Reflow soldering process for double-sided circuit board

Abstract

The invention discloses a reflow soldering process for a double-sided circuit board, which belongs to the technical field of surface mounting processes, and comprises the following steps of: feeding prepared devices into a device posture correction mechanism one by one by a first device feeding execution mechanism; the device attitude correction mechanism corrects the attitude of the device; then, a second device feeding executing mechanism is made to feed the devices with the corrected postures to the corresponding circuit board materials conveyed into the reflow soldering conveying belt; then, a floating pressing execution mechanism is made to carry out floating pressing processing on the circuit board and the device materials located on the reflow soldering conveying belt; and finally, the circuit board and the device material which are subjected to floating pressing treatment are conveyed into a reflow soldering furnace through a reflow soldering conveying belt for reflow soldering treatment. According to the invention, the technical problem of how to improve the production efficiency of the reflow soldering floating height pressing process is solved.

Description

Technical Field

[0001] The invention relates to the technical field of surface mounting technology, and in particular to a double-sided circuit board reflow soldering technology. Background Art

[0002] Surface mount technology (SMT) is an electronic assembly technology that does not require drilling holes on the printed circuit board, but directly solders the surface-mounted components to the specified positions of the printed circuit board, using solder to form mechanical and electrical connections between the components and the printed circuit board.

[0003] The reflow process is one of the surface mount processes, which can use a reflow oven to melt the solder paste so that the surface mounted components and the PCB board are firmly bonded together. Specifically: by melting the solder paste pre-allocated to the pads of the printed circuit board, the mechanical and electrical connection between the soldering surface or pins of the surface mounted components and the pads of the printed circuit board is achieved; when the PCB enters the preheating zone, the solvent and gas of the solder paste are evaporated, and at the same time, the flux of the solder paste wets the pads, component ends and pins, and the solder paste softens, collapses, and covers the pads, isolating the pads, component pins and oxygen; when the PCB enters the insulation zone, the PCB and components are fully preheated; when the PCB enters the reflow soldering zone, the temperature rises rapidly to melt the solder paste, and the liquid solder wets, diffuses, flows or reflows the pads, component ends and pins of the PCB to form solder joints; the PCB enters the cooling zone, the solder joints solidify, and the entire reflow soldering is completed.

[0004] In the reflow process, the phenomenon of reflow soldering floating is easy to occur. The reflow soldering floating refers to the phenomenon that the gap between the device and the PCB pad is too large or the coating material between the pad and the device is too thick during the reflow process, causing the device to float or twist during the reflow process. At this time, an effective method is to match and press the device and the circuit board.

[0005] Based on this, Chinese patent CN212122010U discloses a floating height pressing device for reflow soldering, which includes an outer cover, a pad and a bracket, the top of the bracket is laterally fixedly connected to the pad, and the top of the pad is fixedly connected to the outer cover, a pneumatic telescopic rod is fixedly connected to the middle position of the top of the inner top of the outer cover, and the output end of the pneumatic telescopic rod is laterally fixedly connected to a movable plate, the bottom end of the movable plate is uniformly penetrated by a buffer structure, and the bottom end of the buffer structure is laterally fixedly connected to a push plate, the bottom end of the push plate is uniformly vertically fixedly connected to a probe, and the bottom end of the probe is fixedly connected to a mounting structure, and a pressure head is arranged inside the mounting structure. This floating height pressing device for reflow soldering can effectively reduce excessive pressing force by arranging a buffer structure at the top of the push plate, and using a buffer spring to avoid pressing wear on the PCB board, the pressure head and the probe caused by the pressing force, thereby extending the service life of the device.

[0006] In addition, in order to solve the problem that the PCB board is pressed due to a single pressure direction, the middle part of the PCB board is depressed and deformed due to excessive pressure on the middle part of the PCB board, another patent document with publication number CN118678572A also discloses a floating height pressing device for PCB board reflow soldering, which includes a base, a feeding mechanism is provided at the upper end of the base, and a bracket is fixedly installed at the upper end of the base at the rear side of the feeding mechanism. In the technical solution disclosed in the patent document, when the lifting plate descends, it will drive the rack fixed to it to descend, drive the gear to rotate, and the gear drives the rack on the other side to rise, thereby driving the support plate to rise synchronously, and the support plate drives the telescopic rod 2 and the lower pressure head to rise synchronously, and the lower pressure head gradually penetrates the opening on the feeding mechanism and contacts with the lower surface of the PCB board, and cooperates with the upper pressure head to press the upper and lower surfaces of the PCB board synchronously, thereby avoiding pressing only the upper surface of the PCB board, so that the upper surface of the PCB board is subjected to excessive force, which easily causes the middle pressing area of ​​the PCB board to deform, thereby improving the subsequent reflow soldering quality of the PCB board.

