A wafer memory and its wafer cassette storage control method

Abstract

This application provides a wafer memory and a wafer cassette storage control method thereof, relating to the semiconductor field. The wafer memory provided in this application forms a region for exchanging wafer cassettes and is equipped with two windows, inner and outer, for this region. When wafer cassettes are stored in the wafer memory, the two windows isolate the wafer memory from the outside environment during wafer cassette exchange, ensuring the internal sealing of the wafer memory and preventing workers from accidentally entering the wafer memory during manual operations, thus avoiding injury. Furthermore, the window control can be triggered based on the actual wafer cassette being sent and retrieved, reducing accidental window opening and closing due to worker operation, thereby further preventing worker injuries.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing, specifically to a wafer memory and a wafer cell storage control method thereof. Background Technology

[0002] Wafers are the fundamental raw material in semiconductor manufacturing. They are circular thin films made from extremely high-purity semiconductor materials (such as silicon or gallium arsenide) through processes such as crystal pulling and slicing. In semiconductor technology, wafers can be processed to produce corresponding integrated circuit devices (such as chips, driver circuits, etc.).

[0003] Given the requirements of wafer fabrication processes, these processes often need to be completed in highly cleanroom environments. Therefore, ensuring a clean environment and preventing external interference during wafer fabrication is a critical technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0004] In view of this, embodiments of this application provide a wafer memory and a wafer cassette storage control method thereof, which can ensure that the wafer memory is closed to the outside world when the wafer cassette is exchanged by setting two window plates in the wafer cassette exchange area.

[0005] This application provides a wafer cassette storage method applied to a wafer memory. The wafer memory includes a stacked storage structure and a wafer cassette moving device. The stacked storage structure has multiple wafer cassette bases and forms a wafer cassette exchange cavity communicating with the outside. The wafer cassette exchange cavity has an inner window and an outer window. The multiple wafer cassette bases include storage bases disposed on the sidewalls of the stacked storage structure and exchange bases disposed in the wafer cassette exchange cavity. The wafer cassette moving device is used to move wafer cassettes among the multiple wafer cassette bases. The wafer cassette storage method includes: closing the inner window and opening the outer window in response to a wafer cassette storage request; opening the inner window and closing the outer window in response to at least one wafer cassette being placed on the exchange base; and driving the wafer cassette moving device to move the wafer cassette from the exchange base to the storage base.

[0006] Optionally, the method further includes: in response to the inner window being closed and the outer window being opened, controlling the switching base to be in a first orientation, wherein the first orientations are parallel to each other. In response to the inner window being opened and the outer window being closed, controlling the switching base to be in a second orientation, wherein the second orientation points toward the movement axis of the wafer cassette moving device.

[0007] Optionally, when the wafer cell base on the wafer cell switching cavity is in the second orientation, it blocks the movement trajectory of the inner window. The method further includes: detecting the orientation of the switching base in response to a movement command of the inner window; controlling the switching base to be in the first orientation in response to the switching base being in the second orientation; and executing the movement command of the inner window.

[0008] Optionally, the wafer cell base is equipped with a wafer cell placement sensor. The wafer cell placement sensor generates a wafer cell sensing signal based on the placement status of the wafer cells on the wafer cell base. In response to at least one wafer cell being placed on the switching base, the sensor opens an inner window and closes an outer window, including: determining the wafer cell storage requirement of the switching base based on a wafer cell storage request; and determining whether the wafer cell sensing signal of the switching base meets the wafer cell storage requirement based on the wafer cell sensing signal of the switching base. If so, the wafer cell storage request is completed, the inner window is opened, and the outer window is closed.

[0009] Optionally, determining whether the wafer cell sensing signal of the switching base meets the wafer cell storage requirement based on the wafer cell sensing signal includes: determining the target base where the wafer cells have been placed based on the wafer cell sensing signal; determining whether the target base is consistent with the placement position and / or quantity required for wafer cell storage; if so, determining that the wafer cell storage request has been completed.

[0010] Optionally, the method further includes: generating an anomaly alert in response to a wafer cell sensing signal including abnormal placement information.

[0011] Optionally, the wafer cell exchange cavity is provided with a human presence sensor, and the method further includes: closing the inner window in response to a limb presence signal from the human presence sensor.

[0012] Secondly, this application provides a wafer cassette removal method applied to a wafer memory. The wafer memory includes a stacked storage structure and a wafer cassette moving device. The stacked storage structure is provided with multiple wafer cassette bases and forms a wafer cassette exchange cavity communicating with the outside. The wafer cassette exchange cavity is provided with an inner window and an outer window. The multiple wafer cassette bases include storage bases disposed on the sidewalls of the stacked storage structure and exchange bases disposed in the wafer cassette exchange cavity. The wafer cassette moving device is used to move the wafer cassette between the multiple wafer cassette bases. The wafer cassette removal method includes: in response to a wafer cassette removal request, opening the inner window and closing the outer window; driving the wafer cassette moving device to move the wafer cassette from the storage base to the exchange base; and in response to wafer cassette placement completion, closing the inner window and opening the outer window.

