Wafer turnover device and wafer degumming and inserting integrated equipment

Abstract

The invention provides a wafer turnover device and wafer degumming and inserting integrated equipment, belongs to the technical field of wafer processing, and solves the problem of low wafer turnover speed in the prior art. The device comprises a material frame, the fixing assembly comprises a fixing part which is arranged on the material frame and is used for fixing the wafer; the supporting assembly comprises at least two supporting pieces, the supporting pieces are movably arranged below the fixing piece, a supporting gap with an adjustable interval is formed between the at least two supporting pieces, and the supporting gap allows the wafer to be accommodated or allows the wafer to pass through; the first guide piece acts on the supporting piece so that the supporting piece can at least have the moving freedom degree in the first direction, and the first direction is not parallel to the vertical plane. The supporting piece can move in the first direction, so that the size of the supporting gap is adjusted to execute the operation of releasing the wafer or supporting the wafer, and the turnover speed of the wafer can be remarkably increased.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer processing, and in particular relates to a wafer turnover device and a wafer debonding and wafer inserting integrated equipment. Background Art

[0002] At present, a semi-automatic material frame is widely used in the wafer slicing cleaning workshop of the photovoltaic industry. The semi-automatic material frame is mainly composed of a fixed sponge rod, a bottom wafer support rod and a material frame body.

[0003] However, the existing semi-automatic material frame is loaded with wafers and then goes through the debonding and inserting process. After the debonding is completed, special equipment is required to take and insert wafers from the material frame. After the inserting is completed, the material frame is transported back to the special equipment for the next loading process. That is, the entire loading process is carried out on special equipment, and a long line is required to transport the material frame, resulting in a low turnover rate of the wafers.

[0004] Based on the above content, the technical problem to be solved by this application is: how to increase the turnover speed of the wafer turnover device. Summary of the invention

[0005] The purpose of the present invention is to solve the above problems existing in the prior art and propose a wafer turnover device and a wafer debonding and inserting integrated device, which solves the problem of low turnover speed of the wafer turnover device in the prior art. The technical effect of the present application scheme is to improve the turnover speed of the wafer turnover device.

[0006] The objective of the present invention can be achieved through the following technical solutions: a wafer turnover device, comprising a material frame; a fixing assembly, the fixing assembly comprising: a fixing member, the fixing member is arranged on the material frame and is used to fix the wafer; and a supporting assembly, the supporting assembly comprising: a supporting member, the supporting member is movably arranged below the fixing member and the supporting members are at least two, a supporting gap with adjustable spacing is formed between at least two of the supporting members, the supporting gap allows the wafer to be accommodated or passed through; a first guide member, the first guide member acts on the supporting member so that the supporting member has at least the freedom of movement along a first direction, and the first direction is not parallel to the vertical plane.

[0007] In the above-mentioned wafer turnover device, the first guide member is a guide groove or a guide block, and the first guide member includes: a first accommodating position, the first accommodating position is used to accommodate the support member when it is in the minimum support gap; a second accommodating position, the second accommodating position is used to accommodate the support member when it is in the maximum support gap; wherein, the first accommodating position is arranged obliquely above the second accommodating position.

[0008] In the above-mentioned wafer turnover device, an adjustment area is provided below the support member, the adjustment area is used to accommodate the adjustment member, and the adjustment area allows the adjustment member to be accommodated / removed so that the support member can be moved and switched between the first accommodating position and the second accommodating position.

[0009] In the above-mentioned wafer turnover device, the fixing member is movably arranged on the material frame and there are at least two fixing members, and a fixed gap with an adjustable spacing is formed between at least two of the fixing members, and the fixed gap allows the wafer to be accommodated or passed through;

[0010] The fixing assembly further comprises a second guide member, which acts on the fixing member so that the fixing member has at least a degree of freedom of movement along a second direction, and the second direction is not parallel to the vertical plane.

[0011] In the above-mentioned wafer turnover device, the second guide member is a guide groove or a guide block, and the second guide member includes: a third accommodating position, the third accommodating position is used to accommodate the fixing member when it is in the maximum fixed gap; a fourth accommodating position, the fourth accommodating position is used to accommodate the fixing member when it is in the minimum fixed gap; wherein, the third accommodating position is arranged obliquely above the fourth accommodating position.

