Data acquisition system
The flexible strain data acquisition system manufactured through flexible packaging technology solves the problem that traditional data acquisition systems need to destroy the mechanical characteristics of components or cannot be installed, and realizes data acquisition that is in line with the equipment under test, supporting multi-channel networking distributed testing.
Patent Information
- Application Number
- CN202311180760.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-13
- Publication Date
- 2025-03-14
AI Technical Summary
When performing special components measurements, existing data acquisition instruments need to drill holes or add fixtures to the components, resulting in damage to the mechanical properties of the measured components, or the internal structure cannot be damaged, resulting in the inability to conduct testing.
It provides a data acquisition system, a flexible strain data acquisition system manufactured using flexible packaging technology, including a sensing module and a data acquisition module. The data acquisition module is composed of a first flexible circuit board, and the test channel and the sensing module are connected through flexible wires. The system can be bent in a conformal manner with the equipment being tested, and realize multi-channel networking distributed testing.
The system can be lightweight and small in size, and does not destroy the mechanical properties of the measured object during installation, solving the problem that traditional acquisition systems require holes or add fixtures, and realizes flexible data acquisition of complex structural components.
Smart Images
Figure CN119619791A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of data acquisition technology, and in particular to a data acquisition system. Background Art
[0002] In industrial production, aerospace, medical and sports, there are some large-scale equipment or products with diverse parts and complex structures. They occupy an important position in certain fields, and their operating status and life are directly related to safe production and economic benefits. Stress and strain testing is an important means to evaluate the status of equipment. By testing the force and working conditions of parts and structures, mechanical parameters such as stress, strain, displacement, force, load and acceleration are determined, thereby solving problems such as engineering structure and mechanical strength and stiffness.
[0003] However, in the face of increasingly developed industrial production systems, when using existing data acquisition instruments to measure special components, it is necessary to drill holes in the components or add additional fixtures to install and test them. This will greatly damage the mechanical properties of the measured components. Or some important components cannot have their internal structures destroyed or additional devices are not allowed to be added, resulting in the inability to test. Summary of the invention
[0004] In response to the above technical problems, the present application provides a data acquisition system that can conformally bend with the equipment under test and can realize multi-channel networked distributed testing.
[0005] To solve the above technical problems, the present application provides a data acquisition module, including: a sensor module and a data acquisition module; the data acquisition module includes a first flexible circuit board, at least one test channel is formed on the first flexible circuit board, and the test channel and the sensor module are connected by a flexible wire.
[0006] Optionally, the test channel is arranged along a first direction of the first flexible circuit board, and the flexible wires are arranged on both sides of the first flexible circuit board in a second direction.
[0007] Optionally, a plurality of the test channels are arranged in parallel on the first flexible circuit board, and a first slot is provided between adjacent test channels.
[0008] Optionally, the first flexible circuit board includes a first FPC substrate and a first flexible packaging layer, the test channel is arranged on the first FPC substrate, the first flexible packaging layer covers the first FPC substrate, and the first groove is arranged on the outer surface of the first flexible packaging layer.
[0009] Optionally, the data acquisition module further includes a power supply bus connected to the first flexible circuit board, and the power supply bus is arranged along the second direction of the first flexible circuit board.
[0010] Optionally, the flexible conductive wire comprises a metal wire and a second flexible packaging layer covering the metal wire.
[0011] Optionally, it further includes a wiring hub module, which includes a second flexible circuit board and a signal bus, and the signal bus connects the second flexible circuit board and the data acquisition module.
[0012] Optionally, at least one first channel is formed on one side of the third direction of the second flexible circuit board, the first channel is connected to the signal bus, and a power supply interface and / or a network cable interface is arranged along the fourth direction of the second flexible circuit board.
[0013] Optionally, a plurality of the first channels are arranged in parallel on the second flexible circuit board, and a second slot is provided between adjacent first channels.
[0014] Optionally, the second flexible circuit board includes a second FPC substrate and a third flexible packaging layer covering a surface of the second FPC substrate, the first channel is formed on the second FPC substrate, and the second groove is arranged on an outer surface of the third flexible packaging layer.
