A novel semiconductor wafer film centering calibration mechanism

Abstract

This invention relates to the field of semiconductor equipment technology, and provides a novel semiconductor wafer centering calibration mechanism and method after wafer lamination, including a wafer paper conveying and guiding device, a wafer lamination platform, and an automatic wafer lamination concentricity calibration device. It achieves fully automated pre-cutting of specialized wafer paper, automatic verification of wafer concentricity, and wafer lamination functions. Employing a roller-pressed wafer paper pre-cutting scheme, a vision system combined with a servo motor and precision lead screw, it provides a highly automated, efficient, high-yield, and cost-effective one-stop solution from raw material feeding to finished product unloading.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and more specifically to a novel semiconductor wafer film centering calibration mechanism. Background Technology

[0002] This invention relates to the field of semiconductor wafer packaging, specifically to a sub-field of advanced packaging, and to a front-end process in the wafer-level chip packaging (WLCSP) process flow. Specifically, after the wafer bumping process and the cleaning and impurity removal process, a special film is applied to the back of the wafer. Its function is to effectively prevent scratches, contamination, and oxidation, thereby protecting the back of the wafer from damage and preparing it for subsequent laser marking and slicing processes. During the film application process, calibrating the concentricity between the film and the wafer is difficult, easily leading to film application deviations and affecting wafer quality. Therefore, we propose a novel semiconductor wafer film application centering calibration mechanism. Summary of the Invention

[0003] (a) Technical problems to be solved

[0004] To address the shortcomings of existing technologies, this invention provides a novel semiconductor wafer film bonding centering calibration mechanism that overcomes the deficiencies of existing technologies, has a reasonable design and compact structure, and solves the problems mentioned in the background art.

[0005] (II) Technical Solution

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A novel semiconductor wafer film bonding centering calibration mechanism includes a film paper conveying and guiding device, a film bonding platform, and an automatic film bonding concentricity calibration device. The film paper conveying and guiding device, installed on one side of the film bonding platform, processes the film and then transfers it to the automatic film bonding concentricity calibration device for centering. The feature is that the film paper conveying and guiding device pre-cuts its special film paper and then cooperates with the automatic film bonding concentricity calibration device on the film bonding platform.

[0008] The automatic concentricity calibration device for film application includes a visual inspection device for monitoring the state of pre-cut special film paper, and a concentricity calibration device for fine-tuning the wafer. The visual inspection device compares the cutting marks collected with the preset wafer position, and the concentricity calibration device automatically fine-tunes the wafer position.

[0009] The visual inspection device includes a camera module mounting base and an industrial camera for collecting cutting marks on pre-cut special film paper. The camera module mounting base is connected to a connecting part that slides along the X and Y directions via a bidirectional slide table. The industrial camera mounted on the connecting part is fitted with a slide rail and groove and is controlled by bolts to slide and position along the Z direction.

[0010] The concentricity calibration device includes a wafer positioning device and a wafer driving device;

[0011] The wafer positioning device includes a Z-direction substrate and a Z-direction lower substrate connected to its two ends by cylindrical guide rails. A wafer holding plate connected to the Z-direction substrate is used to fix the wafer by several vacuum chucks.

[0012] The wafer driving device includes an X-axis motor, an X-axis linear guide, and an X-axis ball screw. The output end of the X-axis motor is connected to the X-axis ball screw and drives the substrate in the X and Y directions to slide along the X-axis linear guide.

[0013] A Y-direction motor mounted on the X and Y direction substrate drives a Y-direction ball screw. The Y-direction ball screw is connected to a Y-direction cylindrical guide rail on the Z-direction lower substrate, so that the Z-direction lower substrate slides along the direction of the Y-direction cylindrical guide rail.

[0014] The Z-axis motor, mounted on the bottom of the substrate in the Z-direction direction, is used to control the lifting and lowering of the wafer positioning device via a synchronous wheel mechanism and a Z-axis ball screw.

[0015] (III) Beneficial Effects

[0016] This invention provides a novel semiconductor wafer film bonding centering calibration mechanism. It offers the following advantages:

[0017] This invention provides a novel fully automated wafer lamination device that can automatically pre-cut special film paper, automatically check the concentricity of film paper and wafer, and lamination. It adopts a roller-pressed film paper pre-cutting scheme, a vision system combined with a servo motor and a precision lead screw, and provides a one-stop solution with high automation, high efficiency, high yield and high cost performance from raw material feeding to finished product unloading. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the present invention;

[0019] Figure 2 This is a schematic diagram of the film paper supply and pre-cutting device of the present invention;

[0020] Figure 3 This is a schematic diagram of the film paper supply device of the present invention;

[0021] Figure 4 This is a schematic diagram of the film paper pre-cutting device of the present invention;

[0022] Figure 5 This is a schematic diagram illustrating the function of the special pre-cutting blade of this invention;

[0023] Figure 6 This is a schematic diagram of the membrane paper structure of the present invention;

[0024] Figure 7 This is a schematic diagram of the membrane paper pre-guiding device of the present invention;

[0025] Figure 8 This is a schematic diagram of the film paper conveying and guiding device of the present invention;

[0026] Figure 9 This is a schematic diagram of the film paper conveying device of the present invention;

[0027] Figure 10 This is a schematic diagram of the film paper guiding device of the present invention;

