Chip sorting equipment and chip sorting method

Abstract

The invention provides chip sorting equipment which comprises a material disc, and a plurality of chip containing grooves used for containing chips are formed in the material disc. The test fixture is provided with a plurality of chip placing positions for placing chips; and the conveying device is used for forwards carrying the chips in the charging tray into the test fixture or reversely carrying the chips in the test fixture into the charging tray. The invention further comprises a chip sorting method, the conveying device controls the material disc to move between the material bin and the first position and controls the testing jig to move between the jig box and the second position, forward or reverse carrying of the chips is achieved, the functionality of the equipment is improved, and the machining efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip sorting, and in particular to a chip sorting device. Background Art

[0002] With the rapid development of the semiconductor industry, the production of semiconductor chips is gradually moving towards automation and standardization. When manufacturing chips, multiple tests are usually required. After the test, the test results of each chip on the tray are not exactly the same, and the arrangement is messy. At this time, it is necessary to sort the test results of all chips according to actual needs and store the chips with the same sorting level together.

[0003] At present, chip testing and chip sorting cooperate with each other to complete chip testing. During testing, a tray loaded with multiple chips is sent to the testing equipment. The testing equipment performs synchronous testing on the multiple chips on the tray, and then removes the unqualified chips on the tray. The chips tested by the testing machine are usually moved to the loading position of the sorting machine under the action of the robot. The loading position stacks multiple trays together, and then they are sorted one by one in the sorting machine.

[0004] However, the existing chip sorting machine can only work in one direction, and can only put the chip from the tray to the test fixture or from the test fixture to the tray, and the function is relatively single. And when different trays need to be replaced, the machine can only be stopped to replace different fixtures to replace different trays, which reduces production efficiency. Summary of the invention

[0005] The object of the present invention is to provide a chip sorting device and a chip sorting method, so as to at least solve the problem of low production efficiency in the existing chip processing process.

[0006] In order to solve the above technical problems, the present invention provides a chip sorting device, comprising:

[0007] A material tray, wherein the material tray is provided with a plurality of chip placement slots for placing chips;

[0008] A test fixture, wherein the test fixture is provided with a plurality of chip placement positions for placing chips;

[0009] A conveying device is used to convey the chips in the tray to the test fixture in a forward direction or to convey the chips in the test fixture to the tray in a reverse direction.

[0010] Optionally, in the chip sorting equipment, the conveying device includes a jig conveying module, the jig conveying module includes a jig lifting unit and a carrying unit, and the jig lifting unit and the carrying unit cooperate with each other to move the test jig.

[0011] Optionally, in the chip sorting equipment, the jig conveying module also includes a slide rail, which connects the jig lifting unit and the carrying unit, and the carrying unit can slide on the slide rail. The test jig is located above the lifting unit, and the carrying unit includes a jig clamping assembly and a support assembly. The support assembly is located on both sides of the slide rail, and the jig clamping assembly is located in the middle of the support assembly for slidingly clamping the test jig to the support assembly.

[0012] Optionally, in the chip sorting device, the carrier unit further includes a pressing member, which is located on the supporting assembly and is used to press and fix the test fixture.

[0013] Optionally, in the chip sorting equipment, the test jigs are stacked in a jig box in groups, the jig lifting unit includes a placement table and a lifting drive assembly, the jig box is located above the placement table, and the lifting drive assembly is used to control the lifting height of the placement table.

[0014] Optionally, in the chip sorting equipment, the jig clamping assembly includes a sensing element, and the sensing element is used to sense whether the test jig exists in a corresponding position of the jig box.

[0015] Optionally, in the chip sorting equipment, the conveying device also includes a tray conveying module, the tray conveying module includes a tray clamping assembly and an alternating module, and the tray clamping assembly is used to move the tray forward to the alternating module or move the tray backward from the alternating module.

[0016] Optionally, in the chip sorting equipment, the alternating module includes at least two groups of independent tray placement components.

[0017] Optionally, in the chip sorting equipment, the conveying device also includes a sorting device, and the sorting device includes a detection component and a sorting clamping component. The detection component is used to detect chips, and the sorting clamping component is used to clamp the chips in the tray or the test fixture according to the conveying direction of the chips for detection, and place the qualified chips on the test fixture or the tray.

[0018] Optionally, in the chip sorting equipment, the material tray includes at least one material tray position, and the material tray position is used to fix a small material tray.

[0019] Optionally, in the chip sorting equipment, a pressing piece is provided at a corner of the material tray, and an elastic piece is provided at a diagonal position of the pressing piece, and the elastic piece generates an elastic force toward the pressing piece.

[0020] Optionally, in the chip sorting equipment, the at least two tray positions may be suitable for fixing different trays.

[0021] The present invention also provides a chip sorting method, which is applied to the chip sorting device, wherein the chip sorting device includes a material tray, a test fixture and a conveying device, and the chip sorting method includes:

[0022] The conveying device moves the material tray with material and the test fixture with empty material to the first position respectively, and after the qualified chips in the material tray are detected and screened by the sorting device, the qualified chips are placed on the test fixture, and the test fixture after placement is moved to the next station, or,

[0023] The conveying device moves the empty material tray and the test fixture with material to the first position respectively, and after the qualified chips in the test fixture are detected and screened out by the sorting device, the qualified chips are placed on the material tray, and the placed material tray is moved to the next station.

[0024] Optionally, in the chip sorting method, moving the tray with material or empty material to a suitable position includes: clamping the tray in the loading bin to the tray placement assembly of the alternating module located at the loading position, and multiple groups of the tray placement assemblies are moved alternately between the loading position and the first position respectively.

[0025] Optionally, in the chip sorting method, the material tray that is clamped and moved back to the loading position is moved to the recovery bin until the material tray in the loading bin is emptied, the material tray in the recovery bin is taken out and a new material tray is placed in the loading bin.

[0026] Optionally, in the chip sorting method, moving the empty or loaded test jig to a suitable position includes: clamping the test jig to a carrier assembly, and controlling the carrier assembly to move to a second position.

