Optical processing apparatus and method of operation thereof
By using a thinned calibration plate and scattered light detection technology, the problems of slow and low-precision spot calibration in optical processing equipment have been solved, achieving fast and high-precision spot calibration and improving the processing efficiency and quality of semiconductor devices.
Patent Information
- Application Number
- CN202411883981.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2044-12-19
AI Technical Summary
Existing optical processing equipment is slow and has low precision when calibrating light spot quality, which makes the semiconductor device processing process cumbersome and difficult to meet the high precision requirements.
Using a thinned calibration sheet, the illumination spot is detected by scattering light. Combined with calibration and processing components, rapid and high-precision spot calibration is achieved.
It improves the speed and accuracy of spot calibration, simplifies the wafer processing flow, and enhances the quality and yield of semiconductor devices.
Smart Images

Figure CN119620558B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a processing apparatus and a processing method, and more particularly to an apparatus and method for processing semiconductor devices. Background Technology
[0002] In the field of semiconductor manufacturing technology, semiconductor equipment is needed to process wafers, such as using photolithography equipment to perform photolithography on wafers and using optical inspection equipment to inspect wafers. Especially in the field of semiconductor inspection, optical inspection is widely used due to its advantages such as non-contact and non-destructive operation.
[0003] The spot quality of optical processing equipment determines the precision of semiconductor processing equipment, thus affecting the quality and yield of semiconductor devices. Therefore, before processing wafers with optical processing equipment, the spot quality of the optical processing equipment needs to be calibrated to improve the precision of the optical processing equipment.
[0004] How to quickly calibrate the quality of the light spot and improve the speed and accuracy of light spot calibration is an urgent problem to be solved. Summary of the Invention
[0005] To address the above problems, this invention proposes an optical processing device that can improve processing speed.
[0006] The present invention provides an optical processing device, characterized in that it comprises: a processing component for projecting illumination light onto a sample and processing the sample according to the illumination light, wherein the illumination light forms an illumination spot on the sample surface and the sample is processed by the illumination light; a thinned calibration sheet for calibrating the illumination spot; and a calibration component for receiving scattered light formed by the illumination light scattered by the calibration sheet and detecting the illumination spot according to the scattered light.
[0007] Optionally, the calibration sheet is made of semiconductor material; the calibration sheet comprises at least a portion of a wafer.
[0008] Optionally, it may also include: a stage, the stage including a support area and a calibration area, the support area being used to support the sample, and the calibration area being used to set the calibration sheet.
[0009] Optionally, a drive module is provided for driving the stage to move so that the calibration component can detect the calibration piece.
[0010] Optionally, the calibration component is specifically used to acquire a spot image of the illumination spot and determine first physical information of the illumination spot based on the spot image; the first physical information includes one or a combination of position, shape, size and uniformity.
[0011] Optionally, the illumination light is reflected back from the sample to form a signal light, the signal light including: detection light and the scattered light; the processing component includes: a light source for projecting illumination light onto the sample; and a detection detector for detecting the sample based on the detection light.
[0012] Optionally, the illumination light includes a first illumination light, the signal light returned by the first illumination light through the sample is the first signal light; the detection light formed by the first illumination light is the first detection light, and the scattered light formed by the first illumination light is the first scattered light;
[0013] The detection device further includes: a first beam splitter for splitting the first signal light into the first detection light and the first scattered light; the detection detector includes a first detection detector for receiving the first detection light and detecting the sample based on the first detection light.
[0014] Optionally, the first detection light is formed by the reflection of the first illumination light from the sample; the first beam splitter includes a light-transmitting area and a reflective area, wherein the light-transmitting area is used to allow one of the first detection light and the first scattered light to pass through, and the reflective area is used to allow the other of the first detection light and the first scattered light to be reflected.
[0015] Optionally, the central axis of the first illumination light is perpendicular to the sample surface;
[0016] The processing component further includes a second beam splitter for reflecting the first illumination light onto the sample surface and allowing the first signal light to pass through; or for transmitting the first illumination light onto the sample surface and reflecting the first signal light.
