Pressure sensor capable of preventing packaging overpressure

Abstract

The invention relates to a pressure sensor capable of preventing overpressure in packaging. The top end surface of a shell is provided with a pressing rivet flange; a medium inflow pipe is arranged at the bottom of the shell; a containing groove communicated with the medium inflow pipe is formed in the top end face of the shell in a downward sunken mode, and an abutting area is arranged on the top end face of the shell and located on the outer side of the periphery of the containing groove; the pressure sensitive element assembly is positioned in the accommodating groove; the pressing ring at the bottom of the end button assembly is riveted with the pressing rivet turnup and abuts against the abutting area, through the arrangement, after the end button assembly and the shell are riveted, the bottom of the end button assembly abuts against the abutting area, in the press fitting process, the bottom of the end button assembly cannot make contact with the pressure sensitive element assembly in the containing groove, the risk of overpressure in press fitting is avoided, and the service life of the end button assembly is prolonged. And the requirement for the press-fitting and riveting process is low, and the production efficiency is improved to a certain extent. The vertical limiting column and the elastic column are additionally arranged on the pressure sensitive element assembly for limiting, or the pressure sensitive element assembly is fixed through an adhesive, so that gaps are avoided, and medium flowing is prevented.

Description

Technical Field

[0001] The present application relates to the technical field of pressure sensor packaging, and in particular to a pressure sensor that prevents overpressure in packaging. Background Art

[0002] With the development of lightweight and electronic automobiles, the pressure sensors on automobiles have also evolved from large mechanical pressure sensors to small electronic pressure sensors with simple structure, good stability and high precision. The pressure of the medium on the vehicle measured by electronic pressure sensors is usually around 20 bar, and some are even higher. In order to meet the sealing requirements of the product, the pressure ring and the housing need to have an interference fit. The pressure ring is pressed on the sensitive element, and the sensitive element compresses the sealing ring to achieve the sealing requirements. For example Figure 1 After the bottom of the terminal button assembly 1 shown in the figure is riveted against the riveted flange 2 of the housing 3, the housing 3 is sealed; the pressure ring 4 at the bottom of the terminal button assembly 1 presses the pressure sensitive element assembly 5 in the housing 3 to limit the pressure sensitive element assembly 5, but there are the following problems:

[0003] When the press-fitting force is too large during the press-fitting riveting process, it will cause certain damage to the pressure sensitive element assembly 5, and the entire press-fitting riveting process is required to be relatively high, which reduces the production efficiency to a certain extent. Summary of the invention

[0004] The embodiment of the present application provides a pressure sensor that prevents package overpressure, so as to solve the problem that when the press-fitting force is too large during the press-fitting riveting process between the bottom of the terminal button assembly and the shell, certain damage will be caused to the pressure sensitive element assembly, resulting in high process requirements and low production efficiency for the press-fitting riveting.

[0005] In a first aspect, a pressure sensor for preventing package overpressure is provided, comprising:

[0006] The shell has a riveted flange on its top surface; the bottom of the shell has a medium inlet pipe; the top surface of the shell is recessed downward and provided with a receiving groove connected to the medium inlet pipe, and the top surface of the shell and the outer side of the receiving groove are provided with a pressing area;

[0007] A pressure sensitive element assembly installed in the receiving groove;

[0008] The pressure ring at the bottom of the end button assembly is riveted to the press riveted flange and abuts against the pressing area. Through the above arrangement, after the end button assembly is riveted to the housing, the bottom of the end button assembly abuts against the pressing area, and during the press-fitting process, it will not contact the pressure sensitive element assembly in the receiving groove, thereby avoiding the risk of over-pressure during press-fitting. As a result, the process requirements for the entire press-fitting riveting are relatively low, and the production efficiency is improved to a certain extent.

[0009] In some embodiments, the pressure sensitive element assembly includes an aluminum substrate with a chip attached to the aluminum substrate. The chip is used to sense the pressure of the medium and convert the pressure signal into a voltage signal.