[0028] Figure 11 This is a schematic diagram of the film application platform of the present invention;

[0029] Figure 12 This is a schematic diagram of the membrane paper recycling device of the present invention;

[0030] Figure 13 This is a schematic diagram of the membrane paper recycling mechanism of the present invention;

[0031] Figure 14 This is a schematic diagram of the bottom film conveying device of the present invention;

[0032] Figure 15 This is a schematic diagram of the bottom film guiding device of the present invention;

[0033] Figure 16 This is a schematic diagram of the automatic film concentricity calibration device of the present invention;

[0034] Figure 17 This is a schematic diagram of the visual inspection device of the present invention;

[0035] Figure 18 This is a schematic diagram of the concentricity calibration device of the present invention;

[0036] Figure 19 This is a schematic diagram of the visual system supplementary lighting device of the present invention. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] See attached document Figure 1-19 A novel semiconductor wafer lamination centering calibration mechanism includes a film paper supply and pre-cutting device 1. The film paper supply device 101 is used for loading and supplying raw material film paper. The film paper fixing shaft 10101 is used to load the raw material film paper. A vacuum generator 10102 is used to adsorb and fix the raw material film paper reel inserted into the film paper fixing shaft 10101. A film paper reel mounting reference 10103 serves as the mounting reference for the raw material film paper. A film paper supply motor 10104 provides the driving force for the film paper supply device. An active synchronous pulley 10105 is a synchronous pulley coaxially and fixedly connected to the output shaft of the film paper supply motor 10104. A driven synchronous pulley 10107 is a synchronous pulley coaxially and fixedly connected to the film paper fixing shaft 10101. A synchronous belt 10106 connects the active synchronous pulley to the driven synchronous pulley. Synchronous pulley 10105 and driven synchronous pulley 10107 transmit the output of the film paper supply motor 10104 to the film paper fixing shaft 10101, causing it to rotate according to a set setting. The special film paper 102 is specifically designed for this device and consists of three layers. The outer first and third layers are used to protect the base film of the middle layer, which is the film paper ultimately applied to the back of the wafer. Specifically, the adhesion between the first and middle layers is relatively weak, while the adhesion between the middle and third layers is relatively strong. The film paper pre-cutting device 103 pre-cuts the three layers of film paper. The pre-cutting roller 10301 pre-cuts the film paper; its surface has a special blade layer with a specific pattern, the microstructure of which is shown in the attached figure. Figure 5As shown, the function of the pre-cutting roller 10302 is to cooperate with the pre-cutting cutter 10301 to squeeze and fix the special film paper 102 passing between them, so that the film paper is cut during the rolling process of the pre-cutting cutter 10301. Specifically, the third bottom film and the second film paper of the three-layer film paper are cut through by the blade, while the first bottom film is retained. The function of the left and right adjustment mechanisms 10303 is to adjust the overall pressure between the pre-cutting roller 10302 and the pre-cutting cutter 10301 and the pressure difference between the left and right ends, specifically to ensure that the force is uniform on the entire contact surface of the special film paper 102. The function of the drive motor 10304 is to drive the pre-cutting cutter 10301 to perform rolling cutting according to the control command. The function of the coupling 10305 is to coaxially connect the drive motor 10304 and the pre-cutting cutter 10301, and to transmit power from the output end to the working end as a connecting part. The membrane paper pre-guiding device 104 is used to limit and guide the conveying path and trajectory of the membrane paper. The guide roller 10401 is used to contact the special membrane paper 102 and guide its conveying path. Its surface is provided with an anti-stick coating. Membrane paper limiting blocks 10402 are provided at both ends to prevent the position of the membrane paper from changing during the conveying process and improve the stability of the membrane paper in the entire conveying process. Specifically, the membrane paper limiting block 10402 is an adjustable mechanism that can adjust the specific position according to the size of the membrane paper to meet the requirements of wafer specifications such as 8 inches and 12 inches. The ball bearing 10403 is used to reduce rolling friction. Specifically, two sets of ball bearings 10403 are installed at both ends of the guide roller 10401 to minimize the friction when it rotates, which is beneficial to the stability of the special membrane paper 102 conveying process. The mounting base 105 is used as the mounting base for the above-mentioned functional units.

[0039] The membrane paper conveying and guiding device 2 includes a membrane paper conveying device 201, which conveys the pre-cut membrane paper from the previous process to the next process stage. The membrane paper conveying roller 20101 utilizes the high friction between its surface-coated shaft and the membrane paper to convey the membrane paper to the next process stage through rotation. The membrane paper conveying driven shaft 20102 cooperates with the membrane paper conveying roller 20101 to press the membrane paper between the two rollers, using friction to convey the membrane paper to the next process stage. The membrane paper conveying cylinder 20103 presses the driven shaft 20102 downwards, creating pressure between the two rollers. The three cylinder guide shafts 20107 linearly guide the up-and-down movement of the driven shaft 20102. The bearing 20104 serves to minimize friction during the rolling process of the film paper conveying roller 20101, thereby improving the stability of film paper conveying and reducing the load on the drive mechanism. The drive motor 20105 provides the driving power for the rotation of the film paper conveying roller 20101. The coupling 20106 is a transmission device that is coaxially and fixedly connected to the output shaft of the film paper conveying roller 20101 and the drive motor 20105, transmitting the output of the drive motor 20105 to the film paper conveying roller 20101. The film paper guiding device 202 guides the conveying direction of the film paper. The guide roller 20201 is a rolling shaft with an anti-stick treatment, which guides the conveying direction of the film paper. The guide bearing 20202 minimizes the resistance during the rolling process of the guide roller 20201, thereby improving the stability of film paper conveying and reducing the load on the drive mechanism.

