Polishing pad finishing equipment and method and control device

Abstract

The invention provides polishing pad finishing equipment and method and a control device, and the equipment comprises a first fixed disc which comprises a driving shaft, the driving shaft is coaxial with the first fixed disc, and the periphery of the driving shaft is provided with first teeth; the placing frame is arranged close to the first fixed disc and used for placing the first trimming unit and the second trimming unit; the transfer structure is arranged close to the first fixed disc; the first trimming unit comprises a plurality of first trimming wheels and a plurality of first trimming pieces; second teeth are arranged on the edge of the first finishing wheel and engaged with the first teeth. A plurality of first mounting holes are formed in the first finishing wheel, located in a straight line penetrating through the circle center of the first finishing wheel and used for mounting the first finishing pieces; the second trimming unit comprises a plurality of second trimming wheels and a plurality of second trimming pieces; third teeth are arranged on the edge of the second finishing wheel and meshed with the first teeth. The distances from the circle centers of the second mounting holes formed in the second finishing wheel to the circle center of the second finishing wheel are the same, and the second mounting holes are used for mounting second finishing pieces.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a polishing pad dressing device, method and control apparatus. Background Art

[0002] Non-woven polishing pads (Suba Pad) have the characteristics of high hardness and low compression rate, and are usually used in the polishing process of silicon wafers. The surface of the new polishing pad needs to be initialized and trimmed before processing to ensure the flatness of the silicon wafer when polishing the silicon wafer. Different trimming methods have different effects on the flatness of the subsequent silicon wafer processing, and it is difficult to simultaneously ensure the global flatness Back Ideal Range (GBIR) and local flatness Front least-aquares Range (SFQR) data of the silicon wafer. Summary of the invention

[0003] The embodiments of the present invention provide a polishing pad dressing device, method and control apparatus to solve the problem in the prior art that different dressing methods have different effects on the flatness of subsequent silicon wafer processing, making it difficult to simultaneously ensure the global flatness and local flatness of the silicon wafer.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] In a first aspect, an embodiment of the present invention provides a polishing pad conditioning device, comprising:

[0006] A first fixed plate, a transfer structure, a first trimming unit, a second trimming unit and a placement rack;

[0007] The first fixed plate comprises a driving shaft, the driving shaft is coaxial with the first fixed plate and the outer periphery of the driving shaft is provided with first teeth;

[0008] The placing rack is arranged close to the first fixed plate, and the first trimming unit and the second trimming unit are placed on the placing rack;

[0009] The transfer structure is disposed close to the first fixed plate, and is used to transfer the first trimming unit and the second trimming unit from the placement rack to the first fixed plate, or to transfer the first trimming unit and the second trimming unit from the first fixed plate to the placement rack;

[0010] The first dressing unit comprises: a plurality of first dressing wheels and a plurality of first dressing sheets; the first dressing wheel edge is provided with second teeth, the second teeth meshing with the first teeth; the first dressing wheel is provided with a plurality of first mounting holes, the plurality of first mounting holes are located on a straight line passing through the center of the first dressing wheel, and are used to mount the first dressing sheets, the first dressing sheets are used to dress the polishing pad;

[0011] The second dressing unit includes: multiple second dressing wheels and multiple second dressing sheets; the second dressing wheel edge is provided with third teeth, and the third teeth are meshed with the first teeth; the second dressing wheel is provided with multiple second mounting holes, and the distances from the centers of the multiple second mounting holes to the center of the second dressing wheel are the same, which are used to install the second dressing sheets, and the second dressing sheets are used to dress the polishing pad.

[0012] Furthermore, the transfer structure includes: at least one robotic arm, and the robotic arm is used to transfer the first trimming unit or the second trimming unit.

[0013] Furthermore, the transfer structure includes: at least one adsorption head, and the adsorption head is used to transfer the first trimming unit or the second trimming unit.