[0010] In some embodiments, a relief groove is provided at the center of the bottom of the pressure ring, and a plug is provided in the relief groove, and the plug is connected to the chip through a wiring harness; a supporting step concentric with the relief groove is provided on the inner wall of the relief groove; a wiring harness connecting column connected to the plug is provided in the terminal assembly;

[0011] A vertical limiting column is arranged on the top of the aluminum substrate, and an elastic column in contact with the supporting step is arranged on the top of the vertical limiting column.

[0012] In some embodiments, the sum of the length of the vertical limiting column and the length of the elastic column when not under pressure is greater than the distance between the supporting step and the bottom end surface of the pressure ring.

[0013] In some embodiments, a first sealing ring in contact with the containing groove is provided at the bottom of the aluminum substrate; and the aluminum substrate is bonded in the containing groove by an adhesive.

[0014] In some embodiments, a glue injection hole communicating with the receiving groove is provided on the outer side of the housing;

[0015] A spiral glue flow channel connected with the glue injection hole is provided on the inner wall of the accommodating groove.

[0016] In some embodiments, the adhesive is a hot melt adhesive, and the melting point of the hot melt adhesive is between ℃ and ℃.

[0017] In some embodiments, a first annular groove is provided on the inner wall of the accommodating groove, and a third sealing ring is provided in the first annular groove; the third sealing ring is coated on the outer wall around the aluminum substrate.

[0018] In some embodiments, a second annular groove concentric with the pressure ring is provided on the outer circumference of the pressure ring, and a second sealing ring in contact with the riveted flange is provided in the second annular groove.

[0019] In some embodiments, the height of the plane where the top of the pressure sensitive element assembly is located is lower than the height of the plane where the top end surface of the shell is located.

[0020] The beneficial effects of the technical solution provided by this application include:

[0021] The embodiment of the present application provides a pressure sensor that prevents overpressure in the package, because the top surface of the shell has a riveted flange; the bottom of the shell has a medium inlet pipe; the top surface of the shell is recessed downward and has a receiving groove connected to the medium inlet pipe, and the top surface of the shell and the outer sides of the receiving groove are provided with a pressing area; the pressure sensitive element assembly is located in the receiving groove; the pressing ring at the bottom of the end button assembly is riveted to the riveted flange and abuts against the pressing area. Through the above arrangement, after the end button assembly and the shell are riveted, the bottom of the end button assembly is abutted against the pressing area, and during the press-fitting process, it will not contact the pressure sensitive element assembly in the receiving groove, thereby avoiding the risk of press-fitting overpressure, and having low process requirements for the entire press-fitting riveting process, thereby improving production efficiency to a certain extent.

[0022] In addition, since the top limit of the pressure sensitive element assembly by the terminal assembly is cancelled, the pressure sensitive element assembly will be offset during use. Therefore, vertical limit columns and elastic columns are added to the pressure sensitive element assembly for limiting the position, or the pressure sensitive element assembly is fixed with adhesives to ensure stability during use, avoid gaps, and avoid the flow of media. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 A schematic diagram of the packaging structure of a pressure sensor provided in the related art;

[0025] Figure 2 A schematic diagram of the packaging structure of a pressure sensor for preventing package overpressure provided in an embodiment of the present application;

[0026] Figure 3 A schematic diagram of the packaging structure of a pressure sensor provided in an embodiment of the present application with a vertical limiting column and an elastic column to prevent package overpressure;

[0027] Figure 4 A schematic diagram of the structure of the terminal assembly provided in an embodiment of the present application;

[0028] Figure 5 A schematic diagram of the structure of the housing provided in the embodiment of the present application having a first annular groove and a third sealing ring;

[0029] Figure 6 A schematic structural diagram of a accommodating groove provided in an embodiment of the present application having a spiral glue flow channel.