[0040] The film application platform 301 serves as the substrate for wafer film application. Specifically, the upper surface of the film application platform 301 has an anti-stick coating. After the film paper is transported to the film application platform 301, the wafer is transported from bottom to top to the height of the film application platform 301 by a dedicated mechanism. Then, a dedicated device applies the film paper. The main substrate 303 is the mounting substrate for the various functional units of the device. The four connecting brackets 302 connect the film application platform 301 and the main substrate 303, ensuring they are parallel to each other. The two film application platform positioning sensors 304 detect the assembly position of the film application platform 301. Specifically, the film application platform 301 uses a quick-installation method to accommodate different wafer sizes; therefore, the installation position needs to be checked each time the film application platform 301 is replaced. The film paper sensor 305 detects the position of the film paper to be applied. Specifically, the film paper should be at the same height as the film application platform 301 and parallel to each other in the application state to ensure the stability of the film application process.

[0041] The membrane paper recycling device 4 includes a membrane paper recycling mechanism 401, which recycles the remaining waste membrane paper after the film has been applied. The membrane paper recycling shaft 40101 is a rotating shaft for mounting and fixing the waste base film. The waste membrane paper fixing clamp 40102 fixes the finished membrane paper by securing the film head through the clamp 40102, allowing the waste membrane paper to be rolled up and recycled onto the recycling shaft 40101 as it rotates. The drive motor 40103 provides power for the rotation of the recycling shaft 40101. The output synchronous pulley 40104 is coaxially and fixedly connected to the output shaft of the drive motor 40103. The driven synchronous pulley 40104... 106 and the membrane paper recycling mechanism 401 are coaxially and fixedly connected. The output synchronous belt 40105 is used to transmit the output of the drive motor 40103 to the membrane paper recycling shaft 40101 to realize the recycling of waste membrane paper. The rotary damper 40109 is used to prevent the membrane paper recycling shaft 40101 from rotating in the opposite direction when there is no driving force, thus preventing the recycled waste membrane paper from falling off. The damper synchronous wheel 40108 is coaxially and fixedly connected to the rotary damper 40109. The damper synchronous belt 40107 is used to connect the damper synchronous wheel 40108 and the driven synchronous wheel 40106, specifically to suppress the free rotation of the membrane paper recycling shaft 40101 when there is no driving force. The bottom film conveying device 402 is used to pull back the waste film paper that has already been coated. The film pulling roller 40201 uses the high friction between the adhesive-coated shaft on its surface and the film paper to transport the film paper to the next process step by rotating. The film paper conveying driven shaft 40202 works in conjunction with the film pulling roller 40201 to squeeze the film paper between the film pulling roller 40201 and the film paper conveying driven shaft 40202, using friction to transport the film paper to the next process step. The film paper conveying cylinder 40204 is used to press the film paper conveying driven shaft 40202 downward, creating pressure between the film pulling roller 40201 and the film paper conveying driven shaft 40202. The bearing 40203 is designed to minimize friction during the rolling process of the film-pulling roller shaft 40201, thereby improving the stability of film conveying and reducing the load on the drive mechanism. The drive motor 40205 serves as the driving force for the rotation of the film-pulling roller shaft 40201. The output synchronous pulley 40206 is a transmission device that is coaxially and fixedly connected to the output shaft of the drive motor 40205. The driven synchronous pulley 40208 is coaxially and fixedly connected to the film-pulling roller shaft 40201. The synchronous belt 40207 connects the output synchronous pulley 40206 and the driven synchronous pulley 40208, ultimately transmitting the output of the drive motor 40205 to the film-pulling roller shaft 40201 to supply film.The two bottom film guiding devices 403 restrict and guide the conveying direction of the waste film paper. The waste film paper guide shaft 40301 guides the conveying direction of the film paper. Ball bearings 40302 are installed at both ends of the waste film paper guide shaft 40301 to reduce the rolling resistance of the waste film paper guide shaft 40301, specifically improving the stability of film paper guidance and the film pulling load of the drive mechanism. The waste film paper 405 is the remaining film paper after film application, which needs to be discarded. The recycling substrate 404 is the mounting base for the above-mentioned functional devices.

