Semiconductor diode drying device

Abstract

A semiconductor diode drying device disclosed by the present invention comprises a box body, a placing assembly is arranged in the box body, the placing assembly comprises fixing frames, a plurality of fixing plates, liquid leakage holes, a warm air blower, a liquid discharge plate, an air outlet pipe and a box door, the fixing frames are installed at the two ends of the interior of the box body, the number of the fixing plates is multiple, and the liquid leakage holes are communicated with the fixing frames. The fixing plate is slidably connected with the fixing frame, the fixing plate is detachably installed in the box body, the liquid leakage holes are evenly formed in the fixing plate, the warm air blower is installed at one end of the box body, the liquid drainage plate is obliquely arranged at the bottom of the box body, the air outlet pipe is arranged at the top of the box body, and the box door is rotatably connected to one side of the box body. An exhaust assembly is installed on the air outlet pipe, the exhaust assembly comprises an exhaust pipe, a motor and a threaded rod, and the exhaust pipe is connected to one end of the air outlet pipe, so that the technical problem that the quality of the semiconductor diode is difficult to guarantee in the drying process of the semiconductor diode in the prior art is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of drying devices, and more particularly to a semiconductor diode drying device. Background Art

[0002] In the existing technology, semiconductor diodes are key components in electronic circuits, and their performance and reliability directly affect the working stability and service life of the whole machine. However, the current semiconductor diode drying device still has some shortcomings in design and function, which makes it difficult to meet the increasingly high requirements of drying quality and production efficiency, and it is urgently needed to be optimized and improved.

[0003] Secondly, the exhaust system of the existing drying device lacks flexible adjustment means, which is not conducive to optimizing the drying process. During the drying process, a large amount of water vapor will be generated inside the device, which needs to be discharged in time to avoid affecting the drying effect. However, the exhaust system of many devices uses fixed fans and pipelines, which cannot be adaptively adjusted according to actual working conditions and diode characteristics. If the exhaust volume is too small, it will cause the humidity in the furnace to increase and extend the drying time. If the exhaust volume is too large, it will cause heat loss and increase energy consumption. It is difficult for a fixed exhaust method to take into account both drying efficiency and energy utilization, and there is a large room for optimization.

[0004] Furthermore, the fixation and connection of cables is the basis for the reliable operation of the drying device, but the design of existing devices in this regard is still relatively weak. A large number of power cables, signal cables and sensor cables are usually arranged inside the drying device. Most traditional devices are fixed with simple bundling or strapping, lacking reliable stress relief and protection measures. Under long-term high temperature and vibration environment, loose cables are prone to mutual friction, insulation wear, and even cause short circuit, open circuit and other faults, affecting the safe operation of the equipment. Summary of the invention

[0005] 1. Technical issues to be solved

[0006] In view of the problems existing in the prior art, the present invention provides a semiconductor diode drying device to solve the technical problem mentioned in the background technology that the prior art is difficult to ensure the quality of the semiconductor diode during the drying process of the semiconductor diode.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor diode drying device, comprising a box body, a placing component is arranged inside the box body, the placing component comprises a fixing frame, a fixing plate, a leakage hole, a heater, a drain plate, an air outlet pipe and a box door, the fixing frame is installed at both ends of the box body, a plurality of fixing plates are arranged, and the fixing plates are slidably connected to the fixing frames, and the fixing plates are detachably installed inside the box body, the leakage holes are evenly arranged on the fixing plates, the heater is installed at one end of the box body, the drain plate is obliquely arranged at the bottom of the box body, the air outlet pipe is arranged at the top of the box body, the box door is rotatably connected to one side of the box body, an exhaust component is installed on the air outlet pipe, the exhaust component comprises an exhaust pipe, a motor and a threaded rod, the exhaust pipe is connected to one end of the air outlet pipe, the motor is fixedly installed on the outside of the exhaust pipe, and the threaded rod is connected to the output end of the motor.

[0009] The present invention is further configured that a fixing block is fixedly installed on the exhaust pipe, and the exhaust gas flow rate control process is facilitated by using the fixing block.

