Heat dissipation substrate and vapor chamber

Abstract

The heat dissipation substrate includes a housing having an internal space and a sealing body sealing the internal space. Moreover, the shell is provided with an inner bottom surface and a through hole connected with the inner space, the sealing body is provided with a first part located in the inner space and a second part located in the through hole, the first part is in contact with the inner bottom surface, and in the longitudinal section, the maximum width of the first part is larger than the minimum width of the through hole.

Description

Technical Field

[0001] The present disclosure relates to a heat dissipation substrate and a vapor chamber. Background Art

[0002] International Publication No. 2008 / 012960 discloses a heat pipe in which a refrigerant injection hole and an air discharge hole are sealed by a copper-based metal sealing member. Summary of the invention

[0003] Means used to solve problems

[0004] The heat dissipation substrate involved in the present disclosure has:

[0005] a housing having an interior space; and

[0006] a sealing body, sealing the internal space,

[0007] The shell has an inner bottom surface and a through hole connected to the internal space,

[0008] The sealing body has a first portion located in the internal space and a second portion located in the through hole,

[0009] The first portion is in contact with the inner bottom surface,

[0010] In the longitudinal section, the maximum width of the first portion is greater than the minimum width of the through hole.

[0011] The heat sink involved in the present disclosure has:

[0012] The heat dissipation substrate; and

[0013] A liquid phase fluid is located in the inner space. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1A It is a longitudinal sectional view showing the heat dissipation substrate and the heat spreader according to the first embodiment of the present disclosure.

[0015] Figure 1B It is a longitudinal sectional view showing the heat dissipation substrate and the heat spreader according to the first embodiment of the present disclosure.

[0016] Figure 1C It is a perspective view showing a heat dissipation substrate and a heat spreader according to Embodiment 1 of the present disclosure.

[0017] Figure 2A It is a longitudinal sectional view showing the periphery of the sealing body.

[0018] Figure 2B yes Figure 2A Cross-sectional view at line BB.

[0019] Figure 3A It is a cross-sectional view showing a heat dissipation substrate according to the second embodiment.

[0020] Figure 3B yes Figure 3A Cross-sectional view at line BB.

[0021] Figure 4A This is a longitudinal sectional view of a heat dissipation substrate according to a third embodiment.

[0022] Figure 4B Yes means Figure 4A An enlarged view of portion C1.

[0023] Figure 5A It is a longitudinal sectional view showing a heat dissipation substrate according to a fourth embodiment.

[0024] Figure 5B It is a longitudinal sectional view showing a heat dissipation substrate according to a fifth embodiment.

[0025] Figure 5C It is a longitudinal sectional view showing a heat dissipation substrate according to a sixth embodiment.

[0026] Fig. 6A It is a figure explaining the shape of the sealing body of Embodiment 1-3.

[0027] Figure 6B It is a figure explaining the shape of the sealing body in Embodiment 4 to 6.

[0028] Figure 7 It is a longitudinal sectional view showing a heat dissipation substrate according to a seventh embodiment.

[0029] Fig. 8A It is a longitudinal sectional view showing a heat dissipation substrate according to the eighth embodiment.

[0030] Figure 8B Yes means Fig. 8A An enlarged view of portion C2.

[0031] Fig. 9A This is a longitudinal sectional view showing an example in which a component is mounted on a heat dissipation substrate according to an embodiment.

[0032] Fig. 9B This is a perspective view showing an example in which components are mounted on a heat dissipation substrate according to the embodiment. DETAILED DESCRIPTION

[0033] Hereinafter, the various embodiments of the present disclosure will be described in detail with reference to the drawings. Hereinafter, the direction along the XY plane of FIG. 1 is described as the horizontal direction and the Z direction is described as the upward direction, but the directions may not be consistent with the directions of the heat dissipation substrate 10 or the heat spreader 30 when in use.

[0034] (Implementation Method 1)

[0035] Figure 1A and Figure 1B It is a longitudinal sectional view showing the heat dissipation substrate and the heat spreader according to the first embodiment of the present disclosure. Figure 1C It is a perspective view showing the heat dissipation substrate and the heat spreader according to the first embodiment. Figure 1B The structure before the internal space 111 is sealed is shown.

[0036] The heat dissipation substrate 10 of the first embodiment includes a housing 11 having an internal space 111 and a sealing body 15 sealing the internal space 111. The housing 11 may also include an inner top surface 11b, an inner bottom surface 11c, and a through hole 13 communicating with the internal space 111. The sealing body 15 may also seal the internal space 111 by blocking the through hole 13.

[0037] like Figure 1C As shown, the housing 11 may be in the shape of a flat plate (specifically, a flat plate whose horizontal dimension is larger than the vertical dimension). The through hole 13 is opened on the first surface 11a which is the upper surface of the housing 11, and the first surface 11a may also be in the shape of a plane. The internal space 111 may be a space extending in the horizontal direction (specifically, a space whose horizontal dimension is larger than the vertical dimension).

[0038] One or more pillars 112b from the inner bottom surface 11c to the inner top surface 11b may be located in the inner space 111. The pillars 112b may support the housing 11 from the inside of the inner space 111 so that the inner space 111 is not crushed or expanded.