[0013] Optionally, the method further includes: generating a wafer cassette removal prompt message in response to the completion of wafer cassette placement.

[0014] Thirdly, this application also provides a wafer memory, which includes a stacked storage structure, a wafer cassette moving device, and a controller. The stacked storage structure is provided with multiple wafer cassette bases and forms a wafer cassette exchange cavity inside that communicates with the outside. The wafer cassette exchange cavity is provided with an inner window and an outer window. The multiple wafer cassette bases include storage bases disposed on the side walls of the stacked storage structure and exchange bases disposed in the wafer cassette exchange cavity. The wafer cassette moving device is used to move the wafer cassettes between the multiple wafer cassette bases.

[0015] The controller is used to control the wafer memory to perform the wafer cassette insertion method described in the first aspect and / or the wafer cassette removal method described in the second aspect.

[0016] Based on the wafer memory provided in this application embodiment, a wafer exchange cassette area is formed, and two windows, inner and outer, are configured for this area. When the wafer memory contains wafer cassettes, the two windows isolate the wafer memory from the outside environment during wafer exchange, ensuring the internal sealing of the wafer memory. This also prevents workers from accidentally entering the wafer memory during manual operations, thus avoiding injury. Furthermore, the window control can be triggered based on the actual wafer cassette being sent and retrieved, reducing accidental window opening and closing due to worker error, further preventing worker injuries. Attached Figure Description

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 This is a schematic diagram of a wafer processing system provided in some embodiments of this application.

[0019] Figure 2 This is a schematic diagram of the structure of a wafer memory provided in some embodiments of this application.

[0020] Figure 3A , 3B This is a schematic diagram of the structure of a wafer memory provided in some embodiments of this application.

[0021] Figure 4 This is an exemplary flowchart of a wafer cassette storage method provided in some embodiments of this application.

[0022] Figure 5 This is an exemplary flowchart of a wafer cassette placement and detection method provided in some embodiments of this application.

[0023] Figure 6 This is an exemplary flowchart of a wafer cassette removal method provided in some embodiments of this application.

[0024] Among them, 100 is a wafer processing system; 110 is a processing unit; 120 is a wafer handling system; 200 is a wafer memory; 210 is a vertical storage structure; 220 is a wafer cassette exchange cavity; 221 is an exchange base; 221' is an exchange base; 231 is an outer window; and 232 is an inner window. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] Application Overview:

[0027] With the development of wafer fabrication technology, Automatic Material Handling Systems (AMHS) are generally used for wafer transfer in wafer fabrication. Based on AMHS, wafer fabrication equipment can be integrated into multiple processing units during the wafer fabrication process, thereby enabling the transfer of wafers between different units and within processing units through AMHS.

[0028] To further illustrate the AMHS-based wafer fabrication process, this application provides a system schematic diagram of a wafer fabrication system. Figure 1 The wafer processing system 100 can be understood as a collection of process equipment used in wafer processing.

[0029] like Figure 1 As shown, the wafer processing system 100 may include multiple processing units 110. A processing unit 110 may refer to a cluster of related equipment for one or more processes in the wafer processing technology; that is, a wafer can complete a corresponding processing technology after passing through a corresponding processing unit 110.

[0030] After wafers are assembled, they generally undergo processes such as surface polishing, cleaning, oxidation, photolithography, etching, ion implantation, chemical vapor deposition, physical vapor deposition, chemical mechanical polishing, interconnection, testing, dicing, packaging, and final testing to form semiconductor devices.

[0031] In practical applications, the overall wafer processing can be divided into multiple continuous processing steps according to the actual semiconductor manufacturing requirements. The process equipment of each processing step can form the aforementioned processing unit 110, so that after the wafer enters the processing unit 110, it is automatically / semi-automatically processed by each process equipment to complete the corresponding processing task.

[0032] To enable automatic / semi-automatic material handling in the aforementioned processing unit 110, a wafer handling system 120 can also be integrated into the aforementioned wafer processing system 100. The wafer handling system 120 is an AMHS (Ambidextrous Metal Handling System) applied to wafer processing. In the aforementioned wafer processing system 100, it is mainly used to transfer wafers between processing units 110 and to load and unload wafers for each processing unit 110.

[0033] In practical applications, one or more wafers are typically directly transferred within processing unit 110 for processing using corresponding equipment. Wafers can also be transferred between processing units 110 via wafer cassettes.

[0034] A wafer cassette is a container used in semiconductor manufacturing to hold and transport wafers. Wafer cassettes are primarily used for handling and storing wafers to simplify transportation and reduce the risk of contamination. The interior of a wafer cassette has symmetrical grooves of strictly uniform size to support the two sides of the wafer; typically, one wafer cassette can hold 25 wafers.

[0035] In the wafer processing system 100, the wafer pod can be configured as a front-opening unified pod (FOUP). That is, the wafer pod is open at the front to allow for the retrieval or storage of wafers. Furthermore, in the wafer processing system 100, the wafer pods of different processing units 110 are presented in different styles (mainly distinguished by pod color) to differentiate the different processing stages of the wafers.

