Light-transmitting pressing plate, pressurizing assembly, heating and pressurizing device and light-emitting chip transfer equipment

Abstract

The invention discloses a light-transmitting pressing plate, a pressurizing assembly, a heating and pressurizing device and light-emitting chip transfer equipment. The light-transmitting pressing plate (320) comprises a first surface and a second surface (321) which are parallel to each other, and the light-transmitting pressing plate (320) allows the laser of the target wavelength to transmit in a first direction (Z) in which the first surface points to the second surface (321); the light-transmitting pressing plate (320) is used for transferring a light-emitting chip arranged on the first substrate to the second substrate under the action of pressure and the action of the laser of the target wavelength, the first substrate is located on the side, close to the second surface (321), of the light-transmitting pressing plate (320) and allows the laser of the target wavelength to transmit in the first direction, and the first substrate is closer to the light-transmitting pressing plate (320) than the second substrate. In the embodiment of the invention, the light-transmitting pressing plate (320) provides a basis for pressurization and laser irradiation, and the feasibility of mass transfer of the light-emitting chips is realized.

Description

Transparent pressing plate, pressing assembly, heating and pressing device, and light-emitting chip transfer equipment

[0001] Cross-references

[0002] This disclosure claims priority to Chinese patent application number 202310628821.9 filed on May 30, 2023, entitled “Heating and Pressurizing Device and Chip Transfer Equipment”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to the field of display technology, and in particular to a light-transmitting pressing plate, a pressing component, a heating and pressing device, and a light-emitting chip transfer device. Background Art

[0004] Mass transfer involves the precise transfer of millions, or even tens of millions, of micron-scale light-emitting chips from a source plate to a driver substrate. This process presents numerous challenges in terms of transfer yield, accuracy, and speed, creating a bottleneck restricting the development of next-generation display products. Currently, various laser-assisted transfer technologies have been developed, offering advantages such as minimal device damage, high selectivity, and fast and efficient response, making them a highly promising solution for mass transfer.

[0005] The mass transfer process is the most demanding, requiring high-temperature, high-pressure, and high-precision bonding of upper and lower substrates of different sizes, laser scanning processing, and peeling of the upper and lower substrates. This process is a very important part of the production of display products. Due to the current shortcomings of this technology in terms of complex process links, there is an urgent need for a transfer technology with simpler process links that can ensure transfer yield, accuracy, and speed.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field.

[0007] Summary of the Invention

[0008] The purpose of the present disclosure is to provide a heating and pressurizing device that integrates heating, pressurizing and laser irradiation functions to provide feasibility for mass transfer of chips.

[0009] To achieve the above-mentioned purpose, the present invention adopts the following technical solutions:

[0010] According to a first aspect of the present disclosure, there is provided a light-transmitting press plate, the light-transmitting press plate comprising a first surface and a second surface parallel to each other, the first surface and the second surface both extending along a plane, and the light-transmitting press plate allowing laser light of a target wavelength to pass through in a first direction from the first surface to the second surface;

[0011] The light-transmitting press plate is used to transfer the light-emitting chip arranged on the first substrate to the second substrate under the action of pressure and the action of the laser of the target wavelength, wherein the first substrate is located on the side of the light-transmitting press plate close to the second surface and allows the laser of the target wavelength to pass through in the first direction, the first substrate and the second substrate are located on the same side of the light-transmitting press plate, and the first substrate is closer to the light-transmitting press plate than the second substrate.

[0012] In an exemplary embodiment of the present disclosure, the refractive index of the light-transmitting press plate to a laser with a wavelength of 355 nm is in the range of (1, 1.6).

[0013] In an exemplary embodiment of the present disclosure, the distance between the first surface and the second surface is in the range of [8 mm, 35 mm].

[0014] In an exemplary embodiment of the present disclosure, after the light-transmitting pressing plate transmits a laser within a range of an incident angle less than or equal to 14 degrees, a light spot offset is less than or equal to 0.5 mm.

[0015] In an exemplary embodiment of the present disclosure, after the transparent pressure plate transmits the laser within a laser width of Amm×Bmm, the degradation of the laser spot uniformity does not exceed 2%, and A and B are both less than or equal to 70.

[0016] In an exemplary embodiment of the present disclosure, after the light-transmitting pressing plate transmits the laser within a range of an incident angle less than or equal to 14 degrees, the uniformity of the laser spot is equal to or better than the uniformity of the laser spot before the incident.

[0017] In an exemplary embodiment of the present disclosure, the light-transmitting press plate is made of fused quartz glass or synthetic quartz glass.

[0018] In an exemplary embodiment of the present disclosure, the quartz glass includes inclusions therein, and the particle size of the inclusions is less than 0.1 mm.

[0019] In an exemplary embodiment of the present disclosure, it includes a light-transmitting area and a peripheral area, wherein the peripheral area surrounds the light-transmitting area;

[0020] A first gas passage is provided in the peripheral area, and the first gas passage has a first adsorption port extending to the second surface, and the first adsorption port is distributed around the light-transmitting area.

[0021] In an exemplary embodiment of the present disclosure, the light-transmitting press plate includes a contoured surface located between the first surface and the second surface;

[0022] The first gas passage includes an annular groove and an air vent, the notch of the annular groove is located on the second surface and forms the first adsorption port, one end of the air vent is connected to the annular groove, and the port at the other end of the air vent is located on the contour surface and forms a first exhaust port, which is used to connect to the exhaust device.

[0023] In an exemplary embodiment of the present disclosure, the outer contour of the light-transmitting pressing plate is a rectangle;

[0024] The light-transmitting pressing plate includes four sub-contour surfaces located between the first surface and the second surface, the first gas passage includes four gas channels and four groups of gas holes, and the four sub-contour surfaces, the four gas channels, and the four groups of gas holes correspond to each other one by one;

[0025] One of the air channels is located between a corresponding sub-contour surface and the light-transmitting area, one end of a group of air holes is connected to the corresponding air channel, and the other end is located on the second surface and forms the first adsorption port;

[0026] One of the air ducts extends to two sub-contour surfaces adjacent to a corresponding sub-contour surface, and forms a pair of orifices on the two adjacent sub-contour surfaces. At least one of the four pairs of orifices forms a first air extraction port and is used to connect to the air extraction device. The remaining orifices are sealed.

[0027] In an exemplary embodiment of the present disclosure, the four air passages are interconnected, and one orifice in the four pairs of orifices forms the first air suction port.

[0028] According to a first aspect of the present disclosure, there is provided a pressurizing assembly comprising a connecting portion and the light-transmitting press plate described in the first aspect above;

[0029] The connecting portion has a penetrating hollow area, the connecting portion is fixedly connected to the light-transmitting pressing plate, and is located on a side close to the first surface of the light-transmitting pressing plate;

[0030] In the first direction, the light-transmitting area of ​​the light-transmitting pressing plate overlaps with the hollow area.

[0031] In an exemplary embodiment of the present disclosure, the pressurizing assembly further comprises a metal frame and an elastic pad located between the connecting portion and the light-transmitting pressing plate;

[0032] The metal frame is located between the elastic pad and the light-transmitting pressing plate. Both the metal frame and the elastic pad are annular structures, and the orthographic projections of the metal frame and the elastic pad on the light-transmitting pressing plate surround the light-transmitting area.

[0033] According to a first aspect of the present disclosure, there is provided a heating and pressurizing device comprising a heating carrying mechanism and a pressurizing driving mechanism;

[0034] The heating and carrying mechanism includes a heating component and a carrying platform, the carrying platform is used to carry the second substrate, and the heating component is used to heat the second substrate on the carrying platform;

[0035] The pressurizing drive mechanism includes a drive mechanism and the pressurizing assembly described in the first aspect, wherein the drive mechanism is connected to the pressurizing assembly;

[0036] In which, the transparent pressure plate and the supporting platform are arranged opposite to each other in the first direction, the transparent pressure plate is used to connect the first substrate, and the driving mechanism is used to drive the transparent pressure plate to move in the first direction, so that the transparent pressure plate drives the first substrate and the second substrate to contact in the first direction and generate an interaction force.

[0037] In an exemplary embodiment of the present disclosure, the driving mechanism includes:

[0038] a first slide rail extending along the first direction;

[0039] a slider assembly, slidably connected to the first slide rail, and the slider assembly is connected to the pressurizing assembly;

[0040] A power driving component is connected to the slider assembly and is used to drive the slider assembly to slide along the first slide rail and apply pressure to the pressurizing assembly.

[0041] In an exemplary embodiment of the present disclosure, a second gas passage is provided in the carrier platform, and the second gas passage has a second adsorption port extending to a surface of the carrier platform facing the pressurizing assembly.

[0042] In an exemplary embodiment of the present disclosure, there are two pressurizing drive mechanisms, and the two pressurizing drive mechanisms are respectively located on both sides of the heating component in the second direction, and the two heating drive mechanisms are axially symmetrically arranged about the central axis of the heating component, and the second direction is perpendicular to the first direction.

[0043] In an exemplary embodiment of the present disclosure, the target wavelength is in the range of 100 nm-2000 nm.

[0044] According to a first aspect of the present disclosure, there is provided a light-emitting chip transfer device, comprising:

[0045] The heating and pressurizing device described in the above aspect;

[0046] The laser irradiation device is used to generate laser light of a target wavelength and irradiate the laser light onto the light-transmitting area of ​​the light-transmitting pressing plate.

[0047] According to a first aspect of the present disclosure, there is provided a method for transferring a luminescent chip, comprising:

[0048] Transferring the light-emitting chip from the source substrate to the intermediate substrate, and then from the intermediate substrate to the display substrate;

[0049] The light-emitting chip transfer device described in the first aspect is used to transfer the light-emitting chip from the source substrate to the intermediate substrate, wherein the first substrate is the source substrate and the second substrate is the intermediate substrate;

[0050] And / or the light-emitting chip transfer device described in the above aspect is used to transfer the light-emitting chip from the intermediate substrate to the display substrate, wherein the first substrate is the intermediate substrate and the second substrate is the display substrate.

[0051] According to a first aspect of the present disclosure, a light-emitting chip transfer method is provided, comprising:

[0052] The light-emitting chip transfer apparatus described in the first aspect is used to heat, pressurize, and irradiate a first substrate and a second substrate on a heating and pressurizing device. The first substrate allows laser light of a target wavelength to pass through in a first direction. The light-emitting chip is initially located on the first substrate.

[0053] The driving mechanism drives the pressurizing assembly to move toward the carrying platform to apply pressure, so that the first substrate and the second substrate come into contact and generate an interaction force;

[0054] The heating component heats the second substrate carried on the carrying platform;

[0055] The laser light generated by the laser irradiation device passes through the light-transmitting area of ​​the light-transmitting pressing plate to irradiate the first substrate and the second substrate with laser light, so that the light-emitting chip on the first substrate is transferred to the second substrate.

[0056] In the embodiment of the present disclosure, the provided transparent pressure plate realizes the feasibility of bearing pressure, and because the transparent pressure plate can transmit the laser of the target wavelength in the first direction, the feasibility of laser irradiation is realized, thereby realizing the feasibility of integrating pressurization and laser irradiation, which facilitates the simplification of the process of mass transfer of light-emitting chips and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] The above and other features and advantages of the present disclosure will become more apparent by describing in detail example embodiments thereof with reference to the accompanying drawings.

[0058] FIG1 is a schematic structural diagram of a heating and pressurizing device in an exemplary embodiment of the present disclosure.

[0059] FIG. 2 is a schematic structural diagram of a pressurizing assembly in an exemplary embodiment of the present disclosure.

[0060] FIG3 is a schematic structural diagram of some components of a heating and pressurizing device in an exemplary embodiment of the present disclosure.

[0061] FIG4 is a schematic structural diagram of a power output end of a power conversion element of a heating and pressurizing device in an exemplary embodiment of the present disclosure.

[0062] FIG5 is a schematic structural diagram of a connecting portion in an exemplary embodiment of the present disclosure.

[0063] FIG. 6 is a schematic side view of a pressurizing assembly according to an exemplary embodiment of the present disclosure.