[0042] The automatic film concentricity calibration device 5 includes a visual inspection device 501 that transmits the pre-cut image signal of the film paper to be inspected to the image processing system. By analyzing pixel distribution, brightness, color, and other information, the image signal is converted into a digital signal. The image processing system processes these signals to extract target features and controls the actions of related devices based on the judgment results. The camera module mounting base 50101 connects the equipment frame and the camera module, serving as the mounting reference for the camera module. The bidirectional slide 50102 acts as a fine-tuning platform for the camera module, allowing for fine-tuning in the left-right X direction and the front-back Y direction. The camera bracket 50103 securely mounts the camera module. The wafer is positioned by bolts using a sliding rail and groove mechanism in the Z-direction, providing some adjustment space for easy equipment debugging. The industrial camera 50104 collects the cutting marks on the pre-cut film paper. Specifically, it compares the collected cutting marks with the system's preset cutting trajectory and controls a dedicated device to automatically fine-tune the wafer position based on the comparison result. The camera lens 50105 images the target object onto the photosensitive surface of the image sensor, thus achieving image acquisition. The concentricity calibration device 502 fine-tunes the wafer position based on the result determined by the vision inspection device 501. The wafer 50201 is the wafer to be laminated, available in 8-inch and 12-inch sizes. The wafer fixing tray 50202... Its function is to place and fix the wafer. Specifically, the wafer fixing disk 50202 has several vacuum chucks distributed on it. When the wafer is placed on the wafer fixing disk 50202, the vacuum generator is turned on to create negative pressure on the chucks, thus fixing the wafer. The substrate 50203 in the Z direction is the mounting base for the wafer fixing disk 50202 and other functional devices. Specifically, the cylindrical guide rail 50204 connects and positions the substrate 50206 in the lower Z direction and the substrate 50203 in the upper Z direction, and also serves as a guide for the up and down movement of the wafer fixing disk 50202 in the Z direction. The Z-direction ball screw 50205 transmits the drive generated by the power device mounted on the lower Z-direction substrate 50206 to the substrate 50203 in the upper Z direction. On the wafer holder 50202, the X and Y direction substrates 50208 are mounting substrates for the power device that controls the movement of the wafer holder 50202 in the X and Y horizontal directions. The Y-direction linear guide 50213 is a guide device connecting the X and Y direction substrates 50208 and the Z-direction lower substrate 50206, guiding the movement of the Z-direction lower substrate 50206 in the Y direction. The X-direction linear guide 50209 guides the movement of the X and Y direction substrates 50208 in the X direction. The Y-direction motor 50222 drives the movement of the wafer holder 50202 in the Y direction. The Y-direction motor synchronous pulley 50218 is a synchronous pulley coaxially and fixedly connected to the Y-direction motor 50222.The Y-axis ball screw 50221 is a device that transmits the drive force generated by the power unit to the wafer holder 50202. The Y-axis driven pulley 50219 is a synchronous pulley coaxially and fixedly connected to the Y-axis ball screw 50221. The Y-axis synchronous belt 50220 is a synchronous belt connecting the Y-axis motor synchronous pulley 50218 and the Y-axis driven pulley 50219. Its function is to transmit the driving force generated by the Y-axis motor 50222 to the wafer holder 50202 through the synchronous pulley mechanism and the Y-axis ball screw 50221. The Z-axis motor 50217 drives the wafer holder... The wafer holder 50202 is powered by a Z-axis synchronous pulley 50215, which is coaxially and fixedly connected to the Z-axis motor 50217. The Z-axis driven pulley 50214 is coaxially and fixedly connected to the Z-axis ball screw 50205. The Z-axis synchronous belt 50216 connects the Z-axis motor synchronous pulley 50215 and the Z-axis driven pulley 50214. Its function is to transmit the driving force generated by the Z-axis motor 50217 to the wafer holder 50202 through the synchronous pulley mechanism and the Z-axis ball screw 50205. The X-axis motor... The motor 50212 is a power unit that drives the wafer holder 50202 to move left and right in the X direction. The X-axis coupling 50211 is a coupling that is coaxially and fixedly connected to the output shaft of the X-axis motor 50212. The X-axis ball screw 50210 is a device that ultimately transmits the drive generated by the X-axis motor 50212 to the wafer holder 50202. The supplementary lighting device 503 of the vision system provides illumination for the vision inspection device 501. The light-emitting panel 50301 is used when the vision inspection device 501 performs visual inspection on the pre-cut film paper. The light-emitting panel provides supplementary lighting. The light-emitting panel bracket 50302 securely supports the light-emitting panel 50301. The panel X-direction positioning buckle 50303 positions the light-emitting panel 50301 during supplementary lighting. The light-emitting panel cylinder 50306 drives the light-emitting panel 50301 to move left and right in the X-direction. The light-emitting panel guide rail 50304, consisting of two parallel guide rails, is a limiting device that guides the left and right movement of the light-emitting panel 50301. The guide rail bracket 50305 supports and fixes the light-emitting panel guide rail 50304.

[0043] The workflow is as follows:

[0044] The membrane paper raw material reel is loaded onto the membrane paper fixing shaft 10101, with the inner side of the membrane paper raw material reel pressed against the membrane paper reel mounting reference 10103. The vacuum generator 10102 is turned on to generate negative pressure in the air nozzle, which adsorbs and fixes the membrane paper raw material reel. The controller sends a signal, and the output shaft of the membrane paper supply motor 10104 starts to rotate according to the set parameters such as direction and speed, driving the active synchronous pulley 10105 connected to it on the same axis, thereby driving the synchronous belt 10106 and the driven synchronous pulley 10107 that cooperate with it, thus transmitting the output of the membrane paper supply motor 10104 to the membrane paper fixing shaft 10101. The fixed membrane paper raw material reel is carried and starts to rotate according to the set parameters to start supplying membrane paper.

