Device for laser-assisted polishing of CVD diamond

Abstract

The invention discloses a laser-assisted CVD (chemical vapor deposition) diamond polishing device, which belongs to the technical field of machining and comprises a rotary table connected with a first driving component, and the first driving component drives the rotary table to rotate around the axis of the rotary table; three adsorption tables are arranged at the top of the rotary table in the circumferential direction around the axis of the rotary table at equal intervals, a second driving assembly is arranged on the rotary table, and the second driving assembly drives the adsorption tables to rotate around the axes of the adsorption tables; a clamping mechanism, a laser polishing mechanism and a grinding mechanism are arranged on one side of the rotary table, and the clamping mechanism, the grinding mechanism and the laser polishing mechanism are arranged in one-to-one correspondence with the three adsorption tables correspondingly. The clamping mechanism is used for taking and placing workpieces, the laser polishing mechanism is used for moving along the radial direction of the corresponding adsorption table to roughly grind the workpieces, and the grinding mechanism is used for moving along the radial direction of the corresponding adsorption table to finely polish the workpieces. Mechanical grinding and laser polishing are combined, thinning and polishing work of a workpiece is rapidly achieved, and the machining efficiency is improved; and meanwhile, rapid circulation of the workpieces can be achieved.

Description

Technical Field

[0001] The invention relates to the technical field of mechanical processing, in particular to a device for laser-assisted polishing of CVD diamond. Background Art

[0002] CVD diamond is an excellent engineering structural material and functional material with good mechanical and chemical properties, and has a very broad application prospect. It has been increasingly used in many fields such as tools, machinery, thermal, optics, electronics, aerospace, etc. However, due to the extremely high hardness, good wear resistance, and stable chemical properties of CVD diamond, its processing is also difficult. For traditional CVD diamond processing methods, its processing efficiency is low.

[0003] To this end, a device for laser-assisted polishing of CVD diamond is proposed. Summary of the invention

[0004] The object of the present invention is to provide a device for laser-assisted polishing of CVD diamond, aiming to solve or improve at least one of the above-mentioned technical problems.

[0005] To achieve the above-mentioned object, the present invention provides the following scheme: The present invention provides a device for laser-assisted polishing of CVD diamond, comprising a turntable, a first driving assembly is connected to the turntable, and the first driving assembly drives the turntable to rotate around its axis; three adsorption tables are arranged at equal intervals on the top of the turntable around the axis of the turntable, and a second driving assembly is arranged on the turntable, and the second driving assembly drives the adsorption table to rotate around its own axis;

[0006] A clamping mechanism, a laser polishing mechanism and a grinding mechanism are arranged on one side of the turntable, and the clamping mechanism, the grinding mechanism and the laser polishing mechanism are arranged one by one corresponding to the three adsorption tables respectively; the clamping mechanism is used to take and place the workpiece, the laser polishing mechanism is used to move radially along the corresponding adsorption table to rough grind the workpiece, and the grinding mechanism is used to move radially along the corresponding adsorption table to finely polish the workpiece.

[0007] Preferably, a workbench is provided at the bottom of the turntable, and the first driving assembly includes a first motor fixedly connected to the top of the workbench, and an output shaft of the first motor is fixedly connected to the bottom of the turntable.

[0008] Preferably, the laser polishing mechanism and the grinding mechanism respectively include a lifting assembly, the two lifting assemblies are arranged on the workbench, the lifting ends of the lifting assemblies are fixedly connected with a horizontal moving assembly, the moving end of the horizontal moving assembly on the laser polishing mechanism is provided with a laser processor, and the moving end of the horizontal moving assembly of the grinding mechanism is provided with a grinding wheel;

[0009] While the adsorption platform corresponding to the laser polishing mechanism rotates around its own axis, the horizontal moving component on the laser polishing mechanism drives the laser processor to move along the radial direction of the adsorption platform to roughly grind the workpiece;

[0010] While the adsorption platform corresponding to the polishing mechanism rotates around its own axis, the horizontal moving component on the polishing mechanism drives the grinding wheel to move along the radial direction of the adsorption platform to finely polish the workpiece.