[0030] In the figure: 1. terminal button assembly; 2. riveted flange; 3. housing; 300. medium inlet pipe; 301. accommodating groove; 302. first annular groove; 303. third sealing ring; 4. pressing ring; 400. avoidance groove; 401. insert; 402. supporting step; 403. second annular groove; 404. second sealing ring; 5. pressure sensitive element assembly; 6. vertical limit column; 7. elastic column; 8. first sealing ring. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0032] The pressure of the medium on the vehicle measured by the electronic pressure sensor is usually around 20 bar, and some are even higher. In order to meet the sealing requirements of the product, the pressure ring and the shell need to have an interference fit. The pressure ring is pressed on the sensitive element, and the sensitive element compresses the sealing ring to achieve the sealing requirements. For example Figure 1 After the bottom of the terminal button assembly 1 shown in the figure is riveted against the riveted flange 2 of the housing 3, the housing 3 is sealed; the pressure ring 4 at the bottom of the terminal button assembly 1 presses the pressure sensitive element assembly 5 in the housing 3 to limit the pressure sensitive element assembly 5, but there are the following problems:

[0033] When the press-fitting force is too large during the press-fitting riveting process, it will cause certain damage to the pressure sensitive element assembly 5, and the entire press-fitting riveting process is required to be relatively high, which reduces the production efficiency to a certain extent.

[0034] The embodiment of the present application provides a pressure sensor that prevents package overpressure, so as to solve the problem that when the press-fitting force is too large during the press-fitting riveting process between the bottom of the terminal button assembly and the shell, certain damage will be caused to the pressure-sensitive element assembly, resulting in high process requirements and low production efficiency for the press-fitting riveting.

[0035] See also Figure 2-Figure 4 , a pressure sensor for preventing package overpressure, comprising:

[0036] The shell 3 has a riveted flange 2 on its top surface; the bottom of the shell 3 has a medium inflow pipe 300; the top surface of the shell 3 is recessed downward and provided with a receiving groove 301 connected to the medium inflow pipe 300, and the top surface of the shell 3 and the outer side of the receiving groove 301 are provided with a pressing area;

[0037] The pressure sensitive element assembly 5 is installed in the receiving groove 301;

[0038] The terminal button assembly 1 has a pressing ring 4 at the bottom thereof which is riveted to the riveting flange 2 and abuts against the pressing area.

[0039] Through the above arrangement, after the terminal button assembly 1 and the housing 3 are riveted, the bottom of the terminal button assembly 1 is in contact with the pressing area, and during the press-fitting process, it will not contact the pressure sensitive element assembly 5 in the receiving groove 301, thereby avoiding the risk of over-pressure during press-fitting. Therefore, the process requirements for the entire press-fitting riveting are relatively low, and the production efficiency is improved to a certain extent.

[0040] In some preferred embodiments, the pressure sensitive element assembly 5 includes an aluminum substrate, which is circular, and a chip is attached to the aluminum substrate. The chip is used to sense the medium pressure and convert the pressure signal into a voltage signal. When the detection is performed, the detected medium enters through the medium inflow tube 300 and then acts on the chip. The chip is used to sense the medium pressure and convert the pressure signal into a voltage signal. The voltage signal is transmitted to the terminal assembly 1.

[0041] The height of the plane where the top of the pressure sensitive element assembly 5 is located is lower than the height of the plane where the top surface of the housing 3 is located, which can further ensure that the press-fitting process will not cause overpressure on the pressure sensitive element assembly 5.

[0042] In some preferred embodiments, a avoidance groove 400 is provided at the bottom center of the pressure ring 4, and a plug-in piece 401 is provided in the avoidance groove 400, and the plug-in piece 401 is connected to the chip through a wiring harness; a supporting step 402 concentric with the avoidance groove 400 is provided on the inner wall; a wiring harness connecting column connected to the plug-in piece 401 is provided in the terminal assembly 1; a voltage signal is transmitted to the plug-in piece 401 and the wiring harness connecting column in the terminal assembly 1, thereby connecting to the wiring harness of the vehicle.

[0043] A vertical limiting column 6 is disposed on the top of the aluminum substrate, and an elastic column 7 in contact with the supporting step 402 is disposed on the top of the vertical limiting column 6 .

[0044] As the top limit of the pressure sensitive element assembly 5 by the terminal assembly 1 is cancelled, the pressure sensitive element assembly 5 will be offset when in use, resulting in gaps and causing the medium to flow, that is, the pressure of the medium will cause the assembly 5 to deviate. Although the problem of overpressure during packaging is solved, there are still certain defects. Therefore, a vertical limit column 6 is provided on the top of the aluminum substrate, and the elastic column 7 on the top of the vertical limit column 6 contacts the abutting step 402, thereby limiting the position. Since the elastic column 7 is deformed under pressure, the pressure on the package is converted into deformation, which greatly reduces the pressure on the aluminum substrate.

