Group coating and bonding method and application thereof

Abstract

The invention relates to the technical field of micro-nano processing, in particular to a group coating and bonding method and application thereof. According to the method, the curing agent and the prepolymer are sequentially coated on the surface of the substrate material to obtain the substrate containing the coating layer coated in a layered manner, so that the problem that the mixture is cured in advance after the prepolymer and the curing agent are mixed in the traditional process is effectively avoided, the coating quality in the subsequent coating process is further ensured, the operation process is simple and convenient, the controllability is remarkably improved, and the method is suitable for industrial production. Meanwhile, the prepared adhesive layers have good bonding performance, the cracking phenomenon in the coating process is avoided, and the stability and reliability of the whole adhesive layer structure are improved.

Description

Technical Field

[0001] The invention relates to the technical field of micro-nano processing, and in particular to a group coating and bonding method and application thereof. Background Art

[0002] Mixing a curing agent with a prepolymer and then coating it is a common method for preparing a coating. However, for some fields, mixed coating has certain limitations. For example, the mixed components will solidify after mixing, and coating needs to be done immediately, which is not conducive to large-scale production.

[0003] Polydimethylsiloxane (PDMS) is a silicon-based organic polymer with good chemical stability, biocompatibility, temperature resistance, flexibility and optical transparency. It is widely used in microprocessing technologies that require precise control, such as microelectronics manufacturing, microfluidic chips, biomedical engineering, and optical fields. The existing PDMS coating process mainly includes the following steps: mixing the PDMS prepolymer and the curing agent in a predetermined ratio, and then coating the mixture on the surface of the substrate, and then mainly used in microfluidic chip mold inversion, bonding packaging and other processes. However, although the mixed coating method can meet the basic needs of the above-mentioned application fields, it still has the following shortcomings: it has certain limitations on the selection of coating equipment; it requires rapid coating operation after mixing, resulting in the operation process being inconvenient and inflexible, and not conducive to industrial large-scale production; it is difficult to achieve precise control of the film thickness when applied to the film inversion process, and there are also problems such as low bonding strength when applied to the bonding process.

[0004] Based on mixed coating, especially mixed coatings like PDMS that will have a curing phenomenon, it is urgent to provide a new method that can avoid the problems caused by mixed coating while achieving coating. Summary of the invention

[0005] In view of the deficiencies of the prior art, the present invention provides a group-by-group coating and bonding method and its application. The present invention effectively avoids the problem of premature curing of the mixture after the prepolymer and the curing agent are mixed in the traditional process by coating the prepolymer component and the curing agent component separately, especially the problem of premature curing of the mixture after the PDMS prepolymer and the curing agent are mixed, thereby ensuring the coating quality in the subsequent coating process, the operation process is simple and the controllability is significantly improved, and at the same time, the prepared adhesive layers have good bonding, avoiding cracking during the coating process, and improving the stability and reliability of the overall adhesive layer structure.

[0006] The technical solution of the present invention is as follows:

[0007] The first aspect of the present invention provides a method for coating and bonding in groups, wherein a curing agent and a prepolymer are sequentially coated on the surface of a substrate material to form a layered coating layer on the substrate.

[0008] Preferably, the method further comprises: a process of laminating the surface of the substrate containing the coating layer to another substrate and then heating and bonding them.

[0009] Preferably, the specific steps of the method are as follows:

[0010] S1: Clean the substrate material, dry it and set it aside.

[0011] S2: coating the curing agent on the surface of the substrate to obtain a substrate containing the curing agent.

[0012] S3: Continue to apply prepolymer on the surface of the curing agent.

[0013] S4: Repeat steps S2-S3.

[0014] Preferably, in steps S2 and S3, the coating includes spin coating and / or spray coating.

[0015] Preferably, in step S4, the number of repetitions is greater than or equal to 0 times.

[0016] Preferably, when the coating is spin coating, in steps S2 and S3, the coating conditions are: first spin coating at a rotation speed of 300-800 rpm for 5-12 s; then spin coating at a rotation speed of 2000-4000 rpm for 20-40 s.

[0017] Preferably, when the coating is spraying, before steps S2 and S3, the process also includes diluting the curing agent with a solvent to obtain a curing agent dilution, and diluting the prepolymer with a solvent to obtain a prepolymer dilution. Steps S2 and S3 are sprayed with the curing agent dilution and the prepolymer dilution respectively, and step S3 also includes heating the substrate containing the curing agent and the prepolymer to remove the solvent.