[0011] Preferably, the lifting assembly includes a first bracket fixedly connected to the workbench, a second motor is fixedly connected to the top of the first bracket, a first screw is fixedly connected to the output shaft of the second motor, the first screw is rotatably connected to the first bracket, a first nut is threadedly sleeved on the first screw, and the first nut is slidably connected to the side wall of the first bracket; the two first nuts are respectively fixed to the two horizontal moving assemblies.

[0012] Preferably, the horizontal moving assembly includes a second bracket fixedly connected to the first nut, a fourth motor is fixedly connected to the second bracket, a second screw is fixedly connected to the output shaft of the fourth motor, the second screw is rotatably connected to the second bracket, the second screw is perpendicular to the first screw, the axis of the second screw is parallel to one of the diameters of the corresponding adsorption platform, a second nut is threadedly sleeved on the second screw, the second nut is slidably connected to the side wall of the second bracket, one of the second nuts is fixedly connected to the laser processor, and the other second nut is fixedly connected to the grinding wheel.

[0013] Preferably, the clamping mechanism comprises a manipulator fixedly connected to the workbench.

[0014] Preferably, a cavity is opened in the turntable, and the second driving assembly includes three third motors fixedly connected in the cavity, the output shafts of the third motors extend out of the top of the turntable and are fixedly connected to connecting shafts, and the three connecting shafts are respectively connected to the three adsorption platforms.

[0015] Preferably, the adsorption platform includes a shell fixedly connected to the connecting shaft, an adsorption chamber is provided inside the shell, a plurality of adsorption holes connected to the adsorption chamber are provided on the top of the shell, a vacuum generator is fixedly connected to the side wall of the connecting shaft, and a connecting pipe on the vacuum generator is fixedly connected to the side wall of the shell and connected to the adsorption chamber.

[0016] Preferably, two thickness measuring instruments are fixedly connected to the workbench, one of the thickness measuring instruments is located directly above the adsorption platform corresponding to the laser polishing mechanism, and the other thickness measuring instrument is located directly above the adsorption platform corresponding to the grinding wheel.

[0017] The present invention discloses the following technical effects: the workpiece is automatically loaded through the clamping mechanism, the workpiece is transferred to the laser processing station through the rotation of the turntable, and the laser rough processing of the workpiece is realized with the rotation of the adsorption table and the radial movement of the laser polishing mechanism; then the workpiece is transferred to the grinding station, and the rapid thinning and fine polishing of the workpiece is realized with the rotation of the adsorption table and the radial movement of the grinding mechanism. The present application combines mechanical grinding with laser polishing to process the CVD diamond surface, quickly realizes the thinning and polishing of the workpiece, and improves the processing efficiency; at the same time, the rapid circulation of the workpiece is realized through the cooperation of the turntable and the three adsorption tables. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings constituting a part of the present application are used to provide a further understanding of the present application. The illustrative embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0019] Figure 1 It is a structural schematic diagram of the present invention;

[0020] Figure 2 It is a structural schematic diagram of the laser polishing mechanism of the present invention;

[0021] Figure 3 It is a structural schematic diagram of the grinding mechanism of the present invention;

[0022] Figure 4 is a schematic diagram of the structure of the first motor in the present invention;

[0023] Figure 5 It is a schematic diagram of the internal structure of the cavity of the turntable of the present invention;

[0024] Figure 6 It is a longitudinal cross-sectional view of the adsorption platform in the present invention.

[0025] In the figure: 1. turntable; 2. adsorption table; 3. workbench; 4. first motor; 5. laser processor; 6. grinding wheel; 7. first bracket; 8. second motor; 9. first screw; 10. first nut; 11. second bracket; 12. fourth motor; 13. second screw; 14. second nut; 15. manipulator; 16. cavity; 17. third motor; 18. connecting shaft; 19. housing; 20. adsorption hole; 21. vacuum generator; 22. thickness gauge. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] The laser polishing device mainly includes the following components:

[0029] Laser emitting mechanism: used to emit laser to the workpiece. Laser emitting mechanism usually includes laser and power supply. Laser converts electrical energy into light energy to generate laser beam, while power supply provides the required energy and control function for laser.