[0017] Optionally, the processing component further includes a detection tube, which is used to focus the first detection light onto the first detection detector, and the first detection detector is used to detect the sample based on the first detection light.
[0018] Optionally, the device further includes: a first objective lens for collecting the signal light from the sample;
[0019] The calibration assembly further includes a calibration tube and a calibration detector, wherein the calibration tube and the first objective lens image the illumination spot onto the calibration detector; the calibration detector is used to acquire an image of the illumination spot based on the scattered light collected by the calibration tube.
[0020] Optionally, the first illumination light is broadband; the first detection detector is used to detect the light intensity of different wavelengths in the first detection light, and to obtain the second physical information of the sample based on the light intensity of each wavelength, the second physical information including one or more of the following: material, refractive index, thickness, and width.
[0021] Optionally, the illumination light includes a second illumination light, the scattered light formed by the second illumination light returning from the sample surface is the second scattered light, and the incident direction of the second illumination light is not parallel to the exit direction of the second scattered light; the detection light formed by the second illumination light returning from the sample surface is the second detection light, the incident direction of the second illumination light is not parallel to the exit direction of the second detection light; and the exit direction of the second scattered light is not parallel to the exit direction of the second detection light.
[0022] Optionally, the incident angle of the second illumination light is an obtuse angle or an acute angle; the second detection light is formed by reflection of the second illumination light;
[0023] The calibration component is specifically used to acquire a spot image of the illumination spot of the second illumination light based on the second scattered light.
[0024] Optionally, the processing component includes: an incident light path, the incident light path including: a second light source for generating an initial light beam; a polarizer for polarizing the initial light beam to form polarized light; and a second objective lens for converging the polarized light onto the sample surface to form the second illumination light;
[0025] The outgoing light path includes: a collecting objective lens for collecting the second detection light; a polarizer for converting the second detection light into polarized light; and a detection detector, including a second detection detector for detecting the second detection light passing through the polarizer and detecting second physical information of the target on the sample surface based on the second detection light, wherein the physical information includes one or more of the following: material, refractive index, thickness, and width.
[0026] A rotatable compensator, located in one or both of the incident and outgoing optical paths, is used to adjust the polarization state of the light beam.
[0027] The technical solution of this application also provides a working method based on the above-mentioned optical processing device, including: projecting illumination light onto the calibration component through the processing component, the illumination light being scattered by the calibration plate to form scattered light; detecting the illumination spot according to the scattered light through the calibration component to obtain a calibration result; adjusting the processing component according to the calibration result to make the illumination spot meet preset requirements; after the adjustment, allowing the processing component to process the sample through the calibrated illumination spot.
[0028] The optical processing equipment provided by the technical solution of this invention utilizes a calibration sheet with a rough surface obtained through thinning treatment, resulting in strong beam scattering and improved calibration accuracy. Furthermore, the high sensitivity of the scattered light to the target improves the measurement accuracy of the illumination spot, thereby accelerating the calibration process by calibrating the illumination spot using scattered light.
[0029] Furthermore, placing the calibration strip in the calibration area of the stage eliminates the need to reload the standard strip each time, thereby increasing the calibration speed and sample processing speed. Attached Figure Description
[0030] The present invention will be specifically described below with reference to the accompanying drawings and embodiments. The advantages and implementation methods of the present invention will become more apparent from this description. The content shown in the drawings is for illustrative purposes only and does not constitute any limitation on the present invention. The drawings are schematic only and are not strictly drawn to scale. In the drawings:
[0031] Figures 1 to 2 This is a schematic diagram of the structure of the first embodiment of the optical processing device provided by the present invention;
[0032] Figure 3 This is a schematic diagram of the structure of the second embodiment of the optical processing device provided by the present invention;
[0033] Figures 4 to 5 It is an image of the illumination spot obtained by the optical processing device provided by the present invention. Detailed Implementation
[0034] In semiconductor manufacturing, existing optical processing equipment requires specific calibration boards to calibrate the light spot. Before processing the wafer, the calibration board must be loaded to calibrate the light spot, and only then can the wafer be processed, making the wafer processing process cumbersome. Furthermore, the signal of existing optical processing equipment is relatively weak, making it difficult to perform high-precision calibration of the light spot.
