Testing system, method and equipment of infrared focal plane detector and storage medium

Abstract

The invention provides a test system, method and device of an infrared focal plane detector and a storage medium. The system comprises an infrared focal plane detector to be detected, an interface board and a data acquisition module, the interface board is electrically connected with the infrared focal plane detector to be detected and the data acquisition module respectively; the interface board is configured to obtain an output signal of the infrared focal plane detector to be detected, preprocess the output signal to obtain an acquisition signal, and send the acquisition signal to the data acquisition module; and the data acquisition module is configured to determine test parameters of the to-be-tested infrared focal plane detector according to the acquisition signals. The interface board comprises an input module and an output module; the input module is electrically connected with the infrared focal plane detector to be detected and is configured to provide an input signal for the infrared focal plane detector to be detected; and the output module is electrically connected with the data acquisition module and is configured to obtain an output signal generated by the infrared focal plane detector to be detected under the input signal.

Description

Technical Field

[0001] The present disclosure relates to the field of device detection technology, and in particular to a test system, method, equipment and storage medium for an infrared focal plane detector. Background Art

[0002] There are many types of optoelectronic devices used in missile and ground weapon systems, including infrared focal plane detectors used in infrared guidance. The focal plane on the infrared focal plane detector has thousands of pixels and a readout circuit, which has the dual functions of signal acquisition and signal readout. However, it is currently impossible to accurately and comprehensively test the parameters of the infrared focal plane detector.

[0003] In view of this, how to accurately and comprehensively test the parameters of infrared focal plane detectors has become a technical problem that needs to be solved urgently. Summary of the invention

[0004] In view of this, the purpose of the present disclosure is to provide a testing system, method, device and storage medium for an infrared focal plane detector to solve or partially solve the above technical problems.

[0005] Based on the above purpose, the first aspect of the present disclosure provides a test system for an infrared focal plane detector, the system comprising: an infrared focal plane detector to be tested, an interface board and a data acquisition module; the interface board is electrically connected to the infrared focal plane detector to be tested and the data acquisition module respectively;

[0006] The interface board is configured as follows:

[0007] Acquire a first output signal of the infrared focal plane detector to be tested at a high-temperature blackbody temperature, preprocess the first output signal to obtain a first acquisition signal, and send the first acquisition signal to the data acquisition module;

[0008] Acquire a second output signal of the infrared focal plane detector to be tested at a low-temperature blackbody temperature, preprocess the second output signal to obtain a second acquisition signal, and send the second acquisition signal to the data acquisition module;

[0009] The data acquisition module is configured as follows:

[0010] Determine a first voltage average value from the first collected signal, and determine a second voltage average value from the second collected signal;

[0011] Determine a first response voltage, a first noise voltage, and a first radiation power at a high blackbody temperature based on the first voltage average value, and determine a second response voltage, a second noise voltage, and a second radiation power at a low blackbody temperature based on the second voltage average value;

[0012] determining a first response rate at a high black body temperature based on the first response voltage and the first radiation power, determining a second response rate at a low black body temperature based on the second response voltage and the second radiation power, and determining a response rate from the high black body temperature to the low black body temperature based on the first response rate and the second response rate;

[0013] Determine a first pixel equivalent temperature difference at a high-temperature blackbody temperature based on the first response voltage and the first noise voltage, determine a second pixel equivalent temperature difference at a high-temperature blackbody temperature based on the second response voltage and the second noise voltage, and determine a pixel equivalent temperature difference from the high-temperature blackbody temperature to the low-temperature blackbody temperature based on the first pixel equivalent temperature difference and the second pixel equivalent temperature difference;

[0014] Determine an invalid pixel matrix from the first acquisition signal and the second acquisition signal, and determine an invalid pixel rate based on the invalid pixel matrix;

[0015] The response rate, the pixel equivalent temperature difference and the invalid pixel rate are used as test parameters of the infrared focal plane detector to be tested.

[0016] Based on the same inventive concept, the second aspect of the present disclosure proposes a test method for an infrared focal plane detector, which is applied to the test system for the infrared focal plane detector described in the first aspect, and the system includes: an infrared focal plane detector to be tested, an interface board, and a data acquisition module; the method includes:

[0017] The interface board obtains the output signal of the infrared focal plane detector to be tested, pre-processes the output signal to obtain a collection signal, and sends the collection signal to the data acquisition module;

[0018] The data acquisition module determines the test parameters of the infrared focal plane detector to be tested according to the acquisition signal.

[0019] Based on the same inventive concept, the third aspect of the present disclosure proposes an electronic device, including a memory, a processor, and a computer program stored in the memory and executable by the processor, wherein the processor implements the method as described above when executing the computer program.

[0020] Based on the same inventive concept, a fourth aspect of the present disclosure proposes a non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a computer to execute the method as described above.

[0021] From the above, it can be seen that the test system, method, device and storage medium of the infrared focal plane detector provided by the present disclosure. The interface board can obtain the output signal of the infrared focal plane detector to be tested at different black body temperatures, and send the output signal to the data acquisition module after preprocessing, so that the data acquisition module analyzes the collected signals at different black body temperatures to obtain the test parameters of the infrared focal plane detector to be tested. The data acquisition module analyzes the collected signals at different black body temperatures, and can obtain the response rate, pixel equivalent temperature difference and invalid pixel rate as the test parameters of the infrared focal plane detector to be tested, so that the parameters of the infrared focal plane detector to be tested can be accurately and comprehensively tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the present disclosure or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 It is a first structural schematic diagram of a testing system for an infrared focal plane detector according to an embodiment of the present disclosure;

[0024] Figure 2 It is a second structural schematic diagram of the testing system of the infrared focal plane detector according to an embodiment of the present disclosure;

[0025] Figure 3 A third structural schematic diagram of the test system of the infrared focal plane detector according to an embodiment of the present disclosure;

[0026] Figure 4 It is a schematic diagram of the structure of infrared focal plane detection according to an embodiment of the present disclosure;

[0027] Figure 5 is a flow chart of a method for testing an infrared focal plane detector according to an embodiment of the present disclosure;

[0028] Figure 6 It is a schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure.