[0030] Monitoring device: used to collect surface information of workpieces, including thermal imagers, electron microscopes, surveillance cameras and other equipment. These monitoring devices can help monitor the polishing of workpieces in real time to ensure the polishing effect and quality control.

[0031] Other auxiliary equipment: may include cooling systems, protective devices, etc. to ensure the stability and safety of the polishing process.

[0032] Laser polishing technology is known for its high precision and can achieve micron-level processing accuracy with very small errors. When using a laser polishing machine for processing, the position of patterns and holes can be very precise, which is suitable for application scenarios with extremely high precision requirements.

[0033] In addition, laser polishing has the following advantages:

[0034] High processing efficiency: Laser polishing can complete the processing of a hole in a few seconds, while traditional grinding wheel grinding takes longer.

[0035] Good environmental performance: Laser polishing is a non-contact processing technology that does not produce mechanical wear, thus avoiding dust and noise pollution.

[0036] High processing flexibility: Laser polishing can quickly adjust parameters according to the design drawings to achieve processing of any shape and pattern, suitable for complex and changeable processing needs.

[0037] In the prior art, there is a method for laser-assisted polishing of CVD diamond, which includes a laser rough polishing step, a mechanical polishing step, and a deionized water precision polishing step performed in sequence.

[0038] Laser rough polishing steps: select a specific type of laser according to the properties of the CVD diamond material; for example, for polycrystalline CVD diamond, an infrared laser with a wavelength of 1064 nanoseconds is used for polishing, which will cause a certain degree of graphitization. To reduce the occurrence of graphitization, a nanosecond ultraviolet laser with a higher absorption rate can be used for polishing;

[0039] Optimize the appropriate process parameters through laser ablation simulation;

[0040] The CVD diamond workpiece to be polished is mounted on a rotary table, and the CVD diamond is ablated and polished by adjusting the laser incident angle, the rotary table rotation speed and the laser ablation feed speed;

[0041] It is important to choose a suitable laser incident angle during the laser polishing process. On the one hand, a suitable incident angle can reduce the projection area of ​​the laser on the surface of the diamond film and reduce the surface roughness; on the other hand, it can increase the laser energy density and improve the material removal rate.

[0042] Mechanical polishing steps: After laser rough polishing, select the polishing load, workpiece speed and polishing disc speed, and perform mechanical polishing with the assistance of polishing liquid. Select the polishing time according to the thickness of the material to be removed until the required surface quality is obtained.

[0043] Deionized water precision polishing steps: In order to obtain higher polishing surface quality and completely remove the laser-induced surface defect layer, in the final stage of polishing, the polishing liquid is replaced with deionized water and polishing is continued for 5-10 minutes until the surface quality requirements are met.

[0044] In the prior art, there is a device for polishing diamond assisted by femtosecond laser, which includes a first machine, a second machine and a control device with a controller, the first machine can move along the horizontal X axis, the second machine can move along the X, Y, and Z axes forming an orthogonal system and can rotate around the Z axis, the first machine is provided with a mounting device for mounting a diamond workpiece, the second machine is equipped with a distance sensor and a femtosecond laser ablation device, and the distance signal sending end of the distance sensor and the laser output end of the femtosecond laser ablation device are both facing the first machine, the second machine is also equipped with a grinding wheel for grinding and polishing the diamond workpiece, the control device is connected to the first machine, the second machine, the distance sensor and the femtosecond laser ablation device by signal and can control the first machine and the second machine to move within the corresponding degrees of freedom and form data interaction with the distance sensor and the femtosecond laser ablation device.

[0045] The first platform can rotate around a Z axis which is perpendicular to the X axis.

[0046] The mounting device is a vacuum adsorption device with a vacuum adsorption structure and is used to mount the diamond workpiece on the first machine platform by vacuum adsorption.

[0047] The second machine platform is provided with a focusing lens, and the focusing lens is located at the front side of the laser output end of the femtosecond laser ablation device.