[0018] Preferably, the solvent includes at least one of tetrahydrofuran, acetone, N-methyl-2-pyrrolidone and dichloromethane.

[0019] Preferably, the volume ratio of the curing agent to the solvent is 1:5-10; the volume ratio of the prepolymer to the solvent is 1:5-10.

[0020] Preferably, the spraying conditions are: spraying temperature 40-65°C, spraying speed 80-250mm / s, Z-axis height 25-50mm, pressure tank pressure 0.1-0.5MPa, purge pressure 0.2-0.4MPa, and spraying times 1-8 times.

[0021] Preferably, the method further comprises the following step: S5: laminating the coated surface of the substrate containing the coating to another substrate, and then performing heat-compression bonding.

[0022] Preferably, a curing agent is coated on the surface of the other substrate that contacts the substrate containing the coating.

[0023] The present invention also provides another method for coating and bonding the components, wherein the curing agent is coated on the surface of one substrate, the prepolymer is coated on the surface of another substrate, the curing agent side of the substrate containing the curing agent is laminated with the prepolymer side of the substrate containing the prepolymer to obtain a layered coating; and hot pressing bonding is performed to obtain a product containing the coating.

[0024] Preferably, the coating includes spin coating and / or spray coating. When the coating is spin coating, the conditions for the curing agent coating are: first spin coating at a speed of 300-800 rpm for 5-12 seconds; then spin coating at a speed of 2000-4000 rpm for 20-40 seconds; the conditions for the prepolymer coating are: first spin coating at a speed of 300-800 rpm for 5-12 seconds; then spin coating at a speed of 2000-4000 rpm for 20-40 seconds; when the coating is spray coating, before coating, it also includes diluting the curing agent with a solvent to obtain a curing agent dilution, diluting the prepolymer with a solvent to obtain a prepolymer dilution, and then spraying the curing agent dilution and the prepolymer dilution respectively, and after spraying, it also includes heating the substrate containing the curing agent and the deposition containing the prepolymer separately to remove the solvent, and then bonding the curing agent side of the substrate containing the curing agent with the prepolymer side of the substrate containing the prepolymer, and hot pressing bonding to obtain a product containing a coating.

[0025] Preferably, the remaining preparation conditions of the above-mentioned another method of component coating and bonding are the same as those described in the above-mentioned first aspect.

[0026] The present invention also provides a coating-containing product prepared by the above-mentioned component coating and bonding method.

[0027] The beneficial technical effects of the present invention are:

[0028] The present invention separately and alternately coats the prepolymer and the curing agent on the substrate, in particular, separately and alternately coats the PDMS prepolymer and the corresponding curing agent on the substrate, and then performs subsequent processes. The component coating effectively avoids the problem of premature curing after the prepolymer and the curing agent are mixed in the traditional process, thereby ensuring the quality of the subsequent coating process, making the operation process more convenient and significantly improving the controllability; the alternating coating of the prepolymer and the curing agent components can further enhance the bonding strength of the bonding interface of the mixture; the repeated execution of the group coating steps can realize the on-demand adjustment of the thickness of the adhesive layer, while ensuring the good bonding between the adhesive layers, avoiding cracking during the coating process, and ultimately improving the stability and reliability of the overall structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 Schematic diagram of the structure of a PDMS coating sheet in one embodiment of the present invention.

[0030] In the figure: 1. substrate material; 2. curing agent layer; 3. PDMS prepolymer layer; 4. coating sheet coated with a single layer of PDMS.

[0031] Figure 2 This is a test diagram of the PDMS glue layer thickness of Examples 1 and 6 of the present invention.

[0032] In the figure: a is a PDMS glue layer thickness test diagram of Example 6; b is a PDMS glue layer thickness test diagram of Example 1.

[0033] Figure 3 This is a cross-sectional micrograph of the PDMS coated sheet of Example 2 of the present invention. DETAILED DESCRIPTION

[0034] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments.

[0035] The first aspect of the present invention provides a method for coating and bonding in groups, wherein a curing agent and a prepolymer are sequentially coated on the surface of a substrate material, and heated and cured to obtain a layered coating layer.

[0036] In some embodiments, the method further comprises: laminating the surface of the substrate containing the coating after heat curing to another substrate and then heating and bonding them.