[0007] However, the floating height pressing device for reflow soldering disclosed in the prior art still has the technical problem of insufficient loading efficiency. Specifically, in the production practice of the double-sided circuit board reflow soldering process, it is known that the components and circuit boards that need to be connected using the reflow soldering process usually flow in different assembly lines. Before pre-pressing, the operator needs to load the components onto the circuit board before entering the reflow soldering furnace; moreover, before the floating height pressing process begins, the operator is also required to manually proofread and align the circuit board and other materials to avoid more welding problems during pressing, such as solder joint damage, component displacement, etc. Therefore, the assembly efficiency of the floating height pressing device disclosed in the prior art is not high in actual loading applications. Summary of the invention

[0008] Based on this, it is necessary to provide a double-sided circuit board reflow soldering process to address the technical issue of how to improve the production efficiency of the reflow soldering floating height pressing process.

[0009] A double-sided circuit board reflow soldering process, comprising the following steps: S1: The first component loading actuator loads the prepared components one by one into the component posture correction mechanism; S2: The device posture correction mechanism corrects the device posture; S3: The second device loading actuator loads the device that has completed posture correction onto the corresponding circuit board material transported into the reflow soldering conveyor belt; S4: The floating height pressing actuator performs floating height pressing processing on the circuit board and device materials on the reflow soldering conveyor belt; S5: After the floating height pressing process, the circuit board and device materials are sent to the reflow oven by the reflow conveyor belt for reflow process.

[0010] Furthermore, the first device loading execution mechanism loads the pre-prepared devices one by one into the device posture correction mechanism, and the specific steps are as follows: S11: The components to be loaded are stored in the storage bin in advance; S12: The first transverse displacement mechanism disposed on the side of the first gantry support frame first drives the first longitudinal displacement mechanism, so that the suction cup action mechanism disposed in the first longitudinal displacement mechanism is located above the storage bin; S13: the first longitudinal displacement mechanism drives the suction cup action mechanism downward until the suction cup action mechanism abuts against a device located at the uppermost layer of the storage bin, and the suction cup action mechanism absorbs the device; S14: After the first longitudinal displacement mechanism drives the suction cup action mechanism to move upward to a preset height, the first transverse displacement mechanism drives the first longitudinal displacement mechanism to move transversely until the suction cup action mechanism is located above the device posture correction mechanism; S15: the first longitudinal displacement mechanism drives the suction cup action mechanism downward until the device adsorbed by the suction cup action mechanism is located in the device posture correction mechanism, and the suction cup action mechanism releases the device material; S16: The first longitudinal displacement mechanism drives the suction cup action mechanism to reset upward, and the first lateral displacement mechanism drives the first longitudinal displacement mechanism to reset.

[0011] Furthermore, the device posture correction mechanism performs steps for correcting the device posture, which are specifically as follows: S21: The suction cup action mechanism releases the device material to be calibrated into the material loading fixture; S22: The material pushing correction cylinder drives the material pushing moving block forward, so that the material swinging correction cylinder is pushed forward at the same time, until the material swinging execution part connected to the material swinging correction cylinder is driven to the side surface of the material swinging execution part against the edge of the device material to be corrected, and continues to push the device material to be corrected until one end of the device is completely in contact with the side edge of the inner cavity of the material carrier; S23: The push correction cylinder drives the push moving block to retreat to a preset position. At this time, the swing correction cylinder drives the swing actuator to open, so that the inner wall spacing after the swing actuator is opened corresponds to the preset width of the device; S24: the push correction cylinder drives the push moving block to move forward to a preset position so that the inner wall of the swing execution part fits the two sides of the device to be corrected until the posture of the device to be corrected is corrected to within a preset threshold range; S25: The push material correction cylinder drives the push material moving block to drive the swing material correction cylinder and the swing material execution unit to reset.

[0012] Furthermore, the second device loading actuator loads the device that has completed posture correction onto the corresponding circuit board material transported into the reflow soldering conveyor belt, specifically as follows: S31: The second lateral displacement mechanism disposed on the side of the second gantry support frame drives the second longitudinal displacement mechanism so that the clamping actuator connected to the second longitudinal displacement mechanism is located above the material loading fixture; S32: The second longitudinal displacement mechanism drives the clamping actuator downward until the clamping actuator can clamp the device material that has completed posture correction and is placed in the material carrier; S33: After the clamping actuator clamps the device material, the second longitudinal displacement mechanism drives the clamping actuator to rise to a preset position; S34: the second lateral displacement mechanism drives the second longitudinal displacement mechanism to drive the clamping actuator to move above the reflow conveyor belt, and aligns the clamped device material onto the circuit board to be matched; S35: The second longitudinal displacement mechanism drives the clamping actuator to move downward to another preset position, and the clamping actuator releases the device material onto the circuit board to be matched.

[0013] Furthermore, the steps of the floating and pressing actuator to perform floating and pressing processing on the circuit board and device materials on the reflow soldering conveyor belt are as follows: S41: After the second device loading actuator places the device material that has completed posture correction on the circuit board on the reflow soldering conveyor belt, the first floating height pressing actuator and the second floating height pressing actuator can be located just above and below the circuit board and the device material; S42: the first floating height pressing execution unit moves to abut against the device material to be pressed; S43: The second floating and pressing execution unit moves to the bottom of the circuit board, and cooperates with the first floating and pressing execution unit to perform floating and pressing processing on the circuit board and the device materials at the upper and lower sides at the same time.