[0064] FIG. 7 is a schematic diagram of a fixed explosion structure of a pressurizing assembly in an exemplary embodiment of the present disclosure.

[0065] FIG8 is a schematic diagram of a fixed explosion structure of another pressurizing assembly in an exemplary embodiment of the present disclosure.

[0066] FIG. 9 is a schematic structural diagram of a light-transmitting pressing plate in an exemplary embodiment of the present disclosure.

[0067] FIG. 10 is a schematic diagram of refraction of laser light passing through a light-transmitting press plate in an exemplary embodiment of the present disclosure.

[0068] FIG. 11 is a schematic structural diagram of another light-transmitting pressing plate in an exemplary embodiment of the present disclosure.

[0069] FIG. 12 is a bottom view of another light-transmitting pressure plate in an exemplary embodiment of the present disclosure.

[0070] FIG. 13 is a schematic side view of another light-transmitting pressing plate in an exemplary embodiment of the present disclosure.

[0071] FIG. 14 is a bottom view of a light-transmitting pressing plate in an exemplary embodiment of the present disclosure.

[0072] Figure numerals: Z-first direction; X-second direction; Y-third direction; 10-heating bearing mechanism; 20-pressurizing driving mechanism; 30-base; 40-base leveling member; 50-reinforcement member; 100-heating member; 200-carrying platform; 500-second supporting member; 210-second suction port; 220-second exhaust port; 300-pressurizing assembly; 400-driving mechanism; 310-connecting portion; 320-transparent pressure plate; 330-metal frame; 340-elastic pad; 350, first fixing bolt; 360, second fixing bolt; 370, third fixing bolt; 380, straight-through connector; 390, fourth fixing bolt; 308, washer; 309, locking nut; 311-hollow area; 312-pressurizing area; AA, light-transmitting area; BB, peripheral area; 321, second surface; 322, first air extraction port; 323, first suction port; 324, annular groove; 325, air vent; 326, contour surface; 327, air vent; 328, air duct; 3261, sub-contour surface; 410, first support member; 420, first slide rail; 430, slider assembly; 440, power driver; 450, photoelectric sensor; 460, sensor stopper; 470, second slide rail; 431, slider; 432, first connecting member; 433, second connecting member; 434, guide shaft; 435, pressure sensor; 436, stopper; 437, linear bearing; 4321, first connecting sub-block; 4322, second connecting sub-block; 22a, first connecting arm; 22b, second connecting arm; 441 - drive motor; 442 - power conversion element; 4421 - power output end; 443 - reducer; 451 - limit slot. DETAILED DESCRIPTION

[0073] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be more comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to provide a thorough understanding of the embodiments of the present disclosure.

[0074] In the drawings, the thickness of regions and layers may be exaggerated for clarity. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.

[0075] The described features, structures or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure can be practiced without one or more of the specific details, or other methods, components, materials, etc. can be adopted. In other cases, well-known structures, materials or operations are not shown or described in detail to avoid obscuring the main technical ideas of the present disclosure.

[0076] When a structure is “on” another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is “directly” disposed on the other structure, or that the structure is “indirectly” disposed on the other structure via another structure.

[0077] The terms "a," "an," and "the" are used to indicate the presence of one or more elements / components; the terms "including" and "having" are used to indicate an open-ended inclusiveness and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc. The terms "first," "second," etc. are used merely as labels and do not limit the quantity of the items to which they refer.

[0078] The mass transfer process is the most demanding. To achieve mass transfer of light-emitting chips, the prior art first applies pressure to the two substrates to be transferred in a pressurized chamber to secure the mass of light-emitting chips mounted on the first substrate to the second substrate. Laser irradiation is then applied to the two substrates in a laser chamber to separate the first substrate from the mass of light-emitting chips. Finally, the two substrates to be transferred are separated. The multi-chamber operation not only increases the complexity of the light-emitting chip transfer process, but also significantly reduces production efficiency due to the transfer between multiple chambers.

[0079] The present disclosure provides a light-emitting chip transfer device, which includes a heating and pressing device and a laser irradiation device, wherein the laser irradiation device is used to generate laser light of a target wavelength.

[0080] The light-emitting chip transfer equipment can be used to transfer large quantities of light-emitting chips (such as Micro LED chips), precisely transferring millions or even tens of millions of micron-sized light-emitting chips from a first substrate to a second substrate. The first substrate can be a source substrate (such as a sapphire wafer), and the second substrate can be a glass substrate; or the first substrate can be a glass substrate, and the second substrate can be a display substrate containing a driver circuit (for driving the light-emitting chips).

[0081] The light-emitting chip transfer equipment includes a heating and pressing device and a laser irradiation device. The heating and pressing device is used to achieve contact between the first and second substrates, generate an interaction force, and heat the second substrate. The laser irradiation device is used to generate laser light of a target wavelength to irradiate the first substrate after the first and second substrates have contacted and generated an interaction force. In this way, the heating and pressing device and the laser irradiation device can work together to achieve an integrated operation for transferring light-emitting chips from the first substrate to the second substrate, thereby simplifying the operation process for transferring large quantities of light-emitting chips and improving production efficiency.

[0082] The laser irradiation device generates laser light of a target wavelength capable of transmitting through the first substrate to effectively peel or dissociate a large number of light-emitting chips from the first substrate. The wavelength of the laser light generated by the laser irradiation device can be in the range of 100 nm to 2000 nm. Of course, the wavelength of the laser light generated by the laser irradiation device can also be slightly less than 100 nm or slightly greater than 2000 nm, as long as the light-emitting chips can be peeled or dissociated from the first substrate.

[0083] For example, the wavelength of the laser light generated by the laser irradiation device may be in the range of 390nm-780nm, such as visible light; or in the range of 780nm-2000nm, such as infrared light; or in the range of 100nm-390nm, such as ultraviolet light. Specifically, the wavelength of the laser light generated by the laser irradiation device may be in one of the following ranges: 770nm-622nm (red light), 622nm-597nm (orange light), 597nm-577nm (yellow light), 577-492nm (green light), 492nm-450nm (cyan light), 450nm-435nm (blue light), or 455nm-350nm (violet light). More specifically, the wavelength of the laser light generated by the laser irradiation device is 355nm.

[0084] The heating and pressurizing device can achieve contact between the first substrate and the second substrate and generate interaction force through a pressurizing operation, and can also achieve bonding and fixing of a large number of light-emitting chips on the first substrate to the second substrate through a heating operation; when the laser light of the target wavelength generated by the laser irradiation device is irradiated on the first substrate, the light-emitting chip can be peeled off from the first substrate (the first substrate is the source substrate, and the second substrate is the intermediate substrate) or dissociated (the first substrate is the intermediate substrate, and the second substrate is the display substrate).

[0085] Among them, for the heating and pressurizing device, for example, the second substrate can be heated to 150°C, and the pressure generated between the first substrate and the second substrate can be 0.5MPa, and the duration is 10 minutes to ensure the stability of the bonding between the light-emitting chip on the first substrate and the second substrate.

[0086] The laser light generated by the laser irradiation device can be pre-shaped so that the laser spot shape is the same as the outline shape of the light-emitting chip, while ensuring the uniformity of energy within the spot area. For example, if the outline shape of the light-emitting chip is rectangular, the laser spot can be shaped so that it is a rectangular flat-top spot. In addition, the laser irradiation device can irradiate the first substrate in a matrix dotting manner, and the dotting matrix corresponds to the arrangement of the light-emitting chips on the first substrate, such that one dotting position corresponds to one light-emitting chip, one dotting position corresponds to 2*2 light-emitting chips, or one dotting position corresponds to 2*3 light-emitting chips, etc.

[0087] It should be noted that the second substrate contains a colloid capable of achieving adhesive bonding under heating conditions, thereby ensuring contact and interaction between the first and second substrates. Furthermore, after heating the second substrate, the light-emitting chip on the first substrate is bonded and fixed to the second substrate. In the event that the light-emitting chip dissociates from the first substrate, the light-emitting chip is fixed to the first substrate using a dissociation adhesive. Laser irradiation causes the dissociation adhesive to lose its adhesive properties, thereby achieving dissociation of the light-emitting chip.

[0088] Next, the heating and pressurizing device included in the light-emitting chip transfer equipment is explained in detail.

[0089] FIG1 illustrates a schematic structural diagram of a heating and pressurizing device provided by the present disclosure, and FIG2 illustrates a schematic structural diagram of a pressurizing assembly provided by the present disclosure. As shown in FIG1 and FIG2, the heating and pressurizing device includes: a heating support mechanism 10, which is used to support the second substrate and heat the second substrate; a pressurizing drive mechanism 20, which includes a drive mechanism 400 and a pressurizing assembly 300, and the drive mechanism 400 is connected to the pressurizing assembly 300; wherein the pressurizing assembly 300 includes a light-transmitting pressure plate 320, which is arranged opposite to the heating support mechanism 10 in a first direction, and the light-transmitting pressure plate 320 is used to connect the first substrate, and the drive mechanism 400 is used to drive the light-transmitting pressure plate 320 to move toward the heating support mechanism 10, so as to drive the first substrate to contact the second substrate and generate an interaction force.

[0090] The heating and pressurizing device provided by the present invention carries the second substrate through the heating carrier mechanism 10 and is connected to the first substrate through the transparent pressure plate 320. The second substrate can then be heated by the heating carrier mechanism 10, and when the driving mechanism 400 drives the transparent pressure plate 320 included in the pressurizing assembly 300 to move toward the heating carrier mechanism 10, the first substrate is driven to contact the second substrate and generate an interaction force to achieve the bonding and fixation of the light-emitting chip set on the first substrate and the second substrate; in addition, combined with the light transmittance of the transparent pressure plate 320, the feasibility of laser irradiation of the first substrate is achieved, so that the heating and pressurizing device can integrate the heating, pressurizing and laser irradiation functions, providing feasibility for the mass transfer of light-emitting chips.

[0091] For example, the heating carrier mechanism 10 maintains the second basic heating temperature at 150°C, and the driving mechanism 400 drives the first substrate and the second substrate to contact, and the pressure generated between the two is 0.5 MPa, and the duration is 10 minutes to ensure the stability of the bonding between the light-emitting chip on the first substrate and the second substrate.

[0092] Optionally, as shown in FIG. 1 , the heating carrier mechanism 10 includes a carrier platform 200 and a heating component 100 , and the carrier platform 200 is disposed on one side of the heating component 100 in the first direction Z.

[0093] The first direction Z may be a vertical direction. For example, the supporting platform 200 is disposed above the heating component 100 in the vertical direction.

[0094] The carrier 200 and the transparent pressure plate 320 are arranged relative to each other in the first direction Z (i.e., there is an overlapping area). The carrier 200 is used to support and secure the second substrate, so that when the driving mechanism 400 drives the transparent pressure plate 320 to move toward the carrier 200 along the first direction Z, the first substrate connected to the transparent pressure plate 320 can contact and generate an interaction force with the second substrate on the carrier 200. The heating component 100 has a heating function and is mainly used to heat the carrier 200 to achieve heating of the second substrate. The heating component 100 can be a heating table and can include a housing and a heating tube and a temperature controller disposed within the housing, etc., which are not specifically limited in this disclosure.

[0095] The carrier platform 200 and the heating platform can be connected as one piece, for example, the carrier platform 200 is connected to a side surface of the heating platform in the first direction Z, or the carrier platform 200 and the heating platform are directly processed into an integrated structure. In addition, the carrier platform 200 can also be not connected to the heating component 100, but supported by other supporting structures on one side of the heating component 100 in the first direction Z.

[0096] For example, as shown in FIG1 , the heating support mechanism 10 further includes a second support member 500 positioned around the heating component 100 and supporting the support platform 200 on one side of the heating component 100 in the first direction Z. There may be multiple second support members 500, with the multiple second support members 500 surrounding the heating component 100. The number of second support members 500 can be set based on the size and shape of the support platform 200.

[0097] The second support member 500 may be a support column extending along the first direction Z. The cross section of the support column may be circular, elliptical, triangular, rectangular, square or other polygonal shapes, which are not specifically limited in the present disclosure.