[0029] Description of reference numerals:

[0030] 100. A test system for an infrared focal plane detector, 110. An infrared focal plane detector to be tested, 120. An interface board, 121. An input module, 1211. A power input module, 1212. A bias input module, 1213. A timing input module, 122. An output module, 130. A data acquisition module, and 131. A storage module. DETAILED DESCRIPTION

[0031] In order to make the objectives, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0032] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the embodiments of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0033] Based on the description of the background technology, there are many types of optoelectronic devices currently used in missile and ground weapon systems, including infrared focal plane detectors used in infrared guidance. The focal plane has thousands of pixels and a readout circuit, which has the dual functions of signal acquisition and signal readout. Compared with infrared unit detectors, it is a completely new type of optoelectronic device. The focal plane characteristics of infrared focal plane detectors bring more test evaluation parameters. Considering the current needs, the importance of devices to the system, and the planning of project development, infrared detectors are included in the scope of research on optoelectronic device testing technology at this stage. By investigating and studying the testing technology of infrared focal plane detectors, support can be provided for the construction of detection capabilities of optoelectronic devices. However, there are certain gaps in the types of test devices, the accuracy of test parameters, and the number of test institutions. The research direction is mainly in infrared detector testing technology. Infrared focal plane arrays are the core components of new generation infrared systems such as infrared staring imaging and imaging spectrometers. At present, there are relatively few studies on the testing methods and technologies of infrared focal plane detectors. Therefore, it is necessary to conduct certain in-depth research on the testing methods and technologies of infrared focal plane detectors.

[0034] As mentioned above, how to accurately and comprehensively test the parameters of infrared focal plane detectors has become an important research issue.

[0035] Based on the above description, if Figure 1As shown, the infrared focal plane detector test system 100 proposed in this embodiment includes: an infrared focal plane detector to be tested 110, an interface board 120 and a data acquisition module 130; the interface board 120 is electrically connected to the infrared focal plane detector to be tested 110 and the data acquisition module 130 respectively;

[0036] The interface board 120 is configured as follows:

[0037] Acquire a first output signal of the infrared focal plane detector 110 to be tested at a high-temperature blackbody temperature, preprocess the first output signal to obtain a first acquisition signal, and send the first acquisition signal to the data acquisition module 130;

[0038] Acquire a second output signal of the infrared focal plane detector 110 to be tested at a low-temperature blackbody temperature, preprocess the second output signal to obtain a second acquisition signal, and send the second acquisition signal to the data acquisition module 130;

[0039] The data acquisition module 130 is configured as follows:

[0040] Determine a first voltage average value from the first collected signal, and determine a second voltage average value from the second collected signal;

[0041] Determine a first response voltage, a first noise voltage, and a first radiation power at a high blackbody temperature based on the first voltage average value, and determine a second response voltage, a second noise voltage, and a second radiation power at a low blackbody temperature based on the second voltage average value;

[0042] determining a first response rate at a high black body temperature based on the first response voltage and the first radiation power, determining a second response rate at a low black body temperature based on the second response voltage and the second radiation power, and determining a response rate from the high black body temperature to the low black body temperature based on the first response rate and the second response rate;

[0043] Determine a first pixel equivalent temperature difference at a high-temperature blackbody temperature based on the first response voltage and the first noise voltage, determine a second pixel equivalent temperature difference at a high-temperature blackbody temperature based on the second response voltage and the second noise voltage, and determine a pixel equivalent temperature difference from the high-temperature blackbody temperature to the low-temperature blackbody temperature based on the first pixel equivalent temperature difference and the second pixel equivalent temperature difference;

[0044] Determine an invalid pixel matrix from the first acquisition signal and the second acquisition signal, and determine an invalid pixel rate based on the invalid pixel matrix;

[0045] The response rate, the pixel equivalent temperature difference and the invalid pixel rate are used as test parameters of the infrared focal plane detector 110 to be tested.

[0046] During specific implementation, the infrared focal plane detector 110 to be tested is electrically connected to the interface board 120 , and the interface board 120 is electrically connected to the data acquisition module 130 .

[0047] The interface board 120 is used to obtain the output signal of the infrared focal plane detector 110 to be tested, and pre-process the output signal to obtain the acquisition signal. The data acquisition module 130 is used to analyze the acquisition signal to obtain the test parameters of the infrared focal plane detector 110 to be tested.

[0048] The first output signal is the continuous F frame output data of the infrared focal plane detector 110 under high black body temperature. The second output signal is the continuous F frame output data of the infrared focal plane detector 110 under low black body temperature. Preferably, F≥100.

[0049] The data acquisition module 130 obtains a first response voltage and a first radiation power according to the first voltage average value; obtains a first response rate of the infrared focal plane detector 110 to be tested at a high black body temperature according to the first response voltage and the first radiation power. The data acquisition module 130 obtains a second response voltage and a second radiation power according to the second voltage average value; obtains a second response rate of the infrared focal plane detector 110 to be tested at a low black body temperature according to the second response voltage and the second radiation power. The response rate from the high black body temperature to the low black body temperature is determined according to the first response rate and the second response rate.

[0050] The data acquisition module 130 obtains a first response voltage and a first noise voltage according to the first voltage average value; obtains a first pixel equivalent temperature difference of the infrared focal plane detector 110 to be tested at a high black body temperature according to the first response voltage and the first noise voltage. The data acquisition module 130 obtains a second response voltage and a second noise voltage according to the second voltage average value; obtains a second pixel equivalent temperature difference of the infrared focal plane detector 110 to be tested at a low black body temperature according to the second response voltage and the second noise voltage. The pixel equivalent temperature difference from the high black body temperature to the low black body temperature is determined according to the first pixel equivalent temperature difference and the second pixel equivalent temperature difference.

[0051] The data acquisition module 130 determines the invalid pixel rate based on the invalid pixel matrix. At the same time, the valid pixel matrix can also be determined based on the invalid pixel matrix. After excluding the invalid pixels, the average noise voltage, average response rate, average NETD and response rate non-uniformity (UR) of the infrared focal plane detector 110 to be tested are calculated.

