Substrate structure and manufacturing method thereof
By designing a concave structure in the edge area of the substrate structure, including connected grooves and recesses, the problems of overflow and thickness inconsistent during the lamination process are solved, and effective fixation and thickness consistency of the dielectric material are achieved.
Patent Information
- Application Number
- CN202410694738.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-03-14
AI Technical Summary
After the existing substrate structure has a dielectric material on the substrate and is laminated and cured, it is easy to cause the dielectric material to overflow out of the substrate and the dielectric material thickness to be inconsistent.
A substrate structure is designed, including a core plate body, a dielectric layer and at least one concave structure. The concave structure penetrates the dielectric layer, is recessed to the core plate body, and is located in the edge area, forming interconnected grooves and multiple recessed holes to ensure that the dielectric material does not overflow during the lamination process.
It effectively prevents dielectric materials from overflowing out of the substrate, and is conducive to maintaining the consistency of dielectric thickness, solving the problem of inconsistent dielectric thickness in the prior art.
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Figure CN119627013A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a substrate structure and a manufacturing method thereof, and in particular to a substrate structure and a manufacturing method thereof which can prevent dielectric material from overflowing out of the substrate and is conducive to maintaining the uniform thickness of the dielectric material. Background Art
[0002] With the vigorous development of the electronics industry, many high-end electronic products are gradually developing towards high integration such as light, thin, short and small. With the evolution of packaging technology, the packaging technology of semiconductor chips is becoming more and more diversified, and the size or volume of the packaging substrate is also continuously reduced, so that the semiconductor package can achieve the purpose of being light, thin and short.
[0003] However, the conventional method of manufacturing the substrate structure often causes the dielectric material to overflow out of the substrate and the dielectric material to have inconsistent thickness after the dielectric material is disposed on the substrate and subjected to a lamination and curing process.
[0004] Therefore, how to overcome the various problems of the above-mentioned prior art has become a topic that needs to be solved urgently. Summary of the invention
[0005] The object of the present invention is to provide a substrate structure and a manufacturing method thereof to solve at least one of the above problems.
[0006] In view of the various defects of the above-mentioned prior art, the present invention provides a substrate structure, including: a core board body, having a first side and a second side opposite to each other, and defining a pattern area and an edge area surrounding the pattern area; a dielectric layer, arranged on the first side and the second side of the core board body; and at least one recess structure, penetrating the dielectric layer and recessed into the core board body, and the at least one recess structure is located in the edge area.
[0007] As in the aforementioned substrate structure, the recess structure comprises a groove and a plurality of concave holes which are interconnected, the groove is formed through the dielectric layer, and the plurality of concave holes are formed recessed in the core board body.
[0008] As in the aforementioned substrate structure, the width of the groove is greater than the width of the concave hole, so that the groove and the concave hole have a T-shaped cross section.
[0009] As in the aforementioned substrate structure, the groove is annular.
[0010] As in the aforementioned substrate structure, the depth of the concave hole is 30% of the thickness of the core plate.
[0011] As in the aforementioned substrate structure, the width of the groove is 30 to 50 μm, and the width of the concave hole is 25 to 45 μm.
[0012] As in the aforementioned substrate structure, there are a plurality of recess structures, and each of the recess structures is spaced apart from each other.
[0013] As in the aforementioned substrate structure, the size of each of the recess structures gradually increases from the one adjacent to the pattern area to the one away from the pattern area.
[0014] The present invention also provides a method for manufacturing a substrate structure, including: providing a core board and a dielectric layer, wherein the core board has a first side and a second side opposite to each other, and defines a pattern area and an edge area surrounding the pattern area, the dielectric layer is arranged on the first side and the second side of the core board; and forming at least one recessed structure in the edge area that passes through the dielectric layer and is recessed into the core board.
[0015] As in the aforementioned method for manufacturing the substrate structure, a groove is first formed through the dielectric layer, and then a plurality of recessed holes are formed by recessing the core board body exposed in the groove, so that the groove and the plurality of recessed holes are interconnected to form the recessed structure.
[0016] As in the aforementioned method for manufacturing the substrate structure, the groove is formed by a developing, etching and stripping process.
[0017] As in the aforementioned method for manufacturing the substrate structure, the plurality of recessed holes are formed by laser ablation process.
[0018] As in the aforementioned method for manufacturing the substrate structure, the width of the groove is greater than the width of the concave hole, so that the groove and the concave hole have a T-shaped cross section.