[0012] In the above-mentioned chip turnover device, the fixing component also includes a check mechanism, which includes: a limit member, which is arranged on one side of the third accommodating position and has freedom of movement; an elastic member, which is connected to the limit member and acts on the limit member so that the limit member always has a tendency to move in the direction close to the third accommodating position.

[0013] In the above-mentioned wafer turnover device, the second guide member further includes a limiting portion, the limiting portion is arranged between the third accommodating position and the fourth accommodating position, and the minimum distance between the limiting portion and the limiting member is smaller than the outer diameter of the fixing member.

[0014] The above-mentioned wafer turnover device also includes a force-bearing component, which includes: a force-bearing member, which is arranged above the fixing member and acts on the fixing member, and is used to bear the gravity of the wafer support and act on the fixing member; a reset member, which is arranged below the force-bearing member, and the reset member is elastic so that the force-bearing member always has a tendency to reset upward.

[0015] In the above-mentioned wafer turnover device, a positioning portion is further provided on the material frame, and the positioning portion is used to connect and position the wafer tray.

[0016] In the above-mentioned wafer turnover device, the supporting member includes a supporting roller, and the supporting roller passes through the first guide member; and / or the fixing member includes a fixing roller, and the fixing roller passes through the second guide member.

[0017] Another object of the present application is to provide a wafer debonding and wafer inserting integrated equipment, including a debonding machine, a wafer inserting machine and the above-mentioned wafer turnover device.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The present application guides the support member by setting a first guide member, and the support member can move along the first direction, so as to adjust the size of the support gap to adapt to different working conditions, and perform the operation of releasing the wafer or supporting the wafer. There is no need to configure a complex line body on the side of the material frame to perform redundant material removal operations, and the turnover speed of the wafer can be significantly improved;

[0020] 2. The present application provides an adjustment area below the support member, in which the adjustment member can be accommodated. After the adjustment member is placed, the support member can be pressed and moved along the first direction, thereby eliminating the need to consume a large amount of driving force, thereby achieving position switching of the support member, simplifying the support and release process of the wafer, and after the adjustment member is fixed, its stability is higher than that of the driving mechanism;

[0021] 3. The present application provides a second guide member to guide the fixing member to move, and the fixing member can move along the second direction, so as to adjust the size of the fixing gap to adapt to different working conditions, perform the operation of releasing or fixing the wafer, and avoid the wafer from being stuck with the fixing member when passing through, thereby reducing the wafer damage rate, and because the fixing gap is adjustable, the fixing member has higher clamping stability when fixing the wafer;

[0022] 4. The present application sets a non-return mechanism to ensure that when the wafer is put into the material frame, the fixed gap can maintain the maximum value unchanged, further preventing the wafer from getting stuck, reducing the wafer damage rate during the turnover process, and during the wafer turnover process, the fixing part can be limited from being affected by other operating parts and moving upward, so that the fixing part has better clamping stability;

[0023] 5. By arranging a force-bearing member above the fixing member, the present application allows the gravity of the crystal tray to be transferred from the force-bearing member to the fixing member, thereby preventing the crystal tray from directly acting on the fixing member and causing wear;

[0024] 6. The present application provides a positioning portion on the material frame to facilitate the lowering and installation of the crystal tray and the connection and positioning with the material frame, thereby improving the force-bearing accuracy of the force-bearing component. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a three-dimensional structural schematic diagram of the first embodiment of the wafer turnover device of the present application;

[0026] Figure 2 yes Figure 1 a schematic elevation view of the structure shown;

[0027] Figure 3 yes Figure 2 Schematic diagram after hiding part of the structure;

[0028] Figure 4 It is a structural schematic diagram of the first guide member of the wafer turnover device of the present application;

[0029] Figure 5 It is a three-dimensional structural schematic diagram of the second embodiment of the wafer turnover device of the present application;

[0030] Figure 6 yes Figure 5 a schematic elevation view of the structure shown;

[0031] Figure 7 yes Figure 6 The schematic diagram of the structure shown after the adjustment member is configured;

[0032] Figure 8 It is a structural schematic diagram of the second guide member of the wafer turnover device of the present application;

[0033] In the figure, 100, material frame; 110, material storage space; 120, positioning part; 200, fixing assembly; 210, fixing member; 211, fixing gap; 201, fixing roller; 220, second guide member; 221, third accommodating position; 222, fourth accommodating position; 223, limiting part; 230, non-return mechanism; 231, limiting member; 232, elastic member; 300, supporting assembly; 310, supporting member; 311, supporting gap; 312, adjusting area; 313, adjusting member; 301, supporting roller; 320, first guide member; 321, first accommodating position; 322, second accommodating position; 400, force-bearing assembly; 410, force-bearing member; 420, reset member. DETAILED DESCRIPTION

[0034] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0035] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0037] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0039] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only embodiment.