[0052] The disclosed embodiments take the DLD650 uncooled infrared focal plane detector as the starting point, and study the relevant infrared focal plane detector optoelectronic parameter testing and verification methods and technologies to solve the urgent need for comprehensive evaluation of infrared focal plane detector performance in equipment engineering applications, and promote the overall performance development and quality control of the device.

[0053] Through the above embodiment, the interface board can obtain the output signal of the infrared focal plane detector to be tested at different black body temperatures, and send the output signal to the data acquisition module after preprocessing, so that the data acquisition module analyzes the collected signals at different black body temperatures to obtain the test parameters of the infrared focal plane detector to be tested. The data acquisition module analyzes the collected signals at different black body temperatures and can obtain the response rate, pixel equivalent temperature difference and invalid pixel rate as the test parameters of the infrared focal plane detector to be tested, so that the parameters of the infrared focal plane detector to be tested can be accurately and comprehensively tested.

[0054] In some embodiments, Figure 2 As shown, the interface board 120 includes: an input module 121 and an output module 122;

[0055] The input module 121 is electrically connected to the infrared focal plane detector 110 to be tested, and is configured to provide an input signal to the infrared focal plane detector 110 to be tested;

[0056] The output module 122 is electrically connected to the data acquisition module 130 , and is configured to obtain the output signal generated by the infrared focal plane detector 110 under the input signal, preprocess the output signal to obtain a collection signal, and send the collection signal to the data acquisition module 130 .

[0057] In a specific implementation, the input module 121 is used to provide an input signal to the infrared focal plane detector 110 to be tested. The output module 122 is used to pre-process the output signal of the infrared focal plane detector 110 to be tested.

[0058] Through the above solution, the output signal of the infrared focal plane detector 110 to be tested is preprocessed to obtain a collection signal, so that the data collection module 130 can comprehensively and accurately test the infrared focal plane detector 110 to be tested based on the collection signal.

[0059] In some embodiments, Figure 3 As shown, the input module 121 includes: a power input module 1211, a bias input module 1212 and a timing input module 1213;

[0060] The power input module 1211 is configured to provide an analog voltage or an analog current to the infrared focal plane detector 110 to be tested;

[0061] The bias voltage input module 1212 is configured to provide an analog bias voltage to the infrared focal plane detector 110 to be tested;

[0062] The timing input module 1213 is configured to provide a timing signal to the infrared focal plane detector 110 to be tested; wherein the timing signal includes: a main clock signal, an integration signal, a frame reset signal and a serial control signal.

[0063] In specific implementation, the power input module 1211 (clock driving module) is used to provide analog voltage or analog current to the infrared focal plane detector 110 under test. The bias input module 1212 (DC offset module) is used to provide analog bias to the infrared focal plane detector 110 under test. The timing input module 1213 is used to provide timing signals to the infrared focal plane detector 110 under test.

[0064] The timing signals include: a master clock signal (MCLK signal), an integral signal (INT signal), a frame reset signal (RST signal) and a serial control signal.

[0065] The MCLK signal is a main clock signal of the infrared focal plane detector 110 to be tested, and is a continuous signal with a duty cycle of 50%.

[0066] The RST signal is a frame reset signal, which appears as a high-level signal once per frame, and the high-level time is one MCLK cycle. The rising and falling edges of the RST signal are aligned with the rising edge of the MCLK signal.

[0067] The INT signal is an integration signal, T3 is the row time, the high level time T2 is the integration time, T1+1TMCLK+T5+T2=T3, the integration time can only be changed by changing the position of the rising edge of T2, and the rising and falling edges of the INT signal are aligned with the rising edge of the MCLK signal. After the integration signal of the last row (520 rows) of each frame, the T10 part of the INT signal is a periodically repeated INT signal, T10=k×T3 (k is an integer less than or equal to 20); T9 is a low level, 0≤T9≤T3; T8 is a high level, T8=16TMCLK. The duration of T9 and T10 can be adjusted, and preprocessing or rounding up frames can be performed within the T9 and T10 cycles. The driving array size of the detector is 660×520, and the effective array size is 640×512. The first 10 columns and the last 10 columns, the first 4 rows and the last 4 rows are redundant data and need to be discarded. The circuit adopts a row-by-row readout mode. While the Nth row is integrated, the data of the N-1th row is read out, and the analog signal voltage of the valid pixel is output 18.5 TMCLKs after the falling edge of the INT signal. The rise time and fall time of each timing signal are less than or equal to 10ns.

[0068] The SERDAT signal is a serial control signal. The SERDAT signal is a TTL level signal, with the same high level as DVDD and the same cycle as the MCLK signal. Its value must change on the rising edge of the MCLK signal. The SERDAT signal length is 77 bits. The SERDAT signal takes effect only when the first bit (START) is high and the 8-bit Passwd code is 10101100. The rising edge of the START signal is at least 1 TMCLK signal away from the falling edge of the RST signal, and the last bit of the SERDAT signal is at least 1 TMCLK signal away from the rising edge of the next RST signal, that is, the SERDAT signal and the RST signal cannot have overlapping parts. The SERDAT signal can be sent once per frame, or only once. After the SERDAT signal is sent, it takes effect on the falling edge of the next RST signal.

[0069] Through the above scheme, the power input module 1211 can provide an analog voltage or an analog current to the infrared focal plane detector 110 to be tested, the bias input module 1212 can provide an analog bias to the infrared focal plane detector 110 to be tested, and the timing input module 1213 can provide a timing signal to the infrared focal plane detector 110 to be tested. In this way, the power input module 1211, the bias input module 1212 and the timing input module 1213 can provide input signals to the infrared focal plane detector 110 to be tested.

[0070] In some embodiments, the data acquisition module 130 includes: a storage module 131;

[0071] The storage module 131 is configured to convert the first acquisition signal into a first voltage average value for storage, convert the second acquisition signal into a second voltage average value for storage, and convert the first acquisition signal and the second acquisition signal into an invalid pixel matrix for storage.

[0072] In specific implementation, the first acquisition signal is converted into a first voltage average value and stored in the storage module 131, and the second acquisition signal is converted into a second voltage average value and stored in the storage module 131. When the data acquisition module 130 calculates the response rate from the high-temperature blackbody temperature to the low-temperature blackbody temperature and the pixel equivalent temperature difference from the high-temperature blackbody temperature to the low-temperature blackbody temperature, the first voltage average value and the second voltage average value are retrieved.