[0037] It is understood that the present invention does not limit the types of curing agents and prepolymers, and any curing agent and prepolymer that can achieve the effects of the present invention are within the scope of protection of the present invention. In other words, the curing agent and prepolymer can be any raw material for preparing a mixture containing a curing agent and a prepolymer, and the problem of mixed coating can be avoided by layered coating. Exemplarily, the curing agent and prepolymer are the curing agent and prepolymer used for PMDS, and the PDMS prepolymer and the corresponding curing agent are separately and alternately coated on the substrate, and then the subsequent process is carried out.

[0038] It can be understood that the group-by-group coating effectively avoids the problem of premature curing after the prepolymer and curing agent are mixed in the traditional process (for example, PDMS prepolymer will cure prematurely when mixed with the curing agent), thereby ensuring the quality of the subsequent coating process, making the operation process more convenient and the controllability significantly improved; the alternating coating of the prepolymer and curing agent components can further enhance the bonding strength of the bonding interface of the mixture; repeated execution of the group-by-group coating steps can achieve on-demand adjustment of the thickness of the adhesive layer, while ensuring good bonding between the adhesive layers, avoiding cracking during the coating process, and ultimately improving the stability and reliability of the overall structure.

[0039] In some embodiments, the present invention provides a PMDS group coating and bonding method, wherein the method is to sequentially coat a curing agent and a prepolymer on the surface of a substrate material, heat and cure, and obtain a layered coating layer, and also includes: laminating the surface of the substrate containing the coating after heat curing to another substrate and then heating and bonding.

[0040] In some embodiments, the curing agent and prepolymer are curing agents and prepolymers for PDMS.

[0041] Preferably, the raw material of the PDMS is Dow Corning 184.

[0042] It is understandable that the present invention does not limit the material of the substrate, and any substrate material that can achieve the purpose of the present invention is within the protection scope of the present invention. Exemplarily, the substrate includes at least one of a silicon wafer and a glass substrate.

[0043] In some embodiments, the glass substrate is preferably a glass sheet B270.

[0044] It will be appreciated that when two substrates are included, the two substrates may be the same or different.

[0045] The present invention separates and alternately coats PDMS prepolymer and curing agent, preferably PDMS prepolymer and curing agent, on a substrate, and then performs subsequent processes. The group-by-group coating of PDMS effectively avoids the problem of premature curing of PDMS after mixing in the traditional process, thereby ensuring the quality of the subsequent coating process, making the operation process more convenient and significantly improving the controllability; the alternating coating of the prepolymer and curing agent components can further enhance the bonding strength of the PDMS bonding interface; the repeated execution of the group-by-group coating steps can achieve the on-demand adjustment of the thickness of the adhesive layer, while ensuring good bonding between the adhesive layers, avoiding cracking during the coating process, and ultimately improving the stability and reliability of the overall structure.

[0046] In some embodiments, the structure of the substrate or coating sheet containing the PDMS adhesive layer obtained by the present invention is as follows Figure 1 As shown, it includes a substrate material 1, a curing agent layer 2, a PDMS prepolymer layer 3, and a coating sheet 4 coated with a single layer of PDMS.

[0047] In some embodiments, the specific steps of the group coating and bonding method are as follows:

[0048] S1: Clean the substrate material, dry it and set it aside.

[0049] S2: coating the curing agent on the surface of the substrate to obtain a substrate containing the curing agent.

[0050] S3: Continue to apply prepolymer on the surface of the curing agent.

[0051] S4: Repeat steps S2-S3.

[0052] In some embodiments, in steps S2 and S3, the coating includes spin coating and / or spray coating.

[0053] In some embodiments, in step S4, the number of repetitions is greater than or equal to 0 times.

[0054] In some embodiments, when the coating is spin coating, in steps S2 and S3, the coating conditions are: first spin coating at a rotation speed of 300-800 rpm for 5-12 s; then spin coating at a rotation speed of 2000-4000 rpm for 20-40 s.

[0055] It can be understood that the coating conditions in steps S2 and S3 are the same or different.

[0056] In some embodiments, when the coating is spraying, before steps S2 and S3, the process also includes diluting the curing agent with a solvent to obtain a curing agent dilution, and diluting the prepolymer with a solvent to obtain a prepolymer dilution. Steps S2 and S3 are sprayed with the curing agent dilution and the prepolymer dilution respectively, and step S3 also includes heating the substrate containing the curing agent and the prepolymer to remove the solvent.