[0035] This invention provides an optical processing device, comprising: a processing component for projecting illumination light onto a sample and processing the sample based on the illumination light, wherein the illumination light forms an illumination spot on the sample surface and processes the sample using the illumination light; a thinned calibration sheet for calibrating the illumination spot; and a calibration component for receiving scattered light formed by the illumination light scattered by the calibration sheet and detecting the illumination spot based on the scattered light. Calibrating the illumination spot using the scattered light generated by the thinned calibration sheet improves calibration accuracy.
[0036] The detection method of the present invention will be described in detail below.
[0037] Figures 1 to 2 This is a schematic diagram of the structure of the first embodiment of the optical processing device of the present invention.
[0038] The following combination Figures 1 to 2 The structure of the first embodiment of the overprinted mark of this application will be described in detail.
[0039] Figure 1 This is an optical path diagram of the first embodiment of the optical processing device of the present invention; Figure 2 This is a schematic diagram of the stage 200 of the optical processing device of the present invention.
[0040] Please refer to Figure 1 The optical processing device includes: a processing component for projecting illumination light onto a sample and processing the sample according to the illumination light, wherein the illumination light forms an illumination spot on the sample surface and processes the sample through the illumination light; a thinned calibration sheet 201 for calibrating the illumination spot; and a calibration component for receiving scattered light formed by the illumination light scattered by the calibration sheet 201 and detecting the illumination spot according to the scattered light.
[0041] In this embodiment, the sample is a wafer. This application does not limit the type of sample. In other embodiments, the sample may be an LED panel, a glass casing, or a chip.
[0042] In this embodiment, the calibration piece 201 is made of semiconductor material; the calibration piece 201 comprises a portion of a wafer. Specifically, the semiconductor is polycrystalline silicon, monocrystalline silicon, silicon carbide, or silicon-germanium. The calibration piece 201 is a portion of material cut from a wafer that has undergone thinning treatment.
[0043] The surface roughness of the thinned calibration plate 201 results in strong beam scattering, which improves calibration accuracy. Furthermore, the high sensitivity of the scattered light to the target improves the measurement accuracy of the illumination spot, thus accelerating the calibration process.
[0044] In this embodiment, the processing component is an optical detection component used to detect the sample. The detection includes inspecting for defects in the sample or measuring the target to be tested on the sample surface. Specifically, the target to be tested includes one or more of the following: thin films and through-silicon vias.
[0045] The illumination light is reflected back from the sample to form a signal light, which includes a detection light and the scattered light. The processing component includes a light source for projecting illumination light onto the sample and a detection detector for detecting the sample based on the detection light.
[0046] In other embodiments, the signal light may not include the detection light. For example, the processing component is a photolithography component.
[0047] In this embodiment, the illumination light includes a first illumination light, the signal light returned by the first illumination light through the sample is a first signal light; the detection light formed by the first illumination light is a first detection light, and the scattered light formed by the first illumination light is a first scattered light.
[0048] Specifically, the light source includes: a first light source 111, which generates the first illumination light, and the first illumination light forms an illumination spot on the sample surface.
[0049] The central axis of the first illumination light has a zero angle of incidence with respect to the sample surface. The central axis of the first illumination light is perpendicular to the sample surface and incident on the sample.
[0050] The detection device further includes a first objective lens 101, which is used to collect the first signal light. Specifically, the central axis of the first signal light collected by the first objective lens 101 is perpendicular to the sample surface.
[0051] Specifically, the optical axis of the first objective lens 101 is perpendicular to the sample surface.
[0052] In this embodiment, the first objective lens 101 is also used to collect the first illumination light and to converge the first illumination light onto the sample surface.
[0053] Specifically, the processing component further includes a second beam splitter 102, used to reflect the first illumination light onto the sample surface and allow the first signal light to pass through; or, to transmit the first illumination light onto the sample surface and allow the first signal light to be reflected. In this embodiment, the second beam splitter 102 is used to reflect the first illumination light onto the sample surface and allow the first signal light to pass through.