[0045] Among them, the sum of the length of the vertical limiting column 6 and the length of the elastic column 7 when not under pressure is greater than the distance between the supporting step 402 and the bottom end face of the pressure ring 4. This limitation is to ensure deformation during packaging and to achieve limiting after packaging.

[0046] Furthermore, the present application also has the following several setting methods to achieve the limit of the pressure sensitive element assembly 5:

[0047] The first one, refer to the attached Figure 3 The bottom of the aluminum substrate is provided with a first sealing ring 8 in contact with the receiving groove 301; the aluminum substrate is bonded in the receiving groove 301 by an adhesive. The first sealing ring 8 prevents the inflow of the detection medium, and the adhesive enables the aluminum substrate and the receiving groove 301 to be fixedly connected, and because the adhesive is a hot melt adhesive, the melting point of the hot melt adhesive is between 150℃-220℃. It is convenient for later disassembly and replacement, avoiding the complicated method of screw fixing. The hot melt adhesive is TPU hot melt adhesive, and the working temperature range is usually between 150℃ and 220℃.

[0048] In order to facilitate the injection of glue into the receiving groove 301, the following configuration is also provided:

[0049] The outer side of the housing 3 is provided with a glue injection hole connected to the accommodating groove 301;

[0050] The inner wall of the receiving groove 301 is provided with a spiral glue flow channel connected to the glue injection hole. The setting of the spiral glue flow channel can achieve the most stable connection and reduce the amount of glue injection. Figure 6 .

[0051] The second type, refer to the attached Figure 5 A first annular groove 302 is provided on the inner wall of the accommodating groove 301, and a third sealing ring 303 is provided in the first annular groove 302; the third sealing ring 303 is covered on the outer wall of the aluminum substrate. In this form, the aluminum substrate is allowed to move vertically, but during the movement, both sides of the aluminum substrate are always sealed by the third sealing ring 303, so there will be no problem of medium flow.

[0052] In some preferred embodiments, the outer circumference of the pressure ring 4 is provided with a second annular groove 403 concentric therewith, and a second sealing ring 404 in contact with the riveted flange 2 is provided in the second annular groove 403. In this embodiment, the waterproof effect of the riveted connection can be ensured, thereby improving the waterproof sealing of the pressure sensor to prevent overpressure of the package.

[0053] Through the above structural design, there are several press-fitting methods as follows:

[0054] Method 1: A vertical limit column 6 is provided on the top of the aluminum substrate, and an elastic column 7 in contact with the supporting step 402 is provided on the top of the vertical limit column 6. The pressure sensitive element assembly 5 is first placed in the accommodating groove 301, and then the end button assembly 1 and the riveted flange 2 are directly riveted.

[0055] Method 2: A first sealing ring 8 in contact with the accommodating groove 301 is provided at the bottom of the aluminum substrate; the aluminum substrate is bonded to the accommodating groove 301 by an adhesive, and a glue injection hole connected to the accommodating groove 301 is provided on the outer side of the shell 3; when a spiral glue flow channel connected to the glue injection hole is provided on the inner wall of the accommodating groove 301, the pressure sensitive element assembly 5 is first placed in the accommodating groove 301, and then the terminal button assembly 1 is directly riveted to the riveted flange 2, and then the adhesive in a molten state is injected into the glue injection hole.

[0056] Method three, a first annular groove 302 is provided on the inner wall of the accommodating groove 301, and a third sealing ring 303 is provided in the first annular groove 302; when the third sealing ring 303 is coated on the outer wall of the aluminum substrate, the third sealing ring 303 is first installed on the outer side of the pressure sensitive element assembly 5, and then the pressure sensitive element assembly 5 is placed in the accommodating groove 301, and then the terminal button assembly 1 and the riveted flange 2 are directly riveted.