[0014] Further, the polishing pad dressing device further comprises: a second fixed plate;

[0015] A through hole is provided at the center of the second fixed plate, and the through hole is embedded in the driving shaft;

[0016] The transfer structure is also used to transfer the second fixed plate to above the first fixed plate until the through hole is nested on the driving shaft, or to control the second fixed plate to move away from the first fixed plate;

[0017] Wherein, during the process of dressing the polishing pad, the polishing pad is placed on the first fixed plate and the second fixed plate, and the first dressing unit or the second dressing unit is arranged between the first fixed plate and the second fixed plate to dress the polishing pad.

[0018] Furthermore, the polishing pad dressing device further includes: a driving mechanism, and the driving mechanism is used to control the rotation of the first fixed plate and the second fixed plate.

[0019] Further, the polishing pad dressing device further includes: a third dressing unit;

[0020] The third trimming unit is arranged close to the first fixed plate;

[0021] The third dressing unit includes a diamond dressing disk for performing initial dressing on the polishing pad.

[0022] Furthermore, the first trimming sheet and the second trimming sheet are both diamond discs.

[0023] In a second aspect, an embodiment of the present invention provides a polishing pad conditioning method, comprising:

[0024] The first trimming unit is transferred from the placement rack to the first fixed plate by the transfer structure, and the first trimming wheel is engaged with the driving shaft, and the second fixed plate is controlled to be nested in the driving shaft through the through hole;

[0025] Controlling the first fixed plate and the second fixed plate to rotate in a first direction at a first preset speed, and the first dressing wheel to rotate in a second direction at a second preset speed, wherein the first direction is opposite to the second direction;

[0026] Transferring the second fixed plate and the first trimming unit from the first fixed plate to the placement rack by the transfer structure;

[0027] The second trimming unit is transferred from the placement rack to the first fixed plate by the transfer structure, and the second trimming wheel is engaged with the driving shaft, and the second fixed plate is controlled to be nested in the driving shaft through the through hole;

[0028] Controlling the first fixed plate and the second fixed plate to rotate around a first direction at a third preset speed, and the second dressing wheel to rotate around a second direction at a fourth preset speed, wherein the first direction is opposite to the second direction;

[0029] Wherein, the polishing pad is arranged on the first fixed plate and the second fixed plate.

[0030] Furthermore, before the first trimming unit is transferred from the placement rack to the first fixed plate by the transfer structure, the method further includes:

[0031] The polishing pad is initially dressed by the third dressing unit to ensure the amount of removal from the surface of the polishing pad.

[0032] In a third aspect, an embodiment of the present invention provides a control device, including:

[0033] A first transfer module is used to transfer the first trimming unit from the placement rack to the first fixed plate through a transfer structure, and the first trimming wheel is engaged with the driving shaft, and the second fixed plate is controlled to be nested in the driving shaft through a through hole;

[0034] A first control module, configured to control the first fixed plate and the second fixed plate to rotate in a first direction at a first preset speed, and the first dressing wheel to rotate in a second direction at a second preset speed, wherein the first direction is opposite to the second direction;

[0035] A second transfer module, used for transferring the second fixed plate and the first trimming unit from the first fixed plate to the placement rack through the transfer structure;

[0036] A third transfer module is used to transfer the second trimming unit from the placement rack to the first fixed plate through the transfer structure, and the second trimming wheel is engaged with the driving shaft, and the second fixed plate is controlled to be nested in the driving shaft through the through hole;

[0037] A second control module, used for controlling the first fixed plate and the second fixed plate to rotate around a first direction at a third preset speed, and the second dressing wheel to rotate around a second direction at a fourth preset speed, wherein the first direction is opposite to the second direction;

[0038] Wherein, the polishing pad is arranged on the first fixed plate and the second fixed plate.