[0015] The data acquisition system of the present application includes a sensor module and a data acquisition module; the data acquisition module includes a first flexible circuit board, at least one test channel is formed on the first flexible circuit board, and the test channel and the sensor module are connected by a flexible wire. The data acquisition system of the present application is flexible, can conformally bend with the equipment under test, and can realize multi-channel network distributed testing. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is one of the structural schematic diagrams of the data acquisition system according to the embodiment of the present application;
[0017] Figure 2 This is a second structural diagram of a data acquisition system according to an embodiment of the present application;
[0018] Figure 3 is a structural schematic diagram of a data acquisition module according to an embodiment of the present application;
[0019] Figure 4 is a schematic structural diagram of a first flexible circuit board according to an embodiment of the present application;
[0020] Figure 5 is a structural schematic diagram of a line hub module according to an embodiment of the present application;
[0021] Figure 6 It is a schematic diagram of a packaging structure according to an embodiment of the present application.
[0022] Explanation of the reference numerals: 10 - sensor module; 20 - data acquisition module; 21 - first flexible circuit board; 211 - test channel; 212 - first slot; 22 - flexible wire; 23 - power supply bus; 24 - connector; 30 - hub module; 31 - power supply interface; 32 - signal bus; 33 - network cable interface; 34 - second flexible circuit board; 341 - first channel; 342 - second slot; 40 - battery; 50 - host computer. DETAILED DESCRIPTION
[0023] The following is an explanation of the implementation of the present application by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.
[0024] In the following description, reference is made to the accompanying drawings, which describe several embodiments of the present application. It should be understood that other embodiments may be used and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present application. The following detailed description should not be considered limiting, and the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present application.
[0025] Although the terms first, second, etc. are used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element.
[0026] Furthermore, as used in this article, the singular forms "one", "an" and "the" are intended to include plural forms as well, unless there is an indication to the contrary in the context. It should be further understood that the terms "comprise", "include" indicate the presence of the described features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Exceptions to this definition will only occur when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.
[0027] In order to solve the problem that it is inconvenient to install when using existing data acquisition instruments to measure special components, the present invention proposes a flexible strain data acquisition system made by flexible packaging technology, which has the characteristics of light weight, small size, and conformal to the equipment being measured, especially when applied to the surface of curved components. The data acquisition instrument of the present invention can be equipped with multiple test channels connected to the strain gauge to achieve networking to form distributed data acquisition tests. At the same time, the data acquisition system of the present invention also has an anti-electromagnetic interference function through the internal filtering circuit, and can still work stably in an environment with high electric field strength.
[0028] Figure 1 It is one of the structural schematic diagrams of the data acquisition system shown according to the embodiment of the present application. Figure 2 FIG. 2 is a second structural diagram of a data acquisition system according to an embodiment of the present application. Figure 1 and Figure 2 As shown, the data acquisition system of the present application includes a sensor module 10, a data acquisition module 20, a wiring module 30, a battery 40 and a host computer 50. Among them, the sensor module 10 is attached to the surface of the measured equipment and connected to the data acquisition module 20, and is used to collect strain data of the measured equipment. The sensor module 10 can be a resistance sensor module, which is a component for measuring strain. Generally, a sensitive grid (3-6μm) made of a thin metal foil is attached to a plastic film (15-16μm) called a substrate, and then covered with a layer of film to form a laminated structure. The working principle of the resistance sensor module is based on the strain effect, that is, when a conductor or semiconductor material is mechanically deformed under the action of an external force, its resistance value changes accordingly. This phenomenon is called "strain effect". The battery 40 is a flexible battery, such as a solar thin film battery, which is used to power the wiring module 30. The wiring module 30 is connected to the data acquisition module 20 and the host computer respectively, so as to transmit the collected strain data to the host computer 50. The data acquisition module 20 and the line collection module 30 of this embodiment are both designed as flexible structures, so that the data acquisition system of this embodiment is flexible as a whole and can conform well to the bending of the equipment under test.