[0014] Furthermore, the steps of the first floating height pressing execution unit are as follows: The first pressing drive cylinder drives the telescopic guide rod downward, so that the telescopic guide rod pushes the first pressing movable frame downward along the guidance of the first pressing movable guide rail. At this time, the first abutting portion arranged at the end of the first pressing movable frame can follow it downward until the first abutting portion movably abuts against the circuit board or device material.

[0015] Furthermore, the second floating height pressing execution unit cooperates with the first floating height pressing execution unit to execute the floating height pressing action, which is specifically as follows: S51: After the first abutting portion movably abuts against the circuit board or the device material, the second pressing driving cylinder drives the inclined sliding abutting portion to move forward. At this time, the pulley structure slides from the lower position of the inclined sliding abutting portion to the higher position, so that the pulley structure pushes the second pressing movable frame to move upward along the limit position of the second pressing movable guide rail; S52: When the second pressing movable frame moves upward, the second abutting portion can be driven to move upward at the same time to move closer to the first abutting portion, so that the circuit board and the device material located between the first abutting portion and the second abutting portion can be pressed and processed by both; S53: During the pressing action, the spring between the first pressing movable frame and the telescopic guide rod can be retracted to reduce the impact force, thereby preventing the circuit board and the device materials from being damaged by excessive impact force; S54: After completing the pressing process, the second pressing drive cylinder drives the inclined sliding abutment part to reset. At this time, the pulley structure slides from the high point to the low point along the inclined sliding abutment part, and the two reset springs connected to the two sides of the second pressing movable frame can pull the second pressing movable frame to reset downward along the limit of the second pressing movable guide rail; at this time, the second floating height pressing execution part cooperates with the first floating height pressing execution part to complete the processing of a floating height pressing process.

[0016] In summary, in a double-sided circuit board reflow soldering process of the present invention, the first device feeding actuator is firstly used to feed the pre-prepared devices one by one into the device posture correction mechanism; then the device posture correction mechanism is used to correct the posture of the device; then, the second device feeding actuator is used to feed the device that has completed posture correction onto the corresponding circuit board material transported into the reflow soldering conveyor belt; then, the floating height pressing actuator is used to perform floating height pressing treatment on the circuit board and device materials on the reflow soldering conveyor belt; finally, the circuit board and device materials that have completed the floating height pressing treatment are sent into the reflow soldering furnace by the reflow soldering conveyor belt for reflow soldering treatment. In the aforementioned floating height pressing treatment process, the floating height pressing treatment can be performed on both sides of the circuit board and the device at the same time, and before the floating height pressing treatment is performed, the device can be automatically fed, posture corrected, and transplanted and assembled; the manual processing process of the operator is reduced; therefore, a double-sided circuit board reflow soldering process of the present invention solves the technical problem of how to improve the production efficiency of the reflow soldering floating height pressing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of a double-sided circuit board reflow soldering device of the present invention; Figure 2 It is a structural schematic diagram of a partial structure of a double-sided circuit board reflow soldering device of the present invention; Figure 3 It is a structural schematic diagram of a partial structure of a double-sided circuit board reflow soldering device of the present invention; Figure 4 It is a structural schematic diagram of a partial structure of a double-sided circuit board reflow soldering device of the present invention; Figure 5 It is a structural schematic diagram of a partial structure of a double-sided circuit board reflow soldering device of the present invention; Figure 6 It is a structural schematic diagram of a partial structure of a double-sided circuit board reflow soldering device of the present invention; Figure 7 It is a structural schematic diagram of a partial structure of a double-sided circuit board reflow soldering device of the present invention; Figure 8 It is a structural schematic diagram of a partial structure of a double-sided circuit board reflow soldering device of the present invention; Fig. 9 The present invention is a schematic structural diagram of a partial structure of a double-sided circuit board reflow soldering device. DETAILED DESCRIPTION

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0019] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0021] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0023] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0024] Please also read Figures 1 to 9 , a floating height pressing device for a double-sided circuit board reflow soldering process, comprising: a first device feeding actuator 1, a device posture correction mechanism 2, a second device feeding actuator 3, a reflow soldering conveyor belt 4 and a floating height pressing actuator 5; the first device feeding actuator 1 is arranged adjacent to the device posture correction mechanism 2, the second device feeding actuator 3 is arranged on the other side of the device posture correction mechanism 2 relative to the first device feeding actuator 1, and the first device feeding actuator 1 is movably connected to the device posture correction mechanism 2; the reflow soldering conveyor belt 4 is arranged on the side of the floating height pressing actuator 5, the second device feeding actuator 3 is arranged on the other side of the floating height pressing actuator 5 relative to the reflow soldering conveyor belt 4, and the second device feeding actuator 3 is movably connected to the reflow soldering conveyor belt 4; the reflow soldering conveyor belt 4 is connected to an external reflow soldering furnace (not shown in the figure).

[0025] Specifically, a double-sided circuit board reflow soldering process using the aforementioned floating pressing device comprises the following steps: S1: The first device loading actuator 1 loads the prepared devices one by one into the device posture correction mechanism 2; S2: The device posture correction mechanism 2 corrects the posture of the device; S3: The second device loading actuator 3 loads the device that has completed posture correction onto the corresponding circuit board material transported into the reflow soldering conveyor belt 4; S4: The floating and pressing actuator 5 performs floating and pressing processing on the circuit board and device materials on the reflow soldering conveyor belt 4; S5: The circuit board and device materials that have completed the floating height pressing process are sent to the reflow oven by the reflow conveyor belt 4 for reflow processing.

