Multilayer electronic component

Abstract

There is provided a multilayer electronic component including: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers; an external electrode disposed outside the main body; and a frame terminal including a connecting portion disposed on the external electrode and extending in a first direction, a mounting portion spaced apart from the connecting portion and extending in a second direction intersecting the first direction, and a coupling portion connecting the connecting portion and the mounting portion, the coupling portion includes an inward portion extending inwardly from one end of the connecting portion toward a plane of a central cross-section of the body perpendicular to the second direction, and an outward portion extending outwardly from one end of the inward portion away from the plane of the central cross-section, when an angle formed by the inward portion and the outward portion is defined as [theta], [theta] satisfies 10 DEG < = [theta] < = 150 DEG.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0120954 filed on September 12, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] A multilayer ceramic capacitor (MLCC, a type of multilayer electronic component) may be a chip capacitor mounted on a printed circuit board of any of various electronic products such as an image display device (such as a liquid crystal display (LCD) or a plasma display panel (PDP)), a computer, a smart phone, or a cellular phone to charge or discharge the same.

[0004] Since multilayer ceramic capacitors have a small size, achieve high capacitance, and can be easily mounted, they are used as components in various electronic devices. Recently, with the rapid rise of environmentally friendly vehicles and electric vehicles, the number of power drive systems of vehicles is increasing, and thus the demand for multilayer ceramic capacitors required for such power drive systems of vehicles is also increasing.

[0005] As the use environment of multilayer ceramic capacitors becomes more severe, cracks are easily generated due to vibration or mechanical deformation of the substrate on which the multilayer ceramic capacitor is mounted. When a conventional multilayer ceramic capacitor is mounted on a substrate, the body of the multilayer ceramic capacitor and the substrate may directly contact each other through solder, and heat or mechanical deformation generated from the substrate or adjacent components may be directly transmitted to the multilayer ceramic capacitor, making it difficult to ensure a high level of reliability.

[0006] Therefore, a method of preventing heat and mechanical stress from a substrate from being directly transferred to a multilayer ceramic capacitor by bonding a metal frame to a side surface of the multilayer ceramic capacitor to ensure a distance between the multilayer ceramic capacitor and a substrate on which the multilayer ceramic capacitor is mounted has recently been proposed.

[0007] However, additional research on multilayer ceramic capacitors having excellent durability such as bending strength, equivalent series resistance (ESR), and noise within a limited mounting area is required. Summary of the invention

[0008] An aspect of the present disclosure is to provide a multilayer electronic component having excellent durability against thermal or mechanical deformation generated by a substrate.

[0009] According to one aspect of the present disclosure, a multilayer electronic component is provided, comprising: a main body, comprising a dielectric layer and inner electrodes alternately arranged with the dielectric layer; an outer electrode arranged outside the main body; and a frame terminal, comprising a connecting portion, a mounting portion and a connecting portion, wherein the connecting portion is arranged on the outer electrode and extends along a first direction, the mounting portion is spaced apart from the connecting portion and extends along a second direction intersecting the first direction, and the connecting portion connects the connecting portion and the mounting portion, wherein the connecting portion comprises an inward portion and an outward portion, the inward portion extends inwardly from one end of the connecting portion toward a plane of a central cross-section of the main body perpendicular to the second direction, and the outward portion extends outwardly from one end of the inward portion away from the plane of the central cross-section, wherein when the angle formed by the inward portion and the outward portion is defined as θ, θ satisfies 10°≤θ≤150°.

[0010] According to another aspect of the present disclosure, a multilayer electronic component is provided, comprising: a main body, comprising a dielectric layer and internal electrodes alternately arranged with the dielectric layer; an external electrode arranged outside the main body; and a frame terminal, comprising a connecting portion, a mounting portion and a connecting portion, the connecting portion being arranged on the external electrode and extending along a first direction, the mounting portion being spaced apart from the connecting portion and extending along a second direction intersecting the first direction, and the connecting portion connecting the connecting portion and the mounting portion, wherein the connecting portion comprises an inner protruding portion and an outer protruding portion, the inner protruding portion protruding inwardly toward a plane of a central cross-section of the main body perpendicular to the second direction, and the outer protruding portion being connected to the inner protruding portion and protruding outwardly away from the plane of the central cross-section.

[0011] According to another aspect of the present disclosure, a multilayer electronic component is provided, which includes: a main body, on which external electrodes are arranged on opposite side surfaces of the main body; a first frame terminal and a second frame terminal, each of the first frame terminal and the second frame terminal including: a connecting portion, connected to the corresponding external electrode and extending parallel to the corresponding side surface of the main body; a mounting portion, arranged away from the main body and extending along a longitudinal direction intersecting with the plane of the corresponding side surface; and a connecting portion, arranged between the connecting portion and the mounting portion, protruding toward and / or away from the main body in the longitudinal direction, wherein, in the longitudinal direction, the distance between the innermost surface of the connecting portion of the first frame terminal and the innermost surface of the connecting portion of the second frame terminal is smaller than the distance between the corresponding side surfaces, and / or in the longitudinal direction, the distance between the outermost surface of the connecting portion of the first frame terminal and the outermost surface of the connecting portion of the second frame terminal is larger than the distance between the corresponding side surfaces. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0013] Figure 1 is a perspective view schematically showing a multilayer electronic component according to a first embodiment of the present disclosure;

[0014] Figure 2 It is schematically shown Figure 1 A three-dimensional diagram of a multilayer capacitor;

[0015] Figure 3 is a schematic diagram showing the decomposed state Figure 2 An exploded perspective view of the subject;

[0016] Figure 4 It is along Figure 1 A cross-sectional view taken along line II';

[0017] Figure 5 yes Figure 4 An enlarged view of area K1;

[0018] Figure 6 yes Figure 4 A variation of , and Figure 6 is a cross-sectional view schematically showing a multilayer electronic component according to a second embodiment of the present disclosure.

[0019] Figure 7 yes Figure 6 An enlarged view of area K2;

[0020] Figure 8 is a perspective view schematically showing a multilayer electronic component according to a third embodiment of the present disclosure.

[0021] Fig. 9 It is along Figure 8 A cross-sectional view taken along line II-II'.