[0073] The first acquisition signal and the second acquisition signal are converted into an invalid pixel matrix and stored in the storage module 131 . When the data acquisition module 130 calculates the invalid pixel rate, the invalid pixel matrix is ​​retrieved.

[0074] Through the above scheme, by converting the first acquisition signal and the second acquisition signal and storing them in the storage module 131, it is convenient for the data acquisition module 130 to retrieve the converted data in the storage module 131, and analyze the converted data to obtain the test parameters of the infrared focal plane detector 110 to be tested, so that the infrared focal plane detector 110 to be tested can be tested and analyzed quickly and accurately.

[0075] Through the above embodiment, the interface board can obtain the output signal of the infrared focal plane detector to be tested at different black body temperatures, and send the output signal to the data acquisition module after preprocessing, so that the data acquisition module analyzes the collected signals at different black body temperatures to obtain the test parameters of the infrared focal plane detector to be tested. The data acquisition module analyzes the collected signals at different black body temperatures and can obtain the response rate, pixel equivalent temperature difference and invalid pixel rate as the test parameters of the infrared focal plane detector to be tested, so that the parameters of the infrared focal plane detector to be tested can be accurately and comprehensively tested.

[0076] It should be noted that the embodiments of the present disclosure may be further described in the following manner:

[0077] The disclosed embodiment uses the DLD650 uncooled infrared focal plane detector as the research object to carry out the research on the photoelectric parameter test verification technology. The disclosed embodiment focuses on the analysis and research on the test methods of the important parameters of the infrared focal plane detector, such as the response rate, signal voltage, fixed image noise, noise equivalent temperature difference, bad pixels, and invalid pixel rate.

[0078] Figure 4 FIG. 1 is a schematic diagram of the structure of infrared focal plane detection according to an embodiment of the present disclosure. Figure 4 As shown, the structure of infrared focal plane detection includes: an infrared focal plane detector to be tested, a clock driver (power input module), a DC bias (bias input module), an infrared light source, a vector generator, a system controller, a sensor monitor, a preamplifier, analog-to-digital conversion timing and control, an AD module, a multiplexer and a data acquisition module.

[0079] First, press Figure 2 Connect the test system and perform system presetting; secondly, adjust the test system and apply the specified voltage to the device under test to make the device in normal working state; thirdly, use Figure 2 The test system shown continuously collects F frame data (it is recommended to take F ≥ 100) at low black body temperature T0 and high black body temperature T, respectively, to obtain two sets of F frame two-dimensional arrays; finally, after measuring the two sets of F frame two-dimensional arrays, each photoelectric parameter can be calculated according to the definition.

[0080] An infrared focal plane detector test platform was built, with a focus on designing and manufacturing the interface board. The interface board is an interactive module between the infrared detector component and other hardware device modules. It connects the infrared focal plane detector to be tested with other devices, provides power, bias and timing control for the infrared focal plane detector to be tested, and also completes the preprocessing of the output signal of the infrared focal plane detector to be tested, and finally sends the preprocessed output signal to the acquisition module for data acquisition. Its main interface modules are as follows:

[0081] (1) Power input module

[0082] The power input module mainly provides analog voltage or analog current.

[0083] (2) Bias input module

[0084] The bias input module can be connected to the PXIe-4143 board through an interface, providing the required bias voltage to the required pins of the infrared focal plane detector to be tested through a female header.

[0085] (3) Timing input module

[0086] The timing input module consists of 1 HDRA-EC68 interface and 2 timing output BNCs, which mainly provide the required timing signal for the infrared focal plane detector to be tested, and provide CLK_IN signal and Trigger signal for the acquisition card. Note: In the interface board design, the board PXIe-6544 has 32 channels, of which 9 channels can provide Trigger signals for the acquisition card, and 10 channels can provide CLK_IN signals for the acquisition card.

[0087] (4) Detector Vo output module

[0088] The output module introduces the analog output Vo of the infrared focal plane detector to be tested into the adapter board circuit and finally outputs it to the acquisition card. The output module is mainly composed of 4 BNCs and corresponding circuits.

[0089] The test timing vector design of infrared focal plane detector was carried out, focusing on the research and design of the test timing vector of the TTL pulse signal required for the detector to work, mainly including the main clock signal of the detector, the integration signal, the frame reset signal, etc. The TTL pulse signals required for the infrared focal plane detector to be tested mainly include the MCLK signal, the INT signal, the RST signal, etc. The MCLK signal is the main clock signal of the infrared focal plane detector 110 to be tested, and is a continuous signal with a duty cycle of 50%. The RST signal is a frame reset signal, a high-level signal appears once per frame, and the high-level time is 1 MCLK cycle. The rising edge and the falling edge of the RST signal are aligned with the rising edge of the MCLK signal. The INT signal is an integration signal, T3 is the line time, the high-level time T2 is the integration time, T1+1TMCLK+T5+T2=T3, the integration time can only be changed by changing the position of the rising edge of T2, and the rising edge and the falling edge of the INT signal are aligned with the rising edge of the MCLK signal. After the last row (520 rows) of each frame integrates the signal, the T10 part of the INT signal is a periodically repeated INT signal, T10 = k × T3 (k is an integer less than or equal to 20); T9 is a low level, 0≤T9≤T3; T8 is a high level, T8 = 16TMCLK. The duration of T9 and T10 can be adjusted, and preprocessing or rounding up frames can be performed within the T9 and T10 cycles. The driving array size of the detector is 660×520, and the effective array size is 640×512. The first 10 columns and the last 10 columns, the first 4 rows and the last 4 rows are redundant data and need to be discarded. The circuit adopts a row-by-row readout mode. While the Nth row is integrated, the data of the N-1th row is read out, and the analog signal voltage of the effective pixel point is output 18.5 TMCLK after the falling edge of the INT signal. The rise time and fall time of each timing signal are less than or equal to 10ns.