[0026] Specifically, the first device feeding actuator 1 comprises a first gantry support frame 101, a first transverse displacement mechanism 102, a first longitudinal displacement mechanism 103, a suction cup action mechanism 104 and a storage bin 105; the first transverse displacement mechanism 102 is arranged on the side of the first gantry support frame 101, the first longitudinal displacement mechanism 103 is arranged on the side of the first transverse displacement mechanism 102, the first transverse displacement mechanism 102 is drivingly connected to the first longitudinal displacement mechanism 103, the suction cup action mechanism 104 is movably arranged between the first longitudinal displacement mechanism 103 and the storage bin 105, and the first longitudinal displacement mechanism 103 is drivingly connected to the suction cup action mechanism 104; the storage bin 105 is arranged below the side of the first gantry support frame 101.

[0027] Furthermore, in a double-sided circuit board reflow soldering process of the present invention, the first device feeding execution mechanism 1 feeds the pre-prepared devices one by one into the device posture correction mechanism 2, specifically as follows: S11: The components to be loaded are stored in the storage bin 105 in advance; S12: The first lateral displacement mechanism 102 disposed on the side of the first gantry support frame 101 first drives the first longitudinal displacement mechanism 103, so that the suction cup action mechanism 104 disposed in the first longitudinal displacement mechanism 103 is located above the storage bin 105; S13: The first longitudinal displacement mechanism 103 drives the suction cup action mechanism 104 downward until the suction cup action mechanism 104 abuts against a device located at the uppermost layer of the storage bin 105, and the suction cup action mechanism 104 absorbs the device; S14: After the first longitudinal displacement mechanism 103 drives the suction cup action mechanism 104 to move upward to a preset height, the first transverse displacement mechanism 102 drives the first longitudinal displacement mechanism 103 to move transversely until the suction cup action mechanism 104 is located above the device posture correction mechanism 2; S15: the first longitudinal displacement mechanism 103 drives the suction cup action mechanism 104 downward until the device adsorbed by the suction cup action mechanism 104 is located in the device posture correction mechanism 2, and the suction cup action mechanism 104 releases the device material; S16: The first longitudinal displacement mechanism 103 drives the suction cup action mechanism 104 to move upward and reset, and the first lateral displacement mechanism 104 drives the first longitudinal displacement mechanism 103 to reset.

[0028] Further, in a specific embodiment, the first lateral displacement mechanism 102 has a first lateral displacement guide frame 102a, a first lateral drive motor 102b, a first lateral drive screw rod 102c, a first lateral nut moving block 102d and a first lateral moving frame 102e; the first lateral displacement guide frame 102a is fixedly arranged on the side of the first gantry support frame 101, the first lateral drive motor 102b is arranged on the end side of the first lateral displacement guide frame 102a, the first lateral drive screw rod 102c is movably arranged in the first lateral displacement guide frame 102a, and the first lateral drive motor 102b is drivingly connected to the first lateral drive screw rod 102c; the first lateral nut moving block 102d is matched and connected to the first lateral drive screw rod 102c, the first lateral moving frame 102e is connected to the first lateral nut moving block 102d, and the first longitudinal displacement mechanism 103 is arranged on the side of the first lateral moving frame 102e. Specifically, after being energized, the first transverse driving motor 102b can drive the first transverse driving screw rod 102c to rotate in the first transverse displacement guide frame 102a, thereby enabling the first transverse nut moving block 102d to reciprocate on the first transverse driving screw rod 102c, and then driving the first longitudinal displacement mechanism 103 to reciprocate through the first transverse moving frame 102e.

[0029] Furthermore, the first longitudinal displacement mechanism 103 comprises a first longitudinal driving cylinder 103a and a first longitudinal moving block 103b; the first longitudinal driving cylinder 103a is disposed on the side of the first transverse moving frame 102e, the first longitudinal driving cylinder 103a is drivingly connected to the first longitudinal moving block 103b, and the first longitudinal moving block 103b is connected to the suction cup action mechanism 104. Specifically, after the first longitudinal driving cylinder 103a is powered on, it can drive the first longitudinal moving block 103b to reciprocate in the longitudinal direction and then drive the suction cup action mechanism 104 to descend or ascend.

[0030] Furthermore, the suction cup action mechanism 104 comprises a suction cup bracket 104a, a suction cup rod 104b and a suction cup structure 104c; the suction cup bracket 104a is connected to the first longitudinal moving block 103b, the suction cup rod 104b is arranged in the suction cup bracket 104a, and the suction cup structure 104c is arranged at the lower part of the suction cup rod 104b. Specifically, the suction cup rod 104b is connected to an external air source, so that the suction cup structure 104c can adsorb or release the device as needed; and can be driven by the first longitudinal moving block 103b and follow its movement.