[0098] Regarding the number of second support members 500, for example, if the carrier platform 200 is substantially circular, the number of second support members 500 can be three, four, five, or more, and the plurality of second support members 500 are evenly distributed along the circumference of the heating component 100. If the carrier platform 200 is substantially quadrilateral, the number of second support members 500 can be four, six, eight, or more, and the plurality of second support members 500 can be distributed around the heating component 100 based on the positions of the four sides of the carrier platform 200.

[0099] In some embodiments of the present disclosure, as shown in FIG3 , the carrier 200 has a built-in second gas passage (not shown in the figure), and the second gas passage has a second suction port 210 and a second gas extraction port 220. The second gas extraction port 220 is used to connect to a gas extraction device, and the gas extraction device adsorbs and fixes the second substrate through the second suction port 210 of the second gas passage. The second suction port 210 is an opening where the second gas passage extends to the surface of the carrier 200 facing the transparent pressure plate 320; the second gas extraction port 220 is an opening where the second gas passage extends to the surface of the carrier 200 facing away from the transparent pressure plate 320, or extends to the surface of the carrier 200 facing the transparent pressure plate 320, or extends to the side wall of the carrier 200.

[0100] In some embodiments of the present disclosure, as shown in FIG1 , the driving mechanism 400 is disposed on one side of the heating carrier mechanism 10 in the second direction X, so that when the driving mechanism 400 drives the transparent pressure plate 320 to move along the first direction Z, it can ensure that the transparent pressure plate 320 drives the first substrate and the second substrate to generate a certain amount of interaction force, thereby ensuring the extrusion force between the light-emitting chip on the first substrate and the second substrate, thereby ensuring the bonding strength between the light-emitting chip and the second substrate.

[0101] The second direction X is substantially perpendicular to the first direction Z. For example, the second direction X can be horizontal. The number of drive mechanisms 400 can be two, three, or more. Preferably, there are two drive mechanisms 400. The two drive mechanisms 400 are located on either side of the heating carrier 10 in the second direction X and are symmetrically arranged. This allows the drive mechanisms 400 to apply pressure to the pressurizing assembly 300 from both ends of the pressurizing assembly 300 in the second direction X, thereby maintaining the stability and uniformity of the force applied to the pressurizing assembly 300.

[0102] In some embodiments of the present disclosure, as shown in Figure 1, the driving mechanism 400 includes a first slide rail 420, a slider assembly 430 and a power drive member 440, the first slide rail 420 extends along the first direction Z; the slider assembly 430 is slidably connected to the first slide rail 420, and the slider assembly 430 is connected to the pressurizing assembly 300; the power drive member 440 is respectively connected to the slider assembly 430 and the pressurizing assembly 300, and is used to drive the slider assembly 430 to slide along the first slide rail 420 and apply force to the pressurizing assembly 300.

[0103] Optionally, the first slide rail 420 has two first rails, which are arranged along the third direction Y, that is, the two first rails are respectively located on both sides of the power driving member 440 in the third direction Y. The third direction Y may be perpendicular to both the first direction Z and the second direction X.

[0104] In some embodiments, as shown in Figures 1 and 4, the slider assembly 430 includes a slider 431 and a connecting member, which includes a first connecting member 432, a second connecting member 433, at least one guide shaft 434, and a pressure sensor 435. The slider 431 is slidably connected to the first slide rail 420, and the power driver 440 is used to drive the slider 431 to slide along the first slide rail 420. The first connecting member 432 is connected to the slider 431, or to the slider 431 and the power driver 440. The second connecting member 433 is located on a side of the first connecting member 432 near the heating carrier mechanism 10 and is connected to the pressurizing assembly 300. One end of the at least one guide shaft 434 is slidably connected to the first connecting member 432 and the other end is fixedly connected to the second connecting member 433. The at least one guide shaft 434 extends along the first direction Z. The pressure sensor 435 is located between the first connecting member 432 and the second connecting member 433.

[0105] In this way, the slider 431 can be driven by the power driving member 440 to drive the first connecting member 432 to move along the guide shaft 434 toward the second connecting member 433, and then a force is applied to the pressurizing assembly 300 through the second connecting member 433, and the magnitude of the force is detected by the pressure sensor 435.

[0106] The slider 431 is slidably connected to the side of the first slide rail 420 near the heating support mechanism 10 and is connected to the power output end 4421 of the power driver 440. This connection can be direct or indirect via other components. Furthermore, regarding the slidable connection between the slider 431 and the first slide rail 420, in conjunction with the aforementioned situation where the first slide rail 420 has two first rails, the slider 431 has a second rail that matches the shape and size of the first rail on the first slide rail 420. When there are two sliders 431, each slider 431 has one second rail; alternatively, when there is only one slider 431, the slider 431 has two second rails.

[0107] Optionally, the first connecting member 432 can be roughly an "L"-shaped connecting member. In this case, the first connecting member 432 can be a one-piece component, or it can include multiple sub-components, and each sub-component satisfies a certain connection relationship. For example, in a specific embodiment, as shown in Figure 1 or Figure 4, the first connecting member 432 includes a first connecting sub-block 4321 and a second connecting sub-block 4322. The first connecting sub-block 4321 connects the slider 431, or connects the slider 431 and the power output end 4421 of the power drive 440; the second connecting sub-block 4322 connects the first connecting sub-block 4321 and at least one guide shaft 434, and at least one guide shaft 434 is slidably connected to the second connecting sub-block 4322.

[0108] The power driving member 440 can drive the first connecting sub-block 4321 to slide along the first slide rail 420 by driving the slider 431, or directly drive the first connecting sub-block 4321 to slide along the first slide rail 420. It should be noted that the first connecting sub-block 4321 can be a single block structure. When there are multiple sliders 431 (for example, two sliders 431), the first connecting sub-block 4321 can be connected to both sliders 431 at the same time to maintain the balance of the sliders 431 when sliding.

[0109] As shown in Figure 1, the second connecting sub-block 4322 includes a first connecting arm 22a and a second connecting arm 22b (L-shaped) that are perpendicular to each other. The first connecting arm 22a is connected to the first connecting sub-block 4321, and at least one guide shaft 434 is slidably connected to the second connecting arm 22b. In this embodiment, the first connecting member 432 includes a separate first connecting sub-block 4321 and a separate second connecting sub-block 4322. This structural design helps maintain the stability of the first slide rail 420 and the slider 431 during device disassembly. During disassembly, only the second connecting sub-block 4322 can be removed, maintaining the connection between the first connecting sub-block 4321, the slider 431, and the first slide rail 420, thereby preventing the first slide rail 420 and the slider 431 from being degraded due to disassembly.

[0110] Optionally, the second connecting member 433 is located on a side of the first connecting member 432 that is closer to the pressurizing assembly 300. The second connecting member 433 may be a block-shaped structure, such as a rectangular, square, circular, elliptical, or other regular polygonal block. When the first connecting member 432 slides along the guide shaft 434 to the second connecting member 433, a force is applied to the second connecting member 433, thereby applying a force to the pressurizing assembly 300.

[0111] Optionally, the pressure sensor 435 is connected to the second connecting member 433. In this case, the heating and pressurizing device includes a pressurized state and a pressure relief state: in the pressurized state, the first connecting member 432 contacts the pressure sensor 435 and applies a force so that the pressure sensor 435 is subjected to a force; in the pressure relief state, there is a gap between the first connecting member 432 and the pressure sensor 435, or the first connecting member 432 contacts the pressure sensor 435 but does not generate an effective force (the force value detected by the pressure sensor 435 is 0).

[0112] The pressure sensor 435 is connected to the center of the second connecting member 433 to enhance the accuracy of its force detection. Preferably, the pressure sensor 435 is a pancake-shaped structure to better complete the force detection without affecting the contact between the first connecting member 432 and the second connecting member 433.

[0113] Furthermore, in some embodiments of the present disclosure, as shown in FIG4 , the slider assembly 430 further includes a linear bearing 437 connected between the first connecting member 432 and the guide shaft 434. Specifically, the first connecting member 432 is provided with a mounting hole for mounting the linear bearing 437, and the linear bearing 437 is mounted in the mounting hole. One end of the guide shaft 434 slides through the linear bearing 437.

[0114] When the power driving member 440 drives the first connecting member 432 and the slider 431 to slide along the first slide rail 420, one end of the first connecting member 432 connected to the guide shaft 434 can be guided along the extension direction of the guide shaft 434 and slide along the guide shaft 434. When the first connecting member 432 slides along the guide shaft 434 to the second connecting member 433, a force can be applied to the second connecting member 433, thereby applying a force to the pressurizing assembly 300.

[0115] Furthermore, in some embodiments of the present disclosure, as shown in Figure 4, the slider assembly 430 also includes a limiting portion 436, which is connected to the guide shaft 434 and is located on the side of the first connecting member 432 away from the second connecting member 433. The limiting portion 436 is used to define the sliding range of the first connecting member 432 along the guide shaft 434.

[0116] The structure of the limiting portion 436 can be various. In one embodiment, the limiting portion 436 is an integral structure fixedly connected to the end of the guide shaft 434 away from the second connecting member 433. The cross-section of the limiting portion 436 in the second direction X is larger than the size of the mounting hole of the first connecting member 432, thereby blocking the mounting hole, thereby allowing the first connecting member 432 to slide within the range defined by the limiting portion 436. In another embodiment, the limiting portion 436 includes multiple components, such as a first limiting portion 436 and a second limiting portion 436. The first limiting portion 436 is fixedly connected to the end of the guide shaft 434 away from the second connecting member 433, and the second limiting portion 436 is fixedly connected to a side surface of the first connecting member 432 away from the second connecting member 433 and is located on the side of the first limiting portion 436 closer to the second connecting member 433. The second limiting portion 436 has a through hole for the guide shaft 434 to pass through. The cross section of the first limiting portion 436 in the second direction X is larger than the through hole of the second limiting portion 436 , thereby blocking the through hole of the second limiting portion 436 , thereby allowing the first connecting member 432 to slide within the range defined by it.

[0117] In some embodiments, as shown in Figures 1, 3 and 4, the power drive member 440 includes a drive motor 441 and a power conversion element 442. The drive motor 441 is connected to the first support member 410, and the drive motor 441 is used to output rotational power; the power conversion element 442 has a power input end and a power output end 4421. The power input end of the power conversion element 442 is connected to the drive motor 441, and the power output end 4421 of the power conversion element 442 is connected to the slider assembly 430. The power conversion element 442 is used to convert the rotational power output by the drive motor 441 into linear motion.

[0118] The drive motor 441 can be a servo motor for outputting rotational power. The power conversion element 442 can convert the rotational power into linear motion. Through this structural design, it is possible to improve space utilization while meeting motion requirements. The power conversion element 442 can be fixed to the first support member 410 via at least one fixed seat. The power conversion element 442 can be a ball screw. The two first tracks on the first slide rail 420 can be located on the front and rear sides of the power conversion element 442, that is, the ball screw.

[0119] In some embodiments of the present disclosure, as shown in Figure 1, the power drive 440 also includes a reducer 443, which is connected between the power input end of the drive motor 441 and the power conversion element 442. The reducer 443 is used to reduce the output speed of the drive motor 441 and increase the torque. The drive motor 441 itself has a large output speed and a small torque. The reducer 443 has the functions of reducing speed and increasing torque. After the reducer 443 is installed, the power conversion element 442 can provide a large torque and exert a large force. The force can reach 1 ton, which can meet many process requirements. The drive motor 441 and the reducer 443 can be connected by a key, and the power conversion element 442 and the reducer 443 can be connected by an elastic coupling.

[0120] In some embodiments of the present disclosure, as shown in FIG1 or FIG4 , the driving mechanism 400 further includes a first support member 410, and the first slide rail 420 is connected to the first support member 410. The first support member 410 can be a support plate or a support column, and its cross-section can be circular, rectangular, square, or a regular polygon.