[0057] After the above-mentioned riveting of the terminal button assembly 1 and the shell 3 is achieved, the bottom of the terminal button assembly 1 is in contact with the pressing area, and during the press-fitting process, it will not contact the pressure-sensitive element assembly 5 in the accommodating groove 301, thereby avoiding the risk of over-pressure caused by press-fitting, and has low process requirements for the entire press-fitting riveting process, thereby improving production efficiency to a certain extent.

[0058] In addition, since the top limit of the pressure sensitive element assembly 5 by the terminal assembly 1 is cancelled, the pressure sensitive element assembly 5 will be offset during use. Therefore, a vertical limit column 6 and an elastic column 7 are added to the pressure sensitive element assembly 5 for limiting, or the pressure sensitive element assembly 5 is fixed by an adhesive to ensure stability during use and avoid the problem of flow of the detection medium.

[0059] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0060] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0061] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A pressure sensor for preventing package overpressure, characterized in that: It includes: The housing (3) has a riveted flange (2) on its top end surface; The bottom of the shell (3) is provided with a medium inflow pipe (300); the top surface of the shell (3) is recessed downward and provided with a receiving groove (301) communicating with the medium inflow pipe (300); the top surface of the shell (3) and the outer side of the receiving groove (301) are provided with a pressing area; A pressure sensitive element assembly (5), which is installed in the accommodating groove (301); The end button assembly (1) has a pressure ring (4) at the bottom thereof which is riveted to the riveted flange (2) and abuts against the pressing area.

2. The pressure sensor for preventing package overpressure as claimed in claim 1, characterized in that: The pressure sensitive element assembly (5) comprises an aluminum substrate, on which a chip is attached. The chip is used to sense the pressure of the medium and convert the pressure signal into a voltage signal.

3. The pressure sensor for preventing package overpressure as claimed in claim 2, characterized in that: The center of the bottom of the pressure ring (4) is provided with an escape groove (400), an insert (401) is provided in the escape groove (400), and the insert (401) is connected to the chip through a wire harness; a supporting step (402) concentric with the escape groove (400) is provided on the inner wall of the escape groove (400); a wire harness connecting column connected to the insert (401) is provided in the terminal assembly (1); A vertical limiting column (6) is provided on the top of the aluminum substrate, and an elastic column (7) in contact with the supporting step (402) is provided on the top of the vertical limiting column (6).

4. The pressure sensor for preventing package overpressure as claimed in claim 3, characterized in that: The sum of the length of the vertical limiting column (6) and the length of the elastic column (7) when not under pressure is greater than the distance between the supporting step (402) and the bottom end surface of the pressure ring (4).

5. The pressure sensor for preventing package overpressure as claimed in claim 2, characterized in that: A first sealing ring (8) in contact with the containing groove (301) is provided at the bottom of the aluminum substrate; the aluminum substrate is bonded in the containing groove (301) by an adhesive.

6. The pressure sensor for preventing package overpressure as claimed in claim 5, characterized in that: The outer side of the housing (3) is provided with a glue injection hole which is in communication with the containing groove (301); The inner wall of the containing groove (301) is provided with a spiral glue flow channel connected to the glue injection hole.

7. The pressure sensor for preventing package overpressure as claimed in claim 5, characterized in that: The adhesive is a hot-melt adhesive, and the melting point of the hot-melt adhesive is between 150°C and 220°C.

8. The pressure sensor for preventing package overpressure as claimed in claim 2, characterized in that: A first annular groove (302) is provided on the inner wall of the containing groove (301), and a third sealing ring (303) is provided in the first annular groove (302); the third sealing ring (303) is coated on the outer walls around the aluminum substrate.

9. The pressure sensor for preventing package overpressure as claimed in claim 1, characterized in that: A second annular groove (403) which is concentric with the pressure ring (4) is provided on the outer circumference of the pressure ring (4), and a second sealing ring (404) which contacts the pressure riveted flange (2) is provided in the second annular groove (403).

10. The pressure sensor for preventing package overpressure as claimed in claim 1, characterized in that: The height of the plane where the top of the pressure sensitive element assembly (5) is located is lower than the height of the plane where the top end surface of the shell (3) is located.

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