Stacked package structure integrated with optical drive and preparation method thereof, and lamp panel

Abstract

The application provides a light drive integrated laminated packaging structure and a preparation method and a lamp panel thereof. The laminated packaging structure comprises a packaging carrier plate, an LED chip and a drive chip. The packaging carrier plate comprises a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer which are sequentially stacked. The LED chip is arranged on the side of the first metal layer away from the first insulating layer and is electrically connected to the third metal layer through the first metal layer. The drive chip is arranged on the side of the second metal layer away from the first insulating layer and is electrically connected to the third metal layer through the second metal layer. The third metal layer is used for electrical connection with a printed circuit board. The application can increase the number of partitions of the lamp panel, realize a more delicate picture effect, transfer the drive circuit to the packaging carrier plate, effectively reduce the plane wiring difficulty of the printed circuit board, improve the length difference of the drive circuit between the drive chip and the LED chip and improve the light output quality.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a light drive integrated laminated packaging structure and a preparation method thereof and a lamp panel. BACKGROUND

[0002] A light emitting diode (Light Emitting Diode, LED for short) is an electroluminescent semiconductor light-emitting device. Due to its low energy consumption, small size, long service life, good stability, fast response, and stable light-emitting wavelength, it has been widely used in lighting, display, medical treatment, optical communication and other fields.

[0003] Taking the display field as an example, the current display industry is developing towards high resolution, ultra-thin, high dynamic range imaging, high contrast and wide color gamut. Through the use of Mini LED chips and the Local Dimming technology, each sub-area in the lamp panel can be independently switched on or off or the brightness can be adjusted, and the bright and dark states of each sub-area can be precisely controlled, thereby making the bright and dark levels of the picture more distinct and improving the user's visual experience.

[0004] However, the applicant found in internal research that the Mini LED chip and the driving chip are currently independently arranged on the printed circuit board, and the driving lines connecting the Mini LED chip and the driving chip are also integrated in the printed circuit board. With the increase in the number of sub-areas, the planar wiring difficulty of the driving lines in the printed circuit board will be greatly increased, thereby causing problems such as reduction in production efficiency and yield of the printed circuit board, and increase in energy consumption caused by complex wiring. In addition, especially in large-size display devices, since the driving lines are integrated in the printed circuit board and the driving chip is connected to a large number of Mini LED chips at the same time, there is a problem that the length difference of the driving lines of at least two Mini LED chips connected to the same driving chip is large, thereby causing an IR Drop problem, which affects the overall light output effect of the lamp panel.

[0005] Therefore, how to effectively reduce the planar wiring difficulty of the printed circuit board while increasing the number of sub-areas of the lamp panel, and improve the length difference of the driving lines between the driving chip and the Mini LED chip, is a technical problem that needs to be solved by those skilled in the art. SUMMARY

[0006] The present application provides a light drive integrated laminated packaging structure and a preparation method thereof and a lamp panel, which can effectively solve the problem that it is difficult to reduce the planar wiring difficulty of the printed circuit board while increasing the number of sub-areas of the lamp panel, and improve the length difference of the driving lines between the driving chip and the Mini LED chip.

[0007] In a first aspect, the application provides a light drive integrated laminated packaging structure, comprising:

[0008] a packaging carrier, comprising a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer which are sequentially stacked;

[0009] an LED chip, disposed on a side of the first metal layer away from the first insulating layer, the LED chip being electrically connected to the third metal layer through the first metal layer;

[0010] a driving chip, disposed on a side of the second metal layer away from the first insulating layer, the driving chip being electrically connected to the third metal layer through the second metal layer;

[0011] wherein the third metal layer is configured to be electrically connected to a printed circuit board.

[0012] Optionally, the second insulating layer comprises a solid part and an opening, the solid part surrounding the opening, wherein the third metal layer is disposed on the solid part, the opening exposing the second metal layer, and the driving chip is embedded in the opening and fixedly and electrically connected to the second metal layer.

[0013] Optionally, a vertical projection of the LED chip on the packaging carrier is located within a vertical projection of the driving chip on the packaging carrier.

[0014] Optionally, the laminated packaging structure further comprises an adhesive, the adhesive being filled between the driving chip and a sidewall of the opening.

[0015] Optionally, a thickness of the second insulating layer is greater than a thickness of the first insulating layer, and the thickness of the second insulating layer is greater than a sum of thicknesses of the second metal layer and the driving chip.

[0016] Optionally, the laminated packaging structure further comprises a spacer layer, the spacer layer being disposed on a side of the driving chip away from the second metal layer, wherein a surface of the spacer layer away from the driving chip is flush with a surface of the third metal layer away from the second insulating layer.

[0017] Optionally, the spacer layer is in contact with the printed circuit board, and a material of the spacer layer comprises metal or ceramic.

[0018] Optionally, the first insulating layer and the second insulating layer are made of different materials.