[0048] The femtosecond laser ablation device, the distance measuring sensor and the rotation axis of the second machine are all arranged near the middle position of the second machine in the horizontal direction, and the mounting device is arranged at the middle position of the first machine in the horizontal direction.

[0049] Two grinding wheels are provided, which are respectively arranged on both sides of the second machine platform in the horizontal direction.

[0050] It also includes a grinding wheel height calibration device for calibrating the height of the grinding and polishing wheel. The grinding wheel height calibration device is installed on the first machine platform through a lifting structure.

[0051] The method of using the device includes a diamond surface flattening process and a degraphitization process:

[0052] The diamond surface flattening process is as follows: the distance measuring sensor scans the surface of the diamond workpiece mounted on the first machine mounting device to obtain the Z-axis height of each sampling point on the surface of the diamond workpiece, and feeds back to the control device, the control device automatically calculates the processing parameters of the femtosecond laser ablation device according to the measurement data fed back by the distance measuring sensor, and the femtosecond laser ablation device processes the surface of the diamond workpiece, in this way, the distance measuring sensor repeatedly measures the surface of the diamond workpiece and the femtosecond laser ablation device repeatedly processes until the maximum Z-axis height difference and surface roughness of each sampling point on the surface of the diamond workpiece are within the required range;

[0053] The de-graphitization process is as follows: the distance measuring sensor scans the flattened diamond workpiece surface to obtain the highest height of the diamond surface in the Z-axis direction, the first machine and / or the second machine are adjusted so that the grinding and polishing wheel is aligned with the diamond workpiece after femtosecond laser ablation, the grinding and polishing wheel is adjusted to the initial height by the grinding wheel height calibration device, after calibration, the control device controls the second machine to descend along the Z-axis to the working height of the grinding and polishing wheel according to the highest height of the diamond surface in the Z-axis direction, and the grinding and polishing process on the surface of the diamond workpiece is started according to the set de-graphitization processing parameters of the grinding and polishing wheel until there is no graphitization residue on the diamond surface and the surface roughness meets the requirements.

[0054] The method for automatically calculating the processing parameters of the femtosecond laser ablation device is as follows: the coordinate information of the sampling points on the surface of the diamond workpiece scanned by the ranging sensor is (xi, yi, zi), xi, yi are the position coordinates of the sampling points, and zi is the height information of the sampling points. After the scanning is completed, data analysis is performed on zi, and the average value of the smallest several zi values ​​is taken as the height reference after processing. The control device calculates the processing power that should be taken at different sampling points of femtosecond laser ablation based on the height reference.

[0055] Reference Figure 1-Figure 6The present invention provides a device for laser-assisted polishing of CVD diamond, comprising a turntable 1, a first driving assembly is connected to the turntable 1, and the first driving assembly drives the turntable 1 to rotate around its axis; three adsorption platforms 2 are arranged at equal intervals around the axis of the turntable 1 on the top of the turntable 1, and a second driving assembly is arranged on the turntable 1, and the second driving assembly drives the adsorption platform 2 to rotate around its own axis;

[0056] A clamping mechanism, a laser polishing mechanism and a grinding mechanism are provided on one side of the turntable 1, and the clamping mechanism, the grinding mechanism and the laser polishing mechanism are respectively arranged in one-to-one correspondence with the three adsorption platforms 2; the clamping mechanism is used to take and place the workpiece, the laser polishing mechanism is used to move radially along the corresponding adsorption platform 2 to rough grind the workpiece, and the grinding mechanism is used to move radially along the corresponding adsorption platform 2 to finely polish the workpiece.

[0057] The workpiece is positioned by adsorption of the adsorption platform 2; a rubber layer is pasted on the upper surface of the adsorption platform 2, and the rubber layer increases the friction between the adsorption platform 2 and the workpiece, while buffering the processing force of the workpiece and achieving better adsorption.