[0022] Fig.10 yes Fig. 9 A variation of , and Fig.10 is a cross-sectional view schematically showing a multilayer electronic component according to a fourth embodiment of the present disclosure. DETAILED DESCRIPTION

[0023] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings. However, the present disclosure may be illustrated in many different forms and should not be construed as being limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. Therefore, for clear description, the shapes and sizes of the elements in the accompanying drawings may be exaggerated, and the elements represented by the same reference numerals in the accompanying drawings are the same elements.

[0024] In the accompanying drawings, irrelevant descriptions will be omitted to clearly describe the present disclosure, and the thickness may be exaggerated to clearly indicate multiple layers and regions. The same elements with the same functions within the scope of the same concept will be described using the same reference numerals. Throughout the specification, unless otherwise specifically stated, when a component is referred to as "including" or "comprising", it means that it may also include other components without excluding other components.

[0025] Any two of the first direction, the second direction, and the third direction may intersect each other. For example, in the drawings, the first direction may be defined as a thickness direction, the second direction may be defined as a length direction or a longitudinal direction, and the third direction may be defined as a width direction.

[0026] (First embodiment)

[0027] Figure 1 is a perspective view schematically showing a multilayer electronic component according to a first embodiment of the present disclosure.

[0028] Figure 2 It is schematically shown Figure 1 A three-dimensional diagram of a multilayer capacitor.

[0029] Figure 3 is a schematic diagram showing the decomposed state Figure 2 An exploded perspective view of the subject.

[0030] Figure 4 It is along Figure 1 A cross-sectional view taken along line II'.

[0031] Figure 5 yes Figure 4 Magnified view of area K1.

[0032] Reference Figures 1 to 5 The multilayer electronic component 1000 according to the first embodiment of the present disclosure may include a multilayer capacitor 100 and frame terminals 310 and 320. The multilayer capacitor 100 may include a body 110 and external electrodes 131 and 132 disposed on the outside of the body 110.

[0033] The body 110 is not limited to a specific shape and may be Figure 1and Figure 2 As shown, it may have a hexahedral shape or a shape similar to a hexahedral shape. The body 110 may not have a perfect straight hexahedral shape because the ceramic powder particles included in the body 110 may shrink during the sintering process or the edges of the body 110 may be polished. However, the body 110 may have a substantially hexahedral shape.

[0034] The body 110 may have a first surface 1 and a second surface 2 that are opposite to each other (or intersect the first direction), a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other (or intersect the second direction), and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and are opposite to each other (or intersect the third direction).

[0035] The body 110 may include a dielectric layer 111 and internal electrodes 121 and 122 that are alternately arranged with the dielectric layer 111. The plurality of dielectric layers 111 forming the body 110 may be in a sintered state, and the boundaries between adjacent dielectric layers 111 may be integrated with each other, such that the boundaries may not be easily distinguishable without a scanning electron microscope (SEM).

[0036] The dielectric layer 111 may be formed by the following method: preparing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, coating the slurry on a carrier film and drying it to prepare a ceramic green sheet, and then sintering the ceramic green sheet. There is no particular limitation on the ceramic powder as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material may be used. The ceramic powder may be, for example, BaTiO 3 , or (Ba 3 Ca 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O 3 (0 < y < 1), etc.

[0037] The average thickness of the dielectric layer 111 does not need to be particularly limited, but the average thickness of at least one of the dielectric layers 111 may be greater than or equal to 0.1 μm and less than or equal to 10 μm. In addition, the average thickness of the dielectric layer 111 may be arbitrarily set according to the desired characteristics or purpose. For example, in the case of a high voltage electronic component, the average thickness of at least one of the dielectric layers 111 may be greater than or equal to 0.5 μm, and in order to achieve high capacitance of a multilayer electronic component, the average thickness of at least one of the dielectric layers 111 may be less than 2.8 μm.

[0038] The internal electrodes 121 and 122 may be alternately disposed with the dielectric layer 111, and, for example, the first internal electrode 121 and the second internal electrode 122 as a pair of electrodes having different polarities may be disposed opposite to each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 may be electrically isolated from each other by the dielectric layer 111 disposed therebetween.

[0039] The first inner electrode 121 may be disposed to be spaced apart from the fourth surface 4 and may be connected to the first outer electrode 131 on the third surface 3. In addition, the second inner electrode 122 may be disposed to be spaced apart from the third surface 3 and may be connected to the second outer electrode 132 on the fourth surface 4.

[0040] The conductive metal included in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and the internal electrodes 121 and 122 may include, for example, Ni as a main component, but the present disclosure is not limited thereto.

[0041] The internal electrodes 121 and 122 may be formed by coating or printing a conductive paste for internal electrodes containing a conductive metal on a ceramic green sheet to a predetermined thickness and sintering it. The printing method of the conductive paste for internal electrodes may be screen printing or gravure printing, but the present disclosure is not limited thereto.

[0042] The average thickness of the internal electrodes 121 and 122 does not need to be particularly limited, but may be, for example, greater than or equal to 0.05 μm and less than or equal to 3.0 μm. In addition, the average thickness of the internal electrodes 121 and 122 may be arbitrarily set according to the desired characteristics or purpose. For example, in the case of a high voltage electronic component, the average thickness of at least one of the internal electrodes 121 and 122 may be greater than or equal to 0.1 μm, and in order to achieve high capacitance of a multilayer electronic component, the average thickness of at least one of the internal electrodes 121 and 122 may be less than 1.0 μm.

[0043] The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 represent the size of the dielectric layer 111 in the first direction and the size of the internal electrodes 121 and 122 in the first direction, respectively. The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 can be measured by scanning the cross section of the body 110 in the first direction and the second direction at a magnification of 10000 with a scanning electron microscope (SEM). More specifically, the average thickness of the dielectric layer 111 can be obtained by measuring the thickness of one dielectric layer 111 at multiple points (e.g., 30 points equally spaced in the second direction) and averaging the measured thicknesses. In addition, the average thickness of the internal electrodes 121 and 122 can be obtained by measuring the thickness of one internal electrode 121 or 122 at multiple points (e.g., 30 points equally spaced in the second direction) and averaging the measured thicknesses. The 30 equally spaced points can be specified in the capacitance forming portion to be described later. Furthermore, when the average thickness is obtained by extending the average thickness measurement to 10 dielectric layers 111 and 10 internal electrodes 121 and 122, respectively, the average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 may be further generalized.