[0027] Optionally, in the chip sorting method, clamping the test jig includes: controlling the test jig to rise and fall to a suitable height, and after the jig clamping component senses the presence of material, clamping the test jig to the carrying component and pressing and fixing it.

[0028] Optionally, in the chip sorting method, after the test jig is full of chips or the test jig is emptied of chips, the carrier unit pushes the full jig or the empty jig into a recycling jig box for temporary storage.

[0029] Optionally, in the chip sorting method, fixing the small tray on the tray includes: tilting one corner of the small tray into a clamping piece corresponding to a corner of the tray placement position, and releasing the elastic piece at the opposite corner of the clamping piece to fix and clamp the small tray.

[0030] The chip sorting equipment and the chip sorting method provided by the present invention respectively control the movement of the material tray between the material bin and the first position through the conveying device, and control the movement of the test fixture between the fixture box and the second position, so as to adapt to the forward and reverse transportation of the chip, thereby solving the problem that the sorting machine can only convey the chip in one direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 A schematic diagram of the structure of a chip sorting device provided in an embodiment of the present invention;

[0033] Figure 2 A schematic diagram of the structure of a jig conveying module provided in an embodiment of the present invention;

[0034] Figure 3 A schematic diagram of the structure of a tray conveying module provided in an embodiment of the present invention;

[0035] Figure 4 A schematic diagram of the material tray structure provided in an embodiment of the present invention.

[0036] Reference numerals:

[0037] 10-material tray; 20 test fixture; 2-jigs box; 1-silo;

[0038] 210- jig lifting unit; 220- transport unit; 230- slide rail; 221- jig clamping assembly; 222- support assembly; 223- clamping drive assembly; 224- clamping member; 211- placement table; 212- lifting drive assembly; 110- tray clamping assembly; 120- alternating module; 130- silo lifting unit; 111- clamping claw; 112- tray clamping track; 310- detection assembly; 320- sorting clamping assembly; 105- tray position; 108- small tray; 106- clamping member; 107- elastic member; 109- gripping part. DETAILED DESCRIPTION

[0039] The following is a further detailed description of a chip sorting device and a chip sorting method proposed in the present invention in combination with the accompanying drawings and specific embodiments. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In addition, the structure shown in the accompanying drawings is often part of the actual structure. In particular, the emphasis that each drawing needs to show is different, and sometimes different proportions are used.

[0040] It should be noted that the terms "first", "second", etc. in the specification, claims and drawings of the present invention are used to distinguish similar objects in order to describe the embodiments of the present invention, rather than to describe a specific order or sequence. It should be understood that the structures used in this way can be interchanged under appropriate circumstances. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0041] like Figure 1 As shown, this embodiment provides a chip sorting device, including: a tray 10, on which a plurality of chip placement slots for placing chips are provided; a test fixture 20, on which a plurality of chip placement positions for placing chips are provided; a conveying device, which is used to transport the chips in the tray 10 to the test fixture 20 or to transport the chips in the test fixture 20 to the tray in reverse. The conveying device of the chip sorting device can not only take the chips out of the tray 10 and put them into the test fixture 20, but also reversely move the chips from the test fixture 20 back to the tray 10, and has two chip conveying modes, forward and reverse, which effectively improves the functionality of the device and saves space and cost.

[0042] The conveying device includes a jig conveying module, which is used to move the test jig 20, transfer the test jig 20 to a suitable position, and then use a manipulator to forwardly transport the chip from the tray 10 to the test jig 20 or reversely transport the chip from the test jig 20 back to the tray 10. In order to improve efficiency, the test jigs 20 are often placed in the form of multiple groups of stacks. Each time the conveying device clamps one group of test jigs 20 for processing, after the processing of this group of test jigs 20 is completed and leaves the processing station, the conveying device clamps another group of test jigs 20 again for processing, so as to realize automated processing. When all the groups of stacked test jigs 20 have been transferred and processed or are about to be moved, an alarm or other method can be used to remind manual or machine automatic replenishment to realize continuous processing. In this embodiment, multiple groups of test jigs 20 are stored in a jig box 2 in a stacked manner. The jig box 2 is a layered plate structure. Each group of test jigs 20 is stored on each layer of the jig box 2 to avoid scratches caused by surface contact between two groups of test jigs 20. Each layer of the jig box 20 may be provided with a sliding component to cooperate with the sliding pick-up and placement of the test jig 20, or a conveying component may be provided to cooperate with the sliding pick-up and placement of the test jig 20, so as to reduce the friction between the test jig 20 and the layer, reduce the jig loss and improve the processing efficiency. The jig conveying module includes a jig lifting unit 210 and a carrier unit 220. The jig box 2 is arranged on the jig lifting unit 210. The lifting unit 210 and the carrier unit 220 cooperate with each other to move the test jig 20 to a suitable position for chip transfer. Placing the chip on the tray 10 or the test jig 20 is to place the chip in the chip placement slot of the tray 10 or in the chip placement position of the test jig 20.

[0043] Further, such as Figure 2As shown, the conveying device also includes a slide rail 230, the slide rail 230 connects the fixture lifting unit 210 and the carrier unit 220, the test fixture 20 (fixture box 2) is located above the fixture lifting unit 210, the carrier unit 220 includes a fixture fixture clamping assembly 221 and a support assembly 222, the support assembly 222 is respectively located on both sides of the slide rail 230, and the height is consistent, and the fixture fixture clamping assembly 221 is located in the middle of the slide rail 230. The fixture clamping assembly 221 can slide on the carrier unit 220 through the clamping drive assembly 223, clamp a group of test fixtures 20 in the fixture box 2 and move the group of test fixtures 20 to the support assembly 222. That is, the carrier unit 220 can slide on the slide rail 230, slide to the appropriate position of the fixture clamping assembly 221 above the fixture lifting unit 210 and stop, and the fixture clamping assembly 221 clamps a group of test fixtures 20 in the fixture box 2 by sliding forward on the bottom plate track of the carrier assembly 220, and then slides backward to place the test fixture 20 on the support assembly 222, so as to move the test fixture 20 out of the fixture box 2. The forward sliding direction of the fixture clamping assembly 221 is the direction toward the fixture box 2, and the reverse sliding direction of the fixture clamping assembly 221 is the direction away from the fixture box 2.