[0121] Preferably, the first support member 410 is a support plate extending along the first direction Z. The first slide rail 420 can be connected to the first support member 410 by bolts, screws, etc. Specifically, there are two support plates, one located on either side of the heating carrier mechanism 10 in the second direction X. The first slide rail 420 is connected to a surface of the first support member 410 facing the heating carrier mechanism 10 in the second direction X.

[0122] In some embodiments of the present disclosure, as shown in FIG1 or FIG4 , the driving mechanism 400 further includes at least one photoelectric sensor 450 disposed on one side of the first slide rail 420 . The photoelectric sensor 450 is used to sense the sliding position of the slider assembly 430 .

[0123] There are multiple photoelectric sensors 450. At least one photoelectric sensor 450 includes a first photoelectric sensor 450. The first photoelectric sensor 450 can have multiple functions. In one embodiment, the force generated by the contact between the first substrate and the second substrate caused by the pressurizing component 300 is set with a force threshold, and the setting position of the first photoelectric sensor 450 corresponds to the force threshold. For example, when the force generated by the contact between the first substrate and the second substrate exceeds the force threshold, the first photoelectric sensor 450 can transmit this information to a structure such as an early warning system, causing it to generate an early warning signal to avoid damage to the machine and potential safety hazards. Furthermore, the first photoelectric sensor 450 can be used in conjunction with the pressure sensor 435 to improve the safety factor.

[0124] In other embodiments, the first photoelectric sensor 450 is disposed at a position to define the sliding range of the slider assembly 430 in the first direction Z, so as to soft-limit the slider assembly 430 to prevent the slider assembly 430 from exceeding the sliding range.

[0125] At least one photoelectric sensor 450 also includes a second photoelectric sensor 450, which is arranged on a side of the first photoelectric sensor 450 away from the heating platform. The setting position of the second photoelectric sensor 450 is used to correspond to the initial position of the slider assembly 430; or the setting position of the second photoelectric sensor 450 is used to define the sliding range of the slider assembly 430 in the first direction Z.

[0126] In a specific embodiment, the number of photoelectric sensors 450 is three, and the three photoelectric sensors 450 are arranged along the first direction Z, wherein the photoelectric sensor 450 located in the middle corresponds to the starting position of the slider assembly 430, and the remaining two photoelectric sensors 450 are used to define the sliding range of the slider assembly 430 in the first direction Z to soft-limit the slider assembly 430 to prevent the slider assembly 430 from exceeding the sliding range.

[0127] In some embodiments of the present disclosure, as shown in FIG1 or FIG4 , the drive mechanism 400 further includes a second slide rail 470 , which is connected to the first support member 410 and extends along the first direction Z. The second slide rail 470 is connected to a side surface of the first support member 410 in the third direction Y. For example, the first support member 410 is the support plate in the above-mentioned embodiment, which further has two side surfaces connecting the inner surface and the outer surface, and the second slide rail 470 is connected to one of the side surfaces.

[0128] In some embodiments of the present disclosure, as shown in FIG1 or FIG4 , the drive mechanism 400 further includes a sensor stopper 460 , one end of which is connected to the slider assembly 430 and the other end of which extends toward the photoelectric sensor 450 along the second direction X. Furthermore, a stopper groove 451 is provided on one side of the photoelectric sensor 450 near the sensor stopper 460 , into which the other end of the sensor stopper 460 can be inserted. The sensor stopper 460 can help improve the accuracy of the photoelectric sensor 450 in sensing the sliding position of the drive assembly.

[0129] In some embodiments of the present disclosure, as shown in FIG1 , the heating and pressurizing device further includes a base 30, which is primarily used to provide a support platform for the heating carrier mechanism 10 and the pressurizing drive mechanism 20. Specifically, the heating carrier mechanism 10 and the pressurizing drive mechanism 20 can be connected to one side of the base 30 in the first direction Z. The heating member 100 of the heating carrier mechanism 10 can be fixed to a side surface of the base 30. A second support member 500 can be connected between the base 30 and the carrier platform 200. The bottom end of the first support member 410 of the pressurizing drive mechanism 20 can be connected to the base 30.

[0130] Furthermore, as shown in FIG1 , the heating and pressurizing device further includes at least one abutment leveling member 40, which is connected between the abutment 30 and the second support member 500. The abutment leveling member 40 may be a leveling bolt. The size and shape of the abutment leveling member 40 may be determined based on the cross-sectional shape and size of the second support member 500.

[0131] 1 , the heating and pressurizing device further includes a reinforcing member 50 connected between the first support member 410 and the base 30. The reinforcing member 50 can be a right triangle plate or a right trapezoidal plate to enhance the stability of the first support member 410 fixed to the base 30.

[0132] Next, the pressurizing components included in the heating and pressurizing device are explained in detail.

[0133] As shown in Figures 2 and 5, the pressurizing assembly 300 includes a connecting portion 310 and a light-transmitting pressure plate 320. The connecting portion 310 has a penetrating hollow area 311. The connecting portion 310 is fixedly connected to the light-transmitting pressure plate 320 and is located on a side close to the first surface of the light-transmitting pressure plate 320. In the first direction Z, the light-transmitting area AA of the light-transmitting pressure plate 320 overlaps with the hollow area 311.

[0134] In this way, when the laser of the target wavelength irradiates the pressurizing component 300, the laser can pass through the hollow area 311 on the connecting part 310 and the transparent area 311 of the transparent pressure plate 320 in sequence, thereby realizing laser irradiation of the first substrate connected to the second surface of the transparent pressure plate 320, thereby achieving the effectiveness of peeling or dissociation of the light-emitting chip on the first substrate.

[0135] In addition, as shown in Figure 5, the connecting portion 310 further includes a pressurizing region 312 located outside the hollow region 311. The driving mechanism 400 is connected to the pressurizing region 312 of the connecting portion 310, so that the driving mechanism 400 applies pressure to the connecting portion 310, thereby achieving contact between the first substrate and the second substrate and generating an interaction force. There can be multiple pressurizing regions 312, which are symmetrically distributed around the hollow region 311. For example, the connecting portion 310 has two pressurizing regions 312, which are symmetrically distributed about the hollow region 311 in the second direction X.

[0136] The connecting portion 310 has two surfaces facing each other in the first direction, with a hollowed-out area 311 extending through the two surfaces. The light-transmitting pressure plate 320 is located at the center of the connecting portion 310 to ensure a greater overlap between the light-transmitting area 311 of the light-transmitting pressure plate 320 and the hollowed-out area 311 of the connecting portion 310. The connecting portion 310 can be made of steel to ensure high strength, high hardness, and resistance to deformation. The connecting portion 310 can be roughly rectangular, with the long side of the rectangular plate extending along the second direction X.

[0137] In the present disclosure, for the fixation of the light-transmitting pressure plate 320 and the connecting part 310, in some embodiments, as shown in Figure 2, the pressurizing assembly 300 also includes a metal frame 330, and the metal frame 330 is located between the connecting part 310 and the light-transmitting pressure plate 320 (that is, the metal frame 330 is located on the side close to the first surface of the light-transmitting pressure plate 320), and the light-transmitting pressure plate 320 and the metal frame 330 can be fixed to the connecting part 310 by screws.

[0138] Among them, the metal frame 330 has a ring structure, and its positive projection on the transparent pressure plate 320 surrounds the transparent area AA on the transparent pressure plate 320. That is, when the laser irradiation device generates laser for irradiation, the metal frame 330 will not block the laser from passing through the transparent area AA of the transparent pressure plate 320.

[0139] In other embodiments, as shown in Figures 6 and 7, the pressurizing assembly 300 also includes a metal frame 330 and an elastic pad 340. The metal frame 330 and the elastic pad 340 are both located on the side of the light-transmitting pressure plate 320 away from the second surface 321 (that is, between the connecting portion 310 (not shown in the figure) and the light-transmitting pressure plate 320), and the metal frame 330 is located between the elastic pad 340 and the light-transmitting pressure plate 320. The metal frame 330 and the elastic pad 340 are both annular structures, and the orthographic projections of the metal frame 330 and the elastic pad 340 on the light-transmitting pressure plate 320 surround the light-transmitting area AA.

[0140] The elastic pad 340 may be a rubber pad with a certain degree of elasticity and compressibility. When the driving mechanism 400 drives the first and second substrates to generate a relative force, the light-transmitting pressure plate 320 may experience a slight lateral displacement in a direction perpendicular to the first direction Z due to issues such as the parallelism of the surface of the light-transmitting pressure plate 320 and possible tilting of the light-transmitting pressure plate 320 during assembly. The provision of the elastic pad 340 forms an elastic buffer between the light-transmitting pressure plate 320 and the connecting portion 310. When the driving mechanism 400 drives the first and second substrates to generate a relative force, the elastic deformation of the elastic pad 340 absorbs the lateral displacement of the light-transmitting pressure plate 320 in the second direction X and / or the third direction Y, thereby preventing relative displacement between the light-transmitting pressure plate 320 and the first substrate. This prevents friction between the light-transmitting pressure plate 320 and the first substrate, which could result in debris. Furthermore, the light-transmitting pressure plate 320, which could cause displacement of the first substrate and misalignment with the second substrate, is also avoided.

[0141] As for the fixation of the connecting portion 310, the transparent pressure plate 320, the metal frame 330 and the elastic pad 340 included in the pressure component 300, in some embodiments, as shown in FIG7 , the pressure component 300 further includes a first fixing bolt 350, a second fixing bolt 360 and a third fixing bolt 370, the transparent pressure plate 320 has a first countersunk hole located on the surface facing away from the metal frame 330 and passing through, the metal frame 330 has a first threaded hole located on the surface facing the transparent pressure plate 320, the center line of the first countersunk hole coincides with the center line of the first threaded hole, the first fixing bolt 350 passes through the first countersunk hole and is tightened in the first threaded hole; the metal frame The frame 330 has a second countersunk hole located on the surface facing the transparent pressure plate 320 and passing through it, the elastic pad 340 has a second threaded hole located on the surface facing the metal frame 330, the center line of the second countersunk hole coincides with the center line of the second threaded hole, the second fixing bolt 360 passes through the second countersunk hole and is tightened in the second threaded hole; the connecting part 310 has a third countersunk hole located on the surface facing away from the elastic pad 340 and passing through it, the elastic pad 340 has a third threaded hole located on the surface facing the connecting part 310, the center line of the third countersunk hole coincides with the center line of the third threaded hole, the third fixing bolt 370 passes through the third countersunk hole and is tightened in the third threaded hole.

[0142] Taking the outer contours of the light-transmitting pressing plate 320, the outer contours of the metal frame 330, the outer contours of the elastic pad 340, and the contours of the hollow area of ​​the connecting portion 310 as rectangular, optionally, as shown in FIG7 , the four corners of the light-transmitting pressing plate 320 each have two first countersunk holes, and the metal frame 330 accordingly has eight first threaded holes corresponding to the eight first countersunk holes on the light-transmitting pressing plate 320, so as to achieve a fixed connection between the light-transmitting pressing plate 320 and the metal frame 330 through eight first fixing bolts 350; the metal frame 330 0 has a second countersunk hole in the middle of each side, and correspondingly, the elastic pad 340 has four second threaded holes corresponding to the four second countersunk holes, so that the metal frame 330 and the elastic pad 340 can be fixedly connected by four second fixing bolts 360; each corner of the connecting portion 310 has a third countersunk hole, and correspondingly, the elastic pad 340 has four third threaded holes corresponding to the four third countersunk holes, so that the metal frame 330 and the elastic pad 340 can be fixedly connected by four third fixing bolts 350. At this time, the metal frame 330 and the elastic pad 340 can be fixedly connected by the second fixing bolts 360 first, the connecting portion 310 and the elastic pad 340 can be fixedly connected by the third fixing bolts 370, and then the light-transmitting pressure plate 320 and the metal frame 330 can be fixedly connected by the first fixing bolts 350.