[0039] The shell 11 and the sealing body 15 can be metal. The main component of the metal can be copper, aluminum, titanium, nickel, stainless steel or an iron-based alloy (such as Kovar alloy (FeNiCo)). The main component refers to a component that accounts for more than 80% by mass. The main component of the metal of the shell 11 and the metal of the sealing body 15 can be the same. In addition, the metal of the shell 11 and the metal of the sealing body 15 can be the same component. The so-called same composition not only includes the case of being strictly the same, but also includes the case of being the same except for errors (errors within the tolerance range).

[0040] The material of the housing 11 is at least the material of the inner wall portion 12 (see FIG. 2 ) of the through hole 13, and the parts of the housing 11 other than the inner wall portion 12 may be made of different materials. The inner wall portion 12 refers to a part of the housing 11 that surrounds the through hole 13 and faces the through hole 13, and may also refer to a part that has a thickness ranging from 1 / 5 to 1 / 2 of the diameter of the through hole 13.

[0041] The heat dissipation substrate 10 may include a void structure 17 having voids. The void structure 17 may be located in the internal space 111. More specifically, the void structure 17 may be located in a position in contact with the inner surface of the internal space 111 (e.g., the inner top surface 11b, the inner bottom surface 11c, etc.), or may be integrated with the inner surface. The void structure 17 may also be a structure that functions as a capillary component that can hold and transport liquid phase fluids through surface tension. The void structure 17 may also be a collection or a mesh structure of a fiber body, a sintered body, a porous body, or a needle-shaped body. Alternatively, the void structure 17 may also be a structure in which a plate having a plurality of holes (specifically, micropores) is provided as a multilayer. The void structure 17 may be composed of materials such as metal or ceramics.

[0042] <Heat Flow Plate>

[0043] The heat spreader 30 involved in this embodiment has a heat dissipation substrate 10 and a liquid phase fluid located in an internal space 111, and the internal space 111 can be decompressed. As the liquid phase fluid, water, acetone, methanol, ammonia, etc. can be used. Through this structure, when heat is applied to any part of the heat dissipation substrate 10, the heat can be rapidly diffused by the phase change (i.e., vaporization and condensation) of the liquid phase fluid inside the internal space 111 and the reflux of the liquid phase fluid and the gas phase fluid formed by the vaporization of the liquid phase fluid. When heat is applied to the heat dissipation substrate 10, the internal pressure of the internal space 111 can also be higher than the outside of the shell 11 by vaporizing the liquid phase fluid. With regard to the heat dissipation substrates 10A to 10G of embodiments 2 to 8 described later, the heat spreader of this embodiment can also be constructed in the same manner as described above.

[0044] <Details of the seal section>

[0045] Figure 2A It is a longitudinal sectional view showing the periphery of the sealing body. Figure 2B yes Figure 2A Cross-sectional view at line BB.

[0046] like Figure 2B As shown, the cross section of the through hole 13 may also be circular. According to the shape of the through hole 13, the sealing body 15 may also be cylindrical. In addition, the cross section of the through hole 13 may be elliptical, oblong, polygonal, or a shape having straight edges and curved edges. The sealing body 15 may also have a shape corresponding to the through hole 13.

[0047] Hereinafter, the opening of the through hole 13 at the boundary between the through hole 13 and the internal space 111 is referred to as the first opening 13a, and the opening outside the through hole 13 is referred to as the second opening 13b (see Figure 2A ). In addition, the portion of the housing 11 surrounding the through hole 13 is referred to as the inner wall portion 12. Figure 2A In FIG. 1 , the first opening 13a and the second opening 13b are indicated by thick dashed lines. Figure 2A and Figure 2B In FIG. 1 , the inner wall portion 12 is enclosed by a thick dotted line.

[0048] The through hole 13 may be configured to extend linearly from the first opening 13 a to the second opening 13 b .

[0049] like Figure 2A As shown, the sealing body 15 may have a first portion 15a located in the internal space 111 and a second portion 15b located in the through hole 13. The first portion 15a may be in contact with the first inner bottom surface 11c-1 of the internal space 111. The first inner bottom surface 11c-1 refers to a portion of the inner bottom surface 11c of the internal space 111, which is equivalent to a portion overlapping with the through hole 13 when viewed along the through hole 13.

[0050] The second portion 15 b of the sealing body 15 may be in close contact with the inner wall portion 12 of the through hole 13 while applying pressure to the inner wall portion 12 , or a bonding material such as solder may be filled between the second portion 15 b and the inner wall portion 12 .

[0051] In the longitudinal section, the maximum width W15max of the first portion 15a may be greater than the minimum width W13min of the through hole 13 (i.e., W15max>W13min). In addition, the maximum width W15max of the first portion 15a may also be greater than the width W13a of the first opening portion 13a (i.e., W15max>W13a). As described above, the first opening portion 13a refers to an opening in the through hole 13 located at the boundary between the through hole 13 and the internal space 111. The width W13a of the first opening portion 13a may refer to the length of a line segment connecting one end of the first opening portion 13a to the other end in the longitudinal section. The longitudinal section may also refer to a plane section passing through the center of gravity of the first opening portion 13a and the center of gravity of the second opening portion 13b. The relationship between the maximum width W15max and the minimum width W13min described above may be a relationship that is established in the longitudinal section in any direction, or a relationship that is established except for the longitudinal sections in several directions.