[0044] Specifically, the bottom track direction of the carrier assembly 220 is consistent with the sliding direction of the slide rail 230. In order to place the test jig 20 on the support assembly 222, the height of the clamping claw of the jig clamping assembly 221 can be slightly higher than the height of the support assemblies 222 on both sides, and the width between the two groups of support assemblies 222 is less than or equal to the width of the test jig 20. After the jig clamping assembly 221 slides forward to clamp a group of test jigs 20 in the jig box 2, it slides backward until the test jig 20 is located above the support assembly 222, and the clamping claw is released to allow the test jig 20 to be gently placed on the support assembly 222. Alternatively, a buffer layer may be provided on the support assembly 222 to prevent certain damage to the test jig 20 during the placement process, or a sliding member may be provided on the support assembly 222, and the test jig 20 may slide on the sliding member until the support assembly The clamping jaws 222 may stop at a suitable position, and the clamping jaws may release the test fixture or not, and the specific placement method is not specifically limited here; alternatively, the support assembly 222 is provided in two groups on both sides of the slide rail 230, and each group of support assemblies 222 is provided with a slide groove on the inner side, the direction of the slide groove is the same as the sliding direction of the fixture clamping assembly 221, and the position of the slide groove is the same as the clamping height of the fixture clamping assembly 221, and during the reverse movement of the fixture clamping assembly 221 sliding out the test fixture 20, the test fixture 20 can just be engaged in the slide grooves on both sides to fix the test fixture 20 to the support assembly 222, and a blocking member may be provided on the support assembly 222 to block the test fixture 20 from being limited to the fixed position of the support assembly 222, so as to avoid unnecessary damage during subsequent movement due to position offset.

[0045] In this embodiment, the slide rail 230 is a linear module, and a motor is provided on the linear module to control the forward and reverse movement of the carrier unit 220 on the linear module, so as to realize the rapid transportation of the carrier component 220 .

[0046] The clamping drive assembly 223 includes a clamping claw, a slide cylinder, an elastic member and a dual-axis cylinder. The clamping claw is connected to the slide cylinder. The slide cylinder is used to extend the clamping claw into the fixture box 2 to clamp the test fixture 20. The dual-axis cylinder is used to retract the clamping claw that clamps the test fixture 20 to slide in the opposite direction and drag the test fixture 20 into the support assembly 222. The elastic member is a buffer spring to prevent the vibration of the clamping assembly 223 from affecting the test fixture 20.

[0047] Furthermore, in order to prevent the test fixture 20 from causing slight displacement or bumping during the movement on the carrier unit 220, which may affect the position accuracy of the chip placement and damage the chip, a clamping assembly 224 is provided on the carrier assembly 220 to clamp and fix the test assembly 20 on the support assembly 222. In this embodiment, the clamping assembly 224 is respectively arranged on each group of support assemblies 222, and when the fixture clamping assembly 221 clamps the test fixture and moves it to a suitable position on the support assembly 222, the clamping assembly 224 clamps downward on the top of the test fixture 20 to fix the test fixture 20. The clamping assembly 224 can be a cylinder, an air clamp, an elastic member, etc. to achieve clamping and fixing.

[0048] In order to improve the processing efficiency, the test jig 20 is stored in a jig box 2 in a stacked manner. The jig box 2 is located above the jig lifting unit 210. The jig lifting unit 210 includes a placement table 211 and a lifting drive assembly 212. The placement table 211 of the lifting unit 210 is fixedly connected to the slide rail 230. The jig box 2 is located above the lifting unit 221. The lifting drive assembly 212 is used to drive and control the lifting of the jig box 2. The placement table 211 is provided with a plurality of openings. The lifting drive assembly 212 includes a lifting column and a drive motor. The lifting column is controlled to rise or fall by the drive motor. The lifting column passes through the opening of the placement table 211 and contacts the jig box 2. When the lifting column does not rise, the lifting column does not extend out of the opening, and the jig box 2 is placed on the placement table 2; when the lifting column rises, the jig box 2 is lifted accordingly. That is to say, in this embodiment, the placement table 211 is fixed, and the up and down movement of the jig box 2 is controlled by the lifting drive assembly 212, wherein the openings of the jig box 2 are located at the four corners, and the four corners are lifted and lowered simultaneously to improve the stability of the jig box 2.

[0049] The software sets the position of the topmost test jig 20 in the jig box 2 to match the moving clamping position of the clamping claw of the jig clamping assembly 221 as the initial position of the jig box 2, and records the height of the lifting column at this time. The height of the lifting column can be zero during forward transportation. When the topmost test jig 20 in the jig box 2 is grabbed, the driving motor controls the lifting column to rise one layer of the jig box 2, so that the test jig 20 on the next layer is just located at the position suitable for the sliding clamping of the jig clamping assembly 221. When the test jig 20 on the second layer is clamped out of the jig box 2, the driving motor rises one layer again, so that the position of the test jig 20 on the third layer is just matched with the clamping claw, and so on, until all the test jigs 20 in the jig box 2 are removed, so as to realize the forward clamping and transportation of each layer of the test jig 20. On the contrary, when it is necessary to put the test jig in the carrier unit 220 back into the jig box 2 in reverse, the lifting column is controlled to rise to the bottom layer of the jig box 2 so that it can just match the transfer position of the clamp. At this time, the position of the jig box 2 is the initial position during reverse transportation, that is, when the clamp grabs the test jig 20 for reverse transportation, the clamp can first place the test jig into the bottom layer of the jig box 2. After the placement is completed, the lifting column is controlled to drop one layer so that the position of the empty layer of the second to last layer can match the transfer position of the clamp, and so on, until the jig box 2 drops to the initial position of forward transportation, the clamp can just move the test jig 20 to the top empty layer, and the entire jig box 2 is stacked. The jig box 2 filled with test jigs 20 is transferred to the next workstation manually or by a robot for the next step of processing, and then the empty jig box or the jig box filled with test jigs is selected according to the corresponding program to wait for a new round of processing. In this embodiment, the jig box 2 and the jig conveying module are both in two groups, one group is a loading jig box 2, which is used to carry the test jig from the jig box to the second position for chip transfer, and one group is a recovery jig box 2, which is used to store the test jig sent back from the second position. The two groups of jig boxes 2 are respectively located on the lifting units 210 of the two groups of jig conveying modules. Whether there are chips on the chip placement positions in the test jigs 20 in the loading jig box 2 and the recovery jig box 2 can be set according to the program, so as to select the forward or reverse transportation of the chips. Among them, the second position is the position when the test jig 20 moves to a suitable position to transfer chips with the tray 10.