[0010] The present invention is further configured such that a movable groove is provided on the exhaust pipe, and a movable block is slidably connected to the movable groove, so that the high process of regulating the gas flow rate is facilitated through the coordinated use of various components.

[0011] The present invention is further configured such that a push plate is connected to the moving block, a push spring is connected to one side of the push plate, the push spring is fixedly connected to one end of the inner side of the exhaust pipe, and an exhaust port is opened on one side of the exhaust pipe. The coordinated use of various components facilitates the completion of the gas discharge process.

[0012] The present invention is further configured such that a wire clamping assembly is provided on one side of the box body, and the wire clamping assembly includes a mounting plate, a fixed tube and a movable tube. The mounting plate is fixedly installed on one side of the box body, the fixed tube is fixedly installed on the top of the mounting plate, and the movable tube is slidably connected to one end of the fixed tube. The coordinated use of various components facilitates the completion of the cable fixing process.

[0013] The present invention is further configured such that both the fixed tube and the movable tube are provided with a slot, a telescopic spring is connected in the slot of the movable tube, one end of the telescopic spring is connected with a block, and the block is clamped in the slot of the fixed tube, so that the movement process of the block is facilitated by the coordinated use of various components.

[0014] The present invention is further configured such that a sliding groove is provided inside the fixed tube, an abutment block is slidably connected inside the sliding groove, one end of the abutment block contacts the movable tube, and the coordinated use of various components facilitates the completion of the cable fixing process.

[0015] The present invention is further configured such that a stop block is provided at one end of the fixing tube, a push-out spring is connected to the stop block, and the push-out spring is fixedly connected to the stop block, so that the process of releasing the cable from fixation is facilitated through the coordinated use of various components.

[0016] (III) Beneficial effects

[0017] Compared with the prior art, the present invention provides a semiconductor diode drying device having the following

[0018] Beneficial effects:

[0019] 1. The placement component adopts a combination design of a fixed frame and a detachable fixed plate, which is convenient for loading and removing diodes and can flexibly adapt to the production needs of different batches and specifications. The uniform layout of the leakage holes can effectively promote the removal of moisture on the surface of the diodes. With the inclined drainage plate, the rapid drainage of moisture is achieved, effectively avoiding residual water stains affecting the drying quality. At the same time, the introduction of the heater significantly enhances the heat convection during the drying process. The hot air forms a reasonable circulation flow field in the box, which significantly improves the uniformity and efficiency of drying, shortens the drying time, and improves the production rhythm.

[0020] 2. The design of the exhaust component provides a precise and controllable technical means for the exhaust adjustment of the drying process. By introducing the exhaust pipe and the motor-driven threaded rod into the air outlet pipeline, the adjustment of the motor speed directly determines the movement speed of the threaded rod, which in turn drives the push rod and the spring to cooperate to achieve precise control of the exhaust port opening. This design not only allows flexible adjustment of the exhaust volume according to the humidity in the box and the drying process to optimize the dehumidification effect, but also through the frequency conversion control of the exhaust fan, it can realize the intelligent adjustment of the exhaust flow rate, while ensuring the dehumidification effect, minimizing the heat loss, and achieving energy saving and efficiency improvement in the drying process.

[0021] 3. The ingenious design of the cable clamping assembly provides a strong guarantee for the safe and reliable fixation of the cables inside the drying device. The setting of the mounting plate and the fixed tube provides a solid foundation for the cable fixation. With the slidable movable tube, the flexible adjustment of the cable position is realized. At the same time, slots are opened on the fixed tube and the movable tube and are equipped with elastic blocks. The compression and release of the spring can realize the rapid fixation and reliable locking of the cable. The ingenious cooperation of the sliding groove and the abutment block not only pushes the movable tube to reset, but also guides and limits the block, ensuring that the block can be reliably embedded in the slot. The whole set of cable clamping assembly is simple and reliable to operate. The cable can be fixed and released by simple push-pull action, and the fixation is reliable and can withstand the long-term vibration and impact of the equipment. The hidden dangers of cable loosening and falling off are completely eliminated, providing a solid guarantee for the stable operation of the drying device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1It is a schematic diagram of the overall structure of a semiconductor diode drying device in the present invention;

[0023] Figure 2 It is a side view structural schematic diagram of the present invention;

[0024] Figure 3 It is a structural schematic diagram of the wire clamping assembly in the present invention;

[0025] Figure 4 It is a cross-sectional structural schematic diagram of the wire clamping assembly in the present invention;

[0026] Figure 5 It is a schematic diagram of the structure of the exhaust assembly in the present invention;

[0027] Figure 6 It is a schematic cross-sectional structural diagram of the exhaust assembly in the present invention.