[0040] Please refer to the attached drawings in the instruction manual. Figure 1-Figure 3 The present application includes a material frame 100, a fixing assembly 200 and a support assembly 300. The fixing assembly 200 includes a fixing member 210. The fixing member 210 is arranged on the material frame 100 and is used to fix the wafer. The support assembly 300 includes a support member 310 and a first guide member 320. The support member 310 is movably arranged below the fixing member 210 and there are at least two support members 310. A support gap 311 with an adjustable spacing is formed between at least two support members 310. The support gap 311 allows the wafer to be accommodated or passed through. The first guide member 320 acts on the support member 310 so that the support member 310 has at least the freedom of movement along a first direction, and the first direction is not parallel to the vertical plane.

[0041] Exemplarily, the material frame 100 is generally in the shape of a rectangular parallelepiped, and a material storage space 110 is formed in the material frame 100. The material storage space 110 is used to accommodate the wafer. A fixing member 210 is provided in the upper region of the material frame 100. The shape of the fixing member 210 is not limited to a roller, an arc strip, a block, etc., and only needs to be able to clamp and fix the wafer in the material storage space 110. In addition, in addition to fixing the wafer by clamping, in other embodiments, it can also be fixed by vacuum adsorption, which will not be described here. The lower area of ​​the material frame 100 is provided with a support assembly 300, and the support assembly 300 includes a plurality of support members 310, and a plurality of support points are formed in the material storage space 110 by the plurality of support members 310, so as to jointly support the bottom of the wafer, and the plurality of support members 310 are relatively movablely arranged with the material frame 100, and illustratively, the support members 310 and the material frame 100 are slidably connected or hinged, and a support gap 311 is formed between the plurality of support members 310, and since the support members 310 are movable, the support gap 311 can be adjusted accordingly. When the support gap 311 is configured to be smaller than the minimum outer diameter of the wafer, the plurality of support members 310 jointly act on the wafer to support it; and when the support gap 311 is configured to be larger than the maximum outer diameter of the wafer, the wafer can pass through, thereby quickly releasing the wafer, and there is no need to configure a complex line body on the side of the material frame 100 for material extraction, that is, the equipment size is optimized, the floor space is reduced, and there is no need to perform additional material extraction operations, and the turnover speed of the wafer can be significantly improved. By providing the first guide member 320 to guide the support member 310, the support member 310 can move along the first direction, thereby adjusting the size of the support gap 311 to adapt to different working conditions. The first direction is defined as not parallel to the vertical plane, that is, the first direction is not limited to the inclined upward or inclined downward or horizontal direction.

[0042] See also Figure 4 In some embodiments, the first guide member 320 is a guide groove or a guide block, and the first guide member 320 includes: a first accommodating position 321 and a second accommodating position 322, the first accommodating position 321 is used to accommodate the support member 310 when it is in the minimum support gap 311, and the second accommodating position 322 is used to accommodate the support member 310 when it is in the maximum support gap 311; wherein the first accommodating position 321 is arranged obliquely above the second accommodating position 322.