[0019] In a second aspect, the application provides a preparation method of an optical drive integrated laminated packaging structure, which comprises the following steps:

[0020] A packaging board is provided, wherein the packaging board comprises a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer which are sequentially stacked, the second insulating layer comprises a solid part and an opening, the solid part surrounds the opening, the third metal layer is arranged on the solid part, and the opening exposes the second metal layer;

[0021] A driving chip is embedded in the opening and electrically connected with the second metal layer;

[0022] An adhesive is filled in the gap between the driving chip and the sidewall of the opening, and the adhesive is solidified;

[0023] An LED chip is arranged on the side of the packaging board away from the driving chip and electrically connected with the first metal layer, wherein the vertical projection of the LED chip on the packaging board is located in the vertical projection of the driving chip on the packaging board.

[0024] In a third aspect, the application provides a lamp panel, which comprises a printed circuit board and at least one optical drive integrated laminated packaging structure as described above, wherein the laminated packaging structure is electrically connected with the printed circuit board.

[0025] The application has the following beneficial effects:

[0026] The application can integrate the LED chip, the driving chip and the packaging board with a multi-layer structure into an independent laminated packaging structure, thereby reducing the planar size thereof on the printed circuit board, facilitating the improvement of the layout density of the LED chip, and further improving the number of partitions of the lamp panel to achieve a more delicate picture effect. Moreover, the application can transfer the driving circuit to the packaging board without affecting the connection stability of the LED chip, the driving chip and the printed circuit board, thereby effectively reducing the planar wiring difficulty of the printed circuit board, further improving the production efficiency and yield of the printed circuit board, improving the problem of rising energy consumption caused by complex wiring, standardizing the driving circuit path between the driving chip and the LED chip, and further improving the length difference of the driving circuit between the driving chip and the MiniLED chip, improving the resistance-capacitance delay problem, and improving the overall light output effect of the lamp panel. BRIEF DESCRIPTION OF DRAWINGS

[0027] The technical solutions and other beneficial effects of the application will become apparent from the following detailed description of the specific embodiments of the application, combined with the accompanying drawings.

[0028] Figure 1 A film layer structure schematic diagram of a light drive integrated stack package structure provided by some embodiments of the present application.

[0029] Figure 2 A top view schematic diagram of a package substrate provided by some embodiments of the present application.

[0030] Figure 3 A top view schematic diagram of another package substrate provided by some embodiments of the present application.

[0031] Figure 4 A top view schematic diagram of still another package substrate provided by some embodiments of the present application.

[0032] Figure 5 A film layer structure schematic diagram of another stack package structure provided by some embodiments of the present application.

[0033] Figure 6 A film layer structure schematic diagram of still another stack package structure provided by some embodiments of the present application.

[0034] Figure 7 A preparation method flowchart schematic diagram of a light drive integrated stack package structure provided by some embodiments of the present application.

[0035] Figure 8 A film layer structure schematic diagram of a lamp panel provided by some embodiments of the present application.

[0036] Explanation of reference signs:

[0037] Stack package structure 100; package substrate 10; first metal layer 11; first metal circuit pad 111; first type first metal circuit pad 111-1; second type first metal circuit pad 111-2; first via pad 112; first insulating layer 12; second metal layer 13; second insulating layer 14; solid part 141; opening 142; third metal layer 15; LED chip 20; driving chip 30; adhesive 40; spacer layer 50; encapsulation layer 60; white wall glue layer 70; printed circuit board 200. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0039] The terms "first", "second", etc., are used only for the purpose of description and are not to be interpreted as indicating or implying relative importance or a required sequence of features. Thus, features defined with "first", "second" can include one or more of the features explicitly mentioned or implicitly suggested. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0040] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be interpreted broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0041] The following disclosure provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples. Such repetition is for the purpose of simplification and clarity, and in itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0042] Figure 1 The film layer structure schematic diagram of the optical drive integrated laminated packaging structure provided for some embodiments of the present application is shown in the following figure. Referring to Figure 1 As shown in the figure, the present application provides an optical drive integrated laminated packaging structure 100, which comprises a packaging carrier plate 10, an LED chip 20 and a driving chip 30. The packaging carrier plate 10 comprises a first metal layer 11, a first insulating layer 12, a second metal layer 13, a second insulating layer 14 and a third metal layer 15 which are sequentially stacked. The LED chip 20 is arranged on the side of the first metal layer 11 away from the first insulating layer 12, and the LED chip 20 is electrically connected with the third metal layer 15 through the first metal layer 11. The driving chip 30 is arranged on the side of the second metal layer 13 away from the first insulating layer 12, and the driving chip 30 is electrically connected with the third metal layer 15 through the second metal layer 13. The third metal layer 15 is used for electrical connection with a printed circuit board 200 (English full name: Printed Circuit Board; abbreviation: PCB).