[0054] In this embodiment, the detection device further includes: a first beam splitter 103, used to separate the first signal light into the first detection light and the first scattered light; the detection detector includes a first detection detector 112, which is used to receive the first detection light and detect the sample according to the first detection light.
[0055] In this embodiment, the first detection light is formed by reflection of the first illumination light from the sample; specifically, the central axis of the illumination light is incident perpendicular to the sample surface, and the central axis of the first detection light is also perpendicular to the sample surface. In other embodiments, the first detection light can be formed by scattering the first illumination light; correspondingly, the central axis of the illumination light is incident perpendicular to the sample surface, and the central axis of the first detection light has a non-zero angle with the normal to the sample surface; or, the central axis of the illumination light has a non-zero angle with the normal to the sample surface, and the central axis of the first detection light is perpendicular to the sample surface.
[0056] In this embodiment, the first beam splitter 103 includes a light-transmitting area and a reflection area. The light-transmitting area is used to allow one of the first detection light and the first scattered light to pass through, and the reflection area is used to allow the other of the first detection light and the first scattered light to be reflected.
[0057] In this embodiment, the first signal light transmitted through the second beam splitter 102 reaches the first beam splitter 103, and the first beam splitter splits the first signal light to form the first scattered light and the first detection light.
[0058] Specifically, the reflective area surrounds the light-transmitting area, and the center of the light-transmitting area is located on the normal line of the sample surface.
[0059] In this embodiment, the first light-transmitting area is a through hole; the reflective area is a reflective surface.
[0060] The calibration component is specifically used to acquire a spot image of the illumination spot and determine the first physical information of the illumination spot based on the spot image; the physical information includes one or a combination of position, shape, size and uniformity.
[0061] In this embodiment, the calibration component includes a calibration detector 121, which is used to acquire an image of the illumination spot based on the first scattered light collected by the first objective lens 101.
[0062] Specifically, in this embodiment, the first objective lens 101 is used to image the illumination spot of the first illumination light onto the calibration detector 121 using the first scattered light. In other embodiments, the calibration assembly further includes a calibration tube, which, together with the first objective lens 101, images the illumination spot onto the calibration detector 121; the calibration detector 121 is used to acquire an image of the illumination spot based on the first scattered light collected by the calibration tube.
[0063] In this embodiment, the calibration assembly further includes a reflector 104, which is used to change the propagation direction of the first scattered light, allowing the first scattered light to enter the calibration detector 121. The reflector 104 can change the propagation direction of the first scattered light, thereby allowing the calibration detector 121 to be installed according to the device structure, thus saving space.
[0064] In this embodiment, the first objective lens 101 is used to focus the first detection light onto the first detection detector 112.
[0065] The detection detector includes a first detection detector 112, which is used to detect the first detection light and obtain the second physical information of the sample based on the first detection light.
[0066] In other embodiments of this application, the first objective lens 101 is used to collimate the first signal light, and the processing component further includes a detection tube lens, which is used to converge the first detection light to the first detection detector 112, and the first detection detector 112 is used to detect the sample based on the first detection light.
[0067] In this embodiment, the first illumination light is broadband, and the first detection detector 112 is used to detect the light intensity of different wavelengths in the first detection light, and to obtain the second physical information of the sample based on the light intensity of each wavelength. The second physical information includes one or more of the following: material, refractive index, thickness, and width. Specifically, the first detection detector 112 is a spectrometer.
[0068] In this embodiment, the first illumination light is polarized light; the processing component further includes a polarizer 105, which is used to convert the first illumination light into polarized light and allow the first signal light of a specific polarization state to pass through.
[0069] Please refer to Figure 2 The testing equipment further includes a stage 200, comprising a support area A and a calibration area B, wherein the support area A is used to support the sample and the calibration area B is used to set the calibration piece 201.
[0070] Specifically, in this embodiment, the supporting area A has a vacuum adsorption groove for adsorbing salt samples. The calibration sheet 201 is located around the supporting area A. There are multiple calibration sheets 201, specifically three. In other embodiments of this application, the number of calibration sheets 201 may be one. In other embodiments, the supporting area may also fix the sample using electrostatic or clamping methods.