[0143] In other embodiments, as shown in Figure 8, the pressure assembly 300 also includes a fourth fixing bolt 390 and a locking nut 309, one end of the locking nut 309 is a threaded hole end, and the other end of the locking nut 309 is a threaded end; the transparent pressure plate 320 has a fourth countersunk hole located on the surface facing away from the metal frame 330 and passing through, the metal frame 330 has a first through hole, the elastic pad 340 has a second through hole, and the connecting part 310 (not shown in the figure) has a fourth threaded hole located on the surface facing the elastic pad 340, and the center lines of the first countersunk hole, the first through hole, the second through hole, and the fourth threaded hole coincide; the threaded end of the locking nut 309 is screwed into the fourth threaded hole of the connecting part 310, and the threaded hole end of the locking nut 309 passes through the second through hole and the first through hole in sequence, and extends into the small diameter end of the fourth countersunk hole, and the fourth fixing bolt 390 extends into the fourth countersunk hole and is tightened on the threaded hole end of the locking nut 309.

[0144] Taking the example that the outer contour of the light-transmitting pressure plate 320, the outer contour of the metal frame 330, the outer contour of the elastic pad 340, and the contour of the hollow area of ​​the connecting part 310 are all rectangular, optionally, as shown in Figure 8, the four corners of the light-transmitting pressure plate 320 all have fourth countersunk holes, and accordingly, the metal frame 330 has four first through holes corresponding one-to-one to the four fourth countersunk holes on the light-transmitting pressure plate 320, the elastic pad 340 has four second through holes corresponding one-to-one to the four fourth countersunk holes, and the connecting part 310 has four fourth threaded holes corresponding one-to-one to the four fourth countersunk holes, so as to realize the fixed connection of the connecting part 310, the light-transmitting pressure plate 320, the metal frame 330 and the elastic pad 340 through four fourth fixing bolts 390 and four locking nuts 309. At this time, the locking nut 309 can be fixed on the connecting part 310 first, and then the elastic pad 340, metal frame 330, and transparent pressure plate 320 can be put on the locking nut 309 in sequence, and then the fourth fixing bolt 390 can be pressed on the transparent pressure plate 320 and fixedly connected to the locking nut 309.

[0145] In addition, as shown in Figure 8, the pressure component 30 also includes a washer 308, which is mounted on the fourth fixing bolt 390 and is limited by the screw head of the fourth fixing bolt 390 in the fourth countersunk hole of the transparent pressure plate 320 to provide an elastic margin through the washer 308, thereby achieving elastic buffering when the pressure component 30 is fixed.

[0146] Compared with the second fixing method mentioned above, the first fixing method can independently realize the fixed connection of any two adjacent structural members, thereby reducing the processing accuracy of the countersunk holes or threaded holes on each structural member. At the same time, compared with the second fixing method in which the locking nut 309 passes through the first through hole and the second through hole, it can avoid the shaking of the metal frame 330 and the elastic pad 340 caused by processing errors, thereby ensuring the stability of the fixed connection of the connecting part 310, the transparent pressure plate 320, the metal frame 330 and the elastic pad 340.

[0147] In the present disclosure, for the transparent pressure plate 320 included in the pressurizing component 300, combined with the transfer process of the light-emitting chip described above, in order to realize the integrated operation of the light-emitting chip in mass transfer, the transparent pressure plate 320 needs to have pressure-bearing performance during pressurization and light-transmitting performance during laser dissociation, and also needs to ensure the normal separation of the first substrate and the second substrate.

[0148] In some embodiments, as shown in Figure 9, the transparent pressure plate 320 includes a first surface (not shown in the figure) and a second surface 321 parallel to each other, and the first surface and the second surface 321 both extend along a plane, and the transparent pressure plate 320 allows the laser of the target wavelength to pass through in the first direction Z from the first surface to the second surface 321; the transparent pressure plate 320 is used to transfer the light-emitting chip attached to the first substrate to the second substrate under the action of pressure and the action of the laser of the target wavelength, wherein the first substrate is located on the side of the transparent pressure plate 320 close to the second surface 321, and allows the laser of the target wavelength to pass through in the first direction Z, the first substrate and the second substrate are located on the same side of the transparent pressure plate 320, and the first substrate is closer to the transparent pressure plate 320 than the second substrate.

[0149] In this way, the feasibility of bearing pressure is achieved through the transparent pressure plate 320, and since the transparent pressure plate 320 can transmit the laser of the target wavelength in the first direction Z, the feasibility of laser irradiation is achieved, thereby achieving the feasibility of integrating pressurization and laser irradiation, which facilitates the simplification of the process of mass transfer of light-emitting chips and improves production efficiency.

[0150] For example, the light transmittance of the light-transmitting plate 320 for laser light of the target wavelength is greater than or equal to 80%. Furthermore, the light transmittance of the light-transmitting plate 320 for laser light of the target wavelength is greater than or equal to 90%. Even more so, the light transmittance of the light-transmitting plate 320 for laser light of the target wavelength is greater than or equal to 92%. This ensures that the light-transmitting plate 320 has a good light transmittance effect for laser light of the target wavelength, thereby ensuring the effect of the laser light-transmitting area AA generated by the laser irradiation device during laser dissociation, and further ensuring the dissociation effect of the light-emitting chip on the first substrate when the laser irradiates the first substrate.

[0151] To ensure that the light transmittance of the target wavelength laser beam through the light-transmitting plate 320 is greater than 92%, a lens body (double-flat mirror structure) with a transmittance greater than 92% can be directly selected as the light-transmitting plate 320. Alternatively, a lens body with an anti-reflection coating attached to its surface can be selected as the light-transmitting plate 320. Typically, after the anti-reflection coating is attached to the lens body, the transmittance can reach as high as 99%.

[0152] For example, the target wavelength may be in the range of 390 nm to 780 nm, such as visible light; or in the range of 780 nm to 2000 nm, such as infrared light; or in the range of 100 nm to 390 nm, such as ultraviolet light. Specifically, the target wavelength may be in one of the following ranges: 770 nm to 622 nm (red light), 622 nm to 597 nm (orange light), 597 nm to 577 nm (yellow light), 577 nm to 492 nm (green light), 492 nm to 450 nm (cyan light), 450 nm to 435 nm (blue light), or 455 nm to 350 nm (violet light). More specifically, the target wavelength is 355 nm.

[0153] Among them, the lens body can be roughly a rectangular parallelepiped, a cube, a polygonal prism or a cylinder, etc. The material of the lens body (that is, the material of the light-transmitting pressure plate) can be a glass product (such as fused quartz glass, synthetic quartz glass, natural quartz glass), crystalline or amorphous inorganic non-metal, etc., and it only needs to meet the requirements of light transmittance, pressure bearing performance (withstanding pressure greater than or equal to 0.5 MPa) and high temperature resistance (withstanding temperature greater than or equal to 150°C). For example, the material of the lens body is silicon dioxide. For example, the material of the lens body is magnesia quartz glass. For example, the material of the lens body can be JGS1 quartz glass to ensure the high transmittance of the light-transmitting pressure plate 320 to the laser of the target wavelength (such as 355nm), while achieving the low cost of the light-transmitting pressure plate 320. JGS1 quartz glass is made by melting synthetic stone and a high-purity oxyhydrogen flame. Due to its high hydroxyl content (approximately 2000 ppm), it exhibits excellent light transmittance, particularly in the short-wave ultraviolet (UV) band, where it far surpasses all other types of glass, with a UV transmittance exceeding 90% at 185 nm. For example, the lens body can be made of JGS2 or JGS3 quartz glass. For example, the lens body can be made of Corning 7978, 7979, or 7980 quartz glass.

[0154] In the case where the light-transmitting pressure plate 320 only includes the lens body, when the laser passes through the lens body, the damage threshold of the lens body is relatively high, thereby preventing the heat from accumulating on the surface of the lens body and causing damage to the lens body. In the case where the light-transmitting pressure plate 320 includes the lens body and the anti-reflection film, the first surface and / or the second surface 321 of the lens body has the anti-reflection film; in addition, when the laser passes through the anti-reflection film, heat will accumulate on the anti-reflection film. In this case, in order to avoid damage to the anti-reflection film caused by the accumulated heat, a damage threshold greater than or equal to 7.5 J / cm can be set on the surface of the lens body. 2 For example, the damage threshold of the antireflection coating is 7.5J / cm 2 , 8J / cm 2 , 8.5J / cm2 , 9J / cm 2 wait.

[0155] It should be noted that, for the case where the light-transmitting pressing plate 320 is a lens body, taking the thickness of the light-transmitting pressing plate 320 as 10 mm as an example, a light transmittance test is performed, and the test data are shown in the following table.

[0156] From the test data shown in the above table, it can be seen that the average light loss of the light-transmitting pressing plate 320 with a thickness of 10 mm is 7.37%, which ensures that the light transmittance of the light-transmitting pressing plate 320 is greater than 92%.

[0157] In the present disclosure, when the laser light generated by the laser irradiation device irradiates the light-transmitting pressure plate 320, the laser light that passes perpendicularly through the light-transmitting area AA does not refract, and the optical path of the laser light remains unchanged, thus preventing the position of the laser light spot on the first substrate from shifting. However, the laser light that passes obliquely through the light-transmitting area AA (i.e., not parallel to the first direction Z) does refract, increasing the optical path of the laser light and causing the laser light spot on the first substrate to shift. When the amount of shift in the laser light spot on the first substrate is large, especially in the aforementioned laser irradiation where one dot corresponds to one light-emitting chip, some light-emitting chips may not be effectively peeled or dissociated from the first substrate.

[0158] Among them, when the laser irradiates the transparent pressure plate 320 from a vacuum environment, according to Snell's law, the relationship between the incident angle, the refraction angle and the refractive index of the two media can be expressed as: n1*sinθ1=n2*sinθ2. Among them, n1 and θ1 refer to the refractive index and incident angle of the laser in a vacuum environment, respectively, and n2 and θ2 refer to the refractive index and refraction angle of the laser in the transparent pressure plate 320, respectively. Since n1 takes a constant of 1, the refractive angle of the laser can be determined by combining the refractive index n2 of the laser in the transparent pressure plate 320 and the incident angle of the laser, and then the offset of the light spot formed by the laser irradiation on the first substrate can be calculated according to the following formula in combination with Figure 10. ΔL=(tanθ1-tanθ2) / D

[0159] In the above formula, ΔL refers to the offset of the light spot on the first substrate, θ1 refers to the incident angle of the laser, θ2 refers to the refraction angle of the laser, and D refers to the thickness of the transparent pressure plate 320 (i.e., the thickness of the transparent area AA of the transparent pressure plate 320).

[0160] Based on the above, it can be seen that the factors affecting the offset of the light spot on the first substrate include at least the refractive index of the laser in the transparent pressure plate 320 and the thickness of the transparent pressure plate 320. The greater the refractive index of the laser in the transparent pressure plate 320, the smaller the refraction angle, which in turn leads to a greater offset of the light spot, and the greater the thickness of the transparent pressure plate 320, the greater the offset of the light spot.

[0161] Regarding the refractive index of the laser light in the light-transmitting platen 320, for a given medium, the refractive index of the laser light is n = c / v. While the laser propagation frequency is a fixed value, the laser propagation velocity is v = f*λ. Substituting this into the above refractive index equation, the refractive index of the laser light is n = c / (f*λ). Therefore, when the laser light enters the light-transmitting platen 320 from a vacuum medium, the relationship between the refractive index and wavelength in two different media, for oblique transmission of the laser light, is n1 / n2 = λ2 / λ1.

[0162] Among them, n, v, and λ refer to the refractive index, propagation speed, and wavelength of the laser in the same medium, respectively; c refers to the propagation speed of the laser in a vacuum; f refers to the propagation frequency of the laser; n1 and λ1 refer to the refractive index and wavelength of the laser in the vacuum medium, respectively; n2 and λ2 refer to the refractive index and wavelength of the laser in the transparent pressure plate 320, respectively.