[0043] The LED chip 20, the driving chip 30 and the packaging carrier 10 with the multi-layer structure are integrated into a separate laminated packaging structure 100, so as to reduce the planar size of the laminated packaging structure 100 on the printed circuit board 200, facilitate the improvement of the layout density of the LED chip 20, and further help to improve the number of sub-regions of the lamp panel, so as to realize a more delicate picture effect. Moreover, the driving circuit can be transferred to the packaging carrier 10 without affecting the connection stability of the LED chip 20, the driving chip 30 and the printed circuit board 200, so as to simplify the film layer structure of the printed circuit board 200 with a large planar area (which can be simplified to a single wiring layer), thereby effectively reducing the planar wiring difficulty of the printed circuit board 200, further improving the production efficiency and yield of the printed circuit board 200, improving the problem of increased energy consumption caused by complex wiring, standardizing the driving circuit path between the driving chip 30 and the LED chip 20, shortening the signal transmission distance between the driving chip 30 and the LED chip 20, and further improving the length difference of the driving circuit between the driving chip 30 and the Mini LED chip 20, improving the resistance-capacitance delay problem, reducing the response time difference, and improving the overall light output effect and uniformity of the lamp panel using the laminated packaging structure.

[0044] In some embodiments of the present application, the second insulating layer 14 includes a solid portion 141 and an opening 142, the solid portion 141 surrounds the opening 142, the third metal layer 15 is arranged on the solid portion 141, the opening 142 exposes the second metal layer 13, and the driving chip 30 is embedded in the opening 142 and fixedly and electrically connected to the second metal layer 13.

[0045] In the laminated packaging structure 100 provided by the embodiments of the present application, the second metal layer 13, the second insulating layer 14 and the third metal layer 15 are arranged on the side of the first insulating layer 12 away from the LED chip 20, and the printed circuit board 200 and the driving chip 30 are also arranged on the side of the first insulating layer 12 away from the LED chip 20. Therefore, the applicant needs to consider how to realize the electrical connection between the driving chip 30 and the second metal layer 13, the electrical connection between the printed circuit board 200 and the third metal layer 15, while excluding the interference of the second insulating layer 14 on the electrical connection between the driving chip 30 and the second metal layer 13, and eliminating the structural interference between the printed circuit board 200 and the driving chip 30.

[0046] The applicant further finds that the third metal layer 15 is used for electrical connection with the printed circuit board 200, that is, as long as the metal pattern of the third metal layer 15 is electrically connected with the connecting point on the printed circuit board 200. Therefore, the position of the metal pattern in the third metal layer 15 can be designed, and the position of the connecting point on the printed circuit board 200 can be matched and designed, that is, no metal pattern of the third metal layer 15 is arranged in the specific area capable of accommodating the driving chip 30, and then, the second insulating layer 14 can be designed to have the entity part 141 capable of bearing the metal pattern of the third metal layer 15 and the opening 142 capable of exposing the second metal layer 13 and having an area larger than the driving chip 30, so that the driving chip 30 can be embedded in the opening 142 and electrically connected with the second metal layer 13.

[0047] In the laminated packaging structure 100 provided by the embodiment of the present application, the above arrangement can fully utilize the space in the multi-layer structure of the packaging board 10, realize the electrical connection between the driving chip 30 and the inner metal layer (i.e., the second metal layer 13) in the packaging board 10, and does not affect the electrical connection between the packaging board 10 and the printed circuit board 200, nor cause the interference between the printed circuit board 200 and the driving chip 30. In addition, since the driving chip 30 can be embedded in the opening 142, the positioning accuracy, structural stability and assembly efficiency of the driving chip 30 can be improved.

[0048] In some embodiments of the present application, the vertical projection of the LED chip 20 on the packaging board 10 is located in the vertical projection of the driving chip 30 on the packaging board 10.

[0049] The vertical projection of the LED chip 20 on the packaging carrier 10 is located in the vertical projection of the driving chip 30 on the packaging carrier 10, that is, the planar area of the LED chip 20 is smaller than the planar area of the driving chip 30. It should be noted that the planar area of the LED chip 20 here refers to the planar area of all the LED chips 20 in the laminated packaging structure 100, that is, the laminated packaging structure 100 includes at least one LED chip 20. The significance of this design is that when the LED chip 20 is fixed on the packaging carrier 10, the packaging carrier 10 will bear a certain pressure, and because the second insulating layer 14 has an opening 142, it is easy to cause the packaging carrier 10 to have a problem of reduced pressure-bearing capacity and poor flatness in the area corresponding to the LED chip 20, which may affect the optical effect of the laminated packaging structure 100. By covering the vertical projection of the LED chip 20 on the packaging carrier 10 with the vertical projection of the driving chip 30 on the packaging carrier 10, the driving chip 30 can be used to reinforce the structure of the area where the LED chip 20 is located, improve the stability of the overall structure, and thus improve the optical effect of the laminated packaging structure 100.

[0050] In some embodiments of the present application, the laminated packaging structure 100 further includes an adhesive 40, which is filled between the driving chip 30 and the side wall of the opening 142.

[0051] In the laminated packaging structure 100 provided by the embodiments of the present application, the driving chip 30 fixed on the surface of the side of the second metal layer 13 away from the first insulating layer 12 can reinforce the structure of the area where the LED chip 20 is located to a certain extent, but when there is a gap between the driving chip 30 and the side wall of the opening 142, the packaging carrier 10 may still be warped to a certain extent because the driving chip 30 is not connected to the entity part 141 of the second insulating layer 14. To improve this problem, the present application further provides an adhesive 40 in the gap between the driving chip 30 and the side wall of the opening 142, and the driving chip 30 and the second insulating layer 14 are combined into one whole by the adhesive 40, thereby further improving the deformation resistance of the packaging carrier 10 in the area corresponding to the LED chip 20.