[0028] In the figure: 1. box body; 2. fixing frame; 3. fixing plate; 4. leakage hole; 5. heater; 6. drain plate; 7. exhaust pipe; 8. box door; 9. exhaust pipe; 10. motor; 11. threaded rod; 12. fixing block; 13. moving groove; 14. moving block; 15. pushing plate; 16. pushing spring; 17. exhaust port; 18. mounting plate; 19. fixing pipe; 20. moving pipe; 21. slot; 22. telescopic spring; 23. block; 24. sliding slot; 25. abutment block; 26. abutment block; 27. abutment spring. DETAILED DESCRIPTION

[0029] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0030] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0031] In the present invention, unless otherwise specified, the directions used, such as "up" and "down", usually refer to the directions shown in the drawings, or to the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "left" and "right" usually refer to the left and right shown in the drawings; "inside" and "outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directions are not used to limit the present invention.

[0032] See also Figure 1-6A semiconductor diode drying device comprises a box body 1, wherein a placement component is arranged inside the box body 1, and the placement component comprises a fixing frame 2, a fixing plate 3, a leakage hole 4, a heater 5, a drainage plate 6, an air outlet pipe 7 and a box door 8. The fixing frame 2 is installed at both ends inside the box body 1, and a plurality of fixing plates 3 are arranged, and the fixing plates 3 are slidably connected to the fixing frame 2, and the fixing plates 3 are detachably installed inside the box body 1, and the leakage hole 4 is evenly arranged on the fixing plate 3, the heater 5 is installed at one end of the box body 1, the drainage plate 6 is tiltedly arranged at the bottom of the box body 1, the air outlet pipe 7 is arranged at the top of the box body 1, and the box door 8 is rotatably connected to one side of the box body 1, and an exhaust component is installed on the air outlet pipe 7, and the exhaust component comprises an exhaust pipe 9, a motor 10 and a threaded rod 11, the exhaust pipe 9 is connected to one end of the air outlet pipe 7, the motor 10 is fixedly installed on the outside of the exhaust pipe 9, and the threaded rod 11 is connected to the output end of the motor 10.

[0033] A fixing block 12 is fixedly mounted on the exhaust pipe 9 .

[0034] A moving groove 13 is formed on the exhaust pipe 9 , and a moving block 14 is slidably connected to the moving groove 13 .

[0035] A push plate 15 is connected to the moving block 14 , and a push spring 16 is connected to one side of the push plate 15 . The push spring 16 is fixedly connected to one end of the inner side of the exhaust pipe 9 , and an exhaust port 17 is opened on one side of the exhaust pipe 9 .

[0036] In this embodiment, during the drying process of the semiconductor diode, the box door 8 is opened manually, and the semiconductor diode to be dried is placed on the fixing plate 3 manually. At this time, the moisture on the semiconductor diode will flow out along the leakage hole 4 on the fixing plate 3, and then be discharged along the drainage plate 6 inclined at the bottom side of the box body 1. Then, the heater 5 is manually started, so that the wind blown by the heater 5 blows the semiconductor diode inside the box body 1, thereby completing the drying process of the semiconductor diode. After the drying process is completed, the hot air generated by the drying process flows along the drain plate 6. The gas is discharged through the exhaust pipe 7. At this time, the motor 10 is manually started to drive the threaded rod 11 at the output end to rotate, and the fixed block 12 is used to rotate. When the threaded rod 11 rotates, the moving block 14 is driven to slide in the moving groove 13 of the exhaust pipe 9. During the movement of the moving block 14, the push plate 15 on the inner side of the exhaust pipe 9 is driven to move, so that the push plate 15 squeezes the push spring 16 on the inner side of the exhaust pipe 9, so that the gas discharged from the exhaust pipe 7 can be discharged along the exhaust port 17 of the exhaust pipe 9.