[0057] In some embodiments, the coating is spray coating, and the specific steps of the group coating and bonding method are:

[0058] S1: Clean the substrate material, dry it and set it aside.

[0059] S2: Spraying the curing agent on the surface of the substrate to obtain a substrate containing the curing agent.

[0060] S3: Continue to coat the prepolymer on the surface of the curing agent and heat to remove the solvent.

[0061] S4: Repeat steps S2-S3.

[0062] In some embodiments, in step S3, the heating temperature is 70-200°C, including but not limited to 70°C, 100°C, 125°C, 150°C, 175°C, 200°C, and the time is 20-60min, including but not limited to 20min, 30min, 40min, 50min, 60min.

[0063] In some embodiments, the solvent includes at least one of tetrahydrofuran, acetone, N-methyl-2-pyrrolidone, and dichloromethane.

[0064] In some embodiments, the volume ratio of the curing agent to the solvent is 1:5-10, including but not limited to 1:5, 1:6, 1:7, 1:8, 1:9, 1:10; the volume ratio of the prepolymer to the solvent is 1:5-10, including but not limited to 1:5, 1:6, 1:7, 1:8, 1:9, 1:10.

[0065] In some embodiments, the spraying conditions are: spraying temperature 40-65°C, spraying speed 80-250mm / s, Z-axis height 25-50mm, pressure tank pressure 0.1-0.5MPa, purge pressure 0.2-0.4MPa, and spraying times 1-8 times.

[0066] In some embodiments, the following step is further included: S5: laminating the coated surface of the substrate containing the coating to another substrate, and then performing thermal compression bonding.

[0067] In some embodiments, the surface of the other substrate that is bonded to the coated surface of the substrate containing the coating is coated with a curing agent. That is, after the surface of the other substrate is coated with a curing agent, it is bonded to the coated surface of the substrate containing the coating.

[0068] The present invention also provides another method for group coating and bonding, wherein a curing agent is coated on the surface of one substrate, and a prepolymer is coated on the surface of another substrate, and after heating and curing them respectively, the curing agent side of the substrate containing the curing agent is laminated with the prepolymer side of the substrate containing the prepolymer to obtain a layered coating layer; and hot pressing and bonding are performed to obtain a product containing a coating layer.

[0069] In some embodiments, the coating comprises spin coating and / or spray coating.

[0070] In some embodiments, the coating is spin coating, and the conditions for coating the curing agent are: first spin coating at a speed of 300-800 rpm for 5-12 seconds; then spin coating at a speed of 2000-4000 rpm for 20-40 seconds; the conditions for coating the prepolymer are: first spin coating at a speed of 300-800 rpm for 5-12 seconds; then spin coating at a speed of 2000-4000 rpm for 20-40 seconds.

[0071] In some embodiments, the coating is spraying. Before coating, it also includes diluting the curing agent with a solvent to obtain a curing agent dilution, diluting the prepolymer with a solvent to obtain a prepolymer dilution, and then spraying the curing agent dilution and the prepolymer dilution respectively. After spraying, it also includes heating the substrate containing the curing agent and the deposition containing the prepolymer respectively to remove the solvent, and then laminating the curing agent side of the curing agent-containing substrate and the prepolymer side of the prepolymer-containing substrate, and hot pressing and bonding them to obtain a product containing a coating.

[0072] In the present invention, the heating is to place the substrate on a hot plate for heating treatment, thereby completing the removal of excess solvent and the curing process of the adhesive layer.

[0073] In some embodiments, the heating treatment temperature is 70-200°C, including but not limited to 70°C, 100°C, 125°C, 150°C, 175°C, 200°C, and the time is 20-60min, including but not limited to 20min, 30min, 40min, 50min, 60min.

[0074] In some embodiments, the remaining preparation conditions for coating two substrates separately may be the same as the conditions of the method described in the first aspect above.

[0075] Preferably, the component coating and bonding is used for the component coating and bonding of PDMS.

[0076] The present invention also provides a product containing a (PDMS) coating which is prepared by the above-mentioned (PDMS) group coating and bonding method.

[0077] The following are specific embodiments.