[0050] In order to accurately control the lifting height of the jig box 2, a sensor is provided on the jig 2 to sense the position of the jig box 2. In a sorting device provided in this embodiment, an in-place sensor is provided on the jig box 2. When the jig box 2 is lifted to the initial position during forward or reverse motion, the in-place sensor can generate a signal to reflect the position of the jig box 2, thereby controlling the operation of the motor and pausing the jig box 2 at a suitable position.

[0051] Furthermore, after the carrier unit 220 moves along the slide rail 230 to a suitable position away from the jig lifting unit 210, the jig clamping assembly 221 moves to clamp the test jig 20 in the jig box 2. The carrier unit 220 moves to a suitable position away from the jig lifting unit 210, including the two side supports 222 abutting against the side of the jig box 2. When the clamp clamps the test jig 20 out of the jig box 2, the test jig 20 will not be in a suspended state for a period of time, thereby improving the safety of transportation. In order to prevent the carrier unit 220 from colliding with the jig box 2 during movement, a side guard is provided on the side of the jig box 2, which produces a certain buffering effect when the carrier unit 220 contacts the jig box 2, thereby preventing vibrations such as collisions from affecting the chips in the test jig. The side guard can also be provided on the side of the support 222 close to the jig box 2, and the side guard can also be a stopper, etc. The carrying unit 220 moves to a suitable position away from the lifting unit 210, and the two side supports 222 are not in contact with the sides of the fixture box 2. When the clamp clamps the test fixture 20 out of the fixture box 2, the test fixture 20 is suspended for a period of time, and the suspension distance is less than the length of the test fixture.

[0052] The jig clamping assembly 221 also includes a sensing part, which is used to sense whether there is material at the corresponding clamping position in the jig box 2. When the carrier unit 220 needs to be transported in the forward direction, after moving to a suitable position, the sensing part senses whether there is material at the corresponding position in the loading jig box 2. When the sensing part senses that there is material, the jig clamping assembly 221 clamps the corresponding test jig 20 from the loading jig box 2 to the carrier unit. When the sensing part does not sense that there is material, the jig lifting unit 210 is controlled to adjust the position of the loading jig box 2. When the sensing part senses that there is material at the clamping position, the jig clamping component 221 is controlled to clamp the test jig 20 in the loading jig box 2; conversely, when the carrier unit 220 needs to be transported in the reverse direction, after moving to a suitable position, the sensing part senses whether there is material at the corresponding position in the recovery jig box 2. When the sensing part senses that there is material, the jig lifting unit 210 is controlled to adjust the position of the jig box 2 until the sensing part senses that there is no material at the clamping position, and then the test jig 20 to be placed in the jig box 2 is placed in the recovery jig box 2.

[0053] Furthermore, the conveying device also includes a tray conveying module, such as Figure 3As shown, the tray conveying module is used to convey the tray 10 in the forward or reverse direction. The tray conveying module includes a tray clamping assembly 110 and an alternating module 120. The tray clamping assembly 110 is used to forwardly transport the tray 10 to the alternating module 120 or reversely transport the tray 10 from the alternating module to the tray silo 1. The alternating module 120 receiving the tray 10 is moved to a suitable position, and the chip is forwardly transported from the alternating module 120 to the test fixture 20 or reversely transported from the test fixture 20 back to the alternating module 120 through the sorting module, thereby realizing the forward and reverse transport of the chip of the device.

[0054] The alternating module 120 includes at least two groups of independent tray placement components, each group of tray placement components can receive a group of trays 10. After receiving the trays 10 in the loading bin 1 at the loading position, the tray placement components of one group of alternating modules 120 move to the first position to wait for the sorting module to sort the chips forward or reversely; while the other group of tray placement components of the alternating module 120 remain at the loading position, and when the tray placement components at the first position complete the transfer of the chips, they move back to the loading position, and the other group of tray placement components at the loading position moves to the first position to wait for the transfer of the chips, and the two groups of tray placement positions alternately move between the loading position and the first position. The tray 10 moved back to the loading position is moved to the recovery bin 1 by the tray clamping component 110, and then the tray clamping component 110 clamps the tray in the loading bin 1 to the tray placement component, waiting for alternating movement.

[0055] Furthermore, in order to improve efficiency, the trays 10 are mostly loaded in a stacked form. The trays 10 are in the shape of a flat plate, and a plurality of chip placement grooves arranged in a rectangular array are provided on the trays 10. The depth of the chip placement grooves is adapted to the thickness of the chips, so that the chips can be stably placed in the trays 10. The silo 1 is used to store the stacked trays 10, including a loading silo 1 and a recovery silo 1, which are respectively used to store the loading trays 10 and the trays 10 after receiving or transferring chips. The silo 1 is provided with a tray partition assembly. When the trays 10 are placed in the recovery silo in the reverse direction, a certain gap is formed between two groups of adjacent trays 10 to avoid friction damage to the chips. The silo 1 includes a silo door 100, which is arranged on the side of the silo 1. The trays 10 push a stack of trays into the silo 1 through the silo door to wait for loading.

[0056] The trays 10 in the loading bin 1 and the recovery bin 1 can be placed with or without materials according to the processing conditions, and the state of the trays 10 is not specifically limited.