[0031] Furthermore, the device posture correction mechanism 2 has a correction support frame 201, a loading fixture 202, a push correction cylinder 203, a pushing moving block 204, a swing correction cylinder 205 and a swing execution unit 206; the correction support frame 201 is arranged under the first gantry support frame 101 on the adjacent side of the storage bin 105; the loading fixture 202 is arranged on one side of the upper part of the correction support frame 201, and the push correction cylinder 203 is arranged on the other side of the upper part of the correction support frame 201 relative to the loading fixture 202; the pushing moving block 204 is movably arranged between the loading fixture 202 and the push correction cylinder 203, and the push correction cylinder 203 is drivingly connected to the pushing moving block 204; the swing correction cylinder 205 is arranged on the side of the pushing moving block 204, and the swing correction cylinder 205 is drivingly connected to the swing execution unit 206.

[0032] Furthermore, in a double-sided circuit board reflow soldering process of the present invention, the steps of the device posture correction mechanism 2 correcting the device posture are as follows: S21: The suction cup action mechanism 104 releases the device material to be calibrated into the material loading fixture 202; S22: The material pushing correction cylinder 203 drives the material pushing moving block 204 to move forward, so that the material swinging correction cylinder 205 is pushed forward at the same time, until the material swinging execution part 206 connected to the material swinging correction cylinder 205 is driven to the side surface of the material to be calibrated against the edge of the device material to be calibrated, and continues to push the device material to be calibrated until one end of the device is completely in contact with the side edge of the inner cavity of the material carrier 202; S23: The push correction cylinder 203 drives the push moving block 204 to retreat to a preset position. At this time, the swing correction cylinder 205 drives the swing execution unit 206 to open, so that the inner wall spacing after the swing execution unit 206 is opened corresponds to the preset width of the device; S24: the push correction cylinder 203 drives the push moving block 204 to move forward to a preset position, so that the inner wall of the swing execution part 206 is in contact with the two sides of the device to be corrected, until the posture of the device to be corrected is corrected to within a preset threshold range; S25: The material pushing correction cylinder 203 drives the material pushing moving block 204 to drive the material swinging correction cylinder 205 and the material swinging execution part 206 to reset.

[0033] Furthermore, in a specific embodiment, the second device feeding actuator 3 has a second gantry support frame 301, a second lateral displacement mechanism 302, a second longitudinal displacement mechanism 303 and a clamping actuator 304; the second lateral displacement mechanism 302 is arranged on the side of the second gantry support frame 301, the second longitudinal displacement mechanism 303 is arranged on the side of the second lateral displacement mechanism 302, the second lateral displacement mechanism 302 is drivingly connected to the second longitudinal displacement mechanism 303, the clamping actuator 304 is movably arranged between the second longitudinal displacement mechanism 303 and the reflow soldering conveyor belt 4, and the second longitudinal displacement mechanism 303 is drivingly connected to the clamping actuator 304.

[0034] Furthermore, in a double-sided circuit board reflow soldering process of the present invention, the second device feeding actuator 3 feeds the device that has completed posture correction onto the corresponding circuit board material conveyed into the reflow soldering conveyor belt 4, and the specific steps are as follows: S31: The second lateral displacement mechanism 302 disposed on the side of the second gantry support frame 301 drives the second longitudinal displacement mechanism 303, so that the clamping actuator 304 connected to the second longitudinal displacement mechanism 303 is located above the material loading fixture 202; S32: The second longitudinal displacement mechanism 303 drives the clamping actuator 304 downward until the clamping actuator 304 can clamp the device material that has been corrected and placed in the material carrier 202; S33: After the clamping actuator 304 clamps the device material, the second longitudinal displacement mechanism 303 drives the clamping actuator 304 to rise to a preset position; S34: the second lateral displacement mechanism 302 drives the second longitudinal displacement mechanism 303 to drive the clamping actuator 304 to move above the reflow soldering conveyor belt 4, and aligns the clamped device material onto the circuit board to be matched; S35: The second longitudinal displacement mechanism 303 drives the clamping actuator 304 to move downward to another preset position, and the clamping actuator 304 releases the device material onto the circuit board to be matched.

[0035] Further, in a specific embodiment, the second transverse displacement mechanism 302 has a second transverse displacement guide frame 302a, a second transverse drive motor 302b, a second transverse drive screw rod 302c, a second transverse nut moving block 302d and a second transverse moving frame 302e; the second transverse displacement guide frame 302a is fixedly arranged on the side of the second gantry support frame 301, the second transverse drive motor 302b is arranged on the end side of the second transverse displacement guide frame 302a, the second transverse drive screw rod 302c is movably arranged in the second transverse displacement guide frame 302a, and the second transverse drive motor 302b is drivingly connected to the second transverse drive screw rod 302c; the second transverse nut moving block 302d is matched and connected to the second transverse drive screw rod 302c, the second transverse moving frame 302e is connected to the second transverse nut moving block 302d, and the second longitudinal displacement mechanism 303 is arranged on the side of the second transverse moving frame 302e. Specifically, after being energized, the second transverse driving motor 302b can drive the second transverse driving screw rod 302c to rotate in the second transverse displacement guide frame 302a, thereby enabling the second transverse nut moving block 302d to reciprocate on the second transverse driving screw rod 302c, and then driving the second longitudinal displacement mechanism 303 to reciprocate through the second transverse moving frame 302e.