[0052] According to the relationship between the minimum width W13min and the maximum width W15max, even when the internal pressure of the internal space 111 rises, the possibility of the sealing body 15 falling off from the through hole 13 is reduced, and it is easy to maintain the sealed state. According to the relationship between the width W13a and the maximum width W15max, even when the internal pressure of the internal space 111 rises, the possibility of the sealing body 15 falling off from the through hole 13 is further reduced, and it is easier to maintain the sealed state.

[0053] As described above, the first portion 15a may also be in contact with the first inner bottom surface 11c-1. According to this structure, even when the internal pressure of the internal space 111 rises, the top surface of the first portion 15a is difficult to be exposed to the internal pressure of the internal space 111. Therefore, it is possible to reduce the force acting on the sealing body 15 in the direction of pushing outward due to the rising internal pressure. Therefore, the possibility of the sealing body 15 shifting in the direction of falling off from the through hole 13 is reduced, and it becomes easy to maintain the sealed state of the internal space 111.

[0054] Furthermore, the first portion 15a is in contact with the first inner bottom surface 11c-1, thereby increasing the rigidity of the portion near the sealing body 15 of the case 11. Therefore, when ultrasonically bonding a terminal or a lead of a component to the first surface 11a, bonding becomes easy.

[0055] <Sealing process>

[0056] like Figure 1B As shown, the length L1 of the sealing body 15 before sealing can be longer than the opening from the outside of the through hole 13 (specifically, the second opening 13b, see Figure 2A The sealing body 15 before sealing may have a thickness that allows it to pass through the through hole 13.

[0057] The sealing process may include: a process of passing the sealing body 15 through the through hole 13 until one end of the sealing body 15 contacts the first inner bottom surface 11c-1; and a process of further pressing the sealing body 15. By further pressing, Figure 2A As shown, the first portion 15a of the sealing body 15 is deformed in a manner of expanding the diameter, and the maximum width W15max of the first portion 15a becomes larger than the minimum width W13min of the through hole 13. In addition, during the above deformation, the through hole 13 is blocked and the internal space 111 is sealed by expanding the diameter of the second portion 15b of the sealing body 15 or filling the periphery of the second portion 15b with a bonding material such as solder. The sealing body 15 may also be cut or polished in a manner such that the first surface 11a and the end surface of the sealing body 15 are flush with each other before or after passing through the through hole 13.

[0058] Before the above-mentioned sealing process, liquid phase fluid may be injected into the internal space 111 through the through hole 13. In addition, the above-mentioned sealing process may also be performed in the space after decompression. Through this process, the internal space 111 can be sealed in a state where the internal space 111 contains liquid phase fluid and is decompressed.

[0059] According to the sealing structure of the heat dissipation substrate 10 achieved by the above-described sealing step, deformation is less likely to occur around the through hole 13 , particularly around the first surface 11 a side of the through hole 13 , so that the flatness of the first surface 11 a can be improved also around the sealing portion.

[0060] (Implementation Method 2)

[0061] Figure 3A It is a cross-sectional view showing a heat dissipation substrate according to the second embodiment. Figure 3B yes Figure 3A The heat dissipation substrate 10A of the second embodiment may be the same as that of the first embodiment except that the structure near the sealing body 15 in the internal space 111 is different.

[0062] In the heat dissipation substrate 10A of the second embodiment, the support body 112 of the internal space 111 may also be located on the side of the sealing body 15. The support body 112 is a structure that supports the housing 11 from the inside of the internal space 111 so that the internal space 111 is not crushed or bulged, and may be a side wall of the internal space 111 or a support from the inner bottom surface 11c to the inner top surface 11b. Figure 3A In the embodiment, the side wall which is thicker than other parts is used as the support body 112.

[0063] The support body 112 may be located in contact with the first portion 15a of the sealing body 15. The support body 112 and the sealing body 15 may be in contact with each other from the inner bottom surface 11c to the inner top surface 11b, or may be in contact with each other only partially, or may leave a slight gap as a whole.

[0064] like Figure 3A As shown, when viewed from the sealing body 15, the support body 112 may be located in three directions, two directions, or one direction in the horizontal direction. One direction, two directions, and three directions refer to one to three directions after the entire periphery is divided into four equal parts in the horizontal direction.

[0065] The support body 112 located on the side of the sealing body 15 may be thicker than the side wall 115 in other areas.

[0066] By having the support body 112, when the through hole 13 is blocked by the sealing body 15, the deformation of the periphery of the through hole 13 can be further reduced. In addition, by making the support body 112 a thicker structure, the above-mentioned deformation can be further reduced. In addition, by making the support body 112 a thicker structure, the through hole 13 can be arranged in a manner not too close to the end of the first surface 11a, which produces an advantage of being able to increase the degree of freedom of arrangement of the through hole 13 in the design stage.