[0045] The raw material film paper supplied by the film paper supply device 101 is conveyed to the film paper pre-cutting device 103. The film paper passes between the pre-cutting roller 10301 and the pre-cutting roller shaft 10302. The bolts on both sides are adjusted to control the height of the mounting base of the pre-cutting roller shaft 10302, so that the pressure between the pre-cutting roller 10301 and the pre-cutting roller shaft 10302 reaches a suitable level. The drive motor 10304 starts to rotate in the set direction and speed according to the controller command, which drives the coupling 10305 that is fixedly connected to it on the same axis. Then, the pre-cutting roller 10301 and the pre-cutting roller shaft 10302 are driven actively according to the set parameters to press the film paper between them to the next process and complete the pre-cutting. The pre-cut pattern conforms to the size of 8-inch and 12-inch wafers.

[0046] The pre-cut film paper is conveyed to the film paper pre-guide device 104, and guided by it, the film paper is conveyed to the film paper conveying device 201. The film paper passes between the film paper conveying roller 20101 and the film paper conveying driven shaft 20102, and is pushed out by the piston rod of the film paper conveying cylinder 20103 connected to the film paper conveying driven shaft 20102, so that the film paper conveying driven shaft 20102 presses tightly against the film paper conveying roller 20101. The high-friction silicone rubber on the surfaces of the film paper conveying roller 20101 and the film paper conveying driven shaft 20102 is used to fix the film paper. The drive motor 20105 rotates according to the set direction, speed and other layers under the command of the controller, thereby driving the coupling 20106 and the film paper conveying roller 20101 that are fixedly connected to it on the same axis, and conveying the film paper to the next process step.

[0047] The film paper, conveyed by the film paper conveying device 201 and guided by the film paper guiding device 202, is transported to the film application platform 301. The vision inspection device 501 performs visual inspection on the pre-cut film paper. Specifically, before the vision inspection device 501 determines the pre-cut marks on the film paper, the vision system supplementary lighting device 503 moves from left to right. This is achieved by the drive of the light-emitting panel cylinder 50306, the guidance of the light-emitting panel guide rail 50304, and the positioning of the panel X-direction positioning buckle 50303, which stops the panel X-direction positioning buckle 503. 03 remains directly below the vision inspection device 501. The light-emitting panel 50301 is powered on and emits light. The light passes through the pre-cut film paper from below, increasing the contrast of the knife marks on the film paper, making it easier for the vision inspection device 501 to capture features during inspection. In this process, a wafer position is preset in the system. Then, the pre-cut knife marks on the film paper are compared with the preset wafer position by shooting with the combination of industrial camera 50104 and camera lens 50105. The difference is finely adjusted by concentricity calibration device 502. Specifically, in the X direction, the controller compares the difference between the captured image and the preset position. The controller drives the X-axis motor 50212 according to set parameters and rotates in a specified direction and speed based on the difference compared to the preset position. This drives the X-axis coupling 50211 and the X-axis ball screw 50210, which are coaxially fixed to each other, to rotate. The X-axis ball screw 50210 converts the output of the X-axis motor 50212 into linear motion, which is guided by the X-axis linear guide rail 50209. This causes the X and Y-axis substrates 50208 to move linearly in the X direction, thereby driving the Z-axis lower substrate 50206, which is fixedly connected to it in the X direction, to move in the X direction. This, in turn, drives the Z-axis upper substrate 50203, connected via the cylindrical guide rail 50204, to move. Finally, the controller controls the wafer mounting disk 50202, which is together with the Z-axis upper substrate 50203, to move linearly in the X direction according to the judgment result. In the Y direction, the controller compares the captured image with the preset position... Based on the difference in the preset position, the controller drives the Y-direction motor 50222 to rotate according to the set parameters and the specified direction and speed according to the comparison difference. This drives the Y-direction motor synchronous pulley 50218, which is fixedly connected to it on the same axis. This drives the Y-direction synchronous belt 50220 and the Y-direction driven pulley 50219, which in turn drive the Y-direction ball screw 50221, which is coaxially connected to the Y-direction driven pulley 50219, to rotate. The Y-direction ball screw 50221 converts the output of the Y-direction motor 50222 into linear motion. This motion is guided by the Y-direction linear guide rail 50213 and the Y-direction cylindrical guide rail 50207, causing the Z-direction lower substrate 50206 to move linearly in the Y-direction. This, in turn, drives the Z-direction upper substrate 50203, which is connected to the cylindrical guide rail 50204, to move. Finally, the controller controls the wafer fixing disk 50202, which is together with the Z-direction upper substrate 50203, to move linearly in the Y-direction according to the judgment result.After fine-tuning in the X and Y directions, the concentricity of the wafer and pre-cut film is adjusted. The visual system supplementary lighting device 503 moves from right to left, specifically driven by the light-emitting panel cylinder 50306 and guided by the light-emitting panel guide rail 50304. In the X direction, the positioning buckle 50303 moves from the right positioning position to the initial position on the left and returns to the left standby position. In the Z direction, after fine-tuning in the X and Y directions, the centerness of the wafer and pre-cut film is calibrated. According to the controller command, the Z-axis motor 50217 drives the Z-axis motor synchronous wheel 50215, which is coaxially fixed to it, to rotate. This drives the Z-axis synchronous belt 50216 and the Z-axis driven wheel 50214, which in turn rotate synchronously. This drives the Z-axis ball screw 5, which is coaxially fixed to the Z-axis driven wheel 50214. Rotating 0205, the Z-direction lower substrate 50206 connects to the Z-direction ball screw 50205, thus converting the output of the Z-direction motor 50217 into linear motion in the Z-direction. Guided by the cylindrical guide rail 50204, this causes the Z-direction lower substrate 50206 to move linearly upward in the Z-direction, driving the Z-direction upper substrate 50203 connected to the cylindrical guide rail 50204 to move linearly upward in the Z-direction. Finally, this drives the wafer mounting disk 50202 fixed on the Z-direction upper substrate 50203 to move the wafer upward to the film-applying platform 301, where the wafer is bonded to the film paper adhesive layer, completing the wafer film-applying process. The film-applying wafer is then moved downward in the Z-direction by the concentricity calibration device 502 to a set position, and finally, the wafer robot completes the unloading process of the film-applying wafer.