[0036] Furthermore, the second longitudinal displacement mechanism 303 comprises a second longitudinal driving cylinder 303a and a second longitudinal moving block 303b; the second longitudinal driving cylinder 303a is arranged on the side of the second transverse moving frame 302e, the second longitudinal driving cylinder 303a is drivingly connected to the second longitudinal moving block 303b, and the second longitudinal moving block 303b is connected to the clamping actuator 304. Specifically, after the second longitudinal driving cylinder 303a is electrically started, it can drive the second longitudinal moving block 303b to reciprocate in the longitudinal direction and then drive the clamping actuator 304 to descend or ascend.

[0037] Furthermore, the clamping actuator 304 has a clamping drive cylinder 304a and a clamping jaw 304b; the clamping drive cylinder 304a is connected to the side of the second longitudinal moving block 303b, and the two clamping jaws 304b are movably arranged at the end side of the clamping drive cylinder 304a, and the clamping drive cylinder 304a is respectively connected to the two clamping jaws 304b. Specifically, when the device material that has completed posture correction is located within the working range of the two clamping jaws 304b, the clamping drive cylinder 304a can drive the two clamping jaws 304b to clamp or release the device material.

[0038] Furthermore, the reflow soldering conveyor belt 4 is a conventional conveyor belt structure, for example, it can be a belt conveyor belt structure, and its surface can carry materials such as printed circuit boards.

[0039] Furthermore, the floating height pressing actuator 5 has a pressing support frame 501, a first floating height pressing actuator part 502 and a second floating height pressing actuator part 503; the pressing support frame 501 is arranged on the side of the reflow soldering conveyor belt 4, and the first floating height pressing actuator part 502 and the second floating height pressing actuator part 503 are relatively movably arranged on the side of the pressing support frame 501.

[0040] Therefore, in a double-sided circuit board reflow soldering process of the present invention, the steps of the floating and pressing actuator 5 performing floating and pressing processing on the circuit board and device materials located on the reflow soldering conveyor belt 4 are specifically as follows: S41: After the second device loading actuator 3 places the device material that has completed posture correction on the circuit board on the reflow soldering conveyor belt 4, the first floating height pressing actuator 502 and the second floating height pressing actuator 503 can be located just above and below the circuit board and the device material; S42: the first floating height pressing execution unit 502 moves to contact the device material to be pressed; S43: the second floating and pressing executing unit 503 moves to the bottom of the circuit board, and cooperates with the first floating and pressing executing unit 502 to perform floating and pressing processing on the circuit board and the device materials at the upper and lower sides at the same time.

[0041] Further, in a specific embodiment, the first floating height pressing actuator 502 has a first pressing movable guide rail 502a, a first pressing movable frame 502b, a first abutting portion 502c, a telescopic guide rod 502d, a spring 502e and a first pressing driving cylinder 502f; the first pressing movable guide rail 502a is arranged on the side of the pressing support frame 501, the first pressing movable frame 502b is movably connected to the first pressing movable guide rail 502a, the first abutting portion 502c is connected to one end of the first pressing movable frame 502b, and the telescopic guide rod 502d is movably connected to the other end of the first pressing movable frame 502b; the spring 502d is connected between the first pressing movable frame 502b and the telescopic guide rod 502d, the first pressing driving cylinder 502f is arranged on the upper side of the pressing support frame 501, and the first pressing driving cylinder 502f is drivingly connected to the telescopic guide rod 502d.

[0042] Furthermore, the second floating height pressing actuator 503 comprises a second pressing movable guide rail 503a, a second pressing movable frame 503b, a return spring 503c, a second abutment portion 503d, a pulley structure 503e, an inclined sliding abutment portion 503f and a second pressing driving cylinder 503g; the second pressing movable guide rail 503a is arranged at the lower side of the pressing support frame 501, and the second pressing movable frame 503b is movably arranged on the second pressing movable guide rail 503a; the two return springs 503c are respectively connected to the two sides of the second pressing movable frame 503b, and each return spring 503c is They are respectively connected to the pressing support frame 501; the second abutment portion 503d is arranged at the end of the second pressing movable frame 503b, and the second abutment portion 503d is arranged opposite to the first abutment portion 502c; the pulley structure 503e is arranged at the other end of the second pressing movable frame 503b relative to the second abutment portion 503d, and the pulley structure 503e is movably connected to the inclined sliding abutment portion 503f, and the second pressing drive cylinder 503g is arranged at the lower part of the pressing support frame 501, and the second pressing drive cylinder 503g is drivingly connected to the inclined sliding abutment portion 503f.

[0043] Specifically, in a double-sided circuit board reflow soldering process of the present invention, the steps of the first floating height pressing execution unit 502 are as follows: The first pressing drive cylinder 502f drives the telescopic guide rod 502d downward, so that the telescopic guide rod 502d pushes the first pressing movable frame 502b downward along the guidance of the first pressing movable guide rail 502a. At this time, the first abutment portion 502c arranged at the end of the first pressing movable frame 502b can follow it downward until the first abutment portion 502c is movably abutted against the circuit board or device material.