[0067] like Figure 3AAs shown, in the structure where the support body 112 is located in three directions of the sealing body 15, the passage 111a connected to the wider part of the internal space 111 is located in the remaining direction. The width W111 of the passage 111a can be larger than the diameter φ13 of the through hole 13, or can be the same, or can be smaller than the diameter φ13 of the through hole 13. The smaller it is, the more it can reduce the deformation of the shell 11 near the sealing portion. In the case where the through hole 13 is not cylindrical, the diameter can also be called the minimum width. Since it is difficult to generate circulation of liquid fluid in the passage 111a, the passage 111a can also be located in a position where the heat dissipation effect can be reduced (for example, near the periphery of the first surface 11a when viewed from above).

[0068] (Implementation method 3)

[0069] Figure 4A This is a longitudinal sectional view of a heat dissipation substrate according to a third embodiment. Figure 4B yes Figure 4A The heat dissipation substrate 10B of the third embodiment may have the same components as those of the first and second embodiments except that the crystal grain sizes of the inner wall portion 12 of the through hole 13 and the crystal grain sizes of the sealing body 15 are different.

[0070] The crystal grain size φ1 of the sealing body 15 and the crystal grain size φ2 of the inner wall portion 12 may also satisfy the following condition (1). That is, the crystal grain size φ1 of the sealing body 15 may be equal to or larger than the crystal grain size φ2 of the inner wall portion 12 .

[0071] φ1>0.8×φ2· · · (1)

[0072] In addition, the sealing body 15 and the inner wall portion 12 may be made of a metal having the same main component, or may be made of a metal having the same component (for example, copper).

[0073] The crystal grain sizes φ1 and φ2 may satisfy the following condition (2), and further, may satisfy the following condition (3).

[0074] φ1≥φ2· · · (2)

[0075] φ1>φ2· · · (3)

[0076] Generally, in the main component metal or metal of the same component, the one with a larger crystal grain size is more likely to deform when stress is applied. Therefore, by satisfying the above condition (1), when the through hole 13 is blocked with the seal 15, the deformation of the periphery of the through hole 13 of the housing 11 can be further reduced, and the effect of deforming the seal 15 can be further improved, and the flatness of the periphery of the seal on the outer surface side of the housing 11 can be further improved. In addition, by satisfying the above conditions (2) and (3), the above effects can be further obtained, and the flatness of the periphery of the seal can be further improved.

[0077] The above-mentioned crystal grain size refers to the mean value of crystal grain size, and can be measured as follows. That is, prepare the cross-sectional photo of this part, describe the line segment of specified length on the cross-sectional photo, count the crystal grains overlapping with this line segment. The crystal grain overlapping with the end of the line segment is 1 / 2. And, by the length of the above-mentioned line segment (specifically, the length obtained by dividing by the multiplication of the cross-sectional photo) divided by the number of the counted crystal grains, thus obtain the crystal grain size of a group of samples. In addition, change the direction and position of the line segment to calculate the crystal grain size of a plurality of groups of samples, and use the mean value of the calculated value as the crystal grain size of the measured object.

[0078] The crystal grain size of the inner wall portion 12 and the crystal grain size of the sealing body 15 can be adjusted by applying heat treatment. Therefore, by subjecting the sealing body 15 to a heat treatment equivalent to the heat treatment applied in the manufacturing process of the housing 11 before sealing, or applying a heat treatment with a predetermined difference to the heat treatment, it is possible to manufacture a sealing body 15 having a crystal grain size that satisfies the above-mentioned conditions (1) to (3).

[0079] In addition, the housing 11 may have substantially the same crystal grain size in the inner wall portion 12 and in any other portion.

[0080] (Implementation 4)

[0081] Figure 5A to Figure 5C The longitudinal cross-sectional views respectively show heat dissipation substrates of Embodiments 4, 5 and 6. Heat dissipation substrates 10C to 10E of Embodiments 4 to 6 may be the same as Embodiments 1 to 3 except that the properties of the first inner bottom surface 11c-1 of the internal space 111 to which the first portion 15a of the sealing body 15 contacts are different.

[0082] In embodiments 4 to 6, the Young's modulus of the first inner bottom surface 11c-1 may be greater than the Young's modulus of the sealing body 15. In addition, the Young's modulus of the first inner bottom surface 11c-1 may be greater than the Young's modulus of the inner wall portion 12 of the through hole 13. The first inner bottom surface 11c-1 refers to a portion of the inner bottom surface 11c of the internal space 111 that contacts the first portion 15a of the sealing body 15. The Young's modulus may refer to a value measured by the nanoindentation method specified in the international standard ISO14577.

[0083] According to this structure, when the through hole 13 is blocked by the sealing body 15, the first portion 15a of the sealing body 15 can be effectively deformed to bulge in the horizontal direction. Therefore, compared with the case where the Young's modulus of the first inner bottom surface 11c-1 is not large, the first portion 15a of the sealing body 15 can be bulged with less energy. Therefore, the energy applied from the sealing body 15 to the through hole 13 can also be reduced, and the deformation around the through hole 13 can be reduced. Therefore, the flatness of the sealing portion around the outer surface side of the housing 11 can be further improved.