[0052] In some embodiments of the present application, the adhesive 40 is silicone.

[0053] The silicon gel can not only tightly combine the driving chip 30 and the sidewall of the opening 142 (i.e., the solid part 141), but also seal the driving chip 30 in the opening 142, thereby reducing the risk of water and oxygen invasion at the joint between the pad of the driving chip 30 and the pad of the second metal layer 13.

[0054] In some embodiments of the present application, the adhesive 40 is a light-cured adhesive layer.

[0055] In some embodiments of the present application, the thickness of the second insulating layer 14 is greater than the thickness of the first insulating layer 12, and the thickness of the second insulating layer 14 is greater than the sum of the thicknesses of the second metal layer 13 and the driving chip 30.

[0056] In the laminated packaging structure 100 provided by the embodiments of the present application, the first insulating layer 12 can serve as an electrical isolation between part of the first metal layer 11 and part of the second metal layer 13, and thus the first insulating layer 12 has a certain thickness, for example, the first insulating layer 12 has a reference insulating thickness. However, the second insulating layer 14 not only needs to serve as an electrical isolation between part of the second metal layer 13 and part of the third metal layer 15, but also needs to accommodate the driving chip 30 to avoid structural interference between the driving chip 30 and the driving circuit board, and thus the second insulating layer 14 needs to be thickened to have a thickness greater than the reference insulating thickness. Further, since the pad of the driving chip 30 needs to be welded to the pad of the second metal layer 13, thickening may occur at the joint, but the increased thickness will not exceed the thickness of a single metal layer (such as the third metal layer 15), and thus the thickness of the second insulating layer 14 needs to be greater than the sum of the thicknesses of the second metal layer 13 and the driving chip 30, so that the thickening design allowance of the joint is greater than the thickness of the third metal layer 15, avoiding the structural interference problem between the driving chip 30 and the printed circuit board 200 caused by the outward protrusion of the surface of the side of the driving chip 30 away from the second metal layer 13, and facilitating the improvement of the combination stability of the laminated packaging structure 100 and the driving circuit board.

[0057] In some embodiments of the present application, the laminated packaging structure 100 further comprises a gasket layer 50 disposed on the side of the driving chip 30 away from the second metal layer 13, wherein the surface of the side of the gasket layer 50 away from the driving chip 30 is flush with the surface of the side of the third metal layer 15 away from the second insulating layer 14.

[0058] In the laminated packaging structure 100 provided by the embodiments of the present application, in order to avoid the structural interference problem of the driving chip 30 and the printed circuit board 200 caused by the outward protrusion of the surface of the side of the driving chip 30 away from the second metal layer 13, the thickness of the second insulating layer 14 needs to be greater than the sum of the thicknesses of the second metal layer 13 and the driving chip 30. However, this kind of structural arrangement may cause a small gap between the surface of the side of the driving chip 30 away from the second metal layer 13 and the printed circuit board 200. During the assembly and use of the lamp panel, the laminated packaging structure 100 may collapse at the small gap, thereby affecting the optical effect of the lamp panel. By arranging the spacer layer 50, the surface of the side of the spacer layer 50 away from the driving chip 30 is flush with the surface of the side of the third metal layer 15 away from the second insulating layer 14, which can effectively improve the above problem and improve the stability and optical effect of the laminated packaging structure 100.

[0059] In some embodiments of the present application, the spacer layer 50 is in contact with the printed circuit board 200, and the material of the spacer layer 50 includes metal or ceramic.

[0060] In the laminated packaging structure 100 provided by the embodiments of the present application, the applicant found in internal research that, since the driving chip 30 generates heat during driving the LED chip 20, and the driving chip 30 is embedded in the opening 142, it is difficult for the heat to be conducted to the outside, thereby easily causing the problem of overheat failure of the driving chip 30 caused by long-time use of the laminated packaging structure 100. By making the material of the spacer layer 50 include a material with excellent heat dissipation performance such as metal or ceramic, on the one hand, the spacer layer 50 can be used to fill the gap between the driving chip 30 and the printed circuit board 200, thereby supporting the driving chip 30 and improving the support strength of the packaging carrier 10 in the area of the LED chip 20; on the other hand, the heat in the driving chip 30 can be conducted to the outside through the printed circuit board 200 in contact with the spacer layer 50, thereby reducing the risk of overheat failure of the driving chip 30.

[0061] In some embodiments of the present application, the side of the driving chip 30 away from the second metal layer 13 can be arranged without a functional layer or with a functional layer. The functional layer can be the spacer layer 50 or other film layers, but the functional layer is not connected to any one of the second insulating layer 14, the adhesive 40, and the third metal layer 15.