[0037] See also Figure 3-4As an implementation method of a semiconductor diode drying device for a wire clamping assembly: a wire clamping assembly is arranged on one side of a box body 1, and the wire clamping assembly includes a mounting plate 18, a fixed tube 19 and a movable tube 20. The mounting plate 18 is fixedly mounted on one side of the box body 1, the fixed tube 19 is fixedly mounted on the top of the mounting plate 18, and the movable tube 20 is slidably connected to one end of the fixed tube 19.

[0038] A slot 21 is provided on both the fixed tube 19 and the movable tube 20 . A telescopic spring 22 is connected in the slot 21 of the movable tube 20 . A clamping block 23 is connected at one end of the telescopic spring 22 . The clamping block 23 is clamped in the slot 21 of the fixed tube 19 .

[0039] A sliding groove 24 is formed inside the fixed tube 19 . An abutment block 25 is slidably connected inside the sliding groove 24 . One end of the abutment block 25 contacts the movable tube 20 .

[0040] One end of the fixed tube 19 is provided with an abutting block 26 , and the abutting block 26 is connected with an abutting spring 27 , and the abutting spring 27 is fixedly connected to the abutting block 25 .

[0041] More specifically, when fixing the cables of this device, the cables are manually input from one side of the fixed tube 19, and then output from one end of the mobile tube 20. After all the cables are led out, the block 23 on the fixed tube 19 is manually pressed, and the telescopic spring 22 is squeezed, so that the block 23 can be received in the card slot 21 of the mobile tube 20. At this time, the mobile tube 20 is manually moved, and the moving block 14 pushes the abutment block 25, so that the abutment block 25 slides in the sliding slot 24 on the fixed tube 19. At this time, the abutment block 25 is equipped with The abutting block 26 squeezes the abutting spring. At this time, the card block 23 is ejected by the action of the telescopic spring 22. At this time, the card block 23 is inserted into the fixed tube 19 to complete the clamping process of the cable. When it is necessary to release the fixation, the card block 23 is manually pressed to compress the telescopic spring 22, so that the card block 23 is received in the card slot 21 of the mobile tube 20. At this time, the mobile tube 20 is pulled out of the fixed tube 19, and the abutting block 25 is pushed out along the sliding groove 24 by the action of the abutting block 26 and the abutting spring 27, thereby releasing the fixing process of the cable.

[0042] In summary, when the overall device is in use or running: during the process of drying the semiconductor diode, the box door 8 is opened manually, and the semiconductor diode to be dried is placed on the fixing plate 3 manually. At this time, the moisture on the semiconductor diode will flow out along the leakage hole 4 on the fixing plate 3, and then be discharged along the drainage plate 6 inclined at the bottom side of the box body 1. Then, the heater 5 is started manually, so that the wind blown by the heater 5 blows the semiconductor diode inside the box body 1, thereby completing the drying process of the semiconductor diode. After the drying process is completed, the moisture produced by the drying process The generated hot gas is discharged along the exhaust pipe 7. At this time, the motor 10 is manually started to drive the threaded rod 11 at the output end to rotate, and to use the fixed block 12 to rotate. When the threaded rod 11 rotates, it drives the moving block 14 to slide in the moving groove 13 of the exhaust pipe 9. During the movement of the moving block 14, it drives the push plate 15 on the inner side of the exhaust pipe 9 to move, so that the push plate 15 squeezes the push spring 16 on the inner side of the exhaust pipe 9, so that the gas discharged from the exhaust pipe 7 can be discharged along the exhaust port 17 of the exhaust pipe 9.