[0048] The remaining film paper after the film application is completed is transported to the film paper recycling mechanism for automatic recycling of waste film paper. The bottom film conveying device 402 pulls the waste film paper back from the film application platform 301. The waste film paper is clamped between the film pulling roller shaft 40201 and the film paper conveying driven shaft 40202. The piston rod of the film paper conveying cylinder 40204 pushes out, pressing the film paper conveying driven shaft 40202 connected to it with the film pulling roller shaft 40201. At the same time, the friction of the silicone rubber on the surfaces of the two shafts is used to fix the film paper. The drive motor 40205 rotates according to the controller command and set parameters, driving the output synchronous wheel 40206 fixedly connected to it to rotate, driving the driven synchronous wheel 40208 and the synchronous belt 40207 that cooperate with the output synchronous wheel 40206 to drive the drive motor 40205. The output of 05 is transmitted to the film pulling roller shaft 40201, which is coaxially and fixedly connected to the driven synchronous wheel 40208, thereby driving the waste film paper to be conveyed to the next process. After being limited and guided by the two bottom film guiding devices 403, the waste film paper is conveyed to the film paper recycling mechanism 401. The film head of the waste film paper is clamped by the waste film paper fixing clamp 40102 and fixed on the film paper recycling shaft 40101. The drive motor 40103 rotates according to the setting, driving the output synchronous wheel 40104, which is coaxially and fixedly connected to it, to rotate synchronously. This drives the driven synchronous wheel 40106 and the output synchronous belt 40105, which cooperate with the output synchronous wheel 40104, to transmit the output of the drive motor 40103 to the film paper recycling shaft 40101, so that it rotates according to the setting, and winds up the waste film paper and automatically recycles it.

[0049] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0050] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A novel semiconductor wafer film bonding centering calibration mechanism, comprising a film paper conveying and guiding device, a film bonding platform assembly, and an automatic film bonding concentricity calibration device, wherein the film paper conveying and guiding device, installed on one side of the film bonding platform assembly, processes the film and then transfers it to the automatic film bonding concentricity calibration device for centering, characterized in that: The film paper conveying and guiding device pre-cuts the special film paper on it and then cooperates with the automatic film concentricity calibration device on the film application platform assembly. The automatic concentricity calibration device for film application includes a visual inspection device for monitoring the state of pre-cut special film paper and a concentricity calibration device for fine-tuning the wafer. The visual inspection device compares the cutting marks collected with the preset wafer position, and the concentricity calibration device automatically fine-tunes the wafer position. The visual inspection device includes a camera module mounting base and an industrial camera for collecting cutting marks on pre-cut special film paper. The camera module mounting base is connected to a connecting part that slides along the X and Y directions via a bidirectional slide table. The industrial camera mounted on the connecting part is fitted with a slide rail and groove and is controlled by bolts to slide and position along the Z direction. The concentricity calibration device includes a wafer positioning device and a wafer driving device; The wafer positioning device includes a Z-direction substrate and a Z-direction lower substrate connected to its two ends by cylindrical guide rails. A wafer holding plate connected to the Z-direction substrate is used to fix the wafer by several vacuum chucks. The wafer driving device includes an X-axis motor, an X-axis linear guide, and an X-axis ball screw. The output end of the X-axis motor is connected to the X-axis ball screw and drives the substrate in the X and Y directions to slide along the X-axis linear guide. A Y-direction motor mounted on the X and Y direction substrate drives a Y-direction ball screw. The Y-direction ball screw is connected to a Y-direction cylindrical guide rail on the Z-direction lower substrate, so that the Z-direction lower substrate slides along the direction of the Y-direction cylindrical guide rail. The Z-axis motor, mounted on the bottom of the substrate in the Z-direction direction, is used to control the lifting and lowering of the wafer positioning device via a synchronous wheel mechanism and a Z-axis ball screw.

2. The novel semiconductor wafer film bonding centering calibration mechanism as described in claim 1, characterized in that: The automatic calibration device for film concentricity also includes a visual system supplementary lighting device for providing illumination supplementary lighting to the visual inspection device; The visual system supplementary lighting device includes a light-emitting panel for visual inspection of pre-cut special film paper, a light-emitting panel cylinder and a light-emitting panel guide rail installed on the film application platform assembly, and the output end of the light-emitting panel cylinder is connected to the light-emitting panel so that it slides along the light-emitting panel guide rail. The film application platform assembly is also connected to a light-emitting panel bracket for supporting the light-emitting panel, and the light-emitting panel bracket is also connected to a panel X-direction positioning buckle for fixing and supporting the light-emitting panel.