[0062] The laminated packaging structure 100 provided by the embodiments of the present application has the following advantages: the side of the driving chip 30 away from the second metal layer 13 is not provided with a functional layer, or the functional layer is not connected with any one of the second insulating layer 14, the adhesive 40 and the third metal layer 15, so that when the driving chip 30 is found to have an electrical abnormality after the driving chip 30 is combined with the packaging substrate 10, the driving chip 30 can be easily removed and replaced, and the disassembly and repair efficiency is improved.

[0063] In some embodiments of the present application, the material of the first insulating layer 12 and the second insulating layer 14 is the same in the packaging substrate 10. Optionally, the material of the first insulating layer 12 is resin, and the material of the second insulating layer 14 is resin. In the process of preparing the packaging substrate 10, the assembly composed of the second insulating layer 14 and the third metal layer 15 can be fixed on another assembly composed of the first metal layer 11, the first insulating layer 12 and the second metal layer 13 by a molding process, so as to form the packaging substrate 10 with an integrated structure.

[0064] In some embodiments of the present application, the material of the first insulating layer 12 and the second insulating layer 14 is different in the packaging substrate 10, and the heat conduction efficiency of the first insulating layer 12 is greater than that of the second insulating layer 14. Optionally, the material of the first insulating layer 12 is ceramic, and the material of the second insulating layer 14 is resin or other organic material. In the process of preparing the packaging substrate 10, the assembly composed of the second insulating layer 14 and the third metal layer 15 can be fixed on another assembly composed of the first metal layer 11, the first insulating layer 12 and the second metal layer 13 by a molding process, so as to form the packaging substrate 10 with an integrated structure.

[0065] In the laminated packaging structure 100 provided by the embodiments of the present application, the first insulating layer 12 as the basic bearing film layer of the packaging substrate 10 for bearing the LED chip 20 is made of ceramic, so that the deformation resistance of the first insulating layer 12 can be greatly improved, the pressure bearing capacity of the packaging substrate 10 in the region corresponding to the LED chip 20 can be improved, the stability of the overall structure can be improved, and the optical effect of the laminated packaging structure 100 can be improved.

[0066] In some embodiments of the present application, the material of the first insulating layer 12 and the second insulating layer 14 in the packaging substrate 10 is different, and the heat conduction efficiency of the second insulating layer 14 is greater than that of the first insulating layer 12. Optionally, the material of the second insulating layer 14 is ceramic, and the material of the first insulating layer 12 is resin. In the process of preparing the packaging substrate 10, the assembly composed of the first metal layer 11, the first insulating layer 12 and the second metal layer 13 can be fixed on another assembly composed of the second insulating layer 14 and the third metal layer 15 by plastic packaging process, so as to form an integrated packaging substrate 10.

[0067] In the laminated packaging structure 100 provided by the embodiments of the present application, since the material of the second insulating layer 14 in the packaging substrate 10 is ceramic, the heat energy in the driving chip 30 can be more efficiently conducted through the second insulating layer 14 with excellent heat dissipation efficiency around the side of the driving chip 30, and then conducted to the outside through the printed circuit board 200.

[0068] Figure 2 The top view schematic diagram of the packaging substrate provided by some embodiments of the present application is shown in FIG. 1. Referring to FIG. 1, in some embodiments of the present application, the number of LED chips 20 in the laminated packaging structure 100 is one. Optionally, the type of the LED chip 20 is LED blue light chip. Figure 2

[0069] In some embodiments of the present application, Figure 1 The film layer structure of the laminated packaging structure 100 shown in the schematic diagram can be understood as a cross-sectional schematic diagram cut along the AB line in FIG. 1, in combination with FIG. 2 and FIG. 3. Figure 2 Figure 1 Figure 2 As shown in FIG. 2 and FIG. 3, the first metal layer 11 includes a plurality of first metal line pads 111 and a plurality of first via pads 112, and the first metal line pads 111 are used for welding and fixing the LED chip 20, wherein each of the first metal line pads 111 is electrically connected to one of the first via pads 112 arranged around the side of the metal line pad. For example, the plurality of first metal line pads 111 includes a first type first metal line pad 111-1 and a second type first metal line pad 111-2, and the number of the first via pads 112 on one side is less than that on the opposite side.

[0070] ​​​In some embodiments of this application, the second metal layer 13 includes a plurality of second metal line pads (not shown in the figure) and a plurality of second via pads (not shown in the figure). The second metal line pads are used to solder and fix the driver chip 30. The number of second via pads is the same as the number of first via pads 112 and they are correspondingly set. The number of second metal line pads is one less than the number of second via pads. Each second metal line pad is electrically connected to one second via pad. The second via pads electrically connected to the second metal line pads do not correspond to the first via pads 112 electrically connected to the first metal line pads 111-1 of the first type. In other words, the second via pads corresponding to the first via pads 112 electrically connected to the first metal line pads 111-1 of the first type are not electrically connected to the second metal line pads.

[0071] In some embodiments of this application, the third metal layer 15 includes a plurality of third through-hole pads, the number of which is the same as the number of the second through-hole pads, and they are correspondingly arranged.