[0019] As in the aforementioned method for manufacturing the substrate structure, the groove is annular.
[0020] In the aforementioned method for manufacturing the substrate structure, the depth of the concave hole is 30% of the thickness of the core plate.
[0021] As in the aforementioned method for manufacturing the substrate structure, the width of the groove is 30 to 50 μm, and the width of the concave hole is 25 to 45 μm.
[0022] As in the aforementioned method for manufacturing the substrate structure, there are a plurality of recess structures, and each of the recess structures is spaced apart from each other.
[0023] As in the aforementioned method for manufacturing the substrate structure, the size of each of the recess structures gradually increases from the one adjacent to the pattern area to the one away from the pattern area.
[0024] In summary, the substrate structure and manufacturing method of the present invention can effectively prevent the problem of dielectric material overflowing out of the substrate when laminating dielectric material by forming at least one concave structure in the edge area, and can help maintain the uniform thickness of the dielectric material. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figures 1A to 1F It is a cross-sectional schematic diagram of the method for manufacturing the substrate structure of the present invention.
[0026] Figure 2A It is a top view schematic diagram of the substrate structure of the present invention.
[0027] Figure 2B for Figure 2A A partially enlarged schematic diagram of the dotted box X.
[0028] The reference numerals are as follows:
[0029] 1 Substrate structure
[0030] 10 Core board
[0031] 10a First side
[0032] 10b Second side
[0033] 100 Conductive vias
[0034] 101 Plug material
[0035] 11 Dielectric layer
[0036] 12,12',12" concave structure
[0037] 121 Groove
[0038] 122 Concave hole
[0039] 13 Dielectric materials
[0040] 131 Residual burrs
[0041] A Pattern Area
[0042] B. Marginal area
[0043] D Depth
[0044] H Thickness
[0045] X virtual frame
[0046] W1, W2 width DETAILED DESCRIPTION
[0047] The following describes the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.
[0048] It should be noted that the structures, proportions, sizes, etc. shown in the attached drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed in the present invention. At the same time, the terms such as "on", "first", "second", "one", etc. quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.
[0049] Figures 1A to 1F It is a cross-sectional schematic diagram of a method for manufacturing a substrate structure 1 of the present invention. In this embodiment, the substrate structure 1 is used to carry a semiconductor chip.
[0050] like Figure 1A As shown, a core board 10 and a dielectric layer 11 are provided. The core board 10 has a first side 10a and a second side 10b opposite to each other, and is defined with a pattern area A and an edge area B surrounding the pattern area A, and the core board 10 also has a plurality of conductive through holes 100 connecting the first side 10a and the second side 10b. The dielectric layer 11 is disposed on the first side 10a and the second side 10b of the core board 10.
[0051] In the present embodiment, the core board 10 may be an organic polymer board or other board including Bismaleimidetriazine (BT) and prepreg (PP) with glass fiber, and the dielectric layer 11 is an ABF film (Ajinomoto build-up film). The conductive through hole 100 is a hollow column, which can be filled with a plugging material 101 in the hollow part, wherein the plugging material 101 is of various types, such as conductive glue, ink, etc., and is not particularly limited. It should be understood that in other embodiments, the conductive through hole 100 may also be a solid metal column without the need to fill the plugging material 101.
[0052] Furthermore, after the dielectric layer 11 is disposed on the first side 10a and the second side 10b of the core board 10, through holes are formed in the core board 10 and the dielectric layer 11, and then the conductive vias 100 are formed in the through holes by filling and electroplating processes. It should be understood that there are many processes related to the conductive vias 100, and the present invention is not particularly limited.
[0053] like Figure 1B As shown, at least one groove 121 is formed through the dielectric layer 11 to expose a portion of the core board 10 .
[0054] In this embodiment, the groove 121 is formed by developing, etching and stripping.
[0055] & Stripping; DES) process is formed in the dielectric layer 11 located in the edge area B, and the groove 121 is annular (such as Figure 2A Furthermore, the number of the grooves 121 can be multiple, and the grooves 121 can also be formed in the pattern area A.
[0056] like Figure 1C As shown, the core board 10 exposed in the groove 121 is recessed to form a plurality of recessed holes 122 , so that the groove 121 and the plurality of recessed holes 122 are interconnected to form a recessed structure 12 , thereby obtaining the substrate structure 1 of the present invention.