[0029] In the data acquisition system of this embodiment, each module is thin and light, and has a small size. It only needs to be attached to the surface of the equipment under test with double-sided tape. Compared with the traditional acquisition system, the inherent mechanical properties of the object under test will not be destroyed during installation, which solves the problem of the need to open holes or grooves in the equipment under test during the installation of the traditional acquisition system.
[0030] Figure 3 It is a structural schematic diagram of a data acquisition module according to an embodiment of the present application. Figure 4 Schematic diagram of the structure of a first flexible circuit board according to an embodiment of the present application. Figure 3 and Figure 4As shown, it includes a sensor module 10 and a data acquisition module 20 ; the data acquisition module 20 includes a first flexible circuit board 21 , on which at least one test channel 211 is formed, and the test channel 211 and the sensor module 10 are connected via a flexible wire 22 .
[0031] In this embodiment, the data acquisition module 20 collects strain data of the equipment under test through the sensor module 10. The sensor module 10 can be a strain gauge, which is attached to the outer surface of the equipment under test. The data acquisition module 20 is connected to the sensor module 10 through a flexible wire 22. The data acquisition module 20 includes a first flexible circuit board 21, so that the data acquisition system as a whole is flexible. A plurality of test channels 211 can be formed on the first flexible circuit board 21, and the function of each test channel 211 is to collect weak analog signals, and then connect multiple sensor modules 10 to form a distributed data acquisition system.
[0032] The signal processing circuit of the data acquisition module 20 is divided into a signal amplification circuit and a signal conversion circuit. The signal amplification circuit amplifies the weak voltage signal output by the Wheatstone bridge to a voltage range that can be received by the ADC (Analog-to-Digital Converter). The ADC uses an 8-way synchronous converter with a resolution of 24 bits, and the data output interface is an SPI serial interface. A second-order low-pass filter is provided in the signal amplification circuit, which can reduce high-frequency interference, so that the data acquisition module 20 can still work stably in an environment with high electric field strength. In other embodiments, the external data acquisition module 20 can also further enhance the anti-electromagnetic interference capability by mounting a shielding layer.
[0033] The test channel 211 is arranged along the first direction of the first flexible circuit board 21, and the flexible conductors 22 are arranged on both sides of the second direction of the first flexible circuit board 21. Figure 3 As shown, the first flexible circuit board 21 is in the shape of a long strip, the test channel 211 is arranged along the width direction of the first flexible circuit board 21, and the flexible wire 22 is arranged on both sides of the length direction of the first flexible circuit board 21. In this way, the data acquisition module 20 can connect multiple sensor modules 10. Exemplarily, the size of the data acquisition module 20 can be 188mmx33mm (l=188mm, w=33), it uses a signal processing circuit designed by a flexible process, and has flexible wires 22 on both sides to interconnect with the sensor module 10. Each data acquisition module 20 can connect up to 24 (8*3) standard sensor modules 10.
[0034] Optionally, a plurality of test channels 211 are arranged in parallel on the first flexible circuit board 21, and a first slot 212 is arranged between adjacent test channels 211. By arranging a series of first slots 212 on the surface of the first flexible circuit board 21, and the positions of the first slots 212 are located between adjacent test channels 211, when the data acquisition module 20 is bent, the first slots 212 can relieve stress at the test channels 211, avoid stress concentration, improve the overall bending performance of the data acquisition module 20, and facilitate conformal installation of the data acquisition module 20 on the equipment under test.
[0035] like Figure 4 As shown, in the internal structure of the data acquisition module 20, in terms of the circuit layout of the first flexible circuit board 21, the dotted box is a pair of test channels 211, and the circuits of each pair of test channels 211 of the first flexible circuit board 21 are arranged along the width direction and are symmetrical. When the first flexible circuit board 21 is bent along the length direction, it will not easily cause a circuit breaker problem.