[0043] Exemplarily, when the first guide member 320 is a guide groove, at least a portion of the support member 310 can be accommodated in the guide groove. When the first guide member 320 is a guide block, at least a portion of the support member 310 can be accommodated on the guide block. In some embodiments, the guide block may need to cooperate with a limit block to limit the support member 310, which will not be elaborated here. Further, the first guide member 320 specifically includes a first accommodation position 321 and a second accommodation position 322. Exemplarily, the first accommodating position 321 can be configured to be located at a higher point of the material frame 100 and a near point closer to the center of the material frame 100, and correspondingly, the second accommodating position 322 is configured to be located at a lower point of the material frame 100 and a far point closer to the center of the material frame 100, so that a height difference is formed between the first accommodating position 321 and the second accommodating position 322, and the first accommodating position 321 and the second accommodating position 322 are connected in an inclined shape, thereby guiding the support member 310 to move upward or downward. When each support member 310 enters the corresponding first accommodating position 321, the support gap 311 between the support members 310 is at a minimum value. Conversely, when each support member 310 enters the corresponding second accommodating position 322, the support gap 311 between the support members 310 is at a maximum value, thereby achieving support and release of the chip. In addition, the contour shape of the first guide member 320 in the first accommodating position 321 and the second accommodating position 322 can be adapted to the outer contour of the support member 310. For example, if the outer contour of the support member 310 is circular or elliptical, the contour of the first guide member 320 in the first accommodating position 321 and the second accommodating position 322 is also circular or elliptical.

[0044] See also Figures 2 to 4 In some embodiments, an adjustment area 312 is provided below the support member 310 , and the adjustment area 312 is used to accommodate the adjustment member 313 . The adjustment area 312 allows the adjustment member 313 to be accommodated / removed so that the support member 310 can be moved and switched between the first accommodating position 321 and the second accommodating position 322 .

[0045] It is understandable that, although the support member 310 has the freedom of movement and can be driven to move by some external driving mechanism such as an electric cylinder, a pneumatic cylinder or a hydraulic cylinder, it requires continuous consumption of driving force. Preferably, an adjustment area 312 is provided below the support member 310, in which the adjustment member 313 can be accommodated. The adjustment member 313 can be in the shape of a plate or a block. When the adjustment member 313 is provided in the adjustment area 312, the bottom of the support member 310 can be against the adjustment member 313. Since the support member 310 is pressed upward by the adjustment member 313, its position can be configured in the first accommodation position 321. When the adjustment member 313 is removed from the adjustment area 312, the support member 310 is not pressed by the adjustment member 313 and can fall back to the second accommodation position 322 due to its own gravity. With this arrangement, there is no need to consume a large amount of driving force, that is, energy is saved, and the position switching of the support member 310 is realized, so that the support and release of the chip can be adjusted. Moreover, after the adjustment member 313 is fixed, its stability is higher than that of the driving mechanism.

[0046] Reference Figure 1 and Figure 3 In some embodiments, the support member 310 includes a support roller 301, and the support roller 301 passes through the first guide member 320. It can be understood that the support roller 301 can provide multiple support points for the wafer along its length direction, and two support rollers 301 can support multiple wafers at the same time. It should be noted that the support roller 301 passes through the first guide member 320, which can bring about the effect of facilitating the support roller 301 to be subjected to force, such as upward pressure from the adjustment member 313, and facilitating the force movement to adjust the support gap 311.

[0047] Reference Figure 5 and Figure 8 In some embodiments, the fixing member 210 includes a fixing roller 201, and the fixing roller 201 passes through the second guide member 220. Similarly, the fixing roller 201 can provide multiple clamping points for the wafer along its length direction, and two fixing rollers 201 can clamp multiple wafers at the same time. Furthermore, a flexible member such as a sponge is provided on the fixing roller 201, and the part of the wafer that contacts the sponge can extend into the sponge by relying on its elastic properties, thereby obtaining a better protection effect and preventing the wafer from being damaged. The fixing roller 201 passes through the second guide member 220, which can bring about the effect of facilitating the fixing roller 201 to be subjected to force, such as grabbing and lifting from an external manipulator, and facilitating the force movement to adjust the fixed gap 211.

[0048] In some embodiments, Figure 1 and Figure 2As shown, the fixing member 210 is arranged on the material frame 100 and there are at least two fixing members 210, and a fixed gap 211 with adjustable spacing is formed between at least two fixing members 210, and the fixed gap 211 allows the wafer to be accommodated or passed through. Exemplarily, the fixing assembly 200 can be connected to the material frame 100 by screws (not shown), and a plurality of installation stations are arranged on the material frame 100 for each fixing member 210 to adjust the installation position, so that the fixed gap 211 between the fixing members 210 is adjustable. It should be noted that this adjustment method requires the wafer size to be determined before operation, so as to perform adaptive adjustment.