[0039] The beneficial effects of the present invention are:

[0040] The polishing pad dressing device of the embodiment of the present invention can perform fine dressing of a large area of ​​the polishing pad to ensure the global flatness of the silicon wafer when the polishing pad grinds the silicon wafer by dressing the polishing pad with a first dressing piece arranged on the first dressing wheel along a straight line passing through the center of the first dressing wheel; and then perform fine dressing of the polishing pad by dressing the polishing pad with a second correction piece arranged on a circle concentric with the first fixed plate on the second dressing wheel, thereby ensuring the local flatness of the silicon wafer grinding. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 A schematic diagram showing the position of the first dressing wheel relative to the first fixed plate according to an embodiment of the present invention;

[0042] Figure 2 A schematic diagram showing the position of the second dressing wheel relative to the first fixed plate according to an embodiment of the present invention;

[0043] Figure 3 A schematic diagram showing the structure of the third trimming of an embodiment of the present invention;

[0044] Figure 4 A schematic diagram showing the steps of a polishing pad dressing method according to an embodiment of the present invention;

[0045] Figure 5 A schematic diagram showing a module of a control device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0046] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will be described in detail in conjunction with the accompanying drawings and specific embodiments. In the following description, specific details such as specific configurations and components are provided only to help fully understand the embodiments of the present invention. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present invention. In addition, for clarity and brevity, the description of known functions and structures is omitted.

[0047] It should be understood that the references to "one embodiment" or "an embodiment" throughout the specification mean that the specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present invention. Therefore, the references to "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0048] Aiming at the problem that different trimming methods in the prior art have different effects on the flatness of subsequent silicon wafer processing, and it is difficult to simultaneously ensure the global flatness and local flatness of the silicon wafer, the present invention provides a polishing pad trimming device, method and control device.

[0049] like Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a polishing pad conditioning device, comprising:

[0050] A first fixed plate 1, a transfer structure, a first trimming unit, a second trimming unit and a placement rack;

[0051] The first fixed plate 1 comprises a driving shaft 11, the driving shaft 11 is coaxial with the first fixed plate 1 and the outer periphery of the driving shaft 11 is provided with first teeth;

[0052] The placing rack is arranged close to the first fixed plate, and the first trimming unit and the second trimming unit are placed on the placing rack;

[0053] The transfer structure is arranged close to the first fixed plate 1, and is used to transfer the first trimming unit and the second trimming unit from the placement rack to the first fixed plate, or to transfer the first trimming unit and the second trimming unit from the first fixed plate to the placement rack;

[0054] The first dressing unit comprises: a plurality of first dressing wheels 21 and a plurality of first dressing sheets 22; the first dressing wheel 21 is provided with second teeth on its edge, the second teeth meshing with the first teeth; the first dressing wheel 21 is provided with a plurality of first mounting holes 23, the plurality of first mounting holes are located on a straight line passing through the center of the first dressing wheel, and are used to mount the first dressing sheets 22, the first dressing sheets 22 being used to dress the polishing pad;

[0055] The second dressing unit includes: multiple second dressing wheels 31 and multiple second dressing sheets 32; the second dressing wheel 31 is provided with third teeth on its edge, and the third teeth are meshed with the first teeth; the second dressing wheel 31 is provided with multiple second mounting holes 33, and the distances from the centers of the multiple second mounting holes 33 to the center of the second dressing wheel 31 are the same, which are used to install the second dressing sheets 32, and the second dressing sheets 32 are used to dress the polishing pad.

[0056] Optionally, the straight line passing through the center of the first dressing wheel also passes through the center of the first fixed plate.

[0057] In one embodiment of the present invention, at least three first mounting holes are arranged on each of the first dressing wheels, the first dressing sheets are arranged on the same straight line, and the center of the first dressing sheet is collinear with the center of the first fixed plate, that is, the first dressing sheets are arranged at 180 degrees. By arranging the first dressing sheets at 180 degrees, a large area of ​​the polishing pad surface can be finely trimmed, thereby accelerating the trimming speed of the polishing pad.