[0084] In order to realize the above-mentioned relationship of Young's modulus, the heat dissipation substrates 10C to 10E of the fourth to sixth embodiments may be configured as follows. That is, Figure 5A In the heat dissipation substrate 10C of the fourth embodiment, the housing 11 may include a base 11A and an upper structure 11B joined to the base 11A. Furthermore, the base 11A may be made of a material different from that of the sealing body 15 .

[0085] Specifically, the upper structure 11B and the sealing body 15 can be made of metal such as copper, and the base 11A can be made of ceramics. The ceramics can also be made of materials containing silicon nitride (Si3N4), silicon carbide (SiC), mullite or aluminum nitride (AlN), aluminum oxide (Al2O3) and the like as main components.

[0086] The base 11A and the upper structure 11B may be joined via a joining material such as solder. Furthermore, the internal space 111 may be located between the base 11A and the upper structure 11B, and the through hole 13 may be located in the upper structure 11B. Furthermore, the upper surface of the base 11A may include a first inner bottom surface 11c-1.

[0087] Figure 5B The heat dissipation substrate 10D of the fifth embodiment may also have a plate-shaped or film-shaped member 11D whose material is different from that of other parts of the housing 11 at a portion overlapping with the first inner bottom surface 11c-1. The member 11D may also be made of ceramics and bonded to the inner bottom surface 11c of the housing 11 via a bonding material such as solder. The ceramic may also be a structure containing silicon nitride (Si3N4), silicon carbide (SiC), mullite or aluminum nitride (AlN), aluminum oxide (Al2O3), etc. as a main component.

[0088] Figure 5C In the heat dissipation substrate 10E of the sixth embodiment, the bottom of the housing 11 has a multilayer structure, and the top layer 11E of the bottom (i.e., the layer exposed as the inner bottom surface 11c) may be made of a material different from that of other parts of the housing 11. The top layer 11E may also be made of ceramic. The ceramic may also be a structure containing silicon nitride (Si3N4), silicon carbide (SiC), mullite or aluminum nitride (AlN), aluminum oxide (Al2O3), etc. as a main component.

[0089] The above-mentioned relationship of Young's modulus can be realized by the structures of the heat dissipation substrates 10C to 10E according to the fourth to sixth embodiments.

[0090] <Relationship between Young's modulus and shape of sealant>

[0091] Here, the shape of the sealing body 15 in the above-mentioned first to sixth embodiments will be described in detail. Fig. 6A It is a figure explaining the shape of the sealing body of Embodiment 1-3. Figure 6B It is a figure explaining the shape of the sealing body of Embodiments 4 to 6. In Embodiments 1 to 3, the Young's modulus of the first inner bottom surface 11c-1 is the same as the Young's modulus of the sealing body 15 and the inner wall portion 12. In Embodiments 4 to 6, the Young's modulus of the first inner bottom surface 11c-1 is greater than the Young's modulus of the sealing body 15 and the inner wall portion 12. As described above, the opening of the through hole 13 located at the boundary between the through hole 13 and the internal space 111 is called the first opening 13a, and the opening outside the through hole 13 is called the second opening 13b.

[0092] like Fig. 6A As shown, in embodiments 1 to 3, the first portion 15a of the sealing body 15 includes an upper end portion 151 located at the first opening portion 13a of the through hole 13, a lower end portion 154 connected to the first inner bottom surface 11c-1, and a first middle portion 152 located between the upper end portion 151 and the lower end portion 154. In addition, the contour line of the first portion 15a in the longitudinal section may also have a gentle curve in which the width gradually increases from the upper end portion 151 to the first middle portion 152 and the width gradually decreases downward from the first middle portion 152. If the sealing body 15 is cylindrical, the above-mentioned width may also be referred to as a diameter.

[0093] The first inner bottom surface 11c-1 may also have a concave shape, and the top end of the first portion 15a may be embedded in the concave shape.

[0094] The bulge that appears on the outer line of the first portion 15 a and the depression of the first inner bottom surface 11 c - 1 may be shapes formed by the sealing body 15 being pressed downward when the sealing body 15 closes the through hole 13 .

[0095] like Figure 6B As shown, in embodiments 4 to 6, the first portion 15a of the sealing body 15 may also have an upper end 151, a lower end 154, and a first middle portion 152, similarly to embodiments 1 to 3. In addition, similarly to embodiments 1 to 3, the outline of the first portion 15a in the longitudinal section may also have a gentle curve whose width gradually increases from the upper end 151 to the first middle portion 152 and gradually decreases from the first middle portion downward. If the sealing body 15 is cylindrical, the above-mentioned width may also be referred to as a diameter.

[0096] In addition, the first portion 15a of the fourth to sixth embodiments may include a second intermediate portion 153 between the first intermediate portion 152 and the lower end portion 154, and the outline of the first portion 15a in the longitudinal section may include a curved portion 153a where the width is minimized at the second intermediate portion 153. The second intermediate portion 153 where the width is minimized may also be referred to as a constricted portion.