[0049] In some embodiments, Figures 5 to 8 As shown, the fixing member 210 is movably arranged on the material frame 100 and there are at least two fixing members 210, and a fixed gap 211 with adjustable spacing is formed between at least two fixing members 210, and the fixed gap 211 allows the wafer to be accommodated or passed through; the fixing assembly 200 also includes a second guide member 220, and the second guide member 220 acts on the fixing member 210 so that the fixing member 210 has at least a degree of freedom of movement along the second direction, and the second direction is not parallel to the vertical plane. It can be understood that by configuring multiple fixing members 210, a force can be applied to the wafer in multiple directions, and the clamping stability is higher. Since the multiple fixing members 210 and the material frame 100 are movably connected, the fixed gap 211 formed between the multiple fixing members 210 is adjustable. When the fixed gap 211 is greater than the maximum outer diameter of the wafer, the wafer is allowed to enter the material storage space 110 of the material frame 100, and then the wafer can be against the support member 310. After the wafer passes, the fixing member 210 can be moved to reduce the fixed gap 211, so as to clamp and fix the wafer. By additionally providing a second guide member 220 to guide the movement of the fixing member 210, the fixing member 210 can move along the second direction, thereby adjusting the size of the fixing gap 211 to adapt to different working conditions. The second direction is defined as not being parallel to the vertical plane, that is, the second direction is not limited to being inclined upward or downward or horizontal.

[0050] Continue to refer to Figure 5 and Figure 6 In some embodiments, a force-bearing component 400 is further included. The force-bearing component 400 includes: a force-bearing member 410 and a resetting member 420. The force-bearing member 410 is arranged above the fixing member 210 and acts on the fixing member 210 to bear the gravity of the crystal holder and apply force to the fixing member 210. The resetting member 420 is arranged below the force-bearing member 410, and the resetting member 420 is elastic so that the force-bearing member 410 always has a tendency to reset upward.

[0051] It is understandable that by arranging the force-bearing member 410 above the fixing member 210, when working, the crystal tray with the wafer bonded thereto is placed vertically downward so that the bottom of the crystal tray rests against the force-bearing member 410, so that the gravity of the crystal tray can be transmitted from the force-bearing member 410 to the fixing member 210, thereby preventing the crystal tray from directly acting on the fixing member 210 and causing wear, and the shape of the force-bearing member 410 can be customized according to the shape of the crystal tray. For example, the top of the force-bearing member 410 is in the shape of a long strip or a plane. In addition, the reset member 420 can be a spring. When the force-bearing member 410 is subjected to the gravity of the crystal tray, the reset member 420 is compressed. When the force-bearing member 410 is no longer subjected to the gravity of the crystal tray, the reset member 420 can reset the force-bearing member 410.

[0052] See also Figure 8 In some embodiments, the second guide member 220 is a guide groove or a guide block, and the second guide member 220 includes: a third accommodating position 221 and a fourth accommodating position 222, the third accommodating position 221 is used to accommodate the fixing member 210 when it is in the maximum fixed gap 211, and the fourth accommodating position 222 is used to accommodate the fixing member 210 when it is in the minimum fixed gap 211; wherein the third accommodating position 221 is arranged obliquely above the fourth accommodating position 222.

[0053] Exemplarily, when the second guide member 220 is a guide groove, at least a portion of the fixing member 210 can be accommodated in the guide groove, and when the first guide member 320 is a guide block, at least a portion of the fixing member 210 can be accommodated on the guide block. In some embodiments, the guide block may need to cooperate with the limit block to limit the fixing member 210, which will not be elaborated here. Further, the second guide member 220 specifically includes a third accommodation position 221 and a fourth accommodation position 222. Exemplarily, the third accommodating position 221 can be configured to be located at a higher point of the material frame 100 and a farther point closer to the center of the material frame 100, and correspondingly, the fourth accommodating position 222 is configured to be located at a lower point of the material frame 100 and a closer point to the center of the material frame 100, so that a height difference is formed between the third accommodating position 221 and the fourth accommodating position 222, and the third accommodating position 221 and the fourth accommodating position 222 are connected in an inclined shape, thereby guiding the fixing member 210 to move upward or downward. When each fixing member 210 enters the corresponding third accommodating position 221, the fixed gap 211 between the fixing members 210 is at a maximum value. Conversely, when each fixing member 210 enters the corresponding fourth accommodating position 222, the fixed gap 211 between the fixing members 210 is at a minimum value, thereby achieving the release and clamping of the chip. In addition, the contour shape of the second guide member 220 in the third accommodating position 221 and the fourth accommodating position 222 can be adapted to the outer contour of the fixing member 210. If the outer contour of the fixing member 210 is circular or elliptical, the contour of the second guide member 220 in the third accommodating position 221 and the fourth accommodating position 222 is also circular or elliptical.