[0058] In one embodiment of the present invention, three mounting holes are provided on each of the second trimming wheels, and the second trimming blades are provided on a circle having the same center as the first fixed disk, and the center of each of the second trimming blades is at the same distance from the center of the first fixed disk, that is, the second trimming blades are provided at 120 degrees. By providing the first trimming blades at 120 degrees, the same as the placement of silicon wafers during the polishing and grinding process of silicon wafers, the movement path of the silicon wafers can be matched to the maximum extent, thereby ensuring the local flatness data of the silicon wafers.

[0059] Optionally, the placement rack is a multi-layer structure, and each layer is provided with one of the first trimming unit or the second trimming unit.

[0060] Optionally, a first trimming wheel equipped with the first trimming blade or a second trimming wheel equipped with the second trimming blade is placed on each layer.

[0061] Optionally, when the first dressing wheels are transferred by the transfer structure, a plurality of the first dressing wheels are transferred as a whole by the transfer structure, or the first dressing wheels are transferred one by one in sequence by the transfer structure.

[0062] Optionally, when the second dressing wheels are transferred by the transfer structure, a plurality of the second dressing wheels are transferred as a whole by the transfer structure, or the second dressing wheels are transferred one by one in sequence by the transfer structure.

[0063] The polishing pad dressing device of the embodiment of the present invention can perform fine dressing of a large area of ​​the polishing pad to ensure the global flatness of the silicon wafer when the polishing pad grinds the silicon wafer by dressing the polishing pad with a first dressing piece arranged on the first dressing wheel along a straight line passing through the center of the first dressing wheel; and then perform fine dressing of the polishing pad by dressing the polishing pad with a second correction piece arranged on a circle concentric with the first fixed plate on the second dressing wheel, thereby ensuring the local flatness of the silicon wafer grinding.

[0064] Optionally, the transfer structure includes: at least one robotic arm, and the robotic arm is used to transfer the first trimming unit or the second trimming unit.

[0065] In an embodiment of the present invention, the transfer structure includes a robotic arm, and the robotic arm transfers the first trimming unit or the second trimming unit as a whole.

[0066] In an embodiment of the present invention, the transfer structure includes a plurality of robotic arms, each of which is used to transfer the first trimmed sheet or the second trimmed sheet.

[0067] Optionally, the transfer structure includes: at least one adsorption head, and the adsorption head is used to transfer the first trimming unit or the second trimming unit.

[0068] In an embodiment of the present invention, the transfer structure includes an adsorption head, and the adsorption head transfers the first trimming unit or the second trimming unit as a whole.

[0069] In an embodiment of the present invention, the transfer structure includes a plurality of adsorption heads, each of which is used to transfer the first trimmed sheet or the second trimmed sheet.

[0070] Optionally, the polishing pad conditioning device further comprises: a second fixed plate;

[0071] A through hole is provided at the center of the second fixed plate, and the through hole is embedded in the driving shaft 11;

[0072] The transfer structure is also used to transfer the second fixed plate to above the first fixed plate 1 until the through hole is nested on the driving shaft 11, or to control the second fixed plate to be away from the first fixed plate 1;

[0073] In the process of dressing the polishing pad, the polishing pad is placed on the first fixed plate 1 and the second fixed plate, and the first dressing unit or the second dressing unit is arranged between the first fixed plate 1 and the second fixed plate to dress the polishing pad.

[0074] Optionally, the first fixed plate is a lower fixed plate, and the second fixed plate is an upper fixed plate.

[0075] Optionally, the polishing pad conditioning device further comprises: a driving mechanism, and the driving mechanism is used to control the rotation of the first fixed plate and the second fixed plate.

[0076] It should be noted that, during the process of correcting the polishing pad, the first fixed plate and the second fixed plate are driven by a driving mechanism to rotate along a first direction; the first correction wheel or the second dressing wheel is driven by the driving shaft to rotate along a second direction, and the first direction is opposite to the second direction.

[0077] In the embodiment of the present application, the first direction is a clockwise direction, and the second direction is a counterclockwise direction.