[0078] Example 1

[0079] PDMS group-by-group spin coating bonding method, wherein the specific type of PDMS is Dow Corning 184, the bonding substrate is a silicon wafer, and a single-layer PDMS film is obtained after group-by-group spin coating, and its structural schematic diagram is shown as follows Figure 1 The specific method is as follows:

[0080] (1) Rinse the silicon wafer with acetone and blow dry to ensure that its surface is clean. Then place the silicon wafer on a hot plate to dry out the moisture at 120°C for 10 minutes.

[0081] (2) Spin coating curing agent

[0082] The silicon wafer treated in step (1) is placed on the operating platform of the coating machine, and then the curing agent is spin-coated to cover the entire silicon wafer. The spin-coating parameters are: forward rotation speed 600 rpm, time 10 s; backward rotation speed 2000 rpm, time 30 s.

[0083] (3) Spin coating prepolymer

[0084] The prepolymer is further spin-coated on the surface of the sample containing the curing agent obtained in step (2) to obtain a coating sheet coated with a single-layer PDMS film. The spin-coating parameters are: forward rotation speed 300 rpm, time 6 s; backward rotation speed 2000 rpm, time 30 s.

[0085] (4) Thermocompression bonding

[0086] The PDMS-containing side of the heat-cured coated sheet was aligned with the clean silicon sheet on the other side and then hot-pressed bonded, wherein the bonding pressure was 0.2 MPa, the bonding temperature was 120° C., and the bonding time was 45 min.

[0087] In this embodiment, Figure 2 As shown in Figure b, the thickness of the PDMS film obtained by spin coating with Dow Corning 184 is about 12μm; after testing, the bonding strength is 8.1J / m 2 .

[0088] Example 2

[0089] PDMS group-by-group multi-layer spin coating bonding method, wherein PDMS is Dow Corning 184, the bonding substrate is a silicon wafer, and three layers of PDMS film are obtained after group-by-group spin coating. The specific steps are as follows:

[0090] (1) Rinse the silicon wafer with acetone and blow dry to ensure that its surface is clean. Then place the silicon wafer on a hot plate to dry out the moisture, set the temperature to 100°C, and dry for 15 minutes.

[0091] (2) Spin coating curing agent

[0092] Place the dried silicon wafer on the operating platform of the coating machine, and then spin-coat the curing agent to cover the entire silicon wafer. The spin coating parameters are: forward rotation speed 800rmp, time 10s; backward rotation speed 3000rmp, time 20s.

[0093] (3) Spin coating prepolymer

[0094] The prepolymer was continued to be spin-coated on the surface of the sample containing the curing agent obtained in step (2), and the spin-coating parameters were: forward rotation speed of 600 rpm, time of 6 s; backward rotation speed of 3000 rpm, time of 20 s.

[0095] (4) Repeat steps (2) and (3) twice to obtain a coated sheet coated with three layers of PDMS film.

[0096] (5) Thermocompression bonding

[0097] After aligning the PDMS-coated side of the coated wafer with the clean silicon wafer on the other side, hot pressing bonding was performed, wherein the bonding pressure was 0.4 MPa, the bonding temperature was 125° C., and the bonding time was 40 min.

[0098] In this embodiment, Dow Corning 184 was used for three times of sub-spin coating, and the total thickness of the obtained PDMS film layer was about 35.6 μm. Figure 3As shown in the figure, different PDMS layers can be clearly seen without cracking, indicating that the grouped and multiple spin coating process of PDMS can achieve controllable thickness while ensuring good interlayer bonding, which is conducive to high-quality on-demand regulation of the thickness of the PDMS adhesive layer; in addition, the tested bonding strength is 7.4 J / cm 2 .

[0099] Example 3

[0100] PDMS double substrate group spray bonding method, where PDMS selects Dow Corning 184, the substrates are silicon wafer and glass wafer B270 respectively, and the group sprays Dow Corning 184 on different substrates and then performs the bonding process. The specific steps are as follows:

[0101] (1) Rinse the silicon wafer with acetone and blow dry to ensure that its surface is clean. Then place the silicon wafer on a hot plate to dry out the moisture at 150°C for 10 minutes.

[0102] (2) Glue pretreatment

[0103] Tetrahydrofuran is used as a diluent to dilute the prepolymer and the curing agent respectively, wherein the volume ratio of the prepolymer to the tetrahydrofuran is 1:9; the volume ratio of the curing agent to the tetrahydrofuran is 1:9, to obtain a diluted prepolymer and a diluted curing agent.