[0044] The body 110 may include: a capacitor forming portion, which is disposed inside the body 110 and includes first and second internal electrodes 121 and 122 alternately disposed and a dielectric layer 111 interposed between the first and second internal electrodes 121 and 122, for forming a capacitor; and a first covering portion 112 and a second covering portion 113, which are respectively disposed on two surfaces of the capacitor forming portion opposite to each other in the first direction. The covering portions 112 and 113 may be basically used to prevent the internal electrodes from being damaged due to physical stress or chemical stress. The covering portions 112 and 113 may have the same configuration as the dielectric layer 111, and the covering portions 112 and 113 do not include the internal electrodes.

[0045] The thickness of the covering portions 112 and 113 is not particularly limited. However, in order to achieve miniaturization and high capacitance of multilayer electronic components, the average thickness of the covering portions 112 and 113 may be less than or equal to 100 μm, less than or equal to 50 μm, or less than or equal to 20 μm. Here, the average thickness of the covering portions 112 and 113 may represent the average thickness of each of the first covering portion 112 and the second covering portion 113. The average thickness of the covering portions 112 and 113 may represent the average size of the covering portions 112 and 113 in the first direction, and may be a size obtained by averaging the sizes of the covering portions 112 and 113 in the first direction measured at five equally spaced points in a cross section of the body in the first direction and the second direction.

[0046] The external electrodes 131 and 132 may be disposed outside the body 110 and may be connected to the internal electrodes 121 and 122. Specifically, the external electrodes 131 and 132 may include a first external electrode 131 and a second external electrode 132 respectively disposed on two surfaces of the body 110 opposite to each other in the second direction. The first external electrode 131 may be connected to the first internal electrode 121, and the second external electrode 132 may be connected to the second internal electrode 122.

[0047] The first external electrode 131 may include: a first coupling portion 131a disposed on the third surface 3 and connected to the first internal electrode 121; and a first band portion 131b extending from the first coupling portion 131a to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6 of the body 110. The second external electrode 132 may include: a second coupling portion 132a disposed on the fourth surface 4 and connected to the second internal electrode 122; and a second band portion 132b extending from the second coupling portion 132a to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6 of the body 110.

[0048] The external electrodes 131 and 132 may include a base electrode and a terminal electrode disposed on the base electrode. That is, the first external electrode 131 may include a first base electrode in contact with the third surface 3 and a first terminal electrode disposed on the first base electrode. The second external electrode 132 may include a second base electrode in contact with the fourth surface 4 and a second terminal electrode disposed on the second base electrode.

[0049] The base electrode may include metal and glass. The metal included in the base electrode may be used to ensure electrical connectivity, and the glass may be used to improve bonding strength with the body 110.

[0050] The metal included in the base electrode may be formed using any material as long as it has conductivity, and a specific material may be determined in consideration of electrical properties, structural stability, etc. For example, the metal included in the base electrode may be one or more selected from the group consisting of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and the metal included in the base electrode may include Cu as a main component, but the present disclosure is not limited thereto.

[0051] In addition, the base electrode may be configured using a single layer including metal and glass, but the present disclosure is not limited thereto, and for example, the base electrode may have a multi-layer structure.

[0052] For example, the base electrode may include a first layer including metal and glass and a second layer disposed on the first layer and including metal and resin. Since the base electrode includes the second layer, the bending strength of the multilayer electronic component 1000 may be improved.

[0053] The metal included in the second layer is not particularly limited, and may include one or more selected from the group consisting of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof. The metal included in the second layer may include, for example, one or more of spherical particles and flaky particles.

[0054] The resin included in the second layer can be used to ensure bonding performance and absorb impact. The resin is not particularly limited as long as it has bonding performance and impact absorption performance, and can be mixed with metal powder to make a paste. For example, the resin may include one or more selected from epoxy resin, acrylic resin, etc. In addition, the resin may also include ethyl cellulose.

[0055] The terminal electrode can improve the mounting characteristics. The type of the terminal electrode is not particularly limited, and may be a plating including Ni, Sn, Pd and / or an alloy containing them, and may be formed using multiple layers. The terminal electrode may be, for example, a Ni plating or a Sn plating, or may be formed by sequentially forming a Ni plating and a Sn plating. In addition, the terminal electrode may include multiple Ni platings and / or multiple Sn platings.

[0056] In the drawings, although a structure in which the multilayer electronic component 1000 has two external electrodes 131 and 132 is illustrated, the structure is not limited thereto, and the number and shape of the external electrodes 131 and 132 may be changed according to the shapes of the internal electrodes 121 and 122 or other purposes.

[0057] The size of the multilayer capacitor 100 does not need to be particularly limited. For example, the maximum size of the multilayer capacitor 100 in the second direction may be 0.1 mm to 4.5 mm, the maximum size of the multilayer capacitor 100 in the third direction may be 0.05 mm to 3.2 mm, and the maximum size of the multilayer capacitor 100 in the first direction may be 0.05 mm to 2.5 mm.

[0058] According to the first embodiment of the present disclosure, the frame terminals 310 and 320 may be disposed outside the multilayer capacitor 100 in the second direction. Specifically, the frame terminals 310 and 320 may include a first frame terminal 310 connected to the first external electrode 131 and a second frame terminal 320 connected to the second external electrode 132.

[0059] The frame terminals 310 and 320 may include Ni, Fe, Cu, Ag, Cr or alloys thereof. For example, the frame terminals 310 and 320 may be Fe-42Ni alloy or Fe-18Cr alloy. The thickness of the frame terminals 310 and 320 does not need to be particularly limited, but may be, for example, 0.05 mm to 0.5 mm.