[0078] The polishing pad dressing device of the embodiment of the present invention can ensure the global and local flatness of the silicon wafer while correcting the polishing pad through the first fixed plate, the first dressing wheel placed on the first fixed plate, the second dressing wheel and the second fixed plate.

[0079] like Figure 3 , the polishing pad dressing device further comprises: a third dressing unit 4;

[0080] The third trimming unit 4 is arranged close to the first fixed plate 1;

[0081] The third dressing unit 4 comprises a diamond dressing disk 41 for performing initial dressing on the polishing pad.

[0082] Optionally, the particle size of the diamond dressing disk is 100 mesh or 200 mesh.

[0083] During use, the polishing pad dressing device of the embodiment of the present application firstly dresses the polishing pad once by the third dressing unit to increase the removal amount of the polishing pad surface; then, the polishing pad is dresses again by the first dressing wheel to ensure the global flatness of the silicon wafer when polishing and grinding the silicon wafer; finally, the polishing pad is dresses by the second dressing wheel to ensure the local flatness of the silicon wafer when polishing and grinding the silicon wafer.

[0084] Optionally, both the first trimming sheet 22 and the second trimming sheet 32 ​​are diamond discs.

[0085] like Figure 4 As shown, the embodiment of the present application also provides a polishing pad dressing method, comprising the following steps:

[0086] Step 401, transferring the first trimming unit from the placement rack to the first fixed plate through the transfer structure, and the first trimming wheel is engaged with the driving shaft, and the second fixed plate is controlled to be nested in the driving shaft through a through hole;

[0087] Step 402, controlling the first fixed plate and the second fixed plate to rotate in a first direction at a first preset speed, and the first dressing wheel to rotate in a second direction at a second preset speed, wherein the first direction is opposite to the second direction;

[0088] Step 403, transferring the second fixed plate and the first trimming unit from the first fixed plate to the placement rack by the transfer structure;

[0089] Step 404, transferring the second trimming unit from the placement rack to the first fixed plate through the transfer structure, and the second trimming wheel is meshed with the driving shaft, and the second fixed plate is controlled to be nested in the driving shaft through the through hole;

[0090] Step 405, controlling the first fixed plate and the second fixed plate to rotate in a first direction at a third preset speed, and the second dressing wheel to rotate in a second direction at a fourth preset speed, wherein the first direction is opposite to the second direction;

[0091] Wherein, the polishing pad is arranged on the first fixed plate and the second fixed plate.

[0092] The polishing pad dressing method of the embodiment of the present invention can perform fine dressing on a large area of ​​the polishing pad to ensure the global flatness of the silicon wafer when the polishing pad grinds the silicon wafer by trimming the polishing pad with a first trimming piece arranged on the first trimming wheel along a straight line passing through the center of the first trimming wheel; and then trimming the polishing pad with a second correction piece arranged on a circle concentric with the first fixed plate on the second trimming wheel to perform fine dressing on the grinding path of the corresponding silicon wafer on the polishing pad, thereby ensuring the local flatness of the silicon wafer grinding.

[0093] Optionally, before the first trimming unit is transferred from the placement rack to the first fixed plate by the transfer structure, the method further includes:

[0094] The polishing pad is initially dressed by the third dressing unit to ensure the amount of removal from the surface of the polishing pad.

[0095] The polishing pad dressing method of the embodiment of the present application firstly dresses the polishing pad once by the third dressing unit to increase the removal amount of the polishing pad surface; then dresses the polishing pad again by the first dressing wheel to ensure the global flatness of the silicon wafer when polishing and grinding the silicon wafer; finally, dresses the polishing pad by the second dressing wheel to ensure the local flatness of the silicon wafer when polishing and grinding the silicon wafer.