3. The novel semiconductor wafer film bonding centering calibration mechanism as described in claim 1, characterized in that: It also includes a film paper supply and pre-cutting device, including a mounting substrate, and a film paper supply device and a film paper pre-guiding device mounted on the mounting substrate; The membrane paper supply device includes a membrane paper fixing shaft and a vacuum generator. A membrane paper supply motor is concentrically arranged on the membrane paper fixing shaft to provide driving force. The vacuum generator is set inside the membrane paper fixing shaft to adsorb and fix the raw material membrane paper roll inserted through the membrane paper fixing shaft. A membrane paper roll installation reference is also installed at the end of the membrane paper fixing shaft to provide a reference for the installation of the raw material membrane paper. The pre-guiding device for the membrane paper includes a guide roller shaft with an anti-stick coating on its surface, and membrane paper limiting blocks at both ends of the guide roller shaft to restrict the special membrane paper. The guide roller shaft uses bearings to reduce friction and improve the stability of the special membrane paper conveying process.

4. The novel semiconductor wafer film bonding centering calibration mechanism as described in claim 1, characterized in that: The mounting substrate is also connected to a film paper pre-cutting device. The special film paper is divided into three layers. The adhesion between the first layer and the middle layer is relatively small, while the adhesion between the middle layer and the third layer is relatively large. The film paper pre-cutting device includes a pre-cutting roller shaft driven by a drive motor and a pre-cutting cutter for cutting special film paper disposed on the surface of the pre-cutting roller shaft; The pre-cutting roller blade is located on the roller surface and is also provided with flanges that extend horizontally to both sides. The flanges smoothly transition with the roller surface, so that the special film paper is rolled by the pre-cutting roller to form the third bottom film and the second film paper is cut through by the blade, while the first bottom film is retained. An adjustment mechanism is provided on the side of the pre-cutting roller to control the uniform force on the entire contact surface of the special film paper.

5. The novel semiconductor wafer film bonding centering calibration mechanism as described in claim 1, characterized in that: The membrane paper conveying and guiding device includes a membrane paper conveying device that conveys the pre-cut membrane paper to the next process. The film paper conveying device includes a film paper conveying roller with high friction and a film paper conveying cylinder, which drives the corresponding film paper conveying driven shaft.

6. The novel semiconductor wafer film bonding centering calibration mechanism as described in claim 5, characterized in that: The film paper conveying device includes a drive motor, which drives the film paper conveying roller shaft to rotate and corresponds to the film paper conveying driven shaft; The film paper conveying roller shaft uses nested bearings to reduce friction; The guide roller shaft is an anti-stick rolling shaft and a nested guide bearing, which is used to improve the stability of film paper conveying and reduce the load on the drive mechanism.

7. The novel semiconductor wafer film bonding centering calibration mechanism as described in claim 1, characterized in that: The film application platform assembly includes a film application platform and a main substrate. The film application platform and the main substrate are connected by a connecting bracket. The film application platform is also connected to a film application platform positioning sensor and a film paper sensor for detecting the position of the film paper to be applied.

8. The novel semiconductor wafer film bonding centering calibration mechanism as described in claim 1, characterized in that: It also includes a membrane paper recycling device, comprising a recycling substrate and a membrane paper recycling mechanism mounted on the recycling substrate; The membrane paper recycling mechanism includes a drive motor and a membrane paper recycling shaft installed at the output end of the drive motor. The membrane paper fixing clamp connected to the membrane paper recycling shaft fixes the membrane head of the waste membrane paper. The drive motor drives the membrane paper recycling shaft to recycle the remaining waste membrane paper after the membrane has been applied. It also includes a rotary damper, which is synchronously driven with the membrane paper recovery shaft via a damper timing belt to suppress the free rotation of the membrane paper recovery shaft in the absence of driving force.

9. A novel semiconductor wafer film bonding centering calibration mechanism as described in claim 8, characterized in that: The film paper recycling device also includes a bottom film conveying device for pulling back the waste film paper that has already been applied; The bottom film conveying device includes a film pulling roller shaft, a film paper conveying driven shaft, a film paper conveying cylinder, and a drive motor. The drive motor drives the film pulling roller shaft to rotate, and the film paper conveying cylinder drives the film paper conveying driven shaft to abut against the film pulling roller shaft.