[0057] The tray conveying module also includes a silo lifting unit 130, which is used to control the lifting height of the supporting plate supporting the tray 10 in the silo 1. The silo lifting unit 130 includes a lifting motor and a cylinder, one end of the cylinder is connected to the supporting plate, and the height of the supporting plate is controlled by controlling the movement of the cylinder by the lifting motor. The top of the silo 1 is a non-enclosed structure, and the clamping assembly 110 can clamp the tray 10 from the top of the silo 1 to the alternating module 120 or clamp the tray 10 from the alternating module 120 to the silo 1 in the reverse direction. When all the trays 10 in the silo 1 are clamped out of the silo 1, the lifting motor controls the cylinder to descend until the supporting plate is at the lowest position of the silo 1, and the silo door is opened manually or by a mechanical arm to re-insert the full tray.

[0058] Specifically, the sorting equipment includes two groups of silos 1, a loading silo 1 and a recovery silo 1, the two groups of silos 1 are arranged in parallel and at intervals, the tray clamping assembly 110 includes a clamping claw 111 and a tray clamping track 112, the tray clamping assembly 110 can move on the tray clamping track 112, so the tray clamping track 112 is arranged in parallel with the two groups of silos 1, the alternating module 120 is located between the two groups of silos 1, and when the tray clamping assembly 110 moves on the tray clamping track 112, it can pass through one group of silos, the alternating module and another group of silos respectively, so that the clamping claw can forwardly clamp the tray 10 in the loading silo 1 and place it on the alternating module 120, or reversely put the tray 10 on the alternating module 120 back to the recovery silo 1. The tray clamping assembly 110 further includes a longitudinal drive assembly, which is connected to the clamping jaws 111 and can slide along the tray clamping track 112 to longitudinally drive the clamping jaws 111 to move and pick up.

[0059] In one embodiment, one group of bins 1 is a loading bin 1, and another group of bins 1 is a recycling bin 1, and the loading bin 1 is used to place full trays 10. When the sorting device is transporting chips in the forward direction, the tray clamping assembly 110 clamps the trays in the loading bin 1 to a group of tray placement assemblies of the alternating module 120, and the tray placement assembly moves to a suitable position (first position) and the sorting module clamps the chip from the chip placement slot to the chip placement position of the test fixture 20. When the chips in the tray placement assembly are emptied, the tray placement assembly returns to the loading position, and another group of tray placement assemblies moves to the first position. The tray clamping assembly 110 puts the empty tray 10 on the tray placement assembly at the loading position into the recycling bin 1, and then clamps the full tray 10 from the loading bin 1 to the tray placement assembly at the loading position, waiting for the next alternating movement. Until the recycling bin 1 is filled with empty trays 10, at which time the support plate is located at the lowest position of the recycling bin 1, the bin door is opened to remove the empty trays 10 for storage of the next round of empty trays. On the contrary, when the sorting equipment is to transport the chips in reverse, the tray clamping assembly 110 clamps the empty trays in the loading bin 1 to a group of tray placement assemblies of the alternating module 120, and the tray placement assembly moves to a suitable position (first position) and the sorting module clamps the chip from the test fixture 20 to the tray placement assembly. After that, the tray placement assembly returns to the loading position, and the tray clamping assembly 110 places the full tray in the recycling bin 1. That is to say, the two groups of bins 1 can be loaded with empty trays or full trays, and are not limited to the loading bin 1 can only be loaded with full trays.

[0060] The sorting device includes a detection component 310 and a sorting clamping component 320. The detection component 310 is used to detect chips. When the tray 10 and the test fixture 20 are moved to appropriate positions, the sorting clamping component 320 clamps the chips in the tray 10 or the test fixture 20 according to the direction of chip transportation for detection, and places the qualified chips in the test fixture 20 or the tray 10, and then the test fixture 20 or the tray 10 transfers the qualified chips to the next station. The detection component 310 can be a visual detection.

[0061] In one embodiment, the fixture box 2 is divided into two groups, which are spaced apart and placed in parallel. Figure 1 As shown, the silos 1 are arranged in two groups inside the jig box 2 and are placed parallel to the jig box 2, and the alternating module 120 is arranged in the middle of the two groups of silos 1. Figure 1As shown, the direction of the line connecting the two groups of jig boxes 2 is the first direction, and the direction perpendicular to the first direction is the second direction, and the first direction and the second direction are both located in the same horizontal plane. That is to say, the two groups of jig boxes 2 and the two groups of silos 1 are arranged along the first direction, the alternating module 120 is located in the middle of the two groups of silos 1 and arranged along the second direction, and the tray clamping assembly 110 moves along the first direction at the discharge end to facilitate clamping the tray in the silo to the alternating module 120, and the alternating module can move along the second direction to move the tray to a suitable position for chip handling and transfer. It should be noted that the first direction includes all line directions on the horizontal plane of the first direction, such as Figure 1 As shown in , the first direction generally refers to from left to right or from right to left, and does not specify a single point as the starting point; the second direction includes all line directions on the horizontal plane of the second direction, such as Figure 1 As shown in , the second direction generally refers to from bottom to top or from top to bottom.

[0062] Further, the slide rail 230 is connected to the jig lifting unit 210 and arranged along the second direction. The second position can be a fixed distance when the carrier unit 220 moves along the second direction. The first position can be a position where the alternating module 120 is also moved along the second direction to be consistent with the carrier unit 220 in the first direction. At this time, the carrier unit 220 and the alternating module 120 are on the same straight line along the first direction. When the carrier unit 220 moves to the second position and the alternating module 120 moves to the first position, the chip is tested and transferred. The sorting module is located above the chip transport position of the jig carrier component 220 and the alternating module 120 and arranged along the first direction. The sorting clamping component 320 is used to move along the first direction to vertically clamp the chip on the test jig 20 or the tray 10 to the detection component 310 for detection, and then the qualified chip is placed on the tray 10 or the test jig 20 according to the chip transport direction. The tray 10 and the test jig 20 are respectively transferred to the corresponding next station for further processing.

[0063] Furthermore, in order to make different chips applicable to the chip sorting equipment, the tray 10 is provided with at least one tray position 105, and the tray position 105 is used to fix a small tray 108, and the small tray 108 can hold different chips, and at least one group of small trays 108 is fixed on one group of trays 10 through the tray position 105, and the transportation of different chips is realized by moving a group of trays 10 during loading. When the line needs to be changed during the processing of the chip sorting equipment, the small tray 108 of the chip to be replaced is placed in one of the tray positions 105 in advance and placed in the loading bin 1. When the chip is transported, the equipment does not need to be shut down, and the chips required for the line change can be transported, so as to realize fast line change and improve processing efficiency.