[0036] Optionally, the first flexible circuit board 21 includes a first FPC substrate and a first flexible packaging layer, the test channel 211 is arranged on the first FPC substrate, the first flexible packaging layer covers the first FPC substrate, and the first slot 212 is arranged on the outer surface of the first flexible packaging layer. Figure 6 As shown, the data acquisition module 20 adopts flexible packaging technology, and the passive components and active components are attached to the flexible FPC substrate (i.e., the first FPC substrate). The active components adopt ultra-thin chip technology, and use silicone as the packaging shell (i.e., the first flexible packaging layer), so that the module as a whole has flexible characteristics. In actual implementation, a test channel 211 is formed on the first FPC substrate, and a first slot 212 is formed on the outer surface of the first flexible packaging layer to ensure that the circuit function of the first flexible circuit board 21 is not affected by the slot.
[0037] Optionally, the data acquisition module 20 further includes a power supply bus 23 connected to the first flexible circuit board 21, and the power supply bus 23 is arranged along the second direction of the first flexible circuit board 21. The power supply bus 23 serves as a signal transmission bus and provides power, and the data acquisition module 20 is interconnected with the hub module 30 through the power supply bus 23 wiring harness and the connector 24.
[0038] Optionally, the flexible wire 22 includes a metal wire and a second flexible packaging layer covering the metal wire. The material of the second flexible packaging layer can be silicone. Thus, the flexible silicone wire formed by the metal wire and the second flexible packaging layer covering the metal wire improves the overall flexibility of the data acquisition module 20.
[0039] In one embodiment, if Figure 5As shown, the data acquisition system further includes a wiring hub module 30, which includes a second flexible circuit board 34 and a signal bus 32, and the signal bus 32 connects the second flexible circuit board 34 and the data acquisition module 20. Preferably, the signal bus 32 is flexible and connected to the second flexible circuit board, so that the wiring hub module 30 is flexible as a whole.
[0040] The hub module 30 includes a multi-channel bus interface, a processor, an Ethernet interface and a power supply circuit, and is responsible for triggering the collection action of each data collection module 20. At the same time, the hub module 20 collects the data results of each data collection module 20 and packages the data, and transmits it to the collection terminal (host computer 40) through the gateway.
[0041] Optionally, at least one first channel 341 is formed on one side of the third direction of the second flexible circuit board 34, the first channel 341 is connected to the signal bus 32, and a power supply interface 31 and / or a network cable interface 33 are arranged along the fourth direction of the second flexible circuit board 34. Figure 5 As shown, the second flexible circuit board 34 is in the shape of a long strip, the first channel 341 is arranged along the width direction of the second flexible circuit board 34, and the power supply interface 31 and the network cable interface 33 are respectively arranged on both sides of the length direction of the second flexible circuit board 34. In this way, a single data acquisition module 10 can be connected to multiple sensor modules 10, and the hub module 30 can be connected to multiple data acquisition modules 10, so that the data acquisition system can form distributed data acquisition through networking. Exemplarily, the size of the hub module 30 can be 80mmx50mm, the signal bus 32 is located on one side of the width direction of the hub module, the power supply interface 31 is provided on the left side of the hub module 30, and the network cable interface 33 is connected to the acquisition terminal (host computer 40) on the right side of the hub module 30.
[0042] Optionally, a plurality of first channels 341 are arranged in parallel on the second flexible circuit board 34, and a second slot 342 is arranged between adjacent first channels 341. By arranging a series of second slots 342 on the surface of the second flexible circuit board 34, and the positions of the second slots 342 are between adjacent first channels 341, when the hub module 20 is bent, the second slots 342 can relieve the stress at the first channels 341, avoid stress concentration, improve the overall bending performance of the hub module 20, and facilitate conformal installation of the hub module.