[0097] In the fourth to sixth embodiments, the first inner bottom surface 11 c - 1 may be planar, and the width of the first portion 15 a of the sealing body 15 may gradually increase from the second intermediate portion 153 to the lower end portion 154 .

[0098] The bulge that appears on the outer line of the first portion 15a and the bend of the second middle portion 153 (i.e., the shape of the neck portion) may also be a shape formed by applying pressure to the sealing body 15 when the sealing body 15 blocks the through hole 13, and is caused by the large Young's modulus of the first inner bottom surface 11c-1.

[0099] pass Fig. 6A as well as Figure 6B The shape of the sealing body 15 shown can reduce deformation around the second opening 13b of the through hole 13 and can block the through hole 13 to seal the internal space 111. Furthermore, even if the internal pressure of the internal space 111 varies, the sealing of the internal space 111 can be easily maintained.

[0100] (Implementation 7)

[0101] Figure 7 1 is a longitudinal sectional view showing a heat dissipation substrate according to Embodiment 7. The heat dissipation substrate 10F according to Embodiment 7 may be the same as Embodiments 1 to 6 except for the configuration related to the void structure 17. Figure 7 In FIG. 1 , an example is shown in which the bottom of the housing 11 is made of a material different from that of other parts, but the entire housing 11 may be made of the same material.

[0102] The void structure 17 may also be integrated with the inner bottom surface 11c of the shell 11 and be a part of the inner bottom surface 11c. The inner bottom surface 11c includes a first inner bottom surface 11c-1 in contact with the first portion 15a of the sealing body 15 and a second inner bottom surface 11c-2 adjacent to the first inner bottom surface 11c-1, and the void structure 17 may include a first void structure 17-1 located at the first inner bottom surface 11c-1 and a second void structure 17-2 located at the second inner bottom surface 11c-2. The second inner bottom surface 11c-2 may refer to a portion of the inner bottom surface 11c that is peripheral to the first inner bottom surface 11c-1.

[0103] By positioning the first void structure 17-1 on the first inner bottom surface 11c-1, after the top end of the sealing body 15 contacts the first inner bottom surface 11c-1 in the sealing process, when the sealing body 15 is further pressed in, a friction force acts on the top end of the sealing body 15. Therefore, the possibility that the top end of the sealing body 15 slides on the first inner bottom surface 11c-1 and unexpected bending of the sealing body 15 is reduced can be reduced. Therefore, the sealing process can be performed more stably, and the yield rate of the heat dissipation substrate 10F can be improved.

[0104] The porosity of the first void structure 17-1 may be smaller than the porosity of the second void structure 17-2. The porosity refers to the volume occupied by the voids per unit volume of the void structure 17. The difference in porosity means that the bonding degree between the top of the seal 15 and the first inner bottom surface 11c-1 is improved by the first void structure 17-1. Therefore, according to the above structure, the anchoring effect of the first void structure 17-1 can be obtained, and the displacement of the seal 15 in the direction of falling off from the through hole 13 can be further reduced.

[0105] (Implementation 8)

[0106] Fig. 8A It is a longitudinal sectional view showing a heat dissipation substrate according to the eighth embodiment. Figure 8B Yes means Fig. 8A The heat dissipation substrate 10G of the eighth embodiment may be the same as the first to seventh embodiments except that a part of the inner wall portion 12 surrounding the through hole 13 is different.

[0107] The inner wall portion 12 surrounding the through hole 13 may also include a protrusion 12a protruding toward the internal space 111. In addition, the protrusion 12a may also be in contact with the sealing body 15. The protrusion 12a is located at the boundary between the through hole 13 and the internal space 111 (i.e., the first opening 13a), and the top of the protrusion 12a may also be an acute angle. The top of the protrusion 12a being an acute angle means that the corner of the top of the protrusion 12a in the longitudinal section is an acute angle. Among them, the acute angle refers to an acute angle when the roundness at the microscopic level is ignored. That is, as Figure 8B As shown, the acute angle may mean that an angle θ formed by an extension line of the adjacent first side 12a-1 and an extension line of the second side 12a-2 sandwiching the top end of the protrusion 12a is an acute angle.

[0108] The protrusion 12a can be formed, for example, in the following manner. That is, when the through hole 13 is formed in the housing 11, a burr remains at the opening (i.e., the first opening 13a) on the side of the internal space 111. And the burr is tilted in such a way that the end of the burr faces the center of the opening. In this state, the protrusion 12a can be formed by performing a sealing process using the sealing body 15.

[0109] By having the protruding portion 12a, the first opening 13a of the through hole 13 is difficult to expand even when the internal pressure of the internal space 111 increases. Therefore, the possibility of the sealing body 15 displacing outward in the through hole 13 can be further reduced, and the airtightness between the inner wall portion 12 of the through hole 13 and the sealing body 15 can be further improved.

