A precision motion platform for micro-nano wafer processing and detection

Abstract

The present application relates to the field of micro-nano precision motion technology, and specifically discloses a micro-nano wafer processing and detection precision motion platform, comprising: a base, a rotation module and multiple lifting and leveling modules; the lifting and leveling module comprises: a horizontal driver, a first wedge, a second wedge and a spherical bearing; the first wedge is slidably connected to the base in the horizontal direction; the horizontal driver is arranged on the base and connected to the first wedge; the second wedge is slidably connected to the base in the vertical direction and cooperates with the first wedge; the spherical bearing is arranged on the second wedge; the rotation module comprises: a carrier plate, a wafer washing plate and a linear driver; the carrier plate is arranged on multiple lifting and leveling module spherical bearings; the wafer washing plate is rotatably arranged on the carrier plate; the linear driver is arranged on the carrier plate and connected to the wafer washing plate, and is used to drive the wafer washing plate to rotate through linear motion. The motion platform provided by this solution can achieve high-precision leveling and deviation correction operations in wafer processing, detection and repair.

Description

Technical Field

[0001] The present application relates to the field of micro-nano precision motion technology, and in particular to a micro-nano precision motion platform for wafer processing and detection. Background Art

[0002] As electronic products move toward miniaturization, flexibility, and 3D integration, high chip density (>104 / mm2) and thinness are becoming increasingly prominent. However, existing semiconductor manufacturing methods that increase integration by reducing feature size (<7nm) are gradually approaching their physical limits.

[0003] Mini / Micro LED and other display semiconductor chips require numerous micro- and nano-scale chip processing, inspection, and repair processes. Laser mass processing technology is a common method used to meet these precision requirements.

[0004] During the process of mass laser transfer and welding packaging of chips, there will be a certain degree of offset, tilt and misalignment between the dense Mini / Micro LED chip array on the upper board and the display panel circuit below, resulting in transfer failure and chip interconnection failure, which directly affects the product performance.

[0005] To reduce offset between the chip array and the display panel circuitry, traditional positioning platforms typically use built-in capacitive sensors for closed-loop position feedback. However, capacitive displacement sensors have a limited detection distance (less than 400μm) and require that the object being detected be metal, limiting their use. Summary of the Invention

[0006] In view of this, the purpose of this application is to provide a micro-nano wafer processing and detection precision motion platform to solve the problem that the existing method of reducing the offset between the chip array and the display panel circuit is very limited and has poor accuracy.

[0007] In order to achieve the above technical objectives, the present application provides a micro-nano wafer processing and detection precision motion platform, comprising: a base, a rotation module and multiple lifting and leveling modules;

[0008] The lifting and leveling module includes: a horizontal driver, a first wedge block, a second wedge block and a spherical bearing;

[0009] The first wedge is slidably connected to the base in a horizontal direction;

[0010] The horizontal driver is disposed on the base and connected to the first wedge block, and is used to push the first wedge block to slide;

[0011] The second wedge block is slidably connected to the base in a vertical direction and is in oblique wedge engagement with the first wedge block;

[0012] The spherical bearing is arranged on the second wedge;

[0013] The rotation module includes: a carrier plate, a wafer washing plate and a linear drive;

[0014] The carrier plate is arranged on the spherical bearings of the plurality of lifting and leveling modules;

[0015] The wafer washing plate can be rotatably arranged on the carrier plate;

[0016] The linear driver is arranged on the carrier plate and connected to the wafer washing plate, and is used for driving the wafer washing plate to rotate through linear motion.

[0017] Furthermore, the spherical bearings in the plurality of lifting and leveling modules are evenly distributed around the circumference of the carrier plate.

[0018] Furthermore, the lifting and leveling modules include three.

[0019] Furthermore, the rotation module further includes a spring pre-compression mechanism;

[0020] The spring preload mechanism is arranged on the carrier plate and abuts against the wafer washing plate, and is used for applying an elastic force opposite to the rotation direction to the wafer washing plate when the wafer washing plate rotates.

[0021] Furthermore, the lifting and leveling module further comprises: a flexible support sheet;

[0022] The flexible support sheet is slidably disposed on the first wedge block along the inclined direction of the inclined surface of the first wedge block and is elastically connected to the first wedge block;

[0023] The second wedge is arranged on the flexible supporting sheet.

[0024] Furthermore, two sides of the flexible support sheet are connected to the first wedge blocks via two springs respectively, so as to form a dual-parallel flexible structure.

[0025] Furthermore, the flexible support sheet is provided with a guide rail for the second wedge to be slidably placed.

[0026] Furthermore, the linear drive is a voice coil motor.