[0064] The material tray position 105 can be set to a square shape, adapted to the small square material tray 108, and the material tray position 105 can also be set to other shapes, which are not specifically limited here. Figure 4 As shown, taking the square material tray position 105 as an example, two groups of material tray positions 105 are provided in a group of material trays 10, and the two groups of material tray positions 105 are arranged side by side. A clamping piece 106 is provided at one corner of the material tray position 105, and an elastic piece 107 is provided at the diagonal position of the clamping piece 106. The elastic piece 107 generates an elastic force in the direction of the clamping piece 106, and is used to generate an extrusion force in the diagonal direction to clamp and fix the small material tray 108.

[0065] In this embodiment, the clamping member 106 is similar to an "L" shape and is slightly higher than the tray position 105 and is set at a corner of a square. A groove is provided on the inner side of the clamping member 106 or the clamping member 106 forms a groove between the tray position 105. The groove matches a corner of the small tray 108 and its adjacent edge. The corner of the small tray 108 can be clamped and positioned to the tray position 105 through the groove. An elastic member 107 is provided at the diagonal of the clamping member 106. After one end of the small tray 108 is placed on the clamping member 106, the elastic member 107 pops up at the diagonal to tighten the small tray 108. An opposing force is formed between the elastic member 107 and the clamping member 106 to fix the small tray 108 in the tray position. When the small tray 108 is placed on the tray position 105, a part of the clamping member 107 is located above the small tray 108, and a limit can be formed for the small tray 108 in the Z-axis direction to fix the position of the small tray 108. The pressing member 106 may not be provided with a groove, and the small material tray 108 is clamped by the opposing force. The elastic member 107 includes a spring and a push mechanism, and the push mechanism is used to control the position of the spring. Before placing the small material tray 108, the push mechanism controls the spring to be tightened, and after the small material tray 108 is placed, the push mechanism controls the spring to be released to tighten the small material tray 108, or before placing the small material tray 108, the push mechanism controls the spring to be in a relaxed state, and after the small material tray 108 is placed, the push mechanism controls the spring to be extended to tighten the small material tray 108.

[0066] A gripping portion 109 is provided on the side of each tray position 105 to facilitate taking and placing the small tray 108 from the tray position 105. In this embodiment, the gripping portion 109 is a groove and is provided on both sides of the tray position 105 to facilitate robot or manual material handling.

[0067] The present application also provides a chip sorting method, which is applied to the chip sorting equipment, wherein the chip sorting equipment includes a material tray 10, a test fixture 20 and a conveying device, wherein the conveying device moves the material tray 10 and the test fixture 20 to appropriate positions respectively, and then forward or reversely transports the chips in the material tray 10 or the test fixture 20. With one set of equipment, both forward pick-up and placement of chips to test and reverse pick-up and placement of chips can be completed, thereby enhancing the functionality of the equipment.

[0068] Among them, the forward pick-up and placement of chips includes a conveying device moving the material tray 10 with materials and the test fixture 20 with empty materials to appropriate positions respectively, and the sorting device clamps the chips in the material tray 10 for detection, screens out qualified chips, and places the qualified chips in the test fixture 20. After the qualified chips in the test fixture 20 are placed, the conveying device moves the test fixture 20 to the next station, and then the conveying device moves again to move the next group of material trays 10 with materials and the test fixture 20 with empty materials to appropriate positions for the next round of forward chip transportation, and so on, to maintain continuous forward chip transportation.

[0069] The chip reverse transport includes the conveying device moving the empty material tray 10 and the test fixture 20 with material to the appropriate positions respectively, the sorting device clamps the chips in the test fixture 20 for inspection, and places the qualified chips on the material tray 10 after screening out the qualified chips, until the material tray 10 is filled with chips and the material tray 10 is moved to the next station, and then the conveying device moves again to move the next group of test fixtures 20 with material and the empty material tray 10 to the appropriate positions, and then the next round of chip reverse transport is carried out, and so on, to maintain continuous chip reverse transport.

[0070] Specifically, the number of forward or reverse transport times and directions of the chip can be changed through program settings, and whether to perform the detection process can be selected according to actual operations. If the detection process is not set, after the transportation device moves the material tray 10 with material and the empty material test fixture 20 to the appropriate positions respectively, the sorting device directly clamps the chips in the material tray 10 to the test fixture 20, and then moves the material tray 10 and the test fixture 20 respectively.

[0071] Furthermore, the conveying device includes a jig conveying module and a tray conveying module, which are respectively used to control the movement of the test jig 20 and the tray 10. The specific structures of the jig conveying module and the tray conveying module can be found in the above-mentioned chip sorting equipment and will not be repeated here. Moving the tray 10 with material or empty material to a suitable position includes: the tray clamping assembly 110 clamps the tray 10 from the loading bin 1 to the multiple tray placement assemblies of the alternating module respectively. Taking two groups of tray placement positions as an example, the alternating module alternately moves the two groups of tray placement assemblies to the first position respectively. The first position is the position when the tray 10 moves out or receives the chip, that is, the suitable position of the tray mentioned above.

[0072] The alternating module alternately moves the two groups of tray placement components to the first position, including the two groups of tray placement components alternately moving between the loading position and the first position, including controlling one group of tray placement components to move to the first position, and the other group of tray placement components to remain at the loading position. After the tray chips at the first position are transported, the tray at the first position is controlled to move back to the loading position, and the tray placement component at the loading position moves to the first position, completing the alternating movement of the two groups of tray placement positions. The tray clamping component 110 clamps the tray 10 moved back to the loading position to the recovery bin 1, and clamps the tray in the loading bin 1 to the loading position again to wait for alternating movement, and repeats the cycle until the trays in the loading bin 1 are emptied, and then controls the tray lifting component to move the supporting plate of the loading bin 1 to the lowest position, opens the bin door to re-insert the tray 10, controls the bin door of the recovery bin 1 to open, and moves the recovered tray 10 out of the recovery bin 1.