[0058] During the rough processing, the adsorption table 2 rotates around its own axis, and the laser polishing mechanism moves radially along the radius of the adsorption table 2 during processing, so that the rapid polishing and rough processing of the workpiece can be achieved through the cooperation of the two mechanisms; during the fine polishing, the adsorption table 2 rotates around its own axis, and the grinding mechanism moves radially along the radius of the adsorption table 2, so that the further polishing of the workpiece can be achieved through the cooperation of the two mechanisms.

[0059] The workpiece is automatically loaded through the clamping mechanism, and the workpiece is transferred to the laser processing station through the rotation of the turntable 1. With the rotation of the adsorption table 2 and the radial movement of the laser polishing mechanism, the laser rough processing of the workpiece is realized; then the workpiece is transferred to the grinding station, and with the rotation of the adsorption table 2 and the radial movement of the grinding mechanism, the workpiece is quickly thinned and finely polished. This application combines mechanical grinding with laser polishing to process the CVD diamond surface, quickly realizes the thinning and polishing of the workpiece, and improves the processing efficiency; through the cooperation of the turntable 1 and the three adsorption tables 2, the rapid circulation of the workpiece is realized.

[0060] In some optional embodiments, a workbench 3 is provided at the bottom of the turntable 1 , and the first driving assembly includes a first motor 4 fixedly connected to the top of the workbench 3 , and an output shaft of the first motor 4 is fixedly connected to the bottom of the turntable 1 .

[0061] The turntable 1 is driven to rotate by the first motor 4, thereby realizing the circulation of the workpieces in the three workstations.

[0062] In some optional embodiments, the laser polishing mechanism and the grinding mechanism respectively include a lifting assembly, the two lifting assemblies are arranged on the workbench 3, the lifting ends of the lifting assemblies are fixedly connected with a horizontal moving assembly, the moving end of the horizontal moving assembly on the laser polishing mechanism is provided with a laser processor 5, and the moving end of the horizontal moving assembly of the grinding mechanism is provided with a grinding wheel 6;

[0063] While the adsorption platform 2 corresponding to the laser polishing mechanism rotates around its own axis, the horizontal moving component on the laser polishing mechanism drives the laser processor 5 to move along the radial direction of the adsorption platform 2 to roughly grind the workpiece;

[0064] While the adsorption platform 2 corresponding to the grinding mechanism rotates around its own axis, the horizontal moving component on the grinding mechanism drives the grinding wheel 6 to move along the radial direction of the adsorption platform 2 to finely polish the workpiece.

[0065] The grinding wheel 6 includes a processing motor, and a grinding wheel is fixedly connected to the output shaft of the processing motor. During the processing, the motor drives the grinding wheel to rotate, and the rotation direction of the grinding wheel is opposite to the rotation direction of the adsorption platform 2, thereby increasing the relative speed between the grinding wheel and the adsorption platform 2 and improving the grinding efficiency. The workpiece to be processed can be rectangular, circular, etc., which is not limited in this embodiment.

[0066] The laser processor 5 includes a laser generator and a laser processing head, etc. The laser output by the laser processing head polishes the workpiece.

[0067] After placing the workpiece on the adsorption table 2, the turntable 1 rotates 120° to the bottom of the laser processor 5, adjusts the height of the laser processor 5, and then drives the laser processor 5 to move radially along the adsorption table 2 through the horizontal moving component. The adsorption table 2 rotates at the same time to realize laser processing of the workpiece; then the turntable 1 rotates 120°, and the workpiece rotates to the bottom of the grinding wheel 6 for fine processing. After the processing is completed, the turntable 1 rotates 120° to the bottom of the clamping mechanism to take the workpiece.

[0068] In some additional embodiments, an air blowpipe is fixedly connected to the laser processor 5 to blow impurities out of the working surface during laser processing; a water pipe is fixedly connected to the grinding wheel 4 to perform water-assisted grinding during the grinding and polishing process of the grinding wheel 4 to reduce the grinding temperature of the working surface.

[0069] In some optional embodiments, the lifting assembly includes a first bracket 7 fixedly connected to the workbench 3, a second motor 8 is fixedly connected to the top of the first bracket 7, a first screw 9 is fixedly connected to the output shaft of the second motor 8, the first screw 9 is rotatably connected to the first bracket 7, a first nut 10 is threadedly sleeved on the first screw 9, and the first nut 10 is slidably connected to the side wall of the first bracket 7; the two first nuts 10 are respectively fixed to the two horizontal moving assemblies.