[0060] The frame terminals 310 and 320 may include: connection portions 311 and 321 disposed on the external electrodes 131 and 132 and extending in a first direction (e.g., extending parallel to the third surface 3 and the fourth surface 4); mounting portions 312 and 322 spaced apart from the connection portions 311 and 321 and extending in a second direction intersecting the first direction (e.g., substantially parallel to the first surface 1 and / or the second surface 2); and coupling portions 313 and 323 connecting the connection portions 311 and 321 with the mounting portions 312 and 322. That is, the first frame terminal 310 may include: a first connection portion 311 disposed on the first external electrode 131 and extending in the first direction; a first mounting portion 312 spaced apart from the first connection portion 311 and extending in the second direction; and a first coupling portion 313 connecting the first connection portion 311 and the first mounting portion 312. The second frame terminal 320 may include: a second connection portion 321 disposed on the second external electrode 132 and extending in the first direction; a second mounting portion 322 spaced apart from the second connection portion 321 and extending in the second direction; and a second coupling portion 323 connecting the second connection portion 321 and the second mounting portion 322 .

[0061] The frame terminals 310 and 320 substantially secure the distance between the multilayer capacitor 100 and the substrate to prevent heat or vibration generated from the substrate from being directly transferred to the multilayer capacitor 100 , thereby improving thermal reliability and mechanical durability of the multilayer electronic component 1000 .

[0062] The connection parts 311 and 321 may be connected to the coupling parts 131 a and 132 a of the external electrodes 131 and 132 , thereby serving to electrically connect the external electrodes 131 and 132 with the frame terminals 310 and 320 .

[0063] In an embodiment, the multilayer electronic component 1000 may include conductive adhesive portions 510 and 520 disposed between the external electrodes 131 and 132 and the frame terminals 310 and 320. Specifically, the first conductive adhesive portion 510 may be disposed between the first external electrode 131 and the first frame terminal 310, and the second conductive adhesive portion 520 may be disposed between the second external electrode 132 and the second frame terminal 320. The conductive adhesive portions 510 and 520 may be used to improve the electrical connection and physical connection between the external electrodes 131 and 132 and the frame terminals 310 and 320.

[0064] The first conductive adhesive part 510 and the second conductive adhesive part 520 may include a conductive adhesive such as solder or a conductive resin paste. The solder may include, for example, Sn-Sb-based solder, Sn-Ag-Cu-based solder, Sn-Cu-based solder, and / or Sn-Bi-based solder.

[0065] The coupling parts 313 and 323 may include: inward portions 313a and 323a extending inwardly from one end of the coupling parts 311 and 321 toward the plane of the central cross section of the body 110 perpendicular to the second direction; and outward portions 313b and 323b extending outwardly from one end of the inward portions 313a and 323a away from the plane of the central cross section. That is, the first coupling part 313 may include: a first inward portion 313a extending inwardly from one end of the first coupling part 311 toward the plane of the central cross section; and a first outward portion 313b extending outwardly from one end of the first inward portion 313a away from the plane of the central cross section; and the second coupling part 323 may include: a second inward portion 323a extending inwardly from one end of the second coupling part 321 toward the plane of the central cross section; and a second outward portion 323b extending outwardly from one end of the second inward portion 323a away from the plane of the central cross section. That is, the coupling parts 313 and 323 may have a shape bent inwardly in the second direction, thereby improving the bending strength of the multilayer electronic component 1000 .

[0066] According to the first embodiment of the present disclosure, when the angle formed by the inward portions 313a and 323a and the outward portions 313b and 323b is defined as θ, 10°≤θ≤150° may be satisfied. When the angle θ is greater than 150°, the effect of improving the bending strength of the present disclosure may be extremely small. In addition, when the angle θ is less than 10°, the distance between the first coupling portion 313 and the second coupling portion 323 is reduced, so that the side effect of excessive increase in ESR or acoustic noise of the multilayer electronic component 1000 may occur. In addition, from the viewpoint of ensuring the electrical characteristics of the multilayer electronic component 1000, the angle θ preferably satisfies 60°≤θ≤150°, but the present disclosure is not limited thereto.

[0067] like Figure 5 As shown, in the outer surface of the first frame terminal 310, there may be a first bending point P between the first connection portion 311 and the first inward portion 313a, there may be a second bending point Q between the first inward portion 313a and the first outward portion 313b, and there may be a third bending point R between the first outward portion 313b and the first mounting portion 312. For example, the angle θ may represent a smaller angle of two angles formed by a straight line obtained by connecting the first bending point P and the second bending point Q and a straight line obtained by connecting the second bending point Q and the third bending point R.

[0068] In an embodiment, when the maximum distance between the outer surface of the first outer electrode 131 and the outer surface of the second outer electrode 132 in the second direction is defined as L1, and the minimum distance between the first connection portion 313 of the first frame terminal 310 and the second connection portion 323 of the second frame terminal 320 in the second direction is defined as L2, the maximum distance L1 and the minimum distance L2 may satisfy L2 ≥ 0.1 × L1. When the minimum distance L2 is less than 0.1 × L1, the distance between the first frame terminal 310 and the second frame terminal 320 becomes too close, and there is a risk of arc discharge. The upper limit of the minimum distance L2 does not need to be particularly limited, and may be, for example, L2 < L1.

[0069] For example, the mounting portions 312 and 322 may be used as terminals when mounted on a substrate, and may be joined to a pad pattern of the substrate by solder, etc. In addition, in order to ensure a distance between the multilayer capacitor 100 and the substrate when the multilayer electronic component 1000 is mounted on the substrate, the maximum dimension of the body 110 in the first direction is defined as T, and the minimum dimension between the body 110 and the mounting portions 312 and 322 in the first direction is defined as T1, and 0.2×T≤T1≤T may preferably be satisfied.

[0070] For the mounting portions 312 and 322, in order to be used as terminals when mounted on a substrate, it is sufficient to extend in the second direction and / or the third direction to be parallel to the mounting surface. However, in an embodiment, the mounting portions 312 and 322 may extend inwardly in the second direction from one end of the coupling portions 313 and 323, thereby reducing the mounting area compared to a structure in which the mounting portions 312 and 322 extend outwardly in the second direction from one end of the coupling portions 313 and 323.

[0071] (Experimental example)

[0072] <Bending Strength Evaluation>

[0073] A multilayer capacitor satisfying the X7R standard, having a capacity of 4.7 μF and a rated voltage of 50 V, having a size of 3.2 mm in the second direction and a size of 2.5 mm in the third direction, was prepared. Sample sheets of sample No. 1 to sample No. 6 were prepared, the sample sheets being formed with frame terminals connected to the outer electrodes of the multilayer capacitor and having different angles θ between the inward and outward portions of the connection portions.

