelligent radio frequency transceiver according to claim 2, characterized in that: The angle adjustment assembly (34) includes a plurality of pull ropes (341), and the plurality of pull ropes (341) are evenly distributed along the circumference of the cooling fan (33). The other ends of the pull ropes (341) are movably connected to the inner wall of the shell (1). A memory alloy spring (342) is connected in series to each of the pull ropes (341). The pull ropes (341) are grouped into four and at least one group is provided.

4. The intelligent radio frequency transceiver according to claim 2, characterized in that: The shell (1) is also provided with ventilation grooves (343) on the side wall, and each ventilation groove (343) is provided with a ventilation assembly (344). A plurality of ventilation assemblies (344) are connected via a connecting rod (345). The ventilation assembly (344) cooperates with the angle adjustment assembly (34). When the memory alloy springs (342) connected in series on a plurality of pull ropes (341) are all contracted and kept balanced, the ventilation assembly (344) is operated to open the ventilation grooves (343) provided on the side wall of the shell (1).

5. The intelligent radio frequency transceiver according to claim 4, characterized in that: The ventilation assembly (344) includes a ventilation baffle (3441), the ventilation baffle (3441) is slidably installed in the ventilation slot (343), and the upper and lower sides of the ventilation baffle (3441) are provided with opening slots (3442), and two adjacent ventilation baffles (3441) are fixedly connected by the connecting rod (345), and the inner side surface of the ventilation baffle (3441) is provided with a sliding part (3443), and the sliding part (3443) is connected to the pull rod (345). The pull rope (341) is connected, and a limit hole plate (3444) is arranged on the inner wall of the shell (1) at a position corresponding to the ventilation baffle (3441), the pull rope (341) passes through the limit hole plate (3444), a touch switch (3445) is arranged at the bottom of the limit hole plate (3444), and a pressing part (3446) is arranged on the pull rope (341), and a plurality of the touch switches (3445) are connected in series and electrically connected to the controller; A dynamic capsule (3447) is arranged in the opening groove (3442) at the bottom of the ventilation baffle (3441). The dynamic capsule (3447) is electrically connected to the controller. The dynamic capsule (3447) becomes hard when the power is on and becomes soft when the power is off.

6. The intelligent radio frequency transceiver according to claim 5, characterized in that: When the plurality of touch switches (3445) are in a pressed state, the dynamic capsule (3447) becomes hard when energized under the control of the controller, and the pull rope (341) drives the plurality of ventilation baffles (3441) to move upward at the same time to open the ventilation slots (343) for ventilation.

7. The intelligent radio frequency transceiver according to claim 1 or 4, characterized in that: The shock absorbing module (4) comprises at least one shock absorbing layer (41) made of elastic material, the shock absorbing layer (41) being arranged on the bottom side wall of the shell (1), and the inner side wall of the shell (1) is also provided with a shock absorbing layer (41), and the shock absorbing layer (41) is arranged between the circuit board (2) and the shell (1) to absorb and disperse the impact force generated when falling or colliding; A bracket (42) is also provided on the inner wall of the housing (1), an elastic connecting piece (43) is provided on the bracket (42), and an end of the elastic connecting piece (43) is connected to the circuit board (2).

8. The intelligent radio frequency transceiver according to claim 7, characterized in that: The elastic connecting member (43) is a shock absorbing spring or a shock absorbing rubber pad.

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