[0057] In this embodiment, if Figure 2B As shown, a plurality of recessed holes 122 are formed in the first side 10a and the second side 10b and the edge region B of the core plate body 10 by laser ablation process, and each recessed hole 122 can be a circle in the form of an array. Furthermore, the width W1 of the groove 121 is greater than the width W2 of the recessed hole 122, so that the groove 121 and the recessed hole 122 have a T-shaped cross section. In other embodiments, each recessed hole 122 can also be a square in the form of an array, a circle overlapping each other, or a continuous flow channel shape, and the present invention is not limited thereto.
[0058] In one embodiment, the depth D of the recessed hole 122 may be 30% of the thickness H of the core board 10 . For example, when the thickness H of the core board 10 is 100 μm, the depth D of the recessed hole 122 is 30 μm, but the present invention is not limited thereto.
[0059] In one embodiment, the width of the groove 121 is 30 to 50 μm, and the width of the concave hole 122 is 25 to 45 μm, but the invention is not limited thereto.
[0060] In this embodiment, there can be multiple recess structures 12 that are spaced apart from each other. Figure 2B As shown, the size of each recessed structure 12, 12', 12" gradually increases from the recessed structure 12 adjacent to the pattern area A to the recessed structure 12" away from the pattern area A, that is, the size of the recessed structure 12 is smaller than the size of the recessed structure 12', and the size of the recessed structure 12' is smaller than the size of the recessed structure 12".
[0061] like Figure 1D As shown, the dielectric material 13 is disposed on the pattern area A of the first side 10 a and the second side 10 b of the core board 10 , and the dielectric material 13 fills the groove 121 of the pattern area A.
[0062] In this embodiment, the dielectric material 13 may be ABF film (ABF), polybenzoxazole (PBO), polyimide (PI), prepreg (PP) or other dielectric materials. It should be understood that the material of the dielectric material 13 and the dielectric layer 11 may be the same or different.
[0063] like Figure 1E As shown, the dielectric material 13 is subjected to a lamination process, and the dielectric material 13 is spread to the edge area B and flows into the groove 121 and the concave hole 122 of the edge area B. At this time, the dielectric layer 11 between two adjacent concave structures 12 can be used as a barrier layer to slow down the flow rate of the dielectric material 13 flowing to the edge, and the multiple concave holes 122 can also have the function of storing the dielectric material 13, thereby maintaining a consistent thickness of the dielectric material 13 after lamination.
[0064] like Figure 1F As shown, the dielectric material 13 located in the edge area B can be removed by laser process (deburring) to ensure that the dielectric material 13 is only located in the pattern area A, and each recessed hole 122 of the recessed structure 12 can be used to receive the residual burrs 131 when the dielectric material 13 is removed. Afterwards, a singulation process can be performed to remove the edge area B and the recessed structure 12 of the core board body 10, and the substrate structure 1 obtained thereby can be used to carry semiconductor chips later.
[0065] The present invention further provides a substrate structure 1 , comprising a core board 10 , a dielectric layer 11 and at least one recess structure 12 .
[0066] The core board 10 has a first side 10a and a second side 10b opposite to each other, and defines a pattern area A and an edge area B surrounding the pattern area A, and the core board 10 also has a plurality of conductive vias 100 connecting the first side 10a and the second side 10b. The conductive vias 100 can be hollow columns or solid metal columns filled with plugging materials 101. The dielectric layer 11 is disposed on the first side 10a and the second side 10b of the core board 10.
[0067] The recessed structure 12 includes a groove 121 and a plurality of recessed holes 122 that are interconnected. The groove 121 is formed through the dielectric layer 11 and exposes a portion of the core board 10. The recessed holes 122 are formed by being recessed from the exposed core board 10, and each recessed hole 122 can be a circular shape in an array form. In other embodiments, each recessed hole 122 can also be a square in an array form, a circular shape that overlaps each other, or a continuous flow channel shape, but the present invention is not limited thereto.
[0068] In this embodiment, the groove 121 is formed in the dielectric layer 11 in the edge region B by a development, etching and stripping process and has a ring shape. In other embodiments, the groove 121 may also be formed in the pattern region A.
[0069] In this embodiment, the plurality of recessed holes 122 are formed in the edge region B of the core board 10 by laser ablation. Furthermore, the width W1 of the recessed groove 121 is greater than the width W2 of the recessed hole 122, so that the recessed groove 121 and the recessed hole 122 have a T-shaped cross section.