[0090] The serial control technology of infrared focal plane detector was studied, focusing on the design of the test timing vector of the serial control signal required for the detector to work. Multiple functions of the detector can be realized by serial control signals, and the SERDAT signal is a serial control signal. The SERDAT signal is a TTL level, the high level is the same as DVDD, the cycle is the same as the MCLK signal, and its value must change on the rising edge of the MCLK signal. The length of the SERDAT signal is 77 bits. The SERDAT signal takes effect only when the first bit (START) is high and the 8-bit Passwd code is 10101100. The rising edge of the START signal is at least 1 TMCLK signal away from the falling edge of the RST signal, and the last bit of the SERDAT signal is at least 1 TMCLK signal away from the rising edge of the next RST signal, that is, the SERDAT signal and the RST signal cannot have overlapping parts. The SERDAT signal can be sent once per frame, or only once. After the SERDAT signal is sent, it takes effect until the falling edge of the next RST signal.

[0091] The electrical parameters and response characteristic parameter test technology of infrared focal plane detectors were studied, mainly including response rate, signal voltage, fixed image noise, noise equivalent temperature difference, bad pixels, invalid pixel rate and other parameters. The whole calculation process is:

[0092] Step 1, read the collected high and low temperature data and convert them into voltage average values ​​and read them into memory;

[0093] Step 2, calculating the response voltage by reading the high and low temperature data;

[0094] Step 3, read in the high temperature and low temperature data again, and respectively combine the data with the corresponding response voltage to calculate the noise voltage;

[0095] Step 4, calculate the radiation power of the black body at high temperature and low temperature;

[0096] Step 5, combining the response voltage calculated in step 2 with the radiation power in step 4 to calculate the response rate from high temperature to low temperature;

[0097] Step 6, using the pixel response voltage and pixel noise calculated in steps 2 and 3, calculate the pixel equivalent temperature difference (NETD) from high temperature to low temperature;

[0098] Step 7, check the eight types selected in the "Parameter Calculation Enable" column, calculate the level blind pixel, noise blind pixel, response rate blind pixel, NETD blind pixel, etc., and store them in the corresponding blind pixel type matrix;

[0099] Step 8, according to the four blind pixel type matrices calculated in step 7, calculate and count the invalid pixel matrices and record their corresponding coordinates (for subsequent blind pixel replacement) and calculate the invalid pixel rate;

[0100] Step 9, directly inversely calculating the valid pixel matrix based on the invalid pixel matrix calculated in step 8;

[0101] Step 10, after obtaining the invalid pixel and valid pixel data, excluding the invalid pixels, calculate the average noise voltage, average response rate, average NETD and response rate non-uniformity (UR);

[0102] Step 11, calculating the fixed pattern noise (FPN);

[0103] Step 12, based on the above data, an image with blind pixels, a noise histogram, a response rate histogram and a level histogram are generated and stored as "BadPixel.png", "NoiseHist.png", "ResponsivityHist.png" and "VoltageHist.png" respectively.

[0104] In the above embodiment, an infrared focal plane detector test platform was built, and an interface board was designed and manufactured. The infrared focal plane detector test timing vector design was carried out, and the test timing vector of the TTL pulse signal required for the infrared focal plane detector to work was studied and designed, mainly including the main clock signal, integration signal, frame reset signal, etc. of the infrared focal plane detector. The infrared focal plane detector serial control technology research was carried out, and the test timing vector of the serial control signal required for the detector to work was studied and designed. The electrical parameters and response characteristic parameter test technology of the infrared focal plane detector was studied, mainly including parameters such as response rate, signal voltage, fixed image noise, noise equivalent temperature difference, bad pixels, and invalid pixel rate.

[0105] The embodiments of the present disclosure are not limited to the infrared focal plane detector test system, and the above test method can also be implemented by using other test systems, and the above test method can be applied to other similar chips.

[0106] Through the above embodiments, an infrared focal plane detector test platform is built, and the interface board is designed and manufactured. The interface board is an interactive module between the infrared focal plane detector to be tested and other hardware device modules, which connects the infrared focal plane detector to be tested with other devices, provides power, bias and timing control for the infrared focal plane detector to be tested, and also completes the preprocessing of the output signal of the infrared focal plane detector to be tested, and finally sends the preprocessed output signal to the acquisition module for data acquisition.

[0107] For the convenience of description, the above system is described by dividing the functions into various modules. Of course, when implementing the present disclosure, the functions of each module can be implemented in the same or multiple software and / or hardware.

[0108] The system of the above embodiment is used to implement the corresponding infrared focal plane detector testing method in any of the following embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be described in detail here.

[0109] Based on the same inventive concept, corresponding to any of the above-mentioned embodiment methods, the present disclosure also provides a testing method for an infrared focal plane detector.

[0110] refer to Figure 5 , the infrared focal plane detector test method, the method is applied to the infrared focal plane detector test system described in the above embodiment, the system includes: an infrared focal plane detector to be tested, an interface board and a data acquisition module; the method includes:

[0111] Step 201: the interface board obtains the output signal of the infrared focal plane detector to be tested, pre-processes the output signal to obtain a collection signal, and sends the collection signal to the data collection module.

[0112] Step 202: The data acquisition module determines the test parameters of the infrared focal plane detector to be tested according to the acquisition signal.

[0113] In specific implementation, the interface board obtains the output signal of the infrared focal plane detector to be tested, and pre-processes the output signal to obtain a collection signal. The data acquisition module analyzes the collection signal to obtain the test parameters of the infrared focal plane detector to be tested.

[0114] Through the above embodiments, the interface board can obtain the output signal of the infrared focal plane detector to be tested, and send the output signal to the data acquisition module after preprocessing, so that the data acquisition module can analyze the collected signal to obtain the test parameters of the infrared focal plane detector to be tested.

[0115] In some embodiments, the interface board includes: an input module and an output module; step 201 includes:

[0116] Step 2011: the input module provides an input signal to the infrared focal plane detector to be tested.

[0117] Step 2012: the output module obtains the output signal generated by the infrared focal plane detector to be tested under the input signal, preprocesses the output signal to obtain a collection signal, and sends the collection signal to the data collection module.

[0118] In specific implementation, the input module is used to provide an input signal to the infrared focal plane detector to be tested. The output module is used to pre-process the output signal of the infrared focal plane detector to be tested.