[0110] (Example of component mounting)

[0111] Fig. 9A and Fig. 9B The longitudinal section and the perspective view show an example of mounting a component on the heat dissipation substrate of the embodiment. The heat dissipation substrate 10 and the heat spreader 30 of the embodiment 1 are mounted with the heat generating component 51, so that the heat of the component 51 is dissipated. The component 51 can be a power component such as a power semiconductor through which a large current flows, or can be other various components. The component 51 can be mounted on the module substrate 201 via the heat dissipation substrate 10 and the heat spreader 30.

[0112] like Fig. 9A and Fig. 9B As shown, the element 51 can be mounted in a manner overlapping the area where the through hole 13 and the sealing body 15 of the first surface 11a are located, or can be mounted away from the area. Alternatively, the terminal of the element 51 can also be bonded to the above-mentioned area of ​​the first surface 11a. The terminal can be bonded via a conductive bonding material, or can be bonded by ultrasonic bonding or the like.

[0113] According to the heat dissipation substrate 10 and the heat spreader 30 of the first embodiment, as described above, the flatness of the periphery of the sealing portion on the outer surface of the housing 11 can be improved. Fig. 9A and Fig. 9B As shown, even when the component 51 is mounted on the first surface 11 a , it is possible to reduce the possibility that the sealing portion becomes an obstacle in mounting the component 51 .

[0114] In addition, compared with other structures in which the passage for injecting liquid phase fluid into the internal space 111 and decompressing the internal space 111 is located on the side of the heat dissipation substrate 10, the heat dissipation substrate 10 and the heat spreader 30 of the first embodiment can also improve the flatness of the side. Therefore, when a plurality of heat dissipation substrates 10 and heat spreaders 30 are arranged and mounted on one module substrate 201, the adjacent heat dissipation substrates 10 and heat spreaders 30 can be mounted close to each other, and the concentration of the heat dissipation substrates 10 and heat spreaders 30 can be improved. In addition, the degree of freedom of configuration of the heat dissipation substrates 10 and the heat spreaders 30 can be improved.

[0115] Fig. 9A and Fig. 9BThe heat dissipation substrate 10 of the embodiment 1 may be replaced by the heat dissipation substrates 10A to 10G of the second to eighth embodiments. The replaced structure can also achieve the same effect as described above.

[0116] The embodiments of the present disclosure have been described above. However, the heat dissipation substrate and the heat spreader of the present disclosure are not limited to the above-described embodiments. The details shown in the embodiments can be appropriately changed within the scope of the invention.

[0117] An embodiment of the present disclosure is shown below. In one embodiment,

[0118] (1) A heat dissipation substrate, comprising:

[0119] a housing having an interior space; and

[0120] a sealing body, sealing the internal space,

[0121] The shell has an inner bottom surface and a through hole connected to the internal space,

[0122] The sealing body has a first portion located in the internal space and a second portion located in the through hole,

[0123] The first portion is in contact with the inner bottom surface,

[0124] In the longitudinal section, the maximum width of the first portion is greater than the minimum width of the through hole.

[0125] (2) The heat dissipation substrate according to (1) above, wherein:

[0126] The through hole includes a first opening portion located at a boundary between the through hole and the internal space, and in a longitudinal cross section, a maximum width of the first portion is greater than a width of the first opening portion.

[0127] (3) The heat dissipation substrate according to (1) or (2) above, wherein:

[0128] The housing has a first plane surface.

[0129] One end of the through hole is located on the first surface.

[0130] (4) The heat dissipation substrate according to any one of (1) to (3) above, wherein:

[0131] The housing has an inner wall portion surrounding the through hole,

[0132] The crystal grain size of the sealing body is φ1,

[0133] The crystal grain size of the inner wall is φ2,

[0134] φ1>0.8×φ2.

[0135] (5) The heat dissipation substrate according to (4) above, wherein:

[0136] The inner wall portion and the sealing body are made of metal having the same main component.

[0137] (6) The heat dissipation substrate according to any one of (1) to (5) above, wherein:

[0138] The inner bottom surface includes a first inner bottom surface in contact with the sealing body,

[0139] The housing has an inner wall portion surrounding the through hole,

[0140] The Young's modulus of the first inner bottom surface is higher than that of the sealing body,

[0141] The Young's modulus of the first inner bottom surface is higher than the Young's modulus of the inner wall portion.

[0142] (7) The heat dissipation substrate according to any one of (1) to (6) above, wherein:

[0143] Also included are void structures having voids,

[0144] The void structure is located on the inner bottom surface,

[0145] The inner bottom surface includes a first inner bottom surface in contact with the sealing body and a second inner bottom surface adjacent to the first inner bottom surface.

[0146] The void structure includes a first void structure located on the first inner bottom surface and a second void structure located on the second inner bottom surface.

[0147] The void ratio of the first void structure is smaller than the void ratio of the second void structure.

[0148] (8) The heat dissipation substrate according to any one of (1) to (7) above, wherein:

[0149] The housing has an inner wall portion surrounding the through hole,

[0150] The inner wall portion includes a protrusion located on the inner space side,

[0151] The protrusion is in contact with the sealing body.

[0152] (9) The heat dissipation substrate according to any one of (1) to (8) above, wherein:

[0153] The through hole includes a first opening located at a boundary between the through hole and the internal space,

[0154] The first portion of the sealing body includes an upper end portion located at the first opening, a lower end portion connected to the inner bottom surface, and a first intermediate portion located between the upper end portion and the lower end portion.