[0070] In some optional embodiments, the horizontal movement assembly includes a second bracket 11 fixedly connected to the first nut 10, a fourth motor 12 is fixedly connected to the second bracket 11, a second screw 13 is fixedly connected to the output shaft of the fourth motor 12, the second screw 13 is rotatably connected to the second bracket 11, the second screw 13 is perpendicular to the first screw 9, the axis of the second screw 13 is parallel to one of the diameters of the corresponding adsorption platform 2, a second nut 14 is threadedly sleeved on the second screw 13, the second nut 14 is slidably connected to the side wall of the second bracket 11, one of the second nuts 14 is fixedly connected to the laser processor 5, and the other second nut 14 is fixedly connected to the grinding wheel 6.

[0071] During use, the first screw 9 is driven to rotate by the second motor 8, thereby driving the first nut 10 to rise and fall, thereby adjusting the height of the laser processor 5 and the grinding wheel 6 respectively; the second screw 13 is driven to rotate by the fourth motor 12, thereby driving the second nut 14 to move horizontally, thereby realizing radial movement of the laser processor 5 and the grinding wheel 6.

[0072] In some optional embodiments, the clamping mechanism includes a robot arm 15 fixedly connected to the workbench 3. The robot arm 15 is used to pick up and place the workpiece.

[0073] In some optional embodiments, a cavity 16 is opened in the turntable 1, and the second driving assembly includes three third motors 17 fixedly connected in the cavity 16. The output shaft of the third motor 17 extends out of the top of the turntable 1 and is fixedly connected to a connecting shaft 18. The three connecting shafts 18 are respectively connected to the three adsorption platforms 2.

[0074] In some optional embodiments, the adsorption platform 2 includes a shell 19 fixedly connected to the connecting shaft 18, an adsorption chamber is provided inside the shell 19, a plurality of adsorption holes 20 connected to the adsorption chamber are provided on the top of the shell 19, a vacuum generator 21 is fixedly connected to the side wall of the connecting shaft 18, and a connecting pipe on the vacuum generator 21 is fixedly connected to the side wall of the shell 19 and connected to the adsorption chamber. The adsorption chamber is evacuated by the vacuum generator 21, so that the workpiece is adsorbed through the adsorption holes 20.

[0075] In some optional embodiments, two thickness measuring instruments 22 are fixedly connected to the workbench 3, one thickness measuring instrument 22 is located directly above the adsorption platform 2 corresponding to the laser polishing mechanism, and the other thickness measuring instrument 22 is located directly above the adsorption platform 2 corresponding to the grinding wheel 6. The thickness of the processed workpiece is measured by the thickness measuring instrument 22.

[0076] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0077] The embodiments described above are only descriptions of the preferred modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. A device for laser-assisted polishing of CVD diamond, characterized in that: The invention comprises a turntable (1), the turntable (1) being connected to a first driving assembly, the first driving assembly driving the turntable (1) to rotate around its axis; three adsorption platforms (2) are arranged at equal intervals around the axis of the turntable (1) on the top of the turntable (1), the turntable (1) being provided with a second driving assembly, the second driving assembly driving the adsorption platform (2) to rotate around its own axis; A clamping mechanism, a laser polishing mechanism and a grinding mechanism are arranged on one side of the turntable (1); the clamping mechanism, the grinding mechanism and the laser polishing mechanism are arranged in one-to-one correspondence with the three adsorption platforms (2); the clamping mechanism is used for taking and placing workpieces, the laser polishing mechanism is used for moving radially along the corresponding adsorption platform (2) to perform rough grinding of the workpiece, and the grinding mechanism is used for moving radially along the corresponding adsorption platform (2) to perform fine polishing of the workpiece.