[0036] Based on the aforementioned wafer cassette, in the wafer handling system 120, the wafer cassette can be transferred between processing units 110 and wafers can be extracted from the wafer cassette within the processing unit 110. Therefore, the aforementioned wafer handling system 120 may include a wafer cassette carrier and a wafer carrier.

[0037] Wafer cassette transport equipment refers to equipment that transports wafer cassettes between processing units 110. Specifically, wafer cassette transport equipment typically achieves automated or semi-automated wafer cassette transport between processing units 110 through devices capable of handling wafer cassettes. For example, wafer cassette transport equipment can be implemented using overhead hoist transport (OHT), automated material robot (AMR), conveyor, or other transport equipment.

[0038] Similar to the aforementioned wafer carrier equipment, the wafer carrier equipment can refer to equipment that transports wafers within the processing unit 110, or it can be implemented using the aforementioned handling equipment. Furthermore, it should be noted that the specific form of the wafer carrier equipment can be matched to the requirements of the corresponding processing unit 110, so that the process equipment within the processing unit 110 can process the wafers carried on it. Generally, the wafer carrier equipment can also be called a wafer boat.

[0039] Considering the different processing rates at different stages, a buffer structure can be incorporated into the wafer handling system to coordinate the processing at each stage. This buffer structure in the wafer handling system typically takes the form of a wafer stocker.

[0040] A wafer cassette rack is a device used in semiconductor manufacturing to store and automate the management of wafer cassettes. Each processing unit 110 can be equipped with one or more wafer cassette racks to buffer wafer cassettes awaiting or completed processing. Typically, a wafer cassette rack contains multiple wafer cassette bays to facilitate the storage and dispatch of wafer cassettes, thus balancing the capacity differences between various production process equipment.

[0041] Based on the aforementioned wafer handling system 120, wafer cassettes between processing units 110 can be transferred between wafer cassette storage units in each processing unit 110 via wafer cassette carrying equipment. The wafer cassette storage unit can distribute wafer cassettes as needed, thereby transferring the wafers in the wafer cassettes between various process equipment in the processing unit 110 via wafer carrying equipment to complete the corresponding processing of the wafers.

[0042] Therefore, based on the aforementioned wafer processing system 100, the material handling and processing of wafers can be realized throughout the entire processing process, thereby effectively organizing the relevant process equipment and transportation equipment for wafers, and realizing a high degree of system integration and automation.

[0043] In practical applications, considering the complexity of wafer cassette handling, the interaction between the wafer cassette storage unit and the wafer cassette carrier equipment can generally be achieved through semi-automation. That is, the wafer cassette carrier equipment can be moved to the wafer cassette storage unit, and the exchange of wafer cassettes between the two units can be accomplished manually by staff.

[0044] During this handling process, wafer rack storage units often require open windows to expose the wafer racks to workers for handling or exchange. However, with the windows open, the wafer rack storage unit is exposed to the external environment, potentially compromising its cleanroom environment. Furthermore, workers' limbs may enter the wafer rack storage unit during handling, and given the nature of the unit and the presence of high-speed robotic arms inside, this could cause injury to any limbs entering the unit.

[0045] To address the aforementioned technical problems, this application improves the area for exchanging wafer cassettes in a wafer storage storage system, thereby forming a wafer memory and a wafer cassette storage control method thereof. Specifically, the wafer memory provided in this application forms an area for exchanging wafer cassettes, and this area is equipped with two windows, one inner and one outer. When wafer cassettes are stored in the wafer memory, these two windows isolate the wafer memory from the outside environment during wafer cassette exchange, ensuring the internal sealing of the wafer memory. Simultaneously, it prevents workers from accidentally entering the wafer memory during manual operations, thus avoiding injury to workers.

[0046] Furthermore, considering the vertical movement of the window panel, a space is created below the support plate at the window that will be obscured by the window panel. This application innovatively places the power supply unit for the wafer memory within this space. The power supply unit can be connected to the outside via cables, and the vertical movement of the window panel will not affect its normal operation. Thus, suitable functional mechanisms are placed in an area where interaction with the outside world is difficult, improving the integration density within the wafer memory.

[0047] It should be noted that the wafer memory provided in this application can be understood as a wafer storage library or an improved version thereof. For example, the wafer memory provided in this application can also directly exchange wafers with external systems without wafer exchange through a wafer transport system.

[0048] Various non-limiting embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0049] Exemplary wafer memory

[0050] As mentioned above, this application provides a wafer memory and a wafer cassette storage control method thereof. The wafer memory can be a device for storing wafer cassettes in an automated material handling system. It typically takes the form of a vertical storage unit, where one side of the wafer memory has a shelf for caching wafer cassettes, and the other side has a mobile robot for moving the wafer cassettes, thereby enabling the relocation of wafer cassettes within the wafer memory.