[0071] The calibration area B includes a groove 202 for accommodating the calibration piece 201. The bottom of the groove 202 has a pinhole 202a that penetrates the stage 200. The device also includes a push pin that passes through the vibration hole and presses against the calibration piece 201, enabling replacement of the calibration piece 201. In other embodiments, the calibration piece 201 can be fixed to the stage 200 by adhesive bonding.
[0072] By placing the calibration piece 201 in the calibration area B of the stage 200, the standard piece does not need to be reloaded each time, which can improve the calibration speed and the sample processing speed.
[0073] The device further includes a drive module for driving the stage 200 to move so that the calibration component is aligned with the calibration piece 201.
[0074] Specifically, when processing the sample using the optical processing equipment, the stage 200 is moved by the drive module so that the first objective lens 101 is aligned with the calibration plate 201, and the illumination spot is detected and calibrated by the calibration component; the illumination spot is corrected by adjusting the processing component and / or the first objective lens 101 so that the illumination spot meets the preset requirements; after the illumination spot is corrected, the stage 200 is moved by the drive module so that the first objective lens 101 is aligned with the sample, and the processing component processes the sample.
[0075] Figure 3 This is a schematic diagram of the structure of the second embodiment of the optical processing device of the present invention.
[0076] The difference between this embodiment and the previous embodiment is that, in addition to the structure of the first embodiment, the processing component in this embodiment also includes a tilting processing component. Figure 3 The polarizer 105 and the reflector 104 are omitted in the embodiment shown.
[0077] The tilt processing component is specifically as follows:
[0078] In this embodiment, the illumination light further includes a second illumination light, and the scattered light formed by the second illumination light returning from the sample surface is the second scattered light. The incident direction of the second illumination light is not parallel to the exit direction of the first scattered light. The detection light formed by the second illumination light returning from the sample surface is the second detection light, and the incident direction of the second illumination light is not parallel to the exit direction of the second detection light. Furthermore, the exit directions of the second scattered light and the second detection light are not parallel.
[0079] The incident angle of the second illumination light is an obtuse angle or an acute angle; the second detection light is formed by reflection of the second illumination light; the calibration component is specifically used to acquire an image of the illumination spot based on the second scattered light.
[0080] The tilting processing assembly includes: an incident light path, which includes: a second light source 211 for generating an initial light beam; a polarizer 212 for polarizing the initial light beam to form polarized light; and a second objective lens (not shown in the figure) for converging the polarized light onto the sample surface to form the second illumination light.
[0081] The outgoing light path includes: a collecting objective (not shown in the figure) for collecting the second detection light; an analyzer 222 for converting the second detection light into polarized light; and a detection detector, which further includes a second detection detector 223 for detecting the second detection light passing through the analyzer 222 and detecting the second physical information of the target on the sample surface based on the second detection light. The second physical information includes one or more of the following: material, refractive index, thickness, and width.
[0082] A rotatable compensator, located in one or both of the incident and exit optical paths, is used to adjust the polarization state of the light beam. Specifically, in this embodiment, the tilting processing component includes a first rotatable compensator 213 and a second rotatable compensator 221, respectively located in the incident and exit optical paths.
[0083] Figure 4 and Figure 5 The optical processing device of this application is used to detect the acquired image of the illumination spot. It is evident that the optical processing device of this application can clearly image the illumination spot to obtain first physical information about the illumination spot based on the image. Specifically, in this embodiment, the positional information of the illumination spot can be obtained from the image to detect whether the illumination spot has shifted.
[0084] In this embodiment, the light source includes a first light source 111 and a second light source 211, and the illumination light includes a first illumination light and a second illumination light. In this embodiment, the first illumination spot and the second illumination spot can be detected by the calibration component and the calibration plate 201 respectively to ensure the quality of the illumination spot.
[0085] It should be noted that in other embodiments of this application, the optical processing device may not include the processing components described in the first embodiment and the second beam splitter 102; the processing components of the optical processing device may only include the tilting processing components in this embodiment.