[0054] See also Figure 5 and Figure 6 In some embodiments, a positioning portion 120 is further provided on the material frame 100, and the positioning portion 120 is used to connect and position the crystal tray. It can be understood that by providing the positioning portion 120 on the material frame 100, the positioning portion can be in a convex shape or a concave shape, and the portion thereof abutting against the crystal tray cooperates with each other, so as to facilitate the installation of the crystal tray and the connection and positioning with the material frame 100, and improve the force-bearing accuracy of the force-bearing component 400. Exemplarily, the height of the portion of the positioning portion 120 protruding from the material frame 100 is substantially the same as the height difference between the third accommodation position 221 and the fourth accommodation position 222. With such a configuration, the position of the fixing member 210 can be quantitatively switched according to the downward pressure of the crystal tray.

[0055] like Figure 8 As shown, in some embodiments, the fixing assembly 200 further includes a check mechanism 230, which includes a stopper 231 and an elastic member 232. The stopper 231 is disposed on one side of the third accommodation position 221, and the stopper 231 has a degree of freedom of movement. The elastic member 232 is connected to the stopper 231, and the elastic member 232 acts on the stopper 231 so that the stopper 231 always has a tendency to move in a direction close to the third accommodation position 221. It can be understood that the check mechanism 230 is used to ensure that when the wafer is put into the material frame 100, the fixed gap can maintain a maximum value unchanged, prevent the wafer from being stuck during the input, and reduce the wafer damage rate during the turnover process. In addition, when the fixing member 210 is located at the fourth accommodation position 222 during the wafer turnover process, the fixing member 210 can be limited from being affected by other operating components and moving upward, so that the fixing member 210 has better clamping stability. In some embodiments, a first portion of a limit member 231 of the non-return mechanism 230 is hinged to the material frame 100, and a second portion of the limit member 231 is abutted against a side of the fixing member 210 in the length direction. Before the wafer is inserted, the initial position of the fixing member 210 is located at the third accommodation position 221 of the second guide member 220. During the wafer insertion process, the weight of the crystal support acts on the force-bearing component to press the fixing member 210 downward, overcoming the elastic member 232 so that the fixing member 210 reaches the fourth accommodation position 222; after debonding, the crystal support is removed, and the elastic member 232 limits the fixing member 210 in the fourth accommodation position 222; during the wafer insertion stage, an external robot grabs and lifts the fixing member 210, so that the fixing member 210 overcomes the elastic member 232 and is reset to the third accommodation position 221, thereby releasing the wafer.

[0056] Specifically, during the insertion stage, the fixing member 210 is grasped and lifted by an external robot arm, so that the fixing member 210 moves upward along the trajectory of the second guide member 220 to overcome the elastic force transmitted by the second part of the limiting member 231 until the fixing member 210 enters the third accommodating position 221. The limiting member 231 presses the fixing member 210 under the elastic force of the elastic member 232, so that the fixing member 210 is maintained in the third accommodating position 221, and the fixed gap 211 between the fixing members 210 is at the maximum value, and the chip can smoothly enter the material frame 100. When the chip completely passes through the fixed gap 211, the crystal support (not shown) above the chip can act on the fixing member 210 through gravity, so that the fixing member 210 overcomes the elastic force of the elastic member 232 and moves to the fourth accommodating position 222.

[0057] Continue to refer to Figure 8 In some embodiments, the second guide member 220 further includes a limiting portion 223, which is disposed between the third accommodating position 221 and the fourth accommodating position 222, and a minimum distance between the limiting portion 223 and the limiting member 231 is smaller than an outer diameter of the fixing member 210.

[0058] It can be understood that the role of the limiting portion 223 is to limit the movement of the fixing member 210 between the third accommodating position 221 and the fourth accommodating position 222. If the fixing member 210 needs to switch between the third accommodating position 221 and the fourth accommodating position 222, it is necessary to use the lifting force of an external manipulator (not shown) or the gravity of the crystal support (not shown) to overcome the elastic force of the elastic member 232 and perform the corresponding switching operation.