[0051] To further illustrate the wafer memory provided in this application, this application also provides a schematic diagram of the structure of the wafer memory and its wafer cell storage control method. Wherein, Figure 2 This is a schematic diagram of the structure of a wafer memory 200 provided in some embodiments of this application. Wherein, Figure 2 It can display the overall structure of the wafer memory 200 in the XYZ space.

[0052] exist Figure 2 It can include three reference directions: X-axis, Y-axis, and Z-axis. XOY forms a horizontal plane, Z-axis is the vertical direction of the horizontal plane, and X-axis and Y-axis are two mutually perpendicular directions in the horizontal plane.

[0053] Wafer memory is generally based on the aforementioned horizontal plane and vertical direction. The vertical direction is generally the extension direction of the wafer memory, that is, wafer cells can be stacked in the wafer memory along the vertical direction (i.e., the Z-axis direction) to accommodate multiple wafer cells.

[0054] It should be noted that this application does not limit the configuration of the wafer memory. The above reference direction is only for the convenience of describing the selection of wafer memory and can be adjusted according to actual needs during design and assembly.

[0055] like Figure 2 As shown, the wafer memory 200 may include a stacked memory structure 210.

[0056] The stacked storage structure 210 can refer to the main structure of the wafer memory 200 (i.e., forming a wafer memory cell). Structurally, the stacked storage structure 210 can include a support sidewall and a cell body structure. The support sidewall can refer to the sidewall used to place the wafer cassette base, and the cell body structure refers to other structures outside the support sidewall.

[0057] Specifically, multiple carrier plates can be horizontally arranged inside the carrier sidewall, and each carrier plate can hold multiple wafer cassette bases, so that the wafer cassettes can be placed on the bases.

[0058] Furthermore, the wafer memory 200 can have a wafer cell exchange cavity 220 formed on the carrier sidewall. That is, as... Figure 2 As shown, a window for exchanging wafer cassettes is provided on the support side wall, and upper and lower support plates are provided inside, thus forming a space for placing wafer cassettes (denoted as wafer cassette exchange cavity 220) together with the window.

[0059] Specifically, the aforementioned plurality of wafer cassette bases may include storage bases on the sidewalls of the stack structure 210 and exchange bases 221 disposed in the wafer cassette exchange cavity 220. Further, the figure shows an exchange base 221 without a wafer cassette and an exchange base 221' with a wafer cassette.

[0060] Therefore, based on the wafer cassette exchange cavity 220, wafer cassettes removed from the wafer memory 200 can be stored in this space (such as on the exchange base 221'), allowing external personnel to retrieve wafer cassettes from this area and / or place them in the wafer cassette carrier equipment. Furthermore, personnel can also move wafer cassettes to be stored from the wafer cassette carrier equipment into this space, thereby moving the wafer cassettes in this space to a suitable location in the warehouse using a wafer cassette moving device within the wafer memory 200.

[0061] To ensure the internal airtightness of the aforementioned wafer memory 200 during wafer cassette swapping, the aforementioned wafer memory 200 may further include an outer window and an inner window (not shown in the original text). Figure 2 (View from the center). The outer and inner windows can respectively cover both ends of the internal support plate, thereby sealing off the wafer cassette exchange space from the outside and the inside respectively.

[0062] To further illustrate the aforementioned occlusion of the window by the inner and outer windows, this application also provides a side view of the wafer memory 200 and its wafer cell storage control method under different closed states. Figure 3A and Figure 3B ).in, Figure 3A This can be a side view of the internal structure of the wafer memory 200 when the inner window 232 covers the first window. Figure 3B This can be a side view of the internal structure of the wafer memory 200 when the outer window 231 covers the first window.

[0063] like Figure 3A , Figure 3B As shown, the aforementioned outer window 231 (presented as a movable window panel) is disposed outside the wafer cassette exchange cavity 220 along the first vertical direction (i.e., at the end of the internal support plate near the support sidewall), and the inner window 232 is disposed inside the wafer cassette exchange cavity 220 along the first vertical direction (i.e., at the two ends of the internal support plate away from the support sidewall). The first vertical direction can be the direction of the plane containing the aforementioned support sidewall, i.e. Figure 2 The direction of the XZ plane. Correspondingly, Figure 2 The direction of the YZ plane is denoted as the second vertical direction.

[0064] To enable wafer cassette swapping, the outer window 231 and the inner window 232 can be driven to close and open. The opening and closing of the inner and outer windows can be achieved through vertical translation. Generally, when the inner and outer windows are located within the wafer cassette swapping cavity 220, they are considered closed; when they are outside the wafer cassette swapping cavity 220, they are considered open. Considering the structure of the wafer memory 200, when the aforementioned inner and outer windows 231 are in the closed state, the corresponding window plate can be located below the wafer cassette swapping cavity 220.

[0065] In some embodiments, to isolate the wafer memory 200 from the external environment, at least one of the outer window 231 and the inner window 232 is in a closed state during operation to isolate the external environment. That is, the wafer memory 200 can be in a closed state during operation. Figure 3A and Figure 3B The state transitions shown are to ensure the isolation of the wafer memory 200 from the external environment.