[0072] Figure 3 This is a top view schematic diagram of another packaging carrier provided for some embodiments of this application. (Refer to...) Figure 3 As shown, in some embodiments of this application, the number of LED chips 20 in the stacked packaging structure 100 can be multiple. Optionally, the stacked packaging structure 100 includes multiple LED chips 20, which are respectively LED red light chips, LED green light chips, and LED blue light chips, that is, each stacked packaging structure 100 includes an RGB LED chip group.

[0073] Continue to refer to Figure 3 As shown, the first metal layer 11 includes a plurality of first metal line pads 111 and a plurality of first through-hole pads 112. The first metal line pads 111 are used for soldering and fixing the LED chip 20. Each first metal line pad 111 is electrically connected to one of the first through-hole pads 112 disposed around the periphery of the metal line pad. Figure 2 In contrast, the plurality of first metal line pads 111 include one first type first metal line pad 111-1 and three second type first metal line pads 111-2.

[0074] Figure 4 This is a top view schematic diagram of another packaging carrier provided for some embodiments of this application. (Refer to...) Figure 4As shown, in some embodiments of the present application, the number of LED chips 20 in the stacked packaging structure 100 can be multiple. Optionally, the stacked packaging structure 100 includes multiple LED chips 20, which are respectively LED red light chips, LED green light chips, LED blue light chips and LED white light chips, i.e., each of the stacked packaging structure 100 includes an RGBW LED chip group.

[0075] Continuing to refer to Figure 4 As shown, the first metal layer 11 includes multiple first metal line pads 111 and multiple first via pads 112, the first metal line pads 111 are used for welding and fixing the LED chips 20, wherein each of the first metal line pads 111 is electrically connected with one of the first via pads 112 arranged on the side of the metal line pad, and Figure 2 、 Figure 3 The difference is that the multiple first metal line pads 111 include one first type first metal line pad 111-1 and four second type first metal line pads 111-2.

[0076] In some embodiments of the present application, the driving chip 30 is a four-channel control chip, which can control the on-off and size of the four channels independently under the control of a programming language to adapt to the case that the LED chips 20 are one or more. The communication protocol applicable to the driving chip 30 can be a Serial Parallel Broadcast protocol (abbreviated as: SPB protocol), and the number of signal output channels thereof can be 4 channels or 8 channels.

[0077] In some embodiments of the present application, the driving chip 30 can be a chip that has completed a pre-packaging process, wherein the packaging form adopted by the driving chip 30 can be a chip scale package (English full name: Chip Size Package, or Chip Scale Package; abbreviated as: CSP). The bonding process of the pads of the driving chip 30 and the pads in the second metal layer 13 can be BGA ball planting.

[0078] Continuing to refer to Figure 1 As shown, in some embodiments of the present application, the stacked packaging structure 100 further includes a packaging layer 60, and the packaging layer 60 covers the LED chips 20, wherein the packaging layer 60 has one top light-out surface and four side light-out surfaces. Optionally, the packaging layer 60 is a transparent packaging glue layer or a fluorescent packaging glue layer.

[0079] Figure 5 Another schematic diagram of the film layer structure of the stacked packaging structure provided by some embodiments of the present application. Referring to Figure 5As shown, the LED chip 20 is electrically connected to the driving chip 30 through the driving circuit, and the driving circuit is integrated in the packaging substrate 10. Figure 2 Different from the stacked packaging structure 100 shown, in some embodiments of the present application, the stacked packaging structure 100 further comprises a white wall glue layer 70 disposed on the ejection light surface of the packaging layer 60 to suppress the front light emission and increase the light emission angle of the stacked packaging structure 100.

[0080] Continuing to refer to Figure 5 As shown, in some embodiments of the present application, the packaging glue layer 60 is a transparent packaging glue layer.

[0081] Figure 6 Another film layer structure schematic diagram of a stacked packaging structure provided for some embodiments of the present application is shown. Referring to Figure 6 As shown, the LED chip 20 is electrically connected to the driving chip 30 through the driving circuit, and the driving circuit is integrated in the packaging substrate 10. Figure 2 Different from the stacked packaging structure 100 shown, in some embodiments of the present application, the packaging layer 60 covers the LED chip 20, wherein the light emission surface of the packaging layer 60 is a curved surface to form a hemispherical lens and increase the front light emission angle of the stacked packaging structure 100.

[0082] In some embodiments of the present application, the surface of the packaging layer 60 is provided with a texture or a microstructure to improve the light emission efficiency or enhance the light emission uniformity.

[0083] Continuing to refer to Figure 6 As shown, in some embodiments of the present application, the packaging glue layer 60 is a transparent packaging glue layer.

[0084] In some embodiments of the present application, the printed circuit board 200 is a single-sided PCB aluminum substrate. Specifically, the single-sided PCB aluminum substrate comprises an aluminum substrate layer, an electrically insulating layer and a conductive layer which are sequentially stacked, and the pads in the conductive layer are electrically connected to the pads in the third metal layer 15.

[0085] In the stacked packaging structure 100 provided by the embodiments of the present application, since the driving circuit electrically connecting the LED chip 20 and the driving chip 30 is integrated in the packaging substrate 10, the structure of the printed circuit board 200 can be simplified, and it is possible to use a single-sided PCB aluminum substrate with a lower cost and a higher yield in a Mini LED lamp panel with a large number of partitions.