[0074] Next, a measuring plate (or substrate) for evaluating bending strength is prepared. The measuring plate (or substrate) is supported by two support portions spaced apart from each other, and the distance between the two support portions is 9.0 cm. Then, the sample pieces of sample No. 1 to sample No. 6 are mounted on the substrate, and then the substrate on which the sample piece is mounted is moved downward at a speed of 1 m / s from the initial position of the central part between the two support portions. Then, the substrate is moved until a crack appears in the sample piece, and when a crack appears in the sample piece, the distance moved by the substrate relative to the initial position of the central part is measured. In addition, in order to perform bending strength evaluation, 30 sample pieces of each of sample No. 1 to sample No. 6 are horizontally mounted (the mounting surface is parallel to the inner electrode) on the substrate, and 30 sample pieces of each of sample No. 1 to sample No. 6 are vertically mounted (the mounting surface is perpendicular to the inner electrode) on the substrate. The average value, maximum value, minimum value and standard deviation of the distance moved by the substrate relative to the initial position of the central part are described in Table 1 below.

[0075] [Table 1]

[0076]

[0077]

[0078] Referring to the minimum value of the bending strength in Table 1 above, it can be confirmed that in Samples 1 to 5, when the bending strength was evaluated, the bending strength was guaranteed to be 6 mm or more. As the angle θ increases, the bending strength decreases, and it can be confirmed that in Sample 6, the bending strength cannot be guaranteed to be 6 mm or more.

[0079] <ESR Evaluation>

[0080] An LCR meter (E4980A) was used to measure the ESR of samples No. 1 to No. 6. Ten sample pieces for each sample number (60 sample pieces in total) were measured for the ESR at a frequency of 500 kHz using a surface mount device (SMD) fixture type probe, and the average value, maximum value, and minimum value of the ESR are described in Table 2 below.

[0081] [Table 2]

[0082] Sample No. 1 2 3 4 5 6 θ 5° 10° 60° 90° 150° 180° Average value (mΩ) 10.50 8.09 7.17 6.03 5.27 3.45 Maximum value (mΩ) 11.74 9.27 8.17 7.30 7.67 4.85 Min. value (mΩ) 8.94 6.17 5.81 4.92 4.12 2.17

[0083] Referring to Table 2, it can be confirmed that the ESR decreases as the angle θ increases. This is because the smaller the angle θ is, the shorter the distance between the first frame terminal and the second frame terminal is. In addition, it can be confirmed that the ESR of samples No. 2 to No. 6 is satisfactory, but the average value of the ESR of sample No. 1 is 10.50 mΩ, which exceeds the ESR value of 10 mΩ, which is the ESR value generally required for multilayer capacitors.

[0084] <Acoustic Noise Evaluation>

[0085] To measure acoustic noise, sample pieces of sample No. 1 to sample No. 6 were mounted on a substrate, which was then mounted on a jig for measurement. A direct current (DC) power supply and a signal generator were then used to apply DC voltage and voltage fluctuations to the sample mounted on the jig for measurement. Acoustic noise was then measured using a microphone mounted just above the substrate.

[0086] For each sample number, the acoustic noise of 10 sample pieces (60 sample pieces in total) was measured, respectively, and the average value, maximum value, and minimum value of the acoustic noise measurement values ​​were calculated and described in Table 3 below.

[0087] [Table 3]

[0088] Sample No. 1 2 3 4 5 6 θ 5° 10° 60° 90° 150° 180° Average value (dB) 39.0 34.3 29.7 27.2 24.8 20.3 Maximum value (dB) 41.1 36.7 31.9 29.1 27.5 21.7 Minimum value (dB) 36.4 30.8 27.5 25.2 22.8 19.4

[0089] Referring to Table 3, it can be confirmed that as the angle θ increases, the noise decreases. In addition, the average values ​​of the acoustic noise of samples No. 2 to No. 6 are satisfactory, but the average value of the acoustic noise of sample No. 1 is 39.0 dB, which exceeds the acoustic noise value of 38.0 dB generally required for multilayer capacitors.

[0090] On the other hand, the angle θ may be 10° or more. Referring to Table 3, it can be confirmed that the minimum value of the acoustic noise measurement values ​​of samples No. 3 to No. 6 does not exceed 30.0 dB, and from the viewpoint of reducing acoustic noise, it can be confirmed that the angle θ is preferably 60° or more.

[0091] (Second embodiment)

[0092] Figure 6 yes Figure 4 A variation of , and Figure 6 is a cross-sectional view schematically showing a multilayer electronic component according to a second embodiment of the present disclosure. Figure 7 yes Figure 6 Magnified view of area K2 in FIG.

[0093] In the following, reference will be made to Figure 6 and Figure 7 A multilayer electronic component 2000 according to a second embodiment of the present disclosure is described. Among the components of the multilayer electronic component 2000 according to the second embodiment, the same components as the corresponding components of the first embodiment have the same reference numerals, and the description repeated with the first embodiment of the present disclosure described above is omitted.

[0094] According to the second embodiment of the present disclosure, the frame terminals 310' and 320' may be disposed outside the multilayer capacitor 100 in the second direction. Specifically, the frame terminals 310' and 320' may include a first frame terminal 310' connected to the first external electrode 131 and a second frame terminal 320' connected to the second external electrode 132.

[0095] The frame terminals 310' and 320' may include: connection portions 311' and 321', which are disposed on the external electrodes 131 and 132 and extend in the first direction; mounting portions 312' and 322', which are spaced apart from the connection portions 311' and 321' and extend in a second direction intersecting the first direction; and coupling portions 313' and 323', which connect the connection portions 311' and 321' and the mounting portions 312' and 322'. That is, the first frame terminal 310' may include: a first connection portion 311', which is disposed on the first external electrode 131 and extends in the first direction; a first mounting portion 312', which is spaced apart from the first connection portion 311' and extends in the second direction; and a first coupling portion 313', which connects the first connection portion 311' and the first mounting portion 312'. The second frame terminal 320' may include: a second connection portion 321' disposed on the second external electrode 132 and extending in the first direction; a second mounting portion 322' spaced apart from the second connection portion 321' and extending in the second direction; and a second coupling portion 323' connecting the second connection portion 321' and the second mounting portion 322'.