[0104] Step 3: Spray the diluted curing agent

[0105] Place the silicon wafer on the glue spraying machine operating platform, and then spray the diluted curing agent to cover the entire silicon wafer. The spraying parameters are: spraying temperature 60℃, spraying speed 80mm / s, Z-axis height 30mm, pressure tank pressure 0.1MPa, purge pressure 0.2MPa, and spraying times 2 times.

[0106] (3) Spraying diluted prepolymer

[0107] The diluted prepolymer was sprayed on the surface of the glass sheet B270, and the parameters were: spraying temperature 60°C, spraying speed 80 mm / s, Z-axis height 30 mm, pressure tank pressure 0.1 MPa, purge pressure 0.2 MPa, and spraying times 2 times.

[0108] (4) Heat drying to remove solvent

[0109] The silicon wafer sprayed with the curing agent and the glass wafer (B270) sprayed with the prepolymer were placed on a hot plate for heating to remove the solvent. The heating temperature was 70° C. and the heating time was 10 min.

[0110] (5) Thermocompression bonding

[0111] The glass sheet containing the prepolymer after heating to remove the solvent in step (4) and the silicon sheet containing the curing agent with the sprayed surface are bonded together and hot-pressed, wherein the bonding pressure is 0.2 MPa, the bonding temperature is 120° C., and the bonding time is 40 min.

[0112] In this embodiment, the bonding strength of the coating sheet containing the PDMS film layer obtained by using Dow Corning 184 for group spray bonding is 8.3 J / m 2 .

[0113] Example 4

[0114] PDMS double substrate "sandwich" structure group spray bonding method, where PDMS selects Dow Corning 184, and the substrates are silicon wafer and glass wafer B270 respectively. Dow Corning 184 is sprayed on different substrates and hot-pressed to obtain a "sandwich" bonding layer and test the bonding strength. The specific steps are as follows:

[0115] (1) Rinse the silicon wafer with acetone and blow dry to ensure that its surface is clean. Then place the silicon wafer on a hot plate to dry out the moisture at 150°C for 10 minutes.

[0116] (2) Glue pretreatment

[0117] Tetrahydrofuran is used as a diluent to dilute the prepolymer and the curing agent respectively, wherein the volume ratio of the prepolymer to the tetrahydrofuran is 1:8; the volume ratio of the curing agent to the tetrahydrofuran is 1:8, to obtain a diluted prepolymer and a diluted curing agent.

[0118] (3) Spray the diluted curing agent and prepolymer on the silicon wafer substrate in sequence

[0119] Place the silicon wafer on the glue spraying machine operating platform, and spray the diluted curing agent and diluted prepolymer on the silicon wafer substrate in sequence, so that they cover the entire silicon wafer in sequence. The spraying parameters are: spraying temperature 60℃, spraying speed 80mm / s, Z-axis height 30mm, pressure tank pressure 0.1MPa, purge pressure 0.2MPa, and spraying times 2 times.

[0120] (4) Spray the diluted curing agent on the glass sheet B270 substrate

[0121] Spray the diluted curing agent on the surface of the glass sheet B270. The spraying parameters are: spraying temperature 60°C, spraying speed 80mm / s, Z-axis height 30mm, pressure tank pressure 0.1MPa, purge pressure 0.2MPa, and spraying times 2 times.

[0122] (5) Heat drying to remove solvent

[0123] The silicon wafer sprayed with the curing agent and the prepolymer and the glass wafer (B270) sprayed with the curing agent were placed on a hot plate for heating to remove the solvent. The heating temperature was 75° C. and the heating time was 10 min.

[0124] (6) Thermocompression bonding

[0125] The coated sheets after heating to remove the solvent in step (5) are laminated together on the coated side and hot-pressed for bonding, wherein the bonding pressure is 0.3 MPa, the bonding temperature is 120° C., and the bonding time is 40 min.

[0126] In this embodiment, the bonding strength of the coated sheet obtained by using Dow Corning 184 for the double substrate "sandwich" structure group spray bonding process is 17.2 J / m 2 .