2. The device for laser-assisted polishing of CVD diamond according to claim 1, characterized in that: A workbench (3) is arranged at the bottom of the turntable (1); the first driving assembly comprises a first motor (4) fixedly connected to the top of the workbench (3); and an output shaft of the first motor (4) is fixedly connected to the bottom of the turntable (1).

3. The device for laser-assisted polishing of CVD diamond according to claim 2, characterized in that: The laser polishing mechanism and the grinding mechanism respectively comprise a lifting assembly, the two lifting assemblies are arranged on the workbench (3), the lifting ends of the lifting assemblies are fixedly connected to a horizontal moving assembly, the moving end of the horizontal moving assembly on the laser polishing mechanism is provided with a laser processor (5), and the moving end of the horizontal moving assembly of the grinding mechanism is provided with a grinding wheel (6); While the adsorption platform (2) corresponding to the laser polishing mechanism rotates around its own axis, the horizontal moving component on the laser polishing mechanism drives the laser processor (5) to move along the radial direction of the adsorption platform (2) to roughly grind the workpiece; While the adsorption platform (2) corresponding to the polishing mechanism rotates around its own axis, the horizontal moving component on the polishing mechanism drives the grinding wheel (6) to move along the radial direction of the adsorption platform (2) to finely polish the workpiece.

4. The device for laser-assisted polishing of CVD diamond according to claim 3, characterized in that: The lifting assembly comprises a first bracket (7) fixedly connected to the workbench (3); a second motor (8) is fixedly connected to the top of the first bracket (7); a first screw (9) is fixedly connected to the output shaft of the second motor (8); the first screw (9) is rotatably connected to the first bracket (7); a first nut (10) is threadedly sleeved on the first screw (9); the first nut (10) is slidably connected to the side wall of the first bracket (7); and two first nuts (10) are respectively fixedly connected to the two horizontal moving assemblies.

5. The device for laser-assisted polishing of CVD diamond according to claim 4, characterized in that: The horizontal moving assembly comprises a second bracket (11) fixedly connected to the first nut (10), a fourth motor (12) fixedly connected to the second bracket (11), a second lead screw (13) fixedly connected to the output shaft of the fourth motor (12), the second lead screw (13) being rotatably connected to the second bracket (11), the second lead screw (13) being perpendicular to the first lead screw (9), the axis of the second lead screw (13) being parallel to one of the diameters of the adsorption platform (2) corresponding to it, a second nut (14) being threadedly sleeved on the second lead screw (13), the second nut (14) being slidably connected to the side wall of the second bracket (11), one of the second nuts (14) being fixedly connected to the laser processor (5), and the other second nut (14) being fixedly connected to the grinding wheel (6).

6. The device for laser-assisted polishing of CVD diamond according to claim 2, characterized in that: The clamping mechanism comprises a robot arm (15) fixedly connected to the workbench (3).

7. The device for laser-assisted polishing of CVD diamond according to claim 1, characterized in that: A cavity (16) is provided in the turntable (1), and the second driving assembly comprises three third motors (17) fixedly connected in the cavity (16); an output shaft of the third motor (17) extends out of the top of the turntable (1) and is fixedly connected to a connecting shaft (18); the three connecting shafts (18) are respectively connected to the three adsorption platforms (2).

8. The device for laser-assisted polishing of CVD diamond according to claim 7, characterized in that: The adsorption platform (2) comprises a shell (19) fixedly connected to the connecting shaft (18), an adsorption chamber is provided inside the shell (19), a plurality of adsorption holes (20) connected to the adsorption chamber are provided on the top of the shell (19), a vacuum generator (21) is fixedly connected to the side wall of the connecting shaft (18), and a connecting pipe on the vacuum generator (21) is fixedly connected to the side wall of the shell (19) and connected to the adsorption chamber.

9. The device for laser-assisted polishing of CVD diamond according to claim 2, characterized in that: Two thickness measuring instruments (22) are fixedly connected to the workbench (3), one of the thickness measuring instruments (22) is located directly above the adsorption platform (2) corresponding to the laser polishing mechanism, and the other thickness measuring instrument (22) is located directly above the adsorption platform (2) corresponding to the grinding wheel (6).

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