[0066] in, Figure 3A This can reflect the state where the outer window 231 is open and the inner window 232 is closed. Figure 3B This can reflect the state where the outer window 231 is closed and the inner window 232 is open. During wafer cassette storage control, the actual wafer cassette layout can be adjusted accordingly. Figure 3A and Figure 3BThe wafer memory 200 is constantly switched between the two, thereby enabling the exchange of wafer cells between the wafer memory 200 and the external wafer cells.

[0067] Specifically, if a wafer cassette is provided on the exchange base 221, then in the aforementioned Figure 3A In the illustrated state, the wafer cassette is located in the external space, allowing it to be retrieved / placed by personnel / related equipment. Figure 3B In the state shown, the wafer cassette is located in the internal space of the wafer memory 200, and can thus be moved by the wafer cassette moving device.

[0068] Regarding based on Figure 3A and Figure 3B The wafer cassette storage control method (including wafer cassette insertion and retrieval methods) shown can be found in [reference needed]. Figures 4-6 The relevant descriptions will not be repeated here.

[0069] Furthermore, considering that wafer cassette moving devices generally consist of a planar robotic arm and a longitudinal moving axis, to facilitate the wafer cassette moving device in retrieving wafer cassettes from the switching base, the switching base can be positioned facing the moving axis of the wafer cassette moving device. This allows the wafer cassette moving device to align with the wafer cassette on the switching base simply by rotating to face the device. For example... Figure 2 The exchange base 221 and exchange base 221' are shown.

[0070] However, considering the external environment's wafer cassette access situation, the tilt angle of the aforementioned exchange base 221' would make it inconvenient for external institutions / personnel to place the wafer cassette. Therefore, when retrieving the wafer cassette from the external environment, the aforementioned exchange base 221, located in the middle of the internal support plate and without any angle, is more convenient to retrieve.

[0071] Based on the foregoing, this application further creatively configures the switching base at the wafer cassette switching cavity 220 as a movable base, thereby enabling active control of its orientation. Based on the foregoing, it is configured with two orientations. The first orientation can be parallel to each other (i.e., the orientation of each switching base is parallel to the aforementioned switching base 221). The second orientation can point towards the moving axis of the wafer cassette moving device (as in the aforementioned switching base 221'). These two orientations can be adjusted by the drive structure at the bottom of the base. For more information on orientation adjustment, please refer to [link to relevant documentation]. Figure 4 And its related descriptions.

[0072] Exemplary wafer cassette storage control method:

[0073] To further describe the aforementioned wafer cassette storage control method, this application also provides an exemplary flowchart of a wafer cassette storage method. Figure 4 ) and an exemplary flowchart of the wafer cassette removal method ( Figure 6The wafer cell storage control method (i.e., the aforementioned storage and retrieval method) can be executed by the controller of the wafer memory 200.

[0074] like Figure 4 As shown, process P400 may include the following steps:

[0075] S410, In response to the wafer cassette storage request, close the inner window and open the outer window.

[0076] S420, in response to at least one wafer cassette being placed on the switching base, the inner window is opened and the outer window is closed.

[0077] S430, the drive wafer cassette moving device moves the wafer cassette from the switching base to the storage base.

[0078] In the aforementioned S410, the wafer cassette storage request can refer to an externally triggered request to store a wafer cassette. In some embodiments, the wafer cassette storage request can be automatically triggered by the host computer of the wafer processing system based on the transportation status of the wafer cassette carrier equipment. For example, the host computer can determine the number of wafer cassettes that the wafer memory needs to store at the current moment based on the wafer cassette carrying status of the wafer cassette carrier equipment, thereby generating a wafer cassette storage request. The controller of the wafer memory can receive and parse the request to execute the aforementioned P400.

[0079] In some embodiments, wafer cassette storage requests can also be determined based on worker interaction. For example, a swap button / panel can be provided on the wafer memory, through which workers can communicate a request to store a wafer cassette to the wafer memory controller.

[0080] Specifically, considering that the external placement of wafer cassettes is performed by external equipment / personnel, the number of bases and / or wafer cassettes to be placed can be recorded in the wafer cassette storage request to determine in advance whether placement has been completed. Furthermore, personnel can also provide feedback that placement is complete through the aforementioned interactive controls.

[0081] After the wafer memory controller receives this request, it can close the inner window and open the outer window to enter a state of... Figure 3A In the state shown, the wafer cassette exchange cavity is exposed to the external space, and the wafer cassette can be placed by relevant equipment / personnel.

[0082] In some embodiments, taking into account the two aforementioned orientations, the switching base can be controlled to be in a first orientation when the wafer cassette switching cavity is exposed to the external space. That is, it can be in a first orientation in response to the inner window being closed and the outer window being opened (i.e., in the first orientation). Figure 3A (As shown in the diagram), the control exchange base is in the first orientation.