10. The calibration method for a novel semiconductor wafer film bonding centering calibration mechanism as described in claim 1, comprising the following steps: S1. Load the membrane paper raw material roll onto the membrane paper fixing shaft. The inner side of the membrane paper raw material roll is close to the membrane paper roll installation reference. Turn on the vacuum generator to generate negative pressure through the air nozzle, which adsorbs and fixes the membrane paper raw material roll. S2. The controller sends a signal, and the output shaft of the film paper supply motor starts to rotate according to the set direction, speed and other parameters, which drives the active synchronous pulley connected to it on the same axis, thereby driving the synchronous belt and driven synchronous pulley that cooperate with it, thus transmitting the output of the film paper supply motor to the film paper fixed shaft. The fixed film paper raw material reel is carried and starts to rotate according to the set to start supplying film paper. S3. The raw film paper supplied by the film paper supply device is conveyed to the film paper pre-cutting device. The film paper passes between the pre-cutting roller and the pre-cutting roller shaft. The bolts on both sides are adjusted to control the height of the mounting seat of the pre-cutting roller shaft and to bring the pressure between the pre-cutting roller and the pre-cutting roller shaft to a suitable level. S4. The drive motor starts to rotate in the set direction and speed according to the controller's instructions, which drives the coupling that is fixedly connected to it on the same axis. Then, it drives the pre-cutting roller and the pre-cutting roller shaft to actively press the film paper roller between them to the subsequent process to complete the pre-cutting. S5. The pre-cut film paper is conveyed to the film paper pre-guide device. Guided by the device, the film paper is conveyed to the film paper conveying device, thereby fixing the film paper. The drive motor rotates according to the set direction, speed and other layers under the command of the controller, thereby driving the coupling and film paper conveying roller shaft that are fixedly connected to it on the same axis, and conveying the film paper to the next process step. S6. The film paper, conveyed by the film paper conveying device and guided by the film paper guiding device, is conveyed to the film application platform. The vision system supplementary lighting device moves from left to right and stays directly below the vision inspection device. The vision inspection device performs visual inspection on the pre-cut film paper. Light passes through the pre-cut film paper from below, increasing the contrast of the knife marks on the film paper, making it easier for the vision inspection device to capture features during inspection. The pre-cut knife marks on the film paper are compared with the preset wafer position. S7. The difference is finely adjusted by the concentricity calibration device. Specifically, in the X direction, the X-direction ball screw converts the output of the X-direction motor into linear motion, which is guided by the X-direction linear guide rail to make the X and Y direction substrates move linearly in the X direction. The Z direction substrate is connected by the cylindrical guide rail and finally the wafer fixing disk together with the Z direction substrate is controlled to move linearly in the X direction according to the judgment result. In the Y direction, the difference between the captured image and the preset position is compared. The controller drives the Y-direction motor according to the set parameters and rotates in the specified direction and speed according to the difference in comparison. This drives the Y-direction motor synchronous pulley fixedly connected to it on the same axis, which in turn drives the Y-direction synchronous belt and the Y-direction driven pulley. This drives the Y-direction ball screw, which is coaxially connected to the Y-direction driven pulley, to rotate. The Y-direction ball screw converts the output of the Y-direction motor into linear motion. Guided by the Y-direction linear guide and the Y-direction cylindrical guide, the substrate in the lower Z direction moves linearly in the Y direction. This drives the substrate in the upper Z direction, which is connected to the cylindrical guide, to move. Finally, the controller controls the wafer holder disk, which is together with the substrate in the upper Z direction, to move linearly in the Y direction according to the judgment result. S8. After fine-tuning the positions in the X and Y directions, the concentricity of the wafer and pre-cut film is adjusted, and the vision system's supplementary lighting device returns to the left standby position. In the Z direction, after fine-tuning in the X and Y directions, the centering of the wafer and pre-cut film is calibrated. The Z-axis motor, according to the controller's command, drives the Z-axis motor synchronous wheel, which is coaxially fixed to it, to rotate. This drives the Z-axis synchronous belt and Z-axis driven wheel to rotate synchronously, thereby driving the Z-axis ball screw, which is coaxially fixed to the Z-axis driven wheel, to rotate. The Z-axis lower substrate is connected to the Z-axis ball screw, from... The Z-axis ball screw converts the output of the Z-axis motor into linear motion in the Z-axis direction. Guided by the cylindrical guide rail, it drives the lower Z-axis substrate to move linearly upward in the Z-axis direction, and drives the upper Z-axis substrate connected to the cylindrical guide rail to move linearly upward in the Z-axis direction. Finally, it drives the wafer holder fixed on the upper Z-axis substrate to move the wafer upward to the film-coating platform, where the wafer and the film adhesive layer are bonded, completing the wafer film-coating process. The film-coated wafer is then moved downward in the Z-axis direction to the set position by the concentricity calibration device, and then the wafer robot completes the unloading process of the film-coated wafer. S9. The remaining film paper after film application is conveyed to the film paper recycling mechanism for automatic recycling of waste film paper. The bottom film conveying device pulls the waste film paper back from the film application platform. The waste film paper is clamped between the film pulling roller shaft and the film paper conveying driven shaft. The piston rod of the film paper conveying cylinder pushes out, pressing the film paper conveying driven shaft connected to it against the film pulling roller shaft. At the same time, the friction of the silicone rubber on the surfaces of the two shafts is used to fix the film paper. The drive motor rotates according to the controller command and set parameters, driving the output synchronous pulley fixedly connected to it to rotate, driving the driven synchronous pulley and synchronous belt that cooperate with the output synchronous pulley, and driving the drive motor to rotate. The output of the drive motor is transmitted to the film-pulling roller shaft, which is coaxially and fixedly connected to the driven synchronous wheel, thereby driving the waste film paper to be conveyed to the next process. After being guided by the limiting devices of two bottom film guiding devices, the waste film paper is conveyed to the film paper recycling mechanism. The film head of the waste film paper is clamped by the waste film paper fixing clamp and fixed on the film paper recycling shaft. The drive motor rotates according to the setting, which drives the output synchronous wheel, which is coaxially and fixedly connected to it, to rotate synchronously. This drives the driven synchronous wheel and the output synchronous belt, which cooperate with the output synchronous wheel, to transmit the output of the drive motor to the film paper recycling shaft, so that it rotates according to the setting, and automatically recycles the waste film paper.

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