[0027] Furthermore, the rotating module further comprises: an air bearing;

[0028] The air bearing is arranged on the carrier plate;

[0029] The wafer washing plate is arranged on the air bearing.

[0030] Furthermore, the rotating module further comprises: a backing plate and a rotating plate;

[0031] The rotating plate is arranged on the air bearing;

[0032] The backing plate is arranged on the rotating plate;

[0033] The wafer washing plate is arranged on the pad.

[0034] It can be seen from the above technical scheme that the present application provides a micro-nano wafer processing and detection precision motion platform, including: a base, a rotation module and multiple lifting and leveling modules; the lifting and leveling module includes: a horizontal drive, a first wedge, a second wedge and a spherical bearing; the first wedge is slidably connected to the base in a horizontal direction; the horizontal drive is arranged on the base and connected to the first wedge, used to push the first wedge to slide; the second wedge is slidably connected to the base in a vertical direction, and cooperates with the first wedge oblique wedge; the spherical bearing is arranged on the second wedge; the rotation module includes: a carrier plate, a wafer washing disk and a linear drive; the carrier plate is arranged on the spherical bearings of the multiple lifting and leveling modules; the wafer washing disk is rotatably arranged on the carrier plate; the linear drive is arranged on the carrier plate and connected to the wafer washing disk, used to drive the wafer washing disk to rotate through linear motion.

[0035] The lifting and leveling module converts the horizontal motion of the horizontal actuator into vertical motion, achieving vertical leveling of the carrier plate; the linear actuator rotates the wafer wash plate, achieving vertical rotation of the plate. The micro-nanoscale wafer processing and inspection precision motion platform provided by this solution enables high-precision leveling and deflection correction during wafer processing, inspection, and repair, reducing linear coupling without being restricted by detection distance or the material of the object being inspected. This effectively addresses the limitations and poor accuracy of existing methods for reducing offset between chip arrays and display panel circuits. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0037] Figure 1 A schematic diagram of the overall structure of a micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application;

[0038] Figure 2A schematic diagram of a micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application with the rotation module removed;

[0039] Figure 3 A schematic diagram of a lifting and leveling module in a precision motion platform for micro-nano wafer processing and inspection provided in an embodiment of the present application;

[0040] Figure 4 Another schematic diagram of a lifting and leveling module in a precision motion platform for micro-nano wafer processing and inspection provided by an embodiment of the present application;

[0041] Figure 5 A schematic diagram of a first wedge in a micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application;

[0042] Figure 6 A schematic diagram of a rotation module of a micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application;

[0043] Figure 7 A schematic diagram of the connection structure between a wafer washing plate and a rotating plate of a micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application;

[0044] Figure 8 Schematic diagram of a carrier plate of a micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application. DETAILED DESCRIPTION

[0045] The following will clearly and completely describe the technical solutions of the embodiments of this application in conjunction with the accompanying drawings. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection requested by this application.

[0046] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they should not be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0047] In the description of the embodiments of the present application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, replaceable connections, or integral connections. They can also refer to mechanical connections or electrical connections. They can also refer to direct connections or indirect connections through an intermediate medium. They can also refer to internal connections between two components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0048] See also Figures 1 to 4 , a micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application includes: a base 10, a rotation module 30 and a plurality of lifting and leveling modules 20; the lifting and leveling module 20 includes: a horizontal driver 21, a first wedge 22, a second wedge 23 and a spherical bearing 24; the first wedge 22 is slidably connected to the base 10 in a horizontal direction; the horizontal driver 21 is arranged on the base 10 and connected to the first wedge 22, for pushing the first wedge 22 to slide; the second wedge 23 is slidably connected to the base 10 in a vertical direction and is wedge-matched with the first wedge 22; the spherical bearing 24 is arranged on the second wedge 23; the rotation module 30 includes: a carrier plate 31, a wafer washing disk 32 and a linear driver 33; the carrier plate 31 is arranged on the spherical bearings 24 of the plurality of lifting and leveling modules 20; the wafer washing disk 32 is rotatably arranged on the carrier plate 31; the linear driver 33 is arranged on the carrier plate 31 and connected to the wafer washing disk 32, for driving the wafer washing disk 32 to rotate through linear motion.

[0049] Specifically, the lifting and leveling module 20 also includes a bottom plate 28 and a vertical plate 29. The bottom plate 28 is fixed to the base 10, and the vertical plate 29 is fixed to the bottom plate 28 and is perpendicular to the bottom plate 28. Both the bottom plate 28 and the vertical plate 29 may be provided with guide rails 27. The first wedge 22 may be slidably mounted on the guide rail 27 on the bottom plate 28, and the second wedge 23 may be slidably mounted on the guide rail 27 on the vertical plate 29.