[0070] In one embodiment, the depth D of the recessed hole 122 may be 30% of the thickness H of the core board 10 . For example, when the thickness H of the core board 10 is 100 μm, the depth D of the recessed hole 122 is 30 μm, but the present invention is not limited thereto.
[0071] In one embodiment, the width of the groove 121 is 30 to 50 μm, and the width of the concave hole 122 is 25 to 45 μm, but the invention is not limited thereto.
[0072] In this embodiment, there may be multiple recessed structures 12, 12', 12" and they may be spaced apart from each other, and the size of each recessed structure 12, 12', 12" gradually increases from the recessed structure 12 adjacent to the pattern area A to the recessed structure 12" away from the pattern area A.
[0073] In summary, the substrate structure and its manufacturing method of the present invention can effectively prevent the problem that the dielectric material may overflow outside the substrate when laminating the dielectric material by forming at least one concave structure in the edge area, and can help maintain the uniform thickness of the dielectric material. The present invention can be applied to various printed circuit board processes, such as the subtractive method (Tenting), the modified semi-additive method (MSAP) and the semi-additive method (SAP).
[0074] The above embodiments are only used to illustrate the principles and effects of the present invention, and are not used to limit the present invention. Those skilled in the art may modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.
Claims
1. A substrate structure, comprising: The core board has a first side and a second side opposite to each other and defines a pattern area and an edge area surrounding the pattern area; A dielectric layer is disposed on the first side and the second side of the core board; and At least one recessed structure penetrates the dielectric layer and is recessed into the core board, and the at least one recessed structure is located in the edge area.
2. The substrate structure according to claim 1, wherein: The concave structure comprises a groove and a plurality of concave holes which are interconnected. The groove is formed through the dielectric layer, and the plurality of concave holes are formed concavely in the core plate.
3. The substrate structure according to claim 2, wherein: The width of the groove is greater than the width of the concave hole, so that the groove and the concave hole have a T-shaped cross section.
4. The substrate structure according to claim 2, wherein: The groove is annular.
5. The substrate structure according to claim 2, wherein: The depth of the concave hole is 30% of the thickness of the core plate.
6. The substrate structure according to claim 2, wherein: The width of the groove is 30 to 50 μm, and the width of the concave hole is 25 to 45 μm.
7. The substrate structure according to claim 1, wherein: There are a plurality of recess structures, and each of the recess structures is spaced apart from each other.
8. The substrate structure according to claim 7, wherein: The size of each of the concave structures gradually increases from the one adjacent to the pattern area to the one away from the pattern area.
9. A method for manufacturing a substrate structure, comprising: Providing a core board and a dielectric layer, wherein the core board has a first side and a second side opposite to each other and defines a pattern area and an edge area surrounding the pattern area, and the dielectric layer is disposed on the first side and the second side of the core board; and At least one concave structure penetrating through the dielectric layer and recessed into the core board is formed in the edge region.
10. The method for manufacturing a substrate structure according to claim 9, wherein: Firstly, the dielectric layer is penetrated to form a groove, and then the core board body exposed in the groove is sunken to form a plurality of concave holes, so that the groove and the plurality of concave holes are interconnected to form the concave structure.
11. The method for manufacturing a substrate structure according to claim 10, wherein: The groove is formed by developing, etching and stripping processes.
12. The method for manufacturing a substrate structure according to claim 10, wherein: The plurality of concave holes are formed by laser ablation process.
13. The method for manufacturing a substrate structure according to claim 10, wherein: The width of the groove is greater than the width of the concave hole, so that the groove and the concave hole have a T-shaped cross section.
14. The method for manufacturing a substrate structure according to claim 10, wherein: The groove is annular.
15. The method for manufacturing a substrate structure according to claim 10, wherein: The depth of the concave hole is 30% of the thickness of the core plate.
16. The method for manufacturing a substrate structure according to claim 10, wherein: The width of the groove is 30 to 50 μm, and the width of the concave hole is 25 to 45 μm.
17. The method for manufacturing a substrate structure according to claim 9, wherein: There are a plurality of recess structures, and each of the recess structures is spaced apart from each other.
18. The method for manufacturing a substrate structure according to claim 17, wherein: The size of each of the concave structures gradually increases from the one adjacent to the pattern area to the one away from the pattern area.