[0073] A material tray 10 can be placed in the loading silo 1, and the tray conveying component will move the filled material tray 10 to the first position. After detection, qualified chips are placed on the test fixture 20, and the fixture conveying component transports the qualified chips on the test fixture 20 to the next position. Alternatively, an empty material tray 10 can be placed in the loading silo 1, and the tray conveying component will move the empty material tray 10 to the first position, and the qualified chips detected by the test fixture 20 are placed on the empty material tray 10, and the tray conveying component will transport the full material tray 10 back to the recovery silo 1, thereby realizing forward or reverse transportation of chips.

[0074] Furthermore, in order to facilitate the chip line change operation, at least one tray position 105 is provided on the tray 10 for fixing a small tray 108 for placing different chips. Fixing the small tray 108 on the tray 10 includes: tilting one corner of the small tray 108 into a pressing member 106 corresponding to one corner of the tray placement position, releasing the elastic member 107 at the corner opposite to the pressing member 106 so that the elastic force of the elastic member 107 and the pressing member 106 form a certain opposing force to fix and press the small tray 108. When the small tray 108 is removed, the elastic member 107 releases the elastic force, the opposing force disappears, and the small tray 108 is taken out from the tray placement position.

[0075] Moving the empty or loaded test jig 20 to a suitable position includes: the jig clamping component 221 clamps the test jig 20 from the loading jig box 2 to the carrying component 220, and controls the carrying unit 220 to move to a second position, which is the position of the test jig 20 when moving out or receiving the chip, that is, the suitable position of the test jig mentioned above.

[0076] Furthermore, clamping the test jig 20 from the loading jig box 2 includes: controlling the jig lifting unit 210 to lift and lower the test jig 20 on the top layer in the loading jig box 2 to be at a suitable height, and being located in the same clamping plane as the jig clamping assembly 221 in the carrying unit 220, so that the clamping claws of the jig clamping assembly 221 can clamp the test jig 20. After the jig lifting unit 210 is controlled to rise and fall to a suitable height, the carrier unit 220 is driven by the slide rail 230 to move to a suitable position away from the loading jig box 2, and the slide cylinder of the clamping drive assembly 223 extends to extend the clamping claws into the loading jig box 2. When the sensing component senses that there is a test jig 20 at the clamping position in the loading jig box 2, the dual-axis cylinder is lifted and the slide cylinder is retracted to drag the test jig onto the support 222 of the carrier unit 220. After the clamping component 224 fixes and presses the test jig 20 on the support 222, the linear module drives the entire carrier unit 220 to move to the second position to carry out forward or reverse transport of the chip from the tray 10 to the test jig 20 or from the test jig 20 to the tray 10. When the sensing element does not sense that there is a test jig 20 at the clamping position in the loading jig box 2, the jig lifting unit 210 is controlled to lift and lower the height of the loading jig box 2 until the test jig 20 in the loading jig box 2 can be consistent with the clamping position of the clamping claw. Generally, when the loading jig box 2 is filled with test jigs 20, the jig lifting unit 210 does not rise, and the loading jig box 2 is placed on the support table. At this time, the test jig 20 at the top position in the jig box 2 is consistent with the clamping position of the clamping claw. Whenever a layer of test jigs 20 is removed, the jig lifting unit 210 controls the loading jig box 2 to rise one layer to facilitate the next clamping of the clamping claw. When all the test jigs 20 in the loading jig box 2 are removed, the motor controls the jig lifting unit 210 to descend to the lowest position, and the test jig 20 is re-inserted manually or by a robot. When the chips in the test jig 20 at the second position are moved or filled, the carrier unit 220 moves the full jig or the empty jig back to the initial clamping position, and the jig clamping assembly 221 pushes the test jig 20 into the recovery jig box 2 on the jig lifting unit 210 for temporary storage until the recovery jig box 2 is completely filled, and the jig lifting unit 210 is controlled to descend to the lowest position, and the jig bin is taken out manually or by a robot, and then the jig lifting unit 210 is controlled to rise to continue to temporarily store the returned test jig 20.

[0077] Specifically, taking the forward transport of chips as an example, the chip sorting method is: open the door of the loading bin 1, push the material tray 10 with materials into the loading bin 1; put the empty test fixtures 20 into the loading fixture box 2 according to the number of layers.

[0078] Control the jig lifting unit 210 to lift the loading jig box 2 to a suitable height. After the carrier unit 220 is driven by the linear module to move to a suitable position with the loading jig box 2, the slide cylinder extends and the clamp is extended into the jig box 2. When the material sensor of the clamp senses the presence of material, the dual-axis cylinder is lifted and the slide cylinder retracts to drag the test jig 20 onto the jig carrier unit 220. After the test jig 20 is dragged into place, the clamping cylinder is pressed down to clamp the test jig 20, and the entire carrier unit 220 is driven by the linear module to move to the second position.

[0079] After the jaws of the tray clamping assembly 110 move to the appropriate position, the jaws hook the tray 10 in the loading bin 1 and move it to the alternating module. The alternating module transports the tray to the first position, and the other group of trays on the alternating module moves to the loading position, and the tray clamping assembly 110 continues to place the tray in another group of tray placement positions.

[0080] When the tray 10 moves to the first position and the test fixture 20 moves to the second position, the sorting module starts to work, and the nozzle on the sorting module sucks the chips in the tray 10. After passing through the visual inspection module, the defective products are thrown into the waste box, and the good products are placed in the acupoints of the test fixture 20. After the acupoints on the test fixture 20 are full, the fixture carrier unit 210 pushes the test fixture into the receiving fixture box 2, and the full test fixture 20 is manually taken away from the fixture lifting unit 230 to proceed to the next step.

[0081] After the chips on the tray 10 at the first position on the alternating module are emptied, the other tray 10 waiting to be full on the alternating module moves to the first position to continue feeding, and the empty tray 10 moves to a suitable position, and the tray clamping assembly takes away the empty tray 10 and puts it into the recycling bin 1. When there is no material in the feeding bin 1, the electric cylinder of the tray lifting unit drops to the lowest position, and the two sets of bin doors are opened manually, and the full tray is put back in and the empty tray is taken away.