[0050] The horizontal driver 21 may be a stepper motor and connected to the first wedge 22 via a screw rod. In this embodiment, the base 10 is placed horizontally for illustration, and the vertical direction is the Z axis direction, and correspondingly, the X and Y directions are directions on the horizontal plane.

[0051] In application, the linear drive 33 can be a voice coil motor. The lifting and leveling module 20 in this embodiment can drive the carrier 31 to move vertically along the Z-axis direction and to perform an offset movement relative to the horizontal plane; the rotating module 30 can drive the wafer washing plate 32 to rotate. Multiple lifting and leveling modules 20 can adjust the relative position of the carrier 31 and the base 10 from multiple directions. In conjunction with the rotating module 30, a multi-degree-of-freedom leveling and correction device can be implemented to drive the wafer on the wafer washing plate 32 to move in the Z direction, deflect around X and Y rotations, and rotate around Z. At the same time, in this embodiment, the above-mentioned correction movement is completed by the horizontal drive 21 and the linear drive 33, which can effectively reduce the linear coupling phenomenon and meet the requirements of large stroke and high precision.

[0052] It should be noted that, in this embodiment, a spherical bearing 24 is further used to connect the second wedge block 32 and the carrier plate 31 , which can increase the degree of freedom and leveling accuracy during the leveling process.

[0053] In practical applications, the plurality of lifting and leveling modules 20 may be distributed on the base 10 in a matrix, an isosceles triangle, or the like.

[0054] In this embodiment, in order to ensure that the carrier plate 32 is subjected to uniform force at all angles, the spherical bearings 24 in the plurality of lifting and leveling modules 20 are evenly distributed around the circumference of the carrier plate 31 .

[0055] Taking the case where there are three lifting and leveling modules 20 as an example, the three lifting and leveling modules 20 are distributed in an equilateral triangle.

[0056] Correspondingly, see Figure 8 The carrier plate 31 may be provided with three extension plates for the three spherical bearings 24 to connect.

[0057] In one embodiment, see Figure 5 The lifting and leveling module 20 also includes: a flexible support sheet 25; the flexible support sheet 25 is slidably arranged on the first wedge block 22 along the inclined direction of the inclined surface of the first wedge block 22, and is elastically connected to the first wedge block 22; the second wedge block 23 is arranged on the flexible support sheet 25.

[0058] The flexible support sheet 25 is driven by the piezoelectric ceramic 210 on the first wedge 22. While possessing a certain degree of flexibility, it can move linearly along the driving direction of the piezoelectric ceramic 210, i.e., the inclination direction of the inclined surface of the first wedge 22. The flexible support sheet 25 improves the overall motion accuracy of the precision motion platform and provides a flexible guide for the second wedge 23.

[0059] In a further improved embodiment, the two sides of the flexible support piece 25 are connected to the first wedge block 22 via two springs 26 to form a dual-parallel flexible structure, which can ensure uniform force on both sides of the flexible support piece 25 during linear movement.

[0060] At the same time, the flexible support sheet 25 may also be provided with a guide rail 27 for the second wedge block 23 to be slidably placed.

[0061] In another embodiment, see Figures 6 to 8 The rotating module 30 also includes a spring preload mechanism 34 ; the spring preload mechanism 34 is disposed on the carrier plate 31 and abuts against the wafer washing plate 32 , and is used to apply an elastic force opposite to the rotation direction to the wafer washing plate 32 when the wafer washing plate 32 rotates.

[0062] by Figure 8 Taking the direction shown as an example, the linear actuator 33 is used to propel the wafer washing plate 32 clockwise. During the clockwise rotation of the wafer washing plate 32, the spring preload mechanism 34 is compressed. When the wafer washing plate 32 needs to rotate counterclockwise, the linear actuator 33 retracts, and the spring preload mechanism 34 simultaneously applies a counterclockwise thrust to the carrier plate 31, achieving high-precision Theta rotation of the wafer washing plate 32 around the z-axis.

[0063] The rotating module 30 may further include an air bearing 35 ; the air bearing 35 is disposed on the carrier plate 31 ; and the wafer washing plate 32 is disposed on the air bearing 35 .

[0064] That is, the carrier plate 31 is rotatably connected to the wafer washing plate 32 via the air bearing 35 .

[0065] Furthermore, the rotating module 30 further includes: a pad 36 and a rotating plate 37 ; the rotating plate 37 is disposed on the air bearing 35 ; the pad 36 is disposed on the rotating plate 37 ; and the wafer washing plate 32 is disposed on the pad 36 .