[0043] When fixing the cables of the device, the cables are manually input from one side of the fixed tube 19, and then output from one end of the mobile tube 20. After all the cables are led out, the block 23 on the fixed tube 19 is manually pressed, and the telescopic spring 22 is squeezed, so that the block 23 can be received in the card slot 21 of the mobile tube 20. At this time, the mobile tube 20 is manually moved, and the moving block 14 pushes the abutment block 25, so that the abutment block 25 slides in the sliding slot 24 on the fixed tube 19. At this time, the abutment block 25 cooperates with the abutment block 25 to move. The block 26 squeezes the abutment spring, and the block 23 is ejected under the action of the telescopic spring 22. At this time, the block 23 is inserted into the fixed tube 19 to complete the clamping process of the cable. When it is necessary to release the fixation, the block 23 is pressed manually to compress the telescopic spring 22, so that the block 23 is stored in the slot 21 of the mobile tube 20. At this time, the mobile tube 20 is pulled out of the fixed tube 19, and the abutment block 25 is pushed out along the sliding slot 24 under the action of the abutment block 26 and the abutment spring 27, thereby releasing the fixing process of the cable.

[0044] In all the schemes mentioned above, the connection between two parts can be selected according to actual conditions by welding, bolt and nut matching connection, bolt or screw connection or other well-known connection methods, which will not be described one by one here. In the above, all fixed connections are preferably welded. Although the embodiments of the present invention have been shown and described, it can be understood by ordinary technicians in this field that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. A semiconductor diode drying device, comprising a box (1), wherein a placement component is arranged inside the box (1), wherein the placement component comprises a fixing frame (2), a fixing plate (3), a leakage hole (4), a heater (5), a drainage plate (6), an air outlet pipe (7) and a box door (8), wherein the fixing frame (2) is installed at both ends inside the box (1), a plurality of fixing plates (3) are provided, and the fixing plates (3) are slidably connected to the fixing frame (2), and the fixing plates (3) are detachably installed inside the box (1), and the leakage holes (4) are evenly arranged on the fixing plates (3). The heater (5) is installed at one end of the box body (1), the drain plate (6) is tiltedly arranged at the bottom of the box body (1), the air outlet pipe (7) is arranged at the top of the box body (1), the box door (8) is rotatably connected to one side of the box body (1), an exhaust assembly is installed on the air outlet pipe (7), and the exhaust assembly includes an exhaust pipe (9), a motor (10) and a threaded rod (11), the exhaust pipe (9) is connected to one end of the air outlet pipe (7), the motor (10) is fixedly installed on the outside of the exhaust pipe (9), and the threaded rod (11) is connected to the output end of the motor (10).

2. A semiconductor diode drying device according to claim 1, characterized in that: A fixing block (12) is fixedly mounted on the exhaust pipe (9).

3. A semiconductor diode drying device according to claim 2, characterized in that: The exhaust pipe (9) is provided with a movable groove (13), and a movable block (14) is slidably connected to the movable groove (13).

4. A semiconductor diode drying device according to claim 3, characterized in that: The moving block (14) is connected to a push plate (15), one side of the push plate (15) is connected to a push spring (16), the push spring (16) is fixedly connected to one end of the inner side of the exhaust pipe (9), and one side of the exhaust pipe (9) is provided with an exhaust port (17).

5. A semiconductor diode drying device according to any one of claims 1 to 4, characterized in that: A wire clamping assembly is arranged on one side of the box body (1), and the wire clamping assembly comprises a mounting plate (18), a fixed tube (19) and a movable tube (20); the mounting plate (18) is fixedly mounted on one side of the box body (1), the fixed tube (19) is fixedly mounted on the top of the mounting plate (18), and the movable tube (20) is slidably connected to one end of the fixed tube (19).

6. A semiconductor diode drying device according to claim 5, characterized in that: The fixed tube (19) and the movable tube (20) are both provided with a clamping groove (21), a telescopic spring (22) is connected in the clamping groove (21) of the movable tube (20), a clamping block (23) is connected at one end of the telescopic spring (22), and the clamping block (23) is clamped in the clamping groove (21) of the fixed tube (19).

7. A semiconductor diode drying device according to claim 6, characterized in that: A sliding groove (24) is provided inside the fixed tube (19), and a contact block (25) is slidably connected inside the sliding groove (24), and one end of the contact block (25) is in contact with the movable tube (20).

8. A semiconductor diode drying device according to claim 7, characterized in that: One end of the fixed tube (19) is provided with a stop block (26), and a stop spring (27) is connected to the stop block (26), and the stop spring (27) is fixedly connected to the stop block (25).

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