[0082] When placing the small material tray 108 in the material tray 10, the small material tray 108 is tilted at a certain angle and inserted under the pressing member 106. At the other diagonal position, the elastic member 107 is manually pushed in the opposite direction. When the small material tray 108 enters the material tray 10 and is placed under the pressing member 106, the elastic member 107 is released to push the small material tray 108. After stacking multiple groups of material trays 10, they are pushed into the loading bin 1 together.

[0083] When the chip needs to be transported in the reverse direction, the tray in the loading bin 1 is replaced with an empty tray 10, and the loading jig box 2 is replaced with a test jig 20 with material, and the remaining steps are the same as above.

[0084] The chip sorting equipment can not only take the material out of the material tray 10 and put it into the test fixture 20, but also move the material from the test fixture 20 to the material tray 10, thereby enhancing the functionality of the equipment. In addition, different material trays can be compatible in a set of fixtures, which can realize fast line change, improve production efficiency, and improve processing accuracy.

[0085] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other. In addition, the different parts between the various embodiments can also be used in combination with each other, and the present invention is not limited to this.

[0086] The above description is only a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any changes or modifications made by a person skilled in the art in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A chip sorting device, characterized in that: include: A material tray, wherein the material tray is provided with a plurality of chip placement slots for placing chips; A test fixture, wherein the test fixture is provided with a plurality of chip placement positions for placing chips; A conveying device is used to convey the chips in the tray to the test fixture in a forward direction or to convey the chips in the test fixture to the tray in a reverse direction.

2. The chip sorting device according to claim 1, characterized in that: The conveying device includes a jig conveying module, and the jig conveying module includes a jig lifting unit and a carrying unit. The jig lifting unit and the carrying unit cooperate with each other to move the test jig.

3. The chip sorting device according to claim 2, characterized in that: The jig conveying module also includes a slide rail, which connects the jig lifting unit and the carrying unit. The carrying unit can slide on the slide rail, and the test jig is located above the lifting unit. The carrying unit includes a jig clamping assembly and a support assembly. The support assembly is located on both sides of the slide rail, and the jig clamping assembly is located in the middle of the support assembly for slidingly clamping the test jig to the support assembly.

4. The chip sorting device according to claim 3, characterized in that: The carrying unit further includes a pressing member, which is located on the supporting assembly and is used to press and fix the test fixture.

5. The chip sorting device according to claim 3, characterized in that: The test fixtures are stacked in a fixture box in groups. The fixture lifting unit includes a placement table and a lifting drive assembly. The fixture box is located above the placement table. The lifting drive assembly is used to control the lifting height of the placement table.

6. The chip sorting device according to claim 5, characterized in that: The fixture clamping assembly includes a sensing element, and the sensing element is used to sense whether the test fixture exists in a corresponding position of the fixture box.

7. The chip sorting device according to claim 1, characterized in that: The conveying device also includes a tray conveying module, which includes a tray clamping assembly and an alternating module. The tray clamping assembly is used to transport the tray to the alternating module in a forward direction or to transport the tray out of the alternating module in a reverse direction.

8. The chip sorting device according to claim 4, characterized in that: The alternating module includes at least two independent tray placement components.

9. The chip sorting device according to claim 1, characterized in that: The conveying device also includes a sorting device, which includes a detection component and a sorting clamping component. The detection component is used to detect chips, and the sorting clamping component is used to clamp the chips in the tray or the test fixture for detection according to the conveying direction of the chips, and place the qualified chips on the test fixture or the tray.

10. The chip sorting device according to claim 1, characterized in that: The material tray comprises at least one material tray position, and the material tray position is used to fix a small material tray.

11. The chip sorting device according to claim 10, characterized in that: A pressing piece is provided at one corner of the material tray, and an elastic piece is provided at the diagonal position of the pressing piece, and the elastic piece generates an elastic force toward the pressing piece.

12. The chip sorting device according to claim 10, characterized in that: The at least two material tray positions can be suitable for fixing different material trays.

13. A chip sorting method, applied to the chip sorting equipment, comprising a tray, a test fixture and a conveying device, characterized in that: include: The conveying device moves the material tray with material and the test fixture with empty material to the first position respectively, and after the qualified chips in the material tray are detected and screened by the sorting device, the qualified chips are placed on the test fixture, and the test fixture after placement is moved to the next station, or, The conveying device moves the empty material tray and the test fixture with material to the first position respectively, and after the qualified chips in the test fixture are detected and screened out by the sorting device, the qualified chips are placed on the material tray, and the placed material tray is moved to the next station.

14. The chip sorting method according to claim 13, characterized in that: Moving the tray with material or empty material to the appropriate position includes: clamping the tray in the loading bin to the tray placement component of the alternating module located at the loading position, and multiple groups of the tray placement components are moved alternately between the loading position and the first position.

15. The chip sorting method according to claim 14, characterized in that: The material tray that is clamped and moved back to the loading position is moved to the recovery bin until the material tray in the loading bin is emptied, the material tray in the recovery bin is taken out and a new material tray is placed in the loading bin.

16. The chip sorting method according to claim 13, characterized in that: Moving the empty or loaded test fixture to a suitable position includes: clamping the test fixture to a carrier assembly, and controlling the carrier assembly to move to a second position.

17. The chip sorting method according to claim 16, characterized in that: The clamping of the test jig includes: controlling the test jig to rise and fall to a suitable height, and after the jig clamping component senses the presence of material, clamping the test jig to the carrying component and pressing and fixing it.

18. The chip sorting method according to claim 15, characterized in that: After the chips in the test jig are filled or the chips in the test jig are removed, the carrier unit pushes the full jig or the empty jig into the jig recovery box for temporary storage.

19. The chip sorting method according to claim 13, characterized in that: Fixing the small tray on the tray includes: placing a corner of the small tray into a clamping piece corresponding to a corner of the tray placement position, and releasing an elastic piece at the opposite corner of the clamping piece to fix and clamp the small tray.

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