[0083] In the aforementioned S420, the response that at least one wafer cassette has been placed on the switching base can indicate that an external worker / device has completed the placement of the wafer cassette for this storage request. To incorporate the wafer cassette into the internal environment of the wafer memory, the inner window can be opened and the outer window closed. Figure 3B In the state shown, the wafer cassette switching cavity is exposed inside the wafer memory, thus enabling it to be interacted with by the wafer cassette moving device of the wafer memory.

[0084] Taking into account the two orientations, the orientation can be adjusted to the second orientation to allow the wafer cassette moving device to operate. This means it can respond to the inner window opening and the outer window closing (i.e.,...). Figure 3B (As shown in the state), the control exchange base is in the second orientation so that the wafer cassette is aligned with the moving axis of the wafer cassette moving device.

[0085] Based on the aforementioned steps S410 and S420, an external wafer cassette can be incorporated into the internal space of the wafer memory while maintaining the enclosure of the internal environment of the wafer memory from the external space during this process. Therefore, step S430 can be executed to adjust the position of the wafer cassette (generally moving it from the switching base to the storage base). During this process, if there is an instruction indicating the specific storage location, it can be executed according to the instruction; otherwise, it can be placed according to preset rules, thereby freeing up the switching base for subsequent switching.

[0086] Furthermore, if the storage caddy is not yet available, caching can be performed at the swap caddy. It should be noted that if there is no free caddy in the wafer memory and a wafer cassette storage request is received, an error can be reported.

[0087] To reduce the space occupied by the wafer memory, the size of the aforementioned internal carrier plate can be set based solely on the switching base in the first orientation. However, when the wafer cell base on the wafer cell switching cavity is in the second orientation, it will obstruct the movement trajectory of the inner window. Therefore, during the opening and closing of the aforementioned inner window, the following method can be performed:

[0088] First, in response to the movement command of the inner window, the orientation of the switching base is detected. The movement command of the inner window can refer to internal commands of the wafer memory, specifically commands reflecting changes in the opening and closing state of the inner window.

[0089] Next, in response to the exchange base being in the second orientation, the control switches the exchange base to the first orientation. Thus, the exchange base in the first orientation will not obstruct the movement trajectory of the inner window.

[0090] Finally, execute the movement command for the inner window. In particular, when the open / closed state of the inner window changes, the orientation of the aforementioned exchange base generally also needs to be changed, and the specific changes can be adjusted according to actual needs.

[0091] In addition to closing the inner window during the regular wafer cassette swapping process, to prevent injury to personnel, the system can also actively close the inner window when it detects that the inner window is open and a worker's limb is within the wafer cassette swapping cavity, thus avoiding injury caused by worker misoperation. This process can be based on a human presence sensor (typically an infrared sensor). The wafer cassette swapping cavity is equipped with a human presence sensor. The wafer memory controller can then close the inner window in response to the limb presence signal detected by the human presence sensor.

[0092] In some embodiments, a wafer cell placement sensor is provided on the wafer cell base to detect the placement status of the wafer cell on the base. The wafer cell placement sensor generates a wafer cell sensing signal based on the placement status of the wafer cell on the wafer cell base. Typically, the wafer cell placement sensor is configured as a pressure sensor for the wafer cell; when a wafer cell is present, the sensor is triggered to generate a corresponding wafer cell sensing signal.

[0093] In some embodiments, the determination of whether the wafer cell placement request has been completed can be performed based on the sensing signal of the wafer cell placement sensor. To further illustrate this process, this application also provides an exemplary flowchart of a wafer cell placement detection method (…). Figure 5 ).

[0094] like Figure 5 As shown, process P500 (i.e., the aforementioned S420) may include the following steps:

[0095] S510. Based on the wafer cell storage requirements, determine the wafer cell storage requirements of the switching base.

[0096] S520: Based on the wafer cell sensing signal of the switching base, determine whether the wafer cell sensing signal of the switching base meets the wafer cell storage requirements.

[0097] S530, the wafer cell storage request has been completed. The inner window is opened and the outer window is closed.

[0098] In the aforementioned P500, S520 can be a determination step, and S530 is the execution status of the determination result of S520 being "yes". In practical applications, if the wafer cassette sensing signal does not meet the wafer cassette storage requirements, the aforementioned steps are generally followed. Figure 3A The state shown continues until the requirements are met.

[0099] It should be noted that in the aforementioned S520, the wafer cell sensor signal generally does not need to be actively acquired; the aforementioned wafer cell placement sensor can actively provide its signal to the controller.

[0100] In the aforementioned S510, the wafer cassette storage requirement can be preset or recorded in the aforementioned wafer cassette storage request. For example, the wafer cassette memory is equipped with a storage button, which can be triggered once each time a wafer cassette needs to be stored. The wafer cassette storage requirement corresponding to this button is preset. As another example, the host computer can generate a wafer cassette storage request based on the required number of wafer cassettes, thereby directly writing the wafer cassette storage requirement into the wafer cassette storage request.

[0101] In the aforementioned S520, the judgment process generally involves determining whether the wafer cell corresponding to the wafer cell sensing signal of the switching base is consistent with the wafer cell storage requirement. If they are consistent, the wafer cell storage request is determined to be completed, and the aforementioned S530 is executed.