[0119] Through the above scheme, the output signal of the infrared focal plane detector to be tested is preprocessed to obtain a collection signal, so that the data acquisition module can comprehensively and accurately test the infrared focal plane detector to be tested based on the collection signal.

[0120] In some embodiments, the input module includes: a power input module, a bias input module and a timing input module; step 2011 includes:

[0121] Step 2011A, the power input module provides an analog voltage or an analog current to the infrared focal plane detector to be tested;

[0122] Step 2011B, the bias input module provides a simulated bias voltage to the infrared focal plane detector to be tested;

[0123] Step 2011C, the timing input module provides a timing signal to the infrared focal plane detector to be tested; wherein the timing signal includes: a main clock signal, an integration signal and a frame reset signal.

[0124] In specific implementation, the power input module (clock drive module) is used to provide analog voltage or analog current to the infrared focal plane detector under test. The bias input module (DC offset module) is used to provide analog bias to the infrared focal plane detector under test. The timing input module is used to provide timing signals to the infrared focal plane detector under test.

[0125] The timing signals include: a master clock signal (MCLK signal), an integral signal (INT signal), a frame reset signal (RST signal) and a serial control signal.

[0126] The MCLK signal is the main clock signal of the infrared focal plane detector to be tested, and is a continuous signal with a duty cycle of 50%.

[0127] The RST signal is a frame reset signal, which appears as a high-level signal once per frame, and the high-level time is one MCLK cycle. The rising and falling edges of the RST signal are aligned with the rising edge of the MCLK signal.

[0128] The INT signal is an integration signal, T3 is the row time, the high level time T2 is the integration time, T1+1TMCLK+T5+T2=T3, the integration time can only be changed by changing the position of the rising edge of T2, and the rising and falling edges of the INT signal are aligned with the rising edge of the MCLK signal. After the integration signal of the last row (520 rows) of each frame, the T10 part of the INT signal is a periodically repeated INT signal, T10=k×T3 (k is an integer less than or equal to 20); T9 is a low level, 0≤T9≤T3; T8 is a high level, T8=16TMCLK. The duration of T9 and T10 can be adjusted, and preprocessing or rounding up frames can be performed within the T9 and T10 cycles. The driving array size of the detector is 660×520, and the effective array size is 640×512. The first 10 columns and the last 10 columns, the first 4 rows and the last 4 rows are redundant data and need to be discarded. The circuit adopts a row-by-row readout mode. While the Nth row is integrated, the data of the N-1th row is read out, and the analog signal voltage of the valid pixel is output 18.5 TMCLKs after the falling edge of the INT signal. The rise time and fall time of each timing signal are less than or equal to 10ns.

[0129] The SERDAT signal is a serial control signal. The SERDAT signal is a TTL level signal, with the same high level as DVDD and the same cycle as the MCLK signal. Its value must change on the rising edge of the MCLK signal. The SERDAT signal length is 77 bits. The SERDAT signal takes effect only when the first bit (START) is high and the 8-bit Passwd code is 10101100. The rising edge of the START signal is at least 1 TMCLK signal away from the falling edge of the RST signal, and the last bit of the SERDAT signal is at least 1 TMCLK signal away from the rising edge of the next RST signal, that is, the SERDAT signal and the RST signal cannot have overlapping parts. The SERDAT signal can be sent once per frame, or only once. After the SERDAT signal is sent, it takes effect on the falling edge of the next RST signal.

[0130] Through the above scheme, the power input module can provide analog voltage or analog current to the infrared focal plane detector to be tested, the bias input module can provide analog bias to the infrared focal plane detector to be tested, and the timing input module can provide timing signals to the infrared focal plane detector to be tested. In this way, the power input module, the bias input module and the timing input module can provide input signals to the infrared focal plane detector to be tested.

[0131] In some embodiments, step 201 includes:

[0132] Step 201A: the interface board obtains a first output signal of the infrared focal plane detector to be tested at a high-temperature blackbody temperature, preprocesses the first output signal to obtain a first acquisition signal, and sends the first acquisition signal to the data acquisition module.

[0133] Step 201B: the interface board obtains a second output signal of the infrared focal plane detector to be tested at a low-temperature blackbody temperature, preprocesses the second output signal to obtain a second acquisition signal, and sends the second acquisition signal to the data acquisition module.

[0134] In specific implementation, the first output signal is the continuous F frame output data of the infrared focal plane detector to be tested at a high black body temperature. The second output signal is the continuous F frame output data of the infrared focal plane detector to be tested at a low black body temperature. Preferably, F≥100.

[0135] Through the above scheme, the interface board can obtain the output signal of the infrared focal plane detector to be tested under different blackbody temperatures, and send the output signal to the data acquisition module after preprocessing, so that the data acquisition module can analyze the collected signals under different blackbody temperatures to obtain the test parameters of the infrared focal plane detector to be tested.

[0136] In some embodiments, step 202 includes:

[0137] Step 2021: The data acquisition module converts the first acquisition signal into a first voltage average value, and converts the second acquisition signal into a second voltage average value.

[0138] Step 2022: The data acquisition module determines a first response voltage, a first noise voltage, and a first radiation power at a high blackbody temperature based on the first voltage average value, and determines a second response voltage, a second noise voltage, and a second radiation power at a low blackbody temperature based on the second voltage average value.

[0139] Step 2023, the data acquisition module determines a first response rate at a high-temperature blackbody temperature based on the first response voltage and the first radiation power, determines a second response rate at a low-temperature blackbody temperature based on the second response voltage and the second radiation power, and determines a response rate from the high-temperature blackbody temperature to the low-temperature blackbody temperature based on the first response rate and the second response rate.

[0140] Step 2024: the data acquisition module determines the first pixel equivalent temperature difference at the high-temperature blackbody temperature based on the first response voltage and the first noise voltage, determines the second pixel equivalent temperature difference at the high-temperature blackbody temperature based on the second response voltage and the second noise voltage, and determines the pixel equivalent temperature difference from the high-temperature blackbody temperature to the low-temperature blackbody temperature based on the first pixel equivalent temperature difference and the second pixel equivalent temperature difference.