[0086] The present invention also provides a method for operating an optical processing device, characterized in that it includes:
[0087] The processing component projects illumination light onto the calibration component, which is then scattered by the calibration plate 201 to form scattered light. The calibration component detects the illumination spot based on the scattered light to obtain a calibration result. The processing component is then adjusted based on the calibration result to make the illumination spot meet preset requirements. After the adjustment, the processing component processes the sample through the calibrated illumination spot.
[0088] The optical processing device described in this embodiment is the same as that in the first and second embodiments of the optical processing device. Further details will not be provided here.
[0089] Specifically, when processing the sample using the optical processing equipment, the stage 200 is moved by the drive module to align the first objective lens 101 with the calibration plate 201, and the illumination spot is detected and calibrated by the calibration component; the illumination spot is corrected by adjusting the processing component to make it meet preset requirements; after the illumination spot is corrected, the stage 200 is moved by the drive module to align the first objective lens 101 with the sample, and the processing component processes the sample.
[0090] Specifically, taking the first physical information as an example, the calibration result includes whether the first physical information of the illumination spot deviates from a preset position. If the position of the illumination spot deviates from the preset position, the processing component can be adjusted to bring the position of the illumination spot back to the preset position.
[0091] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.
Claims
1. An optical processing device, characterized by, The device comprises: a processing component configured to project illumination light to a sample and process the sample according to the illumination light, the illumination light forming an illumination spot on a surface of the sample and the sample being processed by the illumination light; a calibration wafer configured to be thinned and used to calibrate the illumination spot; a calibration component configured to receive scattered light scattered by the calibration wafer from the illumination light and detect the illumination spot according to the scattered light; the illumination light returning from the sample forms signal light, the signal light comprising detection light and the scattered light; the processing component comprises a light source configured to project the illumination light to the sample and a detection probe configured to detect the sample according to the detection light; the illumination light comprises first illumination light, and the signal light returning from the sample by the first illumination light is first signal light; the detection light formed by the first illumination light is first detection light, and the scattered light formed by the first illumination light is first scattered light; the optical processing device further comprises a first beam splitter configured to separate the first signal light to form the first detection light and the first scattered light; the detection probe comprises a first detection probe configured to receive the first detection light and detect the sample according to the first detection light; the first detection light is formed by reflection of the first illumination light on the sample; the first beam splitter comprises a light-transmitting region and a reflecting region, the light-transmitting region being configured to transmit one of the first detection light and the first scattered light, and the reflecting region being configured to reflect the other of the first detection light and the first scattered light.
2. The optical processing device of claim 1, wherein, The material of the calibration wafer is a semiconductor; and the calibration wafer comprises at least a part of a wafer.
3. The optical processing device of claim 1, wherein, The device further comprises: a stage comprising a carrying region configured to carry the sample and a calibration region configured to arrange the calibration wafer; 4. The optical processing device of claim 3, wherein, a driving module configured to drive the stage to move so that the calibration component detects the calibration wafer.
5. The optical processing device of claim 1, wherein, The calibration component is specifically configured to acquire a spot image of the illumination spot, and determine first physical information of the illumination spot according to the spot image; the first physical information comprises one or more of a position, a shape, a size, and uniformity.
6. The optical processing device of claim 1, wherein, a central axis of the first illumination light is perpendicular to the surface of the sample; the processing component further comprises a second beam splitter configured to reflect the first illumination light to the surface of the sample and transmit the first signal light; or, transmit the first illumination light to the surface of the sample and reflect the first signal light.
7. The optical processing device of claim 1, wherein, The processing component further comprises a detection tube lens configured to converge the first detection light to the first detection probe, and the first detection probe is configured to detect the sample according to the first detection light.
8. The optical processing device of claim 1, wherein, The device further comprises a first objective lens configured to collect the signal light from the sample; the calibration component further comprises a calibration tube lens and a calibration probe, the calibration tube lens and the first objective lens are configured to image the illumination spot to the calibration probe, and the calibration probe is configured to acquire an image of the illumination spot according to the scattered light collected by the calibration tube lens.