[0059] The integrated chip debonding and chip inserting device (not shown) of the present invention comprises a debonding machine (not shown), a chip inserting machine (not shown) and a chip turnover device. The debonding machine is used to perform debonding processing on the chips in the material frame 100, and the chip inserting machine is used to insert the chips. The working process of the integrated chip debonding and chip inserting device of the present invention is as follows:

[0060] S100, positioning the material frame: the material frame 100 of the present invention is generally placed in a water tank (not shown) for operation, and an adjusting member 313 needs to be installed in the water tank to position the material frame 100 and the water tank, and to keep the support gap 311 formed by the two support members 310 at a minimum value, so as to support the wafer;

[0061] S200, loading wafers: After the crystal rod is cut into wafers, the wafer tray with the wafers attached is loaded into the material frame 100. At this time, the material frame 100 drives the force-bearing member 410 to move downward with the help of the downward pressure of the wafer tray. The downward movement of the force-bearing member 410 drives the fixing member 210 to move along the track groove of the second guide member 220. The position of the fixing member 210 is switched from the third accommodating position 221 to the fourth accommodating position 222, thereby realizing automatic clamping of the wafer.

[0062] S300, wafer debonding: the material frame with the wafer enters the debonding machine for debonding. After the debonding is completed, the fixing member 210 is still maintained at the fourth accommodation position 222 to clamp the wafer in a vertical state, and the wafer tray can be removed;

[0063] S400, releasing the chip: the material frame robot in the chip inserting machine hooks the fixing part 210 and moves the material frame 100 to the chip inserting slot. Because there is no adjusting part 313 in the slot, after the chip is placed on the synchronous belt in the slot, the support part 310 slides to the second accommodation position 322 along the track groove of the first guide part 320 under the action of gravity, and then the robot presses down the fixing part 210 to press the chip, and the hook hooks the fixing part 210 to expand the fixed gap 211 between the fixing parts 210 and lifts the empty material frame. The synchronous belt inside the chip inserting slot clamps the chip, and the material frame robot is retracted, and the material frame 100 is transported back to the water tank.

[0064] Beneficial effects:

[0065] The present application guides the support member 310 by setting a first guide member 320, and the support member 310 can move along the first direction, thereby adjusting the size of the support gap 311 to adapt to different working conditions, and performing the operation of releasing the wafer or supporting the wafer. There is no need to configure a complex line body on the side of the material frame 100 to perform unnecessary material picking operations, and the turnover speed of the wafer can be significantly improved; by setting an adjustment area 312 below the support member 310, the adjustment member 313 can be accommodated in the adjustment area 312, and after the adjustment member 313 is installed, the support member 310 can be pressed and moved along the first direction, thereby eliminating the need to consume a large amount of driving force, that is, the position switching of the support member 310 is realized, so that the support and release process of the wafer is simplified, and the stability of the adjustment member 313 after being fixed is higher than that of the driving mechanism; by setting a second guide member 220 to guide the movement of the fixing member 210, the fixing member 210 can move along the second direction, thereby adjusting the size of the fixed gap 211 to adapt to different working conditions. Under the same working conditions, the operation of releasing or fixing the wafer is performed to avoid the wafer from getting stuck with the fixing part 210 when passing through, thereby reducing the wafer damage rate, and because the fixing gap 211 is adjustable, the fixing part 210 has higher clamping stability when fixing the wafer; by setting the non-return mechanism 230 to ensure that when the wafer is put into the material frame 100, the fixing gap 211 can maintain the maximum value unchanged, further preventing the wafer from getting stuck, reducing the wafer damage rate during the turnover process, and during the wafer turnover process, the fixing part 210 can be limited to move upward due to the influence of other operating parts, so that the fixing part 210 has better clamping stability; by setting the force-bearing part 410 above the fixing part 210, the gravity of the crystal tray can be transmitted from the force-bearing part 410 to the fixing part 210, avoiding the crystal tray directly acting on the fixing part 210 and causing wear; by setting the positioning part 120 on the material frame 100, it is convenient to lower the crystal tray for installation and connect and position it with the material frame 100, and the force accuracy of the force-bearing component 400 can be improved.