[0141] Step 2025: The data acquisition module determines an invalid pixel matrix, and determines an invalid pixel rate based on the invalid pixel matrix.

[0142] Step 2026: The data acquisition module uses the response rate, the pixel equivalent temperature difference and the invalid pixel rate as test parameters of the infrared focal plane detector to be tested.

[0143] In a specific implementation, the data acquisition module obtains a first response voltage and a first radiation power according to the first voltage average value; obtains a first response rate of the infrared focal plane detector to be tested at a high-temperature blackbody temperature according to the first response voltage and the first radiation power. The data acquisition module obtains a second response voltage and a second radiation power according to the second voltage average value; obtains a second response rate of the infrared focal plane detector to be tested at a low-temperature blackbody temperature according to the second response voltage and the second radiation power. The response rate from the high-temperature blackbody temperature to the low-temperature blackbody temperature is determined according to the first response rate and the second response rate.

[0144] The data acquisition module obtains a first response voltage and a first noise voltage according to the first voltage average value; obtains a first pixel equivalent temperature difference of the infrared focal plane detector to be tested at a high black body temperature according to the first response voltage and the first noise voltage. The data acquisition module obtains a second response voltage and a second noise voltage according to the second voltage average value; obtains a second pixel equivalent temperature difference of the infrared focal plane detector to be tested at a low black body temperature according to the second response voltage and the second noise voltage. Determine the pixel equivalent temperature difference from the high black body temperature to the low black body temperature according to the first pixel equivalent temperature difference and the second pixel equivalent temperature difference.

[0145] The data acquisition module determines the invalid pixel rate based on the invalid pixel matrix. At the same time, the valid pixel matrix can also be determined based on the invalid pixel matrix. After excluding the invalid pixels, the average noise voltage, average response rate, average NETD and response rate non-uniformity (UR) of the infrared focal plane detector to be tested are calculated.

[0146] Through the above scheme, the data acquisition module analyzes the collected signals under different blackbody temperatures, and can obtain the response rate, pixel equivalent temperature difference and invalid pixel rate as the test parameters of the infrared focal plane detector to be tested, so that the parameters of the infrared focal plane detector to be tested can be accurately and comprehensively tested.

[0147] It should be noted that the method of the embodiment of the present disclosure can be performed by a single device, such as a computer or a server. The method of the present embodiment can also be applied in a distributed scenario and completed by multiple devices cooperating with each other. In the case of such a distributed scenario, one of the multiple devices can only perform one or more steps in the method of the embodiment of the present disclosure, and the multiple devices will interact with each other to complete the described method.

[0148] It should be noted that the above describes some embodiments of the present disclosure. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0149] Based on the same inventive concept, corresponding to any of the above-mentioned embodiments and methods, the present disclosure also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the test method of the infrared focal plane detector described in any of the above embodiments is implemented.

[0150] Figure 6A more specific schematic diagram of the hardware structure of an electronic device provided in this embodiment is shown, and the device may include: a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040 are connected to each other through the bus 1050 in the device.

[0151] The processor 1010 can be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0152] The memory 1020 may be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 may store an operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program codes are stored in the memory 1020 and are called and executed by the processor 1010.

[0153] The input / output interface 1030 is used to connect the input / output module to realize information input and output. The input / output module can be configured in the device as a component (not shown in the figure), or it can be externally connected to the device to provide corresponding functions. The input device may include a keyboard, a mouse, a touch screen, a microphone, various sensors, etc., and the output device may include a display, a speaker, a vibrator, an indicator light, etc.

[0154] The communication interface 1040 is used to connect a communication module (not shown in the figure) to realize communication interaction between the device and other devices. The communication module can realize communication through a wired mode (such as USB (Universal Serial Bus), network cable, etc.), or through a wireless mode (such as mobile network, WIFI (Wireless Fidelity), Bluetooth, etc.).

[0155] The bus 1050 includes a path that transmits information between the various components of the device (eg, the processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040).

[0156] It should be noted that, although the above device only shows the processor 1010, the memory 1020, the input / output interface 1030, the communication interface 1040 and the bus 1050, in the specific implementation process, the device may also include other components necessary for normal operation. In addition, it can be understood by those skilled in the art that the above device may also only include the components necessary for implementing the embodiments of the present specification, and does not necessarily include all the components shown in the figure.

[0157] The electronic device of the above embodiment is used to implement the corresponding infrared focal plane detector testing method in any of the above embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be described in detail here.

[0158] Based on the same inventive concept, corresponding to any of the above-mentioned embodiment methods, the present disclosure also provides a non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium stores computer instructions, and the computer instructions are used to enable the computer to execute the test method of the infrared focal plane detector as described in any of the above embodiments.

[0159] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device.

[0160] The computer instructions stored in the storage medium of the above embodiments are used to enable the computer to execute the test method of the infrared focal plane detector described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0161] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present disclosure is limited to these examples. Based on the concept of the present disclosure, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present disclosure as described above, which are not provided in detail for the sake of simplicity.

[0162] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present disclosure difficult to understand, the known power / ground connections to the integrated circuit (IC) chips and other components may or may not be shown in the provided figures. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present disclosure difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform on which the embodiments of the present disclosure will be implemented (that is, these details should be fully within the scope of understanding of those skilled in the art). Where specific details (e.g., circuits) are set forth to describe exemplary embodiments of the present disclosure, it is apparent to those skilled in the art that the embodiments of the present disclosure can be implemented without these specific details or with changes in these specific details. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0163] Although the present disclosure has been described in conjunction with specific embodiments of the present disclosure, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.

[0164] The embodiments of the present disclosure are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the present disclosure. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present disclosure should be included in the scope of protection of the present disclosure.