[0096] The connecting portions 313' and 323' may include: inward portions 313a' and 323a', extending inward from one end of the connecting portions 311' and 321' toward a plane of a central cross-section of the main body 110 perpendicular to the second direction; and outward portions 313b' and 323b', extending outward from one end of the inward portions 313a' and 323a' away from the plane of the central cross-section.

[0097] According to the second embodiment of the present disclosure, when the multilayer electronic component 1000 is observed along the third direction, the inward portions 313a' and 323a' and the outward portions 313b' and 323b' may have a curved surface that bulges inwardly in the second direction. That is, when observed along the third direction, the coupling portions 313' and 323' may have a shape that bulges inwardly in the second direction, for example, may have a semicircular arc shape. Since the inward portions 313a' and 323a' and the outward portions 313b' and 323b' have a curved surface that bulges inwardly in the second direction, the bending strength improvement effect of the present embodiment may be more significant.

[0098] Similarly, in the multilayer electronic component 2000 according to the second embodiment, the angle θ formed by the inward portions 313a' and 323a' and the outward portions 313b' and 323b' may satisfy 10°≤θ≤150°. In addition, the angle θ formed by the inward portions 313a' and 323a' and the outward portions 313b' and 323b' may satisfy 60°≤θ≤150°.

[0099] Reference Figure 7 , in the outer surface of the first frame terminal 310', there may be a first bending point X between the first connection portion 311' and the first inward portion 313a', and there may be a third bending point Z between the first outward portion 313b' and the first mounting portion 312'. In addition, in the outer surface of the first frame terminal 310', there may be a second point Y that is the largest distance in the second direction from a straight line obtained by connecting the first bending point X and the third bending point Z. For example, the angle θ may represent the smaller angle of the two angles formed by a straight line obtained by connecting the first bending point X and the second point Y and a straight line obtained by connecting the second point Y and the third bending point Z.

[0100] (Third Embodiment)

[0101] Figure 8 is a perspective view schematically showing a multilayer electronic component 3000 according to a third embodiment of the present disclosure. Fig. 9 is schematically shown along Figure 8 A cross-sectional view of a section taken along line II-II'.

[0102] In the following, reference will be made to Figure 8 and Fig. 9 A multilayer electronic component 3000 according to a third embodiment of the present disclosure is described. Among the components of the multilayer electronic component 3000 according to the third embodiment, the same components as the corresponding components of the first embodiment have the same reference numerals, and the description repeated with the first embodiment of the present disclosure described above is omitted.

[0103] According to the third embodiment of the present disclosure, the frame terminals 710 and 720 may be disposed outside the multilayer capacitor 100 in the second direction. Specifically, the frame terminals 710 and 720 may include a first frame terminal 710 connected to the first external electrode 131 and a second frame terminal 720 connected to the second external electrode 132.

[0104] In addition, the multilayer electronic component 3000 according to the third embodiment of the present disclosure may include the conductive adhesive parts 510 and 520 disposed between the external electrodes 131 and 132 and the frame terminals 710 and 720 .

[0105] The frame terminals 710 and 720 may include: connection portions 711 and 721 disposed on the external electrodes 131 and 132 and extending in a first direction; mounting portions 712 and 722 spaced apart from the connection portions 711 and 721 and extending in a second direction intersecting the first direction; and coupling portions 713 and 723 connecting the connection portions 711 and 721 with the mounting portions 712 and 722. That is, the first frame terminal 710 may include: a first connection portion 711 disposed on the first external electrode 131 and extending in the first direction; a first mounting portion 712 spaced apart from the first connection portion 711 and extending in the second direction; and a first coupling portion 713 connecting the first connection portion 711 and the first mounting portion 712. The second frame terminal 720 may include: a second connection portion 721 disposed on the second external electrode 132 and extending in the first direction; a second mounting portion 722 spaced apart from the second connection portion 721 and extending in the second direction; and a second coupling portion 723 connecting the second connection portion 721 and the second mounting portion 722 .

[0106] According to the third embodiment of the present disclosure, the coupling parts 713 and 723 may include: inner protrusions 713a and 723a, which protrude inwardly toward the plane of the central cross section of the body 110 perpendicular to the second direction; and outer protrusions 713b and 723b, which are connected to the inner protrusions 713a and 723a and protrude outwardly away from the plane of the central cross section. Specifically, the first coupling part 713 may include: a first inner protrusion 713a, which protrudes inwardly toward the plane of the central cross section; and a first outer protrusion 713b, which is connected to the first inner protrusion 713a and protrudes outwardly away from the plane of the central cross section; and the second coupling part 723 may include: a second inner protrusion 723a, which protrudes inwardly toward the plane of the central cross section; and a second outer protrusion 723b, which is connected to the second inner protrusion 723a and protrudes outwardly away from the plane of the central cross section.

[0107] According to the third embodiment of the present disclosure, the coupling parts 713 and 723 that ensure the space between the multilayer capacitor 100 and the substrate may include inner protrusions 713a and 723a and outer protrusions 713b and 723b protruding in opposite directions, thereby more effectively improving the bending strength. For example, the inner protrusions 713a and 723a may be connected to the connecting parts 711 and 721, and the outer protrusions 713b and 723b may be connected to the mounting parts 712 and 722.

[0108] In an embodiment, when the maximum distance in the second direction between the outer surface of the first outer electrode 131 and the outer surface of the second outer electrode 132 is defined as L3, and the maximum distance in the second direction between the first protruding portion 713b of the first frame terminal 710 and the second protruding portion 723b of the second frame terminal 720 is defined as L4, the maximum distances L3 and L4 may satisfy L4>L3. In addition, considering the mounting stability and mounting area of ​​the multilayer electronic component 3000, L4 / L3 may be greater than or equal to 1.1 and less than or equal to 1.5, but the present disclosure is not limited thereto.

[0109] In an embodiment, the outer surfaces of the inner protrusions 713a and 723a in the second direction may be concave surfaces, and the inner surfaces of the outer protrusions 713b and 723b in the second direction may be concave surfaces. That is, the inner protrusions 713a and 723a and the outer protrusions 713b and 723b may be bent in opposite directions to each other, thereby more effectively improving the bending strength of the multilayer electronic component 3000.