[0066] Specifically, the rotating plate 37 is used to cooperate with the air bearing 35; the pad 36 is used to play a buffering role.

[0067] A linear encoder 41 connected to the second wedge 23 may be provided on the vertical plate 29 ; and an arc encoder 42 connected to the wafer washing plate 32 may be provided on the air bearing 35 .

[0068] In an embodiment including three lifting and leveling modules 20, the motion platform includes three linear encoders 41, three piezoelectric ceramics 210, three horizontal drivers 21, a linear driver 33 and an arc encoder 42, which together constitute a seven-axis motion control system; wherein, the three linear encoders 41 are used to detect the lifting distance of the three second wedges 23; the arc encoder 42 is used to detect the rotation distance of the wafer washing plate 32 relative to the carrier 31; the three linear encoders 41 and the arc encoder 42 jointly detect the rotation distance of the wafer washing plate 32 around the X, Y and Z axes and the translation distance along the Z axis, and then feed back the detection results to the control end. The control end receives the feedback and controls the three horizontal drivers 21 and the linear driver 33 to start motion compensation, and finally realizes a closed-loop travel motion, realizes a seven-axis control system based on grating feedback for micro-nano wafer processing, detection and repair precision operations, and realizes high-precision detection and alignment operations.

[0069] The above are only preferred embodiments of the present application and are not intended to limit the present invention. Although the present application has been described in detail with reference to examples, those skilled in the art can still modify the technical solutions described in the aforementioned examples or make equivalent replacements for some of the technical features therein. However, any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A micro-nano wafer processing and detection precision motion platform, characterized in that: include: A base (10), a rotating module (30), and a plurality of lifting and leveling modules (20); The lifting and leveling module (20) comprises: a horizontal driver (21), a first wedge block (22), a second wedge block (23), a flexible support sheet (25) and a spherical bearing (24); The first wedge (22) is slidably connected to the base (10) in a horizontal direction; The horizontal driver (21) is arranged on the base (10) and is connected to the first wedge block (22) for pushing the first wedge block (22) to slide; The second wedge block (23) is slidably connected to the base (10) in a vertical direction and is in oblique wedge engagement with the first wedge block (22); The spherical bearing (24) is arranged on the second wedge (23); The rotating module (30) includes: a carrier plate (31), a wafer washing plate (32) and a linear drive (33); The carrier plate (31) is arranged on the spherical bearings (24) of the plurality of lifting and leveling modules (20); The wafer washing plate (32) can be rotatably arranged on the carrier plate (31); The linear drive (33) is arranged on the carrier plate (31) and is connected to the wafer washing plate (32), and is used to drive the wafer washing plate (32) to rotate through linear motion; The flexible support sheet (25) is slidably arranged on the first wedge block (22) along the inclined direction of the inclined surface of the first wedge block (22), and is elastically connected to the first wedge block (22); The second wedge (23) is arranged on the flexible support sheet (25); Both sides of the flexible support sheet (25) are connected to the first wedge (22) via two springs (26) to form a dual-parallel flexible structure; The flexible support sheet (25) is provided with a guide rail (27) for the second wedge block (23) to be slidably placed.

2. The micro-nano wafer processing and detection precision motion platform according to claim 1, characterized in that: The spherical bearings (24) in the plurality of lifting and leveling modules (20) are evenly distributed around the carrier plate (31).

3. The micro-nano wafer processing and detection precision motion platform according to claim 2, characterized in that: The lifting and leveling modules (20) include three.

4. The micro-nano wafer processing and detection precision motion platform according to claim 1, characterized in that: The rotating module (30) further includes a spring pre-compression mechanism (34); The spring preload mechanism (34) is arranged on the carrier plate (31) and abuts against the wafer washing plate (32), and is used to apply an elastic force opposite to the rotation direction to the wafer washing plate (32) when the wafer washing plate (32) rotates.

5. The micro-nano wafer processing and detection precision motion platform according to claim 1, characterized in that: The linear drive (33) is a voice coil motor.

6. The micro-nano wafer processing and detection precision motion platform according to claim 1, characterized in that: The rotating module (30) further includes: an air bearing (35); The air bearing (35) is arranged on the carrier plate (31); The wafer washing plate (32) is arranged on the air bearing (35).

7. The micro-nano wafer processing and detection precision motion platform according to claim 6, characterized in that: The rotating module (30) further includes: a backing plate (36) and a rotating plate (37); The rotating plate (37) is arranged on the air bearing (35); The backing plate (36) is arranged on the rotating plate (37); The wafer washing plate (32) is arranged on the pad (36).

Images