[0043] Optionally, the second flexible circuit board 34 includes a second FPC substrate and a third flexible packaging layer covering the surface of the second FPC substrate, the first channel 341 is formed on the second FPC substrate, and the second slot 342 is arranged on the outer surface of the third flexible packaging layer. Figure 6As shown, the hub module 30 also adopts flexible packaging technology. The passive devices and active devices are attached to the flexible FPC substrate (i.e., the second FPC substrate). The active devices adopt ultra-thin chip technology, and silicone is used as the packaging shell (i.e., the third flexible packaging layer), so that each module as a whole has flexible characteristics. In actual implementation, a first channel 341 is formed on the second FPC substrate, and a second slot 342 is formed on the outer surface of the third flexible packaging layer to ensure that the circuit function of the second flexible circuit board 34 is not affected by the slot. In this way, the active and passive devices are welded on a flexible base FPC board, and plastic-sealed with materials such as silicone, so that the module has flexible functions from internal materials to external materials, especially on curved components. The product can be bent (minimum bending radius 25mm), which expands the application scenarios of the acquisition system and solves the problem that the traditional acquisition system cannot be conformally bent with the measured component.
[0044] The core content of the present invention is a flexible strain data acquisition system, which effectively solves the problem that the traditional strain acquisition system cannot conform to the equipment, and also solves the problem that the traditional acquisition system needs to groove the components or add fixing devices to install and measure. This invention combines the flexible sensor module 10, the flexible data acquisition module 20, the wiring module 30, and the flexible battery 40 to form a data acquisition system with overall flexible functions. Each flexible functional module adopts flexible packaging technology to combine active flexible chips, passive devices, flexible substrates, and silicone materials together to realize the production of each module.
[0045] The data acquisition system of the present application includes a sensor module and a data acquisition module; the data acquisition module includes a first flexible circuit board, at least one test channel is formed on the first flexible circuit board, and the test channel and the sensor module are connected by a flexible wire. The data acquisition system of the present application is flexible, can conformally bend with the equipment under test, and can realize multi-channel network distributed testing.
[0046] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.
Claims
1. A data acquisition system, characterized in that: It comprises a sensing module and a data acquisition module; the data acquisition module comprises a first flexible circuit board, at least one test channel is formed on the first flexible circuit board, and the test channel and the sensing module are connected via a flexible wire.
2. The data acquisition system according to claim 1, characterized in that: The test channel is arranged along a first direction of the first flexible circuit board, and the flexible wires are arranged on both sides of the first flexible circuit board in a second direction.
3. The data acquisition system according to claim 1 or 2, characterized in that: A plurality of the test channels are arranged in parallel on the first flexible circuit board, and a first slot is arranged between adjacent test channels.
4. The data acquisition system according to claim 3, characterized in that: The first flexible circuit board includes a first FPC substrate and a first flexible packaging layer, the test channel is arranged on the first FPC substrate, the first flexible packaging layer covers the first FPC substrate, and the first groove is arranged on the outer surface of the first flexible packaging layer.
5. The data acquisition system according to claim 2, characterized in that: The data acquisition module further includes a power supply bus connected to the first flexible circuit board, and the power supply bus is arranged along the second direction of the first flexible circuit board.
6. The data acquisition system according to claim 1, characterized in that: The flexible conductive line includes a metal wire and a second flexible packaging layer covering the metal wire.
7. The data acquisition system according to claim 1, characterized in that: It also includes a wiring hub module, which includes a second flexible circuit board and a signal bus, and the signal bus connects the second flexible circuit board and the data acquisition module.
8. The data acquisition system according to claim 7, characterized in that: At least one first channel is formed on one side of the third direction of the second flexible circuit board, the first channel is connected to the signal bus, and a power supply interface and / or a network cable interface is arranged along the fourth direction of the second flexible circuit board.
9. The data acquisition system according to claim 8, characterized in that: A plurality of the first channels are arranged in parallel on the second flexible circuit board, and a second slot is arranged between adjacent first channels.
10. The data acquisition system according to claim 9, characterized in that: The second flexible circuit board includes a second FPC substrate and a third flexible packaging layer covering a surface of the second FPC substrate, the first channel is formed on the second FPC substrate, and the second groove is arranged on an outer surface of the third flexible packaging layer.