[0163] It can be seen from this that there is a certain relationship between the wavelength of the laser and the refractive index of the propagation medium (transparent platen 320), that is, the shorter the wavelength of the laser, the greater the refractive index of the laser in the transparent platen 320. For example, combined with the aforementioned situation that the larger the refractive index, the greater the offset of the light spot, combined with the minimum thickness of the transparent platen 320 involved in the present disclosure, it is necessary to select a double flat mirror structure with a refractive index of less than 1.6 for a laser with a wavelength of 355nm. In other words, the refractive index of the transparent platen 320 involved in the present disclosure for a laser with a wavelength of 355nm is less than 1.6 (that is, the refractive index of the transparent platen 320 is within the range of (1, 1.6)). This is to avoid the situation where the wavelength of the laser is short and the offset of the light spot on the first substrate is large. When the refractive index of the transparent platen 320 is greater than or equal to 1.6, the offset of the light spot irradiated by the laser on the first substrate is large, which can easily affect the peeling or dissociation effect of the light-emitting chip on the first substrate.

[0164] Preferably, the refractive index of the light-transmitting pressing plate 320 for a laser beam having a wavelength of 355 nm is within the range of (1, 1.46) to further ensure the peeling or dissociation effect of the light-emitting chip on the first substrate. For example, the refractive index of the light-transmitting pressing plate 320 for a laser beam having a wavelength of 355 nm can be 1.1, 1.2, 1.3, 1.4, etc.

[0165] Regarding the thickness of the light-transmitting press plate 320, as the thickness of the light-transmitting press plate 320 increases, the size of the light spot on the first substrate will also change. For example, for the case where the incident angle is 0.705 and the refractive index is 1.45, combined with light-transmitting press plates 320 of different thicknesses, the size change of the light spot on the first substrate and the expected size of the light spot are shown in the following table.

[0166] As can be seen from the table above, the light spot on the first substrate increases in size as the transparent platen 320 becomes thicker. A binary fit between the thickness of the transparent platen 320 and the estimated light spot size yields an approximately linear relationship. Furthermore, considering the aforementioned observation that the thicker the transparent platen 320, the greater the light spot offset, the thickness of the transparent platen 320 can be set to be less than or equal to 35 mm. In other words, the distance between the first and second surfaces 321 of the transparent platen 320 can be set to be less than or equal to 35 mm. Preferably, the thickness of the transparent platen 320 can be set to be less than or equal to 20 mm to minimize the light spot offset on the first substrate.

[0167] In addition, as the thickness of the transparent pressure plate 320 decreases, the structural strength of the transparent pressure plate 320 will become smaller and the pressure-bearing capacity will become weaker. Therefore, in order to ensure that the transparent pressure plate 320 has a certain structural strength and thus ensure that it has a certain pressure-bearing performance, the thickness of the transparent pressure plate 320 can be set to be greater than or equal to 8 mm (that is, the distance between the first surface and the second surface 321 of the transparent pressure plate 320 is greater than or equal to 8 mm) to avoid the transparent pressure plate 320 from being damaged due to extrusion when the first substrate contacts the second substrate and generates an interaction force.

[0168] In combination with the above, the thickness of the transparent pressing plate 320 is greater than or equal to 8 mm and less than or equal to 35 mm (i.e., the distance between the first surface and the second surface 321 of the transparent pressing plate 320 is within the range of [8 mm, 35 mm]). This ensures the pressure-bearing capacity of the transparent pressing plate 320 and avoids the situation where the light spot on the first substrate is offset and the light-emitting chip cannot be effectively separated due to the excessive thickness of the transparent pressing plate 320. For example, the thickness of the transparent pressing plate 320 can be set to 8 mm, 12 mm, 16 mm, 20 mm, etc.

[0169] In the present disclosure, when the laser irradiates the first substrate, it is found that the peeling or dissociation effect of some light-emitting chips on the first substrate is not ideal. After careful and detailed research, the inventor found that the energy distribution in the area where each light spot is located in the partial light spot formed by the laser on the first substrate is not uniform, which leads to the dissociation glue in some areas of the first substrate not being effectively dissociated, thereby causing the peeling or dissociation effect of some light-emitting chips to be unsatisfactory.

[0170] For light-transmitting platens 320 of varying thickness, the inventors, based on experimental data, found that the thickness of the light-transmitting platen 320 only affects laser transmission from a geometrical optical perspective and does not affect the uniformity of individual light spots on the first substrate. After careful and detailed research, the inventors discovered that the parallelism of the light-transmitting area AA on the light-transmitting platen 320 and the inclusions within the light-transmitting area AA may affect the uniformity of the light spot on the first substrate.

[0171] Regarding the parallelism of the surface of the light-transmitting area AA, when the laser passes through the light-transmitting area AA of the light-transmitting pressure plate 320, the first surface and the second surface 321 of the light-transmitting pressure plate 320 in the light-transmitting area AA are not strictly flat surfaces, which causes reflection and refraction of the laser, thereby resulting in uneven light spots formed on the first substrate, and further resulting in poor peeling or dissociation effects of the light-emitting chip on the first substrate.

[0172] The first and second surfaces 321 of the light-transmitting pressure plate 320 are both planar, and the parallelism of the first and second surfaces 321 in the light-transmitting area AA is less than or equal to 0.006 mm. For example, the parallelism of the first and second surfaces 321 in the light-transmitting area AA is 0.004 mm, 0.005 mm, and 0.006 mm. Of course, the parallelism of the first and second surfaces 321 in the light-transmitting area AA can also be slightly greater than 0.006 mm, as long as the uniformity of the light spot formed on the first substrate is guaranteed and uneven laser energy distribution within the area where the light spot is formed is avoided.

[0173] Preferably, the parallelism of the first surface and the second surface 321 in the light transmission area AA is less than or equal to 0.003 mm. For example, the parallelism of the first surface and the second surface 321 in the light transmission area AA is 0.002 mm, 0.0025 mm, and 0.003 mm.

[0174] In addition, when the first surface and the second surface 321 of the transparent pressure plate 320 are both planes, not only can the uniformity of the light spot on the first substrate be guaranteed, but also the uniformity of the force applied by the transparent pressure plate 320 on the first substrate can be guaranteed, thereby ensuring that all light-emitting chips on the first substrate can be effectively bonded to the second substrate.

[0175] Inclusions in the light-transmitting area AA, such as tiny bubbles and impurities, within the light-transmitting platen 320 can also cause reflection and refraction of the laser light, leading to uneven light spot formation on the first substrate. Therefore, the particle size of the inclusions within the light-transmitting platen 320 can be set to less than 0.1 mm to minimize the effect of the inclusions on reflection and refraction of the laser light, thereby ensuring uniform light spot formation on the first substrate.

[0176] For example, the particle size of the inclusions in the transparent pressing plate 320 is 0.04 mm, 0.06 mm, 0.08 mm, 0.1 mm, etc. Of course, the particle size of the inclusions in the transparent pressing plate 320 can also be slightly larger than 0.1 mm, such as 0.11 mm, as long as it does not affect the uniformity of the light spot formed on the first substrate.

[0177] It should be noted that the transmittance, refractive index, thickness, surface parallelism, inclusions, etc. of the transparent pressure plate 320 mentioned above in this disclosure are all explained based on the transparent area on the transparent pressure plate 320 for transmitting laser light of the target wavelength.

[0178] In addition, in the present disclosure, the refractive index, thickness, surface parallelism, inclusions, etc. of the light-transmitting press plate 320 described above are combined to ensure the optical effect of the light-transmitting press plate 320 .

[0179] Optionally, after the light-transmitting pressing plate 320 transmits the laser within the range of an incident angle less than or equal to 14 degrees, the light spot offset is less than or equal to 0.5 mm. Furthermore, after the light-transmitting pressing plate 320 transmits the laser within the range of an incident angle less than or equal to 14 degrees, the light spot offset is less than or equal to 200 μm. In this way, after the laser of the target wavelength passes through the light-transmitting area of ​​the light-transmitting pressing plate and forms a light spot on the first substrate, the light spot is prevented from being unable to effectively dissociate the dissociation glue between the first substrate and the light-emitting chip due to a large offset, thereby ensuring the dissociation effect of a large number of light-emitting chips on the first substrate.

[0180] It should be noted that the above-mentioned spot offset can be the test result when a laser with a wavelength of 355nm is transmitted through the light-transmitting area AA on the light-transmitting pressure plate 320 and forms a light spot of 132μm*132μm; of course, it can also be the test result when a laser with other wavelengths is transmitted through the light-transmitting area AA on the light-transmitting pressure plate 320 and forms a light spot of other sizes.

[0181] Optionally, after the light-transmitting pressing plate 320 transmits the laser within the laser width of Amm×Bmm, the degradation of the laser spot uniformity does not exceed 2%, and both A and B are less than or equal to 70. In this way, by setting the area size of the laser width on the light-transmitting pressing plate 320, the uniformity of the laser spot in the area corresponding to the entire laser width is ensured, that is, the uniformity of the laser energy in the area corresponding to the entire laser width is ensured, so as to avoid the situation where the light-emitting chip in the local area on the first substrate fails to be effectively dissociated, thereby facilitating the improvement of the transfer yield of the light-emitting chip. For example, the size of the laser width on the light-transmitting pressing plate 320 is 70mm×70mm, 60mm×70mm, 50mm×70mm, 60mm×60mm, etc.

[0182] For example, in an area with a laser width of 70mm×70mm, when the size of the incident laser light plate is a square with a side length of 6mm and the size of the outgoing laser spot is a square with a side length of 137.5μm, the uniformity of the laser spot is 82% before the transparent pressure plate 320 is added, and the uniformity of the laser spot is 83.5 after the 10mm thick transparent pressure plate 320 is added. Therefore, the uniformity of the laser spot is effectively improved by adding the transparent pressure plate 320, and the dissociation effect of the light-emitting chip on the first substrate is ensured. In the case of adding the transparent pressure plate 320, when the laser passes through the transparent area AA of the transparent pressure plate 320, the inclusions in the transparent area AA on the transparent pressure plate 320 can adjust the refraction angle of the laser beam to improve the uniformity of the laser light plate. For example, the inclusions of the transparent pressure plate 320 can be one or more of bubbles, scattering particles (such as silica particles, etc.), etc. Thus, when preparing the light-transmitting press plate 320 , evenly distributed inclusions may be added to the light-transmitting area AA of the light-transmitting press plate 320 , thereby effectively improving the uniformity of the laser light plate.

[0183] Optionally, after the light-transmitting plate 320 transmits laser light within an incident angle range of 14 degrees or less, the uniformity of the laser spot is equal to or better than the uniformity of the laser spot before the incident light. This ensures the uniformity of the laser spot, and thus the uniformity of the laser energy within the region where the laser spot is located, ensuring that the light-emitting chips within the region where the laser spot is located can be effectively dissociated, thereby facilitating the improvement of the transfer yield of the light-emitting chips. As can be seen from the above example, after a laser with a wavelength of 355nm is transmitted through the light-transmitting area AA of the light-transmitting plate 320 after 10mm, the uniformity of the laser spot is optimized.

[0184] In the present disclosure, when the driving mechanism 400 drives the light-transmitting pressure plate 320 to bring the first substrate into contact with the second substrate and generate an interaction force, the first substrate and the second substrate can be directly placed in alignment, and then the driving mechanism 400 applies pressure to the first substrate during the movement of the light-transmitting pressure plate 320 to generate an interaction force between the first and second substrates. Alternatively, the first substrate can be first fixed to the second surface 321 of the light-transmitting pressure plate 320, and then the driving mechanism 400 applies pressure to the first substrate during the movement of the light-transmitting pressure plate 320 to achieve contact between the first and second substrates and generate an interaction force.

[0185] In the case where the first substrate is fixed to the second surface 321 of the light-transmitting platen 320, the first substrate can be adhered to the second surface 321 of the light-transmitting platen 320 using a release adhesive that is easy to peel, or can be fixed to the second surface of the light-transmitting platen 320 by adsorption. The structure of the light-transmitting platen 320 will be explained below using the method of fixing the first substrate by adsorption.