[0096] like Figure 5 As shown, an embodiment of the present invention provides a control device 500, including:

[0097] The first transfer module 501 is used to transfer the first trimming unit from the placement rack to the first fixed plate through the transfer structure, and the first trimming wheel is engaged with the driving shaft, and the second fixed plate is controlled to be nested in the driving shaft through the through hole;

[0098] A first control module 502, configured to control the first fixed plate and the second fixed plate to rotate in a first direction at a first preset speed, and the first dressing wheel to rotate in a second direction at a second preset speed, wherein the first direction is opposite to the second direction;

[0099] A second transfer module 503, used for transferring the second fixed plate and the first trimming unit from the first fixed plate to the placement rack through the transfer structure;

[0100] A third transfer module 504 is used to transfer the second trimming unit from the placement rack to the first fixed plate through the transfer structure, and the second trimming wheel is engaged with the driving shaft, and the second fixed plate is controlled to be nested in the driving shaft through the through hole;

[0101] A second control module 505, configured to control the first fixed plate and the second fixed plate to rotate in a first direction at a third preset speed, and the second dressing wheel to rotate in a second direction at a fourth preset speed, wherein the first direction is opposite to the second direction;

[0102] Wherein, the polishing pad is arranged on the first fixed plate and the second fixed plate.

[0103] During use of the control device of the embodiment of the present invention, the polishing pad is trimmed by the first trimming sheet arranged on the first trimming wheel along a straight line passing through the center of the first trimming wheel, so that a large area of ​​the polishing pad can be fine-trimmed to ensure the global flatness of the silicon wafer when the polishing pad grinds the silicon wafer; and the polishing pad is trimmed by the second correction sheet arranged on the second trimming wheel on a circle concentric with the first fixed plate, so that the grinding path of the corresponding silicon wafer on the polishing pad can be fine-trimmed, thereby ensuring the local flatness of the silicon wafer grinding.

[0104] In addition, a specific embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored, and when the program is executed by a processor, the steps of the polishing pad dressing method described above are implemented. The same technical effect can be achieved, and to avoid repetition, it will not be described here.

[0105] An embodiment of the present application also provides a computer program product, including computer instructions. When the computer instructions are executed by a processor, the various processes of the above-mentioned polishing pad dressing method embodiment are implemented and the same technical effect can be achieved. To avoid repetition, they will not be repeated here.

[0106] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary personnel in this technical field, several improvements and modifications can be made without departing from the principles described in the present invention. These improvements and modifications are also within the scope of protection of the present invention.

Claims

1. A polishing pad dressing device, characterized in that: include: A first fixed plate, a transfer structure, a first trimming unit, a second trimming unit and a placement rack; The first fixed plate comprises a driving shaft, the driving shaft is coaxial with the first fixed plate and the outer periphery of the driving shaft is provided with first teeth; The placing rack is arranged close to the first fixed plate, and the first trimming unit and the second trimming unit are placed on the placing rack; The transfer structure is disposed close to the first fixed plate, and is used to transfer the first trimming unit and the second trimming unit from the placement rack to the first fixed plate, or to transfer the first trimming unit and the second trimming unit from the first fixed plate to the placement rack; The first dressing unit comprises: a plurality of first dressing wheels and a plurality of first dressing sheets; the first dressing wheel edge is provided with second teeth, the second teeth meshing with the first teeth; the first dressing wheel is provided with a plurality of first mounting holes, the plurality of first mounting holes are located on a straight line passing through the center of the first dressing wheel, and are used to mount the first dressing sheets, the first dressing sheets are used to dress the polishing pad; The second dressing unit includes: multiple second dressing wheels and multiple second dressing sheets; the second dressing wheel edge is provided with third teeth, and the third teeth are meshed with the first teeth; the second dressing wheel is provided with multiple second mounting holes, and the distances from the centers of the multiple second mounting holes to the center of the second dressing wheel are the same, which are used to install the second dressing sheets, and the second dressing sheets are used to dress the polishing pad.

2. The polishing pad conditioning device according to claim 1, characterized in that: The transfer structure includes: at least one robotic arm, and the robotic arm is used to transfer the first trimming unit or the second trimming unit.