[0102] In some embodiments, when the wafer cassette storage request has specific placement requirements for the exchange base, during the execution of the aforementioned S520, the target base where the wafer cassette has been placed can first be determined based on the wafer cassette sensing signal. Then, it is determined whether the target base matches the placement position and / or quantity of the wafer cassette storage request. If they match, the wafer cassette storage request is determined to be completed.

[0103] In some embodiments, to ensure the proper placement of the wafer cassette, the aforementioned wafer cassette placement sensor can also detect the placement orientation of the wafer cassette (e.g., by setting multiple pressure sensors), thereby including abnormal placement information in the wafer cassette sensing signal (if the pressure sensor that needs to be pressed is not pressed, it indicates that its placement orientation is abnormal), thereby generating an abnormality alert.

[0104] Similar to the aforementioned wafer cassette storage method, this application Figure 6 The wafer cassette removal method shown in flowchart P600 may include the following steps:

[0105] S610, In response to the wafer cassette removal request, open the inner window and close the outer window.

[0106] S620, the drive wafer cassette moving device moves the wafer cassette from the storage base to the switching base.

[0107] S630, in response to the completion of wafer cassette placement, closes the inner window and opens the outer window.

[0108] The entire process is similar to the aforementioned P400, and in the aforementioned S610, it can be based on the request being in Figure 3B The state shown is used to execute the aforementioned S620, thereby placing the wafer cassette in the wafer cassette switching cavity. Then, the aforementioned S630 is executed to bring the wafer memory into position. Figure 3A The state shown exposes the wafer cassette that needs to be removed.

[0109] Unlike P400, in P600, the method of wafer cassette removal can be sensed by the wafer memory. That is, the wafer memory can generate a wafer cassette removal request based on its own wafer processing status (or generate the instruction after being determined by the host computer), thus the number of wafer cassettes removed is known. In other words, the triggering condition for S630 is an internal condition.

[0110] In some embodiments, considering that the aforementioned trigger is an internal condition, after the wafer cassette is placed, a wafer cassette removal prompt message (such as an audio prompt, light prompt, or information push) can be generated to remind staff to remove the wafer cassette.

[0111] It should be noted that the aforementioned P600 may also involve technical solutions discussed in P400, such as the orientation change of the exchange base. These will not be elaborated upon here.

[0112] In summary, the wafer memory provided in this application forms an area for exchanging wafer cassettes and is equipped with two windows, one inner and one outer, which isolate the wafer memory from the outside environment when exchanging wafer cassettes. This ensures the internal sealing of the wafer memory and prevents workers from accidentally entering the wafer memory during manual operations, thus avoiding injuries. Furthermore, the windows can be controlled based on the actual movement of wafer cassettes, reducing accidental window openings and closings due to worker error, further preventing injuries.

[0113] It should be noted that the elements described in the above specific embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, this application will not describe the various possible combinations separately.

[0114] It should be understood that multiple components and / or parts can be provided by a single integrated component or part. Alternatively, a single integrated component or part can be divided into multiple separate components and / or parts. The use of the public designation "a" or "an" to describe a component or part is not intended to exclude other components or parts.

[0115] It should be understood that although terms such as "first" or "second" may be used in this application to describe various elements, these elements are not defined by these terms, which are only used to distinguish one element from another.

[0116] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0117] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for storing a wafer cassette, characterized in that, This invention relates to a wafer memory, comprising a vertical storage structure and a wafer cassette moving device. The vertical storage structure has multiple wafer cassette bases and forms a wafer cassette exchange cavity that communicates with the outside. The wafer cassette exchange cavity has an inner window, an outer window, and an inner support plate. The multiple wafer cassette bases include storage bases disposed on the side walls of the vertical storage structure and multiple exchange bases disposed on the inner support plate in the wafer cassette exchange cavity. The wafer cassette moving device is implemented by a planar robotic arm and a longitudinal moving axis, used to move the wafer cassettes between the multiple wafer cassette bases. The wafer cassette storage method includes: In response to a wafer cassette storage request, the inner window is closed and the outer window is opened; In response to the fact that at least one wafer cassette has been placed on the switching base, the inner window is opened and the outer window is closed; The wafer cassette moving device drives the wafer cassette to move from the switching base to the storage base; The exchange base is configured as a rotatable base and has a first orientation and a second orientation, wherein the first orientation of each of the exchange bases is parallel to each other so that the exchange bases can interact with the outside, and the second orientation is directed toward the moving axis of the wafer cassette moving device so that the wafer cassette moving device can be aligned with the exchange base by the orientation rotation of the planar robotic arm. The size of the internal support plate is set only based on the exchange base in the first orientation, so that the exchange base on the wafer cassette exchange cavity blocks the movement trajectory of the inner window when it is in the second orientation. The wafer cassette storage method further includes: In response to the movement command of the inner window, the orientation of the exchange base is detected; In response to the exchange base being in the second orientation, the exchange base is controlled to be in the first orientation to avoid the exchange base obstructing the movement trajectory of the inner window; Execute the movement command for the inner window.