[0110] In an embodiment, when viewed in a third direction intersecting the first direction and the second direction, each of the inner protrusions 713a and 723a and the outer protrusions 713b and 723b may have a semicircular arc shape. The inner protrusions 713a and 723a and the outer protrusions 713b and 723b having a semicircular arc shape have excellent elasticity, so the effect of improving the bending strength can be more significant.

[0111] In an embodiment, the center of curvature C1 of the inner protrusions 713a and 723a and the center of curvature C2 of the outer protrusions 713b and 723b may be located outside the body 110 in the second direction. When the center of curvature C1 of the inner protrusions 713a and 723a and the center of curvature C2 of the outer protrusions 713b and 723b are located outside the body 110 in the second direction, the mounting stability of the multilayer electronic component 3000 can be ensured.

[0112] In addition, in order to ensure the distance between the multilayer capacitor 100 and the substrate when the multilayer electronic component 3000 is mounted on the substrate, when the maximum dimension of the main body 110 in the first direction is defined as T, and the minimum dimension between the main body 110 and the mounting portions 712 and 722 in the first direction is defined as T2, 0.5×T≤T2≤1.5×T can preferably be satisfied.

[0113] In addition, it is sufficient for the mounting portions 712 and 722 to extend in the second direction and / or the third direction to be parallel to the mounting surface in order to function as terminals when mounted on a substrate, but it may be preferred that the mounting portions 712 and 722 extend inwardly in the second direction from one end of the coupling portions 713 and 723. The mounting portions 712 and 722 may extend inwardly in the second direction from one end of the coupling portions 713 and 723, thereby reducing the mounting area compared to a structure in which the mounting portions 712 and 722 extend outwardly in the second direction from one end of the coupling portions 713 and 723.

[0114] (Fourth embodiment)

[0115] Fig.10 Shows Fig. 9 A variation of , and Fig.10 is a cross-sectional view schematically showing a multilayer electronic component 4000 according to a fourth embodiment of the present disclosure.

[0116] In the following, reference will be made to Fig.10 A multilayer electronic component 4000 according to a fourth embodiment of the present disclosure is described. Among the components of the multilayer electronic component 4000 according to the fourth embodiment, the components that are the same as the corresponding components of the first embodiment will be described using the same reference numerals, and descriptions that are repeated with the descriptions of the first and third embodiments of the present disclosure described above will be omitted.

[0117] According to a fourth embodiment of the present disclosure, the frame terminals 710' and 720' may include: connecting portions 711' and 721', which are disposed on the external electrodes 131 and 132 and extend in a first direction; mounting portions 712' and 722', which are spaced apart from the connecting portions 711' and 721' and extend in a second direction intersecting the first direction; and coupling portions 713' and 723', which connect the connecting portions 711' and 721' with the mounting portions 712' and 722'.

[0118] According to a fourth embodiment of the present disclosure, the connecting parts 713' and 723' may include: inner protrusions 713a' and 723a', which protrude inwardly toward the plane of the central cross-section of the main body 110 perpendicular to the second direction; and outer protrusions 713b' and 723b', which are connected to the inner protrusions 713a' and 723a' and protrude outwardly away from the plane of the central cross-section.

[0119] In the fourth embodiment of the present disclosure, the inner protrusions 713a' and 723a' may be connected to the mounting portions 712' and 722', and the outer protrusions 713b' and 723b' may be connected to the connection portions 711' and 721'. The coupling portions 713' and 723' that ensure the distance between the multilayer capacitor 100 and the substrate may include the inner protrusions 713a' and 723a' and the outer protrusions 713b' and 723b' protruding in opposite directions, thereby more effectively improving the bending strength.

[0120] The embodiments of the present disclosure are not limited thereto. For example, a multilayer electronic component may include: a body, on which an external electrode is disposed on opposite side surfaces of the body; a first frame terminal and a second frame terminal, each of the first frame terminal and the second frame terminal including: a connecting portion connected to the corresponding external electrode and extending parallel to the corresponding side surface of the body; a mounting portion, disposed away from the body and extending substantially along a longitudinal direction intersecting a plane of the corresponding side surface; and a connecting portion, disposed between the connecting portion and the mounting portion, protruding toward and / or away from the body in the longitudinal direction, wherein in the longitudinal direction, the distance between the innermost surface of the connecting portion of the first frame terminal and the innermost surface of the connecting portion of the second frame terminal is less than the distance between the corresponding side surfaces, and / or in the longitudinal direction, the distance between the outermost surface of the connecting portion of the first frame terminal and the outermost surface of the connecting portion of the second frame terminal is greater than the distance between the corresponding side surfaces. In addition, the contents described above with respect to the first to fourth embodiments may also apply here.

[0121] As described above, as one of the various effects of the present disclosure, a multilayer electronic component having excellent durability against thermal or mechanical deformation generated by a substrate can be provided.

[0122] While exemplary embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

[0123] In this specification, the expression "embodiment" used in the present disclosure does not refer to the same embodiment, but is provided to emphasize and describe different unique features. However, the embodiments presented above do not exclude the implementation in combination with the features of other embodiments. For example, even if the content described in a particular embodiment is not described in another embodiment, unless there is a contradictory or contrary description to the content in another embodiment, the content can be understood as a description related to another embodiment. The terms used in this disclosure are only used to describe an embodiment and are not intended to limit the present disclosure. In this case, unless the context clearly indicates otherwise, the singular expression includes the plural expression.

[0124] In the present disclosure, the meaning of "connection" is a concept including not only direct connection but also indirect connection through an adhesive layer or the like. In addition, the meaning of "electrical connection" is a concept including both cases of "physical connection" and "non-physical connection". In addition, expressions such as "first", "second", etc. are used to distinguish one component from another component and do not limit the order and / or importance of the components. In some cases, a first component may be named a second component, and similarly, a second component may be named a first component without departing from the scope of the claims.