[0066] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

Claims

1. A wafer turnover device, characterized in that: include: Material frame (100); A fixing assembly (200), the fixing assembly (200) comprising: A fixing member (210), the fixing member (210) being arranged on the material frame (100) and used for fixing the wafer; and A support assembly (300), the support assembly (300) comprising: A support member (310), the support member (310) being movably disposed below the fixing member (210), and there being at least two support members (310), a support gap (311) with an adjustable spacing being formed between the at least two support members (310), the support gap (311) allowing a wafer to be accommodated or passed through; A first guide member (320), the first guide member (320) acts on the support member (310) so that the support member (310) has at least the freedom of movement along a first direction, and the first direction is not parallel to the vertical plane.

2. The wafer turnover device according to claim 1, characterized in that: The first guide member (320) is a guide groove or a guide block, and the first guide member (320) comprises: A first accommodating position (321), the first accommodating position (321) being used to accommodate the support member (310) when the support gap (311) is at a minimum; A second accommodating position (322), the second accommodating position (322) being used to accommodate the support member (310) when the support gap (311) is at a maximum; Wherein, the first accommodating position (321) is arranged obliquely above the second accommodating position (322).

3. The wafer turnover device according to claim 2, characterized in that: An adjustment area (312) is provided below the support member (310), and the adjustment area (312) is used to accommodate the adjustment member (313). The adjustment area (312) allows the adjustment member (313) to be accommodated / removed so that the support member (310) can be moved and switched between a first accommodating position (321) and a second accommodating position (322).

4. The wafer turnover device according to claim 1, characterized in that: The fixing member (210) is movably arranged on the material frame (100), and there are at least two fixing members (210), and a fixed gap (211) with an adjustable spacing is formed between the at least two fixing members (210), and the fixed gap (211) allows a wafer to be accommodated or passed through; The fixing assembly (200) further comprises a second guide member (220), wherein the second guide member (220) acts on the fixing member (210) so that the fixing member (210) has at least a degree of freedom of movement along a second direction, wherein the second direction is not parallel to the vertical plane.

5. The wafer turnover device according to claim 4, characterized in that: The second guide member (220) is a guide groove or a guide block, and the second guide member (220) comprises: a third accommodating position (221), the third accommodating position (221) being used to accommodate the fixing member (210) when the fixing gap (211) is at a maximum; a fourth accommodating position (222), the fourth accommodating position (222) being used to accommodate the fixing member (210) when the fixing gap (211) is at a minimum; Wherein, the third accommodating position (221) is arranged obliquely above the fourth accommodating position (222).

6. The wafer turnover device according to claim 5, characterized in that: The fixing assembly (200) further comprises a non-return mechanism (230), wherein the non-return mechanism (230) comprises: A limiting member (231), the limiting member (231) being arranged on one side of the third accommodating position (221), and the limiting member (231) having a degree of freedom of movement; An elastic member (232), the elastic member (232) being connected to the limiting member (231), the elastic member (232) acting on the limiting member (231) so that the limiting member (231) always has a tendency to move in a direction close to the third accommodating position (221).

7. The wafer turnover device according to claim 6, characterized in that: The second guide member (220) further comprises a limiting portion (223), wherein the limiting portion (223) is arranged between the third accommodating position (221) and the fourth accommodating position (222), and the minimum distance between the limiting portion (223) and the limiting member (231) is smaller than the outer diameter of the fixing member (210).

8. The wafer turnover device according to claim 1, characterized in that: It also includes a force-bearing component (400), wherein the force-bearing component (400) includes: A force-bearing member (410), the force-bearing member (410) being disposed above the fixing member (210) and acting on the fixing member (210), the force-bearing member (410) being used to bear the gravity of the crystal holder and act on the fixing member (210); A reset member (420), wherein the reset member (420) is arranged below the force-bearing member (410), and the reset member (420) is elastic so that the force-bearing member (410) always has a tendency to reset upwards.

9. The wafer turnover device according to claim 1, characterized in that: The material frame (100) is also provided with a positioning portion (120), and the positioning portion (120) is used to position the crystal tray.

10. A wafer debonding and chip inserting integrated equipment, characterized in that: It comprises a debonding machine, a wafer inserting machine and a wafer turnover device as described in any one of claims 1 to 9.

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