[0186] As shown in Figures 9 and 11 , the light-transmitting platen 320 includes a light-transmitting area AA and a peripheral area BB, with the peripheral area BB surrounding the light-transmitting area AA. A first gas passage (not shown) is provided within the peripheral area BB. The first gas passage has first suction ports 323 extending to the second surface 321. The first suction ports 323 are distributed around the light-transmitting area AA. Furthermore, the first gas passage has first exhaust ports 322 extending to the first surface and / or sidewalls of the light-transmitting platen 320. The first exhaust ports 322 are configured to connect to an exhaust device to facilitate suction and fixation of the first substrate via the first suction ports 323.

[0187] Thus, by setting a first gas passage in the peripheral area BB of the transparent pressure plate 320 to form a first adsorption port 323 on the second surface 321, while ensuring stable adsorption of the first substrate, the laser is prevented from being affected and the spot effect of the laser passing through the transparent area AA is ensured.

[0188] For example, in combination with the thickness of the light-transmitting pressure plate 320 described above, taking the thickness of the light-transmitting pressure plate 320 as 8 mm, and the first air exhaust port 322 being located on the side wall of the light-transmitting pressure plate 320 as an example, the first air exhaust port 322 is provided with a 7 mm straight-through connector 380 so that it can be directly connected to the air exhaust device while ensuring the structural strength of the light-transmitting pressure plate 320.

[0189] In the embodiment of the present disclosure, when the transparent pressure plate 320 adsorbs the first substrate, in order to ensure that the first substrate and the second substrate are effectively separated, it is necessary to ensure that the adsorption force of the transparent pressure plate 320 on the first substrate is greater than the molecular force between the first substrate and the second substrate.

[0190] When the light-transmitting pressing plate 320 adsorbs the first substrate, the first substrate may be fixed by negative pressure adsorption. For example, the first substrate may be fixed by vacuum adsorption.

[0191] Typically, the first substrate is adsorbed on the transparent pressing plate 320 along the first direction Z (i.e., the vertical direction). At this time, the adsorption force of the transparent pressing plate 320 on the first substrate can be calculated by the following formula: F = 0.1 x A x P / S;

[0192] In the above formula, F refers to the adsorption force of the transparent pressure plate 320 on the first substrate, and the unit is Newton. A refers to the effective adsorption area of ​​the first adsorption port 323 on the second surface 321, and the unit is cm. 2 , P refers to the vacuum degree of the gas passage when the transparent pressure plate 320 adsorbs the first substrate, and the unit is kPa. S refers to the safety factor, and S is greater than or equal to 2.

[0193] Combined with the above formula, it can be seen that the adsorption force of the transparent pressure plate 320 on the first substrate changes positively with the vacuum degree and the safety factor, that is, as the vacuum degree increases or the safety factor increases, the adsorption force will increase. In conventional use, the vacuum degree of the transparent pressure plate 320 adsorbing the first substrate is greater than or equal to 80kPa, so the minimum adsorption force of the transparent pressure plate 320 on the first substrate is 4A (in Newtons). Combined with the experimental data, it can be seen that the molecular force between the first substrate and the second substrate is usually greater than or equal to 1 Newton and less than or equal to 5 Newtons. In this way, in order to ensure that the adsorption force of the transparent pressure plate 320 on the first substrate is greater than the molecular force between the first substrate and the second substrate, that is, 4A is greater than 5 Newtons, it can be obtained that A is greater than 1.25cm 2 , that is, the effective adsorption area of ​​the first adsorption port 323 on the second surface 321 is greater than 1.25 cm 2 .

[0194] It should be noted that when the transparent pressing plate 320 adsorbs the first substrate, if the vacuum degree is less than 80 kPa, the effective adsorption area of ​​the first adsorption port 323 on the second surface 321 of the transparent pressing plate 320 may also be less than or equal to 1.25 cm 2 , as long as the first substrate and the second substrate can be separated normally after the transparent pressure plate 320 adsorbs the first substrate. In addition, if the molecular force between the first substrate and the second substrate is less than 5 Newtons, the effective adsorption area of ​​the first adsorption port 323 on the second surface 321 of the transparent pressure plate 320 can also be less than or equal to 1.25 cm 2 , this disclosure does not limit this embodiment.

[0195] In some embodiments, as shown in Figure 11, the transparent pressure plate 320 includes a contour surface 326 located between the first surface and the second surface 321, and the first gas passage includes an annular groove 324 and an air vent 327. The notch of the annular groove 324 is located on the second surface 321 and forms a first adsorption port 323. One end of the air vent 327 is connected to the annular groove 324, and the port at the other end of the air vent 327 is located on the contour surface 326 and forms a first exhaust port 322. The first exhaust port 322 is used to connect to the exhaust device.

[0196] The annular groove 324 may be a square, rectangular, or circular groove, and this disclosure does not limit this. Specifically, the shape of the annular groove 324 can be determined based on the outer contour of the light-transmitting area AA, as long as it can stably adsorb and secure the first substrate and does not affect the transmission of laser light through the light-transmitting area AA. The outer contour of the light-transmitting area AA can be designed in conjunction with the outer contour of the light-emitting chip on the first substrate to ensure that the laser light-transmitting area AA can effectively dissociate the dissociation adhesive that adheres the light-emitting chip.

[0197] For example, the outer contour of all the light-emitting chips on the first substrate is a square. At this time, the outer contour of the light-transmitting area AA on the light-transmitting pressure plate 320 can be designed to be a square, and then the annular groove 324 is set as a square annular groove, so as to ensure that it can be stably adsorbed and fixed on the first substrate, while reducing the size of the light-transmitting pressure plate 320.

[0198] Optionally, the annular groove 324 is a square groove, and the inner ring of the square groove has a side length greater than or equal to 75 mm and less than or equal to 80 mm. For example, the side lengths of the annular groove 324 are 75 mm, 77 mm, 79 mm, and 80 mm. This ensures that a sufficiently large laser width can be designed on the light-transmitting pressure plate 320 as the light-transmitting area AA, thereby ensuring that the laser spot formed on the first substrate in the light-transmitting area AA can completely cover the dissociation adhesive that secures the light-emitting chip.

[0199] The effective adsorption area of ​​the first adsorption opening 323 on the second surface 321 of the transparent pressure plate 320 is greater than 1.25 cm 2 In this case, the width of the square annular groove can be set to be greater than or equal to 0.42 mm. For example, the width of the square annular groove is 0.5 mm, 1.0 mm, 1.5 mm, or 2.0 mm.

[0200] Furthermore, the width of the annular groove 324 can be set to be less than or equal to 1 mm. For example, the width of the annular groove 324 is 0.42 mm, 0.62 mm, 0.82 mm, or 1.0 mm. This ensures the stability of the first adsorption port 323 of the square annular groove adsorbing the first substrate while avoiding the problem of the light-transmitting pressure plate 320 being too large.

[0201] In a specific embodiment, as shown in Figures 12 and 13, the transparent pressure plate 320 is a cube with a side length of 100 mm and a thickness of 10 mm. The annular groove 324 on the second surface 321 of the transparent pressure plate 320 is a square annular groove, and the inner ring side length of the square annular groove is 78 mm, the outer ring side length is 82 mm, the groove width of the annular groove is 2 mm, and the groove depth is 6 mm.

[0202] The annular groove 324 can be directly processed on the second surface 321 of the transparent pressing plate 320 , and a vent hole 327 communicating with the annular groove 324 is provided on the contour surface 326 of the transparent pressing plate 320 to obtain the first air extraction port 322 .

[0203] In other embodiments, as shown in Figure 9, the outer contour of the transparent pressure plate 320 is rectangular; the transparent pressure plate 320 includes four sub-contour surfaces 3261 located between the first surface and the second surface 321, and the first gas passage includes four air channels 328 and four groups of air holes 325, and the four sub-contour surfaces 3261, the four air channels 328, and the four groups of air holes 325 correspond to each other one by one; one air channel 328 is located between a corresponding sub-contour surface 3261 and the transparent area AA, one end of the air hole 325 in a group of air holes 325 is connected to the corresponding air channel 328, and the other end is located on the second surface 321, and forms a first adsorption port 323; one air channel 328 extends to two sub-contour surfaces 3261 adjacent to the corresponding sub-contour surface 3261, and forms a pair of orifices on the two adjacent sub-contour surfaces 3261, at least one orifice in the four pairs of orifices forms a first exhaust port 322, and is used to connect to the exhaust device, and the remaining orifices are sealed.

[0204] In this way, the first adsorption port 323 is formed by the openings of multiple groups of air holes 325, which avoids the situation where the entire first adsorption port 323 is depressurized due to the pressure release of some air holes 325 when the transparent pressure plate 320 adsorbs the first substrate, thereby improving the stability of the adsorption of the first substrate.

[0205] Optionally, the four air passages 328 are located in a common plane and interconnected. In this case, one of the four pairs of openings can be configured to form the first air extraction opening 322, while the remaining openings are sealed. This reduces the number of first air extraction openings 322 and, consequently, the number of air extraction devices. The air passages 328 extend in a straight line parallel to the plane of the corresponding sub-contour surface 3261.

[0206] The opening shape of the air holes 325 can be square, rectangular, circular, elliptical, or the like. For example, if the light-transmitting area AA is rectangular, the opening shape of the air holes 325 can be elliptical, with the major axis of the ellipse parallel to the side closest to the light-transmitting area AA. This ensures that each air hole 325 maintains sufficient adsorption strength on the first substrate while reducing the size of the light-transmitting pressure plate 320.

[0207] Optionally, the opening area of ​​the vent hole 325 is greater than or equal to 0.785 mm 2 and less than or equal to 7.065mm 2 For example, the opening area of ​​the vent hole 325 is 0.785 mm 2 , 0.1mm 2 , 1mm 2 , 3mm 2 , 5mm 2 , 7.065mm 2 wait.

[0208] The effective adsorption area of ​​the first adsorption opening 323 on the second surface 321 of the transparent pressure plate 320 is greater than 1.25 cm 2 At this time, the number of the ventilation holes 325 provided on the second surface 321 of the transparent pressure plate 320 can be determined according to the minimum effective adsorption cotton and the opening area of ​​the ventilation holes 325. For example, the opening diameter of the ventilation holes 325 is 1mm, and the opening area is 3.14mm. 2 , and further determine that the number of ventilation holes 325 is at least 40.

[0209] Optionally, the spacing between two adjacent air holes 325 (the spacing between the center points of the air holes 325) is greater than or equal to 3 mm. This ensures the structural strength of the light-transmitting plate 320 after the air holes 325 are provided on the second surface 321 of the light-transmitting plate 320, and prevents the light-transmitting plate 320 from being easily compressed due to a small spacing between two adjacent air holes 325. For example, the spacing between two adjacent air holes 325 is 3 mm, 4 mm, 5 mm, etc.

[0210] Furthermore, the spacing between two adjacent air holes 325 is less than or equal to 6 mm. This ensures that a large number of air holes 325 are provided on the second surface 321 of the light-transmitting pressing plate 320, thereby ensuring that the second surface 321 of the light-transmitting pressing plate 320 has a sufficient effective adsorption area. For example, if the spacing between two adjacent air holes 325 is 4 mm, the second surface 321 of the light-transmitting pressing plate 320 has 76 air holes 325, ensuring that the light-transmitting pressing plate 320 firmly adheres to the first substrate.

[0211] In one embodiment, as shown in FIG14 , the transparent pressing plate 320 is a cube with a side length of 100 mm (thickness of 10 mm), and the diameter of the air holes on the second surface 321 of the transparent pressing plate 320 is 1 mm (i.e., the opening area is 3.14 mm). 2 ), the spacing between two adjacent air holes 325 is 4 mm. In addition, the light-transmitting pressing plate 320 also has 8 evenly distributed and penetrating step holes, the diameter of the large diameter end of the step hole is 5.5 mm, and the diameter of the small diameter end is 2.9 mm.

[0212] Among them, multiple air holes 325 can be directly processed on the second surface 321 of the transparent pressure plate 320, and at the same time, an air duct 328 connecting a row of air holes 325 is set on the sub-contour surface 3261 of the transparent pressure plate 320 along the arrangement direction of the multiple air holes 325 to obtain four air ducts 328 located on four sub-contour surfaces and connected to each other, and then an opening of an air duct 328 is reserved as the first exhaust port 322, and a sealing plug is used to seal the openings of the remaining air ducts 328.