Claims

1. A test system for an infrared focal plane detector, characterized in that: The system comprises: an infrared focal plane detector to be tested, an interface board and a data acquisition module; the interface board is electrically connected to the infrared focal plane detector to be tested and the data acquisition module respectively; The interface board is configured as follows: Acquire a first output signal of the infrared focal plane detector to be tested at a high-temperature blackbody temperature, preprocess the first output signal to obtain a first acquisition signal, and send the first acquisition signal to the data acquisition module; Acquire a second output signal of the infrared focal plane detector to be tested at a low-temperature blackbody temperature, preprocess the second output signal to obtain a second acquisition signal, and send the second acquisition signal to the data acquisition module; The data acquisition module is configured as follows: Determine a first voltage average value from the first collected signal, and determine a second voltage average value from the second collected signal; Determine a first response voltage, a first noise voltage, and a first radiation power at a high blackbody temperature based on the first voltage average value, and determine a second response voltage, a second noise voltage, and a second radiation power at a low blackbody temperature based on the second voltage average value; determining a first response rate at a high black body temperature based on the first response voltage and the first radiation power, determining a second response rate at a low black body temperature based on the second response voltage and the second radiation power, and determining a response rate from the high black body temperature to the low black body temperature based on the first response rate and the second response rate; Determine a first pixel equivalent temperature difference at a high-temperature blackbody temperature based on the first response voltage and the first noise voltage, determine a second pixel equivalent temperature difference at a high-temperature blackbody temperature based on the second response voltage and the second noise voltage, and determine a pixel equivalent temperature difference from the high-temperature blackbody temperature to the low-temperature blackbody temperature based on the first pixel equivalent temperature difference and the second pixel equivalent temperature difference; Determine an invalid pixel matrix from the first acquisition signal and the second acquisition signal, and determine an invalid pixel rate based on the invalid pixel matrix; The response rate, the pixel equivalent temperature difference and the invalid pixel rate are used as test parameters of the infrared focal plane detector to be tested.

2. The system according to claim 1, characterized in that The interface board includes: an input module and an output module; The input module is electrically connected to the infrared focal plane detector to be tested and is configured to provide an input signal to the infrared focal plane detector to be tested; The output module is electrically connected to the data acquisition module, and is configured to obtain the output signal generated by the infrared focal plane detector to be tested under the input signal, preprocess the output signal to obtain a collection signal, and send the collection signal to the data acquisition module.

3. The system according to claim 2, characterized in that The input module includes: a power input module, a bias input module and a timing input module; The power input module is configured to provide an analog voltage or an analog current to the infrared focal plane detector to be tested; The bias voltage input module is configured to provide an analog bias voltage to the infrared focal plane detector to be tested; The timing input module is configured to provide a timing signal to the infrared focal plane detector to be tested; wherein the timing signal includes: a main clock signal, an integration signal, a frame reset signal and a serial control signal.

4. The system according to claim 1, characterized in that The data acquisition module includes: a storage module; The storage module is configured to convert the first acquisition signal into a first voltage average value for storage, convert the second acquisition signal into a second voltage average value for storage, and convert the first acquisition signal and the second acquisition signal into an invalid pixel matrix for storage.

5. A method for testing an infrared focal plane detector, characterized in that: The method is applied to the test system of the infrared focal plane detector according to claims 1 to 4, the system comprising: an infrared focal plane detector to be tested, an interface board and a data acquisition module; the method comprises: The interface board obtains the output signal of the infrared focal plane detector to be tested, pre-processes the output signal to obtain a collection signal, and sends the collection signal to the data acquisition module; The data acquisition module determines the test parameters of the infrared focal plane detector to be tested according to the acquisition signal.

6. The method according to claim 5, characterized in that The interface board includes: an input module and an output module; The interface board obtains the output signal of the infrared focal plane detector to be tested, pre-processes the output signal to obtain a collection signal, and sends the collection signal to the data acquisition module, including: The input module provides an input signal to the infrared focal plane detector to be tested; The output module obtains the output signal generated by the infrared focal plane detector to be tested under the input signal, preprocesses the output signal to obtain a collection signal, and sends the collection signal to the data collection module.

7. The method according to claim 5, characterized in that The interface board obtains the output signal of the infrared focal plane detector to be tested, pre-processes the output signal to obtain a collection signal, and sends the collection signal to the data acquisition module, including: The interface board obtains a first output signal of the infrared focal plane detector to be tested at a high-temperature blackbody temperature, preprocesses the first output signal to obtain a first acquisition signal, and sends the first acquisition signal to the data acquisition module; The interface board obtains a second output signal of the infrared focal plane detector to be tested at a low-temperature blackbody temperature, preprocesses the second output signal to obtain a second acquisition signal, and sends the second acquisition signal to the data acquisition module.

8. The method according to claim 7, characterized in that The data acquisition module determines the test parameters of the infrared focal plane detector to be tested according to the acquisition signal, including: The data acquisition module converts the first acquisition signal into a first voltage average value, and converts the second acquisition signal into a second voltage average value; The data acquisition module determines a first response voltage, a first noise voltage, and a first radiation power at a high black body temperature based on the first voltage average value, and determines a second response voltage, a second noise voltage, and a second radiation power at a low black body temperature based on the second voltage average value; The data acquisition module determines a first response rate at a high black body temperature based on the first response voltage and the first radiation power, determines a second response rate at a low black body temperature based on the second response voltage and the second radiation power, and determines a response rate from the high black body temperature to the low black body temperature according to the first response rate and the second response rate; The data acquisition module determines a first pixel equivalent temperature difference at a high-temperature blackbody temperature based on the first response voltage and the first noise voltage, determines a second pixel equivalent temperature difference at a high-temperature blackbody temperature based on the second response voltage and the second noise voltage, and determines a pixel equivalent temperature difference from the high-temperature blackbody temperature to the low-temperature blackbody temperature based on the first pixel equivalent temperature difference and the second pixel equivalent temperature difference; The data acquisition module determines an invalid pixel matrix, and determines an invalid pixel rate based on the invalid pixel matrix; The data acquisition module uses the response rate, the pixel equivalent temperature difference and the invalid pixel rate as test parameters of the infrared focal plane detector to be tested.

9. An electronic device, characterized in that: The method comprises a memory, a processor and a computer program stored in the memory and running on the processor, wherein when the processor executes the program, the method according to any one of claims 5 to 8 is implemented.

10. A non-transitory computer-readable storage medium, characterized in that: The non-transitory computer-readable storage medium stores computer instructions, and the computer instructions are used to cause a computer to execute the method according to any one of claims 5 to 8.

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