[0044] Furthermore, in a double-sided circuit board reflow soldering process of the present invention, the second floating height pressing execution unit 50 cooperates with the first floating height pressing execution unit 502 to perform the floating height pressing action, which is specifically as follows: S51: After the first abutting portion 502c is movably abutted against the circuit board or device material, the second pressing driving cylinder 503g drives the inclined sliding abutting portion 503f to move forward. At this time, the pulley structure 503e slides from the lower position to the higher position of the inclined sliding abutting portion 503f, so that the pulley structure 503e pushes the second pressing movable frame 503b to move upward along the limit position of the second pressing movable guide rail 503a; S52: When the second pressing movable frame 503b moves upward, it can drive the second abutting portion 503d to move upward at the same time to move close to the first abutting portion 502c, so that the circuit board and device materials located between the first abutting portion 502c and the second abutting portion 503d can be pressed and processed by both; S53: During the pressing action, the spring 502e between the first pressing movable frame 502b and the telescopic guide rod 502d can be retracted to reduce the impact force, thereby preventing the circuit board and the device materials from being damaged by excessive impact force; S54: After completing the pressing process, the second pressing drive cylinder 503g drives the inclined sliding abutment part 503f to reset. At this time, the pulley structure 503e slides along the high point of the inclined sliding abutment part 503f to the low point, and the two reset springs 503c connected to the two sides of the second pressing movable frame 503b can pull the second pressing movable frame 503b to reset downward along the limit of the second pressing movable guide rail 503a; at this time, the second floating height pressing execution part 50 cooperates with the first floating height pressing execution part 502 to complete the processing of a floating height pressing process.

[0045] In summary, in a double-sided circuit board reflow soldering process of the present invention, the first device feeding actuator 1 is firstly used to feed the pre-prepared devices one by one into the device posture correction mechanism 2; then the device posture correction mechanism 2 is used to correct the posture of the device; then, the second device feeding actuator 3 is used to feed the devices that have completed the posture correction onto the corresponding circuit board materials transported into the reflow soldering conveyor belt 4; then, the floating height pressing actuator 5 is used to perform floating height pressing treatment on the circuit board and device materials located on the reflow soldering conveyor belt 4; finally, the circuit board and device materials that have completed the floating height pressing treatment are transported from the reflow soldering conveyor belt 4 into the reflow soldering furnace for reflow soldering treatment. In the aforementioned floating and pressing process, the floating and pressing process can be performed on both sides of the circuit board and the device at the same time, and before the floating and pressing process is performed, the device can be automatically loaded, posture corrected, and transplanted and assembled; the manual processing process of the operator is reduced; therefore, the double-sided circuit board reflow soldering process of the present invention solves the technical problem of how to improve the production efficiency of the reflow soldering floating and pressing process.

[0046] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0047] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A double-sided circuit board reflow soldering process, characterized in that: It includes the following steps: S1: The first component loading actuator (1) loads the pre-prepared components one by one into the component posture correction mechanism (2); S2: The device posture correction mechanism (2) corrects the posture of the device; S3: The second device loading actuator (3) loads the device that has completed posture correction onto the corresponding circuit board material transported into the reflow soldering conveyor belt (4); S4: The floating and pressing actuator (5) performs floating and pressing processing on the circuit board and device materials located on the reflow soldering conveyor belt (4); S5: After the floating height pressing process, the circuit board and the device materials are sent to the reflow oven by the reflow conveyor belt (4) for reflow treatment.

2. A double-sided circuit board reflow soldering process according to claim 1, characterized in that: The first device loading execution mechanism (1) loads the pre-prepared devices one by one into the device posture correction mechanism (2), specifically as follows: S11: The components to be loaded are stored in advance in the storage bin (105); S12: The first transverse displacement mechanism (102) disposed on the side of the first gantry support frame (101) first drives the first longitudinal displacement mechanism (103) so that the suction cup action mechanism (104) disposed in the first longitudinal displacement mechanism (103) is located above the material storage bin (105); S13: the first longitudinal displacement mechanism (103) drives the suction cup action mechanism (104) downward until the suction cup action mechanism (104) contacts a device located at the uppermost layer of the storage bin (105), and the suction cup action mechanism (104) absorbs the device; S14: After the first longitudinal displacement mechanism (103) drives the suction cup action mechanism (104) to move upward to a preset height, the first transverse displacement mechanism (102) drives the first longitudinal displacement mechanism (103) to move transversely until the suction cup action mechanism (104) is located above the device posture correction mechanism (2); S15: the first longitudinal displacement mechanism (103) drives the suction cup action mechanism (104) downward until the device adsorbed by the suction cup action mechanism (104) is located in the device posture correction mechanism (2), and the suction cup action mechanism (104) releases the device material; S16: The first longitudinal displacement mechanism (103) drives the suction cup action mechanism (104) to move upward and reset, and the first transverse displacement mechanism (104) drives the first longitudinal displacement mechanism (103) to reset.