[0086] In some embodiments of the present application, the LED chip 20 can be a Mini LED chip, which refers to an LED chip with a long side size of 50 microns to 300 microns.

[0087] Figure 7 A preparation method flowchart of a stacked packaging structure with a light driver is provided for some embodiments of the present application. Combined withFigure 1 to Figure 7 In the second aspect, the embodiments of the present application provide a preparation method of the optical drive integrated stacked packaging structure 100, which comprises steps S01, S02, S03 and S04.

[0088] The step S01 comprises providing a packaging carrier 10, wherein the packaging carrier 10 comprises a first metal layer 11, a first insulating layer 12, a second metal layer 13, a second insulating layer 14 and a third metal layer 15 which are sequentially stacked, the second insulating layer 14 comprises a solid part 141 and an opening 142, the solid part 141 surrounds the opening 142, the third metal layer 15 is arranged on the solid part 141, and the opening 142 exposes the second metal layer 13.

[0089] The step S02 comprises embedding a driving chip 30 in the opening 142 and electrically connecting the driving chip 30 with the second metal layer 13.

[0090] The step S03 comprises filling an adhesive 40 in the gap between the driving chip 30 and the sidewall of the opening 142 and solidifying the adhesive 40.

[0091] The step S04 comprises arranging an LED chip 20 on the side of the packaging carrier 10 away from the driving chip 30 and electrically connecting the LED chip 20 with the first metal layer 11, wherein the vertical projection of the LED chip 20 on the packaging carrier 10 is located in the vertical projection of the driving chip 30 on the packaging carrier 10.

[0092] The preparation method provided by the embodiment of the present application forms the stacked package structure 100, the LED chip 20, the driving chip 30 and the packaging carrier plate 10 with a multi-layer structure are integrated into a separate stacked package structure 100, thereby reducing the planar size of the stacked package structure 100 on the printed circuit board 200, facilitating the improvement of the layout density of the LED chip 20, thereby improving the number of partitions of the lamp panel, realizing a more delicate picture effect, and transferring the driving circuit to the packaging carrier plate 10 without affecting the connection stability of the LED chip 20, the driving chip 30 and the printed circuit board 200, simplifying the film layer structure of the printed circuit board 200 with a larger planar area (which can be simplified to a single wiring layer), thereby effectively reducing the planar wiring difficulty of the printed circuit board 200, thereby improving the production efficiency and yield of the printed circuit board 200, improving the problem of rising energy consumption caused by complex wiring, standardizing the driving circuit path between the driving chip 30 and the LED chip 20, shortening the signal transmission distance between the driving chip 30 and the LED chip 20, thereby improving the length difference of the driving circuit between the driving chip 30 and the Mini LED chip 20, improving the resistance-capacitance delay problem, reducing the response time difference, and improving the overall light output effect of the lamp panel.

[0093] In addition, in the preparation method described above, the driving chip 30 is first embedded in the opening 142 and electrically connected to the second metal layer 13, and then the driving chip 30 and the second insulating layer 14 are combined into a whole through the adhesive 40, which greatly improves the support strength of the packaging carrier plate 10 in the opening 142 area, thereby avoiding the problem of reducing the flatness of the packaging carrier plate 10 in the area where the LED chip 20 is located in the subsequent step of arranging the LED chip 20 on the packaging carrier plate 10, effectively improving the assembly yield and ensuring the stability and optical effect of the subsequent stacked package structure 100.

[0094] In some embodiments of the present application, after the step of filling the adhesive 40 in the gap between the driving chip 30 and the sidewall of the opening 142 and curing the adhesive 40 in step S03, the method further comprises: arranging a gasket layer 50 on the side of the driving chip 30 away from the second metal layer 13, wherein the surface of the side of the gasket layer 50 away from the driving chip 30 is flush with the surface of the side of the third metal layer 15 away from the second insulating layer 14.

[0095] In the preparation method of the light drive integrated laminated packaging structure 100 provided by the embodiments of the present application, by arranging the gasket layer 50 and making the surface of the side of the gasket layer 50, which is away from the driving chip 30, flush with the surface of the side of the third metal layer 15, which is away from the second insulating layer 14, the problem of the decline of the flatness of the packaging board 10 caused by the gap between the surface of the side of the driving chip 30, which is away from the second insulating layer 14, and the surface of the packaging board 10 during the preparation process, and the insufficient support strength of the opening 142 area, can be effectively improved, and the stability and optical effect of the laminated packaging structure 100 can be improved.

[0096] In some embodiments of the present application, the preparation method of the light drive integrated laminated packaging structure 100 further includes step S05, which includes: arranging a packaging layer 60 on the side of the packaging board 10, which is away from the driving chip 30, and the packaging layer 60 covers the LED chip 20.

[0097] In some embodiments of the present application, after the step S05 is completed, the prepared laminated packaging structure 100 can be arranged on a printed circuit board 200, and the third metal layer 15 can be electrically connected with the printed circuit board 200.