2. The wafer cassette storage method according to claim 1, characterized in that, The method further includes: In response to the inner window being closed and the outer window being opened, the switching base is controlled to be in a first orientation; In response to the inner window being opened and the outer window being closed, the exchange base is controlled to be in a second orientation.

3. The wafer cassette storage method according to claim 1, characterized in that, The wafer cassette base is equipped with a wafer cassette placement sensor, which generates a wafer cassette sensing signal based on the placement status of the wafer cassettes on the wafer cassette base. The step of opening the inner window and closing the outer window in response to at least one wafer cassette being placed on the switching base includes: Based on the wafer cassette storage request, the wafer cassette storage requirement of the switching base is determined; Based on the wafer cell sensing signal of the switching base, determine whether the wafer cell sensing signal of the switching base meets the wafer cell storage requirements; If so, the wafer cassette storage request is completed, the inner window is opened, and the outer window is closed.

4. The wafer cassette storage method according to claim 3, characterized in that, The step of determining whether the wafer cell sensing signal of the switching base meets the wafer cell storage requirement based on the wafer cell sensing signal of the switching base includes: The target base on which the wafer cassette has been placed is determined based on the wafer cassette sensing signal. Determine whether the target base is consistent with the required placement position and / or quantity of the wafer cassette. If so, the wafer cassette storage request is deemed to have been completed.

5. The wafer cassette storage method according to claim 3, characterized in that, The method further includes: In response to the wafer cell sensing signal including abnormal placement information, an abnormality alert is generated.

6. The wafer cassette storage method according to claim 1, characterized in that, The wafer cell exchange cavity is equipped with a human presence sensor, and the method further includes: In response to the presence signal of a limb from the human presence sensor, the inner window is closed.

7. A method for removing a wafer cassette, characterized in that, This invention relates to a wafer memory, comprising a vertical storage structure and a wafer cassette moving device. The vertical storage structure has multiple wafer cassette bases and forms a wafer cassette exchange cavity communicating with the outside. The wafer cassette exchange cavity has an inner window, an outer window, and an internal support plate. The multiple wafer cassette bases include storage bases disposed on the side walls of the vertical storage structure and multiple exchange bases disposed on the internal support plate in the wafer cassette exchange cavity. The wafer cassette moving device, implemented by a planar robotic arm and a longitudinal moving axis, is used to move wafer cassettes between the multiple wafer cassette bases. The wafer cassette removal method includes: In response to a wafer cassette removal request, the inner window is opened and the outer window is closed; The wafer cassette moving device drives the wafer cassette to move from the storage base to the switching base; In response to the completion of wafer cassette placement, the inner window is closed and the outer window is opened; The exchange base is configured as a rotatable base and has a first orientation and a second orientation, wherein the first orientation of each of the exchange bases is parallel to each other so that the exchange bases can interact with the outside, and the second orientation is directed toward the moving axis of the wafer cassette moving device so that the wafer cassette moving device can be aligned with the exchange base by the orientation rotation of the planar robotic arm. The size of the internal support plate is set only based on the exchange base in the first orientation, so that the exchange base on the wafer cassette exchange cavity blocks the movement trajectory of the inner window when it is in the second orientation. The wafer cassette removal method further includes: In response to the movement command of the inner window, the orientation of the exchange base is detected; In response to the exchange base being in the second orientation, the exchange base is controlled to be in the first orientation to avoid the exchange base obstructing the movement trajectory of the inner window; Execute the movement command for the inner window.

8. The wafer cassette removal method according to claim 7, characterized in that, The method further includes: In response to the completion of wafer cassette placement, a wafer cassette removal prompt message is generated.

9. A wafer memory, characterized in that, The wafer memory includes a vertical storage structure, a wafer cassette moving device, and a controller. The vertical storage structure is provided with multiple wafer cassette bases and forms a wafer cassette exchange cavity that communicates with the outside. The wafer cassette exchange cavity is provided with an inner window, an outer window, and an internal support plate. The multiple wafer cassette bases include storage bases disposed on the side walls of the vertical storage structure and exchange bases disposed on the internal support plate in the wafer cassette exchange cavity. The wafer cassette moving device is realized by a planar robotic arm and a longitudinal moving axis, and is used to move the wafer cassettes between the multiple wafer cassette bases. The exchange base is configured as a rotatable base and has a first orientation and a second orientation, wherein the first orientation is parallel to each other and the exchange base interacts with the outside, and the second orientation is directed toward the moving axis of the wafer cassette moving device so that the wafer cassette moving device can be aligned with the exchange base by the orientation rotation of the planar robotic arm; The size of the internal support plate is set only based on the exchange base in the first orientation, so that the exchange base on the wafer cell exchange cavity blocks the movement trajectory of the inner window when it is in the second orientation; The controller is used to control the wafer memory to perform the wafer cassette storage method according to any one of claims 1 to 6 and / or the wafer cassette retrieval method according to any one of claims 7 and 8.

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