3. A double-sided circuit board reflow soldering process according to claim 2, characterized in that: The steps of the device posture correction mechanism (2) correcting the device posture are as follows: S21: The suction cup action mechanism (104) releases the device material to be calibrated into the material loading fixture (202); S22: the material pushing correction cylinder (203) drives the material pushing moving block (204) forward, so that the material swinging correction cylinder (205) is pushed forward at the same time, until the material swinging execution part (206) connected to the material swinging correction cylinder (205) is driven to the side surface of the material to be calibrated against the edge of the device material to be calibrated, and continues to push the device material to be calibrated until one end of the device is completely in contact with the side edge of the inner cavity of the material carrier fixture (202); S23: the push material correction cylinder (203) drives the push material moving block (204) to retreat to a preset position, at which time the swing material correction cylinder (205) drives the swing material execution unit (206) to open, so that the inner wall spacing after the swing wheel execution unit (206) is opened corresponds to the preset width of the device; S24: the push material correction cylinder (203) then drives the push material moving block (204) to move forward to a preset position, so that the inner wall of the swing material execution part (206) is in contact with both sides of the device to be corrected, until the posture of the device to be corrected is corrected to within a preset threshold range; S25: The material pushing correction cylinder (203) drives the material pushing moving block (204) to drive the material swing correction cylinder (205) and the material swing execution part (206) to reset.

4. A double-sided circuit board reflow soldering process according to claim 3, characterized in that: The steps of the second device loading actuator (3) loading the device that has completed posture correction onto the corresponding circuit board material transported into the reflow soldering conveyor belt (4) are as follows: S31: The second lateral displacement mechanism (302) disposed on the side of the second gantry support frame (301) drives the second longitudinal displacement mechanism (303) so that the clamping actuator (304) connected to the second longitudinal displacement mechanism (303) is located above the material loading fixture (202); S32: the second longitudinal displacement mechanism (303) drives the clamping actuator (304) downward until the clamping actuator (304) can clamp the device material that has completed posture correction and is placed in the material carrier (202); S33: After the clamping actuator (304) clamps the device material, the second longitudinal displacement mechanism (303) drives the clamping actuator (304) to rise to a preset position; S34: the second lateral displacement mechanism (302) drives the second longitudinal displacement mechanism (303) to drive the clamping actuator (304) to move above the reflow soldering conveyor belt (4), and align the clamped device material onto the circuit board to be matched; S35: The second longitudinal displacement mechanism (303) drives the clamping actuator (304) to move downward to another preset position, and the clamping actuator (304) releases the device material onto the circuit board to be matched.

5. A double-sided circuit board reflow soldering process according to claim 4, characterized in that: The steps of the floating and pressing actuator (5) performing floating and pressing processing on the circuit board and the device materials located on the reflow soldering conveyor belt (4) are specifically as follows: S41: After the second device loading actuator (3) places the device material that has completed posture correction on the circuit board on the reflow soldering conveyor belt (4), the first floating height pressing actuator (502) and the second floating height pressing actuator (503) can be located just above and below the circuit board and the device material; S42: the first floating height pressing execution unit (502) moves to contact the device material to be pressed; S43: The second floating and pressing execution unit (503) moves to the bottom of the circuit board and cooperates with the first floating and pressing execution unit (502) to perform floating and pressing processing on the circuit board and the device materials at the upper and lower sides at the same time.

6. A double-sided circuit board reflow soldering process according to claim 5, characterized in that: The steps of the first floating height pressing execution unit (502) are as follows: The first pressing drive cylinder (502f) drives the telescopic guide rod (502d) downward, so that the telescopic guide rod (502d) pushes the first pressing movable frame (502b) downward along the guidance of the first pressing movable guide rail (502a). At this time, the first abutting portion (502c) arranged at the end of the first pressing movable frame (502b) can follow it downward until the first abutting portion (502c) is movably abutted against the circuit board or device material.

7. A double-sided circuit board reflow soldering process according to claim 6, characterized in that: The second floating and pressing execution unit (50) cooperates with the first floating and pressing execution unit (502) to execute the floating and pressing action, which is specifically as follows: S51: After the first abutting portion (502c) is movably abutted against the circuit board or device material, the second pressing driving cylinder (503g) drives the inclined sliding abutting portion (503f) to move forward, and at this time, the pulley structure (503e) slides from the lower position of the inclined sliding abutting portion (503f) to the higher position, so that the pulley structure (503e) pushes the second pressing movable frame (503b) to move upward along the limit of the second pressing movable guide rail (503a); S52: When the second pressing movable frame (503b) moves upward, it can drive the second abutting portion (503d) to move upward at the same time to move closer to the first abutting portion (502c), so that the circuit board and device materials located between the first abutting portion (502c) and the second abutting portion (503d) can be pressed and processed by both; S53: During the pressing action, the spring (502e) between the first pressing movable frame (502b) and the telescopic guide rod (502d) can be retracted to reduce the impact force, thereby preventing the circuit board and the device materials from being damaged by excessive impact force; S54: After the pressing process is completed, the second pressing drive cylinder (503g) drives the inclined sliding abutment part (503f) to reset. At this time, the pulley structure (503e) slides from the high point to the low point along the inclined sliding abutment part (503f), and the two reset springs (503c) connected to the two sides of the second pressing movable frame (503b) can pull the second pressing movable frame (503b) along the limit of the second pressing movable guide rail (503a) and reset downward; at this time, the second floating pressing execution part (50) cooperates with the first floating pressing execution part (502) to complete the processing of a floating pressing process.

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