[0098] Figure 8 A film layer structure diagram of a lamp plate provided by some embodiments of the present application is shown in FIG. 3. Figure 8 As shown in FIG. 3, in a third aspect, the present application provides a lamp plate, which includes a printed circuit board 200 and at least one light drive integrated laminated packaging structure 100 described above, wherein the laminated packaging structure 100 is electrically connected with the printed circuit board 200. Specifically, the laminated packaging structure 100 is electrically connected with the printed circuit board 200 through the packaging board 10.

[0099] In summary, the application provides a light drive integrated laminated packaging structure, a preparation method thereof and a lamp panel. The laminated packaging structure comprises a packaging carrier, an LED chip and a drive chip. The packaging carrier comprises a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer which are sequentially stacked. The LED chip is arranged on a side of the first metal layer away from the first insulating layer, and the LED chip is electrically connected to the third metal layer through the first metal layer. The drive chip is arranged on a side of the second metal layer away from the first insulating layer, and the drive chip is electrically connected to the third metal layer through the second metal layer. The third metal layer is used to be electrically connected to a printed circuit board. The application can integrate the LED chip, the drive chip and the packaging carrier with a multi-layer structure into an independent laminated packaging structure, thereby reducing the planar size thereof on the printed circuit board, improving the layout density of the LED chip, and further improving the number of partitions of the lamp panel to achieve a more delicate picture effect. Moreover, the application can transfer the drive circuit to the packaging carrier without affecting the connection stability of the LED chip, the drive chip and the printed circuit board, thereby effectively reducing the planar wiring difficulty of the printed circuit board, further improving the production efficiency and yield of the printed circuit board, improving the problem of rising energy consumption caused by complex wiring, standardizing the drive circuit path between the drive chip and the LED chip, further improving the length difference of the drive circuit between the drive chip and the Mini LED chip, improving the resistance-capacitance delay problem, and improving the overall light output effect of the lamp panel.

[0100] The above provides a detailed introduction to the light drive integrated laminated packaging structure, the preparation method thereof and the lamp panel provided by the application. The principles and implementation manners of the application are described by applying specific examples. The above description of the embodiments is only used to help understand the method of the application and its core idea. Meanwhile, according to the idea of the application, the specific implementation manner and application range will be changed by those skilled in the art. In summary, the content of the specification should not be understood as a limitation of the application.

Claims

1. An optical drive integrated stacked package structure, characterized by, The laminated packaging structure comprises: a packaging carrier, comprising a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer which are sequentially stacked; an LED chip, disposed on a side of the first metal layer away from the first insulating layer, the LED chip being electrically connected to the third metal layer through the first metal layer; a driving chip, disposed on a side of the second metal layer away from the first insulating layer, the driving chip being electrically connected to the third metal layer through the second metal layer; wherein the third metal layer is configured to be electrically connected to a printed circuit board; wherein the second insulating layer comprises a solid portion and an opening, the solid portion surrounding the opening, wherein the third metal layer is disposed on the solid portion, the opening exposing the second metal layer, and the driving chip is embedded in the opening and fixedly and electrically connected to the second metal layer, and a vertical projection of the packaging carrier is located within a vertical projection of the driving chip on the packaging carrier.

2. The stacked package structure of claim 1, wherein, The laminated packaging structure further comprises an adhesive, which is filled between the driving chip and a side wall of the opening.

3. The stacked package structure of claim 1, wherein, The thickness of the second insulating layer is greater than the thickness of the first insulating layer, and the thickness of the second insulating layer is greater than the sum of the thicknesses of the second metal layer and the driving chip.

4. The stacked package structure of claim 3, wherein, The laminated packaging structure further comprises a gasket layer, disposed on a side of the driving chip away from the second metal layer, wherein a surface of the gasket layer away from the driving chip is flush with a surface of the third metal layer away from the second insulating layer.

5. The stacked package structure of claim 4, wherein, The gasket layer is in contact with the printed circuit board, and the material of the gasket layer comprises metal or ceramic.

6. The stacked package structure of claim 1, wherein, The materials of the first insulating layer and the second insulating layer are different.

7. A method for manufacturing an optical drive integrated stacked package structure, characterized by, The method for manufacturing the light-driving integrated laminated packaging structure comprises the following steps: providing a packaging carrier, wherein the packaging carrier comprises a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer which are sequentially stacked, the second insulating layer comprises a solid portion and an opening, the solid portion surrounds the opening, and the third metal layer is disposed on the solid portion, and the opening exposes the second metal layer; embedding a driving chip in the opening and electrically connecting the driving chip to the second metal layer; filling an adhesive in a gap between the driving chip and a side wall of the opening and solidifying the adhesive; disposing an LED chip on a side of the packaging carrier away from the driving chip and electrically connecting the LED chip to the first metal layer, wherein a vertical projection of the LED chip on the packaging carrier is located within a vertical projection of the driving chip on the packaging carrier.

8. A light panel characterized by The lamp panel comprises a printed circuit board and at least one light-driving integrated laminated packaging structure according to any one of claims 1-6, wherein the laminated packaging structure is electrically connected to the printed circuit board.

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