3. The polishing pad conditioning device according to claim 1, characterized in that: The transfer structure includes: at least one adsorption head, and the adsorption head is used to transfer the first trimming unit or the second trimming unit.

4. The polishing pad conditioning device according to claim 1, characterized in that: Also includes: Second fix; A through hole is provided at the center of the second fixed plate, and the through hole is embedded in the driving shaft; The transfer structure is also used to transfer the second fixed plate to above the first fixed plate until the through hole is nested on the driving shaft, or to control the second fixed plate to move away from the first fixed plate; Wherein, during the process of dressing the polishing pad, the polishing pad is placed on the first fixed plate and the second fixed plate, and the first dressing unit or the second dressing unit is arranged between the first fixed plate and the second fixed plate to dress the polishing pad.

5. The polishing pad conditioning device according to claim 4, characterized in that: Also includes: A driving mechanism is used to control the rotation of the first fixed plate and the second fixed plate.

6. The polishing pad conditioning device according to claim 1, characterized in that: Also includes: Third trimming unit; The third trimming unit is arranged close to the first fixed plate; The third dressing unit includes a diamond dressing disk for performing initial dressing on the polishing pad.

7. The polishing pad conditioning device according to claim 1, characterized in that: The first trimming sheet and the second trimming sheet are both diamond discs.

8. A polishing pad dressing method, characterized in that: A polishing pad conditioning device as claimed in any one of claims 1 to 7, comprising: The first trimming unit is transferred from the placement rack to the first fixed plate by the transfer structure, and the first trimming wheel is engaged with the driving shaft, and the second fixed plate is controlled to be nested in the driving shaft through the through hole; Controlling the first fixed plate and the second fixed plate to rotate in a first direction at a first preset speed, and the first dressing wheel to rotate in a second direction at a second preset speed, wherein the first direction is opposite to the second direction; Transferring the second fixed plate and the first trimming unit from the first fixed plate to the placement rack by the transfer structure; The second trimming unit is transferred from the placement rack to the first fixed plate by the transfer structure, and the second trimming wheel is engaged with the driving shaft, and the second fixed plate is controlled to be nested in the driving shaft through the through hole; Controlling the first fixed plate and the second fixed plate to rotate around a first direction at a third preset speed, and the second dressing wheel to rotate around a second direction at a fourth preset speed, wherein the first direction is opposite to the second direction; Wherein, the polishing pad is arranged on the first fixed plate and the second fixed plate.

9. The polishing pad conditioning method according to claim 8, characterized in that: The polishing pad conditioning device according to claim 6, before the first conditioning unit is transferred from the placement rack to the first fixed plate by the transfer structure, further comprising: The polishing pad is initially dressed by the third dressing unit to ensure the amount of removal from the surface of the polishing pad.

10. A control device, applied to the polishing pad conditioning device according to any one of claims 1 to 7, characterized in that: include: A first transfer module is used to transfer the first trimming unit from the placement rack to the first fixed plate through a transfer structure, and the first trimming wheel is engaged with the driving shaft, and the second fixed plate is controlled to be nested in the driving shaft through a through hole; A first control module, configured to control the first fixed plate and the second fixed plate to rotate in a first direction at a first preset speed, and the first dressing wheel to rotate in a second direction at a second preset speed, wherein the first direction is opposite to the second direction; A second transfer module, used for transferring the second fixed plate and the first trimming unit from the first fixed plate to the placement rack through the transfer structure; A third transfer module is used to transfer the second trimming unit from the placement rack to the first fixed plate through the transfer structure, and the second trimming wheel is engaged with the driving shaft, and the second fixed plate is controlled to be nested in the driving shaft through the through hole; A second control module, used for controlling the first fixed plate and the second fixed plate to rotate around a first direction at a third preset speed, and the second dressing wheel to rotate around a second direction at a fourth preset speed, wherein the first direction is opposite to the second direction; Wherein, the polishing pad is arranged on the first fixed plate and the second fixed plate.

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