[0127] Example 5

[0128] The PDMS double substrate group-by-group spin coating bonding method, wherein the specific type of PDMS is Dow Corning 184, the bonding substrate is a silicon wafer and a glass wafer (B270), and the specific group-by-group spin coating bonding process is implemented as follows:

[0129] (1) Rinse the silicon wafer with acetone and blow dry to ensure that its surface is clean. Then place the silicon wafer on a hot plate to dry out the moisture at 110°C for 10 minutes.

[0130] (2) Silicon wafer substrate spin coating curing agent

[0131] The silicon wafer was placed on the operating platform of the coating machine, and then the curing agent was spin-coated to cover the entire silicon wafer, thereby obtaining a coated wafer 1. The spin-coating parameters were: forward rotation speed 600 rpm, time 10 s; backward rotation speed 2000 rpm, time 30 s.

[0132] (3) Spin coating prepolymer on glass substrate

[0133] The prepolymer was spin-coated on the surface of the glass sheet B270 to cover the entire surface of the glass sheet, thereby obtaining a coated sheet 2. The spin-coating parameters were: forward rotation speed 300 rpm, time 6 s; backward rotation speed 2000 rpm, time 30 s.

[0134] (4) Thermocompression bonding

[0135] The coated sheets 1 and 2 coated with the curing agent and prepolymer layers respectively obtained in steps (2) and (3) are attached together and placed in a bonding machine for hot pressing bonding, wherein the bonding pressure is 0.2 MPa, the bonding temperature is 125° C., and the bonding time is 40 min.

[0136] In this embodiment, the PDMS film layer obtained by spin coating with Dow Corning 184 has a thickness of about 12 μm; after testing, the bonding strength is 8.3 J / m 2 .

[0137] Example 6

[0138] The PDMS single substrate group spin coating bonding method, wherein the specific type of PDMS is Dow Corning 184, the bonding substrate is a silicon wafer, and a single-layer PDMS film is obtained after group spin coating. The specific implementation steps are as follows:

[0139] (1) Rinse the silicon wafer with acetone and blow dry to ensure that its surface is clean. Then place the silicon wafer on a hot plate to dry out the moisture at 120°C for 10 minutes.

[0140] (2) Spin coating curing agent

[0141] Place the silicon wafer on the operating platform of the coating machine, and then spin-coat the curing agent to cover the entire silicon wafer. The spin coating parameters are: forward rotation speed 600rmp, time 10s; backward rotation speed 3000rmp, time 30s.

[0142] (3) Spin coating prepolymer

[0143] The prepolymer is continuously spin-coated on the sample surface obtained in step (2) to obtain a coating sheet coated with a single-layer PDMS film. The spin-coating parameters are: forward rotation speed 300 rpm, time 6 s; backward rotation speed 3000 rpm, time 30 s.

[0144] (4) Thermocompression bonding

[0145] The coated side of the heat-cured coated wafer with the coating layer is aligned with the other clean silicon wafer and then hot-pressed bonded, wherein the bonding pressure is 0.2 MPa, the bonding temperature is 120° C., and the bonding time is 45 minutes.

[0146] In this embodiment, Figure 2 As shown in Figure a, the thickness of the PDMS film obtained by spin coating with Dow Corning 184 is about 4.4μm; after testing, the bonding strength is 7.3J / m 2 .

[0147] Comparative Example 1

[0148] PDMS coating bonding method, wherein the specific type of PDMS is Dow Corning 184, the bonding substrate is a silicon wafer, and the combination is mixed and then spin-coated to obtain a single-layer PDMS film. The specific implementation steps are as follows:

[0149] (1) Rinse the silicon wafer with acetone and blow dry to ensure that its surface is clean. Then place the silicon wafer on a hot plate to dry out the moisture at 115°C for 10 minutes.

[0150] (2) Preparation of mixed glue

[0151] The curing agent and the prepolymer are mixed in a volume ratio of 1:10, and stirred evenly to obtain a mixed adhesive solution.

[0152] (3) Spin coating curing agent

[0153] Place the silicon wafer on the operating platform of the glue spreader, and then spin-coat the mixed glue solution to cover the entire silicon wafer. The spin coating parameters are: forward rotation speed 600rmp, time 10s; backward rotation speed 3000rmp, time 30s.

[0154] (4) Thermocompression bonding

[0155] The coated side of the heat-cured coated wafer with the coating layer is aligned with the other clean silicon wafer and then hot-pressed bonded, wherein the bonding pressure is 0.2 MPa, the bonding temperature is 120° C., and the bonding time is 45 minutes.