[0155] The outline of the first portion in the longitudinal section includes a curve in which the width of the first portion gradually increases from the upper end portion to the first middle portion and the width of the first portion gradually decreases downward from the first middle portion.

[0156] (10) The heat dissipation substrate according to (9) above, wherein:

[0157] The first portion of the sealing body has a second intermediate portion between the first intermediate portion and the lower end portion,

[0158] The outline of the first portion in the longitudinal section includes a curved portion where the width of the first portion becomes extremely small at the second intermediate portion.

[0159] In one embodiment,

[0160] (11) A vapor chamber, comprising:

[0161] The heat dissipation substrate according to any one of (1) to (10); and

[0162] A liquid phase fluid is located in the inner space.

[0163] Industrial Applicability

[0164] The present disclosure can be used for heat dissipation substrates and vapor chambers.

[0165] Description of Reference Numerals

[0166] 10, 10A ~ 10G heat dissipation substrate

[0167] 11 Housing

[0168] 11a Page 1

[0169] 11A Base

[0170] 11B Superstructure

[0171] 11D Component

[0172] 11E Top floor

[0173] 11c Inner bottom

[0174] 11c-1 First inner bottom surface

[0175] 11c-2 Second inner bottom surface

[0176] 12 Inner wall part

[0177] 12a Protrusion

[0178] 13 Through hole

[0179] 13a First opening

[0180] 13b Second opening

[0181] 15 Sealing body

[0182] 15a The first part

[0183] 15b Second part

[0184] 17 Void Structure

[0185] 17-1 The first void structure

[0186] 17-2 Second void structure

[0187] 51 Components

[0188] 111 Interior Space

[0189] 111a Passage

[0190] 112 Support

[0191] 115 Sidewall

[0192] 151 Upper end

[0193] 152 First Middle Section

[0194] 153 Second middle section

[0195] 153a Bend

[0196] 154 lower end

[0197] 201 Module substrate

[0198] W15max Maximum width

[0199] W13min minimum width

[0200] W13a Width

Claims

1. A heat dissipation substrate, wherein: have: a housing having an interior space; and a sealing body, sealing the internal space, The shell has an inner bottom surface and a through hole connected to the internal space, The sealing body has a first portion located in the internal space and a second portion located in the through hole, The first portion is in contact with the inner bottom surface, In the longitudinal section, the maximum width of the first portion is greater than the minimum width of the through hole.

2. The heat dissipation substrate according to claim 1, wherein: The through hole includes a first opening located at a boundary between the through hole and the internal space, In the longitudinal cross section, the maximum width of the first portion is greater than the width of the first opening.

3. The heat dissipation substrate according to claim 1, wherein: The housing has a first plane surface. One end of the through hole is located on the first surface.

4. The heat dissipation substrate according to claim 1, wherein: The housing has an inner wall portion surrounding the through hole, The crystal grain size of the sealing body is φ1, The crystal grain size of the inner wall is φ2, φ1>0.8×φ2.

5. The heat dissipation substrate according to claim 4, wherein: The inner wall portion and the sealing body are made of metal having the same main component.

6. The heat dissipation substrate according to claim 1, wherein: The inner bottom surface includes a first inner bottom surface in contact with the sealing body, The housing has an inner wall portion surrounding the through hole, The Young's modulus of the first inner bottom surface is higher than that of the sealing body, The Young's modulus of the first inner bottom surface is higher than the Young's modulus of the inner wall portion.

7. The heat dissipation substrate according to claim 1, wherein: Also included are void structures having voids, The void structure is located on the inner bottom surface, The inner bottom surface includes a first inner bottom surface in contact with the sealing body and a second inner bottom surface adjacent to the first inner bottom surface. The void structure includes a first void structure located on the first inner bottom surface and a second void structure located on the second inner bottom surface. The void ratio of the first void structure is smaller than the void ratio of the second void structure.

8. The heat dissipation substrate according to claim 1, wherein: The housing has an inner wall portion surrounding the through hole, The inner wall portion includes a protrusion located on the inner space side, The protrusion is in contact with the sealing body.

9. The heat dissipation substrate according to claim 1, wherein: The through hole includes a first opening located at a boundary between the through hole and the internal space, The first portion of the sealing body includes an upper end portion located at the first opening, a lower end portion connected to the inner bottom surface, and a first intermediate portion located between the upper end portion and the lower end portion. The outline of the first portion in the longitudinal section includes a curve in which the width of the first portion gradually increases from the upper end portion to the first middle portion and the width of the first portion gradually decreases downward from the first middle portion.

10. The heat dissipation substrate according to claim 9, wherein: The first portion of the sealing body has a second intermediate portion between the first intermediate portion and the lower end portion, The outline of the first portion in the longitudinal section includes a curved portion where the width of the first portion becomes extremely small at the second intermediate portion.

11. A vapor chamber, wherein: have: The heat dissipation substrate according to claim 1; and A liquid phase fluid is located in the inner space.

Images