9. The optical processing device of claim 1, wherein, The first illumination light is wide spectrum; the first detection probe is used for detecting the light intensity of different wavelengths in the first detection light, and obtaining the second physical information of the sample according to the light intensity of each wavelength, wherein the second physical information comprises one or more of the combination of material, refractive index, thickness and width.
10. The optical processing device according to any one of claims 1 to 9, characterized in that, The illumination light comprises second illumination light, the scattering light formed by the second illumination light returning through the sample surface is second scattering light, the incident direction of the second illumination light is not parallel to the emission direction of the second scattering light; the detection light formed by the second illumination light returning through the sample surface is second detection light, the incident direction of the second illumination light is not parallel to the emission direction of the second detection light; and the emission directions of the second scattering light and the second detection light are not parallel.
11. The optical processing device of claim 10, wherein, The incident angle of the second illumination light is obtuse angle or acute angle; the second detection light is formed by reflection of the second illumination light; The calibration component is specifically used for obtaining the spot image of the illumination light spot of the second illumination light according to the second scattering light.
12. The optical processing device of claim 11, wherein, The processing component comprises: an incident light path, which comprises: a second light source for generating an initial light beam; a polarizer for polarizing the initial light beam to form polarized light; and a second objective lens for converging the polarized light to the sample surface to form the second illumination light; An emission light path, which comprises: a collection objective lens for collecting the second detection light; a detection polarizer for converting the second detection light into polarized light; and a detection probe, which comprises a second detection probe for detecting the second detection light passing through the detection polarizer and detecting the second physical information of the target to be detected on the sample surface according to the second detection light, wherein the physical information comprises one or more of the combination of material, refractive index, thickness and width; A rotatable compensator located in one or both of the incident light path and the emission light path, used for adjusting the polarization state of the light beam.
13. A method of operating an optical processing device according to any one of claims 1 to 12, characterized in that Comprise: The processing component projects illumination light to the calibration component, and the illumination light is scattered by the calibration sheet to form scattering light; The calibration component detects the illumination light spot according to the scattering light to obtain a calibration result; The processing component is adjusted according to the calibration result to make the illumination light spot meet the preset requirements; After the adjustment processing, the processing component processes the sample by the calibrated illumination light spot. The first illumination light is wide spectrum; the first detection probe is used for detecting the light intensity of different wavelengths in the first detection light, and obtaining the second physical information of the sample according to the light intensity of each wavelength, wherein the second physical information comprises one or more of the combination of material, refractive index, thickness and width. The illumination light comprises second illumination light, the scattering light formed by the second illumination light returning through the sample surface is second scattering light, the incident direction of the second illumination light is not parallel to the emission direction of the second scattering light; the detection light formed by the second illumination light returning through the sample surface is second detection light, the incident direction of the second illumination light is not parallel to the emission direction of the second detection light; and the emission directions of the second scattering light and the second detection light are not parallel. The incident angle of the second illumination light is obtuse angle or acute angle; the second detection light is formed by reflection of the second illumination light; The calibration component is specifically used for obtaining the spot image of the illumination light spot of the second illumination light according to the second scattering light. The processing component comprises: an incident light path, which comprises: a second light source for generating an initial light beam; a polarizer for polarizing the initial light beam to form polarized light; and a second objective lens for converging the polarized light to the sample surface to form the second illumination light; An emission light path, which comprises: a collection objective lens for collecting the second detection light; a detection polarizer for converting the second detection light into polarized light; and a detection probe, which comprises a second detection probe for detecting the second detection light passing through the detection polarizer and detecting the second physical information of the target to be detected on the sample surface according to the second detection light, wherein the physical information comprises one or more of the combination of material, refractive index, thickness and width; A rotatable compensator located in one or both of the incident light path and the emission light path, used for adjusting the polarization state of the light beam. Comprise: The processing component projects illumination light to the calibration component, and the illumination light is scattered by the calibration sheet to form scattering light; The calibration component detects the illumination light spot according to the scattering light to obtain a calibration result; The processing component is adjusted according to the calibration result to make the illumination light spot meet the preset requirements; After the adjustment processing, the processing component processes the sample by the calibrated illumination light spot.
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