[0156] In this comparative example, the thickness of the PDMS film obtained by spin coating with Dow Corning 184 is about 10 μm; after testing, the bonding strength is 0.37 J / m 2 .

[0157] The above is only a preferred embodiment of the present invention, and the present invention is not limited to the above embodiments. It is understood that other improvements and changes directly derived or associated by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included in the protection scope of the present invention.

Claims

1. A method for coating and bonding a plurality of components, characterized in that: The method comprises coating a curing agent and a prepolymer on the surface of a substrate material in sequence to form a layered coating layer on the substrate.

2. The method for group coating and bonding according to claim 1, characterized in that: The method further comprises: laminating the surface of the substrate containing the coating layer to another substrate and then heating and bonding them.

3. The method for coating and bonding the components according to any one of claims 1 to 2, characterized in that: The specific steps of the method are as follows: S1: clean, dry and set aside the substrate material; S2: coating a curing agent on the surface of the substrate to obtain a substrate containing the curing agent; S3: Continue to coat the prepolymer on the surface of the curing agent; S4: Repeat steps S2-S3.

4. The method for group coating and bonding according to claim 3, characterized in that: In steps S2 and S3, the coating includes spin coating and / or spray coating; In step S4, the number of repetitions is greater than or equal to 0.

5. The method for group coating and bonding according to claim 4, characterized in that: When the coating is spin coating, in steps S2 and S3, the coating conditions are: first, spin coating at a speed of 300-800 rpm for 5-12 s; then, spin coating at a speed of 2000-4000 rpm for 20-40 s; When the coating is spraying, before steps S2 and S3, the process also includes diluting the curing agent with a solvent to obtain a curing agent dilution, and diluting the prepolymer with a solvent to obtain a prepolymer dilution. Steps S2 and S3 are sprayed with the curing agent dilution and the prepolymer dilution respectively, and step S3 also includes a process of heating the substrate containing the curing agent and the prepolymer to remove the solvent.

6. The method for group coating and bonding according to claim 5, characterized in that: The solvent includes at least one of tetrahydrofuran, acetone, N-methyl-2-pyrrolidone, and dichloromethane; The volume ratio of the curing agent to the solvent is 1:5-10; the volume ratio of the prepolymer to the solvent is 1:5-10.

7. The method for group coating and bonding according to claim 5, characterized in that: The spraying conditions are: spraying temperature 40-65° C., spraying speed 80-250 mm / s, Z-axis height 25-50 mm, pressure tank pressure 0.1-0.5 MPa, purge pressure 0.2-0.4 MPa, and spraying times 1-8 times.

8. The method for group coating and bonding according to claim 3, characterized in that: The following steps are also included: S5: laminating the coated surface of the substrate containing the coating to another substrate, and then performing thermal compression bonding; Preferably, a curing agent is coated on the surface of the other substrate that contacts the substrate containing the coating.

9. A method for coating and bonding a plurality of components, characterized in that: The method comprises coating a curing agent on the surface of one substrate, coating a prepolymer on the surface of another substrate, laminating the curing agent side of the curing agent-containing substrate with the prepolymer side of the prepolymer-containing substrate to obtain a layered coating; and hot pressing and bonding to obtain a product containing a coating. The coating comprises spin coating and / or spray coating; When the coating is spin coating, the curing agent coating conditions are: first spin coating at a speed of 300-800 rpm for 5-12 seconds; then spin coating at a speed of 2000-4000 rpm for 20-40 seconds; the prepolymer coating conditions are: first spin coating at a speed of 300-800 rpm for 5-12 seconds; then spin coating at a speed of 2000-4000 rpm for 20-40 seconds; When the coating is spraying, before coating, it also includes diluting the curing agent with a solvent to obtain a curing agent dilution, diluting the prepolymer with a solvent to obtain a prepolymer dilution, and then spraying the curing agent dilution and the prepolymer dilution respectively. After spraying, it also includes heating the substrate containing the curing agent and the substrate containing the prepolymer respectively to remove the solvent, and then laminating the curing agent side of the curing agent substrate and the prepolymer side of the prepolymer substrate, and hot pressing and bonding them to obtain a product containing a coating.

10. A coated product prepared by the component coating and bonding method according to any one of claims 1 to 9.

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