[0213] The present disclosure provides a method for transferring a luminescent chip, the method comprising:

[0214] Transferring the light-emitting chip from the source substrate to the intermediate substrate, and then from the intermediate substrate to the display substrate;

[0215] In which, the light-emitting chip transfer equipment described in the above embodiment is used to transfer the light-emitting chip from the source substrate to the intermediate substrate, the first substrate is the source substrate, and the second substrate is the intermediate substrate; and / or the light-emitting chip transfer equipment described in the above embodiment is used to transfer the light-emitting chip from the intermediate substrate to the display substrate, the first substrate is the intermediate substrate, and the second substrate is the display substrate.

[0216] The present disclosure provides another method for transferring a luminescent chip, the method comprising:

[0217] The light-emitting chip transfer device described in the above embodiment is used to heat, pressurize, and irradiate the first substrate and the second substrate on the heating and pressurizing device. The first substrate allows the laser of the target wavelength to pass in the first direction. The light-emitting chip is initially located on the first substrate:

[0218] Among them, the driving mechanism drives the pressure component to move toward the supporting platform and apply pressure, so that the first substrate and the second substrate contact and generate an interaction force; the heating component heats the second substrate supported on the supporting platform; the laser generated by the laser irradiation device passes through the light-transmitting area of ​​the light-transmitting pressure plate to irradiate the first substrate and the second substrate with laser, so that the light-emitting chip on the first substrate is transferred to the second substrate.

[0219] In a specific embodiment, the light-emitting chip is located on one side of the first substrate, and a first adhesive layer that is sensitive to laser light of a specific wavelength (i.e., a peeling adhesive that can be peeled off by laser light of a specific wavelength, or a dissociating adhesive that dissociates) is provided between the first substrate and the light-emitting chip; when the chip is transferred, the second substrate is arranged opposite to the first substrate, wherein the side of the second substrate facing the first substrate includes a second adhesive layer that is sensitive to a specific temperature (i.e., an adhesive layer that is glued after being heated to a certain temperature). After the first substrate and the second substrate are in contact and generate an interaction force, when the laser sequentially passes through the light-transmitting pressure plate and the first substrate to act on the first adhesive layer at the target position, the viscosity of the first adhesive becomes weaker, making it easier for the light-emitting chip at the target position to be adhered to the second adhesive layer, thereby achieving the transfer of the light-emitting chip from the first substrate to the second substrate. Heating, pressurizing and laser irradiation are carried out simultaneously, which is conducive to the transferred light-emitting chip to be firmly bonded to the second substrate.

[0220] For example, the laser can be used to perform surface irradiation on the first substrate (with a relatively large irradiation area) to transfer multiple light-emitting chips; for example, the laser can be used to perform point irradiation on the first substrate (which can be understood as the irradiation area only having a transfer effect on one light-emitting chip) to transfer a light-emitting chip at a target location; for example, the laser can be used to scan the first substrate to sequentially transfer multiple light-emitting chips arranged in an array from the first substrate to the second substrate. Therefore, the light-emitting chip transfer device disclosed herein can achieve selective transfer of light-emitting chips.

[0221] It should be noted that although the steps of the method of the present disclosure are described in a specific order in the accompanying drawings, this does not require or imply that the steps must be performed in this specific order, or that all steps must be performed to achieve the desired results. Additional or alternative steps, such as omitting certain steps, combining multiple steps into one step, and / or decomposing a step into multiple steps, should all be considered part of this disclosure.

[0222] It should be understood that the present disclosure is not limited in its application to the detailed structure and arrangement of the components set forth in this specification. The present disclosure is capable of other embodiments and can be implemented and executed in a variety of ways. The aforementioned variations and modifications fall within the scope of the present disclosure. It should be understood that the present disclosure disclosed and defined in this specification extends to all alternative combinations of two or more individual features mentioned or evident in the text and / or the drawings. All of these different combinations constitute multiple alternative aspects of the present disclosure. The embodiments of this specification illustrate the best mode known for implementing the present disclosure and will enable those skilled in the art to utilize the present disclosure.

Claims

1. A light-transmitting press plate, It is characterized in that The light-transmitting pressing plate comprises a first surface and a second surface which are parallel to each other, the first surface and the second surface both extend along a plane, and the light-transmitting pressing plate allows laser light of a target wavelength to pass through in a first direction from the first surface to the second surface; The light-transmitting pressing plate is used to transfer the light-emitting chip arranged on the first substrate to the second substrate under the action of pressure and the laser of the target wavelength, wherein the first substrate is located on the side of the light-transmitting pressing plate close to the second surface and allows the laser of the target wavelength to pass through in the first direction, the first substrate and the second substrate are located on the same side of the light-transmitting pressing plate, and the first substrate is closer to the light-transmitting pressing plate than the second substrate.

2. The light-transmitting press plate according to claim 1, It is characterized in that The refractive index of the light-transmitting pressing plate to the laser with a wavelength of 355 nm is in the range of (1, 1.6).

3. The light-transmitting press plate according to claim 2, It is characterized in that A distance between the first surface and the second surface is in the range of [8 mm, 35 mm].

4. The light-transmitting press plate according to claim 2, It is characterized in that After the light-transmitting pressing plate transmits the laser within the range of an incident angle less than or equal to 14 degrees, the light spot offset is less than or equal to 0.5 mm.

5. The light-transmitting press plate according to claim 2, It is characterized in that After the light-transmitting pressing plate transmits the laser within the laser width of Amm×Bmm, the degradation of the laser spot uniformity does not exceed 2%, and A and B are both less than or equal to 70.

6. The light-transmitting press plate according to claim 2, It is characterized in that After the light-transmitting pressing plate transmits the laser within the range of an incident angle less than or equal to 14 degrees, the uniformity of the laser spot is equal to or better than the uniformity of the laser spot before the incident angle.

7. The light-transmitting press plate according to any one of claims 1 to 6, It is characterized in that The material of the light-transmitting pressing plate is quartz glass.

8. The light-transmitting press plate according to claim 7, It is characterized in that The quartz glass contains inclusions, and the particle size of the inclusions is less than 0.1 mm.

9. The light-transmitting press plate according to claim 1, It is characterized in that comprising a light-transmitting area and a peripheral area, wherein the peripheral area surrounds the light-transmitting area; Wherein, a first gas passage is provided in the peripheral area, and the first gas passage has a first adsorption port extending to the second surface, and the first adsorption port is distributed around the light-transmitting area.

10. The light-transmitting press plate according to claim 9, It is characterized in that The light-transmitting pressing plate includes a contoured surface between the first surface and the second surface; The first gas passage includes an annular groove and an air vent, the notch of the annular groove is located on the second surface and forms the first adsorption port, one end of the air vent is connected to the annular groove, the port of the other end of the air vent is located on the contour surface and forms a first exhaust port, and the first exhaust port is used to connect to the exhaust device.

11. The light-transmitting press plate according to claim 9, It is characterized in that The outer contour of the light-transmitting pressing plate is a rectangle; The light-transmitting pressing plate includes four sub-contour surfaces located between the first surface and the second surface, the first gas passage includes four gas channels and four groups of gas holes, and the four sub-contour surfaces, the four gas channels, and the four groups of gas holes correspond to each other one by one; One of the air channels is located between a corresponding sub-contour surface and the light-transmitting area, one end of a group of air holes is connected to the corresponding air channel, and the other end is located on the second surface and forms the first adsorption port; One of the air ducts extends to two sub-contour surfaces adjacent to a corresponding sub-contour surface, and forms a pair of orifices on the two adjacent sub-contour surfaces. At least one of the four pairs of orifices forms a first air suction port and is used to connect to an air suction device, and the remaining orifices are sealed.

12. The light-transmitting press plate according to claim 11, It is characterized in that The four air passages are interconnected, and one orifice in the four pairs of orifices forms the first air suction port.

13. A pressurizing assembly, It is characterized in that A light-transmitting pressing plate comprising a connecting portion and any one of claims 1 to 12; The connecting portion has a penetrating hollow area, the connecting portion is fixedly connected to the light-transmitting pressing plate, and is located on a side close to the first surface of the light-transmitting pressing plate; In the first direction, the light-transmitting area of ​​the light-transmitting pressing plate overlaps with the hollow area.

14. The pressurizing assembly according to claim 13, It is characterized in that The pressurizing assembly further includes a metal frame and an elastic pad located between the connecting portion and the light-transmitting pressing plate; The metal frame is located between the elastic pad and the light-transmitting pressing plate. Both the metal frame and the elastic pad are annular structures, and the orthographic projections of the metal frame and the elastic pad on the light-transmitting pressing plate surround the light-transmitting area.

15. A heating and pressurizing device, It is characterized in that It includes a heating bearing mechanism and a pressurizing driving mechanism; The heating and carrying mechanism comprises a heating component and a carrying platform, wherein the carrying platform is used to carry the second substrate. The heating component is used to heat the second substrate on the carrier platform; The pressurizing drive mechanism comprises a drive mechanism and the pressurizing assembly according to claim 13 or 14, wherein the drive mechanism is connected to the pressurizing assembly; Among them, the transparent pressure plate and the supporting platform are arranged opposite to each other in the first direction, the transparent pressure plate is used to connect the first substrate, and the driving mechanism is used to drive the transparent pressure plate to move in the first direction, so that the transparent pressure plate drives the first substrate and the second substrate to contact in the first direction and generate interaction force.

16. The heating and pressurizing device according to claim 15, It is characterized in that The driving mechanism comprises: a first slide rail, the first slide rail extending along the first direction; A slider assembly is slidably connected to the first slide rail, and the slider assembly is connected to the pressurizing assembly; A power driving member is connected to the slider assembly and is used to drive the slider assembly to slide along the first slide rail and apply pressure to the pressurizing assembly.

17. The heating and pressurizing device according to claim 15, It is characterized in that A second gas passage is disposed in the carrier platform, and the second gas passage has a second adsorption port extending to a surface of the carrier platform facing the pressurizing assembly.

18. The heating and pressurizing device according to claim 15, It is characterized in that There are two pressurizing drive mechanisms, which are respectively located on both sides of the heating component in the second direction, and are axially symmetrically arranged about the central axis of the heating component, and the second direction is perpendicular to the first direction.

19. The heating and pressurizing device according to claim 15, It is characterized in that The target wavelength is in the range of 100nm-2000nm.

20. A light-emitting chip transfer device, It is characterized in that include: The heating and pressurizing device according to any one of claims 15 to 19; The laser irradiation device is used to generate laser light of a target wavelength and irradiate the laser light onto the light-transmitting area of ​​the light-transmitting pressing plate.

21. A method for transferring a luminescent chip, It is characterized in that include: Transferring the light emitting chip from the source substrate to the intermediate substrate, and then from the intermediate substrate to the display substrate; The light-emitting chip is transferred from the source substrate to the light-emitting chip by using the light-emitting chip transfer device as claimed in claim 20. Transferring to an intermediate substrate, the first substrate being a source substrate and the second substrate being an intermediate substrate; And / or using the light-emitting chip transfer device as described in claim 20 to transfer the light-emitting chip from the intermediate substrate to the display substrate, the first substrate is the intermediate substrate, and the second substrate is the display substrate.

22. A light emitting chip transfer method, It is characterized in that include: The light-emitting chip transfer device according to claim 20 is used to heat, pressurize and laser-irradiate the first substrate and the second substrate located on the heating and pressurizing device, wherein the first substrate allows the laser of the target wavelength to pass through in the first direction, and the light-emitting chip is initially located on the first substrate: The driving mechanism drives the pressurizing assembly to move toward the carrying platform to apply pressure, so that the first substrate and the second substrate are in contact and generate an interaction force; The heating component heats the second substrate carried on the carrying platform; The laser generated by the laser irradiation device passes through the light-transmitting area of ​​the light-transmitting pressing plate to irradiate the first substrate and the second substrate with laser, so that the light-emitting chip on the first substrate is transferred to the second substrate.

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