Claims

1. A multilayer electronic component comprising: A main body, comprising a dielectric layer and inner electrodes arranged alternately with the dielectric layer; An external electrode, disposed outside the main body; as well as A frame terminal, comprising a connecting portion, a mounting portion and a coupling portion, wherein the connecting portion is disposed on the outer electrode and extends in a first direction, the mounting portion is spaced apart from the connecting portion and extends in a second direction intersecting the first direction, and the coupling portion connects the connecting portion and the mounting portion, The connecting portion includes an inward portion and an outward portion, wherein the inward portion extends inward from one end of the connecting portion toward a plane of a central cross section of the main body perpendicular to the second direction, and the outward portion extends outward from one end of the inward portion away from the plane of the central cross section, Here, when an angle formed by the inward portion and the outward portion is defined as θ, θ satisfies 10°≤θ≤150°.

2. The multilayer electronic component according to claim 1, wherein The angle θ satisfies 60°≤θ≤150°.

3. The multilayer electronic component according to claim 1, wherein: The external electrodes include first and second external electrodes respectively disposed on two surfaces of the body that are opposite to each other in the second direction, and The frame terminal includes a first frame terminal connected to the first external electrode and a second frame terminal connected to the second external electrode, In which, when the maximum distance between the outer surface of the first outer electrode and the outer surface of the second outer electrode in the second direction is defined as L1, and the minimum distance between the connecting part of the first frame terminal and the connecting part of the second frame terminal in the second direction is defined as L2, L1 and L2 satisfy L2≥0.1×L1.

4. The multilayer electronic component according to claim 1, wherein: The inward portion and the outward portion respectively have curved surfaces convex inwardly in the second direction.

5. The multilayer electronic component according to claim 1, wherein When a maximum dimension of the main body in the first direction is defined as T, and a minimum distance between the main body and the mounting portion in the first direction is defined as T1, T and T1 satisfy 0.2×T≤T1≤T.

6. The multilayer electronic component according to claim 1, wherein: The mounting portion extends inwardly from one end of the coupling portion along the second direction.

7. The multilayer electronic component according to claim 1, further comprising: A conductive adhesive portion is provided between the external electrode and the frame terminal.

8. A multilayer electronic component comprising: A main body, comprising a dielectric layer and inner electrodes arranged alternately with the dielectric layer; An external electrode, disposed outside the main body; as well as A frame terminal, comprising a connecting portion, a mounting portion and a coupling portion, wherein the connecting portion is disposed on the outer electrode and extends in a first direction, the mounting portion is spaced apart from the connecting portion and extends in a second direction intersecting the first direction, and the coupling portion connects the connecting portion and the mounting portion, The coupling portion includes an inner protrusion portion and an outer protrusion portion, wherein the inner protrusion portion protrudes inwardly toward a plane of a central section of the main body perpendicular to the second direction, and the outer protrusion portion is connected to the inner protrusion portion and protrudes outwardly away from the plane of the central section.

9. The multilayer electronic component according to claim 8, wherein: An outer surface of the inwardly projecting portion in the second direction is a concave surface, and An inner surface of the outwardly projecting portion in the second direction is a concave surface.

10. The multilayer electronic component according to claim 8, wherein The inner protrusion is connected to the connection portion, and The protruding portion is connected to the mounting portion.

11. The multilayer electronic component according to claim 8, wherein The inner protrusion is connected to the mounting portion, and The protruding portion is connected to the connecting portion.

12. The multilayer electronic component according to claim 8, wherein When viewed in a third direction intersecting the first direction and the second direction respectively, The inner protrusion portion and the outer protrusion portion each have a semicircular arc shape.

13. The multilayer electronic component according to claim 12, wherein: A center of curvature of the inner protrusion portion and a center of curvature of the outer protrusion portion are respectively located outside the body in the second direction.

14. The multilayer electronic component according to claim 8, wherein The external electrodes include first and second external electrodes respectively disposed on two surfaces of the body that are opposite to each other in the second direction, and The frame terminal includes a first frame terminal connected to the first external electrode and a second frame terminal connected to the second external electrode, wherein a maximum distance between an outer surface of the first outer electrode and an outer surface of the second outer electrode in the second direction is defined as L3, and a maximum distance between an outer protruding portion of the first frame terminal and an outer protruding portion of the second frame terminal in the second direction is defined as L4, L3 and L4 satisfy L4>L3.

15. The multilayer electronic component according to claim 8, wherein When a maximum dimension of the main body in the first direction is defined as T, and a minimum distance between the main body and the mounting portion in the first direction is defined as T2, T and T2 satisfy 0.5×T≤T2≤1.5×T.

16. The multilayer electronic component according to claim 8, wherein The mounting portion extends inwardly from one end of the coupling portion along the second direction.

17. The multilayer electronic assembly of claim 8, further comprising: A conductive adhesive portion is provided between the external electrode and the frame terminal.

18. A multilayer electronic component comprising: a main body, on opposite side surfaces of which external electrodes are disposed; A first frame terminal and a second frame terminal, each of the first frame terminal and the second frame terminal comprising: a connecting portion connected to the corresponding external electrode and extending parallel to the corresponding side surface of the body; A mounting portion disposed away from the main body and extending in a longitudinal direction intersecting with a plane of the corresponding side surface; and a coupling portion, disposed between the connecting portion and the mounting portion, and protruding toward and / or away from the main body in the longitudinal direction, wherein, in the longitudinal direction, a distance between an innermost surface of a connecting portion of the first frame terminal and an innermost surface of a connecting portion of the second frame terminal is smaller than a distance between the corresponding side surfaces, and / or In the longitudinal direction, a distance between an outermost surface of the coupling portion of the first frame terminal and an outermost surface of the coupling portion of the second frame terminal is greater than a distance between the corresponding side surfaces.

19. The multilayer electronic component according to claim 18, wherein: The coupling portion includes an inward portion protruding toward the main body in the longitudinal direction and an outward portion protruding away from the main body in the longitudinal direction, Here, when an angle formed by the inward portion and the outward portion is defined as θ, θ satisfies 10°≤θ≤150°.

20. The multilayer electronic assembly of claim 18, wherein: The coupling portion includes an inner protruding portion connected to the connecting portion and an outer protruding portion connected to the mounting portion, and An outer surface of the inwardly projecting portion in the longitudinal direction is a concave surface, and an inner surface of the outwardly projecting portion in the longitudinal direction is a concave surface.

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